KR20130068496A - Light emitting module - Google Patents

Light emitting module Download PDF

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Publication number
KR20130068496A
KR20130068496A KR1020110135717A KR20110135717A KR20130068496A KR 20130068496 A KR20130068496 A KR 20130068496A KR 1020110135717 A KR1020110135717 A KR 1020110135717A KR 20110135717 A KR20110135717 A KR 20110135717A KR 20130068496 A KR20130068496 A KR 20130068496A
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KR
South Korea
Prior art keywords
light emitting
protrusion
module
lead frame
module substrate
Prior art date
Application number
KR1020110135717A
Other languages
Korean (ko)
Inventor
엄동일
Original Assignee
엘지이노텍 주식회사
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Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020110135717A priority Critical patent/KR20130068496A/en
Publication of KR20130068496A publication Critical patent/KR20130068496A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)

Abstract

An embodiment relates to a light emitting module.
The light emitting module according to the embodiment includes a body; First and second lead frames in the body; And a light emitting chip disposed on at least one of the first and second lead frames; A module substrate having first and second pads thereon and mounted with the plurality of light emitting diodes; A first bonding member between the first pad of the module substrate and the first lead frame of the light emitting diode; A second bonding member between the second pad of the module substrate and the second lead frame of the light emitting diode; Protrusions protruding from the body of each of the light emitting diodes and one of the first and second lead frames; And a recess to which the protrusion is coupled to an upper portion of the module substrate.

Description

Light emitting module {LIGHT EMITTING MODULE}

An embodiment relates to a light emitting module.

A light emitting diode, for example, a light emitting device is a kind of semiconductor device that converts electrical energy into light, and has been spotlighted as a next-generation light source by replacing an existing fluorescent lamp and an incandescent lamp.

Since the light emitting diode generates light by using a semiconductor element, the light emitting diode consumes very low power as compared with an incandescent lamp that generates light by heating tungsten, or a fluorescent lamp that generates ultraviolet light by impinging ultraviolet rays generated through high-pressure discharge on a phosphor .

In addition, since the light emitting diode generates light using the potential gap of the semiconductor device, it has a longer lifetime, faster response characteristics, and an environment-friendly characteristic as compared with the conventional light source.

Accordingly, many researches are being conducted to replace the existing light sources with light emitting diodes, and as information processing technologies are developed, display devices such as LCDs, PDPs, and AMOLEDs are widely used. Among these display devices, an LCD requires an illumination unit such as a backlight unit capable of generating light in order to display an image.

The embodiment provides a light emitting module for preventing tilt of a light emitting diode on a module substrate.

The embodiment provides a light emitting module in which protrusions of a light emitting diode are coupled to a groove of a module substrate.

The embodiment provides a light emitting module in which a light emitting diode is disposed between guide protrusions of a module substrate.

The light emitting module according to the embodiment includes a body; First and second lead frames in the body; And a light emitting chip disposed on at least one of the first and second lead frames; A module substrate having first and second pads thereon and mounted with the plurality of light emitting diodes; A first bonding member between the first pad of the module substrate and the first lead frame of the light emitting diode; A second bonding member between the second pad of the module substrate and the second lead frame of the light emitting diode; Protrusions protruding from the body of each of the light emitting diodes and one of the first and second lead frames; And a recess to which the protrusion is coupled to an upper portion of the module substrate.

The light emitting module according to the embodiment includes a body; First and second lead frames in the body; And a light emitting chip disposed on at least one of the first and second lead frames; A module substrate having first and second pads thereon and mounted with the plurality of light emitting diodes; A first bonding member between the first pad of the module substrate and the first lead frame of the light emitting diode; A second bonding member between the second pad of the module substrate and the second lead frame of the light emitting diode; And guide protrusions corresponding to at least one of side surfaces of the body of each light emitting diode on the module substrate.

The embodiment can prevent the tilt of the light emitting diode.

The embodiment can improve the defective rate of the light emitting module.

The embodiment can improve the reliability of the light emitting module.

The embodiment can improve the reliability of the lighting system having the light emitting module.

1 is an exploded perspective view of a display device according to an exemplary embodiment.
FIG. 2 is a perspective view illustrating the light emitting module of FIG. 1. FIG.
3 is a side cross-sectional view of a light emitting module according to a first embodiment.
4 is a rear perspective view of the light emitting diode in the light emitting module of FIG. 3.
5 is a rear perspective view of the module substrate in the light emitting module of FIG. 3.
6 is a side cross-sectional view illustrating a light emitting module according to a second embodiment.
7 is an exploded perspective view illustrating a light emitting module according to a third embodiment.
8 is an exploded perspective view illustrating a light emitting module according to a fourth embodiment.
9 is an exploded perspective view illustrating a light emitting module according to a fifth embodiment.

In the description of the embodiment, each substrate, frame, sheet, layer, or pattern is formed "on" or "under" of each substrate, frame, sheet, layer, or pattern. When described as being "in", "on" and "under" include both "directly" or "indirectly" formed other components. . In addition, the upper or lower reference of each component is described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied.

1 is an exploded perspective view illustrating a display device according to an exemplary embodiment.

Referring to FIG. 1, the display device 1000 includes a display panel 1061 in which an image is displayed, and a backlight unit 1050 which provides light to the display panel 1061.

The backlight unit 1050 may include a light guide plate 1041 for providing a surface light source to the display panel 1061, a reflective sheet 1022 for reflecting leakage light, and light at an edge region of the light guide plate 1041. A light emitting module 1031 and a bottom cover 1011 forming a lower appearance of the display device 1000 are included.

Although not illustrated, the display apparatus 1000 may include a panel supporter that supports the display panel 1061 from the lower side, a top that forms an edge of the display apparatus 1000, and surrounds and supports the periphery of the display panel 1061. It may include a cover.

Although not shown in detail, the display panel 1061 may include, for example, a lower substrate and an upper substrate coupled to each other to maintain a uniform cell gap, and a liquid crystal layer (not shown) interposed between the two substrates. Include. A plurality of gate lines and a plurality of data lines intersecting the plurality of gate lines may be formed on the lower substrate, and a thin film transistor (TFT) may be formed at an intersection of the gate line and the data line. Color filters may be formed on the upper substrate. The structure of the display panel 1061 is not limited thereto, and the display panel 1061 may have various structures. In another example, the lower substrate may include a color filter as well as a thin film transistor. In addition, the display panel 1061 may be formed in various shapes according to a method of driving the liquid crystal layer.

Although not shown, a gate driving printed circuit board (PCB) for supplying scan signals to gate lines and a data driving printed circuit board (PCB) for supplying data signals to data lines are provided at edges of the display panel 1061. ) May be provided.

A polarizing film (not shown) may be disposed on at least one of the top and bottom of the display panel 1061. An optical sheet 1051 may be disposed below the display panel 1061, and the optical sheet 1051 may be included in the backlight unit 1050, and may include at least one prism sheet or / and a diffusion sheet. have. The optical sheet 1051 may be removed, but is not limited thereto.

The diffusion sheet evenly spreads the incident light, and the diffused light may be focused onto the display panel by the prism sheet. Here, the prism sheet may be selectively configured using a horizontal or / and vertical prism sheet, one or more roughness reinforcing sheets, and the like. The type, number, etc. of the optical sheet 1051 may be added or deleted within the technical scope of the embodiment, but is not limited thereto.

The light emitting module 1031 may be disposed on at least one side of an inner side of the bottom cover 1011. The light emitting module 1031 may be disposed on both sides or all sides of the bottom cover 1011, but is not limited thereto. In addition, the light emitting module 1031 may be disposed on the bottom of the bottom cover 1011 to be mounted in a direct manner. In this case, the configuration of an optical member such as a light guide plate or an optical sheet may vary.

The light emitting module 1031 includes a module substrate 200 and a plurality of light emitting diodes 100 arranged on one surface of the module substrate 200.

The module substrate 200 may include a resin-based printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, and an FR-4 substrate. The module substrate 200 may include a printed circuit board having a metal layer therein. The light emitting diodes 100 may be arranged in one or two rows on the module substrate 200. The light emitting diodes 100 mounted on the module substrate 200 may be arranged at regular intervals or at irregular intervals. The module substrate 200 may be disposed in a bar shape, but is not limited thereto.

The connection method of the plurality of light emitting diodes 100 may vary depending on, for example, a series connection, a parallel connection, and a serial-to-parallel connection, but is not limited thereto.

The plurality of light emitting diodes 100 may be arranged in a first direction at a predetermined pitch or in a matrix form. At least one of the plurality of light emitting diodes 100 emits at least one of at least one color, for example, white, red, green, and blue. The embodiment may use a light emitting diode 100 emitting light of at least one color or a combination of light emitting diodes 100 emitting light of a plurality of colors.

The module substrate 200 may be coupled in a direction perpendicular to the bottom of the bottom cover 1011 or disposed in a direction parallel to the bottom of the bottom cover 1011, but is not limited thereto. The light emitting diodes 100 are mounted on the front surface (or top surface) of the module substrate 200.

The module substrate 200 may be combined with an adhesive, an adhesive, or a fastening member on the bottom cover 1011 or the heat dissipation plate, but is not limited thereto.

The plurality of light emitting diodes 100 are disposed to face at least one side of the light guide plate 1041, and light generated from the plurality of light emitting diodes 100 is incident. The light guide plate 1041 may be formed in a polygonal shape including an upper surface at which a surface light source is generated, a lower surface opposite to the upper surface, and at least four side surfaces. The light guide plate 1041 is made of a transparent material, and may include, for example, one of an acrylic resin series such as polymethyl metaacrylate (PMMA), polyethylene terephthlate (PET), polycarbonate (PC), and polyethylene naphthalate (PEN) resin. Can be. The light guide plate 1041 may be formed by an extrusion molding method, but is not limited thereto.

A reflective pattern (not shown) may be formed on the top or / and bottom of the light guide plate 1041. The reflection pattern is formed of a predetermined pattern, for example, a reflection pattern and / or a prism pattern, thereby reflecting or / and diffusely reflecting light, so that the light may be uniformly irradiated through the entire surface of the light guide plate 1041. The lower surface of the light guide plate 1041 may be formed in a reflective pattern, and the upper surface may be formed in a prism pattern. A scattering agent may be added to the inside of the light guide plate 1041, but is not limited thereto.

The reflective sheet 1022 may be provided under the light guide plate 1041. The reflective sheet 1022 reflects light traveling toward the lower portion of the light guide plate 1041 toward the display panel. The reflective sheet 1022 re-injects the light leaked to the lower portion of the light guide plate 1041 to the light guide plate 1041, thereby preventing problems such as a decrease in light efficiency, a decrease in optical characteristics, and dark areas. The reflective sheet 1022 may be formed of, for example, PET, PC, or PVC resin, but is not limited thereto. The reflective sheet 1022 may be an upper surface of the bottom cover 1011, but is not limited thereto.

The bottom cover 1011 includes an accommodating part 1012 having an open top, and the accommodating part 1012 includes a light emitting module 1031, an optical sheet 1051, a light guide plate 1041, and a reflecting sheet 1022. Can be stored. The bottom cover 1011 may be formed of a material having a high heat dissipation efficiency, for example, a stainless material, but is not limited thereto.

A reflective sheet 1022, a light guide plate 1041, and an optical sheet 1051 may be sequentially stacked on the accommodating portion 1012 of the bottom cover 1011, and the light emitting module 1031 may include the bottom cover 1011. The side surface of the light guide plate 1041 is disposed to correspond to.

At least one light emitting module 1031 may be disposed in the bottom cover 1011, but is not limited thereto.

Referring to FIG. 2, the light emitting module 1031 may mount the plurality of light emitting diodes 100 on the top surface 201 of the module substrate 200. When mounting the plurality of light emitting diodes 100, a bonding member such as solder is disposed on the module substrate 200, and the plurality of light emitting diodes 100 are disposed on the bonding member on the module substrate 200. ) Is placed. In this case, the plurality of light emitting diodes 100 are arranged along the alignment line L1. Thereafter, the plurality of light emitting diodes 100 are bonded through a reflow soldering process. At least one of the plurality of light emitting diodes 100 may be twisted from the alignment line L1 on the bonding member during the reflow soldering. The entire light distribution of the light emitting module 1031 may be changed by the light emitting diode 100 twisted from the alignment line L1, so that the color distribution of the light emitting module 1031 may be changed or treated as defective. The embodiment applies a structure to prevent the light emitting diode 100 from twisting from the alignment line L1 as described above, thereby lowering the defective rate of the light emitting module 1031 by twisting the light emitting diode 100, thereby reducing the total light. It can reduce the influence of the distribution.

In an embodiment, a protrusion is formed on one of the light emitting diodes 100 and the module substrate 200, and a recess corresponding to the protrusion is formed on the other, so that the light emitting diode 100 is frozen by the coupling between the protrusion and the recess. Tilt from the in line can be prevented.

3 is a side cross-sectional view illustrating a light emitting module according to a first embodiment, FIG. 4 is a rear perspective view illustrating an example of the light emitting diode of FIG. 3, and FIG. 5 is a view illustrating an example of a module substrate of FIG. 3.

3 to 5, the light emitting module 1031 may be mounted after arranging a plurality of light emitting diodes 100 on the top surface 201 of the module substrate 200.

Each light emitting diode 100 includes a body 11, at least two lead frames having first and second lead frames 21, 31, at least one light emitting chip 41, and a molding member 51.

The body 11 is an insulating material, for example, polyphthalamide (PPA: Polyphthalamide), LCP (Liquid Crystal Polymer), PA9T (Polyamide9T) resin material, a material containing a metal, PSG (photo sensitive glass), sapphire ( Al 2 O 3 ) and a printed circuit board (PCB). For example, the body 11 will be described as including at least one of a resin material having high reflectance and easy injection molding with the lead frames 21 and 31, for example, PPA and silicon.

A cathode mark may be formed on the upper side of the body 11. The cathode mark distinguishes the first lead frame 21 or the second lead frame 31 of the light emitting diode 10, and is confused about the direction of the polarity of the first and second lead frames 21 and 31. Can be prevented.

A cavity 12 is formed in the body 11, and the cavity 12 includes a concave shape or a recess shape having an open top. The cavity 12 may not be formed in the body 11.

At the bottom of the cavity 12, a plurality of lead frames 21 and 31 are separated from each other by a gap portion. The cavity 12 may be formed in a circle shape, an ellipse shape, a polygon shape, and the like, when viewed from the top of the device, but is not limited thereto.

At least two of the plurality of lead frames 21 and 31 may be electrically separated from each other, and may be formed of a metal plate having a predetermined thickness, and another metal layer may be plated on the surface of the metal plate, but is not limited thereto. . The plurality of lead frames 21 and 31 may be formed of a metal material, for example, titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), or platinum. It may include at least one of (Pt), tin (Sn), silver (Ag), phosphorus (P). In addition, the first and second lead frames 21 and 31 may be formed to have a single layer or a multilayer structure, but are not limited thereto. The thicknesses of the first and second lead frames 21 and 31 may be 0.8 mm to 2 mm, but are not limited thereto.

At least some of the plurality of lead frames 21 and 31 may be disposed at the bottom of the cavity 12 and may be exposed to the lower portion of the body 11. Lower surfaces of the plurality of lead frames 21 and 31 disposed below the cavity 12 are exposed to the lower surface S5 of the body 11 and used as electrode terminals.

The light emitting chip 41 is disposed in the cavity 12. The light emitting chip 41 is mounted on the first lead frame 21 and is connected to the second lead frame 31 by a wire 42. The first lead frame 21 and the second lead frame 31 conduct heat radiated from the light emitting chip 41 in an outward direction and a downward direction to radiate heat.

The light emitting chip 41 implements a compound semiconductor having a group 2 to 6 element selectively as a diode emitting a visible light band or an ultra violet band that emits light such as red, green, blue, and white. However, the present invention is not limited thereto. The light emitting chip 41 may be implemented as a horizontal chip having two electrodes arranged in parallel to each other or a vertical chip having two electrodes disposed on opposite sides of the chip, but the invention is not limited thereto. The horizontal chip may be connected with at least two wires, and the vertical chip may be connected with at least one wire 42, but is not limited thereto.

The cavity 12 is formed with a molding member 51, and the molding member 51 may include a transparent resin material such as epoxy or silicone. In addition, the phosphor or the diffusing agent may be optionally added to the molding member 51, but the present invention is not limited thereto. A lens (not shown) may be formed on the molding member 51 or on an upper surface of the body 11, and the lens may have a concave lens shape, a convex lens shape, a certain part concave, and another part convex. It may include. The phosphor may include, for example, a YAG-based, silicate-based, or TAG-based fluorescent material.

3 and 4, the first end portion 22 of the first lead frame 21 may protrude outward from the first side surface S1 of the body 11. The second end portion 32 of the second lead frame 31 may protrude outward from the second side surface S2 of the body 11. The first side surface S1 and the second side surface S2 of the body 11 are disposed opposite to each other.

At least one of the body 11 and the lead frames 21 and 31 may have protrusions 15 and 16 protruding in the direction of the bottom surface S5 of the body 11. The first embodiment includes a first protrusion 15 and a second protrusion 16 protruding downward from the lower surface S5 of the body 11, and the first protrusion 15 and the second protrusion. 16 may be formed of a material of the body (11). The first protrusion 15 protrudes from the region between the first end 22 of the first lead frame 21 and the second lead frame 31 to the bottom surface of the body 11, and the second protrusion 16 may protrude from the lower end of the body 11 in an area between the second end 32 of the second lead frame 31 and the first lead frame 21.

The first protrusion 15 and the second protrusion 16 are disposed to correspond to each other on the lower surface S5 of the body 11. The distance D3 between the inner surface between the first protrusion 15 and the second protrusion 16 may be smaller than the length X1 of the body 11, and the first protrusion 15 or the first protrusion 15 may be smaller than the length X1 of the body 11. The width D5 of the second protrusion 16 may be narrower than the width Y1 of the body 11. The length X1 of the body 11 is a direction passing through the center of the first lead frame 21 and the second lead frame 31, and between the first side surface S1 and the second side surface S2. It can be a gap. The width Y1 of the body 11 is a direction orthogonal to the length direction and may be a gap between the third side surface S3 and the fourth side surface S4.

The height D2 of the first protrusion 15 and the second protrusion 16 is a length protruding from the lower surface of the body 11 and may be, for example, 150 μm to 200 μm.

Also, as shown in FIG. 2, the distance D3 between the inner surface between the first protrusion 15 and the second protrusion 16 is the bottom width D4 of the cavity 12, that is, the width of the cavity 12. May be formed to be wider than the narrowest part, and the first protrusion 15 and the second protrusion 16 may be disposed in an area which does not overlap with an area of the cavity 12 of the body 11, and thus the first protrusion may be formed. 15 and the second projection 16 can be stably formed.

In addition, the direction in which the first protrusion 15 and the second protrusion 16 are arranged in the module substrate 200 may be formed along the direction in which the plurality of light emitting diodes 100 are arranged.

5 and 6, the module substrate 200 includes a first pad 211 and a second pad 213, and a first recess 215 and a first recess 216 disposed thereon. .

The first pad 211 is electrically connected to the first lead frame 21 of the light emitting diode 100 and supplies power of a first polarity. The second pad 213 is electrically connected to the second lead frame 31 of the light emitting diode 100 and supplies power of a second polarity.

The first pad 211 and the second pad 213 are spaced apart from each other. As shown in FIG. 3, a first joining member 221 is disposed on the first pad 211, and a second joining member 223 is disposed on the second pad 213. The first bonding member 221 and the second bonding member 223 may have a thickness in a range of 50 μm to 150 μm.

The first recess 215 may be formed at a depth lower than the top surface 201 of the module substrate 200 in an area adjacent to the first pad 211. The first recess 216 may be formed at a depth lower than the top surface 201 of the module substrate 200 in an area adjacent to the second pad 213. The length D6 of the first and second recesses 215 and 216 may be longer than the width D5 of the first protrusion 15, and the widths of the first and second recesses 215 and 216 may be longer than the width D5 of the first and second recesses 215 and 216. D7) may be formed wider than the width of the first protrusion 15, the distance (D3) between the first recess 215 and the second recess 216 is the first protrusion 15 and the first The distance D3 between the two protrusions 16 may be wider or narrower, but is not limited thereto.

The depth D2 of the first recess 215 and the first recess 216 may be formed to a depth of 50 μm-100 μm from the upper surface 201 of the module substrate 200. The depth D2 of the first recess 215 and the first recess 216 may be formed to a depth lower than the height D1 of the first protrusion 15 and the second protrusion 16. It may be set to a depth in consideration of the thickness of the first bonding member 221 and the second bonding member 223.

When the light emitting diode 100 is bonded onto the module substrate 200, the first bonding member 221 may be electrically connected by bonding the first pad 211 and the first lead frame 21 to each other. In addition, the second bonding member 223 is electrically connected between the second pad 213 and the second lead frame 31 by bonding.

The first protrusion 15 of the light emitting diode 100 is inserted into the first recess 215 of the module substrate 200, and the second protrusion 16 is the first recess of the module substrate 200. It is inserted into the portion 216.

The light emitting diode 100 is bonded to the first and second bonding members 221 and 223 on the module substrate 200, and the first protrusion 15 and the second protrusion 16 are the first recess 215. ) And the first recess 216 may be prevented from being tilted even when the reflow soldering process is performed. That is, since the first protrusion 15 and the second protrusion 16 of the light emitting diode 100 are disposed in the first recess 215 and the first recess 216 of the module substrate 200, the light emitting diode 100 emits light. Diode 100 does not rotate or tilt with respect to the alignment line.

6 is a view showing a light emitting module according to a second embodiment.

Referring to FIG. 6, the module substrate 200 of the light emitting module has a first recess 225 in a region adjacent to the first pad 211 and a first recess 226 in a region adjacent to the second pad 213. Is formed, the first recess 225 and the first recess 226 has a hemispherical shape may be formed in an intaglio shape.

The first protrusion 24 of the light emitting diode is formed in the first lead frame 21, and the second protrusion 34 is formed in the second lead frame 31. The first protrusion 24 may be formed in a curved structure of the first lead frame 21 or may be formed in a structure protruding from the first lead frame 21. The second protrusion 34 may be formed as a curved structure of the second lead frame 31 or may be formed to protrude from the second lead frame 31.

The first protrusion 24 and the second protrusion 34 may have a shape corresponding to the first concave portion 225 and the first concave portion 226, for example, a hemispherical shape and may be embossed. The first protrusion 24 and the second protrusion 34 may be formed in a hemispherical shape, a pillar shape or a pin shape, but is not limited thereto.

7 is a view showing a light emitting module according to a third embodiment.

Referring to FIG. 7, the light emitting module includes a first recess 235 and a first recess 236, and the first recess 235 and the second recess 236 are circular pillars or polygons. It may be formed in a columnar shape. The first recess 235 and the first recess 236 are disposed diagonally to each other, and the width (or diameter) of each of the recesses 235 and 236 is the first protrusion 17 of the light emitting diode 100. And the same as the second projection 18, or may be formed wider with a difference of less than 1mm.

An interval G1 between the first recess 235 and the first recess 236 may be shorter than the diagonal length of the body 11, but is not limited thereto.

The first protrusion 17 and the second protrusion 18 of the light emitting diode 100 may protrude in a circular column shape or a polygonal column shape from the lower portion of the body 11. The first protrusion 17 and the second protrusion 18 may be formed of the material of the body 11 or may be formed of the material of the lead frames 21 and 31. The first and second protrusions 17 and 18 may be formed of an insulating material or a metal material different from the body 11 or the lead frames 21 and 31, but are not limited thereto.

The first protrusion 17 and the second protrusion 18 of the light emitting diode 100 are coupled to the first recess 235 and the first recess 236 of the module substrate 200 to form a light emitting diode ( 100 may be prevented from being tilted from the alignment line during the reflow soldering process, thereby reducing the defective rate of the light emitting module.

8 is a view showing a light emitting module according to a fourth embodiment.

Referring to FIG. 8, a first recess 215 and a first recess 236 are disposed on the module substrate 200 of the light emitting module, and the first protrusion 17 and the lower portion of the light emitting diode 100 are disposed below. The second projection 18 is disposed. The length D6 of the first and second recesses 215 and 216 may be smaller than the width of the body 11 and longer than the width W1 of the first and second lead frames 21 and 31. have. The first and second recesses 215 and 216 may be formed to have a width into which the first protrusion 17 and the second protrusion 18 may be inserted.

The first protrusion 17 and the second protrusion 18 of the light emitting diode 100 may be formed in the shape of a circle column or a polygonal column, and the widths of the first protrusion 17 and the second protrusion 18 ( For example, the diameter) may be less than 1/3 of the length D6 of the first recess 215 and the second recess 216. By lengthening the length D6 of the first recess 215 and the second recess 216, the light emitting diode 100 can be easily mounted on the module substrate 200, and various types of light emitting diodes ( 100) can be mounted. In addition, the length D6 of the first recess 215 and the second recess 216 may be formed within a range in which the plurality of light emitting diodes 100 do not deviate from the alignment line.

9 is a view showing a light emitting module according to a fifth embodiment.

Referring to FIG. 9, the light emitting module forms guide protrusions 245-248 at at least two corners around a region of the upper surface 201 of the module substrate 200 on which the light emitting diodes 100 are mounted. The distance D8 between the first and second guide protrusions 245 and 246 or the third and fourth guide protrusions 247 and 248 may correspond to the third and fourth side surfaces S3 and S of the body 11 of the light emitting diode 100. It may be wider than the spacing between S4), and wider than the width of the lead frame (211,213). An interval D9 between the first and third guide protrusions 245 and 247 and the second and fourth guide protrusions 246 and 248 may be smaller or wider than the length of the body 11.

When the light emitting diode 100 is mounted on the module substrate 200, first and third guide protrusions 245 and 247 correspond to the third side surface S3 of the light emitting diode 100, and the fourth side surface S4. The second and fourth guide protrusions 246 and 248 correspond to each other. In this embodiment, the first and fourth guide protrusions 246 and 248 may be disposed, or the second and third guide protrusions 246 and 247 may be disposed. In addition, at least one of the first and second guide protrusions 245 and 246 may be disposed to correspond to the first side surface S1 of the body 11 of the light emitting diode 100, and the third and fourth guide protrusions 247 and 248. ) May be disposed to correspond to the second side surface S2 of the body 11 of the light emitting diode 100.

The guide protrusions 245, 246, 247, 248 protrude from the upper surface 201 of the module substrate 200 in a range of 150 μm to 200 μm, so that the first pads 211, 211A and the second pad of the module substrate 200. After arranging the bonding members on the 213 and 213A, respectively, when bonding the light emitting diodes 100 to each other, the side surfaces S3 and S4 of the light emitting diodes 100 may be contacted or disposed with a predetermined gap. have. The plurality of first pads 211 and 211A may be spaced apart from each other, and the plurality of second pads 213 and 213A may be spaced apart from each other, but the present invention is not limited thereto.

The guide protrusions 245-248 of the module substrate 200 may prevent the light emitting diode 100 from being distorted from a preset alignment line on the module substrate 200. In addition, there is an effect that a protrusion may not be formed on at least one of the body 11 and the lead frames 21 and 31 of the light emitting diode 100.

The light emitting module disclosed in the above embodiments may be applied to a backlight unit of a top view type, or to a backlight unit such as a portable terminal, a computer, or an illumination device such as a lamp, a traffic light, a vehicle headlight, an electric sign, a street lamp, and the like. It is not limited. In addition, the light guide plate may not be disposed in the direct type light emitting module, but is not limited thereto. In addition, a light transmitting material such as a lens or glass may be disposed on the light emitting module, but is not limited thereto.

It is not intended to be limited to the above-described embodiments and the accompanying drawings, but is limited by the appended claims. It will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined in the appended claims, As will be described below.

11: body, 12: cavity, 15, 16, 17, 18, 24, 34: protrusion, 21, 31: lead frame, 41: light emitting chip, 100: light emitting diode, 200: module substrate, 215, 216, 225, 226: recessed part, 245 -248: guide protrusion, 211,123: pad

Claims (13)

Body; First and second lead frames in the body; And a light emitting chip disposed on at least one of the first and second lead frames;
A module substrate having first and second pads thereon and mounted with the plurality of light emitting diodes;
A first bonding member between the first pad of the module substrate and the first lead frame of the light emitting diode;
A second bonding member between the second pad of the module substrate and the second lead frame of the light emitting diode;
Protrusions protruding from the body of each of the light emitting diodes and one of the first and second lead frames; And
The light emitting module including a recess coupled to the projection on the upper portion of the module substrate. The light emitting module of claim 1, wherein the protrusion comprises first and second protrusions disposed in different areas of the lower portion of the body. The light emitting module of claim 2, wherein the first protrusion is formed in an area adjacent to the first pad, and the second protrusion is formed in an area adjacent to the second pad. The light emitting module according to any one of claims 1 to 3, wherein the height of the protrusion protrudes from the bottom surface of the body in the range of 150 µm to 200 µm. 2. The light emitting module of claim 1, wherein the protrusion comprises a first protrusion and a second protrusion, wherein at least a portion of the first lead frame and the second lead frame protrude further below the lower surface of the body. The method of claim 5, wherein the first and second projections comprise any one of a hemispherical, columnar pin shape,
The concave portion is formed in a shape corresponding to the first projection and the second projection. The light emitting module of claim 4, wherein the recess is formed to a depth of 50 μm-100 μm from an upper surface of the module substrate. The method of claim 1, wherein the projection comprises a circle or polygonal column shape,
The concave portion is formed light emitting module at least longer than the width of the projection. The light emitting module of claim 7, wherein a depth of the recess is thicker than a thickness of the first bonding member. The light emitting module of claim 7, wherein the recess is formed to have a length that is at least longer than the width of the protrusion. The method of claim 5, wherein the first projection is disposed in the region between the first end of the first lead frame and the second lead frame, the second projection is the second end of the second lead frame and the second 1. A light emitting module disposed in an area between one lead frame. Body; First and second lead frames in the body; And a light emitting chip disposed on at least one of the first and second lead frames;
A module substrate having first and second pads thereon and mounted with the plurality of light emitting diodes;
A first bonding member between the first pad of the module substrate and the first lead frame of the light emitting diode;
A second bonding member between the second pad of the module substrate and the second lead frame of the light emitting diode; And
And a guide protrusion corresponding to at least one of sides of the body of each light emitting diode on the module substrate. The light emitting module of claim 12, wherein at least one guide protrusion is disposed on opposite sides of the body.
KR1020110135717A 2011-12-15 2011-12-15 Light emitting module KR20130068496A (en)

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KR1020110135717A KR20130068496A (en) 2011-12-15 2011-12-15 Light emitting module

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