KR20130074990A - Light emitting module - Google Patents
Light emitting module Download PDFInfo
- Publication number
- KR20130074990A KR20130074990A KR1020110143151A KR20110143151A KR20130074990A KR 20130074990 A KR20130074990 A KR 20130074990A KR 1020110143151 A KR1020110143151 A KR 1020110143151A KR 20110143151 A KR20110143151 A KR 20110143151A KR 20130074990 A KR20130074990 A KR 20130074990A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- light emitting
- electrode pad
- holder
- emitting module
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 154
- 230000017525 heat dissipation Effects 0.000 claims description 49
- 239000000919 ceramic Substances 0.000 claims description 17
- 229910010272 inorganic material Inorganic materials 0.000 claims description 4
- 239000011147 inorganic material Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 abstract description 8
- 230000007613 environmental effect Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 8
- 238000003912 environmental pollution Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000003086 colorant Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
Abstract
Description
An embodiment relates to a light emitting module.
BACKGROUND ART Light emitting devices such as a light emitting diode (LD) or a laser diode using semiconductor materials of Group 3-5 or 2-6 group semiconductors are widely used for various colors such as red, green, blue, and ultraviolet And it is possible to realize white light rays with high efficiency by using fluorescent materials or colors, and it is possible to realize low energy consumption, semi-permanent life time, quick response speed, safety and environment friendliness compared to conventional light sources such as fluorescent lamps and incandescent lamps .
Therefore, a transmission module of the optical communication means, a light emitting diode backlight replacing a cold cathode fluorescent lamp (CCFL) constituting a backlight of an LCD (Liquid Crystal Display) display device, a white light emitting element capable of replacing a fluorescent lamp or an incandescent lamp Diode lighting, automotive headlights, and traffic lights.
In the light emitting module equipped with such a light emitting diode, generally, an electrode pad electrically connected to the light emitting diode and an external power supply are connected by soldering to supply a current required for driving the light emitting diode.
However, the soldering operation is not suitable for the current trend toward eco-friendliness because it is fatal to environmental pollution because of the use of lead, and there is a problem in that lead corrosion corrodes over a long time after the soldering operation and affects the reliability of the light emitting module. .
Embodiments provide a light emitting module that is structurally robust by minimizing environmental pollution by mechanically connecting a light emitting module and an external power source.
According to an embodiment, there is provided a light emitting module, comprising: a substrate having a light source disposed on one surface thereof and including an electrode pad electrically connected to the light source; And a holder positioned on the substrate and having a cavity located in an area corresponding to the electrode pad, wherein the electrode pad is in contact with a protruding electrode portion disposed in the cavity and electrically connected to a wire.
The apparatus may further include a spring part positioned in the cavity and supporting the protruding electrode part.
The apparatus may further include a heat dissipation member disposed under the substrate.
A thermal conductive member may be positioned between the substrate and the heat dissipation member.
The heat dissipation member may include a plurality of heat dissipation fins formed extending in a lower surface direction of the heat dissipation member.
The holder may have a protrusion located on a surface facing the substrate, and the substrate may have a receiver at a position corresponding to the protrusion.
At least one fastening part may be formed on the holder and the substrate, and the holder may be fixed to the substrate by a fastening means.
The electrode pad may be disposed adjacent to an edge region of the substrate.
The thickness of the substrate corresponding to the electrode pad and the thickness of the substrate not corresponding to the electrode pad may be different from each other.
The light source may be a light emitting device, and the electrode pad may be electrically connected to the light emitting device.
The light source may be a light emitting device package, and the electrode pad may be electrically connected to a light emitting device disposed in the light emitting device package.
At least one fastening part may be formed in the holder and the heat dissipation member, and the holder may be fixed to the heat dissipation member by a fastening means.
The substrate may include a metal substrate or a ceramic substrate.
The holder may be made of an inorganic material.
The light emitted from the light emitting device may have a wavelength in the region of 260 to 395 nm.
The electrode pad may include an anode electrode pad and a cathode electrode pad spaced apart from the anode electrode pad.
The anode electrode pad and the cathode electrode pad may be arranged side by side in the same direction.
According to the embodiment, since the light emitting module and the external power supply are mechanically connected without soldering, there is no concern about environmental pollution, which is environmentally friendly, and the occurrence of poor wire connection due to cold soldering can be minimized, thereby improving reliability of the light emitting module. .
1 is a perspective view of a light emitting module according to a first embodiment,
2 is a perspective view of a light emitting module according to a second embodiment;
3 is a view showing the configuration of the fastening portion of the holder,
4A and 4B are cross-sectional views illustrating one embodiment of a contact structure between a wire disposed in a holder and an electrode pad on a substrate;
5 is a perspective view illustrating a light emitting module according to a third embodiment;
6 is a perspective view of a light emitting module according to a fourth embodiment;
7 is a perspective view of a light emitting module according to a fifth embodiment;
8 is a perspective view of a light emitting module according to a sixth embodiment;
9 is a perspective view of a light emitting module according to a seventh embodiment;
FIG. 10 is a view illustrating an embodiment of a head lamp in which a light emitting module according to the above embodiments is disposed.
Hereinafter, with reference to the accompanying drawings an embodiment of the present invention that can specifically realize the above object.
In the description of the embodiment according to the present invention, in the case of being described as being formed "on or under" of each element, the upper (upper) or lower (lower) or under are all such that two elements are in direct contact with each other or one or more other elements are indirectly formed between the two elements. Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one element.
The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. In addition, the size of each component does not necessarily reflect the actual size.
1 is a perspective view of a light emitting module according to a first embodiment.
The light emitting module according to the first embodiment includes a
The
The
The
The ceramic substrate may be formed of a single layer or may be formed of a multilayer, and when the
When the
An
When a plurality of
The
The
That is, the thickness of the
The
The
FIG. 1 illustrates a light emitting module having two
When two or
The
That is,
An internal structure of the
When the
1 illustrates that the
2 is a perspective view of a light emitting module according to a second embodiment.
The content overlapping with the first embodiment will not be described again, and the following description will focus on differences.
The light emitting module according to the second embodiment includes a
The
The
In this case, unlike the first embodiment, the
In FIG. 2, as an example, an
In addition, unlike the first embodiment, since the
That is, the difference between the
2 illustrates that the
3 is a view showing the configuration of the fastening portion of the holder. Hereinafter, a fastening structure of the
3 omits the top surface of the
Although not shown, a fastening portion may be formed at a position corresponding to the
In FIG. 3, as an example, two through-holes are formed on the lower surface of the
The shape and number of the
4A and 4B are cross-sectional views illustrating one embodiment of a contact structure between a wire disposed in a holder and an electrode pad on a substrate.
Referring to FIG. 4A, the
The
Conventionally, the
In an embodiment, the
The
When the
The outer surface of the
Alternatively, as shown in FIG. 4B, the
In this case, a
In addition, the
The
4A and 4B illustrate the
In addition, although not shown, as shown in FIG. 1, when one
Duplicates of the above-described embodiments will not be described again, and the following description will focus on differences.
The light emitting module according to the third embodiment includes a
The
In this case, the
In the first and second embodiments, the
The cover unit 230 may have a similar configuration to the
When the
Alternatively, as shown in FIG. 1, when two or more
In both cases, since the cover unit 230 covers two
In FIG. 5, similar to that shown in FIG. 2, an
In FIG. 5, the first and
The
As described above, when the
However, not all four
The
The
As described with reference to FIG. 3, the cover unit 230 may have at least one fastening portion formed on a lower surface of the cover unit 230, and may be fixed to the
Although not shown, a fastening portion may be formed in the
However, if too many fastening portions are formed to the
Alternatively, a plurality of fitting protrusions are provided on the bottom surface of the
6 is a perspective view of a light emitting module according to a fourth embodiment.
Duplicates of the above-described embodiments will not be described again, and the following description will focus on differences.
The light emitting module according to the fourth embodiment includes a
The
In this case, the
Since the cover unit 230 is similar to the
The
As described above, when the
However, not all four
The
The
The thermally
The
The
A
In FIG. 6, a screw is used as the fastening means 242 as an example, but other fastening means may be used.
The
In FIG. 6, as an example, the
The
The
Alternatively, in some embodiments, the
As described above, the thermally
7 is a perspective view of a light emitting module according to a fifth embodiment.
Duplicates of the above-described embodiments will not be described again, and the following description will focus on differences.
The light emitting module according to the fifth embodiment includes a
The
Referring to part A of the light emitting
The
The
When the
The
Alternatively, a glass portion (not shown) covering the upper surface of the cavity may be formed without forming the
An
As described above, the number and positions of the
In addition, corresponding to the positions of the
The
In FIG. 7, the
The
The ceramic substrate may be formed of a single layer or may be formed of a multilayer, and when the
When the
8 is a perspective view of a light emitting module according to a sixth embodiment.
Duplicates of the above-described embodiments will not be described again, and the following description will focus on differences.
The light emitting module according to the sixth embodiment includes a
The
The
In the fifth embodiment, the
The cover unit 230 may have a configuration similar to the
When the
Alternatively, as shown in FIG. 1, when two or more
In both cases, since the cover unit 230 covers two
In FIG. 8, similar to that shown in FIG. 7, an
In FIG. 8, the first and
The
As described above, when the
However, not all four
9 is a perspective view of a light emitting module according to a seventh embodiment.
Duplicates of the above-described embodiments will not be described again, and the following description will focus on differences.
The light emitting module according to the seventh embodiment includes a
The
In this case, the
The cover unit 230 may be similar to the
The
As described above, when the
However, not all four
The
The
The thermally
The
The
A
In FIG. 9, a screw is used as the fastening means 242 as an example, but other fastening means may be used.
The
The
The
Alternatively, in some embodiments, the
As described above, the thermally
FIG. 10 is a view illustrating an embodiment of a head lamp in which a light emitting module according to the above embodiments is disposed.
Referring to FIG. 10, light generated by the
The
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, This is possible.
Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined not only by the claims below but also by the equivalents of the claims.
100: light source 110: electrode pad
120: substrate 130: holder
200: holder 220: support plate
310: heat dissipation member 400: light emitting device package
901 light emitting
903: Shade 904: Lens
Claims (17)
A holder positioned on the substrate and having a cavity located in an area corresponding to the electrode pad;
The electrode pad is disposed in the cavity and in contact with the protruding electrode portion electrically connected to the wire.
The light emitting module further comprises a spring part positioned in the cavity and supporting the protruding electrode part.
The light emitting module further comprises a heat dissipation member disposed under the substrate.
And a heat conductive member positioned between the substrate and the heat dissipation member.
The heat dissipation member includes a light emitting module including a plurality of heat dissipation fins formed extending in a lower surface direction of the heat dissipation member.
The holder is a light emitting module having a protrusion located on the surface facing the substrate, the substrate is located in the receiving portion corresponding to the protrusion.
At least one fastening part is formed in the holder and the substrate, and the light emitting module is fixed to the substrate by the fastening means.
The electrode pad is disposed adjacent to the edge region of the substrate.
The light emitting module having a thickness different from that of the substrate corresponding to the electrode pad and the thickness of the substrate not corresponding to the electrode pad.
The light source is a light emitting device, the electrode pad is a light emitting module electrically connected to the light emitting device.
The light source is a light emitting device package, the electrode pad is a light emitting module electrically connected to the light emitting device disposed in the light emitting device package.
At least one fastening part is formed in the holder and the heat dissipation member, and the holder is fixed to the heat dissipation member by fastening means.
The substrate comprises a metal substrate or a ceramic substrate.
The holder is a light emitting module made of an inorganic material.
The light emitted from the light emitting device has a wavelength of 260 ~ 395nm wavelength module.
The electrode pad includes an anode electrode pad and a cathode electrode pad spaced apart from the anode electrode pad.
And the anode electrode pad and the cathode electrode pad are arranged side by side in the same direction.
Priority Applications (15)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020110143151A KR20130074990A (en) | 2011-12-27 | 2011-12-27 | Light emitting module |
CN201210301998.XA CN103078040B (en) | 2011-08-22 | 2012-08-22 | Light emitting device packaging piece and electro-optical device |
EP12181342.2A EP2562834B1 (en) | 2011-08-22 | 2012-08-22 | Light emitting diode package |
US13/591,626 US8704433B2 (en) | 2011-08-22 | 2012-08-22 | Light emitting device package and light unit |
JP2012183659A JP6005440B2 (en) | 2011-08-22 | 2012-08-22 | Light emitting device package and light unit including the same |
CN201610852314.3A CN107425103B (en) | 2011-08-22 | 2012-08-22 | Light emitting device package and light apparatus |
US14/253,606 US9196814B2 (en) | 2011-08-22 | 2014-04-15 | Light emitting device package and light unit |
US14/885,661 US9634215B2 (en) | 2011-08-22 | 2015-10-16 | Light emitting device package and light unit |
JP2016175999A JP6567482B2 (en) | 2011-08-22 | 2016-09-08 | Ultraviolet light emitting device package and light emitting unit including the same |
JP2018126360A JP6437154B2 (en) | 2011-08-22 | 2018-07-02 | Light emitting device package |
JP2018126361A JP6626161B2 (en) | 2011-08-22 | 2018-07-02 | Ultraviolet light emitting device package |
JP2018213180A JP6691952B2 (en) | 2011-08-22 | 2018-11-13 | Light emitting device package |
US16/394,870 USRE48858E1 (en) | 2011-08-22 | 2019-04-25 | Light emitting device package and light unit |
JP2019141895A JP6969806B2 (en) | 2011-08-22 | 2019-08-01 | Light emitting element package and lighting equipment |
JP2021171970A JP7266316B2 (en) | 2011-08-22 | 2021-10-20 | light emitting device package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020110143151A KR20130074990A (en) | 2011-12-27 | 2011-12-27 | Light emitting module |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20130074990A true KR20130074990A (en) | 2013-07-05 |
Family
ID=48988954
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020110143151A KR20130074990A (en) | 2011-08-22 | 2011-12-27 | Light emitting module |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR20130074990A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013112234A1 (en) | 2013-06-28 | 2014-12-31 | Electronics And Telecommunications Research Institute | Method and apparatus for balancing the transmission rate between data streams in a broadcast data stream transmission system associated with heterogeneous networks |
WO2015021458A1 (en) * | 2013-08-09 | 2015-02-12 | Molex Incorporated | Holder assembly |
-
2011
- 2011-12-27 KR KR1020110143151A patent/KR20130074990A/en not_active Application Discontinuation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013112234A1 (en) | 2013-06-28 | 2014-12-31 | Electronics And Telecommunications Research Institute | Method and apparatus for balancing the transmission rate between data streams in a broadcast data stream transmission system associated with heterogeneous networks |
WO2015021458A1 (en) * | 2013-08-09 | 2015-02-12 | Molex Incorporated | Holder assembly |
US9985375B2 (en) | 2013-08-09 | 2018-05-29 | Molex, Llc | Holder assembly |
US10243292B2 (en) | 2013-08-09 | 2019-03-26 | Molex, Llc | Holder assembly |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102287651B1 (en) | Illumination device | |
TWI470845B (en) | Led package, led package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof | |
JP2013046072A (en) | Light emitting element package, light source module, and lighting system including light source module | |
JP2015082550A (en) | Light-emitting module, lighting device, and lighting fixture | |
KR20120047061A (en) | Light emitting device array, and backlight unit and display having the same | |
JP2012015329A (en) | Circuit board | |
KR20130074990A (en) | Light emitting module | |
KR20140013782A (en) | Lighting device | |
TWI565043B (en) | An illumination device | |
US8791482B2 (en) | Light emitting device package | |
KR20130074991A (en) | Light emitting module | |
KR100730772B1 (en) | Package for high power light emission device | |
KR101742674B1 (en) | Lighting device | |
KR102115921B1 (en) | Lighting device | |
TWI753673B (en) | High-power light source package structure and manufacturing method thereof | |
KR101992367B1 (en) | Light emitting device package and socket-type light emitting package including the same | |
KR101060445B1 (en) | LED package for LED lighting and lamp, LED heat dissipation device and LED socket with same | |
JP2011086618A (en) | Illumination device | |
KR102160778B1 (en) | Light emitting device module | |
KR101797595B1 (en) | light emitting device package | |
WO2018116698A1 (en) | Structure for attaching light source substrate | |
CN106169467B (en) | Light emitting device | |
KR101914122B1 (en) | Light emitting module and light unit having the same | |
KR101005054B1 (en) | LED Module | |
KR20120096719A (en) | Lighting device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Withdrawal due to no request for examination |