KR20130038176A - Electronic component mounting apparatus, and electronic component mounting method - Google Patents

Abstract

PURPOSE: An electronic component mounting apparatus and an electronic component mounting method are provided to accurately arrange electronic components on a substrate having a through hole. CONSTITUTION: An electronic component mounting apparatus supplies an electronic component(80) having a lead line. A head main body(30) includes a head supporter(31), a nozzle(32), and a nozzle driving part(34). The nozzle adsorbs the electrical component supplied from the electronic component mounting apparatus. A photographing device(36) is fixed to the head supporter and photographs a substrate. A laser recognition apparatus(38) includes a light source(38a) and a light receiving element(38b). A control unit(60) controls the head main body, the photographing device, and the component support unit. [Reference numerals] (60) Control unit; (62) Head control unit; (64) Component supply control unit; (AA) Z axis direction; (BB) Y axis direction;

Description

Electronic component mounting device and electronic component mounting method {ELECTRONIC COMPONENT MOUNTING APPARATUS, AND ELECTRONIC COMPONENT MOUNTING METHOD}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for holding and moving an electronic component with a nozzle to mount it on a substrate.

An electronic component mounting apparatus for mounting an electronic component on a substrate has a head having a nozzle, and the electronic component is held on the substrate and mounted on the substrate. The electronic component mounting apparatus adsorbs the components in the electronic component supply apparatus by moving the nozzle of the head in the direction orthogonal to the surface of the substrate, and then moves the head relatively in the direction parallel to the surface of the substrate, thereby adsorbing. Upon arriving at the mounting position of the part being used, the nozzle of the head is moved in a direction orthogonal to the surface of the substrate to bring the adsorbed electronic component onto the substrate.

Here, as an electronic component mounted on a board | substrate, besides the mounting type electronic component mounted on a board | substrate, there exists a lead-type electronic component provided with a main body and the lead connected to the main body. In this case, a lead type electronic component is mounted by inserting a lead into the hole formed in the board | substrate. In addition, in this case, the electronic component mounted on a board | substrate, for example, SOP, QFP, etc., not inserted into an insertion hole (substrate hole) is set as a mounting type electronic component. As an electronic component mounting apparatus which mounts a lead type electronic component on a board | substrate, the apparatus described in patent documents 1 and 2 is mentioned, for example. Patent Literature 1 includes an electronic component mounter including a mounting type electronic component that is sucked by an adsorption head and a component mounter that mounts both of the lead type electronic components that are clamped by the insertion head and are clinched after insertion of the substrate. It is described. Patent Literature 2 describes an electronic component mounting apparatus in which a mounting head for mounting a mounted electronic component and an insertion head for mounting a lead-type electronic component are integrally formed.

Moreover, the electronic component mounting apparatus is equipped with the some electronic component supply apparatus which supplies the electronic component to be mounted on a board | substrate to the position which a nozzle will attract | suck. The electronic component supplying apparatus has a tape on which electronic components of the same type are arranged at predetermined intervals, and a conveying portion for conveying the tape, and the conveying portion is used to position the nozzle at which the electronic component of the tape is disposed. By conveying, an electronic component is supplied to the position which a nozzle can adsorb | suck.

Moreover, it is an electronic component supply apparatus which supplies an electronic component to the position which a worker can pick up an electronic component in order for a worker to manually insert an electronic component, and also supplies a radial lead type electronic component with a lead wire arrange | positioned in a radial direction. There is (patent document 3).

When the electronic component mounting apparatus mounts the electronic component provided with a lead wire on a board | substrate, the electronic component mounting apparatus inserts and mounts the lead wire of an electronic component into the through hole formed in the board | substrate. The electronic component mounting apparatus executes a process for detecting a position where a through hole (insertion hole) of a substrate is formed when mounting an electronic component. Patent Document 4 describes a method of detecting a position of a through hole on a substrate by setting an image of the through hole and analyzing the photographed image, and setting the detected position to the origin of the substrate.

Japanese Patent Laid-Open No. H05-335782 Japanese Patent Laid-Open No. H09-83121 Japanese Patent Publication H07-48595 Japanese Patent Laid-Open No. H07-91914

Even when the origin mark is not described by using the method described in Patent Document 4, the origin of the substrate can be detected based on the position of the through hole (insertion hole). However, in the case of using the method described in Patent Document 4, since the origin is detected based on the through hole position, the mounted printed circuit board on which the electronic component to be surface mounted and the electronic component including the lead wire are mixed and mounted with high density. In some cases, the mounting position of the electronic component is shifted from the proper position of the substrate.

This invention is made | formed in view of such a point, Comprising: It aims at providing the electronic component mounting apparatus and electronic component mounting method which can mount an electronic component efficiently and with high precision on the board | substrate which has a through hole (insertion hole).

Moreover, a lead type electronic component can be mounted on a board | substrate by using the apparatus of patent documents 1 and 2. Here, the apparatuses described in Patent Literatures 1 and 2 are integrally provided with a dedicated fitting head for inserting an axial lead-type electronic component and a dedicated suction head for mounting the mounted electronic component on a substrate, respectively. This is a mixed mounting apparatus for mounting both the mounted electronic component and the lead electronic component on a substrate. Here, in the mixed mounting mounting apparatus described in Patent Documents 1 and 2, the lead type electronic component cannot be inserted into the insertion hole by the suction head, and the mounting type electronic component cannot be mounted on the substrate by the fitting head. . That is, the device is incompatible with the component types of the electronic component mounted on the head and the lead electronic component. For this reason, the type of electronic components that can be mounted is limited depending on the type of the head mounted on the mounting apparatus, and the apparatus is very expensive because it includes a plurality of head types.

This invention is made | formed in view of the above, and an object of this invention is to be able to mount a lead-type electronic component efficiently and with high precision.

MEANS TO SOLVE THE PROBLEM In order to solve the problem mentioned above and to achieve the objective, this invention is equipped with the board | substrate conveyance part which conveys a board | substrate, and at least 1 electronic component supply apparatus which supplies the electronic component which has a lead wire as an electronic component mounting apparatus. A head main body having a component supply unit, a nozzle for adsorbing an electronic component supplied from the component supply unit, a nozzle driver for driving the nozzle, and a head support for supporting the nozzle and the nozzle driver, and fixed to the head support And a photographing apparatus for photographing the substrate, a storage unit for storing through-hole coordinate design values, reference mark coordinate design values, and electronic component mounting coordinate design values, and operation of the head body, the photographing apparatus, and the component supply unit. And a control part for controlling the through hole formed in the substrate and a wiring pattern formed on a surface of the substrate. The reference mark to be taken is taken by the photographing apparatus, a reference mark correction value is obtained from the reference mark acquired from the photographed image, and the through hole correction is performed from the deviation amount between the through hole position after the reference mark correction and the through hole acquired from the captured image. A value is calculated and a position to mount the electronic component is determined from the reference mark correction value and the through hole correction value.

Here, the controller controls the operation of the head body to move the electronic component having the lead wire to the position of the substrate determined based on the correction result, and inserts the lead wire of the electronic component into the through hole of the substrate. It is preferable to mount the electronic component on the substrate.

The control unit preferably captures an image of two or more through holes formed adjacent to the substrate, and detects the position of the through holes formed in the substrate based on the relative positions of the two or more through holes.

The control unit preferably captures an image of three through holes formed adjacent to the substrate, and detects the position of the through holes formed in the substrate based on the relative positions of the three through holes.

The apparatus further includes a height sensor fixed to the head support to detect a height of the surface of the substrate and the electronic component mounted on the surface of the substrate, and the control unit includes a reference height of the electronic component to be mounted on the substrate. And inserting a lead wire of the electronic component into the through-hole of the substrate, and detecting the height of the electronic component on the substrate by the height sensor to determine whether the detected height of the electronic component is higher than the reference height. It is desirable to determine.

Further, when it is determined that the detected height of the electronic component is higher than the reference height, the controller preferably notifies an error.

Further, when it is determined that the detected height of the electronic component is higher than the reference height, the controller preferably executes a process of pressing the electronic component on the head body.

Moreover, it is preferable that the process which presses the said electronic component is a process which presses the said electronic component toward the said board | substrate side by the front-end | tip of the said nozzle.

Moreover, it is preferable that the said control part determines the quantity to press by the said press process based on the detected height of the said electronic component.

The electronic component supply apparatus further includes a bowl into which a plurality of electronic components are inserted, a rail for guiding the electronic component discharged from the bowl to a suction position at which the nozzle is sucked, and a downstream side of the suction position of the rail. It is preferable to have a support mechanism for closing the electronic component at the suction position of the rail and a vibrating portion for vibrating the bowl.

The support mechanism is a mechanism that is movable in an extension direction of the rail and that can be switched between a closed state and an open state downstream from the suction position of the rail, wherein the bowl is provided in the vibrating portion. It is preferable that it is fixed by the detachable fastening mechanism.

In addition, the component supply unit includes a plurality of the electronic component supply apparatuses, each of the bowls of the plurality of electronic component supply apparatuses is stacked in a vertical direction, and the vibrating portion of the electronic component supply apparatus is another electronic component. It is preferable to vibrate the bowl with the same drive source as other vibrating parts of the feeder.

Moreover, it is preferable that the said several support mechanism is arrange | positioned in parallel along a horizontal direction.

In addition, it is preferable that the driving portion is supported by a fixing portion extending in the vertical direction, and vibrating the bowl with the fixing portion as a starting point.

MEANS TO SOLVE THE PROBLEM In order to solve the above-mentioned subject and achieve the objective, this invention provides the component supply unit provided with the board | substrate conveyance part which conveys a board | substrate, the at least 1 electronic component supply apparatus which supplies the electronic component which has a lead wire, and An electronic component mounting apparatus having a head body having a nozzle for sucking an electronic component supplied from a component supply unit, a nozzle driver for driving the nozzle, and a head support for supporting the nozzle and the nozzle driver, is mounted on the substrate. An electronic component mounting method includes a step of storing through-hole coordinate design values, reference mark coordinate design values, and electronic component mounting coordinate design values, and obtaining the coordinates of the through-holes formed in the substrate and the coordinates of the reference marks formed on the surface of the substrate. The reference mark correction value is calculated from the coordinate calculation step and the coordinates of the reference mark calculated in the coordinate calculation step. The through-hole correction value calculation process which calculates | requires a through-hole correction value from the deviation | deviation amount between the through-hole position after correcting with the calculated said reference mark correction value, and the coordinate of the through-hole calculated by the said coordinate calculation process, calculated | required. And determining a position to mount the electronic component from the reference mark correction value and the through hole correction value.

The electronic component mounting apparatus and the electronic component mounting method according to the present invention exhibit an effect of mounting an electronic component efficiently and with high accuracy on a substrate having a through hole.

1 is a schematic diagram showing a schematic configuration of an electronic component mounting apparatus.
2 is a perspective view showing a schematic configuration of a housing of an electronic component mounting apparatus.
3A is a front view of the housing shown in FIG. 2.
3B is a top view of the housing shown in FIG. 2.
3C is a right side view of the housing shown in FIG. 2.
3D is a left side view of the housing shown in FIG. 2.
FIG. 3E is a rear view of the housing shown in FIG. 2.
4 is an explanatory diagram showing a schematic configuration of a cover of a housing.
5 is an explanatory view showing a schematic configuration of the locking mechanism of the housing.
6 is a schematic diagram showing a schematic configuration of an electronic component mounting apparatus.
7 is a schematic diagram illustrating a schematic configuration of a front side bank.
8 is a schematic diagram showing a schematic configuration of a rear bank.
9 is a schematic diagram illustrating a schematic configuration of another example of the rear side component supply unit.
10 is a schematic diagram showing a schematic configuration of a head of an electronic component mounting apparatus.
11 is a schematic diagram showing a schematic configuration of a head of an electronic component mounting apparatus.
12 is a schematic diagram illustrating a schematic configuration of an example of an electronic component holding tape.
It is a schematic diagram which shows schematic structure of the other example of an electronic component holding tape.
14 is a perspective view showing a schematic configuration of the electronic component supply apparatus of the rear component supply unit.
FIG. 15 is a perspective view of the electronic component supply device shown in FIG. 14 as viewed from a direction different from FIG. 14.
16 is an explanatory diagram showing a schematic configuration of an electronic component supply apparatus of a component supply unit.
17 is an explanatory diagram showing a schematic configuration of a clamp unit of an electronic component supply apparatus.
18 is an explanatory diagram showing a schematic configuration of a feed unit of an electronic component supply apparatus.
19 is an explanatory diagram showing a schematic configuration of the tip support of the feed unit.
20 is an explanatory diagram showing a schematic configuration of a tape feed claw unit of a feed unit.
21 is an explanatory diagram for explaining the operation of the feed unit.
22 is an explanatory diagram showing a schematic configuration of a cutting unit of the electronic component supply apparatus.
23 is an explanatory diagram showing a schematic configuration of a cutting unit of the electronic component supply apparatus.
24 is an explanatory diagram showing a schematic configuration of a cutting unit of the electronic component supply apparatus.
25 is a perspective view showing a schematic configuration of another example of a cutting unit.
FIG. 26: is a perspective view which shows the schematic structure of the cutting unit shown in FIG. 25 from another direction. FIG.
27 is a perspective view illustrating a relationship between the cutting unit and the housing illustrated in FIG. 25.
28 is a perspective view illustrating a schematic configuration of another example of a cutting unit.
It is explanatory drawing for demonstrating the operation | movement of the cutting unit shown in FIG.
30 is an explanatory diagram for explaining the operation of the cutting unit shown in FIG. 25.
It is explanatory drawing which showed schematic structure of the holding mechanism of a cutting unit.
31B is an explanatory diagram showing a schematic configuration of another example of the holding mechanism of the cutting unit.
32 is an explanatory diagram showing a schematic configuration of another example of a feed unit of an electronic component supply apparatus.
33 is a perspective view showing a schematic configuration of the feed unit shown in FIG. 32 from another direction.
FIG. 34 is a front view illustrating a schematic configuration of the feed unit shown in FIG. 32.
35 is a top view illustrating a schematic configuration of the feed unit shown in FIG. 32.
36 is a front view illustrating a schematic configuration of another state of the feed unit illustrated in FIG. 32.
FIG. 37 is a top view illustrating a schematic configuration of another state of the feed unit illustrated in FIG. 32.
FIG. 38 is an explanatory diagram showing a schematic configuration of the feed unit shown in FIG. 32.
FIG. 39 is an explanatory diagram showing a schematic configuration of another state of the feed unit shown in FIG. 32.
40 is a top view illustrating a schematic configuration of an interlock mechanism of the feed unit shown in FIG. 32.
41 is an explanatory diagram showing a schematic configuration of another example of the housing.
FIG. 42 is an explanatory diagram for explaining the operation of the feed unit shown in FIG. 32.
FIG. 43: is explanatory drawing for demonstrating operation | movement of the feed unit shown in FIG.
44 is an explanatory diagram showing a schematic configuration of another example of a component supply apparatus.
FIG. 45 is an explanatory diagram in which a part of FIG. 44 is enlarged.
46 is an explanatory diagram showing a schematic configuration of another example of a component supply apparatus.
FIG. 47 is an explanatory diagram in which a part of FIG. 46 is enlarged.
48 is an explanatory diagram showing a schematic configuration of another example of a component supply apparatus.
FIG. 49 is an explanatory diagram showing an enlarged portion of FIG. 48.
50 is a perspective view illustrating a schematic configuration of a bowl feeder assembly.
FIG. 51 is a perspective view showing a schematic configuration of the bowl feeder assembly shown in FIG. 50. FIG.
52 is a side view illustrating another example of the component supply unit.
53 is a top view illustrating another example of the component supply unit.
FIG. 54 is a side view illustrating a state in which the bowl is separated from the component supply unit shown in FIG. 52.
FIG. 55 is an explanatory diagram showing a relationship between the bowl of the electronic component supply apparatus of the component supply unit shown in FIG. 53 and the support portion of the vibrator.
FIG. 56 is an explanatory diagram showing the schematic configuration of the bowl shown in FIG. 55; FIG.
FIG. 57A is a perspective view showing a schematic configuration of a support mechanism of the electronic component supply device of the component supply unit shown in FIG. 53.
FIG. 57B is a front view showing the schematic configuration of the support mechanism shown in FIG. 57A. FIG.
58A is a perspective view illustrating another state of the support mechanism illustrated in FIG. 57A.
FIG. 58B is a front view showing the schematic configuration of the support mechanism shown in FIG. 58A. FIG.
FIG. 59 is a top view showing a schematic configuration of a drive device of the component supply unit shown in FIG. 53.
60 is a perspective view showing a schematic configuration of the drive unit shown in FIG. 59.
FIG. 61 is an enlarged top view showing an enlarged schematic structure of the drive device shown in FIG. 59. FIG.
62 is a side view illustrating a schematic configuration of the drive unit shown in FIG. 59.
FIG. 63 is a side sectional view showing a schematic configuration of the drive unit shown in FIG. 59; FIG.
64 is an explanatory diagram for explaining the operation of the driving apparatus shown in FIG. 59.
65 is an enlarged perspective view of a part of the electronic component supply apparatus.
66 is an enlarged perspective view of a part of the electronic component supply apparatus.
67A is an enlarged perspective view of a part of the electronic component supply apparatus.
67B is a perspective view showing a part of the electronic component supply device shown in FIG. 67A from another direction.
It is explanatory drawing for demonstrating the shape recognition operation | movement of the electronic component of the electronic component mounting apparatus.
It is explanatory drawing for demonstrating the shape recognition operation | movement of the electronic component of the electronic component mounting apparatus.
It is explanatory drawing for demonstrating the shape recognition operation | movement of the electronic component of the electronic component mounting apparatus.
71 is an explanatory diagram for explaining the shape recognition operation of the electronic component of the electronic component mounting apparatus.
It is explanatory drawing for demonstrating the shape recognition operation | movement of the electronic component of the electronic component mounting apparatus.
73 is a schematic diagram illustrating an example of a detection result of the recognition operation.
74 is a schematic diagram illustrating an example of a detection result of the recognition operation.
It is explanatory drawing for demonstrating the shape recognition operation | movement of the electronic component of the electronic component mounting apparatus.
76 is a flowchart showing an example of the operation of the electronic component mounting apparatus.
77 is an explanatory diagram showing an example of an operation screen.
78 is an explanatory diagram showing a part of the operation screen.
79A is an explanatory diagram showing an example of a component supply angle.
79B is an explanatory diagram showing an example of a component supply angle.
80 is an explanatory diagram showing an example of an operation screen.
81 is an explanatory diagram showing an example of an operation screen.
82 is an explanatory diagram showing a part of the operation screen.
83A is an explanatory diagram showing an example of a measurement position of an electronic component.
83B is an explanatory diagram showing an example of a measurement position of an electronic component.
83C is an explanatory diagram showing an example of a measurement position of an electronic component.
83D is an explanatory diagram showing an example of a measurement position of an electronic component.
84 is a flowchart showing an example of the operation of the electronic component mounting apparatus.
85 is a flowchart showing an example of the operation of the electronic component mounting apparatus.
86 is a flowchart showing an example of the operation of the electronic component mounting apparatus.
87A is an explanatory diagram showing an example of an electronic component.
87B is explanatory drawing which showed an example of the measurement result of a lead.
88A is an explanatory diagram showing an example of an electronic component.
88B is an explanatory diagram showing an example of the measurement result of the lead.
89 is a flowchart showing an example of the operation of the electronic component mounting apparatus.
90 is an explanatory diagram showing a relationship between a lead and an insertion hole.
91 is a flowchart showing an example of the operation of the electronic component mounting apparatus.
It is explanatory drawing for demonstrating operation | movement of the electronic component mounting apparatus.
93 is a flowchart showing an example of the operation of the electronic component mounting apparatus.
94 is a flowchart showing an example of the operation of the electronic component mounting apparatus.
95 is a flowchart showing an example of the operation of the electronic component mounting apparatus.
96 is a flowchart showing an example of the operation of the electronic component mounting apparatus.
97 is a flowchart showing an example of the operation of the electronic component mounting apparatus.
98A is explanatory drawing for demonstrating operation | movement of the electronic component mounting apparatus.
98B is explanatory drawing for demonstrating operation | movement of the electronic component mounting apparatus.
99 is an explanatory diagram showing an example of a nozzle.
FIG. 100 is an explanatory diagram for explaining the nozzle holding operation in FIG. 99.
101A is an explanatory diagram showing an example of a nozzle.
101B is an explanatory diagram showing an example of a nozzle.
101C is an explanatory diagram showing an example of a nozzle.
It is explanatory drawing which showed an example of a nozzle.
102 is a flowchart showing an example of the operation of the electronic component mounting apparatus.
103 is a flowchart showing an example of the operation of the electronic component mounting apparatus.
It is explanatory drawing for demonstrating operation | movement of the electronic component mounting apparatus.
105 is a flowchart showing an example of the operation of the electronic component mounting apparatus.
106 is a flowchart showing an example of the operation of the electronic component mounting apparatus.
107 is a flowchart showing an example of the operation of the electronic component mounting apparatus.
108 is an explanatory diagram showing an example of a lead type electronic component.
109 is a flowchart which shows an example of the operation | movement of an electronic component mounting apparatus.
It is explanatory drawing which shows the relationship between the moving speed of a nozzle, and time.
111 is a flowchart showing an example of the operation of the electronic component mounting apparatus.
112 is an explanatory diagram showing a relationship between a moving speed of a nozzle and time.
It is explanatory drawing for demonstrating an example of the operation | movement of an electronic component mounting apparatus.
It is explanatory drawing for demonstrating an example of operation | movement of an electronic component mounting apparatus.
115 is a flowchart showing an example of the operation of the electronic component mounting apparatus.
116: is explanatory drawing which showed the relationship between the moving speed of a nozzle, and time.
117 is a flowchart showing an example of the operation of the electronic component mounting apparatus.
118 is a flowchart which shows an example of the operation | movement of an electronic component mounting apparatus.
119: is explanatory drawing which showed an example of an operation screen.
120 is a flowchart showing an example of the operation of the electronic component mounting apparatus.
121 is a flowchart showing an example of the operation of the electronic component mounting apparatus.
122 is an explanatory diagram showing an example of an operation screen.
123A is an explanatory diagram showing an example of an operation screen.
123B is an explanatory diagram showing an example of an operation screen.
124 is a flowchart showing an example of the operation of the electronic component mounting apparatus.
125 is a flowchart showing an example of the operation of the electronic component mounting apparatus.
126A is a side view illustrating a schematic configuration of a conventional backup device.
126B is a side view illustrating a schematic configuration of a conventional backup apparatus.
127A is a view showing clinch processing of lead parts.
127B is a view showing clinch processing of lead parts.
128A is a front view illustrating the configuration of the backup pin.
128B is a side view illustrating the configuration of the backup pin.
129: is a figure explaining the opening / closing mechanism of a backup pin, and a height adjustment mechanism.
130 is a perspective view illustrating a configuration of a backup pin.
131 is a view showing the shape of the lead guide groove.
132 is a diagram showing an example of arrangement of backup pins.
133 shows the positional relationship between the insertion hole of the lead and the inclined surface of the backup pin.
134 shows a clinch method for leads.
FIG. 135 is a view showing an operation during mounting of a lead component in the present embodiment. FIG.
136 shows another example of the lead guide groove.
137 shows another example of the lead guide groove.
138A is a side view showing another example of a part recognition method.
138B is a bottom view showing another example of the component recognition method.
139: is a figure explaining the correction information by component recognition.
140 is a schematic top view of the component supply apparatus according to the present embodiment.
141A is a perspective view of a part according to the present embodiment.
141B is a perspective view of the component according to the present embodiment.
142A is a perspective view of a part of the component supply apparatus according to the present embodiment.
142B is a perspective view of a part of the component supply apparatus according to the present embodiment.
143A is a view showing a state in which parts are distributed by the distribution unit according to the present embodiment.
143B is a view showing a state in which parts are distributed by the distribution unit according to the present embodiment.
144A is a figure which shows the state where a component is guided by the arch-shaped guide part which concerns on this embodiment.
144B is a view showing a state in which parts are guided by the arch guide portion according to the present embodiment.
144C is a view showing a state in which parts are guided by an arch guide part according to the present embodiment.
144D is a view showing a state in which parts are guided by an arch guide part according to the present embodiment.
145A is a view showing a state in which parts are changed in posture by the drop unit according to the present embodiment.
145B is a view showing a state in which parts are changed in posture by the drop unit according to the present embodiment.
145C is a view showing a state in which parts are changed in posture by the drop unit according to the present embodiment.
146A is a diagram showing an example of ONCE measurement for the large-scale component according to the present embodiment.
146B is a diagram showing an example of ONCE measurement for the large-scale component according to the present embodiment.
FIG. 146C is a figure which shows an example of ONCE measurement with respect to the large component which concerns on this embodiment.
147A is a diagram showing an example of ONCE measurement for the small component according to the present embodiment.
147B is a diagram showing an example of ONCE measurement for the small component according to the present embodiment.
148 is a flowchart of the direction determining process according to the present embodiment.
FIG. 149A is a diagram showing an example of ONCE measurement for the leadless component according to the present embodiment.
149B is a diagram illustrating an example of ONCE measurement for the leadless component according to the present embodiment.
149C is a diagram illustrating an example of ONCE measurement for the leadless component according to the present embodiment.
150 is a schematic diagram illustrating a schematic configuration of an electronic component mounting apparatus.
151 is a perspective view showing a schematic configuration of an electronic component mounting apparatus.
152: is a schematic diagram which shows schematic structure of the head of the electronic component mounting apparatus.
153 is a perspective view showing a schematic configuration of a head of an electronic component mounting apparatus.
154A is a sectional view showing a schematic configuration of an imaging device of an electronic component mounting apparatus.
154B is a perspective view showing a schematic configuration of a photographing apparatus of an electronic component mounting apparatus.
155: is explanatory drawing which showed an example of the design drawing of the board | substrate to which an electronic component is mounted.
156 is a flowchart showing an example of the operation of the electronic component mounting apparatus.
It is explanatory drawing for demonstrating operation | movement of the electronic component mounting apparatus.
158 is a flowchart showing an example of the operation of the electronic component mounting apparatus.
It is explanatory drawing which showed an example of the measuring position of an electronic component and height.
159B is an explanatory diagram showing an example of a measurement position of an electronic component and a height.
It is explanatory drawing for demonstrating operation | movement of the electronic component mounting apparatus.
161 is a flowchart showing an example of the operation of the electronic component mounting apparatus.
162: is a schematic diagram which shows schematic structure of the electronic component mounting system.
163 is a flowchart which shows an example of the operation | movement of an electronic component mounting system.

Hereinafter, the present invention will be described in detail with reference to the drawings. For reference, the present invention is not limited by the form for carrying out the following invention (hereinafter, referred to as 'embodiment'). In addition, the component in the following embodiment includes the thing of what a person skilled in the art can easily assume, substantially the same thing, what is called a range. In addition, the component disclosed in the following embodiment can be combined suitably.

An embodiment of an electronic component mounting apparatus and an electronic component mounting method according to the present invention will be described in detail with reference to the drawings. For reference, the present invention is not limited by these embodiments. 1 is a schematic diagram showing a schematic configuration of an electronic component mounting apparatus.

The electronic component mounting apparatus 10 shown in FIG. 1 is an apparatus which mounts an electronic component on the board | substrate 8. As shown in FIG. The electronic component mounting apparatus 10 includes a housing 11, a substrate transfer unit 12, component supply units 14f and 14r, a head 15, an XY moving mechanism 16, and a VCS unit ( 17, an exchange nozzle holding mechanism 18, a component storage portion 19, a control device 20, an operation portion 40, and a display portion 42. For reference, the XY moving mechanism 16 includes an X axis driver 22 and a Y axis driver 24. Here, the electronic component mounting apparatus 10 of this embodiment is equipped with the component supply unit 14f, 14r in the front side and the back side centering on the board | substrate conveyance part 12 as shown in FIG. In the electronic component mounting apparatus 10, a component supply unit 14f is disposed on the front side of the electronic component mounting apparatus 10, and a component supply unit 14r is disposed on the rear side of the electronic component mounting apparatus 10. . In the following description, the two component supply units 14f and 14r are referred to as the component supply unit 14 unless otherwise specified.

2 is a perspective view showing a schematic configuration of a housing of an electronic component mounting apparatus. 3A is a front view of the housing shown in FIG. 2. 3B is a top view of the housing shown in FIG. 2. 3C is a right side view of the housing shown in FIG. 2. 3D is a left side view of the housing shown in FIG. 2. 3E is a rear view of the housing shown in FIG. 2. 4 is an explanatory diagram showing a schematic configuration of a cover of a housing. 5 is an explanatory view showing a schematic configuration of the locking mechanism of the housing. For reference, in FIGS. 3A to 3E, the parts supply units 14f and 14r are omitted in order to clearly show the housing 11.

The housing 11 has a main body 11a and covers 11bf and 11br, as shown in Figs. 3A to 3E. The main body 11a is a box which accommodates each part which comprises the electronic component mounting apparatus 10. As shown in FIG. As for the main body 11a, the cover 11bf, the operation part 40, the display part 42, the front side bank 44, and the connector 48 are arrange | positioned at the front side, and the cover 11br and the back at the rear side. The side bank 46 and the connector 49 are formed. The main body 11a has two openings 11c which carry in and discharge the board | substrate 8 in an apparatus, respectively, on two side surfaces. The operation part 40 of this embodiment has the keyboard 40a and the mouse 40b. The display part 42 of this embodiment has the touch panel 42a and the vision monitor 42b. For reference, the touch panel 42a may be a part of the operation unit 40. The front bank 44 and the rear bank 46 are members that support the component supply units 14f and 14r, respectively. The detailed structure of the front bank 44 and the back bank 46 is mentioned later. The connector 48 is connected to the wiring of each part of the component supply unit 14f mentioned later. In addition, the connector 49 is connected with the wiring of each part of the component supply unit 14r mentioned later. Here, as the wiring, there are a wiring for transmitting an electric signal and a tube for supplying air.

Next, covers 11bf and 11br will be described. For reference, the covers 11bf and 11br have only the arrangement positions different in the front side and the rear side, and the configuration is the same. In the following description, the cover 11b will be described unless otherwise specified. The cover 11bf is a fence provided in a part of the front side of the main body 11a, and is arrange | positioned above a vertical direction. The cover 11br is a fence provided in the rear part of the main body 11a, and is arrange | positioned at the vertical direction upper side. The cover 11b is a shape which covers a part of the front surface or the back surface of the main body 11a, and a part of an upper surface, and has an L-shaped cross section. The cover 11b can be opened and closed with respect to the main body 11a as shown in FIG. By opening the cover 11b, it is possible to perform work on each part disposed inside the main body 11a. The tip of the upper surface is connected to the main body 11a, and the cover 11b is rotated by making the connection part a support point. In addition, the cover 11b is supported by the cover support part 11d. The cover support part 11d is a rod-shaped member which expands and contracts, and one end part is connected to the main body 11a, and the other end part is connected to the cover 11b. 11 d of cover support parts expand and contract according to opening and closing of the cover 11b. Moreover, the locking mechanism 11e which locks the expansion-contraction of 11 d of cover support parts is provided in 11 d of cover support parts. The locking mechanism 11e makes the cover support 11d non-expandable by being in the locked state, and makes the cover support 11d extensible by being in the open state. The cover 11b is fixed to the position of a present state, when the locking mechanism 11e will be in the locked state. Thereby, it can suppress that the cover 11b of the open state is closed by self weight.

Referring back to FIG. 1, the description of the electronic component mounting apparatus 10 will continue. The board | substrate 8 should just be a member which mounts an electronic component, The structure is not specifically limited. The board | substrate 8 of this embodiment is a plate-shaped member, and the wiring pattern is provided in the surface. On the surface of the wiring pattern provided in the board | substrate 8, the solder which is a joining member which joins the wiring pattern of an plate-shaped member and an electronic component by reflow is affixed. In the substrate 8, through holes (insertion holes, substrate holes) into which electronic components are inserted are also formed.

The board | substrate conveyance part 12 is a conveyance mechanism which conveys the board | substrate 8 to the X-axis direction in a figure. The board | substrate conveyance part 12 has the rail extended in an X-axis direction, and the conveyance mechanism which supports the board | substrate 8 and moves the board | substrate 8 along a rail. The board | substrate conveyance part 12 is a direction which the mounting target surface of the board | substrate 8 faces the head 15, and moves the board | substrate 8 to an X-axis direction by moving the board | substrate 8 along a rail by a conveyance mechanism. Return. The board | substrate conveyance part 12 conveys the board | substrate 8 supplied from the apparatus supplied to the electronic component mounting apparatus 10 to the predetermined position on a rail. The head 15 mounts the electronic component on the surface of the substrate 8 at the predetermined position. The board | substrate conveyance part 12 conveys the board | substrate 8 to the apparatus which will perform a next process, when an electronic component is mounted on the board | substrate 8 conveyed to the said predetermined position. For reference, as the conveyance mechanism of the board | substrate conveyance part 12, various structures can be used. For example, the conveyance mechanism which combines the rail arrange | positioned along the conveyance direction of the board | substrate 8, and the endless belt which rotates along the said rail, and conveys the board | substrate 8 mounted in the said endless belt is carried out. An integrated belt system conveyance mechanism can be used.

6 is a schematic diagram showing a schematic configuration of an electronic component mounting apparatus. 7 is a schematic diagram illustrating a schematic configuration of a front side bank. 8 is a schematic diagram showing a schematic configuration of a rear bank. In the electronic component mounting apparatus 10, as shown in FIG. 6, the component supply unit 14f is arrange | positioned at the front side, and the component supply unit 14r is arrange | positioned at the rear side. The front side component supply unit 14f and the rear side component supply unit 14r each hold a large number of electronic components to be mounted on the substrate 8, and as shown in FIG. 6, can be supplied to the head 15. That is, the electronic component supply apparatus which supplies to a holding position in the state which can be hold | maintained (adsorbed or gripped) by the head 15 is provided. The component supply units 14f and 14r of the present embodiment both supply a lead type electronic component having a main body and a lead connected to the main body.

The front part supply unit 14f has two bowl feeder assemblies 90. The bowl feeder assembly 90 is provided with a plurality of component supply apparatuses, which are bowl feeders, and supplies electronic components from the respective component supply apparatuses to the holding positions (adsorption positions and gripping positions). The electronic parts supplied by the respective component supply apparatuses to the holding positions are mounted on the substrate 8 by the head 15. The bowl feeder assembly 90 will be described later.

Two bowl feeder assemblies 90 of the component supply unit 14f are provided in the front bank 44. As shown in FIG. 7, the front bank 44 has the support plate 44a. The support plate 44a is fixed to a predetermined position inside the main body 11a with a bolt or the like. The support plate 44a supports the two bowl feeder assemblies 90. The setting shaft 44b is arrange | positioned at the edge part by the side of the board | substrate conveyance part 12 of the support plate 44a. The setting shaft 44b supports the bowl feeder assembly 90 and positions the bowl feeder assembly 90. In addition, the support plate 44a is formed with two recesses 44c at the end portion on the side opposite to the substrate transfer part 12 side. A portion of the bowl feeder assembly 90 is also inserted into the recess 44c to position the bowl feeder assembly 90, respectively.

The component supply unit 14r on the rear side has a plurality of electronic component supply apparatuses (hereinafter, simply referred to as "component supply apparatuses") 100. The electronic component supply apparatus 100 is a radial feeder and supplies an electronic component to a holding position (suction position, gripping position). The electronic components supplied by the component supply apparatuses 100 to the holding positions are mounted on the substrate 8 by the head 15.

The component supply apparatus 100 supplies a radial lead type electronic component to the head 15 using the electronic component holding tape comprised by sticking the lead of several radial lead type electronic components to a tape. The component supply device 100 holds an electronic component holding tape and transfers the holding electronic component holding tape to hold the radial lead type electronic component being held by the nozzle of the head 15 to hold the electronic component. A tape feeder that moves to an area (suction position, gripping position, holding position). The component supply apparatus 100 can cut the lead of the radial lead type electronic component moved to the holding area and separate it, so that the radial lead type electronic component having the lead fixed by the tape can be held in a predetermined position. The radial lead electronic component can be held (adsorbed and held) by the nozzle of the head 15. The component supply apparatus 100 will be described later. For reference, the plurality of component supply apparatuses 100 may supply different kinds of electronic components, or may supply separate electronic components.

The plurality of electronic component supply apparatuses 100 are provided in the rear bank 46. The rear bank 46 is a mechanism for supporting the plurality of electronic component supply apparatuses 100, and as shown in FIG. 8, the first fixing plate 46a, the second fixing plate 46b, and the locking shaft. 46c, the drive cylinder 46d, and the position label 46e. The first fixing plate 46a is a plate-like member extending in the ZX plane, and a hole is formed in the X direction. The hole is a hole into which protrusions formed in the electronic component supply apparatus 100 can be inserted. The first fixing plate 46a positions the electronic component supply apparatus 100 by inserting the projection formed in the electronic component supply apparatus 100 into the hole. The second fixing plate 46b is a plate-shaped member disposed on a surface below the vertical direction, that is, on a surface supporting the electronic component supply device 100. As for the 2nd fixing plate 46b, the unevenness | corrugation is formed in the cross section of the side away from the board | substrate conveyance part 12. As shown in FIG. The 2nd fixing plate 46b positions the electronic component supply apparatus 100 by inserting the protrusion formed in the electronic component supply apparatus 100 in the unevenness | corrugation. The locking shaft 46c is disposed on the side farther from the substrate transfer part 12 than the second fixing plate 46b. The locking shaft 46c supports and positions the electronic component supply apparatus 100 by being fitted by the clamp unit 112 of the electronic component supply apparatus 100. The drive cylinder 46d is a piston capable of protruding upward in the vertical direction, and conveys the electronic component to the holding position of the electronic component supply apparatus 100 by pressing a predetermined position of the electronic component supply apparatus 100 provided at a corresponding position. do. The position label 46e is a guide display for visually recognizing the position of the bank in the rear bank 46. The operator can install the electronic component supply apparatus 100 in a desired position by confirming the position label 46e and installing the electronic component supply apparatus 100 in a predetermined position.

9 is a schematic diagram illustrating a schematic configuration of another example of the rear side component supply unit. The component supply unit 14 mounts an electronic component holding tape (radial component tape) in which a plurality of radial lead type electronic components (radial components) are fixed to a tape body, and is held by the electronic component holding tape. Equipped with a plurality of electronic component supply devices 100 for cutting the lead of the component at the holding position (second holding position) so that the lead type electronic component at the holding position can be held by a suction nozzle or a holding nozzle provided on the head. In addition, a holding position (first holding position) of the mounted electronic component held by the electronic component holding tape is mounted by mounting an electronic component holding tape (chip component tape) in which a plurality of mounted electronic components are fixed to the tape body. Peel off the tape body from the tape body so that the mounted electronic component at the holding position can be held by a suction nozzle or a grip nozzle provided on the head. You may be provided with the electronic component supply apparatus 100a. The component supply unit 14 may provide a stick feeder or a tray feeder to the rear bank 46 as the other electronic component supply apparatus 100a. A plurality of parts supply apparatuses 100 and 100a shown in FIG. 9 are held by a support table (bank) 102. The support base 102 is the same structure as the rear bank 46 mentioned above. In addition to the component supply apparatuses 100 and 100a, the support base 102 can mount a measuring apparatus and a camera.

The component supply unit 14 includes a plurality of components of which the plurality of component supply apparatuses 100 and 100a held on the support table 102 differ in the type of electronic component to be mounted, the mechanism for holding the electronic component, or the supply mechanism. It consists of supply apparatuses 100 and 100a. In addition, the component supply unit 14 may be provided with plural component supply apparatuses 100 and 100a of the same type. In addition, the component supply unit 14 is preferably configured to be detachable to the apparatus main body.

The electronic component supply apparatus 100a supplies an electronic component to the head 15 using the electronic component holding tape comprised by sticking the chip-shaped electronic component to board | substrate to a tape. For reference, in the electronic component holding tape, a plurality of storage chambers are formed in the tape, and the electronic components are stored in the storage chamber. The electronic component supply apparatus 100a holds the electronic component holding tape and transfers the holding electronic component holding tape to move the containment chamber to a holding region where the electronic component can be sucked by the nozzle of the head 15. Tape feeder. For reference, by moving the storage compartment to the holding area, the electronic component housed in the compartment can be exposed to a predetermined position, and the electronic component can be sucked and held by the nozzle of the head 15. have. The electronic component supply apparatus 100a is not limited to a tape feeder, and various chip component feeders for supplying chip electronic components can be employed. As the chip component feeder, for example, a stick feeder, a tape feeder, and a bulk feeder can be used.

The head 15 is an electronic component (lead-type electronic component held in the bowl feeder unit) held in the component supply unit 14f, or an electronic component held in the component supply unit 14r (electronic component supply apparatus 100). A substrate (removed or held) by a nozzle, and the retained electronic component moved to a predetermined position by the substrate transfer section 12 8) It is a mechanism to be mounted on it. In addition, when the component supply unit 14r includes the electronic component supply apparatus 100a, the head 15 includes a substrate (chip mounted electronic component) held by the electronic component supply apparatus 100a. 8) It is a mechanism to mount (mount) on. The structure of the head 15 is mentioned later. For reference, a chip electronic component (mounted electronic component) is a leadless electronic component which does not include a lead inserted into an insertion hole (through hole) formed in a substrate. As the mounted electronic component, SOP, QFP and the like can be exemplified as described above. A chip type electronic component is mounted on a board | substrate without inserting a lead into an insertion hole.

The XY moving mechanism 16 is a moving mechanism for moving the head 15 on the X axis direction and the Y axis direction in FIGS. 1 and 2, that is, on a surface parallel to the surface of the substrate 8, and the X axis driving unit ( 22) and a Y-axis drive unit 24. The X-axis drive unit 22 is connected to the head 15 to move the head 15 in the X-axis direction. The Y-axis drive unit 24 is connected to the head 15 via the X-axis drive unit 22, and moves the head 15 in the Y-axis direction by moving the X-axis drive unit 22 in the Y-axis direction. . The XY movement mechanism 16 moves the head 15 to the position which faces the board | substrate 8, or the position which faces the component supply units 14f and 14r by moving the head 15 to XY-axis direction. You can. In addition, the XY moving mechanism 16 adjusts the relative position between the head 15 and the substrate 8 by moving the head 15. Thereby, the electronic component hold | maintained by the head 15 can be moved to arbitrary positions on the surface of the board | substrate 8, and it becomes possible to mount an electronic component in arbitrary positions on the surface of the board | substrate 8. That is, the XY moving mechanism 16 moves the head 15 on the horizontal plane (XY plane), and moves the electronic component in the electronic component supply apparatuses of the component supply units 14f and 14r to a predetermined position ( It is a conveying means for conveying to a mounting position, a mounting position). For reference, as the X-axis drive unit 22, various mechanisms for moving the head 15 in a predetermined direction can be used. As the Y-axis drive unit 24, various mechanisms for moving the X-axis drive unit 22 in a predetermined direction can be used. As a mechanism for moving an object in a predetermined direction, for example, a linear motor, a rack and pinion, a conveying mechanism using a ball screw, a conveying mechanism using a belt, or the like can be used.

The VCS unit 17, the replacement nozzle holding mechanism 18, and the component reservoir 19 are positions overlapping with the movable region of the head 15 in the XY plane, and the position in the Z direction is different. It is arrange | positioned in the position which becomes vertically lower side than the head 15. As shown in FIG. In this embodiment, the VCS unit 17, the replacement nozzle holding mechanism 18, and the component storage unit 19 are disposed adjacent to each other between the substrate transfer unit 12 and the component supply unit 14r. do.

The VCS unit (part state detection unit, state detection unit) 17 is, as an image recognition device, a camera for photographing the vicinity of the nozzle of the head 15, and an illumination unit for illuminating the photographing area. The VCS unit 17 recognizes the shape of the electronic component adsorbed by the nozzle of the head 15 and the holding state of the electronic component by the nozzle. More specifically, when the head 15 is moved to a position facing the VCS unit 17, the nozzle of the head 15 is taken by the nozzle by analyzing the captured image by photographing the nozzle of the head 15 from the vertical lower side. The shape of the electronic component and the holding state of the electronic component by the nozzle are recognized. The VCS unit 17 sends the acquired information to the control device 20.

The exchange nozzle holding mechanism 18 is a mechanism for holding a plurality of types of nozzles. The exchange nozzle holding mechanism 18 holds a plurality of types of nozzles in a state in which the head 15 is detachable and replaceable. Here, the exchange nozzle holding mechanism 18 of this embodiment holds the suction nozzle which hold | maintains by sucking an electronic component, and the holding nozzle which hold | maintains by holding an electronic component. The head 15 can hold the electronic component to be maintained under an appropriate condition (suction or gripping) by changing the nozzle to be mounted by the exchange nozzle holding mechanism 18 and supplying and driving air pressure to the mounted nozzle. .

The component storage unit 19 is a box in which the head 15 is held by the nozzle but stores electronic components that are not mounted on the substrate 8. That is, in the electronic component mounting apparatus 10, it becomes a waste box which discards the electronic component which is not mounted in the board | substrate 8. The electronic component mounting apparatus 10 moves the head 15 to a position facing the component storage portion 19 when there are electronic components that are not mounted on the substrate 8 among the electronic components held by the head 15. The electronic component is put into the component storage part 19 by releasing the holding electronic component.

The control apparatus 20 controls each part of the electronic component mounting apparatus 10. The control apparatus 20 is an aggregate of various control parts. The operation unit 40 is an input device through which an operator inputs an operation, and has a keyboard 40a, a mouse 40b, and a touch panel 42a. The operation unit 40 sends the detected various inputs to the control device 20. The display part 42 is a screen which displays various information to an operator, and has the touch panel 42a and the vision monitor 42b. The display unit 42 causes the touch panel 42a and the vision monitor 42b to display various images on the basis of the image signal input from the control device 20.

For reference, in the electronic component mounting apparatus 10 of this embodiment, although one head was used, two heads may be provided corresponding to each of the component supply units 14f and 14r. In this case, two heads can be moved independently by providing two X-axis driving parts and moving the two heads in the XY direction, respectively. The electronic component mounting apparatus 10 can mount an electronic component alternately with respect to one board | substrate 8 by providing two heads. In this way, by mounting the electronic components alternately by the two heads, the other head can hold the electronic components in the component supply device while one head is mounting the electronic components on the substrate 8. . Thereby, the time which an electronic component is not mounted in the board | substrate 8 can be shortened more, and an electronic component can be mounted efficiently. Moreover, it is also preferable that the electronic component mounting apparatus 10 arrange | positions two board | substrate conveyance parts 12 in parallel. When the electronic component mounting apparatus 10 alternately moves two board | substrates to the electronic component mounting position by the two board | substrate conveyance parts 12, and mounts components alternately by the said two heads 15, The electronic component can be efficiently mounted on the board.

Next, with reference to FIG. 10 and FIG. 11, the structure of the head 15 is demonstrated. 10 is a schematic diagram showing a schematic configuration of a head of an electronic component mounting apparatus. 11 is a schematic diagram showing a schematic configuration of a head of an electronic component mounting apparatus. For reference, FIG. 10 also shows the component supply apparatus 100 which is one of the various control parts which control the electronic component mounting apparatus 10, and the component supply unit 14r. As shown in Figs. 10 and 11, the head 15 includes a head main body 30, an imaging device (substrate state detection unit) 36, a height sensor (substrate state detection unit) 37, and a laser recognition device (part state). Detector (38).

The electronic component mounting apparatus 10 has the control part 60, the head control part 62, and the component supply control part 64, as shown in FIG. The control unit 60, the head control unit 62, and the component supply control unit 64 are part of the control unit 20 described above. In addition, the electronic component mounting apparatus 10 is connected to a power supply, and supplies electric power supplied from the power supply to each part using the control part 60, the head control part 62, the component supply control part 64, and various circuits. . The control part 60, the head control part 62, and the component supply control part 64 are mentioned later.

As for the electronic component supply apparatus 100, the main body of the electronic component 80 in which the lead was hold | maintained on the electronic component holding tape (radial component tape) is exposed upward. For reference, as the electronic component 80, an aluminum electrolytic capacitor is illustrated. In addition to the aluminum electrolytic capacitor, various electronic components having leads can be used as the electronic component 80. The electronic component supply apparatus 100 draws out and moves an electronic component holding tape, and moves the electronic component 80 hold | maintained on the electronic component holding tape to a holding | maintenance area | region (adsorption | suction area | region and holding area). In this embodiment, the vicinity of the front end of the component mounting apparatus 100 in the Y-axis direction becomes a holding | maintenance area which the nozzle of the head 15 holds the electronic component 80 hold | maintained by the electronic component holding tape. The structure of the electronic component supply apparatus 100 is mentioned later. Similarly, in the case of the electronic component supply apparatus 100a, the predetermined position is a holding area for holding the electronic component 80 held by the nozzle of the head 15 on the electronic component holding tape.

The head main body 30 has a head supporting body 31 for supporting the respective parts, a plurality of nozzles 32, and a nozzle driving part 34. Six nozzles 32 are arranged in a line in the head main body 30 of this embodiment, as shown in FIG. Six nozzles 32 are arranged in the direction parallel to an X-axis. For reference, in the nozzle 32 shown in FIG. 11, all the adsorption nozzles which adsorb | suck and hold an electronic component are arrange | positioned.

The head support 31 is a support member connected to the X-axis drive unit 22 and supports the nozzle 32 and the nozzle drive unit 34. For reference, the head support 31 also supports the laser recognition device 38.

The nozzle 32 is an adsorption mechanism for attracting and holding the electronic component 80. The nozzle 32 has an opening 33 at the tip, and sucks air from the opening 33, thereby adsorbing and holding the electronic component 80 at the tip. In addition, the nozzle 32 has a shaft 32a in which an opening 33 is formed and connected to a distal end portion that sucks the electronic component 80. The shaft 32a is a rod-shaped member that supports the tip portion and is disposed extending in the Z-axis direction. As for the shaft 32a, the air pipe which connects the suction mechanism of the opening 33 and the nozzle drive part 34 is arrange | positioned inside.

The nozzle driver 34 moves the nozzle 32 in the Z-axis direction to suck the electronic component 80 through the opening 33 of the nozzle 32. Here, the Z axis is an axis orthogonal to the XY plane. For reference, the Z axis is a direction orthogonal to the surface of the substrate. In addition, the nozzle drive part 34 rotates the nozzle 32 to (theta) direction at the time of mounting an electronic component. (theta) direction is the direction parallel to the circumferential direction of the circle centering on the Z-axis which is an axis parallel to the direction to which the Z-axis drive part moves the nozzle 32. FIG. For reference, the θ direction is the rotation direction of the nozzle 32.

The nozzle drive part 34 is a mechanism which moves the nozzle 32 to a Z-axis direction, for example, the mechanism which has a linear motor whose Z-axis direction becomes a drive direction. The nozzle drive part 34 moves the opening 33 of the tip part of the nozzle 32 to a Z-axis direction by moving the shaft 32a of the nozzle 32 to a Z-axis direction by a linear motion motor. Moreover, the nozzle drive part 34 is a mechanism which rotates the nozzle 32 to (theta) direction, For example, the mechanism comprised by the motor and the transmission element connected to the shaft 32a is mentioned. The nozzle driver 34 transmits the driving force output from the motor to the shaft 32a by the transmission element, and rotates the shaft 32a in the θ direction, thereby rotating the tip end of the nozzle 32 in the θ direction.

The nozzle drive unit 34 is a mechanism for adsorbing the electronic component 80 to the opening 33 of the nozzle 32, that is, a suction mechanism, for example, an air pipe connected to the opening 33 of the nozzle 32, and the air pipe. The mechanism which has a pump connected with the solenoid valve, and the solenoid valve which switches the pipe opening and closing of an air pipe is mentioned. The nozzle drive unit 34 sucks air from the air pipe by a pump, and switches the air suction from the opening 33 by switching the opening and closing of the solenoid valve. The nozzle driving unit 34 sucks (holds) the electronic component 80 into the opening 33 by opening the solenoid valve and sucking air from the opening 33, and closes the solenoid valve to suck air from the opening 33. In this case, the electronic component 80 adsorbed to the opening 33 is released, that is, the electronic component 80 is not adsorbed to the opening 33 (the state is not maintained).

In addition, the head 15 of this embodiment uses the holding nozzle mentioned later, when the main body upper surface is a shape which cannot adsorb | suck by the nozzle (suction nozzle) 33, when holding the main body of an electronic component. The gripping nozzle can grasp and release the main body of the electronic component from above by opening and closing the movable piece with respect to the fixed piece by sucking and releasing air as in the adsorption nozzle. In addition, the head 15 can replace the nozzle which the nozzle drive part 34 drives by moving the nozzle 32 to the nozzle drive part 34, and performing an exchange operation.

The imaging device 36 is fixed to the head support 31 of the head main body 30, and has a region facing the head 15, for example, a substrate 8 on which the substrate 8 or the electronic component 80 is mounted. Take a picture. The photographing apparatus 36 has a camera and an illuminating device, and acquires an image with a camera, illuminating a visual field with an illuminating device. Thereby, the image of the position facing the head main body 30, for example, the various images of the board | substrate 8 and the component supply unit 14 can be picked up. For example, the imaging device 36 captures an image of a BOC mark (hereinafter simply referred to as "BOC") or a through hole (insertion hole) as a reference mark formed on the surface of the substrate 8. Here, when a reference mark other than the BOC mark is used, an image of the reference mark is taken.

The height sensor 37 is fixed to the head support body 31 of the head main body 30, and the board | substrate 8 in which the area | region which faces the head 15, for example, the board | substrate 8 and the electronic component 80 is mounted Measure the distance to). The height sensor 37 includes a light emitting element for irradiating laser light and a light receiving element for receiving laser light reflected and returned from a facing position, and a portion facing in time until light is emitted from the laser light; A laser sensor that measures the distance can be used. In addition, the height sensor 37 detects the height of the facing part, specifically, the electronic component, by processing the distance between the facing part using its own position at the time of measurement and the position of the substrate. For reference, the process of detecting the height of the electronic component based on the measurement result of the distance with the electronic component may be performed by the control unit 60.

The laser recognition device 38 has a light source 38a and a light receiving element 38b. The laser recognition device 38 is built in the bracket 50. As shown in FIG. 10, the bracket 50 is connected to the lower side of the head support body 31, the board | substrate 8, and the component supply apparatus 100 side. The laser recognition apparatus 38 is an apparatus which detects the state of the electronic component 80 by irradiating a laser beam with respect to the electronic component 80 adsorbed by the nozzle 32 of the head main body 30. Here, the state of the electronic component 80 means the shape of the electronic component 80 or whether the electronic component 80 is attracted to the correct position by the nozzle 32. The light source 38a is a light emitting element that outputs laser light. The light receiving element 38b is a position in the Z-axis direction, that is, a position at the same height, and is disposed at a position opposite to the light source 38a. The shape recognition processing by the laser recognition device 38 will be described later.

Next, the control function of the apparatus structure of the electronic component mounting apparatus 10 is demonstrated. As shown in FIG. 10, the electronic component mounting apparatus 10 includes a control unit 60, a head control unit 62, and a component supply control unit 64. Each control part is comprised by the member provided with arithmetic processing functions, such as CPU, ROM, RAM, and a storage function, respectively. In addition, in this embodiment, although it was set as the some control part for the convenience of description, you may make it one control part. In addition, when making the control function of the electronic component mounting apparatus 10 into one control part, you may implement | achieve by one computing device or you may implement | achieve with a some computing device.

The control part 60 is connected with each part of the electronic component mounting apparatus 10, and runs the stored program based on the input operation signal and the information detected by each part of the electronic component mounting apparatus 10, Control the operation of each part. The control part 60 controls the conveyance operation | movement of the board | substrate 8, the drive operation of the head 15 by the XY moving mechanism 16, the shape detection operation by the laser recognition apparatus 38, etc., for example. Moreover, the control part 60 sends various instructions to the head control part 62 as mentioned above, and also controls the control operation by the head control part 62. FIG. The control part 60 also controls the control operation by the head control part 62 and the component supply control part 64.

The head control part 62 is connected to the nozzle drive part 34, the various sensors arrange | positioned at the head support body 31, and the control part 60, controls the nozzle drive part 34, and controls the operation | movement of the nozzle 32. FIG. do. The head control part 62 is based on the operation instruction supplied from the control part 60 and the detection result of various sensors (for example, a distance sensor), and the electronic component adsorption (holding) / release operation | movement of the nozzle 32, and each nozzle 32 Control rotational movement and Z-axis movement.

The component supply control unit 64 controls the supply operation of the electronic component 80 by the component supply units 14f and 14r. The component supply control part 64 may be provided for every component supply apparatus 100 and the bowl feeder unit 400, and may control all the component supply apparatus 100 and the bowl feeder unit 400 with one. For example, the component supply control unit 64 controls the withdrawal operation of the electronic component holding tape, the cutting operation of the lead and the holding operation of the radial lead type electronic component by the component supply apparatus 100. In addition, the component supply control unit 64 controls the component supply operation by the bowl feeder unit 400. In addition, the component supply control unit 64 controls the drawing operation of the electronic component holding tape by the component supply apparatus 100a when the component supply unit 14f includes the component supply apparatus 100a. The component supply control unit 64 executes various operations based on the instructions given by the control unit 60. The component supply control unit 64 controls the movement of the electronic component holding tape or the electronic component holding tape by controlling the drawing operation of the electronic component holding tape or the electronic component holding tape.

Next, the component supply apparatus 100 will be described with reference to FIGS. 12 to 24. The component supply apparatus 100 is a radial feeder which supplies a radial lead type electronic component to a holding position as mentioned above. First, with reference to FIG. 12 and FIG. 13, an electronic component holding tape is demonstrated. 12 is a schematic diagram illustrating a schematic configuration of an example of an electronic component holding tape. 13 is a schematic view showing another schematic configuration example of the electronic component holding tape.

The electronic component holding tape (radial component tape) 70 shown in FIG. 12 includes a tape body 72 and a plurality of electronic components (radial lead type electronic components, radial lead components) held by the tape body 72. ) As for the tape main body 72, the 1st tape 74 and the 2nd tape 76 narrower than the 1st tape 74 are joined. The tape main body 72 is provided with a hole 78 as a feed hole at regular intervals in the extending direction. That is, the tape main body 72 is provided with the several hole 78 lined up in the extending direction.

The electronic component 80 has an electronic component main body (hereinafter simply referred to as a “body”) 82 and two leads 84 arranged in the radial direction of the main body 82. In the electronic component 80, the lead 84 is sandwiched between the first tape 74 and the second tape 76 and fixed. Thereby, the electronic component 80 is fixed to the predetermined position of the tape main body 72 by clamping the lead 84 between the 1st tape 74 and the 2nd tape 76. Further, the plurality of electronic components 80 are fixed at positions where the holes 78 are disposed between the two leads 84 and the holes 78 of the tape main body 72 are formed. That is, the electronic component 80 is arrange | positioned in the position where the pitch in the conveyance pitch P is the same as the hole 78, and the position in the extending direction of a tape is the same. For reference, the electronic component 80 may be a shape having a lead wire sandwiched between the first tape 74 and the second tape 76 of the tape body 72, and the shape and type of the lead wire and the main body are particularly limited. It doesn't work.

Next, the electronic component holding tape 70a shown in FIG. 13 has a tape body 72 and a plurality of electronic components (radial lead type electronic components) 80 held by the tape body 72. For reference, the electronic part holding tape 70a only differs in the relative positional relationship between the electronic part 80 and the hole 78, and the other structure is the same as that of the electronic part holding tape 70. As shown in FIG. In the electronic component holding tape 70a, two leads 84 of the electronic component 80 are disposed between the holes 78 and the holes 78 of the tape main body 72. That is, the electronic component 80 is arrange | positioned in the position where the pitch in the conveyance pitch P is the same as the hole 78, and the position in the extending direction of a tape shifted by half of an arrangement | positioning interval. That is, the electronic component 80 is arrange | positioned in the position shifted | deviated by half pitch with respect to the hole 78. As shown in FIG.

As shown in FIGS. 12 and 13, the electronic component holding tape may have a relative positional relationship between the hole 78 and the electronic component 80 in the tape extending direction.

Next, FIG. 14 is a perspective view showing the schematic configuration of the electronic component supply apparatus of the rear component supply unit. FIG. 15 is a perspective view of the electronic component supply device shown in FIG. 14 as viewed from a direction different from that of FIG. 14. 16 is an explanatory diagram showing a schematic configuration of an electronic component supply apparatus of a component supply unit. As shown in Figs. 14 to 16, the electronic component supply device 100 holds a housing 110 for guiding the electronic component holding tape, and a clamp unit connected to the rear bank 46 to hold the other parts. 112, the feed unit 114 which conveys an electronic component holding tape, the cutting unit 116 which cuts the lead of the electronic component hold | maintained by the electronic component holding tape, the drive part of a feed unit 114, and a cutting unit. The air pressure adjusting part 118 which adjusts the air pressure of the drive part of 116, and controls the drive of each part is provided.

The housing 110 is a vertically long hollow box, and holds the clamp unit 112, the feed unit 114, the cutting unit 116, and the air pressure adjusting unit 118 therein. The housing 110 is provided with a guide groove 120, a guide portion 122, a discharge portion 126, a grip portion 128, and a protrusion 129. The guide groove 120 is a shape in which one end portion of two straight lines formed along the longitudinal direction of the long narrow surface of the housing 110 in the vertical direction is connected. That is, the guide groove 120 extends from one end of the housing 110 to the vicinity of the other end, is turned in the vicinity of the other end, and is formed in a U shape extending to one end. . The guide groove 120 is a groove for guiding the electronic component holding tape, and the electronic component holding tape is supplied from one end (supply side end) having a U shape. The guide groove 120 moves the supplied electronic component holding tape along the U shape, and discharges it from one end (discharge side end) of the U shape. In addition, the guide groove 120 guides the electronic component holding tape in a state where the tape main body 72 is inside the housing 110 and the electronic components are exposed to the outside of the housing 110.

The guide part 122 is connected with the supply side end part of the guide groove 120, and guides the electronic component holding tape in the state in which the electronic component was hold | maintained to the guide groove 120. FIG. The discharge part 126 is connected with the discharge side end part of the guide groove 120, and the part which moved the inside of the housing 110, and supplied the electronic component to the head 15 discharges the electronic component holding tape. The holding part 128 is a part which an operator takes in conveyance of the electronic component supply apparatus 100, etc. The protrusion 129 is a protrusion inserted into the hole of the first fixing plate 46a of the rear bank 46 described above.

Next, the clamp unit will be described with reference to FIG. 17 along with FIGS. 14 to 16. Here, FIG. 17 is explanatory drawing which showed schematic structure of the clamp unit of an electronic component supply apparatus. The clamp unit 112 is a mechanism connected with the rear bank 46. The clamp unit 112 has a connection part 132, a transmission part 134, an elastic part 136, and a lever 138.

The connection part 132 is a part which contacts the back side bank 46 at the time of connection with the back side bank 46, and is exposed to the exterior of the housing 110. As shown in FIG. For reference, the connection part 132 is arrange | positioned at the surface on the opposite side to the surface in which the guide groove 120 of the housing 110 is formed. As for the connection part 132, the bite part 133 is provided in the edge part of a perpendicular lower side. The bite portion 133 is connected to the locking shaft 46c of the rear bank 46. The transmission part 134 is connected to the bite part 133, the elastic part 136, and the lever 138 of the connection part 132, and the force applied from the lever 138 or the elastic part 136 is connected to the connection part ( 132). One end portion of the elastic portion 136 is fixed to the housing 110, and the other end portion thereof is fixed to the transmission portion 134. The elastic part 136 is a member, such as a spring, and provides the force which pulls the transmission part 134 to the side fixed to the housing 110. Thereby, the transmission part 134 is a state in which the part to which the elastic part 136 is connected is pulled in the predetermined direction. One end of the lever 138 is exposed to the outside of the housing 110, and the other end thereof is connected to the transmission part 134. The lever 138 has a fixed shaft 139 fixed to the housing 110. As a result, the lever 138 is connected to the transmission unit 134 with the fixed shaft 139 as the axis when one end exposed to the outside of the housing 110 is operated by the operator. The end moves. Accordingly, the transfer unit 134 is moved, and a predetermined force acts on the connection unit 132, so that the bite unit 133 is operated. The clamp unit 112 is configured as described above, and the bite portion 133 is connected to the locking shaft 46c of the rear bank 46 by the operation of the lever 138 by the operator, and the rear bank 46 is provided. ) And a state in which the bite portion 133 is open without being connected to the locking shaft 46c.

Next, the feed unit will be described with reference to FIGS. 14 to 16 along with FIGS. Here, FIG. 18 is explanatory drawing which showed schematic structure of the feed unit of an electronic component supply apparatus. 19 is an explanatory diagram showing a schematic configuration of the tip support of the feed unit. 20 is an explanatory diagram showing a schematic configuration of a tape feed claw unit of a feed unit. 21 is an explanatory diagram for explaining the operation of the feed unit. The feed unit 114 is a mechanism which conveys the electronic component holding tape, ie, moves the electronic component holding tape guided along the guide groove 120. The feed unit 114 has a support part 142, a drive part 144, a tip support part 146, and a tape feed claw unit 148. In addition, in this embodiment, the front-end support part 146 and the tape feed claw unit 148 become a position adjustment mechanism which adjusts the relative position between the tape feed claw unit 148 and the housing 110.

The support part 142 is a member fixed to the housing 110 and supports the drive part 144. The drive part 144 has the fixed part 144a and the movable part 144b. The drive part 144 is an air cylinder which expands and contracts the part exposed from the fixed part 144a of the movable part 144b by air pressure. The drive unit 144 reciprocates the front end of the movable part 144b in a direction in which the straight portion of the guide groove 120 extends at least in a predetermined distance range so as to correspond at least to the conveyance pitch. That is, the drive part 144 reciprocates the front end of the movable part 144b at least the distance corresponding to the feed pitch P of a tape. The tip support part 146 is fixed to the tip of the movable part 144b of the drive part 144. The tip support portion 146 is integrated when the movable portion 144b reciprocates and reciprocates. In addition, as shown in FIG. 19, the front end support part 146 is provided with four screw holes 149a, 149b, 149c, and 149d in the part connected with the tape feed claw unit 148 as a vertical upper surface. do. The four screw holes 149a, 149b, 149c, and 149d are formed at four different positions in the tape conveyance direction. In the tip support portion 146, the distance between the screw hole 149a and the screw hole 149b is half the distance of the pitch P of the hole 78 of the tape main body 72 described above. That is, the screw holes 149a and the screw holes 149b are formed at positions shifted by half the pitch of the arrangement intervals of the holes 78. The tip support portion 146 is a distance at which the distance between the screw hole 149c and the screw hole 149d is half the pitch P of the hole 78 of the tape main body 72 described above. That is, the screw holes 149c and the screw holes 149d are formed at positions shifted by half the pitch of the arrangement intervals of the holes 78.

The tape feed claw unit 148 is fixed to the tip support portion 146. The tape feed claw unit 148 has a mounting table 150, a feed claw 152, a pin 154, and a spring 156. The mounting table 150 is a foundation for supporting the transfer claw 152, the pin 154, and the spring 156. The mounting table 150 is a curved plate shape whose cross section orthogonal to a tape conveyance direction forms an L-shape, and a part of upper part of a perpendicular direction is exposed from the housing 110. The mounting base 150 is provided with the holding | gripping part 158 which an operator can hold in the exposed part. The operator can move the tape feed claw unit 148 in the tape feed direction by carrying out an operation by holding the grip part 158 as needed. The mounting table 150 is a member in contact with the tip support 146 and is fixed to the tip support 146 by two fixing screws 159. Here, in the mounting table 150, the interval between the holes into which the two fixing screws 159 are inserted is the interval between the screw hole 149a and the screw hole 149c and between the screw hole 149b and the screw hole 149d. Equal to the interval. That is, the tip support portion 146 has a plurality of combinations of screw holes equal to the arrangement pitches of the fixing screws 159 inserted into the mounting table 150 of the tape feed claw unit 148 at different positions in the tape feed direction. . Accordingly, the mounting table 150 can shift the relative position between the mounting table 150 and the tip support portion 146 by a half pitch by switching the screw hole into which the fixing screw 159 is inserted.

The conveying claw 152 is a member provided with the convex part 152a which protruded in one end part of the rod-shaped member. The conveying claw 152 is arrange | positioned in the position which faces the hole of the tape main body 72 of the electronic component holding tape (henceforth simply a "tape"), and the convex part 152a is a tape In the conveying direction, the surface 152b on the downstream side of the conveying direction becomes a surface orthogonal to the conveying direction, and the surface inclined with respect to the surface orthogonal to the conveying direction on the surface 152c upstream of the conveying direction in the tape conveying direction As the tape 70 approaches, the width of the conveying direction becomes narrower. When the conveyance claw 152 has the hole 78 in the position which faces the convex part 152a, as shown in FIG. 20, the convex part 152a is inserted into the hole 78. As shown in FIG. The pin 154 rotatably supports an end portion on the side where the convex portion 152a of the transfer claw 152 is not formed in a direction parallel to the surface of the paper. One end of the spring 156 is fixed to the protruding surface 150a of the mounting table 150, and the other end of the spring 156 is fixed to the conveying claw 152. The spring 156 presses the conveying claw 152 to the tape side when the convex portion 152a of the conveying claw 152 faces a portion other than the hole 78.

Next, with reference to FIG. 21, the tape conveyance operation of the feed unit 114 is demonstrated. For reference, in the example shown in FIG. 21 (steps S1-S4), the hole formed in the tape main body 72 is first supplied to the housing 110 corresponding to the downstream side of the tape conveyance direction, and firstly the housing 110 ), 78, 78a, 78b, and 78c in that order from the discharge side. In step S1, the convex part 152a of the transfer claw 152 is inserted into the hole 78a of the tape main body 72. As shown in FIG. The feed unit 114 drives the drive unit 144 in a state where the convex portion 152a is inserted into the hole 78a, as shown in step S1, and the feed unit 114 drives the hole of the tape main body 72 in the tape feed direction. The tape transfer claw unit 148 is moved by one pitch.

When the feed unit 114 conveys the tape conveyance claw unit 148 in the tape conveyance direction in the state of step S1, the hole 78a is a tape conveyance direction by the surface orthogonal to the conveyance direction of the convex part 152a. As shown in step S2, the tape feed claw unit 148 and the tape main body 72 are moved together in the tape feed direction. The feed unit 114 moves the electronic component of a tape to a holding position by moving the tape main body 72 to a tape conveyance direction.

When the movement of the tape conveyance direction to the tape conveyance claw unit 148 is completed (step S2), the feed unit 114 waits for the electronic component of the front end held by the tape main body 72 to become a holding position. At this time, the electronic component in the holding position is clamped by the electronic component body as described later, and the lead is cut by the cutter. Next, when a predetermined process is executed on the electronic component mounting apparatus side, a drive command is issued. For example, when the electronic component in the holding position held by the tape is sucked by the suction nozzle of the head or gripped by the holding nozzle, a clamp open command is sent to the electronic component supply apparatus, and the electronic component is supplied by the electronic component supply apparatus. Clamps are opened. Then, when the electronic component held in the nozzle is pulled up by the nozzle rise, a drive command is sent to the feed unit 114. When the drive command is sent, the feed unit 114 drives the drive unit 144 to move the tape feed claw unit 148 by one pitch of the hole of the tape main body 72 in the direction opposite to the tape feed direction. Let's do it. When the feed unit 114 transfers the tape feed claw unit 148 to the side opposite to the tape feed direction in the state of step S2, the inclined surface of the convex portion 152a comes in contact with the hole 78a and follows the slope. The convex portion 152a moves in a direction to be released from the hole 78a. As a result, as shown in step S3, the convex portion 152a is separated from the hole 78a (step S3), the tape does not move, and the tape conveying claw unit 148, Move to the opposite side to the tape feed direction.

Thereafter, when the feed unit 114 moves the tape feed claw unit 148 by one pitch of the hole of the tape main body 72 in the direction opposite to the tape feed direction from the state shown in step S2, the feed unit 114 moves to step S4. As shown, the convex portion 152a is inserted into the hole 78b on the upstream side by one pitch than the hole 78a. At this time, since the conveying claw 152 is pressurized by the spring 156 in the direction of the hole 78b, the convex part 152a is correctly inserted in the hole 78b. Thereafter, the driving unit 144 is immediately driven in the tape conveying direction so that the next electronic component held in the tape main body 72 is transferred to the holding position.

In this way, the feed unit 114 reciprocates the tape feed claw unit 148 by one pitch of the holes of the tape main body 72 by the drive unit 144 in the feed direction, thereby moving the tape by one pitch. Can be moved sequentially.

Next, the cutting unit will be described with reference to FIGS. 22 to 24 in addition to FIGS. 14 to 16. 22 is an explanatory diagram showing a schematic configuration of a cutting unit of the electronic component supply apparatus. 23 is an explanatory diagram showing a schematic configuration of a cutting unit of the electronic component supply apparatus. 24 is an explanatory diagram showing a schematic configuration of a cutting unit of the electronic component supply apparatus. The cutting unit 116 cuts the lead of the electronic component held by the electronic component holding tape. In addition, the cutting unit 116 clamps, that is, holds the electronic component which cut | disconnected the lead until the electronic component is adsorb | sucked (held) by a nozzle. The cutting unit 116 has a supporting portion 162, a driving portion 164, a transmission portion 166, a cutting portion 168, and a cover 169.

The support part 162 is a member fixed to the housing 110, and supports the drive part 164 and the transmission part 166. In addition, the support part 162 supports the cutting | disconnection part 168 through the transmission part 166. As shown in FIG. The drive part 164 has the fixed part 164a and the movable part 164b. The drive part 164 is an air cylinder which expands and contracts the part exposed from the fixed part 164a of the movable part 164b by air pressure. The drive unit 164 reciprocates the front end of the movable unit 164b in a predetermined distance range in the direction in which the straight portion of the guide groove 120 extends. The transmission unit 166 is a transmission mechanism that transmits the power generated by the reciprocating movement of the movable unit 164b to the cutting unit 168. The transmission part 166 converts the reciprocation movement of the movable part 164b in the tape conveyance direction to the movement of the direction orthogonal to a tape conveyance direction, and moves the cut part 168 in the direction orthogonal to a tape conveyance direction. The transmission part 166 moves in the direction in which the front-end | tip part 166a and the front-end | tip part 166b arrange | positioned through the tape passing area | region are mutually approaching, or the direction which is far from each other, ie, the direction shown by the arrow 170. As shown in FIG. When the transmission part 166 of this embodiment moves in the direction in which the movable part 164b of the drive part 164 is extended, it moves in the direction which the front-end | tip part 166a and the front-end | tip part 166b come close to each other. When the transfer section 166 moves in the direction in which the movable section 164b of the drive section 164 contracts, the forward section 166a and the tip section 166b move in a direction away from each other.

The cutting portion 168 is disposed in the holding area to hold the main body of the electronic component disposed in the holding area, and then cuts the lead of the electronic part between the main body and the tape main body, and then holds the electronic part. Keep it. The cut part 168 has the 1st blade part 168a and the 2nd blade part 168b. The cut portion 168 is disposed at a position where the first blade portion 168a and the second blade portion 168b face each other. In addition, the tape is disposed between the first blade portion 168a and the second blade portion 168b, and the lead of the electronic component held on the tape is the first blade portion 168a and the second blade portion 168b. Pass the position between. As shown in FIG. 24, the 1st blade part 168a is connected with the front-end | tip part 166a of the transmission part 166, and when the front-end | tip part 166a moves to the 2nd blade part 168b side, the tip part 166a is carried out. ) Moves toward the second blade portion 168b. As shown in FIG. 24, the 2nd blade part 168b is connected with the front-end | tip part 166b of the transmission part 166, and when the front-end | tip part 166b moves to the 1st blade part 168a side, the tip part 166b is carried out. ) Moves toward the first blade portion 168a. Moreover, the 1st blade part 168a is connected with the front-end | tip part 166a through a spring, and is pressed to the 2nd blade | wing part 168b side by the front-end | tip part 166a.

The cover 169 is a member fixed to the housing 110. The cover 169 is arrange | positioned around the 1st blade part 168a, and the surface which contacts the 2nd blade part 168b of the 1st blade part 168a is an opening. In addition, the cover 169 is in contact with the tip portion 166a through a spring, and presses the tip portion 166a toward the side away from the second blade portion 168b. As a result, when the tip portion 166a is not pressurized toward the second blade portion 168b, it is possible to apply the force in the direction away from the second blade portion 68b to the first blade portion 168a.

The cutting unit 116 has such a configuration as described above, and the driving unit 164 brings the first blade portion 168a on the movable side of the cutting portion 168 into close proximity with the second blade portion 168b on the fixed side. The side of the main body of the electronic component, and the first blade 168a, which is the movable side of the cut portion 168, and the second blade 168b, which is the fixed side, are brought into close contact with each other. A lead disposed between the first blade portion 168a and the second blade portion 168b on the fixed side can be cut. In addition, the cutting unit 116 maintains the state where the first blade portion 168a and the second blade portion 168b are in contact with each other after cutting the lead, so that the side of the main body of the electronic component separated from the tape main body. Can support That is, by cutting the lead, the electronic component separated from the tape main body can be clamped. For reference, the cutting unit 116 may use a mechanism for cutting the lead of the electronic component and a mechanism for clamping the main body of the cut electronic component as a separate mechanism.

Here, the cutting position of the lead which the cutting unit 116 cut | disconnects is demonstrated. In the conventional mounting apparatus provided with a head for lead type electronic component for inserting a board, a very long lead is inserted into a board | substrate by cutting at the lead tip side close to the tape which fixes a lead. This is because the conventional mounting apparatus includes a lead cutting portion and a lead holding portion on the head side, and the lead is cut off because the source of the lead is held by the lead holding portion and then cut down. For losing. In addition, the conventional mounting apparatus guides and inserts the guide pin when inserting the lead into the insertion hole, so even if the lead is long, there is no problem in the substrate insertion. In addition, since the conventional mounting apparatus performs post-processing by a lead bending device which cuts (bones) and cuts the lead to the required length on the back surface of the substrate, the lead is mounted from the component tape. This is because it was necessary to keep it long when cutting it to separate it.

On the contrary, the cutting unit 116 has a length that is equal to the thickness of the substrate or the lead protruding to the back surface side of the substrate, so that the cutting length of the lead of the radial lead-type electronic component does not become a solder defect and corresponds to the thickness of the substrate. It is set as the predetermined length which is length to say. The predetermined length is, for example, almost the same length as the insertion hole of the substrate. More specifically, it is a long length of 0 mm or more and 3 mm or less with respect to the length of the insertion hole of the substrate. As described above, the following effects can be obtained by setting the parts to be shortly cut to a predetermined length from the beginning in the parts supply apparatus, rather than cutting the parts in the head as in the related art.

The electronic component mounting apparatus 10 improves the stability of the lead spacing when the cutting unit 116 cuts the lead shortly and holds the main body of the electronic component in the holding position of the component supply apparatus 100 with the nozzle. It is possible to increase the number of parts to which the lead can be inserted into the insertion hole, so that the mounting can be carried out with high efficiency and with high precision.

In addition, in a conventional mounting apparatus, when a long lead is inserted into a solder paste previously filled or applied to an insertion hole, most of the solder paste is pushed toward the lead tip side, and the solder melted during reflow soldering is minute between the insertion hole and the lead. It may fail to rise to a gap, resulting in poor soldering. On the other hand, the electronic component mounting apparatus 10 is the most preferable soldering by which the cutting unit 116 cut | disconnects a lead shortly and the solder melt | dissolved in the said gap rises and a solder is filled without gap. In addition, by mounting the mounted electronic component on the solder paste coated on the upper surface of the substrate, the lead type electronic component and the mounted electronic component can be simultaneously soldered by one reflow soldering process. In other words, when an excessively long lead is inserted into the solder paste previously filled or applied to the insertion hole, most of the solder paste is pushed toward the lead tip side, so that the melted solder does not rise to the substrate during reflow soldering, that is, the solder substrate It may fail to reach and solder may become bad. On the other hand, in the electronic component mounting apparatus configured as described above, a part of the solder pushed out of the insertion hole by the lead that has passed through the insertion hole by melting the lead shortly to the predetermined length becomes a molten state on the back surface of the substrate. Can be soldered with the electrode on the backside of the substrate. In addition, when there is an electrode inside the insertion hole (substrate hole), the solder may rise and solder in the gap between the lead and the electrode inside the substrate. In this way, soldering can be performed mechanically and electrically.

Moreover, by making the predetermined length the length equivalent to the thickness of a board | substrate, even if a radial lead type electronic component is mounted on a board | substrate, it can suppress that a lead protrudes from a board | substrate (rear surface of a board | substrate). In addition, by setting the predetermined length so that the lead which protrudes to the back surface side of a board | substrate does not become a solder defect, even if a lead is shortened, a lead can be suitably fixed to the insertion hole of a board | substrate by reflow process.

The air pressure adjusting unit 118 controls the air pressure of the air cylinder that is the drive unit 144 of the feed unit 114 and the air cylinder that is the drive unit 164 of the cutting unit 116 to control the driving of each unit. Specifically, the air pressure adjusting unit 118 controls the expansion and contraction, that is, the position of the movable portion 144b of the drive unit 144, to control the position of the transfer claw 152. In addition, the pneumatic pressure adjusting unit 118 controls the expansion and contraction, that is, the position of the movable portion 164b of the drive portion 164, so as to control the first blade portion 168a and the second blade portion 168b of the cut portion 168. Control the position of. Moreover, the air pressure of each part is controlled based on control by the air pressure adjustment part 118 and the component supply control part 64. As shown in FIG.

The component supply apparatus 100 has the above structures. The component supply apparatus 100 provides the tape conveying claw with respect to the front-end support part 146 by providing the position which attaches the mounting base 150 of the tape transfer claw unit 148 to the front-end support part 146 in a tape conveyance direction, By setting the switchable position of the unit 148, it is possible to cope with a plurality of electronic component holding tapes having different relative positions between the holes of the tape body and the electronic components without replacing the components. That is, the component supply apparatus 100 distals the mounting base 150 of the tape transfer claw unit 148 based on the relative position between the hole of the tape body of the electronic component holding tape to be loaded and the electronic component. By switching the position to attach to the support part 146, even if it is any electronic component holding tape, an electronic component can be moved to a holding position.

Specifically, the feed unit 114 changes the position where the mounting table 150 of the tape feed claw unit 148 is attached to the tip support 146, so that the movable portion 144b of the drive portion 144 reciprocates. The position of the convex part 152a of the transfer claw 152 in the position which becomes the state extended most in the range of can be changed. Accordingly, the feed unit 114 has various positions in which the holes of the tape main body are located when the movable portion 144b of the drive portion 144 is in the transfer completed position and the retained position, which are in the state of being most extended in the range of reciprocating movement. You can do it with a location. Accordingly, the feed unit 114 retains the electronic component when the movable portion 144b is in the most extended state in the range of reciprocating movement, even if the electronic component holding tape differs in the arrangement position of the electronic component with respect to the position of the hole. Can be placed in position.

Moreover, it is preferable that the component supply apparatus 100 makes the distance of the reciprocation of the movable part 144b of the feed unit 114 longer than the pitch of the hole of a tape main body, and shorter than twice the pitch. Thereby, the component supply apparatus 100 can reliably insert the convex part 152a of the conveying claw 152 into the hole of a next pitch, and the tape is 1 by reciprocating movement of the conveying claw 152. You can feed by pitch. In addition, when there are plural kinds of pitches of the holes of the tape to be conveyed, the component supply device 100 makes the distance of the reciprocating movement of the movable portion 144b of the feed unit 114 longer than the hole having the longest pitch. It is preferable to make the pitch of the hole shorter than twice the pitch of the shortest tape. Accordingly, even when the pitch of the tape is any kind, the component supply apparatus 100 can reliably insert the convex portion 152a of the conveying claw 152 into the hole of the next pitch, so that once In reciprocating movement, the tape can be conveyed by one pitch. That is, the component supply apparatus 100 can convey the tape of several types of pitches one pitch | variety, without changing the distance of reciprocation movement, or replacing a component.

Here, although the feed unit 114 of the said embodiment made the position which attaches the tape feed claw unit 148 to the front-end support part 146 selectable in two places, the number is not limited to this. The feed unit 114 can respond to more kinds of electronic component holding tapes by increasing the selectable position of the position at which the tape transfer claw unit 148 is attached to the tip support 146. In addition, the feed unit 114 may make it possible to linearly adjust the position which attaches the tape feed claw unit 148 with respect to the front-end support part 146. For example, the tape hole between the tip support part 146 and the tape feed claw unit 148 by making the screw hole of either the front support part 146 or the tape feed claw unit 148 into the elongate hole shape extended in a tape feed direction. The relative position in the direction may be various positions. In this case, it is preferable that the relative position in the tape conveyance direction between the tip support portion 146 and the tape conveying claw unit 148 is adjustable in the range of one pitch of the hole of the tape. As a result, the feed unit 114 can arbitrarily adjust the relative position, and fine adjustment of the relative position is also possible.

Moreover, the feed unit 114 of the said embodiment uses the front-end support part 146 and the tape feed claw unit 148 as a position adjustment mechanism, and measures the relative position between the front-end support part 146 and the tape feed claw unit 148. By changing, the configuration capable of changing the position of the convex portion 152a of the conveying claw 152 when the tape is conveyed is completed, that is, when the movable portion 144b is the most extended in the reciprocating range, that is, the housing 110. And the relative position between the tape feed claw unit 148 is adjustable, but is not limited thereto. The feed unit can use various mechanisms for adjusting the relative position between the housing and the tape feed claw unit as the position adjusting mechanism. For example, the component supply apparatus is capable of adjusting the relative position in the tape conveyance direction between the housing and the feed unit, so that the tape is conveyed, that is, when the movable portion 144b is the most extended in the reciprocating range. The position of the convex part 152a of the transfer claw 152 may be changed. That is, the feed unit may provide a position adjustment mechanism in the connection part between a feed unit and a housing.

Next, various modifications of the electronic component supply apparatus which becomes a radial feeder are demonstrated. 25 is a perspective view showing a schematic configuration of another example of a cutting unit. FIG. 26 is a perspective view showing a schematic configuration of the cutting unit shown in FIG. 25 from another direction. 27 is a perspective view illustrating a relationship between the cutting unit and the housing illustrated in FIG. 25. 28 is a perspective view illustrating a schematic configuration of another example of a cutting unit. It is explanatory drawing for demonstrating the operation | movement of the cutting unit shown in FIG. 30 is an explanatory diagram for explaining the operation of the cutting unit shown in FIG. 25. For reference, the basic configuration of the cutting unit 116a shown in FIGS. 25 to 30 is the same as that of the cutting unit 116. Below, the peculiar point of the cutting unit 116a is demonstrated.

The cutting unit 116a cuts the lead of the electronic component held by the electronic component holding tape. In addition, the cutting unit 116a clamps, i.e., holds the electronic component cut out of the lead until the electronic component is sucked or held (held) by the nozzle 32 (adsorption nozzle or gripping nozzle). The cutting unit 116a has the support part 162, the drive part 164, the transmission part 172, the cutting part 174, and a cover.

The transmission unit 172 is a transmission mechanism that transmits the power generated by the reciprocating movement of the movable unit 164b to the cutting unit 174. The transmission part 172 converts the reciprocation movement of the movable part 164b in the tape conveyance direction to the movement of the direction orthogonal to a tape conveyance direction, and moves the cut part 174 in the direction orthogonal to a tape conveyance direction. The transmission part 172 is comprised from the stator 175 arrange | positioned through the passage area | region of a tape, and the movable part 176. As shown in FIG. The transmission part 172 is close to the 2nd unit 174b connected to the stator 175 of the cut | disconnected part 174, and the 1st unit 174a connected to the movable part 176 of the cut | disconnected part 174. Move in the direction of losing or away. That is, as shown in FIG. 29, when the moving part 172 of the present embodiment moves in the direction in which the movable part 164b of the drive part 164 extends, the mover 176 approaches the stator 175. Move in the direction of The transfer part 172 moves in the direction away from the stator 175 when the movable part 164b of the drive part 164 is moved in the shrinking direction. In this way, the cutting unit 116a is configured to move only one of the two units of the cutting unit 174.

The cut portion 174 is disposed in the holding area, and cuts and holds the lead of the electronic component disposed in the holding area between the main body and the tape main body. The cut part 174 holds both the main body and the lead of the electronic component 80, and subsequently cuts the lead, and maintains the main body and the lead even after cutting the lead. The cut part 174 has the 1st unit 174a and the 2nd unit 174b. The 1st unit 174a has the 1st blade 178a, the 1st main body holding part 179a, and the 1st lead holding part 180a. The first blade 178a and the second blade 178b become the cutting tool 178, and the first main body holding part 179a and the second main body holding part 179b become the main body holding mechanism 179. The first lead holding part 180a and the second lead holding part 180b become the lead holding mechanism 180. As shown in FIG. 30, the cutting part 174 is arrange | positioned in the order of the main body holding mechanism 179, the lead holding mechanism 180, and the cutting tool 178 from the vertical direction upper side.

Each part of the 1st unit 174a and each part of the 2nd unit 174b are arrange | positioned in the position which mutually faces. In addition, the tape is disposed between the first unit 174a and the second unit 174b, and the lead of the electronic component held by the tape is fitted into the cutting tool 178 and the lead holding mechanism 180, The body of the component passes through the position fitted in the body holding mechanism 179.

As for the cutting part 174, the 1st unit 174a is supported by the mover 176, and the direction which moves closer to the 2nd unit 174b with the mover 176, and the direction which moves away (arrow direction of FIG. 30) Go to. When the first unit 174a moves in the direction close to the second unit 174b, the cut portion 174 holds the main body of the electronic component 80 when the main unit holding mechanism 179 moves the lead holding mechanism 180. ) Is in a state of holding the lead of the electronic component 80. Thereafter, when the first unit 174a moves in a direction closer to the second unit 174b, the cutting unit 174 may move the first blade 178a and the second blade 178b of the cutting tool 178. Cross, cut the lead. For reference, in FIG. 30, the first blade 178a and the second blade 178b appear to overlap, but the first blade 178a and the second blade 178b are left and right in the front and rear directions of the ground. Since the positions of the directions are different (beveled with respect to the conveying direction), they are not in contact with each other.

The cutting unit 116a includes a clamp mechanism (main body holding mechanism 179 and lead holding mechanism 180) for holding the electronic component 80, and a cutting mechanism 178 for cutting the lead 84 in one driving portion. Using 164 as a drive source, it is operated by the transmission part 172 in cooperation. Thereby, the cutting unit 116a can perform holding | maintenance of the electronic component 80 and cutting | disconnection of a lead with a simple structure. This also applies to the cutting unit 116.

In addition, the cutting unit 116a can hold the main body 82 of the electronic component 80 by the main body holding mechanism 179, so that the electronic component 80 can be appropriately held even after the lead 84 is cut. . Thereby, the electronic component 80 after cutting the lead 84 can be appropriately maintained, and the electronic component 80 can be easily held by the nozzle 32. This also applies to the cutting unit 116.

In addition, the cutting unit 116a holds the electronic component 80, particularly the main body 82 of the electronic component 80, by the clamp mechanism before cutting the lead 84, thereby keeping the electronic component 80 in a stable position. The lead 84 can be cut | disconnected in the state hold | maintained at. As a result, the lead 84 can be appropriately cut. In addition, the cutting unit 116a holds the electronic component 80 with the clamping mechanism before cutting the lead 84, thereby suppressing the electronic component from which the lead 84 is cut off or falling from the holding position. Can be.

In addition to the main body 82, the cutting unit 116a can regulate the position of the lead 84 at the time of cutting by holding the lead 84, and can cut the lead 84 more appropriately. Further, by holding the lead 84 on the main body side with the lead holding mechanism 180, it is possible to reduce the deformation of the main body side lead 84 generated at the time of cutting.

The cutting unit 116a can simplify the mechanism of an apparatus by making one of the transmission parts 172 into the stator 175. FIG. Moreover, the holding position of the electronic component held by the cutting unit 116a can be made into a stable position, and the operation of the head 15 can be simplified. The cutting unit 116a is preferably provided with both the main body holding mechanism 179 and the lead holding mechanism 180, but may be provided with only one of them.

Here, as shown in FIG. 27, the cutting unit 116a is fixed by inserting the bolts 182 and 185 into the elongate holes 181 and 184 whose length is perpendicular to the vertical direction formed in the housing 110a. Thereby, the cutting unit 116a can adjust the position of a perpendicular direction. Thereby, the position in the vertical direction with respect to the electronic component held on the tape moved by the feed unit can be adjusted. Therefore, the cutting unit 116a can adjust the position of the vertical direction which cut | disconnects a lead with respect to the position of a tape, ie, the cutting position with respect to a radial lead-type electronic component. As described above, the cutting unit 116a can adjust the length of the lead wire after cutting. For reference, in this embodiment, although the mechanism which adjusts the cutting position with respect to a radial lead-type electronic component was made into the combination of the long hole whose adjustment direction becomes length, and the bolt which fixes the position with respect to a long hole, a position adjustment mechanism Is not limited to this. The electronic component supply apparatus should just be a mechanism in which the position of the cutting unit 116a in the Z-axis direction, more specifically, the position of the cutting mechanism in the Z-axis direction can be adjusted with respect to the electronic component holding tape of a holding area.

In addition, the cutting unit 116a has a lever 188 exposed to the outside of the housing 110a. The lever 188 is connected to the linear part of the transmission part 172. Accordingly, the cutting unit 116a can execute the cutting operation of the electronic component by the cutting portion 174 by moving the lever 188 in the direction of the arrow. In other words, by moving the lever 188 in the direction of the arrow, the same operation as that of moving the transmission unit 172 in the linear direction by the drive unit 164 can be executed. Thus, for example, when the position adjustment of the cutting unit 116a is performed, the lead of the electronic component can be cut even if the drive unit 164 is not driven by the control device 20 of the electronic component mounting apparatus 10. . Further, even when no air pressure or electric power is supplied to the drive unit 164, the lead of the electronic component can be cut.

In addition, the electronic component supply apparatus 100 may install the operation part for driving the drive part 164 in the housing 110a. Thereby, the electronic component supply apparatus 100 can perform cutting | disconnection operation | movement of the lead of the electronic component by the cutting unit 116a, even if it does not operate with the control apparatus 20. FIG. For reference, in this case, it is necessary to supply driving force (air pressure or electric power) to the drive part 164.

It is explanatory drawing which showed schematic structure of the holding mechanism of a cutting unit. 31B is an explanatory diagram showing a schematic configuration of another example of the holding mechanism of the cutting unit. The 2nd main body holding part 179b of the cutting unit 116a is a block provided with the two holes 190 into which the bolt fixed to the stator 175 of the transmission part 172 is inserted, as shown to FIG. 31A. to be. The 2nd main body holding | maintenance part 179b is comprised by four surfaces in which the surface parallel to the line which connected two holes 190 differs from the distance from the hole 190. FIG. As for the 1st surface 191a, the distance from the hole 190 becomes the arrow 192a. As for the 2nd surface 191b, the distance from the hole 190 becomes the arrow 192b. As for the 3rd surface 191c, the distance from the hole 190 becomes arrow 192c. In the fourth surface 191d, the distance from the hole 190 becomes an arrow 192d. Arrows 192a, 192b, 192c, and 192d all have different lengths. When the cutting unit 116a fixes the second main body holding part 179b to the stator 175, the cutting unit 116a changes the direction of the second main body holding part 179b (upside down, reverses left and right), and thus the first main body. The surface facing the holding portion 179a can be switched to be the first surface 191a, the second surface 191b, the third surface 191c, or the fourth surface 191d. . Here, since the position of the bolt which fixes the hole 190 is fixed, the 1st main body holding part 179a of the 2nd main body holding part 179b by switching the surface which faces the 1st main body holding part 179a. Distance between the surface facing the surface and the first body holding portion 179a can be changed.

Thereby, the cutting unit 116a can change the distance between the 2nd main body holding | maintenance part 179b and the 1st main body holding | maintenance part 179a at the time of the cutting operation | movement of a lead, The electronic component supply apparatus 100 The distance between the 2nd main body holding | maintenance part 179b and the 1st main body holding | maintenance part 179a can be adjusted suitably according to the kind of electronic component supplied by this.

The 2nd main body holding | maintenance part 195 shown in FIG. 31B is an octagonal columnar shape, and the 1st main body holding | maintenance part 179a becomes a flat surface. A hole 196 into which the bolt is inserted is formed in the second main body holding part 195. The hole 196 is a long hole whose length becomes a direction orthogonal to the conveyance direction of a tape, ie, the direction to which a cutting unit moves. The second main body holding part 195 can adjust the position of the 2nd main body holding part 195 with respect to the bolt in the operation direction of a cut part by adjusting the relative position between the hole 196 and a bolt. In this manner, the cutting unit faces the first main body holding part 179a of the second main body holding part 195 between the longitudinal distances of the holes 196 by using the second main body holding part 195. The distance between the surface and the first body holding portion 179a can be adjusted. Accordingly, the cutting unit can correspond to the width of the main body of more electronic components. For example, the cutting unit can cut off the lead while holding 20 types of lead-type electronic components, and can set 20 kinds of lead-type electronic components which can be supplied to a holding position in the state which cut the lead.

32 is an explanatory diagram showing a schematic configuration of another example of a feed unit of an electronic component supply apparatus. 33 is a perspective view showing a schematic configuration of the feed unit shown in FIG. 32 from another direction. FIG. 34 is a front view illustrating a schematic configuration of the feed unit shown in FIG. 32. 35 is a top view illustrating a schematic configuration of the feed unit shown in FIG. 32. 36 is a front view illustrating a schematic configuration of another state of the feed unit illustrated in FIG. 32. FIG. 37 is a top view illustrating a schematic configuration of another state of the feed unit illustrated in FIG. 32. For reference, the feed unit 200 shown in Figs. 32 to 37 has a convex portion of the transfer claw 152 when the tape has been transferred, i.e., the movable portion 144b is the most extended in the reciprocating range. It is basically the same structure as the feed unit 114 except the structure which can change the position of 152a.

The feed unit 200 includes a support part 202, a drive part 204, a first tip support part 206, a tape feed claw unit 208, a second tip support part 209, and a return direction tape feed. The claw unit 210 and the interlock mechanism 211 are provided. The drive unit 204 has the same configuration as the drive unit 144. In addition, the 1st front-end | tip support part 206 and the tape feed claw unit 208 of this embodiment do not have the position adjustment function in a tape feed direction. In addition, the tape feed claw unit 208 does not have a holding part. Other configurations of the first tip support 206 and the tape feed claw unit 208 are the same as those of the front support 146 and the tape feed claw unit 148.

The support part 202 directly or indirectly drives the drive part 204, the 1st front-end support part 206, the tape feed claw unit 208, the return direction tape feed claw unit 210, and the interlocking mechanism 211. It is a mechanism for supporting with and fixed to the housing 110. The support portion 202 includes a support member 222, two protrusions 230, two screws 232, and two screws 236.

The support member 222 is a plate-shaped member that faces the widest surface of the long and narrow box-shaped area of the housing 110. We face one side of. The support member 222 is connected with the fixed part of the drive part 204, and supports the fixed part. In addition, the support member 222 is fixed to the housing 110 via the protrusion 230.

The protrusion part 230 is arrange | positioned at the surface on the opposite side to the surface which faces the tape feed claw unit 208 etc. of the support member 222. As shown in FIG. The protrusion 230 protrudes in a direction away from the tape feed claw unit 208 or the like. The two projections 230 are arrange | positioned in the position separated by the predetermined distance in the tape conveyance direction of the support member 222. As shown in FIG.

The two screws 232 are screwed to one end (end of the side which contacts the support member 222) of the projection part 230, respectively. The screws 232 are inserted into the elongated holes 222a formed in the support members 222, respectively. The long hole 222a formed in the support member 222 is a hole extended in the tape conveyance direction. For reference, the long hole 222a has a shape in which the screw 232 is movable in the range of one pitch of the hole of the tape in the tape conveying direction.

The two screws 236 are screwed to the other end of the protrusion part 230, respectively. The screws 236 are inserted into the elongated holes 212 formed in the housing 110, respectively. The long hole 212 formed in the housing 110 is a hole extended in the tape conveyance direction. For reference, the long hole 212 is a shape in which the screw 236 is movable in the range of one pitch of the hole of the tape in the tape conveying direction.

In the feed unit 200, a screw 232 screwed to the protrusion 230 is inserted into the elongated hole 222a of the support member 222. In the feed unit 200, a combination of the protrusion 230, the screw 232, and the long hole 222a formed in the support member 222 becomes a position adjustment mechanism. The feed unit 200 may fix the relative position of the feed unit 200 and the tape feeding direction of the housing 110 by tightening the screw 232 to fasten the protrusion 230 and the support member 222. . In addition, the feed unit 200 can relatively move the long hole 222a and the screw 232 by making the screw 232 loose. Accordingly, the support member 222 having the long hole 222a can be relatively moved in the tape conveying direction with respect to the protrusion 230 into which the screw 232 is inserted. The feed unit 200 can make the feed unit 200 moveable with respect to the housing 110 in the tape conveyance direction by making the support member 222 and the protrusion part 230 relatively moveable. Accordingly, the feed unit 200 can adjust the relative position of the feed unit 200 and the tape conveying direction of the housing 110 by removing the screw 232, and tighten the screw 232 to feed the unit. The relative position of the tape transfer direction between the 200 and the housing 110 can be fixed.

In the feed unit 200, a screw 236 screwed to the protrusion 230 is inserted into the long hole 212 of the housing 110. In the feed unit 200, a combination of the protrusion 230, the screw 236, and the long hole 212 formed in the housing 110 serves as a position adjusting mechanism. The feed unit 200 can fix the relative position of the feed unit 200 and the tape feeding direction of the housing 110 by fastening the screw 236 and fastening the protrusion 230 and the housing 110. In addition, the feed unit 200 can relatively move the long hole 212 and the screw 236 by making the screw 236 loose. Accordingly, the housing 110 in which the long hole 212 is formed can be relatively moved in the tape conveying direction with respect to the protrusion 230 in which the screw 236 is inserted. The feed unit 200 can make the feed unit 200 moveable with respect to the housing 110 in a tape conveyance direction by making the housing 110 and the protrusion part 230 relatively moveable. Accordingly, the feed unit 200 can adjust the relative position of the feed unit 200 and the tape conveying direction of the housing 110 by removing the screw 236, and tighten the screw 236 to feed the feed unit. The relative position of the tape transfer direction between the 200 and the housing 110 can be fixed.

The feed unit 200 is configured such that the entire feed unit 200 and the housing 110 can be relatively moved in the tape conveying direction, so that the position of the tape conveying direction of the conveying claw can be simply adjusted without the need for replacement of parts. have. In addition, the feed unit 200 can move the feed unit 200 with respect to the housing 110 only by loosening the screw 232 from the outer side of the housing 110. Thereby, the position adjustment of the tape conveyance direction of a conveying claw can be performed more simply. Here, when the operator relatively moves the feed unit 200 and the housing 110 in the tape conveyance direction, the operator holds the support member 222 and moves the support member 222 in the tape conveyance direction with respect to the housing 110. By doing this, relative movement can be achieved. In addition, the operator may hold the protrusion 230 and make the relative movement. In addition, when the operator loosens the screw 236 to relatively move the feed unit 200 and the housing 110 in the tape conveying direction, the operator holds the loosened screw 236 and attaches the screw 236 to the long hole 212. By moving relative to the feed unit 200 and the housing 110 can be relatively moved in the tape feed direction. In this case, it is preferable to make the screw 236 into the shape which is easy to hold.

In the feed unit 200, when the relative position is moved by a mechanism in which the screw 232 and the long hole 222a are combined, the housing 110 and the protrusion 230 are fixed by the screw 236. It is preferable to make it exist. In addition, the feed unit 200 is fixed to the support member 222 and the protrusion 230 by the screw 232 when the relative position is moved by a mechanism combining the screw 236 and the long hole 212. It is preferable to make it into the state.

In addition, the feed unit 200 is a position adjustment mechanism, and the two mechanisms of the mechanism which combined the screw 232 and the long hole 222a, and the mechanism which combined the screw 236 and the long hole 212 are used. Although the relative position of the tape feed direction between the feed unit 200 and the housing 110 is adjustable by each, it is not limited to this. As the position adjusting mechanism, the feed unit 200 may be provided only with a mechanism in which the screw 232 and the elongated hole 222a which are provided in the part which fixes the projection part 230 and the support member 222 are combined. In addition, the feed unit 200 may provide only the mechanism which combined the screw 236 and the long hole 212 which are the part which fixes the protrusion part 230 and the housing 110 as a position adjustment mechanism.

In addition, the feed unit 200 reciprocates the 1st front-end | tip support part 206 in a tape conveyance direction by the drive part 204, and moves the tape conveyance claw unit 208 to the position shown to FIG. 34 and FIG. 35, It reciprocates between the positions shown in FIG. 36 and FIG. Thus, by reciprocating the tape feed claw unit 208, similarly to the feed unit 114, a tape can be conveyed by 1 pitch in a tape feed direction.

Here, the feed unit 200 of this embodiment further has the 2nd front-end | tip support part 209, the return direction tape feed claw unit 210, and the interlock mechanism 211 as mentioned above. Hereinafter, the second tip support 209, the return direction tape feed claw unit 210, and the linkage mechanism 211 will be described with reference to FIGS. 32 to 37 and FIGS. 38 to 43. FIG. 38 is an explanatory diagram showing a schematic configuration of the feed unit shown in FIG. 32. FIG. 39: is explanatory drawing which showed schematic structure of the other state of the feed unit shown in FIG. 40 is an explanatory diagram showing a schematic configuration of an interlock mechanism of the feed unit shown in FIG. 41 is an explanatory diagram showing a schematic configuration of another example of the housing. FIG. 42 is an explanatory diagram for explaining the operation of the feed unit shown in FIG. 32. FIG. 43: is explanatory drawing for demonstrating operation | movement of the feed unit shown in FIG. 41 illustrates a housing 280 for explaining the feed unit 200.

As shown in FIG. 38 and FIG. 39, the 2nd front-end support part 209 is a plate-shaped member which faces the surface where the long narrow box-shaped area of the housing 110 is the largest, The drive part 204 and the 1st front-end | tip The other surface of the support part 206 and the tape feed claw unit 208 is faced. That is, the 2nd front-end support part 209 and the support member 222 are arrange | positioned in the position which sandwiches the drive part 204, the 1st front-end support part 206, and the tape feed claw unit 208. The second tip support portion 209 is fixed to the support member 222 via the coupling portion 226 and the interlock mechanism 211. The 2nd tip support part 209 is a mechanism which supports the return direction tape feed claw unit 210 mentioned later, and is connected to the interlocking mechanism 211 by the connection part 226. As shown in FIG. As for the 2nd front-end | tip support part 209, a part of perpendicular upper side is exposed from the housing 110. As shown in FIG. In other words, a portion of the second front end support portion 209 is exposed out of the housing 110 from a surface on which the guide groove 120 of the housing 110 is formed. The grip part 228 is provided in a part of the vertical direction upper part of the 2nd front-end | tip support part 209. As shown in FIG. Moreover, the support member 222 and the 2nd front-end support part 209 support the 1st front-end support part 206 in the state which can move to a tape conveyance direction.

The connection part 226 consists of a bolt, a nut, etc., and fixes the 2nd front-end support part 209 to the interlocking mechanism 211. As shown in FIG. As described above, the gripping portion 228 is provided on a portion of the second tip support portion 209 in the vertical direction. The holding part 228 is a part which an operator can grasp. The gripping portion 228 has a shape in which the operator easily moves the second tip support portion 209 in a direction parallel to the tape feeding direction. The operator can move the tape feed claw unit 208 and the return direction tape feed claw unit 210 in the direction parallel to the tape feed direction by moving the second tip support 209 in the direction parallel to the tape feed direction. Can be.

The return direction tape feed claw unit 210 is basically the same structure as the tape feed claw unit 208. The return direction tape feed claw unit 210 is disposed at a position facing the tape feed claw unit 208 while being a position away from the tape feed claw unit 208 in a direction orthogonal to the surface of the support portion 202. have. The return direction tape feed claw unit 210 is fixed to the 2nd front-end support part 209, and moves with a 2nd front-end support part 209 to a direct drive direction (direction to which the movable part of the drive part 204 moves). In addition, in the return direction tape feed claw unit 210, the direction of the feed claw in the linear direction is opposite to that of the tape feed claw unit 208. Moreover, in the return direction tape conveyance claw unit 210, the convex part of a conveyance claw protrudes on the opposite side to the support part 202 side.

The interlock mechanism 211 is a mechanism for transmitting the power transmitted from the drive unit 204 to the first tip support 206 to the second tip support 209. As shown in FIG. 40, the linkage mechanism 211 includes a first slide mechanism 242, a delivery unit 244, and a second slide mechanism 246. The first slide mechanism 242 has a fixed portion 242a and a movable portion 242b. The fixed portion 242a is fixed to the support portion 202. The movable part 242b is supported by the fixed part 242a in the state which can be moved to a linear motion direction (direction to which the movable part of the drive part 204 moves). The movable part 242b is being fixed to the 1st front-end support part 206, and moves to a linear motion direction with the 1st front-end support part 206. As shown in FIG.

The transmission unit 244 is a power transmission mechanism that transmits the power transmitted from the first slide mechanism 242 to the second slide mechanism 246. The transmission part 244 has the pinion gear fixed to the support part by the pin.

The second slide mechanism 246 has a fixed portion 246a and a movable portion 246b. The fixed portion 246a is fixed to the support portion 202. The movable part 246b is supported by the fixed part 246a in the state which can be moved to a linear motion direction (direction to which the movable part of the drive part 204 moves). The movable part 246b is being fixed to the 2nd front-end support part 209, and moves to a linear motion direction with the 2nd front-end support part 209. As shown in FIG.

The linkage mechanism 211 has the above configuration, and the transmission portion 244 includes a gear groove in which the pinion gear is formed in the movable portion 242b of the first slide mechanism 242 and the movable portion of the second slide mechanism 246. It fits in the gear groove formed in 246b). That is, in the interlock mechanism 211, the transmission part 244 and the first slide mechanism 242 are connected by a rack and pinion mechanism, and the transmission part 244 and the second slide mechanism 246 are rack and pinion. It is connected by a mechanism. In addition, as shown in FIG. 40, the linkage mechanism 211 is connected to a position where the transmission unit 244 and the first slide mechanism 242 are connected, and the transmission unit 244 and the second slide mechanism 246 are connected to each other. The position to be becomes the facing position of the pinion gear. As a result, when the pinion gear rotates, the feed unit 200 moves in the direction in which the first slide mechanism 242 and the second slide mechanism 246 are opposite to each other in the linear direction.

Here, the housing 280 to which the feed unit 200 is fixed is demonstrated. As shown in FIG. 41, the guide groove 282 similar to the housing 110 mentioned above is formed in the housing 280. As shown in FIG. The guide groove 282 has a shape in which one end portion of two straight portions 283 and 285 formed along the longitudinal direction of the long narrow surface of the housing 280 in the vertical direction is connected by the return portion 284. That is, in the guide groove 282, the straight portion 283 extends from one end portion of the housing 280 to the vicinity of the other end portion, and returns from the return portion 284 near the other end portion. ) Is formed in a U-shape extending to one end. The guide groove 282 is a groove for guiding the electronic component holding tape, and the electronic component holding tape is supplied from one end (supply side end) having a U shape. The guide groove 282 moves the supplied electronic component holding tape along the U shape, and discharges it from one end (discharge side end) of the U shape. In addition, the guide groove 282 guides the electronic component holding tape in a state where the tape main body is in the housing 280 and the electronic component is exposed to the outside of the housing 280. As for the return part 284 of the housing 280, the guide part 286a is arrange | positioned at the outer peripheral side of the conveyance area | region of a tape, and the guide part 286b is arrange | positioned at the inner peripheral side of the conveyance area | region of a tape. The guide portions 286a and 286b have curved surfaces that are bent along the outer circumference and the inner circumference of the returned conveyance region, respectively. The housing 280 can move the tape in the appropriate direction in the return part 284 by providing the guide parts 286a and 286b in the return part 284.

Next, with reference to FIG. 42 and FIG. 43, the conveyance operation | movement of the electronic component holding tape by the feed unit 200 is demonstrated. As shown in FIG. 42, in the feed unit 200, the tape feed claw unit 208 is fixed to the first tip support 206, and the return direction tape feed claw unit 210 is fixed to the second tip support 209. ) Is fixed.

The tape feed claw unit 208 includes a feed claw 152. The conveying claw 152 is a member provided with the convex part 152a which protruded in one end part of the rod-shaped member similarly to the tape conveying claw unit 148 mentioned above. The conveying claw 152 is arrange | positioned in the position which faces the hole of the tape main body of the electronic component holding tape 70, and the convex part 152a is the conveyance direction downstream side (the conveyance direction front side in a tape conveyance direction). The surface 152b of)) becomes a surface orthogonal to a conveyance direction, and the surface 152c of the upstream (rear conveyance direction) of a conveyance direction in a tape conveyance direction becomes a surface inclined with respect to the surface orthogonal to a conveyance direction. As the tape approaches the tape, the width in the feed direction narrows. When the transfer claw 152 has the hole 78 in the position which faces the convex part 152a, as shown in FIG. 42, the convex part 152a will be in the state inserted into the hole. Here, the tape conveying claw unit 208 is arrange | positioned in the position which faces the tape 70 in the straight part 283 of the guide groove 282, and the convex part 152a is located in the return part 284 side. It is arranged. The tape feed claw unit 208 conveys the tape 70 in the straight portion 283 of the guide groove 282 toward the holding area PP where the electronic components are adsorbed.

The return direction tape feed claw unit 210 includes a feed claw 252. The conveying claw 252 is a member provided with the convex part 252a which protruded in one end part of the rod-shaped member similarly to the tape conveying claw unit 208 mentioned above. The conveying claw 252 is arrange | positioned in the position facing the hole of the tape main body of the tape 70, and the convex part 252a is the surface 252b of the conveyance direction downstream side (transfer direction front side) in a tape conveyance direction. ) Becomes a surface orthogonal to the conveying direction, and the surface 252c on the upstream side (the conveying direction back side) of the conveying direction in the tape conveying direction becomes a surface inclined with respect to the surface orthogonal to the conveying direction, The width of the conveying direction is narrowed. When the conveyance claw 252 has the hole 78 in the position which faces the convex part 252a, as shown in FIG. 42, the convex part 252a will be in the state inserted into the hole. Here, the return direction tape feed claw unit 210 is arrange | positioned in the position which faces the tape 70 in the straight part 285 of the guide groove 282, and the convex part 252a returns the return part 284. It is arrange | positioned on the opposite side to a side. That is, in the return direction tape feed claw unit 210, the feed claw 252 is arrange | positioned in the direction opposite to the feed claw 152 of the tape feed claw unit 208 in a direct drive direction. The return direction tape conveyance claw unit 210 conveys the tape 70 which passed through the holding | maintenance area PP which an electronic component adsorb | sucks toward the discharge part of the linear part 285 of the guide groove 282. As shown in FIG.

Next, the tape transfer operation of the feed unit 200 will be described with reference to FIG. 43. In step S6, the convex part 152a of the conveying claw 152 is inserted into the hole 78 of the tape main body of the tape 70, and the convex part of the conveying claw 252 is inserted into the hole of the tape main body. Here, the conveyance claw 152 is inserted in the hole of the tape 70 in the tape conveyance direction upstream (before the holding | maintenance area PP passes) rather than the holding area PP. In the conveyance claw 252, the convex part is inserted in the hole of the tape returned from the return part 284 in the tape conveyance direction downstream from the holding area PP (after passing through the holding area PP). The feed unit 200 drives the drive unit 204 in a state where the convex portion of the conveying claw 152 is inserted into the hole and the convex portion of the conveying claw 252 is inserted into the hole as shown in step S6. The tape feed claw unit 208 and the return direction tape feed claw unit 210 are moved by one pitch of the hole of the tape main body in the tape feed direction.

When the feed unit 200 sends the tape feed claw unit 208 and the return direction tape feed claw unit 210 in the tape feed direction in the state of step S6, the surface orthogonal to the feed direction of the convex portion of the feed claw 152. And the hole is pushed in the tape conveying direction by the surface orthogonal to the conveying direction of the convex portion of the conveying claw 252, and the tape conveying claw unit 208 and the tape are moved together in the tape conveying direction as shown in step S7. . Here, the tape feed claw unit 208 and the return direction tape feed claw unit 210 are moved in opposite directions to each other by the interlock mechanism 211. In this way, the return direction tape conveying claw unit 210 is moved in the opposite direction to the tape conveying claw unit 208, so that the tape having the hole into which the conveying claws 152 and 252 are inserted is conveyed in the tape conveying direction, that is, Can be conveyed along the guide groove 282 in a direction from the guide portion toward the discharge portion.

The feed unit 200, when the movement of the tape transfer direction to the tape transfer claw unit 208 and the return direction tape transfer claw unit 210 is completed (step S7), the electronic component at the front end held by the tape main body is held. Be in position and wait. At this time, the electronic component in the holding position (holding region) PP is clamped by the electronic component body, and the lead is cut by the cutter. Next, when the electronic component mounting apparatus supplies a predetermined process, for example, the electronic component in the holding position held by the tape, to the head, a driving command is issued to drive the driving unit 204, opposite to the tape conveying direction. The tape conveying claw unit 208 and the return direction tape conveying claw unit 210 are moved by one pitch of the hole of the tape main body 72 in the direction. When the feed unit 200 sends the tape feed claw unit 208 and the return direction tape feed claw unit 210 to the opposite side to the tape feed direction in the state of step S7, the diameter of the convex portions of the feed claws 152 and 252 is reduced. The photograph surface is in contact with the hole, and the convex portions of the transporting claws 152 and 252 move along the inclination in the direction from the hole. As a result, the feed unit 200, as shown in step S8, has the convex portions of the conveying claws 152 and 252 come out of the holes (step S8), so that the tape does not move and the tape conveying claw unit 208 returns. The direction tape feed claw unit 210 moves to the side opposite to the tape feed direction.

Thereafter, the feed unit 200, from the state shown in step S7, is tape feed claw unit 208 and return direction tape feed claw unit by one pitch of the hole of the tape main body 72 in the direction opposite to the tape feed direction. When 210 is moved, as shown in step S9, the convex portions of the transfer claws 152 and 252 are inserted into the holes upstream by one pitch from the holes inserted in step S7. Thereafter, the drive unit 204 is immediately driven in the tape conveying direction to convey the next electronic component to be held in the tape main body 72 to the holding position.

In this way, the feed unit 200 reciprocates the tape feed claw unit 208 by one pitch of the holes of the tape main body 72 by the drive unit 204 in the feed direction, thereby moving the tape by one pitch. Can be moved sequentially.

In addition, the feed unit 200 is provided with a return direction tape feed claw unit 210, and by the interlock mechanism 211, the return direction tape feed claw unit 210 is interlocked with the tape feed claw unit 208. By driving, the tape which passed the holding | maintenance area | region PP can be conveyed in a conveyance direction. In this way, the tape passing through the holding area PP can be conveyed in the conveying direction, whereby the tape can be moved both upstream and downstream of the holding area PP. Thereby, it can suppress that a tape bends in the holding area PP and the tape shifts | deviates. In addition, the feed unit 200 of the present embodiment is moved by one drive mechanism by interlocking the tape feed claw unit 208 and the return direction tape feed claw unit 210 by the interlock mechanism 211. Dogs can be moved. In addition, by moving in conjunction, the distance between the two transfer claws can be kept constant, and the tape can be appropriately conveyed.

Here, in the tape conveyance direction, the electronic component supply apparatus 100 is located downstream of the arrangement position of the conveyance claw 152 in the feed unit 200, and upstream from the return part in the tape conveyance direction. It is preferable to arrange the holding area (holding position) PP. That is, the electronic component supply apparatus 100 transfers the holding | maintenance area PP which hold | maintains the electronic component 80 with the nozzle 32, and the conveyance claw 152 which transfers the electronic component holding tape 70 to a holding | maintenance area | region. It is preferable to arrange | position between and the position pinched | interposed with the return part of the guide groove 282. As a result, the bending or deformation of the electronic component holding tape 70 passing through the holding region PP can be suppressed, whereby the position and electronic component of the electronic component holding tape 70 in the holding region PP can be suppressed. The position of 80 can be stabilized.

44 is an explanatory diagram showing a schematic configuration of another example of a component supply apparatus. 45 is an explanatory diagram showing an enlarged portion of FIG. 44. The electronic component supply apparatus 310 has the plate-shaped member 312 connected to the feed unit, and the opening 314 is formed in the housing. The plate member 312 moves in a conveyance direction with the fixed part of a feed unit. The opening 314 has a plurality of sides 314a, 314b, 314c, and 314d extending in the vertical direction at a position overlapping with an end portion of the plate-shaped member 312 in the movable range of the plate-shaped member 312. It is. Here, the sides 314a, 314b, 314c, and 314d are formed at positions where the spacing between the holes of the tape and the arrangement of the electronic components with respect to the holes correspond to the respective cases. The user selects the position of the side of the plate-shaped member 312 with respect to the side which matches the conditions of the side 314a, 314b, 314c, and 314d according to the combination of the space | interval of the hole of a tape, and the arrangement | positioning of an electronic component with respect to a hole. By fitting, the feed unit can convey the electronic component to the holding area. In addition, in this embodiment, although the case where the combination of the space | interval of the hole of a tape and the arrangement | positioning of an electronic component with respect to a hole is four was demonstrated like the said embodiment, the shape of the opening 314 is changed according to a combination. Just do it.

46 is an explanatory diagram showing a schematic configuration of another example of a component supply apparatus. 47 is an explanatory diagram showing an enlarged portion of FIG. 46. In the electronic component supply apparatus 320 shown to FIG. 46 and FIG. 47, the tape discharge guide 322 is arrange | positioned at the discharge part. The tape discharge guide 322 is disposed on a surface facing the discharge portion in a direction in which the half cylinder forms an angle of 60 degrees with the vertical direction. In the tape discharge guide 322, a plate member is disposed on a surface of the tape discharge guide 322 that faces the guide portion 122. By disposing the tape discharge guide 322, the electronic component supply device 320 can turn the tape discharged from the discharge portion 126 along the semi-cylindrical portion and guide the tape downward in a vertical direction. Thereby, the discharge angle of the electronic component holding tape discharged from the discharge part through the guide groove can be regulated. The tape discharge guide 322 can reduce the load applied to the electronic component holding tape by making the surface facing the discharge portion cylindrical, and can appropriately redirect the electronic component holding tape. In addition, the tape discharge guide 322 can reduce the load applied to the electronic component holding tape by making the inclination angle of the cylindrical portion 60 degrees with respect to the vertical direction, and can appropriately turn the electronic component holding tape. For reference, the tape ejection guide 322 can be smoothly switched by being configured as shown in FIGS. 46 and 47, and the electronic component holding tape can be ejected at a desired position. However, the tape ejection guide 322 is not limited to the above configuration. no.

48 is an explanatory diagram showing a schematic configuration of another example of a component supply apparatus. FIG. 49 is an explanatory diagram showing an enlarged portion of FIG. 48. In the electronic component supply apparatus 320 shown to FIG. 48 and FIG. 49, the member mounting box 324 is provided in the guide part 122. As shown in FIG. The member mounting box 324 is provided with a key portion 326, the key portion 326 is connected to the guide portion 122, and is supported by the guide portion 122. The electronic component holding tape to be supplied to the electronic component supply apparatus 320 is accommodated in the member mounting box 324. For reference, the electronic component holding tape may be placed in the member placing box 324 with the box housing the electronic component holding tape. The electronic component supply apparatus 320 can shorten the distance between the position where the electronic component holding tape is stored, and the guide part 122 by providing the member mounting box 324. As a result, the load applied to the electronic component holding tape can be reduced from the position where the electronic component holding tape is stored to being conveyed to the guide portion 122. Thereby, the electronic component supply tape can be appropriately conveyed by the electronic component supply apparatus 320. In addition, the electronic component holding tape can be prevented from breaking due to its own weight or the hole from being stretched.

Next, the component supply unit 14f will be described. Here, the component supply unit 14f has two bowl feeder assemblies 90. The two bowl feeder assemblies 90 are arranged in parallel and are basically the same in configuration. Hereinafter, one bowl feeder assembly 90 will be described.

50 is a perspective view illustrating a schematic configuration of a bowl feeder assembly. FIG. 51 is a perspective view illustrating a schematic configuration of the bowl feeder assembly shown in FIG. 50. The bowl feeder assembly 90 has two bowl feeder units 400 and a support mechanism 401 as shown in FIGS. 50 and 51. In the present embodiment, the bowl feeder unit 400 and the bowl feeder assembly 90 are controlled by the control unit. The bowl feeder unit 400 and the bowl feeder assembly 90 may use the control apparatus 20 which the electronic component mounting apparatus 10 has as a control part, and the bowl feeder unit 400 and the bowl feeder assembly 90 may be used as a control part. You may have a control part.

The support mechanism 401 is a mechanism for supporting two bowl feeder units 400. The support mechanism 401 has a support plate 491, a support bar 492, and a connection portion 493. The support plate 491 is a plate-shaped member, and two bowl feeder units 400 are installed and fixed. As for the support plate 491, the front-end | tip of the side which supplies a component is connected with the setting shaft 44b of the front side bank 44, and the recessed part 44c. The support bar 492 is connected to the side far from the front bank 44 of the support plate 491 via the connection part 493. The support bar 492 is supported by the mounting surface (bottom) in which the lower end part of the vertical direction installs the electronic component mounting apparatus 10. As for the support mechanism 401, the support plate 491 in which the two bowl feeder units 400 were installed is supported by the front bank 44 and the support bar 492. The support mechanism 401 can suppress the bending of the support plate 491 by supporting the support plate 491 at two places of the front bank 44 and the support bar 492 deviating from the front bank 44. have. Thereby, it can suppress that the vibration of the bowl feeder unit 400 becomes the vibration of the support plate 491, and can drive the bowl feeder unit 400 suitably.

One bowl feeder unit 400 of the bowl feeder assembly 90 has two rows in a vertical direction with the bowl of the bowl feeder unit 400 which is different from the bowl described later, and the holding position (the tip of the rail 422 and the suction). Position) is shifted back and forth. That is, the bowl feeder assembly 90 is arrange | positioned in the Y direction in the position which the bowl mentioned later of two bowl feeder units 400 mentions before and behind. And in the X direction (direction orthogonal to the extension direction of the rail mentioned later, the conveyance direction of a board | substrate), between the bowl which the bowl feeder unit 400 of a 1st row has, and the bowl which the bowl feeder unit 400 of a 2nd row has At least part of the placement area overlaps. That is, the bowl feeder assembly 90 is arrange | positioned so that the bowl position mentioned later of the two bowl feeder units 400 may overlap in the X direction. In addition, the bowl feeder assembly 90 is arrange | positioned in the Y direction in the position which the bowl mentioned later of two bowl feeder units 400 mentions before and behind. Thereby, the bowl feeder assembly 90 can arrange | position the bowl feeder unit 400 efficiently. Specifically, the width in the X direction can be narrowed, and more component supply apparatuses can be arranged in the component supplyable region of the electronic component mounting apparatus 10.

In the present embodiment, the bowl of the bowl feeder unit 400 in the first row and the bowl of the bowl feeder unit 400 in the second row (arranged at a position away from the holding position than the bowl feeder unit 400 in the first row) Is disposed in an area within twice the outer diameter of the bowl in the direction orthogonal to the extending direction of the rail (the X direction, the conveying direction of the substrate). By doing in this way, the width | variety of the X direction can be reliably narrowed, and more component supply apparatuses can be arrange | positioned in the component supply possibility area | region of the electronic component mounting apparatus 10. FIG.

Next, with reference to FIGS. 52-67B, the bowl feeder unit 400 of the bowl feeder assembly 90 of the component supply unit 14f is demonstrated. The bowl feeder unit 400 shown in FIGS. 52-67B uses a bowl feeder as an electronic component supply apparatus. First, the overall configuration of the bowl feeder unit 400 will be described with reference to FIGS. 52 to 54. 52 is a side view illustrating another example of the component supply unit. 53 is a top view illustrating another example of the component supply unit. FIG. 54 is a side view illustrating a state in which the bowl is separated from the component supply unit shown in FIG. 52.

The bowl feeder unit 400 includes bowl feeders 402, 404, 406, which are electronic component supply devices, a drive device 408, and a fixing part 410. That is, the bowl feeder unit 400 is provided with three electronic component supply apparatuses 402, 404, and 406, and is a mechanism which can supply components in three places. In addition, in the bowl feeder unit 400, one drive device 408 becomes a drive part of the electronic component supply devices 402, 404, and 406. In the bowl feeder unit 400, the fixing unit 410 supports the electronic component supply devices 402, 404, 406 and the drive device 408. The fixing part 410 has a frame-shaped support part 442 and a support part 444 extending in the vertical direction, and the electronic component supply devices 402, 404, 406, and the driving device 408 are at the upper and lower ends. Is supported by. In addition, the support part 442 and the support part 444 extend to the rotating shaft of the drive apparatus 408 mentioned later, and the drive apparatus 408 rotates the target part of the electronic component supply apparatus 402, 404, 406. I support it in the state that I can pivot around.

The electronic component supply apparatus 402 has a bowl 420a, a rail 422a, a support mechanism 424a, and a connecting portion 436a. The electronic component supply apparatus 404 has a bowl 420b, a rail 422b, a support mechanism 424b, and a connecting portion 436b. The electronic component supply apparatus 406 has a bowl 420c, a rail 422c, a support mechanism 424c, and a connecting portion 436c. The electronic component supply apparatuses 402, 404, 406 are arranged by stacking the bowls 420a, 420b, and 420c at positions where the positions in the horizontal direction overlap, and the bowls 420a and 420b are sequentially arranged from the upper side in the vertical direction. It is arrange | positioned in order of 420c. In the electronic component supply apparatuses 402, 404, and 406, the supporting mechanisms 424a, 424b, and 424c are arranged in parallel on the same plane. That is, the holding positions of the plurality of rails 422a, 422b, and 422c are arranged on the same plane.

The electronic component supply apparatuses 402, 404, and 406 differ only in the shape of the rails 422a, 422b, and 422c due to different arrangement positions and the arrangement positions, and basically have the same configuration. Hereinafter, what is common in the bowls 420a, 420b, and 420c of the electronic component supply apparatuses 402, 404, and 406 is demonstrated as the bowl 420. FIG. Similarly, the points common to the rails 422a, 422b, and 422c will be described as the rails 422, and the points common to the support mechanisms 424a, 424b, and 424c will be described as the support mechanisms 424. The points common to the connecting portions 436a, 436b, and 436c will be described as the connecting portions 436.

The bowl 420 is a container in which a plurality of electronic components are put. The rail 422 serves as a guide member for guiding the electronic component introduced into the bowl 420 to the suction position. The support mechanism 424 is a mechanism for supporting the electronic component guided by the rail 422 at the suction position. The connection part 436 is connected with the bowl 420 and the excitation part of the drive device 408, and transmits a vibration from the drive device 408 to the bowl 420. FIG. For reference, in the present embodiment, in the electronic component supply apparatuses 402, 404, 406, the connecting portion 436 and the driving apparatus 408 become vibrating portions. Hereinafter, each part is explained in full detail.

The bowl 420 will be described with reference to FIGS. 55 and 56. FIG. 55 is an explanatory diagram showing a relationship between the bowl of the electronic component supply apparatus of the component supply unit shown in FIG. 53 and the support of the vibrator. FIG. 56 is an explanatory diagram showing the schematic configuration of the bowl shown in FIG. 55; FIG. As described above, the bowl 420 is a container in which a plurality of electronic components are put. The bowl 420 has a box shape in which a main body 450, which is a container, has a circular bottom surface, extends in an outer edge thereof in a direction perpendicular to the bottom surface, and has an open top surface. The bowl 420 has a protrusion 451 extending downward in the vertical direction on the bottom surface of the body 450, and a fastening member 452 is inserted into the protrusion 451 for fastening with the connecting portion 436. The fastening member 452 is a mounting screw supported by the structure which is rotatable with respect to the projection part 451, and is not isolate | separated from the projection part 451. FIG. In the connecting portion 436, a fastening hole 454 to which the fastening member 452 is fastened is formed. The bowl 420 is fixed to the connecting portion 436 by fastening the fastening member 452 to the fastening hole 454.

In this manner, the bowl 420 is fixed to the connecting portion 436 in a detachable state by the fastening member 452, thereby eliminating the electronic component supply apparatuses 402, 404, and 406 from the bowl feeder unit 400. The bowl 420 can be easily separated. Accordingly, the bowl 420 can be easily replaced.

Next, one end of the rail 422 is connected to the bowl 420, and the other end of the rail 422 is connected to the support mechanism 424. The rail 422 is formed with a guide groove for guiding the electronic component. The rail 422 moves the electronic component taken out of the bowl 420 along the guide groove and guides it to a portion connected to the support mechanism 424. In addition, as will be described later, the portion of the rail 422 connected to the bowl 420 is fixed to the vibrating unit of the driving device 408, and vibrates with the bowl 420. In addition, the rail 422 is supported in the state which the edge part of the side connected to the support mechanism 424 can slide in the one direction of the extension direction of the rail 422.

The two bowl feeder units 400 shown in FIGS. 50 and 51 have a plurality of bowls 420a, 420b, and 420c, all of which are disposed in the vertical direction. The bowl feeder unit 400 of a 1st row is made into the bowl feeder unit 400 of a 1st row near the holding | maintenance position (adsorption position) of the some rail 422a, 422b, 422c, and the bowl feeder unit of a 2nd row is located farther from this position. It is set to 400. At this time, the plurality of rails 422a, 422b, and 422c of the bowl feeder unit 400 in the second row are vertical in the side of the plurality of rails 422a, 422b and 422c of the bowl feeder unit 400 in the first row. Are arranged side by side in the direction. As shown in FIG. 53, the holding positions of the plurality of rails 422a, 422b, and 422c are expanded in a direction perpendicular to the extending direction of the plurality of rails 422a, 422b, and 422c. Support mechanisms 424a, 424b, 424c are arranged in parallel on the same plane.

Next, the supporting mechanism 424 will be described with reference to FIGS. 57A to 58B. FIG. 57A is a perspective view showing a schematic configuration of a support mechanism of the electronic component supply device of the component supply unit shown in FIG. 53. FIG. 57B is a front view showing the schematic configuration of the support mechanism shown in FIG. 57A. FIG. 58A is a perspective view illustrating another state of the support mechanism illustrated in FIG. 57A. FIG. 58B is a front view showing the schematic configuration of the support mechanism shown in FIG. 58A. FIG. 57A and 57B show the position adjustment bracket 470 of the support mechanism 424 closed, and FIGS. 58A and 58B show the position adjustment bracket 470 of the support mechanism 424 open. In addition, in FIG. 57B and 58B, the guide groove 464 is shown virtually on the upper side of the bracket 470, in order to show the relative position of each member.

The support mechanism 424 has a base 460, a rail support 462, a guide groove 464, and a suction position adjusting unit 468. The base 460 is a member fixed to the fixed portion of the bowl feeder unit 400. The rail support part 462 is a wheel supported by the base 460 in a rotatable state, and supports the rail 422 from the vertical direction lower side. The rail supporter 462 rotates in accordance with the movement in the direction parallel to the extension direction of the rail 422. As a result, the rail 422 is supported in a state capable of moving in a direction parallel to the extending direction with respect to the support mechanism 424. The guide groove 464 is formed in the edge part of the rail 422 extension direction of the base 460. As shown in FIG. The guide groove 464 is connected to the groove of the rail 422, and the electronic component guided through the rail 422 is supplied. That is, the electronic component which passed the rail 422 is supplied to the guide groove 464.

The suction position adjusting unit 468 is a mechanism for adjusting the suction position of the electronic component in the support mechanism 424, and includes a position adjusting bracket 470, a rotation shaft 472, a fixing portion 474, Has a screw 476. The positioning bracket 470 is a member disposed at a position blocking the guide groove 464, and a protrusion 480 is formed at an end of the rail 422 side. The positioning bracket 470 blocks the guide groove 464 so that the electronic component passing through the guide groove 464 moves downstream from the protrusion 480 in the moving direction of the electronic component. Support not to As a result, the positioning bracket 470 can hold the electronic component at a predetermined position of the guide groove 464. The rotation shaft 472 is an axis extending in the extending direction of the guide groove 464 and is fixed to the fixed portion 474 in a rotatable state. The rotation shaft 472 supports the position adjustment bracket 470 in a state capable of moving in the extending direction of the guide groove 464 and in a state rotatable about an axis extending in the extension direction of the guide groove 464. have. The fixing part 474 is fixed to the base 460.

The screw 476 is a member for fixing the positioning bracket 470 to the fixed portion 474, and the screw 476 is inserted into the elongated hole 482 formed in the positioning bracket 470. The long hole 482 is a hole whose extension direction of the guide groove 464 becomes a longitudinal direction. The suction position adjusting unit 468 fixes the positioning bracket 470 with respect to the fixed portion 474 with a screw 476, so that the suction position adjusting unit 468 is movable in the extension direction of the guide groove 464 with respect to the fixed portion 474. The position and the position adjustment bracket 470 which are rotatable about the axis extended in the extension direction of the guide groove 464 are fixed.

The suction position adjusting unit 468 has the above configuration, and as shown in FIGS. 57A and 57B, the electronic component is fixed by fixing the positioning bracket 470 to the fixing portion 474 with the screws 476. The support mechanism 424 can be supported at a predetermined position. In addition, the suction position adjusting unit 468 separates the screw 476 from the position adjusting bracket 470, as shown in Figs. 58A and 58B, so that the guide groove 464 is downstream in the electronic component moving direction. The side end 490 can be opened. Thereby, the electronic component supplied to the rail 422 and the guide groove 464 can be discharged | emitted from the front end of the guide groove 464, ie, the downstream end part in the moving direction of an electronic component. In this way, when the electronic component is a mechanism capable of discharging from the tip of the guide groove 464, the electronic component remaining in the rail 422 or the guide groove 464 when the bowl 420 is replaced and the electronic component to be supplied is changed. Can be simply discharged.

The electronic component supply apparatuses 402, 404, 406 allow the positioning bracket 470 to be movable in the extension direction of the guide groove 464 with respect to the fixing portion 474, and fixed with screws 476. By making the structure to make it easy, the position of the positioning bracket 470 in the extension direction of the guide groove 464 can be adjusted easily. Thereby, the position which supports an electronic component can be changed according to the kind of electronic component. That is, the position of the protrusion 480 can be adjusted in accordance with the suction position of the electronic component. Accordingly, even when the type of electronic component to be supplied is changed, the electronic component can be supported at an appropriate suction position.

In addition, the electronic component supply apparatuses 402, 404, and 406 configure the bowl 420 and the support mechanism 424 as described above to facilitate the replacement of the bowl 420, and to retain the electrons remaining at the time of replacement. The parts can be easily ejected. Thereby, the kind of electronic component to be supplied by the electronic component supply apparatuses 402, 404, and 406 can be easily changed.

Next, the drive unit 408 will be described with reference to FIGS. 52 to 54 and FIGS. 59 to 64. FIG. 59 is a top view illustrating a schematic configuration of a drive device of the electronic component supply device of the component supply unit shown in FIG. 53. FIG. 60 is a perspective view showing a schematic configuration of the drive unit shown in FIG. 59. FIG. 61 is an enlarged top view showing an enlarged schematic structure of the drive device shown in FIG. 59. FIG. 62 is a side view illustrating a schematic configuration of the drive unit shown in FIG. 59. FIG. 63 is a side sectional view showing a schematic configuration of the drive unit shown in FIG. 59; FIG. 64 is an explanatory diagram for explaining the operation of the driving apparatus shown in FIG. 59.

59 to 62, the drive device 408 includes a motor 430, a shaft 432, a linear way 433, an attachment block portion 434, a rail support portion 502 and And a base rail 504, a fixing part 506, and a rotating part 508.

59 to 63, the motor 430 is a drive source of the drive device 408, and includes a motor main body 550, an eccentric shaft 552, a bearing 554, and a linear way 556. Has As for the motor 430, the eccentric shaft 552 rotates by the motor main body 550 rotating the shaft 550a. The rotation force is transmitted to the motor 430 through the eccentric shaft 552 and the bearing 554, and the linear way 556 is rotated.

59 to 63, the shaft 432 is supported in a rotatable state by the bearings 562 and 564 fixed to the fixed portion. In addition, the bearings 562 and 564 are supported by the collar 566 connected to the shaft 432 in the state which does not move in a perpendicular direction.

The linear way 433 is supported in a state in which the vicinity of one end is rotatable to the outer end of the linear way 556, and the vicinity of the other end is fixed to the attachment block portion 434. The linear way 433 is supported by the shaft 432 in a rotatable state. Here, in the linear way 433 and the linear way 556, the linear way 433 becomes a rail unit, and the linear way 556 becomes a slide unit. Thereby, the linear way 433 is connected in the state which the connection position with respect to the linear way 556 is movable. That is, the position where the linear way 433 is connected with the linear way 556 is fluctuate | varied. With this configuration, the linear way 433 is rotated around the axis 432 by the rotation of the linear way 556.

The attachment block portion 434 is supported by the shaft 432 in a rotatable state and is connected to the linear way 433. The attachment block portion 434 and the linear way 433 are connected by the connecting member 570. The attachment block portion 434 is a long narrow plate-like member extending in the horizontal direction orthogonal to the extending direction of the linear way 433, and an end portion thereof is connected to the rail support portion 502. In the attachment block portion 434, the upper surface of the plate-shaped member connected to the linear way 433 is connected to the connection portion 436. In addition, the attachment block portion 434, the same member as the long narrow plate-like member that is connected to the linear way 433 is disposed at the position connected to each connection portion 436, the upper surface is connected to the connection portion 436 It is. 52 and 53, the attachment block portion 434 is provided with a rod portion extending in the vertical direction, and the rod portion is connected to the end of the long narrow plate-shaped member. Accordingly, the attachment block portion 434 and the long narrow plate-shaped member connected to the connecting portion 436 rotate integrally with the shaft 432 as the rotation axis.

The rail support part 502 is connected with the edge part of the attachment block part 434. One end of the base end rail 504 is connected to the rail support 502, and the other end thereof is connected to the rail 422. In the base rail 504, the rotational movement of the attachment block portion 434 is converted into a linear movement by the rail support portion 502 and transmitted. In addition, the base rail 504 is connected to the electronic component supply part of the bowl 420 to guide the electronic component supplied from the bowl 420 to the rail 422. The fixed part 506 is fixed to the non-moving part of the drive device 408, that is, the foundation. The rotation part 508 is supported by the fixed part 506 so that rotation is possible. The rotation part 508 has the fixed end 520 supported by the fixed part 506 so that rotation is possible, and the movable end 522 which is a connection part between the base rail 504 and the rail 422. As shown in FIG. The pivoting part 508 is connected with the connection part between the base rail 504 and the rail 422 by the movable end 522, and restrict | limits the movement area of the connection part between the base rail 504 and the rail 422.

The drive device 408 has the above configuration, and as shown in FIG. 64, the motor 430 is a drive source, transmits a driving force to the linear way 433, and rotates it. In addition, the attachment block portion 434 is fixed in a rotatable state by the shaft 432, and rotates about the rotation axis of the shaft 432 by the rotation of the linear way 433. The rotation of the attachment block portion 434 is transmitted to the rail support portion 502. The rail supporter 502 converts the driving force in the rotational direction of the attachment block portion 434 into the driving force in the linear direction to reciprocate the base rail 504 in a direction parallel to the extending direction of the rail. At this time, the pivoting portion 508 provided at the connection portion between the base rail 504 and the rail 422 is a movable end that is a connection portion between the base rail 504 and the rail 422 around the fixed end 520. 522 is rotated. In this way, the drive device 408 vibrates the attachment block portion 434 and the base rail 504, so that the bowl 420 attached to the attachment block portion 434 through the connection portion 436, and the base portion. However, the rail 422 connected to the rail 504 is vibrated. The bowl feeder unit 400 vibrates the bowl 420 by the driving device 408 to move the electronic components put into the bowl 420 in the bowl 420 and to supply the rail 422. Further, the bowl feeder unit 400 vibrates the rails 422 by the drive device 408, thereby supplying the electronic components guided through the rails 422 to the support mechanism 424.

As described above, the bowl feeder unit 400 can effectively utilize a horizontal area by stacking the bowls of the component supply apparatuses 402, 404, and 406 in the vertical direction, thereby providing a plurality of component supply apparatuses in space. It can be deployed efficiently. As a result, the bowl feeder unit 400 can supply a plurality of electronic components to the suction position. In addition, the bowl feeder unit 400 can arrange | position the support mechanism 424 closely in a horizontal direction by stacking the bowl of the component supply apparatuses 402, 404, 406 in a perpendicular direction as mentioned above. As a result, the suction position of the electronic component can be brought closer, and the moving distance of the head during the component suction can be shortened. In addition, the bowl feeder unit 400 can reduce the drive source by using one drive device 408 as the drive unit of the three component supply devices 402, 404, 406, thereby simplifying the device configuration. have. Moreover, by supporting the rotating shafts of the component supply apparatuses 402, 404, 406 by the fixing part 410, each part can be vibrated stably. Moreover, although the bowl feeder unit 400 of the said embodiment made three parts supply apparatuses, the number of parts supply apparatuses is not limited to this.

In addition, in this embodiment, although the drive mechanism which vibrates the bowl 420 was used as a drive part of the bowl feeder unit 400, it is not limited to this. The electronic component supply apparatus (bowl feeder) which comprises the bowl feeder unit 400 only needs to be able to supply the electronic component 80 to the rail 422 by vibrating the bowl 420. For example, a drive that swings the bowl 420 may be used as the drive.

65 is an enlarged perspective view of a part of the electronic component supply apparatus. As shown in FIG. 65, the component supply apparatuses 402, 404, and 406 of the bowl feeder unit 400 have a starting end for detecting the presence or absence of electronic components at the bowl 420 side end of the rail 422. As shown in FIG. Side component detection sensors 580a, 580b, and 580c. The start end side component detection sensors 580a, 580b, and 580c detect whether there is an electronic component at the bowl 420 side end portion of the rail 422. A laser sensor can be used as the start end side component detection sensors 580a, 580b, and 580c. The bowl feeder unit 400 detects whether there are electronic components at the bowl 420 side end portion of the rail 422 by the start end side component detection sensors 580a, 580b, and 580c, so that the electronic components are connected to the rail 422. It can stay and detect whether it is full. For example, the bowl feeder unit 400, when the state where the electronic component is detected by the start end component detection sensors 580a, 580b, 580c continuously detected for a predetermined time, the electronic component stays at a predetermined position, Since it is a state which does not progress ahead of the rail 422, it can determine with a full state.

66 is an enlarged perspective view of a part of the electronic component supply apparatus. As shown in FIG. 66, the component feeder 402, 404, 406 of the bowl feeder unit 400 is a holding position side which detects the presence or absence of the electronic component of the front end (suction position, holding position) of the rail 422. As shown in FIG. Component detection sensors 582a, 582b, and 582c. The holding position side component detection sensors 582a, 582b, and 582c detect whether there is an electronic component in the holding position which is the tip side of the corresponding rail 422. The holding position side component detection sensor 582a is an optical sensor having a light emitting portion 584a and a light receiving portion 586a. The light emission part 584a and the light reception part 586a are arrange | positioned at the position which sandwiches a holding position by both. When the measurement light output from the light emitting portion 584a is received by the light receiving portion 586a, the holding position side component detection sensor 582a detects that there is no electronic component in the measurement area (holding position in this embodiment). The holding position side component detection sensor 582a detects the presence of an electronic component in the measurement area (holding position in this embodiment) when the measurement light output from the light emitting portion 584a is not received by the light receiving portion 586a. . Similarly, the holding position side component detection sensor 582b is also an optical sensor having a light emitting portion 584b and a light receiving portion 586b, and the holding position side component detecting sensor 582c is also a light emitting portion 584c and a light receiving portion 586c. It is an optical sensor having. The holding position side component detection sensors 582a, 582b, and 582c detect the presence or absence of electronic components by the same configuration. The bowl feeder unit 400 detects the presence or absence of an electronic component in the holding position by the holding position side component detection sensors 582a, 582b, and 582c, and drives the bowl feeder unit 400 based on the detection result. When the bowl feeder unit 400 determines that there are no electronic components at the holding position, for example, by the holding position side component detection sensors 582a, 582b, and 582c, the bowl feeder unit 400 drives the driving device 408 to convey the electronic components. do.

In addition, when the electronic component mounting apparatus 10 performs the operation of holding the electronic component in the holding position of the bowl feeder unit 400 by the nozzle 32 of the head 15, the holding position side component detection sensor 582a. When it is detected that there is an electronic component in the holding position by 582b and 582c, the holding operation for holding the electronic component in the holding position is performed and held by the holding position side component detection sensors 582a, 582b and 582c. When it is detected that there is no electronic component in the position, you may wait. Thereby, the electronic component mounting apparatus 10 can hold | maintain an electronic component more reliably, and can suppress that a holding operation is performed when there is no electronic component in a holding position. As a result, the electronic component mounting apparatus can more efficiently perform the holding operation of the electronic component.

67A is an enlarged perspective view of a part of the electronic component supply apparatus. 67B is a perspective view showing a part of the electronic component supply device shown in FIG. 67A from another direction. For reference, in FIG. 67A and FIG. 67B, the component supply apparatus 402 of the bowl feeder unit 400 is shown, The component supply apparatuses 404 and 406 are also the same structure. The component supply apparatus 402 is vertically upper side (arrow 591) to the rail 422 side edge part of the base rail 504 to which the electronic component of the bowl 420 connects the bowl 420 and the rail 422. Direction) has an air blow portion 590 for injecting air. The air blow part 590 injects the air in the direction of an arrow 591 to the rail 422 side edge part of the base rail 504, and returns the electronic component in the said position to the bowl 420. FIG.

In the base rail 504, the guide part 592 is arrange | positioned at the connection part with the bowl 420. As shown in FIG. The guide part 592 guides the electronic component of the electronic component conveyed from the bowl 420 to the base rail 504 in the bowl 420 which is not a proper direction. That is, the guide part 592 prevents the electronic component conveyed in the inappropriate direction among the electronic components conveyed by the base rail 504 from entering the base rail 504. Specifically, in the guide part 592, a plate-like member is disposed at a position where the leads of an electronic component in an inappropriate direction come into contact with each other, and guide the electronic component in contact with the lead to the bowl 420.

In the base rail 504, a drop portion 594 is formed above the vertical direction of the region where the air is blown by the air blow portion 590. FIG. The drop portion 594 is disposed outside the base rail 504 (side away from the bowl 420), and is inclined close to the bowl 420 as it is directed upward in the vertical direction. In the drop part 594, air is injected by the air blow part 590 to guide the electronic component pushed upward in the vertical direction to the bowl 420 side by tilting. Thereby, it can suppress that an electronic component protrudes out of the bowl 420. FIG.

As shown in FIGS. 67A and 67B, the component supply device 402 installs an air blow part 590 to return the electronic component moved toward the rail 422 to the bowl 420, thereby providing the electronic component. May be appropriately guided to the rail 422. For example, the component supply device 402 may periodically return the electronic component at the target position to the bowl 420 by periodically performing air blowing by the air blow unit 590. Thereby, the electronic component which is conveyed while being inclined with respect to the rail 422 and is not carried into the rail 422 in the target area can be excluded. In addition, the component supply apparatus 402 can also exclude the electronic component whose direction is not suitable by the guide part 592 by the air blow part 590. FIG. For reference, in this embodiment, although the air blow part 590 is provided as a mechanism which returns the electronic component of the base rail 504 which is the start end of the rail 422 to the bowl 420, it is not limited to this. . For example, a mechanical mechanism may be used instead of the air blow part 590.

Next, operation | movement of each part of an electronic component mounting apparatus is demonstrated. For reference, the operation of each part of the electronic component described below can be executed by controlling the operation of each part based on the control device 20.

68-74, the shape recognition operation | movement of the electronic component of an electronic component mounting apparatus is demonstrated. It is explanatory drawing for demonstrating the shape recognition operation | movement of the electronic component of the electronic component mounting apparatus. It is explanatory drawing for demonstrating the shape recognition operation | movement of the electronic component of the electronic component mounting apparatus. It is explanatory drawing for demonstrating the shape recognition operation | movement of the electronic component of the electronic component mounting apparatus. 71 is an explanatory diagram for explaining the shape recognition operation of the electronic component of the electronic component mounting apparatus. It is explanatory drawing for demonstrating the shape recognition operation | movement of the electronic component of the electronic component mounting apparatus. 73 is a schematic diagram illustrating an example of a detection result of the recognition operation. 74 is a schematic diagram illustrating an example of a detection result of the recognition operation.

The electronic component mounting apparatus 10 measures the shape of an electronic component using the laser recognition apparatus 38 as mentioned above. As shown in FIG. 68, the laser recognition device 38 outputs laser light from the light source 38a in a state where the electronic component 80 is disposed between the light source 38a and the light receiving element 38b. By detecting the laser light reaching the light receiving element 38b, the shape of the component disposed between the light source 38a and the light receiving element 38b is detected. In addition, when the laser recognition apparatus 38 detects the shape of one direction of the electronic component 80 adsorbed by the nozzle 32, the nozzle driver 34 moves or rotates the nozzle 32 to rotate the electronic component 80. ) Is moved or rotated to detect the shape again. As described above, the laser recognition device 38 rotates the electronic component 80 so that the laser light is irradiated to the electronic component 80 and the light receiving element for the electronic component 80 as shown in FIG. 69. The angle of 38b is changed.

As shown in FIG. 70, the electronic component mounting apparatus 10 adjusts the height in the Z-axis direction of the electronic component 80 in step S11, and the laser recognition apparatus 38 includes the light source 38a and the light receiving element ( In the state where the electronic component 80 is disposed between 38b), laser light is irradiated to a constant region from the light source 38a. Then, the electronic component mounting apparatus 10 starts rotation (rotation of (theta) direction) of the electronic component 80 in step S12.

After that, when the rotational speed of the electronic component 80 reaches a constant speed, the electronic component mounting apparatus 10 starts measuring the shape of the electronic component 80 in the predetermined direction by the laser recognition device 38 in step S13. do. At this time, the laser recognition device 38 irradiates laser light to a predetermined region from the light source 38a in a state where the electronic component 80 is disposed between the light source 38a and the light receiving element 38b. The laser light is received by 38b). Here, the laser light blocked by the electronic component 80 does not reach the light receiving element 38b or the intensity is lowered. Thereby, the laser recognition apparatus 38 can detect the shape of the electronic component 80 in the cross section of the measured angle through the distribution of the laser light received by the light receiving element 38b. . In this embodiment, the laser recognition apparatus 38 detects the edge part of the laser beam received by the light receiving element 38b, and detects the outermost shape of the electronic component 80 in the said direction. In step S14, the electronic component mounting apparatus 10 repeats the shape detection of the electronic component 80 by the method of step S13 while rotating the electronic component 80, whereby the electronic component 80 is rounded by one circumference. The shape of the minute is detected. Thereby, the shape of all the directions of the electronic component 80 can be detected. As described above, the laser recognition device 38 detects shapes from one direction, and overlaps the detection results of the shapes in each direction, as shown in FIG. (Shape of outermost part) can be detected correctly.

Here, as mentioned above, the electronic component mounting apparatus 10 of this embodiment mounts the electronic component 80 which is a radial lead-type electronic component on the board | substrate 8. As shown in FIG. When the electronic component mounting apparatus 10 detects the shape of the electronic component 80 shown in FIG. 72, the shape detected differs according to the height of the Z-axis direction to measure. That is, as shown in FIG. 72, the laser recognition apparatus 38 of the electronic component mounting apparatus 10 performs the detection in the line A, the detection in the line B, in the line C. As shown in FIG. In the case of performing the detection, in the case of performing the detection in the line D, the shapes to be detected are different.

For example, if the laser recognition apparatus 38 measures the shape in the line A shown in FIG. 72, the laser recognition apparatus 38 can detect the shape of the main body 82 of the electronic component 80, as shown in FIG. In addition, if the laser recognition apparatus 38 measures the shape in the line B shown in FIG. 72, the shape of the lead 84 of the electronic component 80 can be detected as shown in FIG. For reference, since the laser recognition device 38 detects the shape of the outermost part of the measurement height of the electronic component, the outermost portions of the electronic components (the outermost lead 84) are mutually formed as the shape of the electronic component. The connected shape is detected. Moreover, when the laser recognition apparatus 38 measures the shape in the line C shown in FIG. 72, the laser recognition apparatus 38 can detect the shape of the lower surface position of the main body 82, and the line D shown in FIG. When the shape is measured, the shape of the lower surface position of the lead 84 can be detected. The electronic component mounting apparatus 10 adjusts the height in the Z-axis direction of the nozzle 32 that adsorbs the electronic component 80, whereby the laser recognition device 38 measures the shape of the electronic component 80. Can be in various positions.

It is explanatory drawing for demonstrating the shape recognition operation | movement of the electronic component of the electronic component mounting apparatus. In addition, the electronic component mounting apparatus 10 may use the electronic component 80a shown in FIG. 75 as an electronic component which is a radial lead type electronic component. The notch 89 is formed in a part of the main body 82a of the electronic component 80a. The part in which the notch 89 is formed in the electronic component 80a becomes a shape different from other electronic components. In addition, the electronic component 80a can determine the direction by the position where the notch 89 is formed.

Here, in the control part 60 of the electronic component mounting apparatus 10 of this embodiment, the operator (the position of the electronic component in the Z-axis direction) with respect to the electronic component which mounts, ie, the electronic component adsorb | sucked with the nozzle, is operated by an operator. When set in advance, the laser recognition device 38 detects the shape of the electronic component at the position set by the operator. Thus, the electronic component mounting apparatus 10 can measure the shape of an electronic component based on the position set by the operator, and can make the characteristic shape part of an electronic component into a measurement position, and identifies the kind of electronic component, and The direction detection of parts can be performed with higher precision.

For reference, the electronic component mounting apparatus 10 has been described in the case of recognizing the shape of the electronic component using the laser recognition device 38, but is not limited thereto. As the state detection part, the electronic component mounting apparatus 10 may use the camera (VCS unit 17 of this embodiment) which measures the shape of the electronic component supported by the housing 11 in three dimensions. Moreover, you may use the camera which measures the shape of well-known electronic components other than VCS in three dimensions. The same process can be performed by measuring the space | interval of the lead end part of the electronic component which is a measurement object, the bent shape of a lead, the shape of a component main body, etc. with the camera which measures the shape of an electronic component three-dimensionally.

76 is a flowchart showing an example of the operation of the electronic component mounting apparatus. Referring to FIG. 76, the overall processing operation of the electronic component mounting apparatus 10 will be schematically described. For reference, the process shown in FIG. 76 is executed by the control device 20 controlling each part. The electronic component mounting apparatus 10 reads a production program as step S52. The production program is created by a dedicated production program preparation device or by the control device 20 based on various input data.

If the electronic component mounting apparatus 10 reads a production program in step S52, it detects the state of an apparatus as step S54. Specifically, the configuration of the component supply units 14f and 14r, the kind of the electronic component being charged, the kind of the prepared nozzle, and the like are detected. The electronic component mounting apparatus 10 detects the state of the apparatus in step S54, and when preparation is completed, carries in a board | substrate as step S56. When the electronic component mounting apparatus 10 loads a board | substrate in step S56, and arrange | positions a board | substrate in the position to mount an electronic component, it mounts an electronic component on a board | substrate in step S58. The electronic component mounting apparatus 10 carries out a board | substrate as step S60, when mounting of an electronic component is completed in step S58. When the electronic component mounting apparatus 10 carries out a board | substrate in step S60, it determines whether production is complete | finished as step S62. If it is determined in step S62 that the production is not finished (No), the electronic component mounting apparatus 10 proceeds to step S56 and executes the processing of steps S56 to S60. That is, based on the production program, a process of mounting an electronic component on a substrate is executed. The electronic component mounting apparatus 10 ends this processing, when it is determined in step S62 that the production is finished (Yes).

The electronic component mounting apparatus 10 can manufacture the board | substrate with which the electronic component was mounted by mounting a electronic component on a board | substrate after reading a production program and making various settings as mentioned above. In addition, the electronic component mounting apparatus 10 mounts a lead-type electronic component having a main body and a lead connected to the main body as a electronic component on a substrate, specifically, inserting the lead into a hole (insertion hole) formed in the substrate. As a result, the electronic component can be mounted on a substrate.

77 is an explanatory diagram showing an example of an operation screen. 78 is an explanatory diagram showing a part of the operation screen. 79A is an explanatory diagram showing an example of a component supply angle. 79B is an explanatory diagram showing an example of a component supply angle. 80 is an explanatory diagram showing an example of an operation screen. 81 is an explanatory diagram showing an example of an operation screen. 82 is an explanatory diagram showing a part of the operation screen. 83A to 83D are explanatory diagrams each showing an example of a measurement position of an electronic component.

Below, an example of the process of registering various information of the electronic component to be mounted in the electronic component mounting apparatus 10 is demonstrated, referring FIGS. 77-83D. The electronic component mounting apparatus 10 determines various values of mounting processing based on the production program based on the registered electronic component information, and mounts the electronic component based on the determined values. For reference, various pieces of information of an electronic part may be registered as part of a production program, or may be registered as information of a group of electronic parts common to a plurality of production programs.

The electronic component mounting apparatus 10 causes the display unit 42 (touch panel 42a or vision monitor 42b) to display the operation screen 602 shown in FIG. The operation screen 602 displays various input items. The operator can input the information of the electronic component by performing various operations while the operation screen 602 is displayed. In addition, although FIG. 77 shows the screen which inputs the information of an electronic component as component data, the electronic component mounting apparatus 10 can also input board | substrate data, mounting data, adsorption data, and vision data.

In the operation screen 602 shown in FIG. 77, an input item 604 for inputting a component type of an electronic component and an input item 606 for inputting a component attitude are displayed. In addition, the operation screen 602 is an item for inputting an external size including the width, length, height, and lead length of an electronic component, and whether the laser (laser recognition device 38) is used as a centering method. 17)), an item for selecting whether to use, an item for inputting a package size (body size of the electronic component), and the like. In addition, the operation screen 602 displays tabs for displaying detailed items such as component posture, centering, additional information, expansion, and inspection. In addition, the operation screen 602 of this embodiment is a detailed item of a component attitude | position, The input item 608 of the component provision angle which shows the angle of the electronic component supplied to a holding position, the input item of a tape type, and the electronic component An input item of pitch information indicating the arrangement pitch is included.

Here, the input item 604 is an item for inputting the type of electronic component to be registered. When an item is selected, a list 610 of selections is displayed in pull-down as shown in FIG. 78. . In addition to the types of various electronic components, the list 610 displays options of inserting components and other components. The operator can input information into the input item 604 of the component type by adjusting the cursor 612 to the desired selection and performing a determination operation.

The input item 608 is a component providing angle indicating the angle of the electronic component supplied to the holding position to be input, and can be selected from 0 °, 90 °, 180 °, 270 °, and the like. For example, as shown in FIG. 79A, when the target electronic component is the electronic component 614, the postures of which the electronic component 614 is rotated by 90 degrees are 0 degrees, 90 degrees, 180 degrees, and 270 degrees, respectively. Becomes The operator inputs an angle into the input item 608 based on what attitude the posture when the electronic component 614 is supplied to the holding position of the electronic component supply apparatus becomes. On the other hand, the reference position of the angle of the electronic component 614 can be set by the operator.

In the electronic component mounting apparatus 10, as shown in FIG. 79B, the electronic component 616 may be held in a state inclined at a predetermined angle with respect to the tape 618. Here, the electronic component 616 is a film capacitor. If the posture does not correspond to any of 0 °, 90 °, 180 °, and 270 ° like the electronic part 616, the operator inputs the angle of the electronic part 616 to the other. Here, when holding the electronic component 616, it is preferable that the head 15 uses the holding nozzle which hold | maintains by holding the electronic component 616 as the nozzle 32. As shown in FIG. When the electronic component mounting apparatus 10 holds the electronic component 616 by using the grip nozzle, the contact surface of the grip nozzle is adjusted by adjusting the angle of the nozzle based on the component providing angle input to the guitar of the input item 608. Can be set at an angle corresponding to the inclination of the electronic component 616, thereby reducing the occurrence of holding errors.

The electronic component mounting apparatus 10 performs additional information by the operation unit 40 in a state where the operation screen 602 shown in FIG. 77 is displayed on the display unit 42 (touch panel 42a or vision monitor 42b). When the tap is selected, a part of the operation screen 602 is displayed on the operation screen 620 shown in FIG. The operation screen 620 includes an input item 622 of the mounted press amount and an input item 624 of the suction press amount. In addition, the operation screen 620 also includes a selection item of preliminary operation, confirmation of part release by the sensor, correction of the suction position of the part, automatic teaching, or skipping of the part. Is indicated. Moreover, the item of the part disposal which inputs the processing method of an electronic part in the case of discarding a part (when it is determined that a part is not mountable) is also displayed.

The input item 622 is an item which sets the dimension which presses an electronic component from a board | substrate upper surface at the time of mounting. "0" is a value at which the distance between the electronic component and the substrate becomes 0 in the design value. When the numerical value increases in the positive direction, the electronic component mounting apparatus 10 moves the electronic component to the pressed state in the vertical direction below the substrate. By setting the press amount, it is possible to restrain the component from slipping on the cream solder during mounting because the component is mounted in a state in which the component does not reach the substrate by the influence of the flatness of the substrate or the like. On the other hand, in order to more reliably mount an electronic component on a board | substrate, it is preferable to make initial value a positive value, for example, 0.5 mm.

The input item 624 is a press amount during component holding. That is, the item sets the distance between the nozzle and the electronic component when the nozzle holds the electronic component at the holding position of the electronic component supply apparatus. "0" is a value at which the distance between the electronic component and the holder of the nozzle becomes 0 in the design value. When the numerical value increases in the positive direction, the electronic component mounting apparatus 10 moves the nozzle until it is pressed downward in the vertical direction than the electronic component. By setting the press amount, the nozzle does not reach the electronic part due to the variation of the part size (height), etc., so that it is impossible to adsorb or grip the part, or the phenomenon such as standing of the chip-shaped electronic part occurs. It can be suppressed. On the other hand, in order to more reliably hold the electronic component with the nozzle, the initial value is preferably a positive value, for example, 0.2 mm.

In addition, the operation screen 620 displays the input items of the component layer. The input item of the component layer is an item for setting the priority for each component in the same mounting layer. By setting this item, it is possible to set the priority of the mounting order of the electronic component when producing in the optimization order.

Moreover, the operation screen 620 displays the input item of gripper nozzle data. Here, a gripper nozzle is a holding nozzle holding and holding an electronic component. The pressurization position is a position which pressurizes an electronic component at the time of holding. Horizontal clearance (clearance) is an item for inputting the clearance between the pressing surface of the holding side arm of the gripping nozzle and the component negatively. The nozzle direction at the time of suction is an item which inputs the nozzle direction at the time of suction, when a component is supplied with 0 degree | times. The fine adjustment value of a suction height is an item which inputs the offset value of the holding height (suction height) at the time of holding.

The electronic component mounting apparatus 10 is extended by the operation part 40 in the state which displayed the operation screen 602 shown in FIG. 77 on the display part 42 (touch panel 42a or vision monitor 42b). When the tab is selected, the operation screen 630 shown in FIG. 81 is displayed on a part of the operation screen 602. The operation screen 630 displays items for setting various conditions for the detection processing of the state of the electronic component executed by the laser recognition apparatus 38. The operation screen 630 includes an input item for setting the moving speed of the nozzle, an input item 632 for laser height, and an input item 634 in the shape of a part. Here, (theta) velocity (time of measurement) is an item which inputs the acceleration of the (theta) axis of a nozzle at the time of laser recognition, and (theta) velocity (outside of measurement) is a rotation after laser centering, for example, to make a mounting angle. This item inputs the acceleration of the θ axis of the nozzle in the case of rotation or the like.

The input item 632 is an item for inputting a distance from the tip of the nozzle at the time of measurement to the laser irradiation surface. The input item 634 is an item for inputting the shape of the electronic component to be measured. As shown in Fig. 82, the input item 634 is designated by the cursor 638 in the list 636 in which the selection is displayed, and the component shape information is input. . When the shape of the electronic component is recognized by the laser recognition device 38 by inputting the shape of the component, specifically, the shape of the main body of the electronic component in the input item 634, a feature point for determining whether the electronic component is the specified electronic component is specified. You can do it. For example, when the input item 634 is input with no edge notch, four vertices are detected. In the case of the electronic components 640 and 641 shown in FIG. 83A, the positions of four vertices 1 to 4 are detected, respectively. Thereby, position shift and angle shift can be detected. In addition, when the input item 634 is inputted with edge notch, five to eight vertices are detected. In the case of the electronic component 642 shown in Fig. 83B, the positions of the six vertices 1 to 6 are detected. In the case of the electronic component 643 shown in FIG. 83B, the positions of eight vertices 1 to 8 are detected. Thereby, position shift and angle shift can be detected. When the PLCC is input to the input item 634, eight vertices are detected. In the case of the electronic component 644 shown in Fig. 83C, the positions of eight vertices 1 to 8 are detected. In the case of PLCC, the position shift and the angle shift can be detected using four points from the detected eight vertices. In addition, when flexible is input to the input item 634, eight points of the vicinity which the component width of a XY direction becomes minimum are detected. In the case of the electronic components 646 and 647 shown in FIG. 83D, the positions of eight points 1 to 8 are detected. In the case of the electronic component 643 shown in FIG. 83D, the positions of the eight vertices 1 to 8 are detected. Thereby, position shift and angle shift can be detected.

The electronic component mounting apparatus 10 can display the operation screens 602, 620, 630, etc. as mentioned above, and can acquire various information regarding an electronic component. The electronic component mounting apparatus 10 can mount an electronic component suitably on a board | substrate by performing the mounting process of an electronic component based on the various information regarding the acquired electronic component. In addition, the electronic component mounting apparatus 10 provides various input items adapted to leadless electronic components (mountable electronic components) without leads and lead-type electronic components (insertable electronic components) having leads to be inserted into the board. The processing according to each electronic component can be executed. For example, the electronic component mounting apparatus 10 can input an insertion component indicating that it is an insertion type electronic component for each component type. Accordingly, the electronic component mounting apparatus 10 detects the type of the component to determine whether it is a mounted electronic component or an insert-type electronic component, that is, whether or not the lead is inserted into a hole (insertion hole) of the substrate during mounting. Can be detected).

84 and 85, a recognition operation on the shape of the electronic component will be described. 84 and 85 are flowcharts each showing an example of the operation of the electronic component mounting apparatus. The processing shown in FIG. 84 and FIG. 85 is performed by the control part 60 controlling the operation | movement of each part.

The process shown in FIG. 84 is a process of setting the position which measures the shape of an electronic component. Here, the control part 60 may perform the process shown in FIG. 84 every time when measuring the shape of an electronic component, and it performs for every electronic component at the time of setting the mounting operation | movement of the electronic component with respect to a board | substrate. In the actual mounting process of the electronic component, the measurement of the shape may be performed based on the result of the execution (the setting result of the measurement position) previously determined.

The control part 60 determines whether there exists a setting of a measurement position in step S112. Here, the setting of the measurement position refers to the information of the position at which the shape set by the operator is measured with respect to the target electronic component, and an input value of the laser height on the operation screen. If it is determined in step S112 that the setting has been made (Yes), the control unit 60 sets the measurement position based on the setting as step S114, that is, the measurement position set by the operator is determined as the measurement position of the electronic component. Is set, and the process ends. In addition, when it determines with no setting in step S112 (No), the control part 60 sets a reference position to a measurement position in step S116, and complete | finishes this process. Here, the reference position is a reference measurement position set by the category of the electronic component, that is, whether it is a capacitor or an IC chip.

The electronic component mounting apparatus 10 can set the measurement position by an operator in this way, and can make the position which the operator set arbitrarily as a measurement position. In addition, the electronic component mounting apparatus 10 can set the measurement position of one electronic component in multiple numbers. For example, in the case of a radial lead type electronic component, the shape of two places, a main body and a lead, can also be measured. Moreover, when the measurement position is set, the electronic component mounting apparatus 10 acquires the information of the shape in the said measurement position of the said electronic component based on a setting. In addition, the shape information may use the result measured using the laser recognition apparatus 38, or may use the shape data of the said electronic component input by the operator.

Next, the process shown in FIG. 85 is a process before mounting of an electronic component, specifically, the determination process based on the measurement process of the shape of an electronic component, and a measurement result. In addition, the control part 60 performs all the electronic components which hold | maintain the process of FIG. The control unit 60 acquires data of the electronic component to be held in step S120. Here, the data of the electronic parts to be held (adsorption targets and gripping objects) are various pieces of information necessary for mounting the electronic parts on the substrate. The data of the electronic component to be maintained includes the position of the component supply device 100 in which the electronic component is held, the shape data of the electronic component, the adsorption height (holding height) of the electronic component, and the electronic component with the laser recognition device 38. Information of the measurement position to be measured.

If the control part 60 acquired the data in step S120, it determines a measurement position as step S122. That is, the control part 60 determines the position which detects the shape of an electronic component, ie, the position of the electronic component's Z-axis direction, based on the data acquired by step S120. In addition, the control part 60 may perform the process of step S120 and step S122 before adsorption | suction of an electronic component.

The controller 60 determines the measurement position in step S122, and adjusts the Z-axis position of the electronic component in step S124 when the electronic component is attracted by the nozzle. That is, the control part 60 moves the measurement position determined in step S122 of an electronic component to the measurement area of the laser recognition apparatus 38 by moving a nozzle to a Z-axis direction. If the Z-axis position of the electronic component was adjusted in step S124, the control unit 60 measures the shape of the electronic component in step S126. That is, the control part 60 detects the shape in the measurement position of an electronic component using the laser recognition apparatus 38. As shown in FIG.

If the control part 60 detects the shape in the measurement position of an electronic component in step S126, it determines whether it is measurement completion as step S128. That is, the control part 60 determines whether the measurement of the shape in the measurement position determined in step S122 is complete | finished. If it is determined in step S128 that the measurement is not finished (No), the control section 60 proceeds to step S124, performs the processing of steps S124 and S126 again, and determines the shape of the measurement position where the measurement is not finished. Measure it. The control part 60 detects the shape of the set measurement position by repeating adjustment of the position of an electronic component and measurement of a shape in this way.

If it is determined in step S128 that the measurement is finished (Yes), the control unit 60 compares the measurement result with the reference data as step S130. Here, the reference data is data of the shape of the electronic component that is the suction target (holding target) obtained in step S120. By comparing the measurement result with the reference data, the control unit 60 determines whether or not the electronic component adsorbed has a shape that matches the reference data, whether the direction of the electronic component matches the direction of the reference data, or the like.

If the control part 60 made the comparison in step S130, it determines with step S132 whether a component is appropriate. Specifically, the control part 60 determines whether the electronic component is adsorb | sucked in the state which can be mounted in step S132. If it is determined in step S132 that the component is not appropriate (No), the control unit 60 discards the electronic component adsorbed by the nozzle in step S134, and ends the present process. The control part 60 disposes an electronic component by moving a head and a nozzle to the position which faces the component storage part 19, and throws in the component storage part 19 the electronic component hold | maintained by the said nozzle. On the other hand, the control part 60 performs the process which mounts the same kind of electronic component in the same mounting position (mounting position) of a board | substrate again.

If it is determined in step S132 that the component is appropriate (Yes), the control unit 60 determines whether the component direction (direction in the rotational direction of the nozzle) is appropriate as step S136. That is, it is determined whether the adsorbed electronic component is the same as the reference direction. On the other hand, the control part 60 of this embodiment determines whether the electronic component is reversed in step S136. If it is determined in step S136 that the direction is not appropriate, that is, the electronic component is inverted (No), the controller 60 inverts the electronic component in step S138, and then proceeds to step S140.

The control unit 60 finely adjusts the mounting position (mounting position) of the electronic component on the basis of the holding position as step S140 when it is determined to be Yes in step S136 or when the processing of step S138 is executed. For example, based on the detection result of the shape of the electronic component, the position where the nozzle adsorbs the electronic component is detected, and the relative position of the nozzle and the substrate at the time of mounting is adjusted based on the shift of the holding position with respect to the reference position. . The control part 60 complete | finishes this process, after having performed the process of step S140. Moreover, when the process of step S140 of FIG. 85 is performed, the control part 60 mounts the determined electronic component on a board | substrate with the result of step S140.

The electronic component mounting apparatus 10 detects the shape of the electronic component using the laser recognition device 38 in this way and performs various kinds of processing based on the result, whereby the electronic component can be mounted on the substrate more appropriately. have.

Even if the electronic component mounting apparatus 10 discards the electronic component in step S134 of the flowchart shown in FIG. 85, and determines that the shape of the lead of the electronic component is inappropriate, the electronic component mounting apparatus 10 may execute a process of correcting the shape of the lead. It's okay. That is, in step S134, the lead of the electronic component may be corrected (processed) into an insertable shape without mounting the electronic component and mounted at the mounting position (mounting position). The electronic component mounting apparatus 10 may fix a lead of an electronic component with the mechanism which clamps the electronic component of the cutting unit of the electronic component supply apparatus 100, and corrects the lead of an electronic component with the correction mechanism provided separately. You can do it. Thus, as a processing means which processes the shape of a lead, various means, such as a mechanism which clamps the main body or lead of an electronic component, and the correction mechanism provided separately, can be used.

86 is a flowchart showing an example of the operation of the electronic component mounting apparatus. Hereinafter, with reference to FIG. 86, the recognition operation | movement of the state (shape) of the lead of an electronic component is demonstrated. For reference, the processing shown in FIG. 86 is partly the same processing as that of the electronic component using the laser recognition device 38 described above. In step S150, the electronic component mounting apparatus 10 adjusts the Z-axis position to move the shape of the lead to the measurement position. If the electronic component mounting apparatus 10 has moved the electronic component to the measurement position in step S150, the electronic component mounting apparatus 10 performs measurement by rotating the electronic component in step S152. In addition, the process of step S152 is the same as the process of FIG. 70 mentioned above. If the electronic component mounting apparatus 10 performed the measurement in step S152, it detects the outermost shape of a lead based on a measurement result as step S154. That is, the shape which connected the outer lead in the measurement position is detected.

When the electronic component mounting apparatus 10 detects the outermost shape of the lead in step S154, the electronic component mounting apparatus 10 rotates the direction of the electronic component in the set direction in step S156 to perform measurement in the set direction, that is, one fixed The measurement is performed in the direction, and in step S158, the number of leads is detected based on the measurement result, and the present process ends.

87A is explanatory drawing which showed an example of an electronic component. 87B is an explanatory diagram showing an example of the measurement result of the lead. 88A is an explanatory diagram showing an example of an electronic component. 88B is an explanatory diagram showing an example of the measurement result of the lead. When the electronic component mounting apparatus 10 measures the shape of the lead of the electronic component 670 shown in FIG. 87A, for example, in step S156, the electronic component mounting apparatus 10 performs measurement in the direction in which the laser light is irradiated in the front-rear direction of the paper. When the shape of the lead is measured in the direction shown in FIG. 87A, the waveform 673 shown on the screen 672 shown in FIG. 87B is detected as the measurement result. The waveform 673 decreases the output at the position where the lead is present. The electronic component 670 has five leads. For this reason, the waveform 673 detects five troughs at which the output is reduced.

Next, when the electronic component mounting apparatus 10 measures the shape of the lead of the electronic component 671 shown in FIG. 88A, the electronic component mounting apparatus 10 performs measurement in the direction in which the laser light is irradiated in the front-rear direction of the page in step S156. When the shape of the lead is measured in the direction shown in FIG. 88A, the waveform 675 shown on the screen 674 shown in FIG. 88B is detected as the measurement result. In the waveform 675, the output decreases at the position where a lead exists. The electronic component 671 has three leads. For this reason, the waveform 675 is detected by three low points in which the output is reduced.

In this way, the electronic component mounting apparatus 10 measures the shape by fixing the electronic component in a predetermined direction and analyzes the result, thereby adding the number of leads detected in the predetermined direction in addition to the outermost shape of the electronic component (pins). Can be detected). The electronic component mounting apparatus 10 can detect the number of leads in addition to the external shape of an electronic component by performing the process of FIG.

An example of the determination as to whether the electronic component which measured the shape is appropriate using FIG. 89 and FIG. 90 is demonstrated. That is, an example of the process performed in step S130, S132 of FIG. 85 is demonstrated. 89 is a flowchart showing an example of the operation of the electronic component mounting apparatus. 90 is an explanatory diagram showing a relationship between a lead and an insertion hole. The electronic component mounting apparatus 10 acquires the outermost shape of the lead of an electronic component as step S160. In addition, the outermost shape of a lead can be detected by the process of FIG. 86 mentioned above. If the electronic component mounting apparatus 10 acquired the shape in step S160, it determines with step S162 whether it matches with the electronic component mounted. That is, based on the characteristic point of the outermost shape of a lead, it is determined whether the electronic component hold | maintained by a nozzle is an electronic component which is a mounting object. In addition, when performing the determination of step S162, shapes other than the outermost shape of a lead, the shape of a main body, etc. may be compared.

The electronic component mounting apparatus 10 proceeds to step S166 when it is determined in step S162 that it matches the electronic component (Yes), and when it is determined that it does not match (No), it proceeds to step S169. . When it determines with Yes in step S162, the electronic component mounting apparatus 10 determines as step S166 whether the space | interval of outermost shape is contained in a permissible range. Specifically, the electronic component mounting apparatus 10 compares the detected outermost shape of a lead with the insertion hole of the board | substrate which inserts a lead, and the space | interval of the outermost shape of a lead is in the tolerance range of the space | interval of an insertion hole. Determine the acknowledgment.

Hereinafter, the permissible range in the case where the lead 684 of the electronic component 680 is inserted into each of the four insertion holes 682 arranged at the rectangular apex shown in FIG. 90 will be described. For reference, in FIG. 90, the vertical direction of the sheet is the Y direction, and the horizontal direction of the sheet is the X direction. Here, the diameter of the insertion hole 682 is dP, and the diameter of the lead 684 is dL. The distance in the X direction connecting the farthest position of the lead 684 of the design value is dA, and the distance in the Y direction connecting the farthest position of the lead 684 of the design value is dB.

In the example shown in FIG. 90, in the design value, each is arrange | positioned so that the center of the insertion hole 682 and the center of the lead 684 may overlap. In this case, the upper limit of the allowable range is a distance connecting the position of the insertion hole 682 at the furthest point. In other words, the upper limit value in the X direction is dC, which is the distance of the furthest point in the X direction of the insertion hole 682. The upper limit value in the Y direction is dD, which is the distance of the furthest point in the Y direction of the insertion hole 682. In addition, the lower limit of an allowable range becomes the distance which connected the furthest position of the lead 684 when it is inscribed in the position where the insertion hole 682 is closest. The lower limit value in the X direction is dE, which is the distance of the furthest point in the X direction of the lead 684a. The lower limit value in the Y direction is dF, which is the distance of the furthest point in the Y direction of the lead 684b. In addition, the permissible range (upper limit, lower limit) shown in FIG. 90 is an example, and a permissible range can be set in various settings. For example, you may set the permissible range which should just be a space | interval which contacts at least one part of a lead with an insertion hole. By widening the allowable range, it is possible to reduce the discarded electronic components, and by narrowing the allowable range, it is possible to suppress the occurrence of mounting errors.

When the electronic component mounting apparatus 10 determines in step S166 that the gap of the outermost shape is within the allowable range (Yes), it determines that the electronic component is appropriate as step S168, and terminates this process. When the electronic component mounting apparatus 10 determines in step S166 that the gap of the outermost shape does not fall within the allowable range (No), and when it determines No in step S162, the electronic component is not appropriate as step S169. It determines with no, and complete | finishes this process.

The electronic component mounting apparatus 10 detects the shape of the lead and judges whether the electronic component is appropriate based on the detected result, specifically, whether the electronic component can be inserted into the insertion hole, so that the electronic component can be more reliably boarded. Can be mounted on That is, the lead of the electronic component can be inserted more reliably into the insertion hole. In particular, in the case of a configuration in which a lead is cut by an electronic component supply device and supplied to a holding position, such as a radial feeder, the lead tends to be deformed, so that the held electronic component cannot be mounted. Since the electronic component mounting apparatus 10 can determine the state of a lead, it can suppress that a mounting operation is performed to a board | substrate using the electronic component which cannot be mounted, and the electronic component which is not inserted on a board | substrate can be suppressed. You can suppress what's left. Accordingly, adverse effects on other electronic components can also be suppressed. On the other hand, when the process of FIG. 89 is executed, the processes of steps S156 and S158 may not be executed during the process of FIG. 86 which detects the shape of the lead of the electronic component.

91 is a flowchart showing an example of the operation of the electronic component mounting apparatus. Fig. 89 may further perform a determination based on the number of leads, if the suitability of the electronic component is determined based on the outermost shape of the electronic component. The electronic component mounting apparatus 10 acquires the outermost shape of the lead of an electronic component as step S160. If the electronic component mounting apparatus 10 acquired the shape in step S160, it determines with step S162 whether it matches with the electronic component mounted.

The electronic component mounting apparatus 10 proceeds to step S163 when it is determined to match (Yes) with the electronic component in step S162, and to step S169 when it is determined to be non-matching (No). When the electronic component mounting apparatus 10 determines Yes in step S162, the electronic component mounting apparatus 10 acquires the number of leads of a component as step S163. In addition, you may acquire the number of leads together with an outermost shape. In addition, the outermost shape and the number of leads may be measured before this process.

When the number of leads is acquired in step S163, the electronic component mounting apparatus 10 determines whether it matches with the electronic component mounted in step S164. That is, it is determined whether the number of leads is equal to the number of leads of the electronic component to be mounted. If it is determined in step S164 that the electronic component matches (Yes), the electronic component mounting apparatus 10 proceeds to step S166.

When it determines with Yes in step S164, the electronic component mounting apparatus 10 determines as step S166 whether the space | interval of an outermost shape is contained in a permissible range. If it is determined in step S166 that the gap of the outermost shape is in the allowable range (Yes) in step S166, the electronic component mounting apparatus 10 determines that the electronic component is appropriate, and ends this process. If the electronic component mounting apparatus 10 determines in step S166 that the gap of the outermost shape does not fall within the allowable range (No), and if it determines No in steps S162 and S164, the electronic component is determined as step S169. It determines that it is not suitable, and complete | finishes this process.

By detecting and comparing the number of leads of an electronic component, the electronic component mounting apparatus 10 can also distinguish the electronic component which differs only in the number of leads. Accordingly, even when the outermost shape of the lead is detected and the shape of the lead is determined, the electronic component having a different number of leads can be identified.

The electronic component mounting apparatus 10 can detect the shape of a lead through a simple process by using the laser recognition apparatus 38 as an apparatus which detects the shape of the lead of an electronic component. On the other hand, in the above embodiment, the outermost shape (the outermost gap of the lead) is detected as the shape of the lead in that processing and determination can be performed in a short time, but other shapes, for example, leads other than the diameter or the outermost lead The interval of may be detected. In addition, the electronic component mounting apparatus 10 can implement mounting of an insertion type electronic component (lead type electronic component) suitably using the structure used for mounting a mounted electronic component by using the laser recognition apparatus 38. As shown in FIG. have. In addition, the electronic component mounting apparatus 10 may use the VCS unit 17 provided with another apparatus, for example, a camera as an apparatus which detects the shape of the lead of an electronic component. On the other hand, when the VCS unit 17 is used, since the shape of the electronic component is measured from the lower side of the electronic component, the electronic component can be measured from the side surface, that is, the position in the Z-axis direction is received by the light source 38a and light receiving. The process becomes more complicated than the case of using the laser recognition apparatus 38 which can measure the electronic component which is the same position as the element 38b, and the precision may fall.

Next, the operation of determining the mounting order (mounting order) of the electronic components will be described with reference to FIGS. 92 and 93. The mounting order includes the order of the electronic components to be inserted. It is explanatory drawing for demonstrating operation | movement of the electronic component mounting apparatus.

The electronic component mounting apparatus 10 of this embodiment is provided with the list 302 shown in FIG. 92 as production program data. The list 302 is information on the mounting layer for the mounting point of the substrate (including the point to be inserted into the substrate) and information on the designation of the insertion component. Here, the mounting layer is information of priority used when determining the mounting order of electronic components, and is set to a numerical value of 1 to 7. Here, the mounting layer is a numerical value which is determined that the mounting order is earlier as the value is smaller, and that the mounting order is later as the value is larger. On the other hand, a mounting layer is a value which a worker sets in consideration of various information. The designation of the insertion component is an item indicating whether the electronic component to be mounted at the mounting point is an insertion component. On the other hand, in FIG. 92, the mounting point designated as the insertion part is shown as Yes. Here, the insertion part is an electronic part which mainly inserts a lead, such as a radial lead type electronic part, into the hole formed in the board | substrate. On the other hand, designation of the insert is also information set by the operator. For this reason, regardless of the type of electronic component, the mounting point determined by the operator as the insert component can set the designation of the insert component to Yes.

The electronic component mounting apparatus 10 creates the mounting order list 304 using the information of the list 302. Here, the mounting order list 304 is a mounting point where the mounting point on the upper side of the list is mounted first, and the mounting point below the list is a mounting point on which the electronic components are mounted later. That is, the mounting order list 304 is displayed in order from the top in ascending order of mounting of the electronic parts. Here, the inner layer of the mounting order list 304 is information of the layer determined by the control part 60 based on the specification of the mounting layer and the insertion component. The control part 60 determines the mounting point to mount an electronic component in order from the mounting point with a small numerical value of an inner layer.

93 is a flowchart showing an example of the operation of the electronic component mounting apparatus. The process shown in FIG. 93 is an example of the process of creating the mounting order list 304 based on the list 302. The process shown in FIG. 93 is executed by the control part 60 controlling the operation | movement of each part. The control unit 60 reads the production program as step S200. The control unit 60 reads the production program from an external device or reads from a storage unit of the electronic component mounting apparatus 10. If the control part 60 has read the production program in step S200, it will acquire the information of the mounting point n as step S202. Specifically, the information of the mounting layer of the mounting point n and the information of the insertion part designation are acquired.

If the control unit 60 acquired the information of the mounting point n in step S202, it is determined in step S204 whether the mounting point n is an insertion part, that is, whether the information of the insertion part designation of the mounting point n is Yes. Determine. If it is determined in step S204 that the mounting point n is not an inserted part (No) in step S204, the control unit 60 sets internal layer = mounting layer as step S206. That is, the control part 60 sets the numerical value of a mounting layer as the numerical value of an internal layer, when the information of the insertion part designation of the mounting point n is not Yes. If the control part 60 performed the process of step S206, it will progress to step S210. When it is determined in step S204 that the mounting point n is an insertion part (Yes) in step S204, the control unit 60 sets the inner layer = mounting layer + 7 as step S208. That is, the control part 60 makes the numerical value which added 7 the numerical value of a mounting layer the numerical value of an internal layer, when the information of the insertion part designation of the mounting point n is Yes. If the control part 60 has performed the process of step S208, it will progress to step S210.

If the process of step S206 or step S208 has been performed, the control unit 60 determines, as step S210, whether the mounting data is finished, that is, whether the inner layer has been calculated for all mounting points. If it is determined in step S210 that it is not the end (No), the control unit 60 sets the mounting point n to n + 1 as step S212, and then proceeds to step S202. That is, the mounting point of the detection target of the inner layer is made the next mounting point and the above-described processing is performed.

If it is determined in step S210 that the end (Yes), i.e., the inner layers of all mounting points are set, in step S210, the control unit 60 determines the mounting order as step S214. That is, the control part 60 determines the order which mounts an electronic component in a mounting point based on the set internal layer and various conditions. After determining the mounting order, the controller 60 creates a mounting order list and ends the present process.

Thus, the electronic component mounting apparatus 10 provides an item which can set whether an operator is an insert component, and performs a constant addition to the inner layer of the mounting point set as an insert component, so that an insert component is attached to a board | substrate from behind. Can be mounted. Moreover, the operator can reverse the mounting procedure of the target electronic component only by determining whether it is an inserted component. Accordingly, when setting the mounting layer, it is not necessary to set the mounting layer of the electronic component in consideration of the layer for the mounting layer. This can reduce the burden on the operator of the operation of determining the mounting layer.

The operation of the component supply apparatus of the electronic component mounting apparatus will be described with reference to FIG. 94. 94 is a flowchart showing an example of the operation of the electronic component mounting apparatus. The process shown in FIG. 94 is performed by the component supply control part 64 controlling the operation | movement of each part of a component supply apparatus based on the process of the control part 60. FIG. On the other hand, the process shown in FIG. 94 is started in the state in which the electronic component is not arrange | positioned in a holding area. In step S260, the component supply control unit 64 moves the tape by one pitch. In other words, the component supply control unit 64 moves the tape by one pitch by moving the feed claw of the feed unit in one reciprocating or conveying direction. As a result, the electronic component held in the tape main body is moved to the holding area.

If the electronic component is moved to the holding area in step S260, the component supply control unit 64 cuts the lead of the electronic component moved to the holding area in step S262. That is, the component supply control part 64 cut | disconnects the part which exists between the component main body of a lead, and a tape main body by a cutting unit. If the lead is cut in step S262, the component supply control unit 64 maintains the clamping state as step S264. In other words, the component supply control unit 64 cuts the lead wire by the cutting unit and then maintains the state where the lead is inserted into the cut gear.

When the component supply control unit 64 maintains the clamping state in step S264, it is determined as step S266 whether the nozzle 32 holds (adsorbs or grips) the electronic component. When the component supply control unit 64 determines that the electronic component is not held by the nozzle (No) in step S266, the component supply control unit 64 proceeds to step S264. The component supply control unit 64 maintains the clamping state of the electronic component until it is determined that the electronic component is held by the nozzle.

When it is determined in step S266 that the electronic component is held by the nozzle (Yes), the component supply control unit 64 releases the electronic component, that is, releases the clamping state, in step S268. As a result, the electronic component cut out of the lead and separated from the tape is moved to a predetermined mounting position (mounting position) by the nozzle and mounted on the substrate.

If the electronic component is released in step S268, the component supply control unit 64 determines whether there is a tape transfer request in step S270. The tape transfer request is a request for moving the tape by one pitch to move the next electronic component to the holding area. If it is determined in step S270 that the request has been made (Yes), the component supply control unit 64 proceeds to step S260 to execute the above process again.

When it is determined in step S270 that there is no request (No), the component supply control unit 64 determines whether the processing ends as step S272. If it is determined in step S272 that the process is not finished (No), the component supply control unit 64 proceeds to step S270. Moreover, the component supply control part 64 complete | finishes this process, when it determines with processing completion (Yes) in step S272.

The component supply control part 64 can move a radial lead type electronic component to a nozzle by moving an electronic component to a holding area as mentioned above, cutting and clamping a lead, and releasing clamping, if an electronic component is attracted to the nozzle. Can be adsorbed in a state.

95 is a flowchart showing an example of the operation of the electronic component mounting apparatus. In addition, the processing operation shown in FIG. 95 is an operation from carrying in a board | substrate to completion of mounting of the electronic component with respect to a board | substrate. In addition, the process operation shown in FIG. 95 is executed by the control part 60 controlling the operation | movement of each part.

The control part 60 carries in a board | substrate as step S302. Specifically, the control part 60 conveys the board | substrate which is a target to mount an electronic component to the board | substrate conveyance part 12 to a predetermined position. If the board | substrate was carried in in step S302, the control part 60 performs a holding movement as step S304. Here, the holding movement (adsorption movement) is a processing operation for moving the head main body 30 to a position where the nozzle 32 faces the electronic component 80 in the holding region of the component supply unit 14.

The control part 60 lowers the nozzle 32 as step S306, if the holding movement was performed in step S304. That is, the control part 60 moves the nozzle 32 downward to the position which can hold | maintain (adsorb | suck, hold) the electronic component 80. FIG. When the control part 60 lowers the nozzle 32 in step S306, the control part 60 hold | maintains components by the nozzle 32 as step S308, and raises the nozzle 32 as step S310. If the control part 60 moved the nozzle to the predetermined position in step S310, specifically, if the electronic component 80 was moved to the measurement position of the laser recognition apparatus 38, it will be carried out to the nozzle 32 as step S312. The shape of the electronic component adsorbed is detected. If the control part 60 detects the shape of an electronic component in step S312, it raises a nozzle as step S314. On the other hand, when the control part 60 detects the shape of the component of step S312 as mentioned above, and determines that the retained electronic component is not mountable, it discards an electronic component and adsorb | sucks an electronic component again. When the control part 60 raises a nozzle to a predetermined position, as step S316, a mounting movement, ie, the position which opposes the mounting position (mounting position) of the board | substrate 8 with the electronic component adsorbed by the nozzle 32, is carried out. Perform a processing operation for moving up to, and in step S318, the nozzle 32 is lowered, and in step S320, a component mounting (part mounting), i.e., a processing operation for releasing the electronic component 80 from the nozzle 32, In step S322, the nozzle 32 is raised. That is, the control part 60 performs the above-mentioned mounting process in the process operation of step S312 to step S320.

When the nozzle is raised in step S322, the control unit 60 determines whether or not the mounting of all components is completed in step S324, that is, whether the mounting process of the electronic component that is to be mounted on the substrate 8 is completed. If the control unit 60 determines in step S324 that the mounting of all components is not completed (No), that is, the electronic component to be mounted remains, the control unit 60 proceeds to step S304, whereby the next electronic component is transferred to the substrate 8. Perform the processing operation mounted on the. Thus, the control part 60 repeats the said process operation | movement until the mounting of all the components with respect to a board | substrate is completed. If it is determined in step S324 that the mounting of all parts is completed (Yes), the control unit 60 ends this process.

Next, with reference to FIG. 96, the operation | movement of the component supply apparatus 100 and the head 15 before and after a nozzle adsorb | sucks the electronic component hold | maintained in the component supply apparatus 100 is demonstrated. 96 is a flowchart showing an example of the operation of the electronic component mounting apparatus. The process shown in FIG. 96 is performed by the control part 60 controlling the operation | movement of each part.

The control part 60 performs XY adsorption | movement movement of the head 15 as step S340, and also starts clamping the electronic component by the component supply apparatus 100. FIG. That is, the control part 60 moves the head 15 to XY direction in step S340, and moves the nozzle 32 to a holding area. Moreover, the control part 60 arrange | positions an electronic component in the holding | maintenance area | region of the component supply apparatus 100, and makes it the state which cut and clamped the lead after that.

The control unit 60 performs the process of step S340, and when the movement of the holding position of the head 15 is completed in step S342, that is, if the nozzle 32 of the head 15 is moved to the holding area, In step S344, the clamping waiting time is compared with the elapsed time, and in step S346, it is determined whether the waiting time has elapsed, that is, whether the elapsed time is equal to or greater than the clamping waiting time.

The control unit 60 proceeds to step S344 when it is determined in step S346 that the waiting time has not elapsed (No), that is, the elapsed time is less than the clamping waiting time. The control unit 60 repeats the processes of steps S344 and S346 until the waiting time elapses.

If it is determined in step S346 that the waiting time has elapsed (Yes), the control unit 60 performs the Z-axis adsorption drop as step S348. That is, the control part 60 moves a nozzle below Z-axis to the position where an electronic component in a holding area can adsorb | suck. If the Z-axis adsorption drop is performed in step S348, the control unit 60 adsorbs the component in step S350, that is, the electronic component by the nozzle, and in step S352, the clamping release waiting time and the existing Z-axis lowering waiting time. Compare Here, the clamping release waiting time is a processing time required for releasing the clamping state of the electronic component clamped by the component supply apparatus 100. The conventional waiting time at the time of the Z-axis descending is the waiting time at the position where the nozzle of the head adsorbs electronic components. On the other hand, the existing Z-axis descending waiting time is a preset value and is a time required for the adsorption treatment of the electronic component.

If the comparison is made in step S352, the control unit 60 determines whether the clamping release waiting time is large, that is, if the existing Z-axis lowering waiting time <clamping release waiting time as step S354. In step S354, when determining that the clamping release waiting time is large (Yes), that is, the existing Z-axis descending waiting time < the clamping release waiting time, the controller 60 waits as much as the clamping release waiting time as step S356. The flow proceeds to step S360. Further, when the control section 60 determines in step S354 that the clamping release waiting time is not large (No), that is, the existing waiting time when the Z-axis descends ≥ the clamping release waiting time, the existing Z-axis as step S358. The descent waits for the waiting time, and the process proceeds to step S360.

If the control part 60 performed the process of step S356, S358, it performs the Z-axis adsorption | suction rise of a head, the feed operation of a component supply apparatus, and complete | finishes this process as step S360.

The electronic component mounting apparatus 10 can mount an electronic component on a board | substrate by performing the processing operation shown in FIG. 95 and FIG.

Next, an example of a process in the case of holding an electronic component in the holding position of the electronic component supply apparatus 100 with a nozzle is demonstrated using FIG. 97-98B. 97 is a flowchart showing an example of the operation of the electronic component mounting apparatus. 98A is explanatory drawing for demonstrating operation | movement of the electronic component mounting apparatus. 98B is explanatory drawing for demonstrating operation | movement of the electronic component mounting apparatus. The process shown in FIG. 97 can be performed by the control apparatus 20 of the electronic component mounting apparatus 10 controlling each part.

The electronic component mounting apparatus 10 performs the holding | maintenance operation | movement of an electronic component with a nozzle in step S402. That is, the electronic component mounting apparatus 10 performs an operation of holding (adsorption and gripping) the electronic component in the holding area of the electronic component supply apparatus with the nozzle. The electronic component mounting apparatus 10 detects the holding state of the electronic component as step S404, if the holding operation is performed in step S402. Specifically, the laser recognition device 38 or the VCS unit 17 detects whether the nozzle holds the electronic component.

If the electronic component mounting apparatus 10 detects the holding state in step S404, it determines whether the nozzle holds the electronic component in step S406. The electronic component mounting apparatus 10 ends this process, when it determines with the electronic component holding (Yes) in step S406. When it is determined in step S406 that the electronic component is not held (No), the electronic component mounting apparatus 10 detects the state of the holding position of the electronic component supply apparatus as step S408. For example, the electronic component mounting apparatus 10 detects the height of a holding position by the height sensor 37, and detects whether an electronic component exists in a holding position. On the other hand, imaging by the imaging device 36 may detect the presence or absence of an electronic component.

If the electronic component mounting apparatus 10 detects the state of a holding position in step S408, it determines in step S410 whether an electronic component exists in a holding position. If it is determined in step S410 that the electronic component is present (Yes), the electronic component mounting apparatus 10 proceeds to step S416, and if it is determined that there is no electronic component (No), it proceeds to step S412. Here, the electronic component mounting apparatus 10 detects the presence or absence of an electronic component by the height sensor 37 based on the height of a holding position. For example, when there is an electronic component 80 in the holding area as shown in FIG. 98A, the height of the holding area becomes high, and when there is no electronic component 80 in the holding area as shown in FIG. 98B, the height of the holding area becomes low ( Tape position). As mentioned above, the electronic component mounting apparatus 10 determines that an electronic component exists when the height of a holding area is higher than a threshold value, and determines that there is no electronic component when it is lower than a threshold value.

When it determines with No in step S410, the electronic component mounting apparatus 10 determines in step S412 whether the number of transfer operations is more than a threshold number of times. Here, the conveying operation is an operation in which the electronic component supply apparatus 100 sends the tape by the interval of arrangement of the electronic components. The number of transfer operations in step S412 is the number of times the transfer operation was performed in a state in which the electronic components cannot be adsorbed. If it is determined in step S412 that the number of transfer operations is equal to or greater than the threshold number of times (Yes), the electronic component mounting apparatus 10 proceeds to step S416, and the number of transfer operations is not greater than or equal to the threshold number of times (No). If it is determined, the flow advances to step S414.

When the electronic component mounting apparatus 10 determines No in step S412, it performs a tape conveyance operation in step S414, and progresses to step S402. When it determines with Yes in step S410 or step S412, the electronic component mounting apparatus 10 performs an error process as step S416, and complete | finishes this process. Here, when it determines with Yes in step S410, the electronic component mounting apparatus 10 notifies that an electronic component remains in a holding position as an error process. When the electronic component mounting apparatus 10 determines Yes in step S412, as an error process, it notifies that an electronic component supply apparatus 100 cannot confirm a component, even if it carries out a certain number of transfer operations.

When the electronic component mounting apparatus 10 does not have an electronic component left in the holding position in this manner, the electronic component mounting apparatus 10 sends a tape and executes the holding operation of the electronic component again, even if there is a portion where the electronic component is not arranged on the tape. The mounting of electronic components can be continued without stopping the apparatus. In addition, the electronic component mounting apparatus 10 does not retain electronic components in the holding position even when the electronic component whose lead is cut by the electronic component supply apparatus 100 is moved from the holding position without being held by the nozzle. In this case, the electronic component can be mounted more efficiently by continuing the mounting operation.

It is explanatory drawing which shows an example of a nozzle. 100 is an explanatory diagram for explaining a holding operation of the nozzle of FIG. 99. 99 and 100 are diagrams showing an example of a grip nozzle (gripper nozzle). The nozzle 690 shown in FIG. 99 and FIG. 100 has the fixed arm 692 and the movable arm 694. The nozzle 690 is fixed with the support point 695 of the movable arm 694 rotatable to the main body of the nozzle 690, and the movable arm 694 has the support point 695 as the axis. The portion facing the fixed arm 692 can move in a direction away from the direction of approaching the fixed arm 692. As for the movable arm 694, the drive part 696 is connected with the part of the main body of the nozzle 690 and the part which approaches or moves away from the fixed arm 692 with the support point 695 interposed. The drive part 696 is moved by the drive source (air pressure) which drives a suction nozzle. As the driving unit 696 moves, the movable arm 694 moves in a direction away from the direction in which the portion facing the fixed arm 692 approaches the fixed arm 692.

The nozzle 690 reduces the distance between the fixed arm 692 and the movable arm 694 while the electronic component 80 is present between the fixed arm 692 and the movable arm 694. As shown in the figure, the electronic component 80 can be gripped.

The gripping nozzle is not limited to the nozzle 690 and may have various shapes. 101A to 101D are explanatory diagrams each showing an example of a nozzle. The nozzle 690a shown in FIG. 101A, the nozzle 690b shown in FIG. 101B, the nozzle 690c shown in FIG. 101C, and the nozzle 690d shown in FIG. 101D have the space | interval and movable range between a fixed arm and a movable arm, respectively. different. For this reason, the nozzles 690a to 690d differ in the shape of the grippable electronic component.

The electronic component mounting apparatus 10 can hold | maintain an electronic component suitably by selecting the kind of nozzle which hold | maintains this electronic component according to the kind of electronic component to hold. Specifically, by selecting whether to use an adsorption nozzle or a holding nozzle according to the electronic component to be retained, and to switch which nozzle is used among each type of nozzle, more types of electronic components can be formed by one electronic component mounting apparatus. It can be implemented.

Next, with reference to FIG. 102, an example of the process while the electronic component mounting apparatus mounts an electronic component is demonstrated. 102 is a flowchart showing an example of the operation of the electronic component mounting apparatus. The electronic component mounting apparatus 10 specifies the electronic component to hold with each nozzle of a head as step S450. That is, the kind of electronic component which a nozzle will hold next is specified.

If the electronic component mounting apparatus 10 specified the electronic component in step S450, it determines whether there is a replacement of a nozzle in step S452. If it is determined in step S452 that the nozzles are not replaced (No), the electronic component mounting apparatus 10 proceeds to step S456. If it is determined in step S452 that the nozzles have been replaced (Yes), the electronic component mounting apparatus 10 performs nozzle replacement in step S454. Specifically, the electronic component mounting apparatus 10 moves the head 15 to the replacement nozzle holding mechanism 18, moves the nozzle held by the head to the replacement nozzle holding mechanism 18, and replaces the replacement nozzle. The nozzle, which is held by the holding mechanism 18 and will be used next, is mounted to the head. The electronic component mounting apparatus 10 changes the nozzle attached to the head by the exchange nozzle holding mechanism 18 from an adsorption nozzle to a holding nozzle, and changes the kind of suction nozzle or the kind of a holding nozzle. If the electronic component mounting apparatus 10 has performed the processing of step S454 or if it is determined to be No in step S452, the electronic component mounting apparatus 10 uses the nozzle mounted on the head 15 as the step S456, that is, in step S450. The holding operation of the specific electronic component is executed, and the present process ends.

As shown in FIG. 102, the electronic component mounting apparatus 10 can hold | maintain an electronic component with a more suitable nozzle by replacing the nozzle which a head mounts according to the kind of electronic component. Moreover, by making the nozzle replaceable, it is possible to appropriately hold both the lead type electronic component and the mounted type electronic component with one electronic component mounting apparatus 10. In addition, more types of electronic components can be held. The electronic component mounting apparatus 10 can hold | maintain both electronic components using a common nozzle by holding both a main body part, ie, a part which is not a lead, both a lead type electronic component and a mounting type electronic component. As a result, it is possible to hold the lead-type electronic component without providing a dedicated nozzle for holding the lead. On the other hand, in order to obtain the above effect, it is preferable to hold the main body of the lead-type electronic component, but a nozzle for holding the lead may be provided.

Next, with reference to FIG. 103 and FIG. 104, an example of the process from execution of setup process (setting of a production program, preparation of each part, adjustment of a part supply apparatus, etc.) to starting production is demonstrated. 103 is a flowchart showing an example of the operation of the electronic component mounting apparatus. It is explanatory drawing for demonstrating operation | movement of the electronic component mounting apparatus. In addition, the process of FIG. 103 can also be performed as a process from once stopping production to resuming.

The electronic component mounting apparatus 10 executes setup processing in step S460, and in step S462, the lead of the electronic component is cut by the cutting unit of the electronic component supply apparatus 100 to clamp the electronic component. On the other hand, the process of step S462 is executed as a process of a part of the setup process of step S460. In addition, the electronic component mounting apparatus 10 is not held by the head after clamping the electronic component.

The electronic component mounting apparatus 10 outputs a message as step S464, after performing the process of step S462. Specifically, the screen 698 shown in FIG. 104 is displayed as a message. On the screen 698, the message &quot; Keep clamping state? &Quot;, button 699a of Yes and button 699b of No, are displayed.

The electronic component mounting apparatus 10 displays the message in step S464, and if either one of the buttons 699a and 699b is selected and determined, determines in step S466 whether to maintain the clamping state. If it is determined in step S466 that the clamping state is not maintained (No), that is, button 699b is selected in step S466, the electronic component mounting apparatus 10 releases the clamping state to release the electronic component in step S467. To exit. In this case, the worker collects the electronic parts from the holding area. On the other hand, in the present embodiment, it is asked whether the clamping state is to be maintained. Alternatively, the present embodiment may ask whether to release the clamping state. In this case, the correspondence between Yes and No is reversed.

If the electronic component mounting apparatus 10 determines that the clamping state is maintained in step S466 (Yes), that is, the button 699a is selected, the electronic component mounting apparatus 10 maintains the clamping state in step S468, and in step S469, after the start of production, The electronic component is used and this process ends.

As shown in Fig. 103, the electronic component mounting apparatus 10 supplies the electronic component after the start of production of the electronic component whose lead is cut, at the time of setup processing, for the purpose of adjusting the cutting position of the electronic component. By using it as the first electronic component of the apparatus, the burden on the operator can be reduced. Specifically, the effort of collecting the electronic parts and the effort of pressing the collected electronic parts by hand and inserting them into the substrate can be omitted.

Next, an example of the process which the electronic component mounting apparatus 10 performs at the time of mounting an electronic component is demonstrated using FIG. 105. FIG. 105 is a flowchart showing an example of the operation of the electronic component mounting apparatus.

In step S470, the electronic component mounting apparatus 10 specifies the position at which the electronic component is to be mounted, and in step S472, the height of the mounting position is detected. On the other hand, the height of the board | substrate of the position to mount can be detected by the height sensor 37. FIG. If the electronic component mounting apparatus 10 detects the height in step S472, it determines in step S474 whether the height is equal to or less than the threshold (the distance between the head and the measurement position is longer than the threshold). That is, the electronic component mounting apparatus 10 determines whether nothing is placed in the position which will mount the electronic component of a board | substrate.

When the electronic component mounting apparatus 10 determines that the height is not equal to or less than the threshold value (No) in step S474, that is, the height is higher than the threshold value, the electronic component mounting apparatus 10 determines that something is placed at the mounting position, and thereby, step S476. The error process is executed as is, and the process ends. When the electronic component mounting apparatus 10 determines in step S474 that the height is equal to or less than the threshold value (Yes), it is determined that nothing is placed at the mounting position, and in step S478, the electronic component mounting process is executed. This process ends.

As shown in FIG. 105, the electronic component mounting apparatus 10 detects the height of the board | substrate of the position to mount an electronic component, and performs an error process, when the height of a board | substrate is high, and it differs in the position to mount a board | substrate. When there is an obstacle such as a member, the execution of the operation for mounting the electronic component can be suppressed. Thereby, an electronic component can be mounted, restraining damage to a board | substrate or an electronic component. In FIG. 105, the height of the substrate is detected by the height sensor 37 so as to simplify the processing. However, the state of the mounting position on the substrate may be detected by the imaging device 36.

Next, an example of the processing operation | movement after completion of mounting of the electronic component of the electronic component mounting apparatus 10 is demonstrated using FIG. 106 is a flowchart showing an example of the operation of the electronic component mounting apparatus.

The electronic component mounting apparatus 10 determines in step S480 whether the mounting of all components has been completed, that is, whether all electronic components to be mounted on the substrate have been mounted on the substrate based on the production program. The electronic component mounting apparatus 10 proceeds to step S480 when it is determined in step S480 that the mounting of all components is not completed (No), that is, there are electronic components that are not mounted.

The electronic component mounting apparatus 10 detects the state of the electronic component in a mounting position as step S482, when it determines with mounting (Yes) that all the components are completed in step S480. Here, the state of the electronic component at the mounting position can be detected, for example, by detecting the height of each position of the substrate by the height sensor 37 or by acquiring an image of the substrate surface by the imaging device 36.

If the electronic component mounting apparatus 10 detects the state of the electronic component in step S482, it determines whether there is a mounting position in which there is no electronic component in step S484. When using the detection result of the height sensor 37, the electronic component mounting apparatus 10 determines that there is no electronic component, when there is a mounting position where the position whose height is lower than a design value (for example, the height of a board | substrate) is detected. do. In addition, when the electronic component mounting apparatus 10 judges through the image acquired by the imaging device 36, it performs matching with the shape of the component memorize | stored as data of a component, and when it does not match, an electronic component It can be determined that there is no. When the electronic component mounting apparatus 10 determines in step S484 that there is a mounting position without electronic components (Yes), it generates error information indicating a defective product as step S486, and proceeds to step S488. do. On the other hand, the electronic component mounting apparatus 10 determines whether there is an electronic component at every mounting position, and creates error information indicating a defective part at all mounting positions determined to be absent. The electronic component mounting apparatus 10 proceeds to step S488 when it is determined in step S484 that there are no mounting positions with no electronic components (No), that is, it is determined that the electronic components are mounted at all mounting positions.

When it determines with No in step S484 or the process of step S486, the electronic component mounting apparatus 10 determines as a step S488 whether there exists a mounting position which shifted the position of an electronic component. When the electronic component mounting apparatus 10 uses the detection result of the height sensor 37, when there exists a mounting position detected in the position which shifted the position (edge of an electronic component) from which the height changes from a design value, the electronic component It is determined that the position of is shifted. In addition, when it determines with the image acquired by the imaging device 36, the electronic component mounting apparatus 10 performs matching with the shape of the component memorize | stored as data of a component, and the shape of a component matches, but a position is If it does not coincide, it can be determined that the position of the electronic component is shifted. When the electronic component mounting apparatus 10 determines in step S488 that there is a mounting position in which the electronic component is shifted (Yes), the electronic component mounting apparatus 10 generates error information indicating position shift as step S490, and proceeds to step S492. do. On the other hand, the electronic component mounting apparatus 10 determines whether the position of the electronic component is shifted with respect to all the mounting positions, and creates error information indicating the position shift with respect to all the mounting positions where it is determined that the position of the electronic component is shifted. do. In step S488, when the electronic component mounting apparatus 10 determines that there are no mounting positions in which the positions of the electronic components are shifted (No), that is, the electronic components in all the mounting positions are mounted at appropriate positions, Proceed to step S492.

The electronic component mounting apparatus 10 determines whether there is an error detection as step S492 when it determines with No in step S488, or when the process of step S490 is performed. That is, it is determined whether there is error information created in steps S486 and S490. When it is determined in step S492 that the error is detected (Yes), the electronic component mounting apparatus 10 outputs error information as step S494, and terminates this process. That is, the electronic component mounting apparatus 10 outputs the error information created in step S486 and step S490. On the other hand, various methods can be used as an output method of the error information. The electronic component mounting apparatus 10 can display error information on the display part 42, for example. When the electronic component mounting apparatus 10 determines in step S492 that there is no detection of an error (No), this process ends.

As shown in FIG. 106, the electronic component mounting apparatus 10 can confirm whether an electronic component is suitably mounted on a board | substrate by detecting whether an electronic component is mounted after mounting is completed. In addition, by checking with the electronic component mounting apparatus 10, the effort which visually confirms can be saved, and the possibility that the produced board | substrate becomes a defective product can be reduced. Moreover, by outputting the error information based on the detection result, it is possible to notify the operator of the occurrence of mounting failure such as a defective product or a position shift. In addition, by notifying the position where the mounting failure occurred and the type of the electronic component as the error information, the mounting failure can be eliminated until the processing of the next step is executed. As a result, production efficiency can be improved.

In addition, although the target of determination was made into all the mounting components in FIG. 106, it is not limited to this. The electronic component mounting apparatus 10 may make only a specific electronic component into an object of determination. For example, only a lead type electronic component may be used, and only a radial lead type electronic component may be used as a target of determination. In addition, only a specific kind of electronic component may be the object of determination, or only an electronic component of a specific mounting position may be the object of determination.

Next, using FIG. 107-116, the operation | movement which mounts an electronic component in the mounting position (mounting position) of a board | substrate during the processing operation of an electronic component mounting apparatus, specifically, when moving a nozzle to a Z-axis direction Will be described. 107 is a flowchart showing an example of the operation of the electronic component mounting apparatus. 108 is an explanatory diagram showing an example of a lead type electronic component. On the other hand, it is preferable to perform the process shown in FIG. 107 at the time of a setup operation (optimization process) based on a production program and a teaching result. In this case, the electronic component mounting apparatus 10 may control an operation | movement based on the result computed by the setup operation at the time of production, ie, actually performing the process which mounts an electronic component on a board | substrate. On the other hand, the electronic component mounting apparatus 10 may perform the process shown in FIG. 107 at the time of production, ie, actually performing the process which mounts an electronic component on a board | substrate. In addition, the electronic component mounting apparatus 10 executes the process shown in FIG. 107 for each electronic component mounted on a board | substrate.

In step S502, the electronic component mounting apparatus 10 determines whether it is a lead type electronic component. That is, the electronic component mounting apparatus 10 determines whether the electronic component (electronic component to be processed) to be mounted on the substrate is an electronic component into which a lead is inserted into the insertion hole of the substrate. When determining that the electronic component mounting apparatus 10 is not a lead type electronic component (No) in step S502, the electronic component mounting apparatus 10 calculates a movement pattern in the Z-axis direction on the first speed reference as step S504, and ends the present process. do. In addition, the process of step S504 is mentioned later.

When the electronic component mounting apparatus 10 determines that it is a lead type component (Yes) in step S502, it determines with step S506 whether the lead is forming. Here, that the lead is formed means that the lead is not in a straight shape, and the curved portion and the refractive portion are formed. For example, when the curved portion is formed in the lead 704 connected to the main body 702 as in the electronic component 700 shown in FIG. 108, the lead 704 becomes a formed electronic component. As the electronic component in which the lead is formed, a connector or the like is excited. On the other hand, the electronic component can be prevented from falling out well after insertion into the insertion hole by forming the lead, that is, forming the curved portion or the refractive portion. That is, the formed portion functions as a fall prevention tool.

When the electronic component mounting apparatus 10 determines that the lead is not formed (No) in step S506, the electronic component mounting apparatus 10 calculates the movement pattern in the Z-axis direction on the second speed reference as step S508, and ends the present process. . In addition, the process of step S508 is mentioned later. When the electronic component mounting apparatus 10 determines that the lead is formed (Yes) in step S506, the electronic component mounting apparatus 10 calculates the movement pattern in the Z-axis direction on the third speed reference as step S510, and ends the present process. . In addition, the process of step S510 is mentioned later.

Next, the method of calculating the movement pattern of a Z-axis direction based on the process of step S504, ie, a 1st speed reference | standard, is demonstrated using FIG. 109 and FIG. 110. FIG. 109 is a flowchart which shows an example of the operation | movement of an electronic component mounting apparatus. It is explanatory drawing which shows the relationship between the moving speed of a nozzle, and time. Here, step S504 is executed when it is determined that the electronic component is not a lead-type electronic component, that is, a mounted electronic component which does not insert a lead into the insertion hole. That is, it is executed when the electronic component to be processed is a mounted electronic component.

The electronic component mounting apparatus 10 acquires a component height as step S520. Specifically, the information of the height of the electronic component is acquired. The height of the electronic component is the height in the Z axis direction of the electronic component. If the electronic component mounting apparatus 10 detects the height of the component in step S520, the electronic component mounting apparatus 10 calculates the distance in the Z-axis direction between the mounting position and the nozzle in step S522. Specifically, the head is moved to the mounting position, and the distance between the mounting position and the nozzle when the nozzle is moved in the Z-axis direction is calculated. In addition, the processing order of step S520 and step S522 may be reversed. In addition, although the information of step S520 and step S522 can be acquired based on the conditions input previously, you may acquire it by measurement.

If the electronic component mounting apparatus 10 has calculated the distance between the mounting position and the nozzle in step S522, it determines the conditions to decelerate from the speed V1 to the speed V2 in step S524, and from the speed V2 in step S526. The deceleration condition is determined, and the present process ends. Here, the speeds V1 and V2 are moving speeds in the Z-axis direction. The condition to decelerate from the speed V1 to the speed V2 is a condition for decelerating the moving speed of the nozzle from the speed V1 to the speed V2 during the movement in the Z-axis direction. The electronic component mounting apparatus 10 is a condition for further reducing the moving speed of the nozzle from the speed V2 during the movement in the Z-axis direction.

The electronic component mounting apparatus 10 determines the movement pattern of the nozzle shown in FIG. 110 by determining the conditions which change (decelerate) the movement speed of a nozzle in step S524 and step S526. 110 shows the relationship between the moving speed of the nozzle and the time, that is, the moving speed of the nozzle in each time. The movement pattern based on the 1st speed reference | standard shown in FIG. 110 accelerates to speed V1, when the nozzle started moving to the mounting position (dropping of a nozzle), and then speeds V1 until time t1. Go to. Thereafter, the nozzle starts deceleration at time t1, and decelerates to speed V2 at time t2. Here, time t2 is time when the distance between the lower end of an electronic component and a board | substrate becomes a set distance. Specifically, it is the time when the lower end of the electronic component and the substrate approach a constant distance. Thereafter, the nozzle moves at a constant speed until time t3, starts deceleration at time t3, and then stops.

The electronic component mounting apparatus 10 moves the electronic component in the movement pattern of FIG. 110 until the electronic component approaches a predetermined distance of the substrate at the time t1 (that is, in a range farther than the predetermined distance). The electronic component can be moved at the first speed V1. Then, the speed is slower than the speed V1 until the electronic component is mounted (mounted) on the substrate, that is, the electronic component approaches a predetermined distance of the substrate and then the mounting is completed (that is, within a certain distance). The electronic component can be moved at a speed (third speed) V2 which is the speed. As a result, the electronic component can be moved quickly in the range where the substrate is not affected, and the electronic component can be moved slowly in the range where the substrate may be affected. As a result, the time required for mounting can be shortened while maintaining the accuracy of mounting on the substrate. On the other hand, the electronic component mounting apparatus 10 can move an electronic component to a board | substrate by determining the time t3 so that it may move at a constant speed even after contact with an electronic component and a board | substrate, and will stop after that, and the predetermined pressurization may be carried out. The solder of the substrate and the electronic component can be brought into contact with each other.

Next, the method of calculating the movement pattern of the Z-axis direction based on the process of step S508, ie, a 2nd speed reference | standard, is demonstrated using FIGS. 111-114. 111 is a flowchart showing an example of the operation of the electronic component mounting apparatus. 112 is an explanatory diagram showing a relationship between a moving speed of a nozzle and time. 113 and 114 are explanatory diagrams for explaining an example of the operation of the electronic component mounting apparatus, respectively. Here, step S508 is executed when it is determined that the electronic component is a lead-type electronic component, that the lead is not formed, that is, the lead-type electronic component inserting the lead into the insertion hole, and that the lead is straight. That is, it is executed when the electronic component to be processed is a lead-type electronic component that is not formed.

The electronic component mounting apparatus 10 acquires a component height as step S530. Specifically, the information of the height of the electronic component is acquired. The height of the lead type electronic component is the height in the Z-axis direction of the electronic component, that is, the component height 87 obtained by adding the heights of the main body 82 and the lead 84 of the electronic component. If the electronic component mounting apparatus 10 acquires the component height (component length) in step S530, it acquires the lead length in step S532. Here, the lead length is the height in the Z-axis direction of the lead 84, that is, the length 86 of the lead 84 of the electronic component as shown in FIG. If the electronic component mounting apparatus 10 acquired the lead length 86 in step S532, it calculates the distance in the Z-axis direction between a mounting position and a nozzle as step S534. Specifically, the head is moved to the mounting position, and the distance between the mounting position and the nozzle when the nozzle is moved in the Z-axis direction is calculated. On the other hand, the processing order of step S530, step S532, and step S534 may be reversed. In addition, although the information of step S530, step S532, and step S534 can be acquired based on the conditions input previously, you may acquire by measurement.

When the electronic component mounting apparatus 10 has calculated the distance in the Z-axis direction between the mounting position and the nozzle in step S534, as step S536, it determines a condition to decelerate from the speed V1 to the speed V3, and as step S538. On the basis of the lead length, a condition for decelerating from the speed V3 is determined, and the present process ends. Here, the speeds V1 and V3 are moving speeds in the Z-axis direction. The condition for decelerating from the speed (first speed) V1 to the speed (second speed) V3 is a condition for decelerating the movement speed of the nozzle from the speed V1 to the speed V3 during the movement in the Z-axis direction. to be. The electronic component mounting apparatus 10 is a condition for further reducing the moving speed of the nozzle from the speed V3 during the movement in the Z-axis direction. On the other hand, the speed V3 is a speed slower than the speed V2 mentioned above.

The electronic component mounting apparatus 10 determines the movement pattern of the nozzle shown in FIG. 112 by determining the conditions which change (decelerate) the movement speed of a nozzle in step S536 and step S538. 112 shows the relationship between the moving speed of the nozzle and the time, that is, the moving speed of the nozzle in each time. The movement pattern based on the 2nd speed reference | standard shown in FIG. 112 accelerates to speed V1, when a nozzle starts to move to a mounting position (dropping of a nozzle), and then the speed V1 until time t4. Go to. Thereafter, the nozzle starts deceleration at time t4, and decelerates to speed V3 at time t5. Here, time t5 is time when the distance between the lower end of an electronic component (that is, the lower end of the lead 84) and a board | substrate becomes a set distance, as shown in FIG. Specifically, it is the time when the lower end of the electronic component and the substrate approach a constant distance. Thereafter, the nozzle moves at a constant speed until time t6, starts deceleration at time t6, and then stops. Here, when the electronic component mounting apparatus 10 mounts an electronic component in the movement pattern shown in FIG. 112, as shown in FIG. 114 between time t5 and time t6, as shown in FIG. Insert it into the insertion hole.

The electronic component mounting apparatus 10 moves the electronic component in the movement pattern of FIG. 114 until the electronic component approaches a predetermined distance of the substrate at the time t4 (that is, in a range farther than the predetermined distance), and the speed ( The electronic component can be moved at a first speed (V1). Thereafter, until the electronic component is mounted (mounted) on the substrate, that is, the electronic component approaches a predetermined distance of the substrate, and then the lead is inserted into the insertion hole to complete the mounting (that is, within a certain distance). The electronic component can be moved at a speed (second speed) V3 that is slower than the speed V1. Accordingly, the electronic component can be moved quickly in the range where the substrate is not affected, and the electronic component can be moved slowly in the range where the substrate may be affected. As a result, the time required for mounting can be shortened while maintaining the accuracy of mounting on the substrate.

The electronic component mounting apparatus 10 stably reads the lead to the substrate by detecting the timing of deceleration from the speed V3 based on the lead length, that is, determining the interval from the time t5 to the time t6. Can be inserted. In addition, the electronic component may be moved until the main body 82 and the substrate approach a predetermined distance. That is, the electronic component mounting apparatus 10 can adjust the movement conditions of the electronic component at the time of inserting a lead into an insertion hole which cannot be adjusted only by a component height by using a lead length as a determination criterion. Specifically, when the height of the main body 82 of the lead-type electronic component is the height of the component, the lead may be decelerated after contact with the substrate. When the height of the component 87 of the lead-type electronic component is the component height, Although it is necessary to adjust the press amount for each part component, in this embodiment, various conditions can be determined according to the length by inputting a lead length as a parameter.

Moreover, in the case of a lead type electronic component, the electronic component mounting apparatus 10 can adjust the pressurization which presses the main body of an electronic component to a board | substrate after contacting an electronic component and a board | substrate by adjusting the timing of time t6. . As a result, the main body can be moved with respect to the substrate under conditions different from the mounted electronic component that presses the terminal to the solder paste.

Next, using FIG. 115 and FIG. 116, the method of calculating the movement pattern of a Z-axis direction based on the process of step S510, ie, a 3rd speed reference is demonstrated. 115 is a flowchart showing an example of the operation of the electronic component mounting apparatus. 116: is explanatory drawing which showed the relationship between the moving speed of a nozzle, and time. Here, step S510 is executed when the electronic component is a lead-type electronic component, and the lead is formed, that is, the lead-type electronic component inserting the lead into the insertion hole, and it is determined that the lead is not straight. . That is, it is executed in the case of a lead type electronic component in which the electronic component to be processed is formed.

The electronic component mounting apparatus 10 acquires a component height as step S540. Specifically, the information of the height of the electronic component is acquired. The electronic component mounting apparatus 10 acquires a lead length as step S541, if the component height is acquired in step S540. If the electronic component mounting apparatus 10 acquired the lead length in step S541, it calculates the distance in the Z-axis direction between a mounting position and a nozzle as step S542. Specifically, the head is moved to the mounting position, and the distance between the mounting position and the nozzle when the nozzle is moved in the Z-axis direction is calculated. On the other hand, the processing order of step S540, step S541, and step S542 may be reversed. In addition, although the information of step S540, step S541, and step S542 can be acquired based on the conditions input previously, you may acquire by measurement.

If the electronic component mounting apparatus 10 calculated the distance between a mounting position and a nozzle in step S542, it determines with the step S544 the conditions which decelerate from the speed V1 to the speed V4, and by step S546, On the basis of this, the conditions for decelerating from the speed V4 are determined, and the present process ends. Here, the speeds V1 and V4 are moving speeds in the Z-axis direction. The condition for decelerating from the speed (first speed) V1 to the speed (fourth speed) V4 is a condition for decelerating the movement speed of the nozzle from the speed V1 to the speed V4 during the movement in the Z-axis direction. to be. The electronic component mounting apparatus 10 is a condition for further reducing the moving speed of the nozzle from the speed V4 during the movement in the Z-axis direction. On the other hand, the speed (fourth speed) V4 is a speed slower than the above-mentioned speed (second speed) V3.

The electronic component mounting apparatus 10 determines the movement pattern of the nozzle shown in FIG. 116 by determining the conditions which change (decelerate) the movement speed of a nozzle in step S544 and step S546. 116 shows the relationship between the moving speed of the nozzle and the time, that is, the moving speed of the nozzle in each time. The movement pattern based on the 3rd speed reference | standard shown in FIG. 116 accelerates to speed V1, when a nozzle starts moving to a mounting position (dropping of a nozzle), and then speeds V1 until time t7. Go to. Thereafter, the nozzle starts deceleration at time t7 and decelerates to speed V4 at time t8. Here, time t8 is time when the distance between the lower end of an electronic component (that is, the lower end of a lead) and a board | substrate becomes a set distance. Specifically, it is the time when the lower end of the electronic component and the substrate approach a constant distance. Thereafter, the nozzle moves at a constant speed until time t9, starts deceleration at time t9, and then stops.

The electronic component mounting apparatus 10 moves the electronic component in the movement pattern of FIG. 116, and as in the case of FIG. 112, until the electronic component approaches a predetermined distance of the substrate at a time t7 (that is, than the predetermined distance). In the distant range), the electronic component can be moved at a speed (first speed) V1. Thereafter, until the electronic component is mounted (mounted) on the substrate, that is, the electronic component approaches a predetermined distance of the substrate, and then the lead is inserted into the insertion hole to complete the mounting (that is, within a certain distance). The electronic component can be moved at a speed (fourth speed) V4 that is slower than the speed V1. As a result, the electronic component can be moved quickly in the range where the substrate is not affected, and the electronic component can be moved slowly in the range where the substrate may be affected. As a result, the time required for mounting can be shortened while maintaining the accuracy of mounting on the substrate.

The electronic component mounting apparatus 10 is stable as described above by detecting the timing of deceleration from the speed V4 based on the lead length, that is, determining the interval from the time t8 to the time t9. The lead can be inserted into the substrate. In addition, the electronic component may be moved until the main body 82 and the substrate approach a predetermined distance.

Moreover, in the case of a lead type electronic component, the electronic component mounting apparatus 10 can adjust the pressurization which presses the main body of an electronic component to a board | substrate, after contacting an electronic component and a board | substrate by adjusting the timing of time t9. . Thereby, the main body can be moved with respect to the board under conditions different from the mounted electronic component which presses the terminal on the solder paste.

In addition, in the electronic component mounting apparatus 10, when the lead is formed and a larger sliding resistance occurs when the insertion hole is inserted, the moving speed when the lead is inserted into the insertion hole is slower than the speed V3. By setting the speed V4, the formed lead can be inserted into the insertion hole appropriately. Thereby, the electronic component in which the lead is formed can be mounted suitably on a board | substrate.

107 to 116, the electronic component mounting apparatus 10 has the Z-axis direction of the electronic component depending on the type of the electronic component, specifically, depending on whether it is a lead type electronic component or a mounted electronic component. By adjusting the movement pattern, the electronic component can be mounted on the substrate with the movement pattern corresponding to each electronic component. Moreover, in the case of a lead type electronic component, by adjusting the movement pattern of the electronic component in the Z-axis direction according to whether it is formed, an electronic component can be mounted on a board | substrate with the movement pattern corresponding to each electronic component.

The electronic component mounting apparatus 10 has a movement speed in the range in which the electronic component approaches the vicinity of the substrate, and makes the movement speed V3 in the case of the lead type electronic component slower than the movement speed V2 in the case of the mounted electronic component. As a result, the lead type electronic component can be more reliably mounted on the substrate.

In addition, the electronic component mounting apparatus 10 has a movement speed in a range in which the electronic component approaches the vicinity of the substrate, in which the lead is formed rather than the movement speed V3 when the lead is not formed. By slowing the moving speed V4, the formed lead can be more reliably inserted into the insertion hole. Thereby, the probability of mounting an electronic component can be made higher.

In addition, when mounting the lead wire electronic component as described above, by setting the movement pattern based on the lead wire length, the lead can be more suitably inserted into the insertion hole, thereby providing the electronic component with higher precision and better efficiency. It can be mounted on a substrate.

In addition, as shown in FIG. 107, the electronic component mounting apparatus 10 preferably changes the speed reference according to the type of the electronic component and calculates the moving pattern according to the type, but is not limited thereto. The electronic component mounting apparatus 10 may be made to perform the process of step S504 every time, when it is the structure which mounts only a lead-type electronic component. In addition, the processes of step S506, step S508, and step S510 of FIG. 107 may be repeated. In addition, although the electronic component mounting apparatus 10 has shown the relationship of speed and time as a movement pattern, you may calculate a movement pattern in the relationship of a speed, a position, and a speed and a distance.

Next, with reference to FIGS. 117-125, the operation | movement of the bowl feeder unit 400 during a process operation | movement of the electronic component mounting apparatus 10, specifically, a holding position of the electronic component by the bowl feeder unit 400 The operation of supplying to the holding area will be described. All operations of the bowl feeder unit 400 described below can be controlled by using the control device 20 as a control unit of the bowl feeder unit 400.

First, the determination operation | movement regarding the state in which the electronic component of the electronic component supply apparatuses 402, 404, 406 of the bowl feeder unit 400 is full is demonstrated using FIG. 117 is a flowchart showing an example of the operation of the electronic component mounting apparatus. Here, the fullness of the electronic component is a state in which it is determined that the electronic component is disposed on the corresponding rail 422 of the electronic component supply apparatus 402, 404, 406. That is, the fact that the electronic components of the electronic component supply apparatuses 402, 404, 406 are full means that the electronic components are filled in the rails 422, and thus the electronic components can be newly guided from the bowl 420 to the rails 422. It is a state that it cannot be determined. Hereinafter, the case where it is determined whether the electronic component supply apparatus 402 is full is demonstrated. The electronic component mounting apparatus 10 repeats the process of FIG. 117 while the electronic component supply apparatus 402 is driving. On the other hand, the electronic component supply apparatuses 404 and 406 can also perform the determination by the same process.

The electronic component mounting apparatus 10 acquires the detection result of the starting end side component detection sensor 580a in step S602, and determines whether an electronic component exists in step S604. That is, the electronic component mounting apparatus 10 determines whether there is an electronic component in the measurement position (start end of the rail 422) of the base rail 504 based on the detection result of the start end component detection sensor 580a. do. When the electronic component mounting apparatus 10 determines that there is no electronic component (No) in step S604, that is, it is determined that there is no electronic component at the beginning of the rail 422, the electronic component mounting apparatus 10 continues to reset the time as shown in step S606. The process ends. The duration time is a time during which the state in which an electronic component exists is continued.

When it is determined in step S604 that the electronic component is present (Yes), the electronic component mounting apparatus 10 detects as step S608 whether the duration is greater than or equal to the threshold, that is, the electronic component is greater than or equal to the threshold time. Determine if the state is continuing. The threshold value is a time set by the operator or a reference time set to an initial value. The threshold value is input as a full completion wait time.

If it is determined in step S608 that the duration time is not equal to or greater than the threshold value (No) in step S608, the electronic component mounting apparatus 10 proceeds to step S602 and repeats the above process. When it is determined in step S608 that the duration time is equal to or greater than the threshold value (Yes) in step S608, the electronic component mounting apparatus 10 determines that the electronic component mounting apparatus is full and ends the present process.

As shown in FIG. 117, the electronic component mounting apparatus 10 analyzes the detection result of the start-end component detection sensor 580a, so that the electronic component supply apparatus 402 is full, ie, the rail 422 (422a). ) Can determine whether the electronic component is charged.

In the process of Fig. 117, it is determined whether or not it is full using only the detection result of the start end side part detection sensor, but it is preferable to also determine whether it is full using the detection result of the holding position side detection sensor. Hereinafter, an example of a process is demonstrated using FIG.

118 is a flowchart which shows an example of the operation | movement of an electronic component mounting apparatus. In addition, a part of the process shown in FIG. 118 is the same as the process of FIG. The same step number is used for such a process, and the detailed description is abbreviate | omitted. The electronic component mounting apparatus 10 acquires the detection result of the starting end side component detection sensor 580a in step S602, and determines whether an electronic component exists in step S604. If the electronic component mounting apparatus 10 determines that there is no electronic component (No) in step S604, that is, it is determined that there is no electronic component, the electronic component mounting apparatus 10 resets the duration as step S606 and ends this process.

When it is determined in step S604 that the electronic component is present (Yes), the electronic component mounting apparatus 10 acquires the detection result of the holding position side component detection sensor 582a as step S612, and as step S614, Determine if the part is present. That is, the electronic component mounting apparatus 10 determines whether an electronic component exists in the measurement position (end of the rail 422) of a holding position based on the detection result of the holding position side component detection sensor 582a. If the electronic component mounting apparatus 10 determines that there is no electronic component (No) in step S614, that is, it is determined that there is no electronic component in the holding position, the electronic component mounting apparatus 10 resets the time continuously and ends this process.

When it is determined in step S614 that the electronic component is present (Yes), the electronic component mounting apparatus 10 detects whether the duration is greater than or equal to the threshold, that is, the electronic component is greater than or equal to the threshold time. Determine if is continued. If it is determined in step S608 that the duration time is not equal to or greater than the threshold value (No) in step S608, the electronic component mounting apparatus 10 proceeds to step S602 and repeats the above process. When it is determined in step S608 that the duration time is equal to or greater than the threshold value (Yes) in step S608, the electronic component mounting apparatus 10 determines that the electronic component mounting apparatus is full and ends the present process.

As shown in FIG. 118, the electronic component mounting apparatus 10 is based on the detection result of the holding position side component detection sensor 582a in addition to the detection result of the starting end side electronic component detection sensor 580a. By determining whether the electronic component is present and determining whether it is full, it is possible to further increase the detection accuracy of the full state. By detecting the presence or absence of the electronic component in the holding position, the electronic component is stopped in the middle of the rail 422, and it can be suppressed from determining that the electronic component is full while the electronic component is not supplied to the tip.

Next, the processing operation of the air blow part 590 of the electronic component supply device 402 will be described with reference to FIGS. 119 and 120. 119: is explanatory drawing which showed an example of an operation screen. 120 is a flowchart showing an example of the operation of the electronic component mounting apparatus. The electronic component mounting apparatus 10 displays the operation screen 710 shown in FIG. 119, so that an operator can set the control conditions of the air blow part 590. FIG. That is, the electronic component mounting apparatus 10 can display the operation screen 710 as a screen which inputs the operation which sets the control conditions of the air blow part 590. FIG.

In the operation screen 710, the display area 712 which displays the conditions of a blowing stop space is displayed. The display area 712 has a first area 718 and a second area 720. The first area 718 is an area in which information corresponding to the electronic component supply device 402 of one bowl feeder assembly 90 is displayed. The second area 720 is an area in which information corresponding to the electronic component supply device 402 of the other bowl feeder assembly 90 is displayed. In the first area 718 and the second area 720, an input item 722 for inputting a blowing stop interval before full and an input item 724 for inputting a blow stop interval after full are supplied with electronic components. Displayed for each device (for each lane on the operation screen 720). Here, the blowing stop interval is a time at which the air blowing is stopped. That is, it is time until the air blow part 590 stops air blowing, and then performs air blowing next. The corresponding electronic component supply apparatus performs air blowing at the stop interval of the input item 722 when it is not detected as full, and air at the stop interval of the input item 724 when it is detected as full. Execute blowing. In addition, the display area 712 divides the area for each bowl feeder assembly 90, and displays the input items 722 and 724 for each electronic part supply device, thereby making it easier to input a gap for each electronic part supply device. Can be. The electronic component mounting apparatus 10 preferably limits the numerical value (stopping interval) input to the input item 722 to a time longer than the numerical value (interval) input to the input item 724. For example, it is preferable to set the blowing stop time before the filling to 10 seconds and the blowing stop time after filling to 1 second. Accordingly, when the electronic component supply apparatus is full, the electronic component mounting apparatus 10 can perform air blowing at shorter intervals than when the electronic component supply apparatus is full. When the electronic component supply apparatus becomes full, the electronic component mounting apparatus 10 can suppress that an electronic component flows in and presses in the filled rail 422 by shortening an air blowing interval.

The operation screen 710 also displays an input item 714 for inputting a blowing duration and an input item 716 for inputting a charging completion wait time. Here, the blowing duration is a time when one blowing is being executed, that is, a time when blowing is turned ON. The blowing duration is a time that can be set by the operator, for example 0.2 seconds. The charge completion waiting time is the time from the detection of the presence of the electronic component by the sensor to the determination that the sensor is full, the time of the threshold for determining whether it is full, that is, the threshold of step S608 described above. The electronic component mounting apparatus 10 displays the operation screen 710 so that an operator can input various conditions.

Next, with reference to FIG. 120, the control operation of the air blow part by the electronic component mounting apparatus 10 is demonstrated. The electronic component mounting apparatus 10 controls the operation of the air blow unit based on the conditions input on the operation screen 710 and the above-described determination of full. The electronic component mounting apparatus 10 determines in step S620 whether the drive has stopped in step S622 when the drive is driven. Here, the drive device is a drive device of the bowl feeder unit. The drive device being driven is a state in which the electronic component mounting device is in operation (a state in which the bowl is vibrated). When it is determined in step S622 that the drive device does not stop (No), the electronic component mounting apparatus 10 determines whether it is full as step S624. That is, it is determined whether the electronic component supply apparatus in which the air blow part is installed is full. On the other hand, whether it is full or not can be determined by the process mentioned above.

When determining that the electronic component mounting apparatus 10 is not full (No) in step S624, whether the threshold time has elapsed before being filled as step S626, that is, the elapsed time from the most recent air blowing is full. It is determined whether it is longer than the previous threshold. If the electronic component mounting apparatus 10 determines that the threshold time has not elapsed (No) before it is full in step S626, it proceeds to step S622, and the threshold time has elapsed before it is full in step S626. If YES, the flow proceeds to step S630.

When determining that the electronic component mounting apparatus 10 is full (Yes) in step S624, whether the threshold time has elapsed after being filled in step S628, that is, after the elapsed time from the most recent air blowing is full. Determine if it is longer than the threshold. When the electronic component mounting apparatus 10 determines in step S628 that the threshold time has not elapsed (No), the process proceeds to step S622, and in which the threshold time has elapsed after the filling in step S626. If YES, the flow proceeds to step S630.

When the electronic component mounting apparatus 10 determines in step S626 or S628 that the elapsed time is longer than the threshold value, the electronic component mounting apparatus 10 executes air blowing as step S630, and resets the elapsed time as step S632 to step S622. Proceed to

If the electronic component mounting apparatus 10 determines in step S622 that the driving apparatus is stopped (Yes), the process ends. In this way, the electronic component mounting apparatus 10 repeats the above process while the driving apparatus of the electronic component supply apparatus is driven, and performs air blowing by the air blow section at a stop interval based on each situation.

The electronic component mounting apparatus 10 can suppress blockage of an electronic component in the connection part which supplies an electronic component from a bowl to a rail by performing air blowing before it becomes full. Moreover, the electronic component mounting apparatus 10 can suppress that an electronic component is supplied from a bowl to the rail of a full state by performing air blowing after it becomes full. As a result, the electronic components are concentrated on the base rail, so that clogging of the electronic components can be suppressed. In particular, according to the present embodiment, when the plurality of electronic component supply apparatuses are driven by one driving apparatus, since the vibration of the bowl continues, by moving the electronic components from the base rail to the bowl by air blowing, the bowl to rail Excessive concentration of electronic components on the base rail can be suppressed while maintaining the supply operation of the electronic components.

121 is a flowchart showing an example of the operation of the electronic component mounting apparatus. Next, the control operation of the drive unit based on the detection result of the state of charge of the bowl feeder unit 400 will be described with reference to FIG. 121. The electronic component mounting apparatus 10 drives the electronic component supply apparatuses 402, 404, 406 in step S640, and excites a motor in step S642. That is, the electronic component mounting apparatus 10 makes each part of the bowl feeder unit 400 start state. If the electronic component mounting apparatus 10 has excited the motor in step S642, the electronic component mounting apparatus 10 starts the supply operation of the electronic component in step S646. That is, the motor is driven and the bowl 422 or the like is vibrated to start the supply of the electronic component to the holding position. On the other hand, it is preferable that the electronic component mounting apparatus performs the above-mentioned air blowing operation during the execution of the electronic component supply operation.

If the electronic component mounting apparatus 10 started the supply operation in step S646, it determines in step S648 whether all the electronic component supply apparatuses driven by the same drive apparatus are full. That is, it is determined whether all the electronic component supply apparatuses of one bowl feeder unit 400 are full. On the other hand, whether each electronic component supply apparatus is full can be detected by the process mentioned above.

When determining that the electronic component mounting apparatus 10 is not full (No) in step S648, the electronic component mounting apparatus 10 determines whether to stop the electronic component supply apparatus in step S650. Specifically, it is determined whether there is an instruction to stop the electronic component supply apparatus. The electronic component mounting apparatus 10 is instructed to stop the electronic component supply apparatus when the mounting operation of the electronic component is stopped, for example, when an error is output, when an error occurs in the electronic component supply apparatus, or when production is stopped. Is output. If the electronic component mounting apparatus 10 determines to stop (Yes) in step S650, it progresses to step S659, and if it determines not to stop (No), it progresses to step S648.

When determining that the electronic component mounting apparatus 10 is full (Yes) in step S648, the electronic component mounting apparatus 10 stops the motor while maintaining the excited state in step S652, and in step S654, the holding position side component detection sensor 582. It is determined whether or not the absence of a component is detected. On the other hand, the electronic component mounting apparatus 10 determines whether or not the electronic component at the holding position of the electronic component supply apparatus is held by the head, instead of detecting the absence of the component by the holding position side component detection sensor 582. You may. When the electronic component mounting apparatus 10 determines in step S654 that the component is not detected by the holding position side component detection sensor 582 (Yes), it proceeds to step S646. When the electronic component mounting apparatus 10 determines in step S654 that the absence of a component is not detected (No) by the holding position side component detection sensor 582, the electronic component that has become full in step S656. Determine if there is a supply.

The electronic component mounting apparatus 10 proceeds to step S646 when it is determined in step S656 that there is an electronic component supply apparatus that has become full (Yes). When the electronic component mounting apparatus 10 determines that there is no electronic component supply apparatus (No) which has become full in step S656, that is, all electronic component supply apparatuses remain in a full state, as step S658, Determine whether to stop the electronic component supply device. If the electronic component mounting apparatus 10 determines to stop (Yes) in step S658, it progresses to step S659, and if it determines not to stop (No), it progresses to step S654.

When the electronic component mounting apparatus 10 determines Yes in step S650 or S658, in step S659, the exciting state is canceled, the electronic component supply apparatus is stopped, and the present process is finished.

The electronic component mounting apparatus 10 stops the vibration of the bowl 420 by the drive apparatus 408 by stopping the motor 430 when all the electronic component supply apparatuses become full, as shown in FIG. By doing so, the supply operation of the electronic component from the bowl 420 to the rail 422 can be stopped. The electronic component mounting apparatus 10 can reduce power consumption by stopping the supply operation of the electronic component from the bowl 420 to the rail 422 in a full state. In addition, the electronic component mounting apparatus 10 can resume vibration in a short time by maintaining the state which excited the motor 430 even when the vibration is stopped. As a result, the delay of supply of the electronic component to the holding position can be suppressed, and the electronic component can be efficiently mounted on the substrate.

The electronic component mounting apparatus 10 executes the charging replenishment operation of filling the bowl feeder assembly 90 (or the bowl feeder unit 400) as a setup operation, that is, before starting the mounting operation of the electronic component on the substrate. It is desirable to make this possible.

Hereinafter, the charging replenishment operation will be described with reference to FIGS. 122 to 124. 122 is an explanatory diagram showing an example of an operation screen. 123A and 123B are explanatory diagrams which respectively show an example of an operation screen. 124 is a flowchart showing an example of the operation of the electronic component mounting apparatus.

The electronic component mounting apparatus 10 displays the operation screen 730 based on the operator's operation during the setup operation. The operation screen 730 is a screen for inputting various operations during the setup operation, and a button 732 is displayed. The button 732 is a button for instructing the execution of the refilling operation. The electronic component mounting apparatus 10 displays the operation screen 740 of FIG. 123A related to the charge replenishment operation, when operation is input to the button 732. FIG.

The operation screen 740 shown in FIG. 123A is an operation screen of the charge replenishment operation displayed when the button 732 is operated. The operation screen 740 includes a display area 742 and buttons 748 and 749. The display area 742 is a display area which shows the state of each electronic component mounting apparatus (bowl feeder), and the item 744 corresponding to each electronic component mounting apparatus is displayed. Item 744 indicates whether charging replenishment is completed and whether the electronic component mounting apparatus is installed at the corresponding position. When the item 744 is full, "OK" is displayed. When the item 744 is not full, "Incomplete" is displayed. In addition, when the electronic component mounting apparatus is not installed in the corresponding position, item 744 is displayed with "*＊＊＊". When the button 748 is operated in the state where the operation screen 740 is displayed, the electronic component mounting apparatus executes the charge refilling operation. When the button 749 is operated while the operation screen 740 is displayed, the electronic component mounting apparatus stops the refilling operation.

The operation screen 740a illustrated in FIG. 123B is a screen displayed in a state where the charge refilling operation is completed. In the operation screen 740a, "incomplete" has disappeared from the item 744, and the sentence "Charge replenishment completed" is displayed in the message display column 746. As shown in FIG.

As shown in FIG. 124, when the electronic component mounting apparatus 10 detects the charging supplement instruction which instruct | indicates execution of a charging supplement operation, as step S660, it drives a drive apparatus and performs a supply operation of an electronic component as step S662. It starts.

If the electronic component mounting apparatus 10 started a supply operation in step S662, it determines with step S664 whether all the electronic component supply apparatuses driven by the same drive apparatus are full. That is, it is determined whether all the electronic component supply apparatuses of one bowl feeder unit 400 are full. On the other hand, whether each electronic component supply apparatus is full can be detected by the process mentioned above. The electronic component mounting apparatus 10 proceeds to step S664 when it is determined in step S664 that it is not full (No). When it is determined in step S664 that the electronic component mounting apparatus 10 is full (Yes), the electronic component mounting apparatus 10 stops the driving apparatus and ends the present process in step S666.

The electronic component mounting apparatus 10 can fill the electronic component mounting apparatus by performing the process shown in FIG. It is preferable that the electronic component mounting apparatus 10 performs the above-mentioned air blowing operation | movement during execution of the electronic component supply operation. The electronic component mounting apparatus 10 can promptly start mounting of an electronic component at the start of production by performing a charge replenishment operation.

Next, with reference to FIG. 125, the control operation of the head based on the detection result of the holding position side component detection sensor is demonstrated. 125 is a flowchart showing an example of the operation of the electronic component mounting apparatus. The electronic component mounting apparatus 10 repeats the process of FIG. 125, while performing the electronic component mounting operation. The electronic component mounting apparatus 10 acquires the detection result of the holding position side component detection sensor in step S670, and determines whether there is an electronic component in step S672. That is, the electronic component mounting apparatus 10 determines whether the electronic component is detected in the holding position.

When it is determined in step S672 that the electronic component is present (Yes), the electronic component mounting apparatus 10 executes the holding operation of the electronic component by the head, and ends this processing in step S674. That is, the electronic component detected at the holding position is held by the nozzle of the head, and the mounting operation of the electronic component is executed. When it is determined in step S672 that there is no electronic component (No), the electronic component mounting apparatus 10 causes the head to wait as step S676. In other words, the head waits for execution of the holding operation of the electronic component at the holding position.

If the electronic component mounting apparatus 10 has waited for the head in step S676, it is determined in step S678 whether the absence state continues for a certain time, that is, whether the state in which the electronic component is not detected in the holding position continues for a predetermined time. do. When the electronic component mounting apparatus 10 determines in step S678 that the state in which it is absent does not continue for a predetermined time (No), it progresses to step S670 and repeats the said process.

If it is determined that the absence of the state in step S678 continues for a predetermined time (Yes) in step S678, the electronic component mounting apparatus 10 outputs error information as step S679, and ends the present process.

As shown in Fig. 125, the electronic component mounting apparatus 10 controls the holding operation of the head based on the detection result of the holding position side component detection sensor, thereby performing the holding operation of the electronic component in a state in which the electronic component cannot be held. Can be suppressed. Accordingly, the holding operation of the electronic component is executed, the state of the electronic component is measured by the laser recognition device 38 or the like, it is detected that the electronic component is not held, and then the holding operation of the electronic component is executed again. The risk of repeating the operation can be reduced, and the work efficiency can be improved. In addition, when the electronic component is not detected, the error information is output, whereby the operator can be quickly notified that a problem has occurred in the supply of the electronic component by the electronic component mounting apparatus.

Here, the electronic component mounting apparatus 10 of the said embodiment is equipped with the bowl feeder assembly 90 which used the bowl feeder as a component supply unit 14f, and the electronic component of a radial feeder as a component supply unit 14r. Although it was set as the structure provided with the supply apparatus 100, it is not limited to this. The electronic component mounting apparatus 10 can make a component supply unit into various combinations. For example, the electronic component supply apparatus of a bowl feeder may be provided in both the front and rear component supply units, and the electronic component supply apparatus of a radial feeder may be provided in both the front and rear component supply units. In addition, as described above, the component supply unit may include an electronic component supply apparatus (chip component feeder) 100a for supplying a mounted electronic component. In addition, you may make the electronic component supply apparatuses of the component supply unit of one of the front and the rear all the electronic component supply apparatus (chip component feeder) 100a. That is, even if the component supply unit of one of the front and the rear supplies a lead type electronic component (electronic component inserted into a board | substrate), and the other may supply a leadless electronic component (electronic component mounted on a board | substrate). It's okay. As the electronic component mounting apparatus, a so-called tray feeder or an axial feeder can also be used. The electronic component mounting apparatus 10 can be mounted or inserted into a board | substrate by attracting or holding an electronic component, even if it is an electronic component supplied by any electronic component supply apparatus. On the other hand, in an electronic component supply device for supplying a lead type electronic component, the lead type electronic component is held by the nozzle in a direction in which the main body is disposed above the vertical direction of the lead, that is, in a direction in which the lead is disposed below the vertical direction of the main body. To the holding position. Here, the electronic component mounting apparatus 10 is a component supply unit provided with the electronic component mounting apparatus of a bowl feeder, the component supply unit provided with the other kind of electronic component mounting apparatus, and a board | substrate conveyance part like this embodiment. It is preferable to arrange | position to the opposing position across the (12). Thereby, the influence of the vibration of a bowl feeder can be suppressed in the component supply unit provided with the other kind of electronic component mounting apparatus.

Next, the modification of the electronic component mounting apparatus is demonstrated using FIGS. The electronic component mounting apparatus shown in FIGS. 126-139 is an electronic component mounting apparatus which performs the mounting process of an electronic component in the state supported by the back surface by the backup apparatus provided with a some backup pin.

126A and 126B are side views each showing the schematic structure of the conventional backup apparatus. Here, FIG. 126A has shown the state in which the board | substrate 100 is stopped in the component mounting position. The backup apparatus 862 is arrange | positioned under the board | substrate 861, The backup apparatus 862 has the backup table in which the some backup pin 863 which supports the board | substrate 861 from the lower surface at the time of component mounting is provided. 864.

The backup table 864 is configured to be movable up and down, and after the substrate 861 is positioned at the component mounting position as shown in FIG. 126B, the backup table 864 is raised as shown in FIG. 126B. The substrate 861 is lifted by the backup pin 863. Thus, the electronic component 107 is mounted on the board | substrate 861 by the adsorption nozzle 866 of the mounting head 865 in the state supported by the front-end | tip part of the backup pin 863 from the lower surface of the board | substrate. do.

The position of the backup pin 863 standing up on the backup table 864 is determined according to the kind (size, shape, etc.) of the board | substrate 861. For this reason, the backup table 864 is provided with a plurality of pin holes into which the backup pins 863 can be inserted and removed, and the arrangement of the backup pins 863 can be changed according to the type of the substrate. .

According to the kind of the board | substrate 861, there exists a technique of patent document 1 as an automatic test whether a backup pin 863 is arrange | positioned at a suitable position. This technique is provided with a plurality of switches that are turned on and off in accordance with insertion and removal of the backup pins 863, and arrangement position data of the backup pins 863 obtained from signals of the plurality of switches, and are registered in advance. Is to compare the appropriate position data.

Here, as an electronic component mounted on a board | substrate, there exists a radial lead type electronic component (radial component, lead component) in which the lead used as a terminal protrudes on the lower surface, such as an aluminum electrolytic capacitor or a resistor which requires an upright mounting. When such a radial lead type electronic component is mounted on a substrate, the lead of the electronic component inserted into the insertion hole may be clinched as described above. On the other hand, although the electronic component mounting apparatus 10 can be mounted correctly on a board | substrate even if it does not implement as mentioned above, it can also be set as the structure which clinches.

127A and 127B are illustrations showing clinch processing of the radial lead type electronic components, respectively. Such a radial lead type electronic component is an insert-mount electronic component. When mounting on a substrate, first, as shown in FIG. 127A, the lead 820a is inserted into the insertion hole 861a formed in the substrate 861 from the upper surface of the substrate. And insert the lead 820a from the lower surface of the substrate. Then, as shown in FIG. 127B, the radial lead electronic component 820 is fixed to the substrate 861 by performing a clinching process of bending the lead portion on the lower surface of the substrate.

In this way, the electronic component mounting apparatus in which no mechanism for performing the clinch processing of the lead portion is provided, inserts the lead into an insertion hole formed in the substrate at the time of mounting the radial lead type electronic component, and mounts the substrate if necessary. After carrying out to the outside of the apparatus, the clinch processing is performed by the dedicated apparatus. For this reason, it is preferable that the electronic component mounting apparatus 10 is equipped with the mechanism which can clinch the lead of an electronic component. In addition, it is preferable that the electronic component mounting apparatus 10 is provided with the mechanism which can clinch the lead of an electronic component in a backup pin.

Next, the specific structure of the backup pin in this embodiment is demonstrated. 128A is a front view illustrating the configuration of the backup pin. 128B is a side view illustrating the configuration of the backup pin. The backup pin 840 extends in the vertical direction and includes a pair of clinch guides (support members) 841 that support the lower surface of the circuit board 8 at its upper end when the component is mounted. The pair of clinch guides 841 are disposed to face each other in the horizontal direction in FIG. 128A, and the lower ends thereof are connected to the guide flanges 842 at predetermined intervals. Here, each clinch guide 841 is guide flange 842 centering on the axis | shaft 843 extended in the paper vertical direction (direction perpendicular | vertical to the up-down direction and the opposing direction of the clinch guide 841) in FIG. 128A. ) Can be connected rotatably. At this time, the clinch guide 841 is strongly attached to the guide flange 842 by caulking or the like. Thereby, as shown by the backup pins 840a, 840b, and 840c of FIG. 129, the space | interval (alpha) of the upper end part of the clinch guide 841 can be made variable. In this manner, the opening and closing mechanism of the clinch guide 841 is realized by the guide flange 842 and the shaft 843.

Moreover, the lead guide groove 841a is formed in the upper end part of each clinch guide 841 in the side surface on the opposite side to the arrangement side of the opposing clinch guide 841. The lead guide groove 841a has a constant groove width in the extending direction, and the bottom surface of the lead guide groove 841a is an inclined surface inclined with respect to the horizontal plane. Each clinch guide 841 supports the lower surface of the board | substrate 8 by the upper surface 841b shown in FIG. Here, the upper surface 841b of the clinch guide 841 is a horizontal surface.

131 shows the shape of the lead guide groove 841a. As shown in FIG. 131, the inclined surface formed by the lead guide groove 841a is comprised by two inclined surfaces in which the inclination-angle with respect to the horizontal surface differs vertically. That is, the inclination angle of the inclined surface is changed in the point P in the middle of the up and down direction, the inclination angle of the upper inclined surface QP is gentle (inclination angle = θ1), and the inclination angle of the lower inclined surface PR The inclination angle is steep (inclination angle = θ1 + θ2). The angles θ1 and θ2 are set to, for example, θ1 = 30 ° and θ2 = 30 °. In addition, in FIG. 131, the point Q is the upper end part of the bottom surface (inclined surface) of the lead guide groove 841a, and the point R is the lower end part of the bottom surface (inclined surface) of the lead guide groove 841a.

Returning to FIG. 128, the guide flange 842 is screwed to the screw shaft 844 extended in an up-down direction, and the height position is adjustable. Moreover, the nut 845 is also screwed under the guide flange 842 to the screw shaft 844, and the height position of the guide flange 842 can be locked by the double nut system. The screw shaft 844 is fixed to the base 846 in which the lower end part is provided in a backup table. Thus, the height adjusting mechanism (height adjusting means) of the clinch guide 841 is realized by the guide flange 843, the screw shaft 844, and the nut 845.

And when the backup pin 840 is installed on a backup table, as shown in the backup pins 840a, 840b, and 840c of FIG. 129, the height of the backup pin 840 (a clinch guide from the bottom surface of the base 846). The height to the tip end of 841; β is adjusted so that it is always constant regardless of the interval α (distance between points shown in FIG. 131) of the upper end of the clinch guide 841. The arrangement position of the backup pin 840 on the backup table is predetermined based on the type (substrate mounting pattern) of the substrate 8. For this reason, before starting a component mounting process, a layout which recorded the arrangement position of the backup pin 840 according to the board mounting pattern is affixed on the backup table 850, and the backup pin 840 is arrange | positioned according to the layout diagram. do. On the other hand, the backup pin 840 is mounted on the backup table 850 by being attracted to the backup table 850 by a magnet or inserted into a hole formed in the backup table 850.

132 is a view showing an arrangement example of the backup pin 840. As illustrated in FIG. 132, a plurality of backup pins 840 are disposed on the backup table 850. At this time, the backup pin 840 is always arrange | positioned in the position corresponding to the mounting point of the insertion type radial lead type electronic component 820 as shown in FIG. In the other areas, the backup pins 840 in a state where the upper end of the clinch guide 841 is closed are appropriately disposed at positions where the substrate 8 can be supported such that the substrate 8 is not bent.

The radial lead type electronic component 820 includes lead terminals 820a protruding downward one by one on both sides from a lower surface thereof. In the board | substrate 8, the some insertion hole for inserting the lead 820a of the radial lead-type electronic component 820 is formed, and when mounting the radial lead-type electronic component 820 on the board | substrate 8, First, the lead 820a is inserted from above the insertion hole of the board | substrate 8, and this lead 820a protrudes from the lower surface of the board | substrate 8. The radial lead type electronic component 820 is fixed to the substrate 8 by performing a clinching process of bending the lead 820a on the lower surface of the substrate 8.

In this embodiment, when the backup pin 840 is disposed at a position corresponding to the mounting point of the radial lead type electronic component 820, the positional relationship between the insertion hole of the lead 820a and the clinch guide 841 is shown in FIG. Make the relationship shown in 133. 133 is a view showing the positional relationship between the insertion hole of the lead and the inclined surface of the backup pin. FIG. 133 shows the top view of the positional relationship between the insertion hole of a lead and the inclined surface of a backup pin in the upper surface, and shows the front sectional view of the positional relationship between the insertion hole of a lead and the inclined surface of a backup pin in the lower surface. 133 briefly shows the distal end of the backup pin 840. As shown in FIG. 133, the backup pin 840 arrange | positioned in the position corresponding to the mounting point of the radial lead-type electronic component 820 has the front-end diameter A; gap (alpha) of the upper end part of the clinch guide 841. As shown in FIG. ), The opening degree of the clinch guide 841 is adjusted by the opening / closing mechanism so that the smaller than the distance between the centers B of the insertion holes 805a for inserting the lead 820a of the radial lead type electronic component 820. do. In the clinch guide 841, the outer diameter C of the backup pin 840 (the distance between the points R of the clinch guides 841) is the distance B between the centers of the insertion holes 805a. ) And its thickness is set so as to be larger than the sum D of the diameters of the? And the insertion hole 805a.

That is, as shown in the front sectional view of FIG. 133, when viewed from the front, the position Q in the horizontal direction (the radial direction of the insertion hole 805a) of the inclined surface is in the range of the insertion hole 805a. At the same time, it is located at a position away from the backup pin 840 than the center position of the insertion hole 805a. In addition, when viewed from the front, the position R in the horizontal direction (the radial direction of the insertion hole 805a) of the lower end portion of the inclined surface is outside the range of the insertion hole 805a and the center position of the insertion hole 805a. It is in a position more outward of the backup pin 840.

Although not particularly shown, from the side view, the center position in the horizontal direction (the radial direction of the insertion hole 805a) of the upper end portion of the inclined surface coincides with the center position of the insertion hole 805a. The width of the upper end of the inclined surface (the groove width of the upper end of the lead guide groove 841a) is set equal to or larger than the diameter of the insertion hole 805a. By such a configuration, the electronic component mounting apparatus inserts the lead 820a into the insertion hole 805a when the radial lead type electronic component 820 is mounted on the substrate 8, and thus the radial lead type electronic component 820. The lower end of the lead 820a contacts the inclined surface formed at the upper end of the backup pin 840, and is bent along the inclined surface as shown in FIG. As described above, the electronic component mounting apparatus can perform the clinching process of the lead 820a at the same time as the radial lead type electronic component 820 is mounted on the substrate 8.

Next, the mounting method to the board | substrate 8 of the radial lead type electronic component 820 in this embodiment is demonstrated using FIG. FIG. 135 is a view showing the operation when the radial lead type electronic component is mounted in the present embodiment. FIG. First, the head 15 is moved and the upper surface of the radial lead type electronic component 820 is held from the component supply device 15 by the nozzle 32. After the component recognition by the VCS unit 17 is performed, the electronic component mounting apparatus moves the head 15 to the mounting point of the retained radial lead type electronic component 820. At this time, in the electronic component mounting apparatus, as shown in step S701 of FIG. 135, the lead 820a of the radial lead type electronic component 820 is positioned vertically above the insertion hole 805a formed in the substrate 8. Stops the head 15.

Next, the suction nozzle of the head 15 is lowered. At this time, as shown in step S702 of FIG. 135, the lead 820a is inserted into the insertion hole 805a. Since the front end diameter A of the clinch guide 841 is set to be smaller than the distance B between the centers of the insertion holes 805a, it is further from the state shown in step S702 of FIG. When the nozzle 32 is lowered, as shown in step S703 of FIG. 135, the lower end of the lead 820a abuts on the bottom surface of the lead guide groove 841a formed in the upper end of the backup pin 840.

Since the bottom surface of the lead guide groove 841a is an inclined surface that is inclined with respect to the horizontal surface, when the suction nozzle is further lowered from the state shown in step S703 in FIG. 135, the nozzle 32 from the upper surface of the radial lead electronic component 820 is lowered. ), The lower end of the lead 820a is bent along the shape of the lead guide groove 841a as shown in step S704 of FIG. 135. Subsequently, as shown in step S705 of FIG. 135, the nozzle 32 is lowered until the bottom surface of the radial lead type electronic component 820 contacts the top surface of the substrate 8 to form a radial lead type electronic component ( 820 release the adsorption. The angle with respect to the horizontal surface of the front-end | tip of the lead 820a at this time becomes the angle (theta) 1 of the inclined surface of the upper side in the bottom surface of the lead guide groove 841a. Since the angle θ1 of the inclined surface on the upper side is set to a relatively small angle, the radial lead electronic component 820 does not come off from the substrate 8 by clinching on the inclined surface on the upper side.

Here, in this embodiment, the inclined surface formed by the bottom surface of the lead guide groove 841a is comprised by two inclined surfaces which differ in the inclination angle up and down. If a lower inclined surface with a relatively inclined angle with respect to the horizontal surface is not provided, and the clinch processing is to be performed only with an upper inclined surface with a relatively small inclination angle with respect to the horizontal surface, the tip of the lead 820a is below the insertion hole 805a. In the process of protruding, the distal end portion thereof does not extend to the outside of the clinch guide 841, and there is a fear that the clinch processing may not be performed properly.

On the other hand, in this embodiment, in the process of the tip part of the lead 820a protruding below the insertion hole 805a, since this tip part can be relief | released to the outer side of the clinch guide 841 by the lower inclined surface, the lead 820a can be appropriately enlarged. At this time, since the lead 820a can be clinched while guiding the lead 820a by the side surface of the concave lead guide groove 841a, the lead guide groove 841a of the lead 820a at the time of clinching in the width direction is Relief can be suppressed.

And when all the electronic components are mounted on the board | substrate 8, a backup table will descend | fall, and the backup pin 840 will be separated from the board | substrate 8 as shown in step S706 of FIG. After the support of the substrate 8 is released by the backup device in this manner, the substrate 8 is carried out from the electronic component mounting apparatus 1, and the lead 820a of the radial lead type electronic component 820 reflows. It is completely fixed by soldering or the like of the method. As described above, since the lead 820a of the radial lead type electronic component 820 is clinched at the time of mounting on the substrate 8, even when the substrate 8 vibrates when the substrate 8 is taken out, the radial lead As long as an external force is not directly applied to the type electronic component 820, the lead 820a can be kept inserted into the insertion hole 805a.

In this way, an inclined surface inclined with respect to the horizontal plane is formed at the upper end portion of the backup pin that supports the circuit board from the rear surface when the component is mounted, and the backup pin is disposed at least vertically below the mounting point of the radial lead type electronic component. At this time, it arrange | positions so that the position of the upper end part of the inclined surface in the radial direction of the insertion hole of the lead formed in the circuit board may be in the range of an insertion hole, and the position which deviates to one side with respect to the center position of an insertion hole. Moreover, the position of the lower end of the inclined surface in the radial direction of the insertion hole is arranged so as to be outside the range of the insertion hole and out of the other side with respect to the center position of the insertion hole.

Thereby, when the component is mounted, when the lead of the radial lead type electronic component protrudes from the lower surface of the insertion hole of the circuit board, the tip portion thereof can be brought into contact with the inclined surface. For this reason, by lowering a radial lead type electronic component from such a state, the front-end | tip part of a lead terminal can be bent along the said inclined surface. In this manner, the clinch processing of the lead terminals can be performed simultaneously with the component mounting, so that the lead terminals can be made difficult to be removed from the insertion holes of the substrate. Therefore, even if the substrate vibrates at the time of carrying out after the component mounting, the state where the radial lead type electronic component is mounted on the substrate can be maintained.

In addition, since the clinch function of the lead is provided to the backup pin, there is no need to newly install a dedicated mechanism for the clinch processing, and the space can be reduced by that amount. In addition, since the backup pin can be used without being limited to the clinch function, the backup pin can be used as a normal substrate support pin if it is disposed at a place other than the vertical downward of the mounting point of the radial lead type electronic component. Further, since the lead guide groove extending in the vertical direction at the upper end of the clinch guide is formed, and the inclined surface is formed by the bottom surface of the lead guide groove, the relief of the lead terminal is suppressed by the guide of the lead guide groove, The clinch process can be performed.

In addition, the inclined surface is composed of two inclined surfaces having different inclination angles with respect to the horizontal plane, and the angle of the upper inclined surface is set smaller than that of the lower inclined surface. In the process of protruding downward, the lead tip portion can be released in the clinch direction by the lower inclined surface. Therefore, the lead terminal can be bent smoothly. Moreover, since the angle with respect to the horizontal surface of the lead terminal after clinching process can be made into the angle of a comparatively small upper inclined plane, the radial lead type electronic component after clinching process can be stably fixed to a circuit board.

Moreover, since the opening / closing mechanism which can adjust the opening degree of the upper end part of a clinch guide is provided, it can respond to the clinch process of several radial lead type electronic components from which a lead pitch differs with one kind of backup pin. At this time, since the lower ends of the pair of clinch guides are rotatably connected to the guide flanges, the opening and closing mechanism can be realized with a relatively simple configuration.

Moreover, since the height adjustment mechanism of the clinch guide is provided, the height of the some backup pin can be made constant regardless of the opening degree of the upper end part of a clinch guide, and a circuit board can be stably supported. At this time, by locking the height position of the clinch guide by the double nut method, it can be resistant to the height change in the component mounting.

In addition, in the said embodiment, although the case where only one lead guide groove 841a was formed in the clinch guide 841 was demonstrated, two lead guide grooves 841a can also be formed as shown in FIG. . As a result, the lead-type electronic component is not a radial lead type electronic component 820 having one lead 820a on one side as shown in FIG. 127 but a radial lead type having two leads on one side. It can correspond to an electronic component. Also, a radial lead type electronic component having two or more leads on one side can be coped with by adjusting the number of grooves of the lead guide groove 841a, the gap between the grooves, the groove width, and the like in accordance with the number of leads and the lead pitch.

In addition, in the said embodiment, although the case where the groove width of the lead guide groove 841a was made constant in the extending direction was demonstrated, as shown in FIG. 137, from the front-end | tip part of the clinch guide 841 in an extension direction. The farther it is, the narrower the groove width may be. Thereby, the lead relief at the time of clinching can be suppressed more effectively.

In the above embodiment, the case of performing the part recognition using the VCS unit 17 has been described, but as described above, the part recognition can also be performed by the laser recognition device 38. In this case, the laser device includes a laser irradiation unit for irradiating laser light in the horizontal direction and a laser light receiving unit for receiving laser light irradiated by the laser irradiation unit.

138A is a side view showing another example of a part recognition method. 138B is a bottom view showing another example of the component recognition method. As shown in Figs. 138A and 138B, when the radial lead type electronic component 820 is recognized, the component recognition is performed while the suction nozzle is moved to a position where the lead 820a is caught by the laser surface. The above-mentioned method can be used as a component recognition method by a laser. First, the adsorption part is rotated while receiving the laser light irradiated from the laser irradiation part at the laser light receiving part, and the part which becomes the shadow at every predetermined rotation angle is stored. At the end of the rotation, the part outline is drawn by the optical axis and shadow of the laser. By this method, as shown in FIG. 139, the X direction dimension (distance X between the leads 820a) and the Y direction dimension (diameter Y of the lead 820a) of a lead part can be recognized.

Next, the component center position is calculated on the basis of the external shape recognition result of the lead portion, and the shift amount of the component center with respect to the head rotation center (component adsorption center) previously stored as a parameter is calculated. Here, as said shift | offset | difference amount, the shift | offset | difference amount dX of the X direction of a component center with respect to a head rotation center, the shift amount dY of the Y direction of a component center with respect to a head rotation center, and the angle of a component center with respect to a head rotation center The deviation amount dθ of is calculated. Then, the positions of the component mounting coordinates are corrected by using the calculated shift amounts dX, dY, and dθ as the X-direction correction value, the Y-direction correction value, and the θ-direction correction value, and the parts are mounted. Accordingly, the radial lead type electronic component 820 can be mounted on the substrate 8 at an appropriate angle at an appropriate position.

In addition, in the said embodiment, although the case where the lead 820a of both sides was clinched in the opposite direction was demonstrated, the direction to clinch the lead 820a is not limited to this. That is, the surface which forms the lead guide groove 841a in the clinch guide 841 can be selected suitably. In addition, although the lower end of the clinch guide 841 is attached to the guide flange 842 by caulking to adjust and maintain the rotational position, it is possible to fasten and relax by a screw or the like to adjust and maintain the rotational position. It's okay.

Moreover, in the said embodiment, although the case where the opening-and-closing mechanism was implement | achieved by connecting each lower end part of a pair of clinch guide 841 rotatably with the guide flange 842, the pair of clinch guide 841 was demonstrated. If it is a structure which makes the space | interval (alpha) of the upper end of a variable, it is not limited to this. In addition, although the case where the height adjustment mechanism was realized by screwing the guide flange 842 to the screw shaft 844 extended in an up-down direction was demonstrated, if it is a structure which can adjust the height of the clinch guide 841, it is this. It is not limited.

Next, an example of the component supply apparatus which is a bowl feeder is demonstrated using FIGS. 140-149C. For reference, the electronic component mounting apparatus 902 shown in FIGS. 140-149C is basically the same structure as the electronic component mounting apparatus 402, 404, 406 mentioned above.

As shown in FIG. 140, the electronic component supply apparatus 902 is a bowl feeder which supplies the electronic component P to the holding position hold | maintained by the nozzle of a head by a vibrating system. The electronic component supply apparatus 9910 conveys the electronic component P to the holding position just before the board | substrate conveyance part 12 via the linear rail 904. FIG. The electronic component supply apparatus 902 has a metal bowl 931 (accommodating container) formed in a cylindrical shape with an upper surface open, and accommodates a plurality of electronic components P in the bowl 931 individually. In the bowl 931, a conveying path 933 for conveying the electronic component P from the bottom portion toward the opening side is provided in a spiral shape along the inner circumferential surface 932.

The bowl 931 is connected to a vibration unit for applying vibration. When vibration is applied to the bowl 931 by the vibrating portion, the electronic component P placed on the bottom portion moves on the conveyance path 933 toward the opening side. In the vicinity of the exit of the spiral conveyance path 933, a resin sending part 941 made to feed the rails 904 along the direction of the electronic component P is attached. In the delivery part 941, a linear conveyance path (base rail; 942) is formed which is connected to the spiral conveyance path 933, and such a linear conveyance path 942 is also subjected to the vibration of the vibrating part to be used as an electronic component (P). ) Is moved toward the rail 904.

The delivery part 941 is provided with the distribution part 943 which passes only the electronic component P of a predetermined direction in the vicinity of the exit of the spiral conveyance path 933. In addition, in the delivery part 941, the drop part which changes the electronic component P arrange | positioned by the distribution part 943 to the attitude | position which can adsorb | suck by the nozzle 21 near the inlet part of the rail 904. (drop in portion 944) is provided. Electronic component P which passed the delivery part 941 is transmitted to the rail 904, and is conveyed toward a holding position. The rail 904 consists of a pair of linear metal plate, and is extended so that it may incline downward from the electronic component supply apparatus 902 to a holding position slightly. The rail 904 also receives the vibration of the vibrator and conveys the electronic component P toward the mounting apparatus 1.

Here, with reference to FIG. 141 and FIG. 142, a transmission part is demonstrated in detail. For reference, in the following description, in the case where the electronic component supply apparatus supplies large electronic components, respectively, in FIGS. 141A and 142A, the electronic component supply apparatus supplies the small components in FIGS. 141B and 142B. 141A and 141B are perspective views of the components according to the present embodiment, respectively. 142A and 142B are partial perspective views of the component supply apparatus which concerns on this embodiment, respectively. On the other hand, FIG. 141A shows a large component. 141B shows a small component. Moreover, FIG. 142A shows the component supply apparatus which conveys the large components shown in FIG. 141A. FIG. 142B shows the component supply apparatus for conveying the small component shown in FIG. 141A.

As shown in FIG. 141A, when the large electronic component Pa is referred to as the length dimension X in the X-axis direction, the width dimension Y in the Y-axis direction, and the height dimension Z in the Z-axis direction, It has a rectangular parallelepiped part main body 971a which becomes> Z> Y. The component main body 971a is provided with a plurality of leads 973a which protrude outward from the mounting surface 972a mounted on the substrate W. As shown in FIG. On the mounting surface 972a, four leads 973a and five leads 973a are arranged in two rows side by side in the X-axis direction. The electronic component Pa is attached to the board | substrate W by inserting the lead 973a into the mounting hole formed in the board | substrate W. As shown in FIG.

As shown in FIG. 141B, the small electronic component Pb is X when the X-axis direction is the length dimension X, the Y-axis direction is the width dimension Y, and the Z-axis direction is the height dimension Z. A rectangular parallelepiped part main body 971b is formed. In the component main body 971b, a plurality of leads 973b protruding outward from the mounting surface 972b to be mounted on the substrate W is provided. On the mounting surface 972b, three leads 973b arranged in the X-axis direction are arranged in one row. In addition, a recess 975b is formed in the component main body 971b so as to expose the center lid 973b to the outside. The electronic component Pb is attached to the board | substrate W by inserting the lead 973b into the mounting hole formed in the board | substrate W. As shown in FIG.

As shown in FIG. 142A, in the bowl 931a of the electronic component supply apparatus 902a, the spiral conveyance path 933a is formed along the circumferential wall part 934a. That is, one side of the conveyance path 933a is surrounded by the circumferential wall portion 934a in the conveyance width direction, and the other end side of the conveyance direction is open toward the inside of the bowl 931a. On the said conveyance path 933a, the electronic component Pa is conveyed in various postures along the circumferential wall part 934a. For example, the electronic component Pa is a standing posture in which the longitudinal direction (X-axis direction) of the component main body 971a is in the longitudinal direction, and the transverse direction in which the width direction (Y-axis direction) of the component main body 971a is in the longitudinal direction. The attitude | position and the height direction (Z-axis direction) of the component main body 971a are conveyed in the longitudinal attitude | position which faces a longitudinal direction. On the other hand, in the standing posture and the transverse posture, the lid 973a faces the transverse direction, and in the longitudinal posture, the lead 973a faces the longitudinal direction.

The delivery part 941a is provided near the exit of the conveyance path 933a of the bowl 931a, and is a conveyance path (base rail) which connects the spiral conveyance path 933a of the bowl 931 and the rail 904a. 942a). On one end side of the conveyance path 942a in the conveyance width direction, an outer wall portion 945a is formed which is connected to the circumferential wall portion 934a of the bowl 931a. The other end side in the conveyance width direction of the conveyance path 942a is open toward the bowl 931a. The delivery part 941a is provided with the distribution part 943a which selects the electronic component Pa which enters in various postures from the spiral conveyance path 933a.

The distribution part 943a passes only the electronic component Pa conveyed in a predetermined posture, and is made of a metal guide part 951a (first guide part) and a conveying path 942a provided on the conveying path 942a. And a chamfer portion 952a (width reduction portion) formed in the groove. The guide portion 951a is provided on an attachment plate 953a attached to the outer wall portion 945a and is formed by folding a band plate extending forward from the attachment plate 953a. The guide part 951a extends so that the upper direction of the conveyance path 942a may cross diagonally toward the downstream side from the upstream of a conveyance direction.

In this case, the lower end of the guide portion 951a crosses a position slightly higher than the width dimension Y of the electronic component Pa from the road surface of the conveyance path 942a. Therefore, the electronic component Pa of the horizontal posture passes below the guide part 951a, and the passage of the electronic component Pa of the standing posture and the longitudinal attitude is restricted by the guide part 951a. The electronic parts Pa in the standing posture and the longitudinal posture are guided along the extending direction of the guide portion 951a, and are removed from the conveying path 942a and returned to the inside of the bowl 931a (see FIG. 143). In this way, the guide portion 951a passes only the electronic component Pa in the horizontal posture.

The chamfer 952a is formed in the range slightly longer than the length dimension X of the electronic component Pa in the other end side of the conveyance path direction of the conveyance path 942a below the guide part 951a. The chamfer 952a narrows the conveyance width of the conveyance path 942a so that the lead 933a faces the inside of the bowl 931a of the electronic component Pa in the transverse direction (the electronic component of FIG. 143A). Pass only the electronic component Pa (see (Pa2)). Among the electronic parts Pa in the lateral direction, the electronic parts Pa in the opposite direction in which the lead 953a faces the outer wall part 945a side are shifted toward the chamfer 952a side. Then, it is dropped from the conveyance path 942a and returned to the inside of the bowl 931a. Thus, the chamfer 952a passes only the electronic component Pa of a basic posture among the electronic components Pa of a lateral posture.

In addition, the electronic component Pa in which the lead 973a faces the conveying direction among the electronic parts Pa in the lateral posture is sent out because the length dimension X is sufficiently large with respect to the conveying width of the conveying path 933a. Before entering the part 941a, it is dropped from the conveyance path 933a and returned to the inside of the bowl 931. By this structure, the attitude | position of the electronic component Pa which passes through the distribution part 943a is uniformly aligned, and is conveyed toward the rail 904a. Moreover, the delivery part 941 is provided with the drop part 944a which changes a posture in the attitude | position which can attract the electronic component Pa of a basic posture by the mounting head 3, and sends it to the rail 904a.

The drop portion 944a knocks down the electronic component Pa conveyed along the outer wall portion 945 in the conveying width direction by its own weight by the recessed portion 954a formed to narrow the conveying width of the conveying path 942a. It is formed to throw. At this time, the electronic component Pa of the basic posture is dropped from the lead 973a facing the inside of the bowl 931a to the inside of the depression 954a, and the posture is changed to a longitudinal posture in which the lead 973a faces downward. (See FIGS. 145A-145C). The electronic component Pa whose posture is changed is conveyed toward the rail 904a and conveyed toward the holding position. The attitude | position of the electronic component Pa at this time is set as the appropriate attitude | position with respect to the head 15 which attaches the electronic component Pa from upper direction with respect to the board | substrate W. As shown in FIG.

As shown in FIG. 142B, the electronic component supply apparatus 902b has the metal guide part 955b (second guide part) which guides the small electronic component Pb toward the chamfer 952b. Is different from the electronic component supply apparatus 902a only. Therefore, the same structure as the electronic component supply apparatus 902a is abbreviate | omitted as much as possible, and only the guide part 955b is demonstrated in detail. In this electronic component supply apparatus 902b, since the length dimension X of the electronic component Pb is not large enough with respect to the conveyance width of the helical conveyance path 933b, the lead in the electronic component Pb of a lateral posture is read. The electronic component Pb (see electronic component Pb5 in FIG. 143B) in which the 933b faces the conveyance direction also enters the delivery section 941b without falling off.

Since the electronic component Pb conveyed in such a direction is conveyed in a lateral posture, it passes below the strip | belt-shaped guide part 951b. In addition, even on the conveyance path 942b narrowed by the chamfer 952b, since the center of gravity of the electronic component Pb is located on the conveyance path 942b, the electronic component Pb is removed from the chamfer 952b. Difficult to drop out Accordingly, the discharging part 941b guides the electronic component Pb toward the chamfer 952b by the guide portion 955b, whereby the lead 973b of the transverse posture faces the conveying direction. Pb) is separated from the conveying path 933b.

The guide part 955b is attached to the guard 56b fixed to the outer wall part 945b, and is formed in an arcuate shape from the cross section (Kb). The guide part 955b is provided so that the conveyance path 942b may be extended toward the inside of the bowl 931b from the outer wall part 945b side, and the tip part which faces the inside of the bowl 931b is upward of the chamfer 952b. Located in The tip portion of the guide portion 951b is formed in a wedge shape so as to guide the electronic component Pb toward the chamfer 952b. In this case, the tip portion of the guide portion 951b avoids the lead 973b toward the inside of the bowl 931b with respect to the electronic component Pb conveyed in the basic position, and the electronic component Pb conveyed out of the basic position. ) Is formed to abut on the component main body 971b (see FIG. 144). In this way, the electronic component Pb passing through the distribution part 943b is aligned in the same posture and conveyed toward the rail 904b.

Referring to FIGS. 143A and 143B, a state in which components are distributed by the distribution unit will be described. 143A and 143B are views showing how the components are distributed by the distribution unit according to the present embodiment, respectively. On the other hand, Fig. 143A shows the distribution of large parts, and Fig. 143B shows the distribution of small parts.

As shown in FIG. 143A, in the electronic component supply apparatus 902a, the large electronic component Pa is conveyed in various positions from the spiral conveyance path 933a of the bowl 931a. Here, the first electronic component Pa1 is in the longitudinal posture, the second electronic component Pa2 is in the transverse basic posture, and the third electronic component Pa3 is the reverse posture in the basic posture, and the fourth electronic component ( Pa4) is conveyed in a standing position, respectively. When the electronic component Pa1 in the longitudinal posture enters the delivery section 941a, the lead 973a of the electronic component Pa1 facing in the longitudinal direction is guided by the band-shaped guide portion 951a to enter the bowl 931a. Is returned. Then, when the electronic part Pa2 of the basic posture enters the delivery part 941a, the lead main body 971a which fell to the side, and the component main body 971a which the width dimension Y faces the longitudinal direction are guide parts of strip shape. Passes below 951a. At this time, since the lead 973a of the electronic component Pa2 faces the inside of the bowl 931a, and the center of the electronic component Pa2 is inclined toward the outer wall portion 945a, the electronic component Pa2 is chamfered. Through 952a, there is no dropping into the bowl 931a.

Next, when the electronic component Pa3 in the reverse posture enters the delivery section 941a, the lead body 971a that has fallen to the side and the component main body 971a in which the width dimension Y is in the longitudinal direction are guided in the form of a band-shaped guide ( Pass under 951a). At this time, since the lead 973a of the electronic component Pa3 faces the outer wall portion 945a side, and the center of gravity of the electronic component Pa3 is inclined toward the chamfer 952a side, the electronic component Pa3 is conveyed. It is dropped from the furnace 942a and returned to the inside of the bowl 931a. Then, when the electronic part Pa4 of the standing posture enters the delivery part 941a, the component main body 971a in which the longitudinal dimension X stands in the longitudinal direction is guided by the strip | belt-shaped guide part 951a, and a bowl 931a returns to the inside. In this way, only the basic electronic component Pa2 is conveyed toward the drop portion 944a.

As shown in FIG. 143B, in the electronic component supply apparatus 902b, the small electronic component Pb is conveyed in various postures from the spiral conveyance path 933b of the bowl 931b. Here, the first electronic component Pb1 is in the longitudinal posture, the second electronic component Pb2 is in the transverse basic posture, and the third electronic component Pb3 is the reverse posture in the basic posture, and the fourth electronic component ( Pb4) is conveyed in the standing posture and the orthogonal posture in which the fifth electronic component Pb5 is rotated 90 degrees in the horizontal direction with respect to the basic posture. When the electronic component Pb1 in the longitudinal posture enters the delivery section 941b, the lead 973b of the electronic component Pb1 facing in the longitudinal direction is guided by the strip-shaped guide portion 951b to form the inside of the bowl 931b. Return to.

Next, when the electronic component Pb2 of the basic posture enters the delivery part 941b, the component body 971b with the lead 933b lying sideways and the width dimension Y in the longitudinal direction is guided in the form of a band-shaped guide ( 951b). At this time, the lead 973b of the electronic component Pb2 faces the inside of the bowl 931b, and the center of gravity of the electronic component Pb2 is biased toward the outer wall portion 945b, and the electronic component Pb2 is arcuated. Since it does not contact 955b, the electronic component Pb2 does not fall into the bowl 931b through the chamfer 952b (see FIGS. 144A and 144B). Then, when the electronic component Pb3 in the reverse posture enters the delivery section 941b, the side parts lead 933b and the component body 971b in which the width dimension Y is in the longitudinal direction are guided in the form of a strip. Passes below 951b. At this time, the electronic component Pb3 is guided toward the chamfer 952b by the tip of the arc-shaped guide portion 955b, and is dropped from the conveying path 942b to be returned to the inside of the bowl 931b.

Next, when the electronic part Pb4 in the standing posture enters the delivery part 941b, the component main body 971b whose length dimension X is vertically guided is guided by the guide part 951b, and into the bowl 931b. Is returned. Then, when the orthogonal posture electronic component Pb5 enters the delivery part 941b, the component main body 971b with the side fall lead 933b and the width dimension Y toward the longitudinal direction is guide part 951b. To pass down. At this time, the electronic component Pb5 is guided toward the chamfer 952b by the tip of the arc-shaped guide portion 955b, is dropped from the conveying path 942b, and returned to the inside of the bowl 931b (Fig. 144C and Fig. 144D). Thus, even when small electronic component Pb is conveyed, only the electronic component Pb2 of a basic posture is conveyed toward the drop part 944b.

With reference to FIG. 144, the state where a small component is guided by the arch-shaped guide part is demonstrated. 144 is a view showing a state in which parts are guided by an arch guide part according to the present embodiment. On the other hand, Figures 144A and 144B show the case where the basic posture parts are conveyed, and Figs. 144C and 144D show the cases where the orthogonal posture parts are conveyed, respectively.

As shown in FIGS. 144A and 144B, in the electronic component Pb conveyed in the basic posture, the lead 973b faces the inside of the bowl 931b, and the guide portion 955b is located near the root of the lid 973b. The space which reliefs the front-end | tip of this is formed. Therefore, even if the electronic component Pb of a basic posture is conveyed on the conveyance path 942b, the guide part 955b does not contact the electronic component Pb. On the other hand, as shown in FIGS. 144C and 144D, in the electronic component Pb conveyed in the orthogonal attitude, the lead 973b faces the front of the conveyance direction, and the space which reliefs the front-end | tip part of the guide part 955b is formed. It is not. Therefore, when the orthogonal posture electronic component Pb is conveyed on the conveyance path 942b, the electronic component Pb is guided toward the chamfer 952b by the front-end | tip part of the guide part 955b, and into the bowl 931b. Drop out By this structure, the arcuate guide part 955b can pass only the electronic component Pb of a basic posture.

With reference to FIGS. 145A-145C, the state which the attitude | position of a component is changed by the drop part is demonstrated. 145A to 145C are views showing how the attitude of the parts is changed by the drop unit according to the present embodiment. 145A shows a state in which the attitude of the large parts is changed, FIG. 145B shows a state in which the attitude of the large parts is changed in the drop portion of the comparative example, and FIG. 145C shows a state in which the attitude of the small parts is changed.

As shown in FIG. 145A, the drop part 944a is formed by narrowing the conveyance path 942a by the recessed part 954a. The recessed part 954a is formed so that the width | variety may become narrow by the pair of inclined surfaces 961a and 963a which oppose in the conveyance width direction. When the electronic part Pa is conveyed on the conveyance path 942a narrowed by the recessed part 954a, the electronic component (Pa) of the corner part 962a of the conveyance path 942a and the inclined surface 961a becomes a point. Pa) falls in the direction of the arrow. At this time, the inclined surface 963a functions as a guide surface for guiding the tip of the lead 973a to the bottom surface 964a, so that the electronic component Pa can be smoothly knocked down. By this structure, the posture of the electronic component Pa in the transverse posture is changed to the longitudinal posture in which the lead 973a faces downward.

By the way, as shown to FIG. 145B, in the drop part 944c which concerns on a comparative example, the rail 904c is provided below perpendicularly. For this reason, when the electronic component Pa fell, the situation which the front-end | tip of the lead 973a caught on the boundary part between the inclined surface 963c and the rail 904c generate | occur | produced. Therefore, in the drop portion 944a according to the present embodiment, the tip of the lead 973a is guided by the inclined surface 963a when the electronic component Pa falls, so that the attitude change of the electronic component Pa is ensured. After the termination is completed, it is sent out to the rail 904a. Thereby, the electronic component Pa can be continuously sent to the rail 904a without the electronic component Pa being blocked in the depression 954a.

On the other hand, as shown in FIG. 145C, in the small electronic component Pb, although the lead 973b is formed in a row in a horizontal direction, the attitude | position is changed similarly to the large electronic component Pb. In addition, in this embodiment, although the guide surface which guides the front-end | tip of the lead 973a, 973b was comprised by the inclined surface 963a, 963b, it is not limited to this structure. The guide surface should just be able to guide the tip of the leads 973a and 973b, for example, it may be a curved surface.

By the above structure, the electronic component P is conveyed from the electronic component supply apparatus 902 to a holding position in an appropriate position. In this case, the electronic component P is conveyed to the holding position in a longitudinal posture in which the length dimension X is in the conveying direction and the lead 973 is directed downward, and the conveyance is reversed before and after in the conveying direction. It may become. As a result, the electronic component mounting apparatus determines the direction of the electronic component P as described above, and attaches it to the substrate W after returning the electronic component P conveyed back and forth in an appropriate direction. . Hereinafter, the direction discrimination process of the electronic component P in the electronic component mounting apparatus will be described.

The head 15 takes out the electronic component P supplied from the electronic component supply apparatus 902 by the nozzle 32, and correct | amends the position shift amount by SWEEP measurement. SWEEP measurement irradiates a laser beam from the side with respect to the component main body 971, rotating the electronic component P adsorbed by the nozzle 32. As shown in FIG. And the shadow of the component main body 971 is detected by a CCD line sensor, and the shift amount XY (theta) of the position and the direction of the electronic component P with respect to the nozzle 32 is calculated. According to such a shift amount, the shift amount is corrected by the rotation of the θ motor of the nozzle 32 and the XY moving mechanism 16.

When the head 15 corrects the position by SWEEP measurement, the head 15 adjusts the irradiation height of the laser light to the lead 973 of the electronic component P. Then, the laser beam is irradiated to the lead 973 of the electronic component P, and the front and rear directions of the electronic component P are determined by ONCE measurement. With ONCE measurement, the laser beam is irradiated to the lead 973 of the electronic component P adsorbed by the nozzle 32, and the coordinates (left end coordinates) and the right inner side of the left inner side of the shadow of the lead 973 are included. To get the coordinates (right coordinate) of. The head 15 determines the inversion state based on how the shadow produced by the lead 933 becomes a non-object based on the threshold value α set as the reference coordinate.

Here, with reference to FIGS. 146A-146C, the direction determination process using ONCE measurement is demonstrated in detail. 146A-146C is a figure which shows an example of ONCE measurement of the large component which concerns on this embodiment, respectively. 147A and 147B are diagrams each showing an example of ONCE measurement of the small component according to the present embodiment. In addition, in the following description, it is assumed that the direction of the component at the time of normal supply is set to 90 degrees, and the direction of the component at the time of reverse supply is set to 270 degrees with respect to the controller of the mounting apparatus. In addition, in FIG. 146 and FIG. 147, the coordinate axis is set so that it may become large from left to right. Incidentally, in the following description, the direction discrimination process is performed using ONCE measurement, but the direction discrimination process may be performed using SWEEP measurement.

As shown to FIG. 146A, in the large electronic component Pa, several lead 973a is arrange | positioned side by side in 2 rows along the longitudinal direction (X-axis direction). Therefore, even if the laser light is irradiated from the arrangement direction of the lead 973a, whether the shadow generated by the lead 973a is a target for the threshold α which becomes the reference coordinate, is it normally conveyed in the direction of 90 degrees? It is not possible to determine whether or not it has been inverted in the direction of FIG. Therefore, for example, as shown in Figs. 146B and 146C, by setting the direction discrimination angle to 945 degrees, the shadow generated by the lead 973a is made on the basis of the threshold value α during normal supply and reverse supply. We do not target.

As shown to FIG. 146B and 146C, by the irradiation of the laser beam with respect to the lid 973a, the coordinate of the left inner side and the right inner side of the shadow formed by the lid 973a are acquired. The center coordinates of the coordinates of the left inner side and the coordinates of the right inner side are calculated, and the direction of the electronic component Pa is determined according to which of the left and right with respect to the threshold α. In the direction shown in FIG. 146B, the center coordinate Ac between the left inner coordinate Al and the right inner coordinate Ar of the shadow is located to the left of the threshold α, and thus the value of the central coordinate Ac. It is set lower than this threshold value α. On the other hand, in the direction shown in Fig. 146C, the center coordinate Bc between the left inner coordinate Bl and the right inner coordinate Br of the shadow is located to the right of the threshold α, and thus the center coordinate Bc. Is set higher than the threshold value α. For example, when the direction shown in FIG. 146B shows a normal supply, the electronic component Pa shown in FIG. 146C is rotated 180 degrees, and is adjusted to an appropriate direction.

In addition, the threshold value α is a coordinate stored in the control device 20 in advance, for example, satisfies the requirement of α = (Ac + Bc) / 2. In addition, in this embodiment, it is determined whether the lead 973a is appropriately arrange | positioned with respect to the component main body 971a other than said direction discrimination process. For example, when the center coordinates Ac and Bc exist within a predetermined error range centering on the threshold value α, the electronic component Pa is determined to be defective and discarded. As a result, for example, a defective product in which the lead 973a is bent can be separated from the production line. On the other hand, the error range is a threshold α ± error determination value β, for example, to satisfy the requirement of the error determination value β = (Ac−α) / 2.

As shown in FIG. 147, in the small electronic component Pb, the some lead 973b is arrange | positioned side by side along the longitudinal direction (X-axis direction). In this case, when the laser light is irradiated from the arrangement direction of the lead 973b, the shadow generated by the lead 973b becomes non-object based on the threshold α at the time of normal supply and the reverse supply. Based on the above, it can be determined whether it is conveyed normally in the direction of 90 degrees or inverted and conveyed in the direction of 270 degrees. Therefore, the direction discrimination angle is set to 0 degrees. In the direction shown in FIG. 147A, the center coordinate Ac between the left inner coordinate Al and the right inner coordinate Ar of the shadow is located to the left of the threshold α, and thus the value of the central coordinate Ac. It is set lower than this threshold value α. On the other hand, in the direction shown in FIG. 147B, the center coordinate Bc between the left inner coordinate Bl and the right inner coordinate Br of the shadow is located to the right of the threshold α and the center coordinate Bc. Is set higher than the threshold value α. For example, when the direction shown in FIG. 147A shows a normal supply, the electronic component Pb shown in FIG. 147B is rotated 180 degree | times, and it adjusts to an appropriate direction.

In addition, the threshold value α is a coordinate previously stored in the control unit 18 similarly to the direction discrimination processing of the large electronic component Pa, and satisfies, for example, the requirement of α = (Ac + Bc) / 2. . In addition, in the case of the electronic component Pb in which the leads 973b are in a line, the direction can be determined using only the left inner coordinates or the right inner coordinates without calculating the center coordinates of the shadow of the lead 973b. Do. In addition, in this embodiment, it is determined whether the lead 973b is appropriately arrange | positioned with respect to the component main body 971b other than the said direction discrimination process. For example, when the center coordinates Ac and Bc exist in the predetermined error range centering on the threshold value α, the electronic component Pb is determined to be defective and discarded. Thereby, the defective article which the lead 973b bent can be isolate | separated from a manufacturing line. On the other hand, the error range is a threshold α ± error determination value β, for example, satisfying the requirement of the error determination value β = (Ac−α) / 2.

The direction discrimination process shown by this embodiment is only an example, It is not limited to such a structure. The direction discrimination process should just be a structure which discriminates inversion of a component using the coordinate of the shadow of a lead, The threshold value (alpha), the method of a direction discrimination process, the irradiation position of a laser beam, etc. may be changed suitably. In addition, the error determination process should just be a structure which determines whether a lead is appropriately arrange | positioned with respect to a component main body using the coordinate of the shadow of a lead, The error range, the method of an error determination process, etc. may be changed suitably.

Referring to Fig. 148, the flow of the direction discrimination process will be described. 148 is a flowchart of the direction determining process according to the present embodiment. In addition, although the flow of the direction discrimination process of a large component is demonstrated here, the flow of the direction discrimination process of a small component is the same. On the other hand, it is assumed that the control unit of the mounting apparatus has previously set the direction discrimination, the discrimination method, the threshold value, the error determination value, the direction discrimination height, and the direction discrimination angle.

As shown in FIG. 148, when the electronic component Pa is sent to the electronic component supply apparatus 902a, the electronic component Pa is taken out from the rail 904 by the nozzle 32 of the head 15, and a board | substrate Electronic component Pa is conveyed toward the mounting position with respect to (W). Each process from step S681 to step S689 is performed during the conveyance of the electronic component Pa. First, the electronic component mounting apparatus performs SWEEP processing on the electronic component Pa at the start of conveyance of the electronic component Pa in step S681. In the SWEEP process, the laser light source and the CCD line sensor are matched to the height position of the component main body 971a, and the laser light is irradiated to the component main body 971a while the component main body 971a is rotated. And the shift amount of the position or direction of the electronic component Pa with respect to the nozzle 32 is computed from the shadow of the component main body 971a, and the shift amount is correct | amended.

Next, in the electronic component mounting apparatus, in step S682, the laser light source and the CCD line sensor are adjusted to the direction discrimination height, that is, the height of the lead 973a of the electronic component Pa. Next, in step S683, the electronic component mounting apparatus performs ONCE processing on the electronic component Pa in which the lead 973a is positioned at the direction determination height. In the ONCE process, the direction of the electronic component Pa is matched to the direction discrimination angle, and the laser light is irradiated to the lead 973a of the electronic component Pa matched to the direction discrimination angle. Then, the left inner coordinates and the right inner coordinates of the shadow of the lead 973a are acquired, and the center coordinates of the shadow of the lead 973a are calculated. When the left inner coordinates and the right inner coordinates of the shadow of the lead 973a are acquired, the direction of the electronic component Pa is returned to the original angle from the direction determination angle.

Next, in step S684, the electronic component mounting apparatus determines whether the center coordinate is within the error range defined by the error determination value. If it is determined in step S684 that the center coordinate is within the error range (Yes), the electronic component mounting apparatus discards the electronic component Pa in step S685, for example, because the lead 973a is bent. On the other hand, when the electronic component mounting apparatus determines that the central coordinate is out of the error range (No) in step S684, the central coordinate and the value of the threshold value α are compared in step S686 to determine the electronic component Pa. It determines whether the direction is a 90 degree direction or a 270 degree direction.

When the electronic component mounting apparatus determines in step S686 that the direction of the electronic component Pa at the time of normal supply is set to 90 degrees (90 °), the central coordinate is smaller than the threshold value α as step S687. Determine whether or not. When the electronic component mounting apparatus determines in step S687 that the central coordinate is smaller than the threshold value α (Yes), the electronic component Pa from the electronic component supply apparatus 902a is normal to the holding position (90). And the insertion operation | movement to the board | substrate W is performed as step S690. On the other hand, in the electronic component mounting apparatus, when it is determined in step S687 that the central coordinate is equal to or greater than the threshold value α, the electronic component Pa is removed from the electronic component supply apparatus 902a with respect to the mounting apparatus 1. It is assumed that it is supplied in an inverted direction (270 degrees), and in step S689, the direction of the electronic component Pa is reversed and set in the normal direction. In step S690, the electronic component mounting apparatus performs an insertion operation for inserting the electronic component Pa aligned in the normal direction with respect to the substrate W. As shown in FIG.

When the electronic component mounting apparatus determines in step S686 that the direction of the electronic component Pa at the time of normal supply is set to 270 degrees (270 °), the central coordinate is larger than the threshold value α as step S688. Determine whether or not. When the electronic component mounting apparatus determines in step S688 that the center coordinate is larger than the threshold α (Yes), the electronic component supply apparatus 902a is in a normal direction from the electronic component supply apparatus 902a for the holding position 270. And the insertion operation | movement with respect to the board | substrate W is performed as step S690. On the other hand, in the electronic component mounting apparatus, when it is determined in step S688 that the center coordinate is equal to or less than the threshold α, the direction in which the electronic component Pa is reversed from the electronic component supply apparatus 902a with respect to the holding position. It is supplied at (90 degrees), and in step S689, the direction of the electronic component Pa is reversed and aligned in the normal direction. In step S690, the electronic component mounting apparatus performs an insertion operation for inserting the electronic component Pa aligned in the normal direction, with respect to the substrate W. As shown in FIG.

Thus, not only the conveyance posture of the electronic component Pa from the electronic component supply apparatus 902a, but also the front-back direction of the electronic component Pa in a conveyance direction is matched to a normal direction, and the board | substrate W is carried out. It is possible to reliably prevent the mounting error of the electronic component Pa against the. In addition, during the conveyance of the electronic component Pa by the head 15, the rotational correction of the front and rear directions of the electronic component Pa enables the electronic component Pa to be efficiently mounted on the substrate W. FIG. . On the other hand, in the electronic component mounting apparatus, in step S686, for example, the direction at the time of normal supply is set to 90 degrees for the large electronic parts Pa, and the direction at the time of normal supply is set for the small electronic parts Pb. It may be set to 270 degrees.

In this embodiment, although the direction discrimination process is performed with respect to the component with a lead, it is also possible to perform the direction discrimination process with respect to the component without a lead. With reference to FIGS. 149A-149C, the direction determination process using ONCE measurement about the component without a lead is demonstrated. 149A to 149C are views each showing an example of ONCE measurement for the part without a lead according to the present embodiment. In addition, in the following description, it is assumed that the direction of the component at the time of normal supply is set to 90 degrees, and the direction of the component at the time of reverse supply is set to 270 degrees with respect to the controller of the mounting apparatus. In addition, in FIG. 149, the coordinate axis is set to become large from the left side to the right side.

As shown in FIG. 149A, the electronic component Pc has an inclined surface 77c inclined at about 945 degrees with one corner of a rectangle cut out when viewed from the top. Therefore, by rotating the electronic component Pc 945 degrees and irradiating the laser light in parallel with respect to the inclined surface 77c, the electronic component Pc is centered on the threshold value α during normal supply and reverse supply. The shadows that they create are non-targets. As shown to FIG. 149B and FIG. 149C, by the irradiation of a laser beam, the coordinate of the left inner side and the right inner side of the shadow formed by the electronic component Pc are acquired. The center coordinates of the coordinates of the left inner side and the coordinates of the right inner side are calculated, and the direction of the electronic component Pc is determined according to which of the left and right with respect to the threshold α.

In the direction shown in FIG. 149B, the center coordinate Ac between the left inner coordinate Al and the right inner coordinate Ar of the shadow is located to the right of the threshold α, and thus the value of the central coordinate Ac. It is set higher than this threshold value α. On the other hand, in the direction shown in FIG. 149C, the center coordinate Bc between the left inner coordinate Bl and the right inner coordinate Br of the shadow is located to the left of the threshold α, and thus the center coordinate Bc. The value of is set lower than the threshold value α. For example, when the direction shown in FIG. 149B shows a normal supply, the electronic component P shown in FIG. 149C is rotated 180 degrees and adjusted to an appropriate direction.

In addition, the threshold value α is a coordinate stored in advance in the control device 20, for example, satisfies the requirement of α = (Ac + Bc) / 2. In addition, in this embodiment, it is determined whether the dimension error of the electronic component Pc is in the appropriate range other than the said direction discrimination process. For example, when the center coordinates Ac and Bc exist in the predetermined error range centering on the threshold value α, the electronic component Pc is determined to be defective and discarded. Thereby, the defective article with large dimensional error can be isolate | separated from a manufacturing line. On the other hand, the error range is a threshold α ± error determination value β, for example, satisfying the requirement of the error determination value β = (Ac−α) / 2.

In the case of the electronic component P, the direction discrimination processing is performed in substantially the same flow as the part with the lead. However, in the flowchart shown in FIG. 148, the process of adjusting the direction discrimination height (step S682 in FIG. 148) is performed. It is omitted. As described above, in the electronic component mounting apparatus according to the present embodiment, even when the electronic component Pc without a lead is different in the shadow formed by the electronic component Pc at the time of normal supply and at the time of reverse supply at the time of ONCE measurement. If so, the direction discrimination process can be performed.

As described above, according to the electronic component supply apparatus 902 according to the present embodiment, even if the electronic component P is an electronic component such as a mold release component or a connector, the electronic component having a predetermined posture by the distribution unit 943. Only (P) is selected and the drop part 944 is converted into the attitude | position which the head 15 can take out. Therefore, since the electronic component P is supplied to the holding position with the lead 973 facing downward, it is not necessary to change the attitude of the electronic component P on the head 15 side, and it is placed horizontally. The electronic component P can be supplied to the head 15 (holding position held by) which mounts the electronic component P with respect to the board | substrate W) by appropriate attitude | position.

The electronic component supply apparatus which becomes a bowl feeder is not limited to the said embodiment. For example, in the above-mentioned embodiment, although the components are distributed by the band-shaped guide part and the chamfer part, it is not limited to such a structure. The distribution part should just be a structure which makes only a part of a predetermined posture pass. In addition, although the distribution part was made into the structure which only passes a component of a transverse posture, you may make it the structure which only passes a component of a longitudinal posture.

In addition, in the above embodiment, the component is supplied to the mounting apparatus in a longitudinal posture in which the lead is directed downward by the distribution part and the drop part, but the configuration is not limited to this configuration. If the mounting nozzle corresponds to the transverse component in which the lead faces to the side, the component may be supplied to the mounting apparatus in the state of the transverse attitude.

In the above embodiment, the component supply device is configured to supply an electronic component (lead type electronic component) with a lead to the holding position, but is not limited to such a configuration. The component supply apparatus can also arrange the leadless components (mountable electronic components) in an appropriate posture and supply them to the mounting apparatus by means of the distribution section and the drop section.

Moreover, in above-mentioned embodiment, although the strip | belt-shaped board | plate material was extended so that it may cross the upper direction of a conveyance path as a 1st guide part, it is not limited to such a structure. The first guide portion may be configured in any way as long as it allows only a component having a predetermined posture to pass therethrough.

Moreover, in above-mentioned embodiment, although the arch-shaped board | plate material was arrange | positioned as the 2nd guide part across the conveyance path, it is not limited to this structure. What is necessary is just a structure which a 2nd guide part contacts with parts other than a basic posture and falls from a conveyance path.

Moreover, although the conveyance width of the conveyance path was narrowed by the chamfer part as a width reduction part in said embodiment, it is not limited to such a structure. The width reduction part should just be a structure which reduces the conveyance width of a conveyance path, for example, may reduce a conveyance width by notch.

In the above-described embodiment, the electronic component is mounted on the substrate, but the configuration is not limited to this configuration. The electronic component may be configured to be mounted on a substrate other than a substrate.

In addition, although the bowl feeder was illustrated and demonstrated as an electronic component supply apparatus in the above-mentioned embodiment, it is not limited to this structure. For example, a distribution part, a drop part, a direction discrimination process, etc. can be applied to a bulk feeder.

In addition, in the above-mentioned embodiment, although it was set as the structure which performs a direction discrimination process using ONCE measurement, it is not limited to this structure. The inversion before and after in the conveyance direction of the components only needs to be discriminated, and for example, the direction discrimination process may be performed using SWEEP measurement.

Next, another example of the electronic component mounting apparatus will be described with reference to FIGS. 150 to 160. 150 is a schematic diagram illustrating a schematic configuration of an electronic component mounting apparatus. 151 is a perspective view showing a schematic configuration of an electronic component mounting apparatus. On the other hand, the electronic component mounting apparatus 10a shown to FIGS. 150-160 is the same as that of the electronic component mounting apparatus 10 except the some structure, such as the number of heads.

The electronic component mounting apparatus 10a shown to FIG. 150 and 151 is an apparatus which mounts an electronic component on the board | substrate 8. FIG. The electronic component mounting apparatus 10a has the board | substrate conveyance part 12, the component supply units 14f and 14r, the head 15f and 15r, and the XY moving mechanism 16. As shown in FIG. The XY moving mechanism 16 includes X axis driving units 22f and 22r and Y axis driving unit 24. Here, the electronic component mounting apparatus 10a of this embodiment is equipped with the component supply unit 14f, 14r, the head 15f, 15r, and the X-axis drive part 22f, 22r, as shown in FIG. do. Thus, although the electronic component mounting apparatus 10a is equipped with two parts by one structure, in FIG. 151, in order to show the structure of each part easily, the component supply unit 14r, the head 15r, and the X-axis drive part are shown. The illustration of 22r is omitted. The electronic component mounting apparatus 10a becomes one module in which the component supply unit 14f, the head 15f, and the X-axis drive part 22f are arrange | positioned in front of the electronic component mounting apparatus 10a, and supply parts. The unit 14r, the head 15r, and the X-axis drive part 22r become one module arranged at the rear side of the electronic component mounting apparatus 10a. In addition, hereinafter, the two parts supply units 14f and 14r will be referred to as the component supply units 14 unless they are specifically distinguished, and the two heads 15f and 15r will be referred to as the heads 15a when not specifically distinguished. When the two X-axis drivers 22f and 22r are not particularly distinguished, the X-axis driver 22a is referred to. Here, the board | substrate conveyance part 12 and the component supply units 14f and 14r are the same structures as the electronic component mounting apparatus 10. As shown in FIG. The component supply units 14f and 14r include an electronic component mounting apparatus 100 for supplying lead type electronic components, a bowl feeder assembly 90, an electronic component mounting apparatus 100a for supplying mounted electronic components, and the like. do.

The head 15a adsorbs the electronic components held in the component supply unit 14, that is, the radial lead type electronic components held in the component supply apparatus 100 or the chip electronic components held in the component supply apparatus 100a. It is a mechanism which mounts the adsorbed electronic component on the board | substrate 8 moved to the predetermined position by the board | substrate conveyance part 12. As shown in FIG. In addition, the structure of the head 15 is mentioned later.

The XY moving mechanism 16 is a moving mechanism for moving the heads 15f and 15r on the X-axis direction and the Y-axis direction in FIG. 151, that is, on a plane parallel to the surface of the substrate 8. 22r) and the Y-axis drive part 24 is provided. The X-axis drive part 22f is connected to the head 15f and moves the head 15f in the X-axis direction. The X-axis driver 22r is connected to the head 15r and moves the head 15r in the X-axis direction. The Y-axis drive unit 24 is connected to the head 15 through the X-axis drive unit 22, and moves the head 15f in the Y-axis direction by moving the X-axis drive unit 22f in the Y-axis direction, The head 15r is moved to the Y-axis direction by moving the X-axis drive part 22r to the Y-axis direction. The XY moving mechanism 16 can move the head 15f to the position which faces the board | substrate 8, or the position which faces the component supply unit 14f by moving the head 15f to XY-axis direction. . The XY moving mechanism 16 can move the head 15r to the position which faces the board | substrate 8, or the position which faces the component supply unit 14r by moving the head 15r to an XY axis direction. . In addition, the XY moving mechanism 16 adjusts the relative position between the head 15 and the substrate 8 by moving the head 15. Thereby, the electronic component held by the head 15 can be moved to the arbitrary position of the surface of the board | substrate 8, and an electronic component can be mounted in the arbitrary position of the board | substrate 8 surface. In addition, as the X-axis drive part 22, various mechanisms for moving the head 15 to a predetermined direction can be used. As the Y-axis drive unit 24, various mechanisms for moving the X-axis drive unit 22 in a predetermined direction can be used. As a mechanism for moving an object in a predetermined direction, for example, a linear motor, a rack and pinion, a conveying mechanism using a ball screw, a conveying mechanism using a belt, or the like can be used.

The electronic component mounting apparatus 10a is equipped with two heads 15f and 15r, and can mount an electronic component with respect to one board | substrate alternately. In this way, by mounting the electronic components alternately with the two heads 15, the other head can absorb the electronic components in the component supply device while the one head mounts the electronic components on the substrate. Thereby, the time for which an electronic component is not mounted on the board | substrate 8 can be shortened, and an electronic component can be mounted efficiently.

Next, the structure of the head 15 is demonstrated using FIG. 152 and FIG. 153. FIG. 152: is a schematic diagram which shows schematic structure of the head of the electronic component mounting apparatus. 153 is a perspective view showing a schematic configuration of a head of an electronic component mounting apparatus. In addition, FIG. 152 also shows the various control part which controls the electronic component mounting apparatus 10a, and the one component supply apparatus 100 of the component supply unit 14 together. The head 15 has the head main body 30, the laser recognition apparatus 38, the imaging device 36a, and the height sensor 37a as shown to FIG. 152 and FIG. As shown in FIG. 152, the electronic component mounting apparatus 10a has the control part 60, the memory | storage part 61, the head control part 62, and the component supply control part 64. As shown in FIG. In addition, the electronic component mounting apparatus 10a is connected to a power source and uses the control unit 60, the storage unit 61, the head control unit 62, the component supply control unit 64, and various circuits to supply the power supplied from the power source. To each unit. The control part 60, the memory | storage part 61, the head control part 62, and the component supply control part 64 are mentioned later. As described above, the electronic component supply apparatus 100 exposes the electronic component 80 held by the electronic component holding tape.

The head main body 30 has the head support body 31 which supports each part, the some nozzle 32, and the nozzle drive part 34. As shown in FIG. As shown in FIG. 153, six nozzles 32 are arrange | positioned at the head main body 30 of this embodiment in a row. Six nozzles 32 are arranged in a direction parallel to the X axis. The head support 31 is a support member connected to the X-axis drive unit 22 and supports the nozzle 32 and the nozzle drive unit 34. On the other hand, the head support 31 also supports the imaging device 36a, the height sensor 37a, and the laser recognition device 38. In addition, the head main body 30 and the laser recognition apparatus 38 are the same structures as each part of the head 15 mentioned above.

The imaging device 36a is fixed to the head support 31 of the head main body 30, and has a region facing the head 15, for example, a substrate 8 on which the substrate 8 or the electronic component 80 is mounted. Take a picture. Hereinafter, the structure of the imaging device 36a is demonstrated using FIG. 154A and 154B. Here, FIG. 154A is sectional drawing which shows schematic structure of the imaging device of the electronic component mounting apparatus. 154B is a perspective view showing a schematic configuration of a photographing apparatus of an electronic component mounting apparatus. 154A and 154B, the imaging device 36a includes a housing 51, a camera body 52, a lens 54, a vertical light 56, an angle light 58, It has outer ring illumination 59. The housing 51 is a support member for supporting each of the camera body 52, the lens 54, the vertical light 56, the angle light 58, and the outer ring light 59, and is fixed to the head support 31. It is. The camera main body 52 is provided with an imaging element and is a mechanism which photographs the area | region which faces the head 15. As shown in FIG. The camera body 52 sends the acquired image to the control unit 60. The lens 54 is mounted on the substrate 8 side of the camera body 52, that is, vertically lower side, and adjusts the focus and magnification of the image incident on the camera body 52. On the other hand, the lens 54 may not be provided with a mechanism for adjusting the focus and magnification of the image incident on the camera body 52, that is, it may be a fixed optical system. The vertical illumination 56 is arranged on the substrate 8 side, that is, the vertical direction lower side than the lens 54. The vertical light 56 illuminates the substrate 8 by irradiating light from the vertical direction toward the substrate 8. The angle light 58 is arranged on the substrate 8 side, that is, the vertical direction lower side than the vertical light 56. The angle illumination 58 illuminates the board | substrate 8 by irradiating light from the oblique direction toward the board | substrate 8. The outer ring light 59 is arranged on the substrate 8 side, that is, vertically lower side than the angle light 58. The outer ring light 59 illuminates the board | substrate 8 by irradiating light so that the outer periphery of the imaging area of the camera main body 52 may be enclosed toward the board | substrate 8. The vertical illumination 56, the angle illumination 58, and the outer ring illumination 59 can use various illumination apparatuses as an illumination device which irradiates light, For example, light-emitting elements, such as LED, can be used. The vertical illumination 56, the angle illumination 58, and the outer ring illumination 59 have an opening between the camera body 52 and the substrate 8. Thereby, the camera main body 52 can capture the image of the board | substrate 8, without being obscured by the vertical illumination 56, the angle illumination 58, and the outer ring illumination 59. FIG.

The imaging device 36a of the present embodiment has the above configuration, and photographs an image of a BOC mark or through hole as a reference mark formed on the surface of the substrate 8 as described later. Here, in this embodiment, although the reference position of the wiring pattern formed in the surface of the board | substrate was detected using the BOC mark, you may use another reference mark. In addition, the photographing apparatus 36a adjusts the amount of light output from the vertical illumination 56, the angle illumination 58, and the outer ring illumination 59, thereby adjusting the amount of light illuminating the substrate 8 from three directions. It can adjust, and the image of the through-hole formed in the board | substrate and the image of a BOC mark can be acquired with higher precision. In addition, the control unit 60 can detect the position of the through hole with higher accuracy by inverting the polarity of the image photographed by the imaging device 36a, that is, the black and white. Specifically, since the through hole is a hole and becomes black on the image, it is possible to float white by reversing the polarity, so that the outline and hole diameter of the through hole can be detected with higher accuracy.

The height sensor 37a is fixed to the head support 31 of the head main body 30, and the area | region which faces the head 15, for example, the board | substrate 8 in which the board | substrate 8 and the electronic component 80 were mounted Measure the distance to). The height sensor 37a includes a light emitting element for irradiating laser light and a light receiving element for receiving laser light reflected and returned from a facing position, and a portion facing in time until light is emitted from the laser light; A laser sensor that measures the distance can be used. Moreover, the height sensor 37a detects the height of the facing part, specifically, the electronic component by processing the distance with the facing part using the position of the board | substrate and the position of a board | substrate at the time of a measurement. In addition, the control part 60 may perform the process which detects the height of an electronic component based on the measurement result of the distance with an electronic component.

Next, a control function of the device configuration of the electronic component mounting apparatus 10a will be described. As shown in FIG. 152, the electronic component mounting apparatus 10a has a control part 60, the memory | storage part 61, the head control part 62, and the component supply control part 64 as a control function. Each of the various control units is constituted by a member having a CPU, an operation processing function such as ROM or RAM, and a storage function. In addition, in this embodiment, although it was set as the some control part for the convenience of description, you may use as one control part. In addition, when the control function of the electronic component mounting apparatus 10a is set as one control part, it may be implemented by one computing device or may be implemented by a plurality of computing devices. The control part 60, the head control part 62, and the component supply control part 64 are the same structures as each part of the electronic component mounting apparatus 10. FIG. On the other hand, the electronic component mounting apparatus 10 may also be equipped with the memory | storage part 61 separately from the control part 60 similarly.

The storage unit 61 is connected to the control unit 60 and has a storage function such as a ROM or a RAM. In addition, the memory | storage part 61 may be provided integrally with the control part 60, and may be provided separately. The memory | storage part 61 memorize | stores the data which the control part 60 acquired from each part, and the data computed by the control part 60 and calculated. The storage unit 61 corrects, for example, data of a design drawing including through-hole coordinate design values, reference mark coordinate design values, and electronic component mounting coordinate design values, shapes of various electronic components, adsorption conditions, and adsorption processing. Remember conditions, production programs, and more. On the other hand, the storage unit 61 can delete unnecessary data under the control of the control unit 60.

Next, each operation of the electronic component mounting apparatus 10a will be described. For reference, the following control operation can also be performed in the electronic component mounting apparatus 10. 155 to 157, the operation of determining the position on the substrate 8 on which the electronic component mounting apparatus 10a mounts the electronic component will be described. It is explanatory drawing which showed an example of the design drawing of the board | substrate which mounts an electronic component. 156 is a flowchart showing an example of the operation of the electronic component mounting apparatus. It is explanatory drawing for demonstrating operation | movement of the electronic component mounting apparatus.

As shown in FIG. 155, the electronic component mounting apparatus 10a stores the information of the design drawing 970, The position where the electronic component 80 is to be mounted in the board | substrate 8 based on the information of the design drawing 1570 is shown. Decide The electronic component mounting apparatus 10a acquires the information of the design drawing 970 through a communication line or from a storage medium, and stores the acquired information in the storage unit 61. Here, the design drawing 970 includes a plurality of electronic component mounting regions 980. The electronic component mounting area 980 is design value information of the mounting coordinates of the electronic component on the substrate, that is, the electronic component mounting coordinate design value. The plurality of electronic component mounting regions 980 included in the blueprint 970 differ in size and shape depending on the type of electronic component to be mounted. Further, in the electronic component mounting area 980, design value information of 982a, 982b, 982c, 984a, 984b, 986a, 986b, and 986c, that is, through hole formation coordinates corresponding to the position at which the lead wire of the electronic component to be mounted is inserted, that is, Through-hole coordinate design values are included. Here, the through hole forming position 982a, the through hole forming position 982b, and the through hole forming position 982c are through holes adjacent to each other. The through hole forming position 986a, the through hole forming position 986b, and the through hole forming position 986c are also through holes adjacent to each other. Another through hole is disposed between the through hole forming position 984a and the through hole forming position 984b. On the other hand, in FIG. 155, although the code | symbol was used for some through-hole formation position of the electronic component mounting area 980, when the other electronic component mounting area 980 also has a through hole, the through-hole formation position is provided. In addition, although only the electronic component mounting area | region 980 corresponding to the electronic component which has a lead wire was shown in FIG. 155, the design drawing 970 shows the electronic component which does not have a lead wire as a kind of electronic component, ie, surface mount. Information on the electronic component mounting area corresponding to the position where the electronic component is mounted is included. The design drawing 970 also includes a reference mark coordinate design value which is design value information of coordinates of the BOC mark 990 serving as a reference mark of the mounting position of the electronic component to be surface mounted. Thus, the design drawing 970 contains the electronic component mounting coordinate design value, the through-hole coordinate design value, and the reference mark coordinate design value.

The electronic component mounting apparatus 10a reads and analyzes the information of the design drawing 970 shown in FIG. 155 from the memory | storage part 61, and determines the kind of electronic component mounted in the board | substrate 8, and the mounting position of each electronic component. Obtain information such as design values. Moreover, the electronic component mounting apparatus 10a corrects the acquired design value based on the information of the board | substrate acquired by the imaging device 36a. Hereinafter, the correction process of the mounting position is demonstrated using FIG. For reference, the process shown in FIG. 156 can be implemented by executing the process of the control part 60 and controlling the operation of each part.

First, the control part 60 reads the design value of the coordinate of a BOC mark in step S712. That is, the control part 60 reads the information of the design drawing corresponding to the board | substrate which mounts an electronic component from the memory | storage part 61, and the reference mark coordinate which is a position in which the BOC mark is formed on the board | substrate based on the information of a design drawing. Read the design value information. Next, the control part 60 reads the design value of the coordinate of a through-hole as step S714. That is, the control part 60 reads out the through-hole coordinate design value which is the information of the position in which the through-hole is formed on the board | substrate based on the information of a design drawing from the memory | storage part 61. FIG. Here, the control part 60 reads out the design value of the coordinate of the at least 2 or more through hole which is a target to perform correction process among the many through-hole coordinate design values. Through-hole coordinates to be read out are represented by three points of through-hole design coordinates 982a, 982b, and 982c, and three points of through-hole design coordinates 986a, 986b, and 986c. Target the hole. That is, through-holes with different through-hole design coordinates, such as two points of through-hole design coordinates 984a and 984b, are not targeted. In addition, the processing order of step S712 and step S714 may be reversed. In addition to the BOC mark coordinate design value and through hole coordinate design value, the control unit 60 also reads information on the electronic component mounting coordinate design value which is the electronic component mounting area. That is, the control part 60 reads out the production program which is a mounting program which performs the process which mounts an electronic component in the board | substrate 8. In addition, the control part 60 may read the mounted program prepared previously, and may produce the production program based on the coordinate of the design drawing 970. FIG. In the production program, mounting coordinate data, component angles, dimensions, and the like of each component obtained from the substrate data are input. The control part 60 mounts a component on a board | substrate according to a production program.

If the control part 60 performed the process of step S714, it carries in a board | substrate as step S716. That is, the control part 60 carries in and fixes the board | substrate 8 to the position where the electronic component can be mounted by the head 15a, ie, a component mounting area | region.

If the board | substrate was carried in in step S716, the control part 60 will measure the position of a BOC mark as step S718. Specifically, the control unit 60 is expected to have a BOC mark based on the design value of the coordinates of the BOC mark read out in step S712 and the position of the substrate 8 conveyed using the imaging device 36a. Acquire an image of the position. The control part 60 measures the position of the BOC mark of the board | substrate 8, ie, the position of an actual BOC mark by interpreting it as the image acquired by the imaging device 36a.

If the control part 60 measured the position of a BOC mark in step S718, it measures the position of the through-hole which is a measurement object as step S720. Specifically, the control part 60 uses the imaging device 36a, and there exists a through hole which is a measurement object based on the design value of the coordinate of the through-hole read in step S712, and the position of the board | substrate 8 conveyed. Acquire an image of the expected position. The control part 60 measures the position of the through-hole of the board | substrate 8, ie, the position of an actual through-hole, by interpreting it as the image acquired by the imaging device 36a. In addition, the electronic component mounting apparatus 10a may measure the coordinate of a through hole with the above-mentioned height sensor 37a provided in the head. That is, the electronic component mounting apparatus 10a measures the height of the surface of a board | substrate with the height sensor 37a, the coordinate whose through-hole is formed in the coordinate whose height is lower than the surface of a board | substrate, or the coordinate which cannot measure a height. It may be measured as.

When the position of the through hole is measured in step S720, the control unit 60 compares the measurement result with a design value in step S722, calculates a correction amount in step S724, and determines mounting coordinates based on the correction amount in step S726. Specifically, the control unit 60 calculates the reference mark correction value and the through hole correction value as correction values.

Hereinafter, an example of correction is demonstrated using FIG. As for the board | substrate 8a shown in FIG. 157, the BOC design coordinate 990, the electronic component design coordinate 992, the electronic component design coordinate 994, and the through-hole design coordinate 996 become a coordinate of a design value. In addition, three BOC design coordinates 990 are provided on the substrate 8a. The electronic component design coordinates 992 are coordinates of the position where the electronic component which is surface-mounted on the board | substrate 8a, ie, which does not insert a lead wire in a through hole, is mounted. The electronic component design coordinates 994 are design coordinates for mounting a lead-type electronic component for inserting a lead wire into the through hole formed in the substrate 8a. The through hole design coordinates 996 for inserting the lead wires of the electronic components mounted in the vicinity of the electronic component design coordinates 994 are provided on the substrate 8a. Meanwhile, in FIG. 157, the electronic component design coordinates 992 and the electronic component design coordinates 994 are shown one by one, but the electronic component design coordinates 992 and the electronic component design coordinates 994 are the number of electronic components to be mounted. Installed in accordance with.

The control part 60 acquires the information of the BOC mark formation position 990a currently formed in the board | substrate 8a by the imaging device 36a, and the BOC mark design coordinate 990 of a design value by measurement The deviation between the acquired actual BOC mark formation positions 990a is detected, and the reference mark correction value for correcting the coordinates (x, y, θ) of the electronic component design coordinates 992 is calculated based on the detection result, and the calculated reference is calculated. By performing the BOC mark correction indicated by the arrow ma in FIG. 157 based on the mark correction value, the coordinates (x1, y1, θ1) of the electronic component mounting position 992a, which are mounting coordinates, are determined. In addition, the control part 60 calculates the reference mark correction value which correct | amends the coordinates (x2, y2, (theta) 2) of the electronic component design coordinate 994, and the arrow mb in FIG. 157 based on the calculated reference mark correction value. By performing the indicated BOC mark correction, coordinates (x3, y3, θ3) of the electronic component mounting position 994a, which are mounting coordinates, are determined.

Here, the process of forming the wiring pattern as a land position electrically connected with a BOC mark and an electronic component on a board | substrate becomes the same process. That is, the BOC mark formation position 990a on the actual substrate, the electronic component mounting position 992a and the electronic component mounting position 994a determined by the land position on the actual substrate are positioned on the substrate by one process. For this reason, the deviation according to the board setting difference is calculated | required the deviation between the BOC mark design coordinate 990 and the actual BOC mark formation position 990a, and based on the deviation of a BOC mark, BOC mark correction in each electronic component mounting position is carried out. It can be corrected at once by finding the value. That is, the electronic component design coordinates 992 are corrected based on the deviation between the BOC mark design coordinates 990 and the actually measured BOC mark formation positions 990a, whereby the actual electronic component placement positions where the wiring patterns and lands are formed ( 992a) can be determined as the mounting position.

Next, the step of opening the through hole on the substrate is formed through a step different from the step of forming a wiring pattern as a land position electrically connected to the BOC mark or the electronic component on the substrate. For this reason, even if the BOC mark correction is performed, between the mounting position of the through hole corresponding to the electronic component mounting position 994a calculated based on the BOC mark correction value and the position correction of the through hole 996b formed on the substrate. Position shift may occur. That is, the substrate setting shift | offset | difference with respect to a mounting apparatus is calculated | required based on the shift | offset between the BOC mark formation position 990 which is a design value, and the measured BOC mark formation position 990a, and the lead type which has a lead wire based on this BOC mark correction | amendment The design coordinates (x2, y2, θ2) of the electronic component mounting position (also referred to simply as the electronic component mounting position) 994 and the design coordinates (A, B, C) of the through hole formation position 996 are corrected to Even when the coordinates (x3, y3, θ3) of the mounting position 994a and the coordinates (A1, B1, C1) of the through hole formation position 996a are calculated, the calculated through hole formation position 996a actually forms through holes. There is a possibility that the lead of the lead type electronic component (for example, the radial lead type electronic component) cannot be inserted into the through hole forming position 996b, shifting from the position 996b.

In order to solve this problem, a method of detecting a misalignment between the through hole design coordinates 996 and the actual through hole formation position 996b to obtain a correction value (arrow h in FIG. 157) is also considered, but the board is brought into the electronic component mounting apparatus. Each time, the detection of the BOC mark for mounting the chip-shaped electronic component and the calculation of calculating the BOC mark correction value (arrows ma and mb) are performed, and the deviation from the detection of the through-hole for mounting the lead-type electronic component. Since it is necessary to repeat the correction value (arrow h) calculation for each of the lead-type electronic components, the tact is lowered.

Here, the actual through hole forming position 996b and the electronic component mounting position 994b of the radial lead type electronic component are corrected for the BOC mark with respect to the through hole coordinate design coordinate 996 and the mounting coordinate design coordinate 994. (Deviation) (arrow mb) correct | amended by this, and the deviation amount (arrow n) between the through-hole formation position 996a after BOC mark correction, and the through-hole formation position 996b on an actual board | substrate are included.

The control unit 60 adds the through hole forming position 996a after the BOC mark correction and the through hole forming position 996b on the actual substrate in addition to the correction amount (arrow mb) of the BOC mark correction for the through hole in step 24. The deviation amount (arrow n) of the liver is calculated as a correction amount for through-hole correction and stored in the storage unit 61. Here, as described above, since the through hole on the substrate is formed by the same process, the deviation of the actual through hole forming position with respect to the through hole forming position in which the BOC mark is corrected through the design coordinates of the through hole is equal to any through hole. In addition, it can calculate based on the correction amount of the through-hole which is a target. Therefore, the control part 60 obtains and stores the through-hole correction amount which is the correction amount of the through-hole formation position 996b on the actual board | substrate with respect to the through hole formation position 996a after BOC mark correction, and correct | amends the correction amount of BOC mark correction ( By simply obtaining the arrows m1, m2, etc.), the actual mounting position 992a of the chip-shaped electronic component can be determined by correcting the BOC mark with respect to the electronic component design coordinate 992. Further, the control unit 60 performs BOC mark correction (correction of the arrow mb) on the electronic component design coordinates 994, and then calls out through-hole correction (correction of the arrow n) from the storage unit 61 to correct it. As a result, the electronic component mounting position 994b of the lead-type electronic component can be determined as the mounting position. On the other hand, the electronic component mounting apparatus also shares with other electronic component mounting apparatus the information of the amount of displacement (arrow n) between the through hole forming position 996a after the BOC mark correction and the through hole forming position 996b on the actual substrate. When carrying in another electronic component mounting apparatus, through-hole correction can be performed without detecting the position of the through-hole.

As a result, the tact can be increased even when the chip-shaped electronic component and the radial electronic component are mixed and mounted on one board by one electronic component mounting apparatus. On the other hand, although the correction amount (arrow n) of the through-hole correction of FIG. 157 is shown large for convenience of description, the correction amount (arrow n) becomes larger as the through-hole forming position 996a and the through-hole forming position 996b are farther away. It is not.

The control unit 60 calculates the correction amount in step S724 and, based on the correction amount (arrow ma, mb) of the BOC mark correction and the correction amount (arrow n) of the through-hole correction (arrow n), in step S726. If the mounting coordinates 992a and 994b are determined, the electronic component mounting process is executed in step S728. The control unit 60 drives the head 15a through the head control unit 62 to mount the chip type electronic component or the radial lead type electronic component supplied from the component supply unit 14 to the determined mounting coordinates 992a and 994b. do. When the electronic component is mounted on the substrate, the control unit 60 carries out the substrate on which the electronic component is mounted to the outside of the apparatus in step S730, and determines whether production ends in step S732.

If it is determined in step S732 that it is not the end of production (No), the control unit 60 proceeds to step S716 and repeats the above process. Here, the control part 60 determines that it is not the end of production, when mounting an electronic component in a board | substrate using the same mounting program, ie, when manufacturing the same product again. The control part 60 complete | finishes this process, when it determines with the production end (Yes) in step S732.

The electronic component mounting apparatus 10a detects the position of a BOC mark and the through-hole which are a measurement target by the imaging device 36a, and correct | amends the BOC mark with respect to the mounting coordinates of the electronic component surface-mounted based on the position of a BOC mark. By performing correction, correction of arrows ma and mb, and based on the position of the through hole as the measurement target, through hole correction and correction of arrow n, which are corrections to the mounting coordinates of the electronic component into which the lead wire is inserted into the through hole, The mounting position of both the electronic component to be mounted and the electronic component into which the lead wire is inserted into the through hole can be appropriately corrected, and the electronic component can be mounted at a more suitable position on the substrate.

In addition, the electronic component mounting apparatus 10a can acquire the angle correction value by setting the coordinate of the through-hole which is a measurement target to two or more points, and can also correct a mounting coordinate with higher precision by making it three points. . In addition, in this embodiment, although the electronic component was mounted after the correction process was performed, detection of the position of the through hole in step S720 may be performed before mounting of the electronic component which inserts the lead wire into the through hole, and surface mount is performed. This may be done after the electronic component is mounted.

Next, the process operation | movement at the time of mounting an electronic component is demonstrated using FIGS. 158-160. 158 is a flowchart showing an example of the operation of the electronic component mounting apparatus. 159A is explanatory drawing which showed an example of the measuring position of an electronic component and a height. 159B is an explanatory diagram showing an example of the measurement positions of the electronic component and the height. It is explanatory drawing for demonstrating operation | movement of the electronic component mounting apparatus. Here, the electronic component mounting apparatus 10a performs the processing operation shown in FIGS. 158-160 when mounting an electronic component by inserting a lead wire into a through hole.

The procedure of the processing operation at the time of mounting an electronic component is demonstrated using FIG. For reference, the process shown in FIG. 158 can be implemented by executing the process of the control part 60 and controlling the operation | movement of each part. In addition, the control part 60 performs the process shown in FIG. 158 every time one electronic component is mounted on a board | substrate.

The control part 60 mounts an electronic component in a board | substrate in step S750. That is, the control part 60 adsorb | sucks an electronic component from a component supply unit by the head 15a, and mounts the attracted electronic component on a board | substrate. If the electronic component has been mounted on the board, the control unit 60 measures the position of the electronic component in step S752. Specifically, the control part 60 measures the height of the component mounted by the height sensor 37a.

Here, it is preferable that the electronic component mounting apparatus 10a measures the height of several places of an electronic component. For example, the electronic component 80a shown in FIG. 159A has a main body 82a and a plurality of leads 84a arranged in the radial direction of the main body 82a. As for the main body 82a, the surface attracted by the nozzle 32 which is a surface orthogonal to a radial direction is rectangular. When mounting the electronic component 80a, the electronic component mounting apparatus 10a measures the height of four measurement positions 88a by making the four corners of the rectangular shape of the main body 82a the measurement position 88a. . Next, the electronic component 80b shown in FIG. 159B has a main body 82b and a plurality of leads 84b arranged in the radial direction of the main body 82b. As for the main body 82b, the surface attracted by the nozzle 32 which is a surface orthogonal to a radial direction is circular. When the electronic component mounting apparatus 10a mounts the electronic component 80b, the three measurement positions 88b make three places near the outer edge of the circular shape of the main body 82b the measurement position 88b. Measure the height of On the other hand, the measurement position 88b becomes a position 120 degrees apart from each other on the circumference | surroundings. The electronic component mounting apparatus 10a can measure exactly which position of an electronic component floats by measuring the height of several places of an electronic component.

If the control part 60 measured the position of the height direction of an electronic component in step S752, it will determine whether an electronic component has floated as step S754. Specifically, the control part 60 memorize | stores in advance the information of the height in the measurement position at the time of mounting the target electronic component on a board | substrate, compares the height memorize | stored previously and the measured height, and height of an electronic component Determines whether is within the allowable value of the height previously stored.

The control part 60 complete | finishes this process, when it determines in step S754 that there is no lift of an electronic component (No), ie, it determines that the height of an electronic component is within an allowable value. If the height of the electronic component is within the allowable value, the control unit 60 can determine that the lead wire of the electronic component can be inserted into the through hole, and thus the electronic component is properly inserted, and the process is terminated.

If it is determined in step S754 that the electronic component is lifted (Yes), that is, the height of the electronic component is higher than the allowable value in step S754, the control unit 60 determines the press amount and the press position as step S756. Specifically, the control unit 60 detects which position of the electronic component is floating and the floating amount based on the measurement result of the height of the electronic component. The control part 60 determines the press position of the electronic component and the press amount in the said position based on the detected position and the floating quantity of the electronic component.

When the press amount and the press position are determined in step S756, the control unit 60 executes the press processing of the electronic component by the nozzle in step S758. That is, the control part 60 presses an electronic component with a nozzle by the height corresponding to a press amount in the press position determined in step S756. When the press process is performed in step S758, the control unit 60 measures the position of the electronic component as in step S760 as in step S752.

When the position of the electronic component is measured in step S760, the control unit 60 determines whether there is an uplift of the electronic component as in step S762 as in step S762. The control part 60 complete | finishes this process, when it determines with the no electronic component lifting (No) in step S762.

When it is determined in step S762 that the electronic component is lifted (Yes), the control unit 60 determines in step S764 whether the threshold value ≤ the number of press processing, that is, the number of times the press processing has been executed is equal to or greater than the threshold. do. If it is determined in step S764 that the threshold value> press processing number (No) is determined in step S764, the control unit 60 proceeds to step S756 and repeats the above processing.

If it is determined in step S764 that the threshold value? Press processing number (Yes) is determined in step S764, the control unit 60 executes the NG process as step S766 and ends the present process. That is, when the electronic component is lifted even if the press processing is performed more than the threshold number of times, the control unit 60 determines that the lift cannot be lifted by the press processing, and executes the NG process to terminate the present processing. . Examples of the NG process include a stop of the apparatus, a process of adsorbing and discarding the mounted electronic component with a nozzle, and mounting a new electronic component.

Next, with reference to FIG. 160, the process at the time of lifting of an electronic component is demonstrated. For reference, FIG. 160 is an example in the case of measuring the height of four places of the electronic component 80a. The control part 60 measures the height of the two measurement positions of the one lead wire 84a side of the electronic component 80a by the height sensor 37a in step S780, and the height sensor 37a as step S782. The heights of the two measurement positions on the other lead wire 84a side of the electronic component 80a are measured. The control part 60 determines that the other lead wire 84a side measured in step S782 is floating through the measurement result of step S780 and step S782.

The control part 60 determines that the other lead wire 84a side measured from the measurement result of step S780 and step S782 is floating, and the press position and the press amount of the other lead wire 84a side of the electronic component 80a are floating. Is determined, the other lead wire 84a side of the electronic component 80a is pressed toward the substrate 8 by the nozzle 32 as Step S784.

If the control part 60 performed the press process with respect to the electronic component 80a in step S784, as step S786, the measurement of two places on the one lead wire 84a side of the electronic component 80a by the height sensor 37a. The height of the position is measured, and in step S788, the height of the two measurement positions on the other lead wire 84a side of the electronic component 80a is measured by the height sensor 37a. If the control part 60 detects that the height of the electronic component 80a is within an allowable value from the measurement result of step S786 and step S788, it judges that the electronic component 80 is suitably mounted in the board | substrate 8, The process ends. In FIG. 160, the case where the electronic component 80a is pressed onto the substrate 8 by one press process is described. However, the press process is not performed based on the measurement result or the press process is performed a plurality of times. There is a case. Moreover, as a press process, several parts of an electronic component may be pressed with a nozzle.

The electronic component mounting apparatus 10a detects the height of the mounted electronic component when the electronic component is mounted by inserting the lead wire of the electronic component into the through hole, and executes a press process when the electronic component is floating, thereby providing a lead wire. The electronic component which has can be mounted on a board | substrate suitably. In addition, the electronic component mounting apparatus 10a detects the height of an electronic component by the height sensor 37a mounted in the head main body which performs the mounting process of an electronic component, and when the electronic component floats, the nozzle 32 is carried out. By carrying out a furnace press process, the board | substrate with which the electronic component was mounted can be manufactured efficiently. That is, since the height sensor can be arranged near the electronic component when the electronic component is mounted, and the press processing can be performed by the nozzle, the press processing can be performed in a short time, and the substrate on which the electronic component is mounted can be efficiently It can manufacture. In addition, it is possible to detect the floating electronic component more accurately by determining the lifting using the height sensor.

In addition, when the electronic component mounting apparatus 10a of the said embodiment determines that an electronic component is floating, it is made to perform a press process, but this invention is not limited to this. The electronic component mounting apparatus 10a may display an error, when it determines with the electronic component floating. That is, it is also possible to display only an error without performing a press process. Also in this case, floating electronic parts can be detected more accurately, and a worker can be notified with high precision that there are floating electronic parts. As a result, the position of the substrate with the floating electronic component and the floating electronic component can be accurately determined, and the mounting state of the electronic component can be grasped accurately with less load than if it is confirmed by visual observation.

In addition, in the said embodiment, although it was set as the structure which has one head or the structure which has two head 15a, this invention is not limited to this. For example, the electronic component mounting apparatus 10a may have three heads.

In addition, when the head 15a is provided with a plurality of nozzles, the head 15a may be provided with at least one nozzle capable of holding and mounting the radial lead type electronic component, and the configuration of the nozzle can be configured in various configurations. For example, the head 15a is a nozzle in which half of the nozzles can hold and mount the radial lead-type electronic components, and the remaining half of the nozzles are nozzles that cannot absorb the radial lead-type electronic components. It is okay. In addition, the head 15a may be any nozzle capable of holding and mounting a radial lead type electronic component. In addition, when determining the nozzle to hold the electronic component to be mounted based on the production program, the electronic component mounting apparatus 10a determines the nozzle to hold and mount the electronic component according to the type of nozzle. In addition, although the electronic component mounting apparatus 10a of this embodiment was set as the structure which the component supply apparatus 100 and the supply apparatus 100a are mixed, it is good also as a structure provided only the component supply apparatus 100.

Moreover, the electronic component mounting apparatus 10a is a component supply unit which has the electronic component supply apparatus 100 which supplies the electronic component with a lead, and the electronic component supply apparatus 100a which supplies the electronic component which does not have a lead. Although it is set as the structure provided with (14), the component supply unit of another structure can also be used.

Next, an example of the processing operation at the time of mounting an electronic component is demonstrated using FIG. 161 is a flowchart showing an example of the operation of the electronic component mounting apparatus. The electronic component mounting apparatus 10 performs the process of FIG. 161 for every operation | movement which makes an electronic component with the nozzle of a head. 161 is basically an electronic component, which is a process in which both a lead type electronic component and a mounted electronic component are mounted on a substrate. In step S910, the electronic component mounting apparatus 10 specifies the electronic component to be held, and determines in step S912 whether the component to be held is a lead type electronic component.

When determining that the electronic component mounting apparatus 10 is a lead type electronic component (Yes) in step S912, the electronic component mounting apparatus 10 holds the lead type electronic component of the electronic component supply apparatus by the nozzle in step S914. That is, the electronic component mounting apparatus 10 holds the lead type electronic component supplied to the holding position (second holding position) of the electronic component supply apparatuses 100, 402, 404, 406, etc. by the nozzle. If the electronic component mounting apparatus 10 held the lead type electronic component as a nozzle in step S914, the lead of the lead type electronic component is inserted into the insertion hole in step S916 and mounted on the substrate.

When it is determined in step S912 that the electronic component mounting apparatus 10 is not a lead type electronic component (No), the electronic component mounting apparatus 10 holds the mounted electronic component of the electronic component supply apparatus as a nozzle in step S917. That is, the electronic component mounting apparatus 10 holds the mounted electronic component supplied to the holding position (first holding position), such as the electronic component supply apparatus 100a, with a nozzle. If the electronic component mounting apparatus 10 held the mounted electronic component as a nozzle in step S917, the electronic component mounting apparatus 10 mounts the mounted electronic component on a board | substrate as step S918. That is, the electronic component mounting apparatus 10 mounts on a board | substrate, without inserting a mounting type electronic component in an insertion hole.

If the electronic component mounting apparatus 10 has executed the processing of step S916 or S918, that is, the electronic component is mounted, it determines whether or not all electronic components have been mounted in step S919. When the electronic component mounting apparatus 10 determines that mounting is not completed (No) in step S919, it progresses to step S910 and specifies the electronic component to mount next, and the said process for the said specific electronic component. Run The electronic component mounting apparatus 10 ends this process, if it is determined in step S919 that the mounting is completed (Yes).

As shown in FIG. 161, the electronic component mounting apparatus 10 can mount a mounting type electronic component and a lead type electronic component on a board | substrate with one head. In addition, the electronic component mounting apparatus 10 can mount both a mounting type electronic component and a lead type electronic component with the same nozzle. Here, the electronic component mounting apparatus 10 can be conveyed and mounted with the same nozzle as a mounted electronic component by holding | maintaining (adsorption or gripping) the main body of a lead-type electronic component. In addition, the electronic component mounting apparatus 10 determines whether it is a mounted electronic component or a lead-type electronic component, and performs a switch which inserts or does not insert a lead into an insertion hole according to each, and is mounted by the same head or the same nozzle. Even if this is performed, it can be mounted on a board | substrate on conditions suitable for each electronic component. Thus, the mounted electronic component and the lead electronic component can be mounted without replacing the nozzle. In addition, since the mounting type electronic component and the lead type electronic component can be mixed and mounted without dividing, the mounting order is less restricted and the mounting efficiency can be further improved.

Here, the electronic component mounting apparatus 10 can obtain the said effect more suitably by using the radial lead type electronic component supplied to the electronic component supply apparatus 100 as mentioned above as a lead type electronic component. The electronic component mounting apparatus 10 holds a radial lead type electronic component whose lead has been cut into a predetermined length by the electronic component supply apparatus 100, and more specifically, the main body is held by a nozzle and conveyed. The lead is inserted into the insertion hole and mounted on the substrate. In this way, the electronic component mounting apparatus 10 can shorten the length of a lead in order to hold the main body of an electronic component. Moreover, since the electronic component mounting apparatus 10 is a structure which cut | disconnects a lead before conveying to a tape main body and holding | maintenance, the state which the part hold | maintained with the tape in order to perform conveyance of the lead of a radial lead type electronic component was removed. Can be mounted on a substrate. Thereby, the lead of a radial lead type electronic component can be shortened and it can mount to a board | substrate, and an electronic component can be mounted to a board | substrate in a stable state. Specifically, since the lead of the radial lead type electronic component can be shortened to be mounted on the substrate, the vibration caused by the lead and the insertion hole in contact with the substrate when the substrate is mounted can be reduced. Accordingly, even if the radial lead type electronic component and the mounted electronic component are mounted in the same process, the influence on the mounting of each other can be reduced, and both can be mounted in the same process, that is, even if they are successively mounted by the same head or the same nozzle. Can be suitably mounted.

Here, the electronic component mounting apparatus 10 of the said embodiment is equipped with the bowl feeder assembly 90 which used the bowl feeder as a component supply unit 14f, and the electronic component of a radial feeder as a component supply unit 14r. Although it was set as the structure provided with the supply apparatus 100, it is not limited to this. The electronic component mounting apparatus 10 can make a component supply unit into various combinations. For example, the electronic component supply apparatus of a bowl feeder may be provided in both the front and rear component supply units, and the electronic component supply apparatus of a radial feeder may be provided in both the front and rear component supply units. In addition, as described above, the component supply unit may include an electronic component supply apparatus (chip component feeder) 100a for supplying the mounted electronic component to the electronic component holding tape. In addition, you may make the electronic component supply apparatus of one component supply unit all the front and rear parts into an electronic component supply apparatus (chip component feeder; 100a). That is, even if the component supply unit of one of the front and the rear supplies a lead type electronic component (electronic component inserted into a board | substrate), and the other side supplies an electronic component (electronic component mounted on a board | substrate) without a lead, It's okay. The electronic component mounting apparatus may use a so-called tray feeder as the electronic component supply apparatus. In addition, the electronic component mounting apparatus is an axial feeder which cuts the lead of the axial type electronic component held on the tape as the electronic component supplying device to be shortly below the substrate as described above, and supplies the axial feeder to the holding position in a bent in a U-shape. Can also be used. In this case, the electronic component mounting apparatus holds the axial type electronic component main body at the holding position of the axial feeder with a nozzle, and then discriminates the good / bad of the lead spacing and inserts the axial type electronic component judged as good. Insert it into the hole (substrate hole). The electronic component mounting apparatus 10 can be mounted or inserted into a board | substrate by attracting or holding an electronic component, even if it is an electronic component supplied by any electronic component supply apparatus. On the other hand, in an electronic component supply device for supplying a lead type electronic component, the lead type electronic component is held by the nozzle in a direction in which the main body is disposed above the vertical direction of the lead, that is, in a direction in which the lead is disposed below the vertical direction of the main body. To the holding position. Here, the electronic component mounting apparatus 10 is a component supply unit provided with a bowl feeder like this embodiment, and other types of electronic component supply apparatuses, for example, the said radial feeder, the axial feeder, and the mounted electronics. It is preferable to arrange component supply units, such as a component tape feeder, a stick feeder, and a tray feeder, in the front side and the back side which are the positions which oppose through the board | substrate conveyance part 12. As shown in FIG. Since the influence of the vibration of the bowl feeder can be suppressed on other kinds of component supply units, it is possible to stabilize the nozzle holding action on the electronic components supplied by the other kinds of electronic component supply apparatuses from the holding position.

In addition, in this embodiment, although the component supply unit was demonstrated as two component supply units 14f and 14r, the number is not limited. In addition, the two component supply units 14f and 14r may be regarded as one component supply unit, and each of the component supply units 14f and 14r may be regarded as the first component supply unit and the second component supply unit. For example, one component supply unit is provided with a bowl feeder (part supply unit 14f, 1st part supply part) and a radial feeder (part supply unit 14r, 2nd part supply part) like the said embodiment. Can be regarded as. In this case, the 1st component supply part and the 2nd component supply part are arrange | positioned in the position which opposes the position where the board | substrate is arrange | positioned. In addition, it can also be regarded that one component supply unit 14f includes the first component supply portion and the second component supply portion. For example, as described above, one component supply unit 14f can be regarded as a configuration including a radial feeder (first component supply unit) and a chip component feeder (second component supply unit). Thus, the electronic component mounting apparatus 10 can be set as the structure provided with the some kind of electronic component supply apparatus irrespective of a combination.

Here, as an electronic component supplied by the electronic component supply apparatus 100 which is a radial feeder, there exist various radial lead type electronic components which can hold a lead with a tape. The electronic component supply apparatus 100 can supply an aluminum electrolytic capacitor, an inductor, a ceramic capacitor, a film capacitor, etc., for example. Moreover, as an electronic component supplied by the electronic component supply apparatuses 402, 404, 406 which are bowl feeders, there are various lead-type electronic components which are package components. The electronic component supply apparatuses 402, 404, 406 can supply, for example, a solid state relay, a DIP electronic component, a SIP electronic component, a connector, a transformer, and the like.

In addition, when the head 15 of this embodiment is equipped with several nozzles in order to be able to mount more types of electronic components with one head, the said nozzle automatic replacing apparatus (exchange in this embodiment) The head exchange operation realized by the combination of the nozzle holding mechanism and the head body) allows each nozzle to be replaced with various suction nozzles and holding nozzles during mounting production. The electronic component mounting apparatus 10 depends on the component conditions such as the size, weight of the mounted electronic component and the lead-type electronic component, whether the upper surface of the component body has an adsorptive plane, and whether the component body can be gripped. For each part, a suction nozzle having an appropriate suction hole diameter or a grip nozzle having a grip member having an appropriate shape is designated and stored in the production program. The electronic component mounting apparatus 10 changes the nozzle to be attached to the head or determines a nozzle to hold the electronic component in the head based on the correspondence relationship between the electronic component and the nozzle stored in the production program.

As a result, the electronic component mounting apparatus 10 includes, for example, a nozzle holding the mounted electronic component and a lead electronic component when the electronic component held by the nozzle is changed from the mounted electronic component to the lead-type electronic component during board mounting. Is maintained at the same nozzle and at a different nozzle. When the nozzles are different, the electronic component mounting apparatus 10 automatically replaces the nozzles by the nozzle autochanger when the electronic component to be mounted is changed during setup or production. That is, when the electronic component mounted on the substrate during production is a mounted electronic component, for example, a nozzle (adsorption nozzle or gripping nozzle) suitable for the electronic component is selected, and the electronic component supplying device for supplying the electronic component is in a holding position. The nozzle is moved to the mounted electronic component to hold the electronic component to move to a predetermined position on the substrate, and the operation of mounting the electronic component while controlling the descending speed is continued. The electronic component mounting apparatus 10 determines whether or not the nozzles are the same or different when the electronic components to be mounted are terminated by a predetermined number and the electronic components to be mounted next are changed to lead-type electronic components. . When it is determined that the nozzles are the same, the electronic component mounting apparatus 10 uses the same nozzle as the nozzle for the lead-type electronic component because replacement of the nozzle is unnecessary. In addition, when it is determined that the nozzles are different, the electronic component mounting apparatus 10 uses the nozzle as the nozzle for the lead-type electronic component when the nozzle is usable by another nozzle mounted on the head, and uses the nozzle for another nozzle. If there is no possible nozzle, the nozzle automatic replacement device automatically replaces the nozzle for the lead type electronic component. When the electronic component mounting apparatus 10 prepares the nozzle for lead type electronic components in this way, the electronic component mounting apparatus 10 which moves a head and moves the nozzle to the holding position of a lead type electronic component supply apparatus is A lead-type electronic component having a lead that is shortly cut to a predetermined length from an electronic component tape (electronic component holding tape) by a built-in cutting device (cutting unit) by an electronic component supply device for supplying a lead-type electronic component. Set it to the holding position. The electronic component mounting apparatus 10 holds | maintains by adsorb | sucking or holding a lead-type electronic component with the said nozzle, and a board | substrate is discriminated by a detection means (laser recognition apparatus 38), and a position shift is discriminated and a board | substrate is discriminated. Control to select the electronic components inserted into the insertion hole (substrate hole), correct the positional shift of the lead when inserting it into the insertion hole, and reduce the descending speed at the time of insertion according to the cutting length of the lead. Implement while performing.

In addition, when the head 15 is provided with a plurality of nozzles, the head 15 may be provided with at least one nozzle capable of holding and mounting a lead type electronic component (insertable electronic component). Can be. For example, the head 15 may be a nozzle in which some of the nozzles hold lead-type electronic components, and the remaining nozzles may be nozzles in which the mounted electronic components are held. In this case, the electronic component mounting apparatus performs mounting control for mounting the mounted electronic component on a substrate when the nozzle holds the mounted electronic component, and when the lead electronic component is held, the lead type. The mounting control for inserting the electronic component into the insertion hole (substrate hole) is performed. In addition, the head 15 may use all the nozzles as a nozzle which holds a lead-type electronic component. In addition, the electronic component mounting apparatus 10 holds and mounts the electronic component according to the type of electronic component when determining the adsorption nozzle (or the gripping nozzle to hold) which adsorbs the electronic component to be mounted based on the production program. Determine the nozzle to do. The electronic component mounting apparatus 10 prepares a plurality of nozzles that can be attached to one head in this way, and operates the nozzle automatic changer during production by an instruction based on a production program to produce the nozzles mounted on the head next. By attaching and detaching and replacing with a nozzle in accordance with the electronic component (electronic component to be mounted), the lead-type electronic component can be held and inserted in the substrate, and the mounted electronic component can be mounted on the substrate in order.

Next, an example of the electronic component mounting system (mounting system) using the electronic component mounting apparatus mentioned above is demonstrated using FIG. 162 and 163. FIG. 162: is a schematic diagram which shows schematic structure of the electronic component mounting system. The electronic component mounting system (hereinafter also referred to as "mounting system") shown in FIG. 162 includes a pattern forming apparatus 2, a reflow processing apparatus 4, conveying devices 6 and 7, and electronic component mounting. Has a device 10. The mounting system 1 is configured such that the substrates are conveyed in the order of being the pattern forming apparatus 2, the conveying apparatus 6, the electronic component mounting apparatus 10, the conveying apparatus 7, and the reflow processing apparatus 4. The unit is arranged.

The pattern forming apparatus 2 is a device which forms a pattern of a solder paste on the surface of a board | substrate, and fills a solder paste in the insertion hole of a board | substrate. The reflow apparatus 4 heats the substrate to a predetermined temperature and temporarily melts the solder paste of the substrate, thereby adhering the substrate and the electronic component in contact with the solder paste. That is, the reflow apparatus 4 adheres the mounted electronic component mounted on the pattern of the solder paste formed on the surface of the substrate and the substrate with the solder paste of the pattern, and the lead-type electronic component having the lead inserted into the insertion hole. The lead insertion hole is bonded with solder paste filled in the insertion hole.

The conveying apparatuses 6 and 7 are apparatuses which convey a board | substrate. The conveying apparatus 6 carries in to the electronic component mounting apparatus 10 the board | substrate processed and carried out by the pattern forming apparatus 2. The conveying apparatus 7 carries in to the reflow processing apparatus 4 the board | substrate processed and carried out by the electronic component mounting apparatus 10.

The electronic component mounting apparatus 10 mounts an electronic component on a board | substrate as mentioned above. Here, the electronic component mounting apparatus 10 can mount a lead type electronic component as an electronic component. In addition, the electronic component mounting apparatus 10 can mount both a lead type electronic component and a mounting type electronic component as an electronic component. The mounting system 1 is configured as described above.

163 is a flowchart which shows an example of the operation | movement of an electronic component mounting system. The mounting system 1 prints a solder paste on the substrate in step S960. That is, the mounting system 1 forms the solder paste pattern in the surface of a board | substrate by the pattern forming apparatus 2 as step S960, and fills a solder paste in an insertion hole. When the solder paste is printed on the substrate in step S960, the mounting system 1 carries the substrate into the electronic component mounting apparatus 10 by the transfer device 6 and, in step S962, the electronic component mounting apparatus 10. Thus, the lead type electronic component and the mounting type electronic component are mounted on the substrate. When the electronic component is mounted on the substrate in step S962, the mounting system 1 carries in the reflow processing apparatus 4 the board on which the electronic component is mounted by the transfer device 7 to perform the reflow process in step S964. Execution is terminated.

In this way, the mounting system 1 mounts the lead-type electronic component and the mounted electronic component by the electronic component mounting apparatus 10, thereby providing a substrate in one reflow process for both the lead-type electronic component and the mounted electronic component. Can be fixed at Thereby, the mounting system 1 can simplify the structure of a manufacturing line.

Further, by mounting the lead type electronic component and the mounting type electronic component by the electronic component mounting apparatus 10, the lead of the radial lead type electronic component can be mounted in a short state as described above. Accordingly, the mounting system 1 mounts the lead-type electronic component and the mounted electronic component in the same process, and even if the reflow of the lead-type electronic component and the mounted electronic component is performed simultaneously, the electronic component is mounted on the substrate. It can adhere suitably. Thereby, the production efficiency of a board | substrate can be improved.

In addition, the electronic component mounting system 1 is formed by filling or applying solder paste in the insertion hole in advance, so that the inserted lead is temporarily fixed to the insertion hole through the solder paste. The lead can be shortened since the process of bending the component can be eliminated, and accordingly, the lead bending apparatus installed on the back side of the substrate can be omitted in the conventional mounting apparatus for inserting a substrate. In addition, a support pin for supporting a substrate used in a conventional electronic component mounting apparatus (chip mounter) can be disposed at an arbitrary position and inserted into the substrate mounting and insertion hole by the head.

In addition, since the above-described effect can be obtained in the mounting system 1 shown in FIGS. 162 and 163, the mounting system including the electronic component mounting apparatus having a suitable configuration is not limited to this. For example, the mounting system may be configured to include a plurality of electronic component mounting devices 10. In addition, the mounting system 10 may be used as a mounting apparatus in which only the lead type electronic component is mounted. In addition, although the electronic component mounting apparatus 10 can mount suitably a lead type electronic component, it can also be used as an apparatus which mounts only a mounting type electronic component temporarily.

1: mounting system
2: pattern forming apparatus
4: reflow processing unit
6, 7: conveying device
8: substrate
10: Electronic component mounting device
11: housing
11a: main body
11b, 11f, 11r: cover
11c: opening
11d: cover support
11e: locking mechanism
12:
14, 14f, 14r: component supply unit
15: head
16: XY moving mechanism
17: VCS unit
18: replacement nozzle holding mechanism
19: parts storage
20: controller
22: X axis drive part
24: Y-axis driving part
30: Head body
31: head support
32: Nozzle
34:
38: Laser recognition device
40: control panel
42:
44: front side bank
46: rear bank
48, 49: connector
60: control unit
62: head control unit
64: parts supply control unit
70: electronic component holding tape
72: tape body
80: electronic components
82: main body (electronic component main body)
84: lead
90: bowl feeder assembly
100, 100a, 200, 402, 404, 406: electronic component supply device
102: Support
110: housing
112: clamp unit
114: feed unit
116,116a: cutting unit
118: air pressure adjustment unit
120: Guide Home
302: list
304: Mount order list
400: Bowl Feeder Unit
408: driving device
410: fixed part
Bowl 420, 420a, 420b, 420c
422, 422a, 422b, 422c: rail
424, 424a, 424b, 424c: support mechanism
426, 426a, 426b, 426c: Connection
580a, 580b, 580c: Starting end part detection sensor
582a, 582b, 582c: Sensor for holding position side parts
590: air blow part

Claims (15)

A substrate conveying unit for conveying a substrate,
A component supply unit having at least one electronic component supply device for supplying an electronic component having a lead wire;
A head body having a nozzle for adsorbing an electronic component supplied from the component supply unit, a nozzle driver for driving the nozzle, and a head support for supporting the nozzle and the nozzle driver;
A photographing apparatus fixed to the head support to photograph the substrate;
A storage unit that stores through-hole coordinate design values, reference mark coordinate design values, and electronic component mounting coordinate design values;
It has a control unit for controlling the operation of the head body, the photographing apparatus and the component supply unit,
The control unit photographs a through hole formed in the substrate and a reference mark as a reference for a wiring pattern formed on a surface of the substrate with the photographing apparatus.
A reference mark correction value is obtained from a reference mark acquired from the photographed image, a through hole correction value is calculated from the deviation amount between the through hole position after the reference mark correction and the through hole acquired from the photographed image, and the reference mark correction value and the An electronic component mounting apparatus, characterized in that for determining a position to mount the electronic component from the through-hole correction value. The method of claim 1,
The controller controls the operation of the head body to move the electronic component having the lead wire to the position of the substrate determined based on the correction result, and inserts the lead wire of the electronic component into the through hole of the substrate. And the electronic component is mounted on the substrate. 3. The method according to claim 1 or 2,
The control unit photographs an image of two or more through holes formed adjacent to the substrate, and detects the position of the through holes formed in the substrate based on the relative positions of the two or more through holes. Mounting device. 3. The method according to claim 1 or 2,
The control unit photographs an image of three through holes formed adjacent to the substrate, and detects the position of the through holes formed in the substrate based on the relative positions of the three through holes. . The method of claim 1,
A height sensor fixed to the head support to detect a height of the surface of the substrate and the electronic component mounted on the surface of the substrate,
The controller stores a reference height of the electronic component to be mounted on the substrate,
Inserting the lead wire of the electronic component into the through hole of the substrate, and detecting the height of the electronic component on the substrate by the height sensor to determine whether the detected height of the electronic component is higher than the reference height; Electronic component mounting apparatus. 6. The method of claim 5,
And the control unit notifies an error when it is determined that the detected height of the electronic component is higher than the reference height. 6. The method of claim 5,
And the control unit executes a process of pressing the electronic component to the head body when it is determined that the detected height of the electronic component is higher than the reference height. 8. The method of claim 7,
A process for pressing the electronic component is a process of pressing the electronic component toward the substrate by the tip of the nozzle. 9. The method according to claim 7 or 8,
And the control unit determines the amount of pressing in the pressing process based on the detected height of the electronic component. The method of claim 1,
The electronic component supply apparatus includes a bowl into which a plurality of electronic components are put;
A rail for guiding the electronic component discharged from the bowl to a suction position at which the nozzle is sucked;
A support mechanism for closing the downstream side of the suction position of the rail to support the electronic component at the suction position of the rail;
And an oscillating portion for vibrating the bowl. The method of claim 10,
The support mechanism is a mechanism that is movable in an extension direction of the rail and that can be switched between a closed state and an open state downstream from the suction position of the rail,
The bowl is an electronic component mounting device, characterized in that fixed to the vibrating portion by a fastening mechanism detachable. The method according to claim 10 or 11,
The component supply unit includes a plurality of electronic component supply devices,
Each bowl of the said electronic component supply apparatus is laminated | stacked and arrange | positioned in a perpendicular direction,
And the vibrator of the electronic component supply device vibrates the bowl with the same driving device as another vibrator of another electronic component supply device. 13. The method of claim 12,
A plurality of said support mechanism is arrange | positioned in parallel along a horizontal direction, The electronic component mounting apparatus characterized by the above-mentioned. 13. The method of claim 12,
And the drive portion is supported by a fixing portion extending in the vertical direction, and vibrates the bowl with the fixing portion as a starting point. A component supply unit including a substrate conveyance portion for conveying a substrate, at least one electronic component supply device for supplying an electronic component having a lead wire, a nozzle for attracting an electronic component supplied from the component supply unit, and driving the nozzle An electronic component mounting method for mounting an electronic component on the substrate by an electronic component mounting apparatus having a head body having a nozzle driver and a head support for supporting the nozzle and the nozzle driver.
A process of storing through-hole coordinate design values, reference mark coordinate design values, and electronic component mounting coordinate design values;
A coordinate calculation step of obtaining coordinates of the through hole formed in the substrate and coordinates of the reference mark formed on the surface of the substrate;
A reference mark correction value calculation step of obtaining a reference mark correction value from coordinates of the reference mark calculated in the coordinate calculation step;
A through-hole correction value calculating step of obtaining a through-hole correction value from a deviation amount between the through-hole position after correcting with the calculated reference mark correction value and the coordinate of the through-hole calculated in the coordinate calculating step;
And determining a position to mount the electronic component from the reference mark correction value and the through hole correction value.

Images