CN101547590B - Mounting device and mounting method - Google Patents
Mounting device and mounting method Download PDFInfo
- Publication number
- CN101547590B CN101547590B CN200810086911A CN200810086911A CN101547590B CN 101547590 B CN101547590 B CN 101547590B CN 200810086911 A CN200810086911 A CN 200810086911A CN 200810086911 A CN200810086911 A CN 200810086911A CN 101547590 B CN101547590 B CN 101547590B
- Authority
- CN
- China
- Prior art keywords
- components
- parts
- suction nozzle
- mounting
- mounting head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention relates to a mounting device, which comprises a substrate transferring device, a component feeding device, a mounting head, a mounting head driving device, an identifying device and a control device, wherein the substrate transferring device transfers substrates to the mounting device; the component feeding device provides components; the mounting head can be driven by the mounting head driving device to rotate to any angle; a plurality of rotatable suction nozzles are arrayed on the surface of the mounting head, and the suction nozzles absorb the components; the identifying device identifies the position state of each component adsorbed on the suction nozzles as well as the mounting requirements of the mounting position corresponding to the component on the substrate; and the control device controls the operation of each part of the mounting device. By the rotation of the mounting head and/or the suction nozzles, the control device adjusts the position state of each component to conform to the mounting requirements of the mounting position corresponding to the component on the substrate, and mounts the component on the mounting position corresponding to the component on the substrate.
Description
Technical field
The present invention relates to a kind of mounting device that on substrate, mounts components and parts, relate in particular to that possess can be with the mounting device of the mounting head of arbitrarily angled rotation.
Background technology
At present, on substrate, mount in the mounting device of components and parts, the suction nozzle absorption components and parts by being installed on the mounting head mount.Yet in the process of mounting, when suction nozzle rotated, the components and parts phase mutual interference sometimes that adjacent suction nozzle is adsorbed caused components and parts to come off or produces position deviation, influences mounting of components and parts.In addition, because the shape and size of different types of components and parts are all inequality, thereby, when mounting different components and parts, need change corresponding suction nozzle according to components and parts usually, cause production capacity to reduce.
Summary of the invention
In order to overcome above-mentioned defective of the prior art, the objective of the invention is to, a kind of novel mounting device that can overcome above-mentioned defective is provided.
The mounting device that the present invention relates to comprises: base plate transfer device, components and parts feeding device, mounting head, mounting head drive unit and recognition device, control device.Wherein, base plate transfer device need mount the substrate of components and parts to the mounting device transmission; The components and parts feeding device provides components and parts to mounting head; Mounting head can and rotate to arbitrarily angled by the driving of mounting head drive unit; On the surface of mounting head, be arranged with the rotatable a plurality of suction nozzles that are used to adsorb components and parts, adsorb components and parts from the components and parts feeding device by a plurality of suction nozzles; Recognition device identification be attracted on location status and the substrate of each components and parts on the suction nozzle with the corresponding requirement that mounts that mounts the position of these components and parts; Control device is controlled the operation of the various piece of mounting device; Seriatim to components and parts by suction nozzle absorption; Utilize the rotation of mounting head and/or suction nozzle; With the location status of these components and parts be adjusted into substrate on mount mounting of position and require consistently with these components and parts are corresponding, and these components and parts are mounted on mounting on the position with these components and parts are corresponding on the substrate.
Recognition device is also discerned shape, the size of each adsorbed on suction nozzle components and parts; And judge by control device; Because of only adjusting the location status of adsorbed components and parts through the rotation suction nozzle; Cause adjusting the location status that is attracted to the components and parts on the suction nozzle through the rotation mounting head under the situation that these components and parts and the components and parts that are attracted to adjacent suction nozzle interfere.So, can prevent to interfere between the adsorbed components and parts of adjacent suction nozzle, utilize the suction nozzle of mounting head more fully, improve production efficiency.
Recognition device is also discerned shape, the size of each components and parts in the components and parts feeding device; And judge by control device; Can not adsorb under the situation of components and parts by single suction nozzle; Utilize adjacent plural these components and parts of suction nozzle absorption, and adjust location status by these components and parts of adjacent plural suction nozzle absorption through the rotation mounting head.So, can when absorption shape components and parts different, need not change suction nozzle, improve production efficiency with size.
The present invention also provides a kind of attaching method, comprising: the control mounting head will be mounted on the operation that mounts on the assigned position on the substrate by the components and parts of suction nozzle absorption by each suction nozzle from absorption process and the control mounting head that the components and parts feeding device adsorbs components and parts seriatim.Mount in the operation, also comprise the steps: to utilize recognition device mounting mounting of position and require the identification step discerned on the location status that is attracted to the components and parts on the suction nozzle and the substrate with these components and parts are corresponding; The rotation that utilizes mounting head and/or suction nozzle with the location status of these components and parts be adjusted into substrate on mount mounting of position and require corresponding to location status set-up procedure with these components and parts are corresponding; With being mounted on, these components and parts mount locational step with these components and parts are corresponding on the substrate.
In addition, recognition device is also discerned shape, the size of each adsorbed on suction nozzle components and parts.Mount operation; Before the location status set-up procedure; Also comprise the steps: the step judged by control device, judge when only adjusting the location status of adsorbed components and parts, whether cause these components and parts and the components and parts that are attracted on the adjacent suction nozzle to interfere through the rotation suction nozzle; Be judged as under the situation about interfering, only adjusting the location status that is attracted to the components and parts on the suction nozzle through the rotation mounting head.
In addition, absorption process also comprises, is judged by control device, whether can utilize the step of single components and parts of suction nozzle absorption.Can not adsorb under the situation of components and parts by single suction nozzle when being judged as, utilize adjacent plural these components and parts of suction nozzle absorption.And, mount operation, before the location status set-up procedure, also comprise judge whether it is the step by components and parts of plural suction nozzle absorption by control part.When being judged as is when adsorbing components and parts by plural suction nozzle, adjusts this location status by the components and parts of adjacent plural suction nozzle absorption through the rotation mounting head.
Description of drawings
Fig. 1 is the sketch map of the critical piece of the mounting device that the present invention relates to.
Fig. 2 is the end view of the mounting head that the present invention relates to.
Fig. 3 is that the mounting head that second execution mode of the present invention relates to is mounted on the view on the substrate with components and parts.
Fig. 4 is that the mounting head that the 3rd execution mode of the present invention relates to is mounted on the view on the substrate with components and parts.
Embodiment
Below, with reference to accompanying drawing, the present invention is described at length.In the accompanying drawings, with the identical parts of identical symbolic representation or have the parts of identical function, omit the explanation of repetition.
Fig. 1 is the sketch map of the critical piece of the mounting device that the present invention relates to.
As shown in Figure 1, in this mounting device, centre portion is provided with base plate transfer device 1 therein.This base plate transfer device 1 need mount the substrate 2 of components and parts to the mounting device transmission, mounting after the end of components and parts, substrate 2 is sent out mounting device.Near base plate transfer device 1, dispose the components and parts feeding device 3 that components and parts are provided to mounting device.This components and parts feeding device 3 has a plurality of feeder channels 4, deposits a kind of components and parts in each feeder channel 4.
Mounting head 5 is fixed on the arm 6.Arm 6 can be moving along the y-axis shift among Fig. 1.When arm 6 was moving along y-axis shift, it was also moving along y-axis shift to drive mounting head 5.In addition, mounting head 5 can also be on arm 6 X axle in Fig. 1 move.Since arm 6 can be along y-axis shift moving and mounting head 5 can on arm 6, move along the X axle, thereby mounting head 5 can move on the XY plane.In addition, mounting head 5 can also be around the Z shaft rotary random angle on arm 6.Fig. 2 is the end view of mounting head 5.As shown in Figure 2, motor 8 reaches bearing 10 through driving-belt 9 with actuating force when rotated, and then drive mounting head 5 is rotated.Motor 8, driving-belt 9 and bearing 10 have constituted the mounting head drive unit that drives mounting head 5.A plurality of rotatable suction nozzles 7 are installed on the mounting head 5.Suction nozzle 7 is used for from the required components and parts of this components and parts feeding device 3 absorption.
Above-mentioned mounting device also possesses recognition device and control device (not shown).Shape, the size of recognition device identification components and parts, in addition, also identification be attracted on location status and the substrate 2 of each components and parts on a plurality of suction nozzles 7 with the corresponding requirement that mounts that mounts the position of these components and parts.Control device is controlled the operation of the various piece of mounting device; Seriatim to components and parts by suction nozzle 7 absorption; Utilize the rotation of mounting head 5 and/or suction nozzle 7 to make mounting mounting of position and require consistently on location status and the substrate 2 of these components and parts, and these components and parts are mounted on mounting on the position with these components and parts are corresponding on the substrate 2 with these components and parts are corresponding.
Below, first execution mode of the present invention is described.
At first, control device moves along the X axle on arm 6 with mounting head 5 along y-axis shift is moving through control arm 6, makes mounting head 5 arrive components and parts feeding device 3 places.At this moment, recognition device is discerned the components and parts in the components and parts feeding device 3, and control device is judged needed components and parts, then by the required components and parts of the absorption of a plurality of suction nozzles 7.Then, control device moves along the X axle on arm 6 with mounting head 5 along y-axis shift is moving through control arm 6 once more, makes mounting head 5 arrive the top of substrate 2.
At this moment, recognition device is to mounting mounting of position and require to discern with these components and parts are corresponding on the location status that is attracted to each components and parts on the suction nozzle 7 and the substrate 2, and these information are sent to control device.Control device through adjustment mounting head 5 on the XY plane move and around the rotation of Z axle and the rotation of suction nozzle 7, with the location status of these components and parts be adjusted into substrate 2 on mount mounting of position and require consistent with these components and parts are corresponding.Then, mounting head 5 is mounted on mounting on the position with components and parts are corresponding on the substrate 2 with these components and parts with meeting the requirements.Mounting after the completion of these components and parts, mounting device repeats aforesaid operations for next components and parts.
Fig. 3 is that the mounting head 5 that second execution mode of the present invention relates to is mounted on the view on the substrate 2 with components and parts.
At first, control device moves along the X axle on arm 6 with mounting head 5 along y-axis shift is moving through control arm 6, makes mounting head 5 arrive components and parts feeding device 3 places.At this moment, recognition device is discerned the components and parts in the components and parts feeding device 3, and control device is judged needed components and parts, then by the required components and parts of the absorption of a plurality of suction nozzles 7.
At this moment, as shown in Figure 3, on the suction nozzle 7a of mounting head 5, be adsorbed with components and parts A, on adjacent suction nozzle 7b, be adsorbed with components and parts B.Be the part that dotted line surrounded among Fig. 3 with the corresponding position that mounts of components and parts A on the substrate 2.For components and parts A is mounted on mounting on the position of substrate 2 with meeting the requirements, must components and parts A be rotated a certain angle.Yet if only rotate components and parts A through rotation suction nozzle 7a, components and parts A and components and parts B might interfere, and cause components and parts A and components and parts B to come off or squint, even might damage components and parts A and components and parts B and suction nozzle 7a, 7b.
Control device moves along the X axle on arm 6 with mounting head 5 along y-axis shift is moving through control arm 6 once more, makes mounting head 5 arrive the top of substrate 2.At this moment; Recognition device is to mounting with components and parts A is corresponding that mounting of position requires and the shape and size of components and parts A and B being discerned on the location status that is attracted to the components and parts A on the suction nozzle 7a, the location status that is attracted to the components and parts B on the suction nozzle 7b, the substrate 2, and these information are sent to control device.Control device if judge when only adjusting the location status of the adsorbed components and parts A of suction nozzle 7a through rotation suction nozzle 7a, will cause components and parts A and components and parts B to interfere according to these information that received.So control device is not controlled suction nozzle 7a rotation, only control mounting head 5 rotations, thereby also can rotate components and parts A, and avoided interfering with components and parts 7b.Control device moves through control mounting head 5 again, with the location status of components and parts A be adjusted into substrate 2 on mount mounting of position and require consistent with components and parts A is corresponding.Then, mounting head 5 is mounted on this with components and parts A with meeting the requirements and mounts on the position.
In the prior art, in order to prevent to interfere between the adsorbed components and parts of adjacent suction nozzle, the method that near the suction nozzle taking usually to make does not adsorb components and parts.Compared with prior art, this execution mode has utilized the suction nozzle of mounting head more fully, has improved production efficiency.
Fig. 4 is that the mounting head 5 that the 3rd execution mode of the present invention relates to is mounted on the view on the substrate 2 with components and parts.
At first, control device moves along the X axle on arm 6 with mounting head 5 along y-axis shift is moving through control arm 6, makes mounting head 5 arrive components and parts feeding device 3 places.At this moment, recognition device is discerned the components and parts in the components and parts feeding device 3, and control device is judged needed components and parts.And recognition device is discerned shape, the size of needed components and parts, and these information are sent to control device.Then, by the required components and parts of the absorption of a plurality of suction nozzles 7.When the control device court verdict goes out because of the bigger grade of required size of component can not be by these components and parts of single suction nozzle 7 absorption the time, by needed these components and parts of adjacent plural suction nozzle 7 absorption.
At this moment, as shown in Figure 4, adjacent suction nozzle 7a on the mounting head 5 and suction nozzle 7b co-absorbed components and parts C.Be the part that dotted line surrounded among Fig. 3 with the corresponding position that mounts of components and parts C on the substrate 2.For components and parts C is mounted on mounting on the position of substrate 2 with meeting the requirements, must components and parts C be rotated a certain angle.Yet because adjacent suction nozzle 7a and suction nozzle 7b co-absorbed components and parts C, thereby suction nozzle 7a and suction nozzle 7b can not turns, can't rotate components and parts C through rotating 7a and 7b.
Control device moves along the X axle on arm 6 with mounting head 5 along y-axis shift is moving through control arm 6 once more, makes mounting head 5 arrive the top of substrate 2.Recognition device is to mounting mounting of position and require to discern with components and parts C is corresponding on the location status that is attracted to adjacent suction nozzle 7a and the components and parts C on the 7b and the substrate 2, and these information are sent to control device.Control device is not controlled suction nozzle 7a and 7b rotation according to these information that received, and only controls mounting head 5 rotations, thereby can rotate components and parts C yet.Control device moves through control mounting head 5 again, with the location status of components and parts C be adjusted into substrate 2 on mount mounting of position and require consistent with components and parts C is corresponding.Then, mounting head 5 mounts this with components and parts C with meeting the requirements and mounts on the position.
In the prior art,, need to change different suction nozzles usually in order to adsorb the shape components and parts different with size.And in this execution mode, utilize a plurality of suction nozzles to adsorb same components and parts, and compared with prior art, need not change suction nozzle, improved production efficiency.
More than be example with embodiment and accompanying drawing, describe the present invention, still, the present invention is not limited to above-mentioned execution mode.Those skilled in the art can be out of shape and change the present invention as required under the situation that does not depart from connotation of the present invention and scope.These distortion and variation are all within the scope of claim of the present invention.
Claims (5)
1. a mounting device is used on substrate, mounting components and parts, it is characterized in that,
Comprise: base plate transfer device, components and parts feeding device, mounting head, mounting head drive unit and recognition device, control device, wherein,
Said base plate transfer device need mount the substrate of components and parts to said mounting device transmission,
Said components and parts feeding device provides components and parts to said mounting head,
Said mounting head, can by said mounting head drive unit drive and rotate to arbitrarily angled,
On the surface of said mounting head, be arranged with the rotatable a plurality of suction nozzles that are used to adsorb components and parts, adsorb components and parts from said components and parts feeding device by a plurality of said suction nozzles,
Said recognition device, identification be attracted on location status and the said substrate of each components and parts on the said suction nozzle with the corresponding requirement that mounts that mounts the position of these components and parts,
Said control device; Operation to the various piece of said mounting device is controlled; Seriatim to components and parts by said suction nozzle absorption; The rotation that utilizes said mounting head and/or said suction nozzle with the location status of these components and parts be adjusted into said substrate on mount mounting of position and require consistently with these components and parts are corresponding, and these components and parts are mounted on mounting on the position with these components and parts are corresponding on the said substrate
Said recognition device is also discerned shape, the size of each adsorbed on said suction nozzle components and parts, and is judged by said control device,
Because of only adjusting the location status of adsorbed components and parts through rotating said suction nozzle, cause under the situation that these components and parts and the components and parts that are attracted to adjacent said suction nozzle interfere,
Through rotating the location status that said mounting head adjustment is attracted to the components and parts on the said suction nozzle.
2. mounting device according to claim 1 is characterized in that,
Said recognition device is also discerned shape, the size of each components and parts in the said components and parts feeding device, and is judged by said control device,
Can not adsorb by single said suction nozzle under the situation of components and parts,
Utilize adjacent plural said these components and parts of suction nozzle absorption, and adjust location status by these components and parts of adjacent plural said suction nozzle absorption through rotating said mounting head.
3. an attaching method is used to mount components and parts, it is characterized in that,
In the described mounting device of claim 1, said control device is controlled the various piece of said mounting device, and comprises following operation:
Control said mounting head by each said suction nozzle from the absorption process of said components and parts feeding device absorption components and parts and
Control said mounting head and will be mounted on the operation that mounts on the assigned position on the said substrate by the components and parts of said suction nozzle absorption seriatim,
Mount in the operation said, also comprise the steps:
Utilize said recognition device to mounting mounting of position and require the identification step discerned on the location status that is attracted to the components and parts on the said suction nozzle and the said substrate with these components and parts are corresponding;
The rotation that utilizes said mounting head and/or said suction nozzle with the location status of these components and parts be adjusted into said substrate on mount mounting of position and require corresponding to location status set-up procedure with these components and parts are corresponding; With
These components and parts are mounted on mount locational step with these components and parts are corresponding on the said substrate.
4. attaching method as claimed in claim 3 is characterized in that,
Said recognition device is also discerned shape, the size of each adsorbed on said suction nozzle components and parts,
The said operation that mounts before said location status set-up procedure, also comprises the steps:
Whether the step of being judged by said control device is judged only when rotating said suction nozzle and adjust the location status of adsorbed components and parts, cause these components and parts and the components and parts that are attracted on the adjacent said suction nozzle to interfere,
Be judged as under the situation about interfering, only through rotating the location status that said mounting head adjustment is attracted to the components and parts on the said suction nozzle.
5. attaching method as claimed in claim 3 is characterized in that,
Said recognition device is also discerned shape, the size of needed components and parts,
Said absorption process also comprises, is judged by said control device, whether can utilize the step of single components and parts of said suction nozzle absorption,
Can not adsorb by single said suction nozzle under the situation of components and parts when being judged as,
Utilize adjacent plural said these components and parts of suction nozzle absorption; And,
The said operation that mounts before said location status set-up procedure, also comprises,
Judge whether it is step by said control part by components and parts of plural said suction nozzle absorption;
When being judged as is when adsorbing components and parts by plural said suction nozzle, adjusts this location status by the components and parts of adjacent plural said suction nozzle absorption through rotating said mounting head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810086911A CN101547590B (en) | 2008-03-28 | 2008-03-28 | Mounting device and mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810086911A CN101547590B (en) | 2008-03-28 | 2008-03-28 | Mounting device and mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101547590A CN101547590A (en) | 2009-09-30 |
| CN101547590B true CN101547590B (en) | 2012-09-26 |
Family
ID=41194354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810086911A Active CN101547590B (en) | 2008-03-28 | 2008-03-28 | Mounting device and mounting method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101547590B (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102143678B (en) * | 2010-02-01 | 2015-11-25 | 未来产业株式会社 | For the equipment of supplies electrons element |
| KR102028743B1 (en) * | 2011-10-07 | 2019-10-04 | 쥬키 가부시키가이샤 | Electronic component mounting apparatus, and electronic component mounting method |
| WO2013157107A1 (en) * | 2012-04-18 | 2013-10-24 | 富士機械製造株式会社 | Splicing device and splicing method |
| JP5877315B2 (en) * | 2012-06-19 | 2016-03-08 | パナソニックＩｐマネジメント株式会社 | Component mounting apparatus, part feeder, and part feeder extraction restriction releasing method in component mounting apparatus |
| CN103547139B (en) * | 2012-07-10 | 2018-04-17 | 韩华泰科株式会社 | Electronic component mounting device and its control method |
| KR20190091018A (en) * | 2018-01-26 | 2019-08-05 | 한화정밀기계 주식회사 | Apparatus for mounting a chip |
| CN108650880A (en) * | 2018-08-21 | 2018-10-12 | 安徽广晟德自动化设备有限公司 | A kind of full-automatic chip mounter |
| KR20210104967A (en) * | 2020-02-18 | 2021-08-26 | (주)테크윙 | Picking apparatus for gripping electronic component |
| CN111642126B (en) * | 2020-05-25 | 2021-04-09 | 深圳市琦轩实创科技有限公司 | A paster equipment for production of electron class product |
| CN112272512B (en) * | 2020-10-23 | 2021-10-19 | 湖南大学 | SMD mounting system |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6662437B2 (en) * | 2000-01-27 | 2003-12-16 | Sanyo Electric Co., Ltd. | Apparatus and method for mounting electronic components |
| CN101091426A (en) * | 2005-03-29 | 2007-12-19 | 松下电器产业株式会社 | Component shape profiling method and component mounting method |
-
2008
- 2008-03-28 CN CN200810086911A patent/CN101547590B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6662437B2 (en) * | 2000-01-27 | 2003-12-16 | Sanyo Electric Co., Ltd. | Apparatus and method for mounting electronic components |
| CN101091426A (en) * | 2005-03-29 | 2007-12-19 | 松下电器产业株式会社 | Component shape profiling method and component mounting method |
Non-Patent Citations (2)
| Title |
|---|
| JP平2-241099A 1990.09.25 |
| 袁鹏.基于视觉的高速高精度贴片机运动控制系统的设计与实现.《计算机集成制造系统》.2004,第10卷188-189. * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101547590A (en) | 2009-09-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101547590B (en) | Mounting device and mounting method | |
| CN102348621B (en) | Substrate transfer process system, substrate transfer process method, and apparatus and method for mounting component | |
| US6467158B1 (en) | Component feeder with load position alignment recognition | |
| JP4997124B2 (en) | Electronic component mounting head and electronic component mounting apparatus | |
| CN1071536C (en) | Automatic electronic parts mounting apparatus | |
| US20020053134A1 (en) | Component mounter and mounting method | |
| KR101065907B1 (en) | Component-supplying head device, component-supplying device, component-mounting device, and method of moving mounting head portion | |
| CN101083902A (en) | Surface mounting machine | |
| JPWO2017119216A1 (en) | Electronic component handling unit | |
| KR100323790B1 (en) | electronic component mounting device | |
| EP0724381B1 (en) | Component mounting apparatus and component mounting method | |
| CN202565667U (en) | Clamp for nozzle replacing | |
| CN1742528A (en) | Multiple insertion head | |
| JP2012248778A (en) | Die bonder and bonding method | |
| KR100651815B1 (en) | Chip mounter | |
| KR101287579B1 (en) | Head assembly for chip mounter | |
| KR20050092415A (en) | Electronic parts mounting apparatus and electronic parts mounting method | |
| KR101383886B1 (en) | Electronic component mounted device and nozzle drive control method | |
| JP2012186505A (en) | Component supply device | |
| KR20080041579A (en) | Solder ball mounting method and solder ball mounting apparatus | |
| JP2018160671A (en) | Component holding head | |
| CN102711433A (en) | Suction nozzle, mounting apparatus, method for mounting electronic components, and method for manufacturing component-mounted substrates | |
| US6355298B1 (en) | Placement system apparatus and method | |
| TWI767556B (en) | Sustainer mechanism and handler having the same | |
| KR100636302B1 (en) | Apparatus for conveying substrates and method of conveying substrates |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |