KR20130074990A - Light emitting module - Google Patents

Light emitting module Download PDF

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Publication number
KR20130074990A
KR20130074990A KR1020110143151A KR20110143151A KR20130074990A KR 20130074990 A KR20130074990 A KR 20130074990A KR 1020110143151 A KR1020110143151 A KR 1020110143151A KR 20110143151 A KR20110143151 A KR 20110143151A KR 20130074990 A KR20130074990 A KR 20130074990A
Authority
KR
South Korea
Prior art keywords
substrate
light emitting
electrode pad
holder
emitting module
Prior art date
Application number
KR1020110143151A
Other languages
Korean (ko)
Inventor
김병목
조영준
정수정
권서연
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to KR1020110143151A priority Critical patent/KR20130074990A/en
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to CN201210301998.XA priority patent/CN103078040B/en
Priority to EP12181342.2A priority patent/EP2562834B1/en
Priority to JP2012183659A priority patent/JP6005440B2/en
Priority to US13/591,626 priority patent/US8704433B2/en
Priority to CN201610852314.3A priority patent/CN107425103B/en
Publication of KR20130074990A publication Critical patent/KR20130074990A/en
Priority to US14/253,606 priority patent/US9196814B2/en
Priority to US14/885,661 priority patent/US9634215B2/en
Priority to JP2016175999A priority patent/JP6567482B2/en
Priority to JP2018126360A priority patent/JP6437154B2/en
Priority to JP2018126361A priority patent/JP6626161B2/en
Priority to JP2018213180A priority patent/JP6691952B2/en
Priority to US16/394,870 priority patent/USRE48858E1/en
Priority to JP2019141895A priority patent/JP6969806B2/en
Priority to JP2021171970A priority patent/JP7266316B2/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Abstract

PURPOSE: A light emitting module is mechanically connected to an external power supply without soldering, and thus prevents environmental problems. CONSTITUTION: A substrate has a light source (100) on one side. Electrode pads (110a,110b) are electrically connected with the light source. A holder (130) has a cavity on an area corresponding to the area of the electrode pad. The electrode pad contacts a projecting electrode portion. The projecting electrode portion is electrically connected with a wire.

Description

Light emitting module {LIGHT EMITTING MODULE}

An embodiment relates to a light emitting module.

BACKGROUND ART Light emitting devices such as a light emitting diode (LD) or a laser diode using semiconductor materials of Group 3-5 or 2-6 group semiconductors are widely used for various colors such as red, green, blue, and ultraviolet And it is possible to realize white light rays with high efficiency by using fluorescent materials or colors, and it is possible to realize low energy consumption, semi-permanent life time, quick response speed, safety and environment friendliness compared to conventional light sources such as fluorescent lamps and incandescent lamps .

Therefore, a transmission module of the optical communication means, a light emitting diode backlight replacing a cold cathode fluorescent lamp (CCFL) constituting a backlight of an LCD (Liquid Crystal Display) display device, a white light emitting element capable of replacing a fluorescent lamp or an incandescent lamp Diode lighting, automotive headlights, and traffic lights.

In the light emitting module equipped with such a light emitting diode, generally, an electrode pad electrically connected to the light emitting diode and an external power supply are connected by soldering to supply a current required for driving the light emitting diode.

However, the soldering operation is not suitable for the current trend toward eco-friendliness because it is fatal to environmental pollution because of the use of lead, and there is a problem in that lead corrosion corrodes over a long time after the soldering operation and affects the reliability of the light emitting module. .

Embodiments provide a light emitting module that is structurally robust by minimizing environmental pollution by mechanically connecting a light emitting module and an external power source.

According to an embodiment, there is provided a light emitting module, comprising: a substrate having a light source disposed on one surface thereof and including an electrode pad electrically connected to the light source; And a holder positioned on the substrate and having a cavity located in an area corresponding to the electrode pad, wherein the electrode pad is in contact with a protruding electrode portion disposed in the cavity and electrically connected to a wire.

The apparatus may further include a spring part positioned in the cavity and supporting the protruding electrode part.

The apparatus may further include a heat dissipation member disposed under the substrate.

A thermal conductive member may be positioned between the substrate and the heat dissipation member.

The heat dissipation member may include a plurality of heat dissipation fins formed extending in a lower surface direction of the heat dissipation member.

The holder may have a protrusion located on a surface facing the substrate, and the substrate may have a receiver at a position corresponding to the protrusion.

At least one fastening part may be formed on the holder and the substrate, and the holder may be fixed to the substrate by a fastening means.

The electrode pad may be disposed adjacent to an edge region of the substrate.

The thickness of the substrate corresponding to the electrode pad and the thickness of the substrate not corresponding to the electrode pad may be different from each other.

The light source may be a light emitting device, and the electrode pad may be electrically connected to the light emitting device.

The light source may be a light emitting device package, and the electrode pad may be electrically connected to a light emitting device disposed in the light emitting device package.

At least one fastening part may be formed in the holder and the heat dissipation member, and the holder may be fixed to the heat dissipation member by a fastening means.

The substrate may include a metal substrate or a ceramic substrate.

The holder may be made of an inorganic material.

The light emitted from the light emitting device may have a wavelength in the region of 260 to 395 nm.

The electrode pad may include an anode electrode pad and a cathode electrode pad spaced apart from the anode electrode pad.

The anode electrode pad and the cathode electrode pad may be arranged side by side in the same direction.

According to the embodiment, since the light emitting module and the external power supply are mechanically connected without soldering, there is no concern about environmental pollution, which is environmentally friendly, and the occurrence of poor wire connection due to cold soldering can be minimized, thereby improving reliability of the light emitting module. .

1 is a perspective view of a light emitting module according to a first embodiment,
2 is a perspective view of a light emitting module according to a second embodiment;
3 is a view showing the configuration of the fastening portion of the holder,
4A and 4B are cross-sectional views illustrating one embodiment of a contact structure between a wire disposed in a holder and an electrode pad on a substrate;
5 is a perspective view illustrating a light emitting module according to a third embodiment;
6 is a perspective view of a light emitting module according to a fourth embodiment;
7 is a perspective view of a light emitting module according to a fifth embodiment;
8 is a perspective view of a light emitting module according to a sixth embodiment;
9 is a perspective view of a light emitting module according to a seventh embodiment;
FIG. 10 is a view illustrating an embodiment of a head lamp in which a light emitting module according to the above embodiments is disposed.

Hereinafter, with reference to the accompanying drawings an embodiment of the present invention that can specifically realize the above object.

In the description of the embodiment according to the present invention, in the case of being described as being formed "on or under" of each element, the upper (upper) or lower (lower) or under are all such that two elements are in direct contact with each other or one or more other elements are indirectly formed between the two elements. Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one element.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. In addition, the size of each component does not necessarily reflect the actual size.

1 is a perspective view of a light emitting module according to a first embodiment.

The light emitting module according to the first embodiment includes a substrate 120 including an electrode pad 110 disposed on one surface and electrically connected to the light source 100, and positioned on the substrate 120. And a holder 130 in which the cavity 132 is positioned in an area corresponding to the electrode pad 110, wherein the electrode pad 110 is disposed in the cavity 132 and electrically connected to the wires 134 and 135. In contact with the protruding electrode 131.

The light source 100 may be a light emitting device 102, and may be a chip on board (COB) type in which the light emitting device 102 is mounted on the substrate 120 in a chip form.

The light emitting device 102 includes a plurality of compound semiconductor layers, for example, a light emitting diode (LED) using a semiconductor layer of Group III-V elements, and the LED emits light such as blue, green, or red. It may be a colored LED or a UV LED. The emitted light of the LED may be implemented using various semiconductors, but is not limited thereto.

The substrate 120 may be a metal substrate or a ceramic substrate on which a circuit pattern is formed.

The ceramic substrate may be formed of a single layer or may be formed of a multilayer, and when the substrate 120 is a multilayer ceramic substrate, for example, high temperature cofired ceramics (HTCC) or low temperature cofired ceramics. (Low Temperature Cofired Ceramics, LTCC) technology can be implemented.

When the light emitting device 102 is a UV LED including a deep UV LED or a near UV LED having a wavelength of about 260 to 395 nm, the substrate may be formed by ultraviolet light emitted from the light emitting device 102. The substrate 120 may be formed of a ceramic substrate so that the 120 does not become discolored or deteriorated.

An electrode pad 110 electrically connected to the light source 100 is positioned on an upper surface of the substrate 102.

When a plurality of electrode pads 110 are provided, the electrode pads 110 may be used as a concept including a plurality of electrode pads.

The electrode pad 110 may be disposed adjacent to an edge region of the substrate 120, but the arrangement of the electrode pad 110 may vary depending on the embodiment, and the present invention is not limited thereto.

The electrode pad 110 may be disposed on the upper surface of the substrate 120 as it is, or may be disposed in the groove 114 by forming a groove 114 in the substrate 120.

That is, the thickness of the substrate 120 corresponding to the electrode pad 110 and the thickness of the substrate 120 not corresponding to the electrode pad 110 may be different from each other. For example, the electrode pad ( The thickness of the substrate 120 corresponding to 110 may be thinner.

The electrode pad 110 is positioned to be spaced apart from the anode electrode pad 111 electrically connected to the first electrode (not shown) of the light source 100 and the anode electrode pad 111. And a cathode electrode pad 112 electrically connected to the second electrode (not shown).

The anode electrode pad 111 and the cathode electrode pad 112 may be arranged side by side in the same direction, but are not limited thereto.

FIG. 1 illustrates a light emitting module having two electrode pads 110 such as the first electrode pad 110a and the second electrode pad 110b as an example, but according to an embodiment, Only one or three or more light emitting modules may be provided.

When two or more electrode pads 110 are provided, there is an advantage in that the electrode pad 110 can be selected and used at a convenient position without changing the position or direction of the light emitting module according to the position of an external power source.

The holder 130 includes a cavity 132 positioned on the substrate 120 and having an opening corresponding to the electrode pad 110, and disposed in the cavity 132. ) Is in contact with the electrode pad 110.

That is, wires 134 and 135 connected to an external power source are disposed in the cavity 132 of the holder 130, and the protruding electrode part 131 electrically connected to the wires 134 and 135 is the anode electrode. The pad 111 and the cathode electrode pad 112 may be in contact with each other to supply a current to the light emitting module.

An internal structure of the holder 130 and a contact structure of the electrode pad 110 will be described later with reference to FIGS. 3 and 4.

When the light emitting device 102 includes a UV LED, the holder 130 may be made of an inorganic material so as not to be discolored or altered by ultraviolet light emitted from the light emitting device 102.

1 illustrates that the holder 130 is provided only on the upper portion of the first electrode pad 110a in order to facilitate the description of the shape of the electrode pad 110. 130 is provided.

2 is a perspective view of a light emitting module according to a second embodiment.

The content overlapping with the first embodiment will not be described again, and the following description will focus on differences.

The light emitting module according to the second embodiment includes a substrate 120 including an electrode pad 110 disposed on one surface of the light source 100 and electrically connected to the light source 100, and positioned on the substrate 120. And a holder 130 in which a cavity 132 is positioned in an area corresponding to the electrode pad 110, wherein the electrode pad 110 is disposed in the cavity 132 and is electrically connected to a wire. 131).

The light source 100 may be a light emitting device 102, and may be a chip on board (COB) type in which the light emitting device 102 is mounted on the substrate 120 in a chip form.

The electrode pad 110 is positioned to be spaced apart from the anode electrode pad 111 electrically connected to the first electrode (not shown) of the light source 100 and the anode electrode pad 111. And a cathode electrode pad 112 electrically connected to the second electrode (not shown).

In this case, unlike the first embodiment, the anode electrode pads 111 and the cathode electrode pads 112 are not arranged side by side in the same direction, but may be disposed in separate areas on the substrate 120.

In FIG. 2, as an example, an anode electrode pad 111 is positioned at a part of an edge region of the substrate 120, and a cathode electrode pad 112 is positioned in a diagonal direction spaced apart from the anode electrode pad 111. Shown.

In addition, unlike the first embodiment, since the anode electrode pad 111 and the cathode electrode pad 112 are spaced apart from each other, the holder 130 also has the anode electrode pad 111 and the cathode electrode pad 112. ) Are respectively divided so as to cover each one, and a wire connected to an external power source is also disposed in the cavity 132 formed in the holder 130.

That is, the difference between the holder 130 in the first embodiment and the holder 130 in the second embodiment is that the holder 130 of the first embodiment has one holder as the anode electrode pad 111 and the cathode electrode pad ( Since the two wires 134 and 135 of different polarities are disposed in the cavity 132 because all of them cover 112 at a time, the holder 130 of the second embodiment includes one holder for covering the anode electrode pad 111. Since there is another holder covering the cathode electrode pad 112, wires 134 or 135 of different polarities are disposed in the cavity 132 of each holder.

2 illustrates that the holder 130 is provided only at the upper portion of the anode electrode pad 111 in order to facilitate the description of the shape of the electrode pad 110, but the holder 130 is also disposed at the upper portion of the cathode electrode pad 112. ) Is provided.

3 is a view showing the configuration of the fastening portion of the holder. Hereinafter, a fastening structure of the holder 130 disposed in the light emitting module according to the embodiment will be described with reference to FIG. 3.

3 omits the top surface of the holder 130 and shows only the bottom surface. The holder 130 may include at least one first fastening part 137 and may be fixed to the substrate 120 disposed on the bottom surface of the holder 130 by the fastening means 138.

Although not shown, a fastening portion may be formed at a position corresponding to the first fastening portion 137 in the substrate 120.

In FIG. 3, as an example, two through-holes are formed on the lower surface of the holder 130 as fastening portions 137, and screws are fastened to the fastening portions 137 of the holder 130 and the substrate as fastening means 138. The fastening part (not shown) of the 120 is coupled to the holder 130 is fixed to the substrate 120 is shown.

The shape and number of the first fastening part 137, the type of the fastening means 138, and the like can be variously modified according to the embodiment, without being limited thereto.

4A and 4B are cross-sectional views illustrating one embodiment of a contact structure between a wire disposed in a holder and an electrode pad on a substrate.

Referring to FIG. 4A, the holder 130 has a cavity 132 positioned corresponding to the electrode pad 110 on the substrate 120, is disposed in the cavity 132, and protrudes electrically connected to the wire 134. The electrode unit 131 is in contact with the electrode pad 110.

Grooves 114 may be formed in the substrate 120, and the electrode pads 110 may be disposed in the grooves 114.

The electrode pad 110 is connected to the circuit pattern 117 formed on the substrate 120.

Conventionally, the wire 134 connected to the external power source and the electrode pad 110 on the substrate 120 are electrically connected by soldering, but the soldering operation is fatal to environmental pollution because it uses heavy metal such as lead, There was a problem that a poor wire connection occurs due to cold solder.

In an embodiment, the wire 134 disposed in the holder 130 is mechanically contacted with the electrode pad 110 through the protruding electrode part 131, so that there is no fear of environmental pollution, minimizing poor wire connection, etc. The reliability of the light emitting module can be improved.

The cavity 132 of the holder 130 may be provided with a spring 139 for supporting the protruding electrode 131.

When the wire 134 is in contact with the electrode pad 110 through the protruding electrode 131, the spring 139 may be protruded by the restoring force of the spring 139. The electrode pad 110 may be more firmly contacted.

The outer surface of the spring 139 may be coated with an insulating material to prevent electrical short between the wire 134 and the electrode pad 110.

Alternatively, as shown in FIG. 4B, the wire 134 and the electrode pad 110 may be electrically connected to each other by the second electrode part 133 formed integrally with the protruding electrode part 131 and the spring part 139 of FIG. 4A. May be connected.

In this case, a separate support part 115 may be positioned on one surface of the cavity 132 so that one side of the second electrode part 133 may be supported through the support part 115.

In addition, the holder 130 includes at least one protrusion 136 on a lower surface facing the substrate 120, and the substrate 120 accommodates at least one at a position corresponding to the protrusion 136. The holder 118 and the substrate 120 may be fitted to each other.

The protrusion 136 and the receiving part 118 may allow the holder 130 and the substrate 120 to be more firmly coupled with the fastening means 138 as described above with reference to FIG. 3.

4A and 4B illustrate the wire 134 electrically connected to the anode electrode pad 111 as an example, but the same may be applied to the wire 135 electrically connected to the cathode electrode pad 112. .

In addition, although not shown, as shown in FIG. 1, when one holder 130 is disposed to cover both the anode electrode pad 111 and the cathode electrode pad 112, the cavity of the holder 130 may be formed. Two wires 134 and 135 having different polarities are disposed on the 132, and the wires 134 and 135 are formed of the anode electrode pad 111 and the cathode electrode pad 112 disposed on the substrate 120. Each may be electrically connected. FIG. 5 is a perspective view illustrating a light emitting module according to a third embodiment.

Duplicates of the above-described embodiments will not be described again, and the following description will focus on differences.

The light emitting module according to the third embodiment includes a substrate 120 including an electrode pad 110 disposed on one surface of the light source 100 and electrically connected to the light source 100, and positioned on the substrate 120. And a holder 200 in which a cavity 132 is positioned in an area corresponding to the electrode pad 110, wherein the electrode pad 110 is disposed in the cavity 132 and is connected to a wire and electrically connected to the wire. 131).

The light source 100 may be a light emitting device 102, and may be a chip on board (COB) type in which the light emitting device 102 is mounted on the substrate 120 in a chip form.

In this case, the holder 200 includes a support plate 220 disposed corresponding to at least a portion of the edge region of the substrate 120, and at least one cover unit 230 provided with a cavity 132.

In the first and second embodiments, the holder 130 is formed to cover only portions corresponding to the electrode pads 110 disposed on the substrate 120. In the third embodiment, only the portions corresponding to the electrode pads 110 are covered. In addition, it is formed to cover a portion corresponding to the edge region of the substrate 120.

The cover unit 230 may have a similar configuration to the holder 130 described above with reference to FIGS. 1 to 4, and thus a detailed description thereof will be omitted.

When the anode electrode pads 111 and the cathode electrode pads 112 are arranged side by side in the same direction on the substrate 120, the cover unit 230 may cover the anode electrode pads 111 and the cathode electrode pads 112. It can be provided as one unit to cover at a time.

Alternatively, as shown in FIG. 1, when two or more anode electrode pads 111 and cathode electrode pads 112 are arranged side by side in the same direction, the cover unit 230 includes the substrate 120. A plurality may be provided to cover each.

In both cases, since the cover unit 230 covers two anode electrode pads 111 and two cathode electrode pads 112, the two cover units 230 are connected to an external power source in the cavity 132 of the cover unit 230. Wire can be placed.

In FIG. 5, similar to that shown in FIG. 2, an anode electrode pad 111 is positioned at a portion of an edge region of the substrate 120, and is spaced apart from the anode electrode pad 111 so that the cathode electrode pad 112 is disposed. Since the first cover unit 230a covering the anode electrode pad 111 and the second cover unit 230b covering the cathode electrode pad 112 are disposed, respectively, the first and second covers. Wires 134 and 135 connected to an external power source are disposed in the units 230a and 230b, respectively.

In FIG. 5, the first and second cover units 230a and 230b are shown to be disposed diagonally to each other in the edge region of the substrate 120, but this is only an example, and according to the position of the electrode pad 110. It may be located in parallel with each other.

The support plate 220 is disposed corresponding to the edge region of the substrate 120, for example, a first support plate 221 positioned corresponding to the first edge region of the substrate 120, and A third support plate 222 positioned to face the first support plate 221, and a third support plate 222 connected to one side of the first support plate 222 and one side of the second support plate 222. The support plate 223 may include a fourth plate 224 positioned to face the third support plate 223.

As described above, when the support plate 220 includes first, second, third and fourth support plates 221 ˜ 224 corresponding to four edge regions of the substrate 120, the support plate 220 is provided. ) May have an opening 210 with a central area open.

However, not all four support plates 221 to 224 should be provided, but one support plate 220 connecting two cover units 230a and 230b, or two support plates 221 facing each other. Only 222 or 223 and 224 may be provided.

The support plate 220 may be disposed in contact with the upper surface of the substrate 120 in the edge region of the substrate 120.

The support plate 220 may be integrally formed with the cover unit 230.

As described with reference to FIG. 3, the cover unit 230 may have at least one fastening portion formed on a lower surface of the cover unit 230, and may be fixed to the substrate 120 by fastening means.

Although not shown, a fastening portion may be formed in the support plate 220 to be fixed to the substrate 120 by a fastening means.

However, if too many fastening portions are formed to the support plate 220, mechanical stress may occur when the fastening portion is formed on the substrate 120 or when the substrate 120 and the holder 200 are coupled to each other. Therefore, a fastening part may be provided only in the cover unit 230 so that it can be firmly fixed while applying less stress.

Alternatively, a plurality of fitting protrusions are provided on the bottom surface of the support plate 220, and fitting grooves are formed on the substrate 120 to correspond to the fitting protrusions, so that the support plate 220 is fitted to the substrate 120. And may be fixed.

6 is a perspective view of a light emitting module according to a fourth embodiment.

Duplicates of the above-described embodiments will not be described again, and the following description will focus on differences.

The light emitting module according to the fourth embodiment includes a substrate 120 including an electrode pad 110 disposed on one surface of the light emitting module 100 and electrically connected to the light source 100, and positioned on the substrate 120. And a holder 200 in which a cavity 132 is positioned in an area corresponding to the electrode pad 110, wherein the electrode pad 110 is disposed in the cavity 132 and is connected to a wire and electrically connected to the wire. 131). The heat dissipation member 310 is disposed under the substrate 120.

The light source 100 may be a light emitting device 102, and may be a chip on board (COB) type in which the light emitting device 102 is mounted on the substrate 120 in a chip form.

In this case, the holder 200 includes a support plate 220 disposed corresponding to at least a portion of the edge region of the substrate 120, and at least one cover unit 230 provided with a cavity 132.

Since the cover unit 230 is similar to the holder 130 described above with reference to FIGS. 1 to 4, a detailed description thereof will be omitted.

The support plate 220 is disposed corresponding to the edge region of the substrate 120, for example, a first support plate 221 positioned corresponding to the first edge region of the substrate 120, and A third support plate 222 positioned to face the first support plate 221, and a third support plate 222 connected to one side of the first support plate 222 and one side of the second support plate 222. The support plate 223 may include a fourth plate 224 positioned to face the third support plate 223.

As described above, when the support plate 220 includes first, second, third and fourth support plates 221 ˜ 224 corresponding to four edge regions of the substrate 120, the support plate 220 is provided. ) May have an opening 210 with a central area open.

However, not all four support plates 221 to 224 should be provided, but one support plate 220 connecting two cover units 230a and 230b, or two support plates 221 facing each other. Only 222 or 223 and 224 may be provided.

The heat dissipation member 310 may be made of a material having excellent thermal conductivity because it serves to discharge heat generated from the light source 100 to the outside.

The heat dissipation member 310 may include a plurality of heat dissipation fins 312 formed extending in a lower surface direction of the heat dissipation member 310. The heat dissipation fin 312 improves the heat dissipation effect by widening the area where the heat dissipation member 310 is in contact with the outside air.

The thermally conductive member 320 may be located between the heat dissipation member 310 and the substrate 120. The thermally conductive member 320 has excellent thermal conductivity, electrical insulation, and flame retardancy, thereby maximizing a heat transfer effect by bringing the heat generating part into close contact with the heat dissipating member.

The support plate 220 may include at least one second fastening part 240 formed to protrude from the support plate 220.

The second fastening part 240 may be formed to extend on the same plane as the support plate 220 and may protrude beyond the width of the substrate 120 positioned below the holder 200.

A fastening part 314 is also formed in a region on the heat dissipation member 310 corresponding to the second fastening part 240 formed on the support plate 220, so that the holder 200 is formed by the fastening means 242. It may be fixed to the heat dissipation member 310.

In FIG. 6, a screw is used as the fastening means 242 as an example, but other fastening means may be used.

The second fastening part 240 may be formed on at least one of the plurality of support plates 221 to 224.

In FIG. 6, as an example, the second fastening part 240 is provided in the first support plate 221 and the second support plate 222, but is not limited thereto.

The second fastening part 240 is symmetrical to two opposite support plates 221 and 222 or 223 and 224 so that the holder 200 can be more firmly fixed to the heat dissipation member 310. It can be formed.

The holder 200 may be fixedly coupled to the substrate 120 as in the above-described embodiments, but since the substrate 120 includes a circuit pattern, the holder 200 may be restricted from forming a fastening portion. The second fastening part 240 may be formed in the holder 200 to be fixed to the heat dissipation member 310 disposed under the substrate 120.

Alternatively, in some embodiments, the holder 200 may be fixed to both the substrate 120 and the heat dissipation member 310.

As described above, the thermally conductive member 320 may be positioned between the substrate 120 and the heat dissipation member 310 to fix the substrate 120 to the heat dissipation member 310. However, since the cost of the thermal conductive member 320 is expensive, the substrate 120 without the thermal conductive member 320 is fixed by fixing the holder 200 and the heat dissipating member 310 through the second fastening part 240. It can be fixed to the heat dissipation member 310 to reduce the manufacturing cost of the light emitting module.

7 is a perspective view of a light emitting module according to a fifth embodiment.

Duplicates of the above-described embodiments will not be described again, and the following description will focus on differences.

The light emitting module according to the fifth embodiment includes a substrate 120 including an electrode pad 110 disposed on one surface and electrically connected to the light source 100, and positioned on the substrate 120. And a holder 200 in which a cavity 132 is positioned in an area corresponding to the electrode pad 110, wherein the electrode pad 110 is disposed in the cavity 132 and is connected to a wire and electrically connected to the wire. 131).

The light source 100 may be a light emitting device package 400, and may be a package on board (POB) type in which the light emitting device package 400 is mounted on the substrate 120.

Referring to part A of the light emitting device package 400 which is an enlarged view of the light emitting device package 400 in the light emitting module, the light emitting device package 400 is disposed on the body 410 and the body 410 having a cavity formed therein. And a light emitting device 102 electrically connected to an electrode pattern (not shown) formed on the body 410, and a molding part 420 formed in the cavity.

The body 410 may include a ceramic material, a synthetic resin material, or a metal material.

The light emitting device 102 includes a plurality of compound semiconductor layers, for example, a light emitting diode (LED) using a semiconductor layer of Group III-V elements, and the LED emits light such as blue, green, or red. It may be a colored LED or a UV LED. The emitted light of the LED may be implemented using various semiconductors, but is not limited thereto.

When the light emitting device 102 includes a UV LED, the body 410 may be made of an inorganic material such as ceramic so as not to be discolored or altered by ultraviolet light emitted from the light emitting device 102.

The molding part 420 may surround and protect the light emitting device 102. In addition, the molding part 420 may include a phosphor to change the wavelength of light emitted from the light emitting device 102.

Alternatively, a glass portion (not shown) covering the upper surface of the cavity may be formed without forming the molding portion 420.

An electrode pad 110 is positioned on an upper surface of the substrate 120, and the electrode pad 110 is connected to an anode electrode pad 111 and the light source electrically connected to a first electrode (not shown) of the light source 100. And a cathode electrode pad 112 electrically connected to the second electrode (not shown) of 100.

As described above, the number and positions of the electrode pads 110 and the number and arrangement of the anode electrode pads 111 and the cathode electrode pads 112 included in the electrode pads 110 may be in various forms. In FIG. 7, as an example, one anode electrode pad 111 is positioned at a part of an edge region of the substrate 120, and one cathode electrode pad 112 is arranged to be spaced apart from the anode electrode pad 111. It was.

In addition, corresponding to the positions of the anode electrode pad 111 and the cathode electrode pad 112, a holder 130 covering the anode electrode pad 111 and the cathode electrode pad 112 is disposed.

The holder 130 may be similar to the holder 130 described above with reference to FIGS. 1 to 4.

In FIG. 7, the holder 130 is disposed only on the anode electrode pad 111 so that the shape of the electrode pad 110 may be easily understood. However, the holder 130 may also be disposed on the cathode electrode pad 112. Is placed.

The substrate 120 may be a metal substrate or a ceramic substrate on which a circuit pattern is formed.

The ceramic substrate may be formed of a single layer or may be formed of a multilayer, and when the substrate 120 is a multilayer ceramic substrate, for example, high temperature cofired ceramics (HTCC) or low temperature cofired ceramics. (Low Temperature Cofired Ceramics, LTCC) technology can be implemented.

When the light emitting device 102 is a deep UV LED having a wavelength of about 280 nm or a near UV LED having a wavelength of about 365 to 395 nm, the light emitting device 102 is exposed to ultraviolet light emitted from the light emitting device 102. The substrate 120 may be formed of a ceramic substrate so that the substrate 120 is not discolored or altered.

8 is a perspective view of a light emitting module according to a sixth embodiment.

Duplicates of the above-described embodiments will not be described again, and the following description will focus on differences.

The light emitting module according to the sixth embodiment includes a substrate 120 including an electrode pad 110 disposed on one surface of the light source 100 and electrically connected to the light source 100, and positioned on the substrate 120. And a holder 200 in which a cavity 132 is positioned in an area corresponding to the electrode pad 110, wherein the electrode pad 110 is disposed in the cavity 132 and is connected to a wire and electrically connected to the wire. 131).

The light source 100 may be a light emitting device package 400, and may be a package on board (POB) type in which the light emitting device package 400 is mounted on the substrate 120.

The holder 200 includes a support plate 220 disposed corresponding to at least a portion of an edge region of the substrate 120, and at least one cover unit 230 provided with a cavity 132.

In the fifth embodiment, the holder 130 is formed so as to cover only a portion corresponding to the electrode pad 110 disposed on the substrate 120. It is formed to cover a portion corresponding to the edge region of the substrate 120.

The cover unit 230 may have a configuration similar to the holder 130 described above with reference to FIGS. 1 to 4.

When the anode electrode pads 111 and the cathode electrode pads 112 are arranged side by side in the same direction on the substrate 120, the cover unit 230 may cover the anode electrode pads 111 and the cathode electrode pads 112. It can be provided as one unit to cover at a time.

Alternatively, as shown in FIG. 1, when two or more anode electrode pads 111 and cathode electrode pads 112 are arranged side by side in the same direction, the cover unit 230 includes the substrate 120. A plurality may be provided to cover each.

In both cases, since the cover unit 230 covers two anode electrode pads 111 and two cathode electrode pads 112, the two cover units 230 are connected to an external power source in the cavity 132 of the cover unit 230. Wire can be placed.

In FIG. 8, similar to that shown in FIG. 7, an anode electrode pad 111 is positioned at a portion of an edge region of the substrate 120 and is spaced apart from the anode electrode pad 111 so that the cathode electrode pad 112 is disposed. Since the first cover unit 230a covering the anode electrode pad 111 and the second cover unit 230b covering the cathode electrode pad 112 are disposed, respectively, the first and second covers. Wires 134 and 135 connected to an external power source are disposed in the units 230a and 230b, respectively.

In FIG. 8, the first and second cover units 230a and 230b are shown to be disposed diagonally to each other in the edge area of the substrate 120, but this is only an example, and according to the position of the electrode pad 110. It may be located in parallel with each other.

The support plate 220 is disposed corresponding to the edge region of the substrate 120, for example, a first support plate 221 positioned corresponding to the first edge region of the substrate 120, and A third support plate 222 positioned to face the first support plate 221, and a third support plate 222 connected to one side of the first support plate 222 and one side of the second support plate 222. The support plate 223 may include a fourth plate 224 positioned to face the third support plate 223.

As described above, when the support plate 220 includes first, second, third and fourth support plates 221 ˜ 224 corresponding to four edge regions of the substrate 120, the support plate 220 is provided. ) May have an opening 210 with a central area open.

However, not all four support plates 221 to 224 should be provided, but one support plate 220 connecting two cover units 230a and 230b, or two support plates 221 facing each other. Only 222 or 223 and 224 may be provided.

9 is a perspective view of a light emitting module according to a seventh embodiment.

Duplicates of the above-described embodiments will not be described again, and the following description will focus on differences.

The light emitting module according to the seventh embodiment includes a substrate 120 including an electrode pad 110 disposed on one surface of the light source 100 and electrically connected to the light source 100, and positioned on the substrate 120. And a holder 200 in which a cavity 132 is positioned in an area corresponding to the electrode pad 110, wherein the electrode pad 110 is disposed in the cavity 132 and is connected to a wire and electrically connected to the wire. 131). The heat dissipation member 310 is disposed under the substrate 120.

The light source 100 may be a light emitting device package 400, and may be a package on board (POB) type in which the light emitting device package 400 is mounted on the substrate 120 in a package form.

In this case, the holder 200 includes a support plate 220 disposed corresponding to at least a portion of the edge region of the substrate 120, and at least one cover unit 230 provided with a cavity 132.

The cover unit 230 may be similar to the holder 130 described above with reference to FIGS. 1 to 4.

The support plate 220 is disposed corresponding to the edge region of the substrate 120, for example, a first support plate 221 positioned corresponding to the first edge region of the substrate 120, and A third support plate 222 positioned to face the first support plate 221, and a third support plate 222 connected to one side of the first support plate 222 and one side of the second support plate 222. The support plate 223 may include a fourth plate 224 positioned to face the third support plate 223.

As described above, when the support plate 220 includes first, second, third and fourth support plates 221 ˜ 224 corresponding to four edge regions of the substrate 120, the support plate 220 is provided. ) May have an opening 210 with a central area open.

However, not all four support plates 221 to 224 should be provided, but one support plate 220 connecting two cover units 230a and 230b, or two support plates 221 facing each other. Only 222 or 223 and 224 may be provided.

The heat dissipation member 310 may be made of a material having excellent thermal conductivity because it serves to discharge heat generated from the light source 100 to the outside.

The heat dissipation member 310 may include a plurality of heat dissipation fins 312 formed extending in a lower surface direction of the heat dissipation member 310. The heat dissipation fin 312 improves the heat dissipation effect by widening the area where the heat dissipation member 310 is in contact with the outside air.

The thermally conductive member 320 may be located between the heat dissipation member 310 and the substrate 120. The thermally conductive member 320 has excellent thermal conductivity, electrical insulation, and flame retardancy, thereby maximizing a heat transfer effect by bringing the heat generating part into close contact with the heat dissipating member.

The support plate 220 may include at least one second fastening part 240 formed to protrude from the support plate 220.

The second fastening part 240 may be formed to extend on the same plane as the support plate 220 and may protrude beyond the width of the substrate 120 positioned below the holder 200.

A fastening part 314 is also formed in a region on the heat dissipation member 310 corresponding to the second fastening part 240 formed on the support plate 220, so that the holder 200 is formed by the fastening means 242. It may be fixed to the heat dissipation member 310.

In FIG. 9, a screw is used as the fastening means 242 as an example, but other fastening means may be used.

The second fastening part 240 may be formed on at least one of the plurality of support plates 221 to 224.

The second fastening part 240 is symmetrically formed on two facing plates 221 and 222 or 223 and 224 so that the holder 200 can be more firmly fixed to the heat dissipation member 310. Can be.

The holder 200 may be fixedly coupled to the substrate 120 as in the above-described embodiments, but since the substrate 120 includes a circuit pattern, the holder 200 may be restricted from forming a fastening portion. The second fastening part 240 may be formed in the holder 200 to be fixed to the heat dissipation member 310 disposed under the substrate 120.

Alternatively, in some embodiments, the holder 200 may be fixed to both the substrate 120 and the heat dissipation member 310.

As described above, the thermally conductive member 320 may be positioned between the substrate 120 and the heat dissipation member 310 to fix the substrate 120 to the heat dissipation member 310. However, since the cost of the thermal conductive member 320 is expensive, the substrate 120 without the thermal conductive member 320 is fixed by fixing the holder 200 and the heat dissipating member 310 through the second fastening part 240. It can be fixed to the heat dissipation member 310 to reduce the manufacturing cost of the light emitting module.

FIG. 10 is a view illustrating an embodiment of a head lamp in which a light emitting module according to the above embodiments is disposed.

Referring to FIG. 10, light generated by the light emitting module 901 may be reflected by the reflector 902 and the shade 903, and then may pass through the lens 904 to face the front of the vehicle body.

The light emitting module 901 may be a light emitting module according to the above-described embodiments and may be a chip on board (COB) type in which a light emitting device is mounted on a substrate, or a package on package (LED) mounted on a substrate. Board) type.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, This is possible.

Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined not only by the claims below but also by the equivalents of the claims.

100: light source 110: electrode pad
120: substrate 130: holder
200: holder 220: support plate
310: heat dissipation member 400: light emitting device package
901 light emitting module 902 reflector
903: Shade 904: Lens

Claims (17)

A substrate including a light source disposed on one surface and including an electrode pad electrically connected to the light source; And
A holder positioned on the substrate and having a cavity located in an area corresponding to the electrode pad;
The electrode pad is disposed in the cavity and in contact with the protruding electrode portion electrically connected to the wire. The method of claim 1,
The light emitting module further comprises a spring part positioned in the cavity and supporting the protruding electrode part. The method of claim 1,
The light emitting module further comprises a heat dissipation member disposed under the substrate. The method of claim 3, wherein
And a heat conductive member positioned between the substrate and the heat dissipation member. The method of claim 3, wherein
The heat dissipation member includes a light emitting module including a plurality of heat dissipation fins formed extending in a lower surface direction of the heat dissipation member. The method of claim 1,
The holder is a light emitting module having a protrusion located on the surface facing the substrate, the substrate is located in the receiving portion corresponding to the protrusion. The method of claim 1,
At least one fastening part is formed in the holder and the substrate, and the light emitting module is fixed to the substrate by the fastening means. The method of claim 1,
The electrode pad is disposed adjacent to the edge region of the substrate. The method of claim 1,
The light emitting module having a thickness different from that of the substrate corresponding to the electrode pad and the thickness of the substrate not corresponding to the electrode pad. The method of claim 1,
The light source is a light emitting device, the electrode pad is a light emitting module electrically connected to the light emitting device. The method of claim 1,
The light source is a light emitting device package, the electrode pad is a light emitting module electrically connected to the light emitting device disposed in the light emitting device package. The method of claim 3, wherein
At least one fastening part is formed in the holder and the heat dissipation member, and the holder is fixed to the heat dissipation member by fastening means. The method of claim 1,
The substrate comprises a metal substrate or a ceramic substrate. The method of claim 1,
The holder is a light emitting module made of an inorganic material. The method of claim 10 or 11,
The light emitted from the light emitting device has a wavelength of 260 ~ 395nm wavelength module. The method of claim 1,
The electrode pad includes an anode electrode pad and a cathode electrode pad spaced apart from the anode electrode pad. 17. The method of claim 16,
And the anode electrode pad and the cathode electrode pad are arranged side by side in the same direction.
KR1020110143151A 2011-08-22 2011-12-27 Light emitting module KR20130074990A (en)

Priority Applications (15)

Application Number Priority Date Filing Date Title
KR1020110143151A KR20130074990A (en) 2011-12-27 2011-12-27 Light emitting module
CN201210301998.XA CN103078040B (en) 2011-08-22 2012-08-22 Light emitting device packaging piece and electro-optical device
EP12181342.2A EP2562834B1 (en) 2011-08-22 2012-08-22 Light emitting diode package
JP2012183659A JP6005440B2 (en) 2011-08-22 2012-08-22 Light emitting device package and light unit including the same
US13/591,626 US8704433B2 (en) 2011-08-22 2012-08-22 Light emitting device package and light unit
CN201610852314.3A CN107425103B (en) 2011-08-22 2012-08-22 Light emitting device package and light apparatus
US14/253,606 US9196814B2 (en) 2011-08-22 2014-04-15 Light emitting device package and light unit
US14/885,661 US9634215B2 (en) 2011-08-22 2015-10-16 Light emitting device package and light unit
JP2016175999A JP6567482B2 (en) 2011-08-22 2016-09-08 Ultraviolet light emitting device package and light emitting unit including the same
JP2018126360A JP6437154B2 (en) 2011-08-22 2018-07-02 Light emitting device package
JP2018126361A JP6626161B2 (en) 2011-08-22 2018-07-02 Ultraviolet light emitting device package
JP2018213180A JP6691952B2 (en) 2011-08-22 2018-11-13 Light emitting device package
US16/394,870 USRE48858E1 (en) 2011-08-22 2019-04-25 Light emitting device package and light unit
JP2019141895A JP6969806B2 (en) 2011-08-22 2019-08-01 Light emitting element package and lighting equipment
JP2021171970A JP7266316B2 (en) 2011-08-22 2021-10-20 light emitting device package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110143151A KR20130074990A (en) 2011-12-27 2011-12-27 Light emitting module

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013112234A1 (en) 2013-06-28 2014-12-31 Electronics And Telecommunications Research Institute Method and apparatus for balancing the transmission rate between data streams in a broadcast data stream transmission system associated with heterogeneous networks
WO2015021458A1 (en) * 2013-08-09 2015-02-12 Molex Incorporated Holder assembly

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013112234A1 (en) 2013-06-28 2014-12-31 Electronics And Telecommunications Research Institute Method and apparatus for balancing the transmission rate between data streams in a broadcast data stream transmission system associated with heterogeneous networks
WO2015021458A1 (en) * 2013-08-09 2015-02-12 Molex Incorporated Holder assembly
US9985375B2 (en) 2013-08-09 2018-05-29 Molex, Llc Holder assembly
US10243292B2 (en) 2013-08-09 2019-03-26 Molex, Llc Holder assembly

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