CN1071536C - Automatic electronic parts mounting apparatus - Google Patents

Automatic electronic parts mounting apparatus Download PDF

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Publication number
CN1071536C
CN1071536C CN96123135A CN96123135A CN1071536C CN 1071536 C CN1071536 C CN 1071536C CN 96123135 A CN96123135 A CN 96123135A CN 96123135 A CN96123135 A CN 96123135A CN 1071536 C CN1071536 C CN 1071536C
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CN
China
Prior art keywords
mouth
installation head
electronic unit
pick
picking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN96123135A
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Chinese (zh)
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CN1159139A (en
Inventor
根岸重节
西口长嗣
安田干夫
宗贯孝
森冈学
角孝义
藤高明
古田升
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
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Publication date
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Publication of CN1159139A publication Critical patent/CN1159139A/en
Application granted granted Critical
Publication of CN1071536C publication Critical patent/CN1071536C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408Incorporating a pick-up tool
    • H05K13/041Incorporating a pick-up tool having multiple pick-up tools
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0411Pick-and-place heads or apparatus, e.g. with jaws having multiple mounting heads
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00Metal working
    • Y10S29/044Vacuum
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49137Different components
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/53039Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y10T29/53048Multiple station assembly or disassembly apparatus
    • Y10T29/53052Multiple station assembly or disassembly apparatus including position sensor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53174Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178Chip component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53174Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183Multilead component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53187Multiple station assembly apparatus
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53191Means to apply vacuum directly to position or hold work part
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53261Means to align and advance work part

Abstract

A compact and high-speed automatic electronic parts mounting apparatus is provided which includes first and second parts feeders. Each of the first and second parts feeders includes a plurality of cassettes storing therein electronic parts and having pick-up stations. The second parts feeder is arranged at a preselected interval away from the first parts feeder in a first direction. Each of the first and second mounting heads is movable in the first direction and includes a plurality of pick-up nozzles movable in a vertical direction for picking up the electronic parts from the pick-up stations of the cassettes. The printed board-holding table is disposed within the preselected interval between the first and second parts feeders. The controller controls the movement of the table and the first and second mounting heads.

Description

Automatic electronic parts mounting apparatus
The present invention relates generally to a kind of automatic electronic parts mounting apparatus.Relate to a kind of electronic component mounting apparatus that is configured to chip part is installed to the miniature high-speed on the printed circuit board (PCB) or rather.
The Japan Patent that is numbered 6-85492 has openly been discussed the erecting device that a kind of robot that generally uses as shown in figure 28 drives for the first time.Device comprises that the electronic unit device 70, of feeding is used for plate holder gripping member 79, one installation head, 72, one first driving shafts 73 and one second driving shaft 74 that a printed circuit board (PCB) 75 is fixing.Electronic unit is fed and is furnished with some tape drums 77 on the device 70, so as will to place with on electronic unit supply with in order.Installation head 72 turns and supporting one slidably picks up mouth 71 so that electronic unit is picked up and is mounted on the printed circuit board (PCB) 75.Be furnished with installation head 72, the second driving shafts 74 on first driving shaft 73 and move first driving shaft 73, installation head 72 can be moved on reference axis X-and Y-both direction by direction perpendicular to first driving shaft 73.
The Japan Patent that is numbered 7-202491 has openly been discussed a kind of high speed rotating erecting device as shown in figure 29 for the first time, and it comprises a swivel head 81, one parts feed device 80, one electronic unit monitors 86 and an XY workbench 83.Swivel head 81 have some along the swivel head circumferential arrangement pick up mouth 82, these are picked up mouth and periodically rotate.The parts device 80 of feeding moves to that position that one of them pickup 82 stops operating.XY workbench 83 is fixed with a printed circuit board (PCB), so that electronic unit is installed on the printed circuit board (PCB), and can move on two mutually perpendicular directions.Electronic unit pick up, monitor and the rotation of installation and swivel head 81 is carried out synchronously.
But there is following defective in the erecting device of above-mentioned prior art.Simply small and exquisite on the erecting device structure that robot drives, but owing to electronic unit will be picked up one by one and is loaded on the printed circuit board (PCB) 75, so be difficult to operate fast.Though and the high speed rotating erecting device can be installed in electronic unit on the printed circuit board (PCB) apace, its structure heaviness, and equipment manufacturing cost height.Seek a kind ofly to have concentrated the small and exquisite of above-mentioned two kinds of conventional apparatus advantages and fitting machine fast with regard to needs like this.
Therefore a main purpose of the present invention is to avoid the unfavorable aspect of prior art.
Another object of the present invention is to provide a kind of small and exquisite and electronic component mounting apparatus at a high speed.
According to an aspect of the present invention, provide a kind of automatic electronic parts mounting apparatus, it comprises: (a) first parts that the contain a plurality of boxes device of feeding stores electronic unit and has a pickup station in each box; (b) second parts that the contain a plurality of boxes device of feeding stores electronic unit and has a pickup station in each box; (c) workbench of a fixed printed circuit board makes electronic unit can be installed on the printed circuit board (PCB); (d) one first installation head, this installation head comprise a plurality of that move in the vertical direction, be used for electronic unit is picked up mouth from what pickup station was picked up; (e) one second installation head, this installation head comprise a plurality of can vertically moving so that electronic unit is picked up mouth from what pickup station was picked up; And (f) one be used for the controller that Control work platform and first and second installation head move, so that first and second installation head is picked up electronic unit in pickup station, install them into the given position on the printed circuit board (PCB) that is fixed on the workbench then; Wherein, first parts device of feeding is arranged in along first direction and leaves the feed spacing place of pre-selected of device of second parts, workbench is fed between the device with predetermined feed device and second parts of first parts that are located at interval at, and be designed to and can move along the second direction perpendicular to first direction, first and second installation head are configured to and can move along first direction.
In a better model of the present invention, feed each box of device of first and second parts is arranged apart from locating adjacent to each other along the first segment of first direction.Each of first and second installation head is picked up mouth and is being arranged adjacent to each other apart from the second the same pitch place with first segment.
Controller is controlled moving of first and second installation head with first and second mode of operations.First mode of operation is to make first installation head pick up electronic unit by picking up mouth in first parts are fed all pickup stations of device, and meanwhile, second installation head then will be installed on the printed circuit board (PCB) that is fixed on the workbench by picking up the electronic unit that mouth picks up.Second mode of operation is to make second installation head pick up electronic unit by picking up mouth in second parts are fed all Queensland of picking up station of device, and meanwhile, first installation head then will be installed on the printed circuit board (PCB) that is fixed on the workbench by picking up the electronic unit that mouth picks up.
Controller is controlled all vertical moving of picking up mouth of each first and second installation head, so that all mouths of picking up of each first and second installation head can synchronously pick up electronic unit.
Controller is also alternately controlled first and second installation head, make each first and second installation head comprise first number pick up first group of mouth with comprise second number and pick up second group of mouth and can move with different timings and pick up electronic unit.
Each of first group of each first and second installation head is picked up mouth and is picked up operation selected pickup station from all boxes with one first and pick up an electronic unit, and each of second group of each first and second installation head is picked up mouth and picked up second after the operation with one with first and pick up the selected pickup station of operation from all boxes and pick up an electronic unit.
All mouth vertical moving of picking up of each first and second installation head of controller may command make all picking up of each first and second installation head have at least one to be moved to pick up one of them electronic unit from a selected pickup station of box in the mouth.
In controller may command first and second installation head each along first direction move and first and second installation head in each all vertical moving of picking up mouth, make from selected all pickup stations of box one of in the mouth each that picks up of given number in each first and second installation head pick up one of them electronic unit.
Each first and second installation head comprises picks up mouth travel mechanism, and this mechanism has a lifting member and falling apparatus, and lifting member is used for synchronously upwards carrying on a shoulder pole liter with picking up mouth, and falling apparatus is used for picking up mouth independently of each other and falls.
On first and second parts are fed device, put a first sensor and one second transducer respectively, be used for monitoring by the existence of picking up the electronic unit that mouth picks up and the orientation of parts, and index signal is provided in view of the above.
One whirligig also is provided, has been used to make each to pick up mouth around its center rotation.
Each is picked up mouth and has one and prolong female length in vertical direction.Each center line of picking up mouth that described whirligig is centered around that length direction extends rotates picks up mouth.
Also and then a position monitor and an offset aligning gear be provided.Position monitor monitors the position of each electronic unit of pickup station clamping, and determines whether it departs from given tram.The offset aligning gear is adjusted at workbench and has relative position between the electronic unit of offset, so that compensate this offset.
The offset aligning gear comprises that described whirligig and is designed to along the travel mechanism of mobile working platform A0 electronic unit on the second direction.
The offset aligning gear comprises that also one is designed to move along first direction second travel mechanism of first and second installation head.
From following detailed description and appendedly understand about having more fully the present invention the schematic diagram of preferred embodiment of the present invention, but this certain embodiments only is indicative and for ease of understanding, and should not be considered to limitation of the invention.
Fig. 1 is the three-dimensional view according to the electronic component mounting apparatus of the first embodiment of the present invention;
Fig. 2 is the plane graph of Fig. 1;
Fig. 3 is the part perspective view that an installation head is shown;
Fig. 4 illustrates the end view of picking up mouth that installation head shown in Figure 3 is furnished with;
Fig. 5 illustrates a perspective view that the box of electronic unit is housed;
Fig. 6 is the part perspective view of the electronic unit detent mechanism of box shown in Figure 5;
Fig. 7 is the plane graph of Fig. 6;
Fig. 8 (a) and Fig. 8 (b) are the plane graphs with fitting operation picked up that an electronic component mounting apparatus is shown;
Fig. 9 (a) and Fig. 9 (b) are the plane graphs with fitting operation picked up that an electronic component mounting apparatus is shown;
Figure 10 (a) and Figure 10 (b) illustrate an order of picking up mouth to pick up the side view of operation;
Figure 11 illustrates to stop one to pick up the side view of the work of picking up operation of mouth;
Figure 12 (a), 12 (b) and 13 illustrate all installation head and all front views of picking up the operation of mouth when picking up electronic unit;
Figure 14 (a), 14 (b), 15 (a), 15 (b) and 16 illustrate the front view of installation head in the sequence of operations that picks up electronic unit according to a second embodiment of the present invention;
Figure 17 (a), 17 (b), 18 (a), 18 (b), 19 (a) and 19 (b) illustrate installation head picks up the sequence of operations of electronic unit in a third embodiment in accordance with the invention front view;
Figure 20 (a) is the plane graph that a kind of line pattern of the printed circuit board (PCB) that is used for fourth embodiment of the invention is shown;
Figure 20 (b) is the plane graph that the another kind of line pattern of the printed circuit board (PCB) that is used for fourth embodiment of the invention is shown;
Figure 21 and 22 is part perspective views of sequence of operations that the installation head of a fourth embodiment in accordance with the invention is shown;
Figure 23 and 24 is examples of the advantage of explaining that the line sensor of an electronic component mounting apparatus of the present invention is arranged;
Figure 25 (a) and 25 (b) are side views of picking up the mouth lowering mechanism that illustrates according to a fifth embodiment of the invention;
Figure 26 is the part perspective view that installation head according to a sixth embodiment of the invention is shown;
Figure 27 is the plane graph that electronic component mounting apparatus according to a sixth embodiment of the invention is shown;
Figure 28 one illustrates the perspective view of a traditional electronic component mounting apparatus; And
Figure 29 one illustrates the perspective view of another traditional electronic component mounting apparatus.
Now referring to all figure, especially Fig. 1 wherein shows the electronic component mounting apparatus according to first embodiment of the invention.
This electronic component mounting apparatus generally comprises a underframe 1, first and second parts feed device 2 and 3, one workbenches, 6, the first and second installation head 10 and 11, and a controller 38 of whole operations that is used for control device.
First and second parts are fed and are furnished with two groups of boxes 4 on each of device 2 and 3, are storing electronic unit in each box.First and second parts device 2 and 3 of feeding is installed on the underframe 1 with a given spacing.Workbench 6 is arranged in first and second parts and feeds in the spacing between device 2 and 3, and be designed to move with the equidirectional (that is along Y direction) along guide rail 7 through a ball screw 5 by motor 14 as shown in Figure 2, in fixed printed circuit board 19, provide electronic unit thus by box 4.
First and second installation head 10 and 11 each be fixed with a plurality of mouths (vacuum nozzle) 18 of picking up to extract and the clamping electronic unit, picking up mouth moves to the direction (that is X-direction) of (that is Y-direction) perpendicular to the electronic unit supplier with one by a guide assembly 8, be furnished with a driving mechanism of knowing on the guide assembly 8, this mechanism is installed on the lower surface of upper frame 9 and with underframe 1 and links to each other.All mouths 18 of picking up are in given pitch upper edge directions X arrangement adjacent one another are, picking up the mouth pitch is the same with being arranged in the feed pitch of those boxes 4 on device 2 and 3 of first and second parts, when picking up electronic unit with box lunch, each pick up mouth 18 can with box 4 in corresponding one align.
As shown in Figure 2, electronic component mounting apparatus also comprises a loader 15, one emptiers 16 and first and second line sensors 12 and 13.Loader 15 is sent to workbench 6 with printed circuit board (PCB) 19.16 of emptiers transport printed circuit board (PCB) 19 from workbench 6.Each first and second line sensor 12 and 13 is arranged between two groups of boxes 4, that is to say, is in first and second centres of feeding one of device 2 and 3, and sensor measurement is by the height of the electronic unit of picking up mouth 18 clampings.Be furnished with otch on first and second line sensors 12 and 13 and be fixed with picking up mouth 18 and when directions X moves, can passing through of electronic unit from transducer so that allow.
Fig. 3 illustrates the structure of each first and second installation head 10 and 11.Pick up mouth 18 and be installed within the axle 17, axle 17 is supported by supporting saddle 37, and the supporting saddle can move in vertical direction and be rotatable.Be furnished with some positioning seats 25 in the upper end of axle.As Fig. 4 is clearly shown that, each positioning seat 25 is formed with a plurality of vertical incision 25a on its peripheral surface, corresponding one is meshed in one of them otch and the alignment pin 27, alignment pin is anchored on the flat board 94, and this flat board is connected with the front surface of supporting saddle 37 when axle 17 arrives bottom dead centre.
On supporting saddle 37, the vertical slip drive motors 28 with of a rotary drive motor 20 is installed.One driven wheel (that is pinion) 21 is housed on the rotary drive motor 20, and this gear is meshed with the tooth bar 23 that is supported slidably by guide roller 36.Tooth bar 23 is meshed with one group of driven gear 22 that is installed on the axle 17.
One bent axle 29 is installed in prejudicially on the vertical slip drive motors 28 and by a pin 27 that is contained on the bent axle 29 and supports rotatably, and a flat board 30 is loaded on a slide 31 and the supporting base slidably, and slide can vertically slide.As Fig. 4 was clearly shown that, dull and stereotyped 30 had one first ratchet 32, and it is meshed with second ratchet 39, and second ratchet is positioned at the bottom of the cylinder 34 that is supported on electromagnet 33 slidably.
Each second ratchet 39 of cylinder 34 is meshed with a flange 98 of the upper end that is installed in rotation on one of respective shaft 17.Between every flange 98 and one 93 is to impel axle 17 disc springs that move down 26.
Each electromagnet 33 links to each other with a power supply with lead 92 through switch 90.
Fig. 5 to Fig. 7 illustrates and is installed on feed in the box 4 on device 2 and 3 one of first and second parts, and box has with Japan Patent and discloses the identical structure that is disclosed for 7-28159 number for the first time, is hereby incorporated by reference.
As described in Figure 5, box comprises that a housing 41, is used to load the top cover 44 of electronic unit, and a polypropylene board 42.One dividing plate 47 that is positioned within the housing 41 is used to define first and second storerooms 45 and 46, makes electronic unit progressively be transported to second storeroom 46 by first storeroom 45.
One lift block 49 inserts second storeroom 46 through the bottom of housing 41.One is formed on when grooves 43 in the housing 41 are used to transport electronic unit 50 and can makes the parts alignment.The polypropylene board 42 of antistatic covers the front portion of housing 41, sees through this plate and can see electronic unit 50.One baffle plate, 51, one guide fingers 52 and a pull bar 53 are set at an outlet (that is a pickup station) of groove 43 and locate.Baffle plate 51 only just comes opening and closing through guide finger 52 by pull bar 53 when electronic unit 50 is provided, and makes it mobile.
As can be from seeing Fig. 6 and Fig. 7, pull bar 53 is positioned near the exit of groove 43 with opening and closing baffle plate 51, and an electronic unit 50 that will take the lead exposes and the linearity of controlling retainer 63 moves, be formed with first vacuum groove 59 that links to each other with a vacuum source and one first vacuum hole 58 on the baffle plate 51, one second vacuum groove 62 that links to each other with vacuum source, and one second vacuum hole 61.First vacuum groove 59 is connected between the outlet of first vacuum hole 58 and groove 43 so that to electronic unit 50 location.Second vacuum groove 62 is connected at a sidepiece of second vacuum hole 61 and groove 43 and separates with electronic unit 50 that will take the lead and subsequently parts, so just helps electronic unit 50 sequentially is transported to the exit of groove 43.
Below discuss the operating procedure of installation head 10 and 11.
At first, first installation head 10 moves to first feed position of device 2 and pick up electronic unit 50 through picking up mouth 18 according to the program of controller 38 shown in Fig. 8 (a).
Then, shown in Fig. 8 (b), installation head 10 moves to first line sensor 12.First line sensor 12 is surveyed each existence by the electronic unit 50 of picking up mouth 18 clampings, directed and height, and provide index signal to controller 38.At this moment, second installation head 11 will be installed on the printed circuit board (PCB) 19 that is fixed in workbench 6 from second electronic unit that device 3 picks up of feeding.
When second installation head 11 has been finished fitting operation, on the printed circuit board (PCB) 19 that first installation head 10 promptly moves to shown in Fig. 9 (a) on the workbench 6, and the electronic unit 50 that will pick up is installed on the printed circuit board (PCB) 19.Second installation head 11 then moves to second by controller 38 and feeds the assigned position of device 3 so that pick up electronic unit 50, then, shown in Fig. 9 (b), moves to second line sensor 13.Second line sensor 13 is surveyed each existence by the electronic unit 50 of pickup 18 clampings, directed and height, and provide index signal to controller 38.
The said sequence operating procedure can repeat to be installed on the printed circuit board (PCB) 19 with the electronic unit 50 that will need quantity for several times.
Below argumentation is in the location of the electronic unit 50 at the pickup station place of each box 4.
A series of electronic units 50 that transport along groove 43 are ended by retainer 63, as Fig. 6 and 7.Second vacuum hole 61 and second vacuum groove 62 are imposed a negative pressure, as Fig. 7 is clearly shown that, spurring the second and the 3rd electronic unit, and make them be fixed in location sidewall 65 places of second vacuum groove 62.Then, pull bar 53 do a swing make retainer 63 electronic unit 50 move equidirectional on move a segment distance a, as shown in Figure 7, make those leading electronic unit 50 freedom.Imposing a negative pressure to first vacuum hole 58 and first vacuum groove 59 then makes it to be located by location end wall 64 and location sidewall 65 to spur that leading electronic unit 50.
Discuss an oriented operating process that leading electronic unit 50 is picked up below with reference to Fig. 3,4,10 (a), 10 (b) and 11.
Shown in Figure 10 (a), when switch 90 was in open position, cylinder 34 was fixed on the ratchet 32, is not subjected to the attraction of electromagnet 33.After connecting vertical slip drive motors 28, will cause the pin 24 that is loaded on the bent axle 29 as shown in Figure 3 to move downward, thereby plate 30 and ratchet 32 are moved downward along slide 31.This flange 98 that will cause being installed on axle 17 upper ends moves downward by means of the spring force of spring 26.All like this alignment pins 27 are meshed with all vertical incision 25a of positioning seat 25 respectively, fixedly to pick up the Zhu Jiao position of mouth 18.
Mouth 18 will move down so that it contacts with the electronic unit 50 of the pickup station that is positioned at box 4 when needs will be picked up, and the drive motors 28 that vertically slides promptly disconnects.Picking up mouth 18 then is drained through the electromagnetically operated valve (not shown) to extract electronic unit 50.Vertical subsequently sliding motor 28 counter-rotatings are picked up mouth 18 with lifting.When arriving top dead-centre, pick up mouth and promptly remain static.
When connecting switch 90 as Figure 11, electromagnetic block 33 energisings make it to move up to attract cylinder 34.This has just prevented cylinder 34, flange 98, the axle 17 with pick up the trend that moves downward that mouth 18 causes moving downward of vertical sliding motor 28 owing to ratchet 32.Like this, electronic unit 50 just can not picked up by picking up mouth 18.
Below will discuss by the fitting operation of picking up the electronic unit 50 that mouth 18 picks up.
At first, move down by rotating the pin 24 that vertical slip drive motors 28 will be installed on bent axle 29, thus shown in Figure 10 (b) make like that dull and stereotyped 30 and ratchet 32 move down along slide 31.This causes each flange of 17 98 to move down by means of the spring force of spring 26.Alignment pin 27 is meshed with the vertical incision 25a of positioning seat 25 then, fixedly to pick up mouth 18 each positions, angle respectively.
Pick up mouth 18 and move down until electronic unit 50 with till printed circuit board (PCB) 19 contacts vertical slip drive motors stall this moment.Pick up then in the mouth 18 pressure by an electromagnetically operated valve (not shown) be switched on the occasion of, so that electronic unit 50 is discharged on the printed circuit board (PCB) 19.Vertical slip drive motors 28 counter-rotatings are picked up mouth 18 with lifting.In case when reaching top dead-centre, this is picked up mouth and promptly remains static.
When switch 90 is switched on as shown in figure 11, electromagnet 33 energisings make it to move up to attract cylinder 34, this has just prevented cylinder 34, flange 98, axle 17 and has picked up the downward motion of mouth 18, and with make ratchet 32 do downward motion by vertical slip drive motors irrelevant.Like this, electronic unit 50 just can not be installed on the printed circuit board (PCB) 19.
The change that is installed in the orientation of the electronic unit 50 on the printed circuit board (PCB) 19 is finished by connecting rotary drive motor 20, and this motor rotates driven gear 22 is picked up mouth 18 with adjusting Zhu Jiao position by pinion 27 and tooth bar 23.
Figure 12 (a), 12 (b) and 13 illustrate the sequence of operations step of first installation head 10 when picking up electronic unit 50.The operation of second installation head 11 is the same, by and omit detailed description here.
Shown in Figure 12 (a), first installation head 10 at first moves on to first and feeds a given position of device 2 to pick up electronic unit 50,10 switches 90 of picking up mouth 18 all disconnect then, to discharge the ratchet 32 of electromagnet 33 stickings, make that ratchet 32 is moved downward.This moves down by the spring force of spring 26 with regard to causing picking up mouth 18, shown in Figure 12 (b), makes each pick up mouth 18 corresponding to 10 electronic units 50 of the pickup station that is arranged in box 4, and it is picked up.
Then, as shown in figure 13, ratchet moves up, and meanwhile, all mouths 18 of picking up all are raised and stop at top dead-centre.Then, first installation head 10 is gone to first line sensor, 12 places, so that whether check that all 10 electronic units 50 are all picked up mouth 18 and fixed and whether be in a correct orientation.If 10 electronic units are all picked up mouth 18 and clamped, then first installation head 10 will be shifted to printed circuit board (PCB) 19 as previously discussed like that.
First installation head 10 was picked up electronic unit 50 from first parts are fed device 2 during, 11 of second installation head were engaged in and will be installed on the printed circuit board (PCB) 19 from second electronic unit 50 that device 3 picks up of feeding.On the contrary, second installation head 11 is picked up electronic unit 50 from second parts are fed device 3 during, 10 of first installation head are engaged in being installed on the printed circuit board (PCB) 19 from first electronic unit 50 that device 2 picks up of feeding, have so just realized the operation of Fast Installation.
Below will discuss second embodiment of electronic component mounting apparatus, this embodiment is designed to be divided into many groups with picking up mouth 18, so that in the once mounting operating process dissimilar electronic units is installed on the printed circuit board.
Figure 14 (a) illustrates the sequence of operations step of first installation head 10 that dissimilar electronic unit 50a and 50b are picked up to Figure 16.For example, the difference of parts is the difference of thickness.Second installation head 11 is the same, thereby repeats no more.
Shown in Figure 14 (a), first installation head 10 at first moves to feed a given position of device 2 of first parts, makes each pick up corresponding among mouth 18 and electronic unit 50a and the 50b one and aligns.Need pick up first group of electronic unit 50a picks up the switch 90 of mouth 18 (this group have 5 pick up mouth) in the present embodiment and is disconnected, cause first group to pick up mouth 18 and move down one first distance, from box 4, to pick up electronic unit 50a according to moving downward of ratchet 32.
Then, shown in Figure 15 (a), ratchet 32 moves up, and mentions first group of being fixed with electronic unit 50a and picks up mouth 18.When reaching top dead-centre, pick up mouth 18 and promptly stop to move.
Then, first group of switch 90 of picking up mouth 18 is switched on, second group of switch 90 of picking up mouth 18 (this group comprises that 5 of remainder are picked up mouth 18 in the present embodiment) then is disconnected, cause second group to pick up mouth 18 and shown in Figure 15 (b), move down a second distance that is shorter than first distance like that, so that the electronic unit 50b of thickness greater than electronic unit 50a picked up, after this, as shown in figure 16, they are mentioned and stop at top dead-centre.
After above-mentioned each step operation was finished, first installation head 10 moved to line sensor 12 places, with whether check all pick up mouth 18 all clamping electronic unit 50a and 50b are arranged.Each later step operation is described the same with first embodiment, repeats no more.
Can be clear that as above-mentioned discussion, second embodiment of electronic component mounting apparatus is useful when needs are controlled the stroke of picking up mouth 18 independently, in the case, the electronic unit that need pick up and be mounted on the printed circuit board (PCB) 19 can have all kinds, for example has different thickness.
Below discuss the 3rd embodiment of electronic component mounting apparatus, this embodiment is designed to available selected several mouths 18 of picking up and picks up electronic unit 50 from several box of needs.
Figure 17 (a) a series ofly picks up operation to what Figure 19 (b) showed first installation head 10, and the operation of second installation head 11 is just the same, so repeat no more.
Shown in Figure 17 (a), at first first installation head 10 is moved to the first given position of feeding device 2, make each pick up mouth 18 and align with a corresponding electronic unit 50.The switch 90 of picking up mouth 18 (selected two in the present embodiment and picked up mouth 18) that selected needs are picked up electronic unit 50 is disconnected, cause the selected mouth 18 of picking up to move downward according to the spring force that moves downward by means of spring 26 of ratchet 32, shown in Figure 17 (b), so that selected those electronic units 50 are raised from box.
Then, ratchet 32 moving upward like that shown in Figure 18 (a), what promote that clamping has an electronic unit 50 picks up mouth 18.Reach top dead-centre in case pick up mouth 18, its motion has just stopped.
Subsequently, first installation head 10 is displaced to the left side like that shown in Figure 18 (b), and selected being different from picking up for the first time second batch of mouth of picking up that has picked up electronic unit in the operation picks up mouth 18 and be placed in respectively on the electronic unit 50 that need pick up subsequently.Clamping has first selected switch of picking up mouth 18 of electronic unit 50 to be switched on, second batch of selected switch of picking up mouth 18 is disconnected so that second batch of selected mouth of picking up moves downward shown in Figure 19 (a) simultaneously, and pick up more needed electronic units 50, afterwards, second batch of selected mouth of picking up is raised and stops at top dead center, shown in Figure 19 (b).
After having finished said sequence operation, first installation head 10 moves to line sensor 12 places, with check more selected pick up mouth 18 whether all clamping correctly electronic unit 50 is arranged.That is discussed among later operation and first embodiment is consistent, so repeat no more.
The 4th embodiment below in conjunction with Figure 20 (a) and Figure 20 (b) argumentation electronic component mounting apparatus.
Figure 20 (a) illustrates 19: the first and second printed wires 95 of printed circuit board (PCB) and 96 with two same line figures.Be installed on spacing A between the electronic unit of the same type 50 on first and second printed wires 95 and 96 and be set to the integral multiple of the pitch of picking up mouth 18 of adjacent arrangement in twos.
Figure 20 (b) illustrates the printed circuit board (PCB) 19 of another modification, and it is 4 * 4 matrix forms, contains 16 identical printed wires.Be installed on spacing B between the same type of electrical component 50 on the adjacent lines and be set to the integral multiple of the pitch of picking up mouth 18 of arrangement adjacent one another are.
Discuss as following, the 4th embodiment uses above-mentioned two types printed circuit board (PCB) 19.
Figure 21 illustrates first installation head 10 and is positioned on the printed circuit board (PCB) 19 of being located by guide rail 97.The operation of second installation head 11 is identical with the operation of first installation head 10, so repeat no more.
When on first and second printed wires 95 and 96 that are installed in the printed circuit board (PCB) 19 shown in Figure 20 (a) with type of electrical component 50 respectively, pick up electronic unit 50 and they synchronously are installed on first and second printed wires 95 and 96 as shown in figure 22 with spacing A mouth 18a and the 18b (as shown in figure 21) of picking up spaced apart from each other.
When on the printed circuit board (PCB) 19 that is installed in type of electrical component 50 shown in Figure 20 (b), pick up electronic unit 50 and they synchronously are installed on two adjacent printed wires of printed circuit board (PCB) 19 with the spacing B mouth 18 of picking up spaced apart from each other.
Like this, the 4th embodiment has reduced the number of operations of mobile first and second installation head 10 and 11 with respect to conventional apparatus, thereby has realized the high speed fitting operation, and is will be transported on the printed circuit board (PCB) with type of electrical component one by one in legacy system.
Discuss the benefit that disposes line sensor 12 and 13 that provides as shown in Figure 2 below in conjunction with Figure 23 and 24.
If as shown in figure 24 line sensor 12 being placed on the workbench 6 and first parts feeds between the device 2, need between the workbench 6 and first line sensor 12, increase by a space D so as first installation head 10 from box 4, pick up electronic unit 50 and by first line sensor, 12 detection electronics 50 after be in static and till second installation head is finished fitting operation, avoid influencing each other of first installation head and second installation head when first installation head 10.But, if first parts that line sensor 12 is arranged in are as shown in figure 23 fed in the gap of device 2 middle bodies, that is to say that being arranged in first parts feeds between two groups of boxes of device 2, the hypotelorism that then can allow the workbench 6 and first parts to feed between the device 2 is as shown in the figure C, thereby causes the physical dimension of whole device to diminish.
And, in case detecting first installation head 10 by first line sensor 12, to pick up electronic unit 50 wrong, the layout of above-mentioned this first line sensor 12 has reduced the distance that matching requirements first installation head 10 moves when operating again, thereby has reduced the operating time again.
Discuss the 5th embodiment of electronic component mounting apparatus below in conjunction with Figure 25 (a) and 25 (b), this embodiment is different from first embodiment, and it is that each picks up mouth 18 and provide one to pick up mouth lowering mechanism 100, rather than electromagnetic block 33 and cylinder 34 are provided.Remaining constructs all similar first embodiment, so do not give unnecessary details.
Pick up mouth lowering mechanism 100 and comprise L shaped securing rod 99, one springs 110 and an air rammer 120.Securing rod 99 is pivoted to be supported and is pushed in the direction of the clock by spring 110, as seen in Fig..When piston 120 outwards was projected into the spring force that props up spring 110 shown in Figure 25 (a), securing rod 99 promptly was meshed with flange 98 at the one end, was fixed in a given horizontal level with picking up mouth.When the piston 120 shown in Figure 25 (b) is shunk back, it will cause securing rod 99 to clockwise rotate by means of the spring masterpiece of spring 110, thereby discharge the engagement of itself and flange 98.The spring force by means of spring 26 moves downward according to moving downward of ratchet 32 to pick up mouth 18 like this.
Figure 26 and 27 illustrates the 6th embodiment of electronic component mounting apparatus, this embodiment is designed to the skew of recoverable electronic unit 50, these skews pick up and cause when electronic unit and desire are placed in printed circuit board (PCB) 19 with it when picking up mouth 18, same parts has been adopted the numbering identical with previous embodiment, repeated no more.
Be clearly shown that as Figure 26, the electronic component mounting apparatus of present embodiment is not to resemble positioning seat 23 and dull and stereotyped 94 are arranged the previous embodiment, and alignment pin 27 is fixed, but be designed to by motor 20, tooth bar 23 and be contained in driven wheel 22 on the axle 17 and make and pick up mouth 18 and rotate, thereby the angular deflection of correcting electronic parts 50 with angle direction.Tooth bar 23 can replace with a belt.
As shown in figure 27, electronic component mounting apparatus also includes component locations monitor 121 and 122, replaces to be arranged in feed line sensor 12 and 13 in the center clearance of device 2 and 3 of first and second parts.Each component locations monitor 121 and 122 can comprise a ccd image sensor so that monitor the position of each electronic unit 50 and provide an index signal to controller 38 when directions X moves at each first and second parts device 2 and 3 of feeding.Controller 38 is determined each electronic unit 50 at X, the skew of Y and θ direction, if this skew exceeds tolerance band, then the motor 20 to motor 14, guide assembly 8 and first and second installation head 10 and 11 of workbench 6 provides offset correction signal respectively.
In offset correction operation, the skew of Y direction is mat motor 14 mobile working platforms and proofreading and correct.The skew of directions X is proofreaied and correct by move first and second installation head 10 and 11 along guide assembly 8.The skew of angular direction theta is that mat motor 20 makes and picks up mouth 18 and rotate around the longitudinal centre line and proofread and correct.
In fitting operation, if all are clamped in the electronic unit of picking up on the mouth 18 50 offset is arranged all, make them stand offset correction operation, sequentially install them on the printed circuit board (PCB) 19 then.If only there is part to be held in the electronic unit of picking up on the mouth 18 50 offset is arranged, make them stand to be offset the shift correction operation and sequentially they are installed on the printed circuit board (PCB) then, after this, remaining electronic unit 50 is installed synchronously or sequentially.
Here the form with preferred embodiment has disclosed the present invention, yet should be appreciated that, only otherwise departing from principle of the present invention also can provide various forms of examples.Therefore, the present invention is interpreted as comprising all possible embodiment and to the embodiment correct is shown under the prerequisite that does not deviate from by the illustrated principle of the invention of claims.For example, the slide mechanism that is used for workbench 6 that comprises motor 14 and spherical screw mandrel 5 can replace the slide mechanism that comprises a linear servo motor, a rack-and-pinion and a lead.Each first and second installation head 10 and 11 mouth rotating mechanism comprise rotational drive motor 20, pinion 21 and tooth bar 23, but also can replace a pulley and a belt.In addition, each first and second installation head 10 and 11 movement in vertical direction can realize with a gas cylinder actuators, a linear servo motor and a spherical screw mandrel, to replace slip drive motors 20, slide 31 and bent axle 29.

Claims (16)

1. an automatic electronic parts mounting apparatus comprises:
The one first parts device of feeding, this device of feeding comprises a plurality of boxes, each box internal memory contains electronic unit and a pickup station is arranged;
The one second parts device of feeding, this device of feeding comprises a plurality of boxes, each box internal memory contains electronic unit and a pickup station is arranged;
The workbench of one fixed printed circuit board is installed on the printed circuit board (PCB) electronic unit;
One first installation head, this installation head comprise a plurality of moving in the vertical direction to pick up the mouth of picking up of electronic unit from pickup station;
One second installation head, this installation head comprise a plurality of moving in the vertical direction to pick up the mouth of picking up of electronic unit from pickup station; And
One controller, this controller is used for controlling moving of described workbench and described first and second installation head, make described first and second installation head pick up electronic unit, then electronic unit is installed on the given position by the fixing printed circuit board (PCB) of described workbench from pickup station;
It is characterized in that, described first parts device of feeding is arranged in along first direction and leaves the feed preselected spacing place of device of described second parts, described workbench is placed in described first and second parts and feeds within the pre-selected spacing of device and can move along the second direction perpendicular to first direction, and described first and second installation head are configured to and can move along described first direction.
2. automatic electronic parts mounting apparatus as claimed in claim 1, it is characterized in that, each described first and second parts is fed the box of device along arranging adjacent to each other on second pitch of first direction, and each first and second installation head pick up mouth with described first segment layout adjacent to each other on second pitch that equates.
3. automatic electronic parts mounting apparatus as claimed in claim 1, it is characterized in that, described controller is controlled the motion of described first and second installation head with first and second operator schemes, first operator scheme is meant that described first installation head picks up electronic unit by picking up mouth from the feed pickup station of device of described first parts, this moment, second installation head then will be installed on the printed circuit board (PCB) that is fixed in workbench by picking up the electronic unit that mouth picks up, second operator scheme is meant that described second installation head picks up electronic unit by picking up mouth from the feed pickup station of device of described second parts, and this moment, first installation head then will be installed on the printed circuit board (PCB) that is fixed in workbench by picking up the electronic unit that mouth picks up.
4. automatic electronic parts mounting apparatus as claimed in claim 1, it is characterized in that, what described controller was controlled each described first and second installation head picks up moving both vertically of mouth, makes the mouth of picking up of each described first and second installation head synchronously pick up electronic unit.
5. automatic electronic parts mounting apparatus as claimed in claim 1, it is characterized in that, described controller is controlled described first and second installation head, make each described first and second installation head contain first quantity pick up first group of mouth with contain second quantity and pick up second group of mouth and pick up electronic unit with different timed motion.
6. automatic electronic parts mounting apparatus as claimed in claim 5, it is characterized in that, in first group of each first and second installation head each is picked up mouth and is picked up in the operation one first pick up an electronic unit from a selected box pickup station, and in second group of each first and second installation head each is picked up mouth second picking up in the operation and pick up an electronic unit from a selected box pickup station after first picks up operation.
7. automatic electronic parts mounting apparatus as claimed in claim 1, it is characterized in that, what described controller was controlled each described first and second installation head picks up moving both vertically of mouth, make all picking up of each described first and second installation head have at least one to move in the mouth, to pick up an electronic unit from a selected box pickup station.
8. automatic electronic parts mounting apparatus as claimed in claim 1, it is characterized in that, described controller is controlled all motions of picking up mouth in vertical direction of each described first and second installation head motion on first direction and each first and second installation head, makes the mouth of picking up of each given number of each described first and second installation head pick up an electronic unit from a selected box pickup station.
9. automatic electronic parts mounting apparatus as claimed in claim 1, it is characterized in that, described first and second installation head comprise picks up mouth travel mechanism, and it has one and is used for promoting synchronously upwards the lifting member of picking up mouth and is used for descending independently of each other and picks up the lowering means of mouth.
10. automatic electronic parts mounting apparatus as claimed in claim 1, it is characterized in that, it comprises that also being arranged in described first and second parts respectively feeds in the device, be used to monitor by existence and the orientation of picking up the electronic unit that mouth picks up, and a first sensor and one second transducer of index signal are provided.
11. automatic electronic parts mounting apparatus as claimed in claim 1 is characterized in that, it also comprises and is used to make pickup station to center on the tumbler that rotate at its center.
12. automatic electronic parts mounting apparatus as claimed in claim 11 is characterized in that, each is picked up mouth and has a length of vertically extending, and described tumbler makes each pick up mouth around its center line that extends in the longitudinal direction rotation.
13. automatic electronic parts mounting apparatus as claimed in claim 1, it is characterized in that, it also comprises a position monitor and an offset aligning gear, described position monitor monitors each position by the electronic unit of picking up the mouth clamping, to determine its side-play amount from a given tram, described offset aligning gear is adjusted at the relative position between the electronic unit that workbench and has offset, is offset with compensated position.
14. automatic electronic parts mounting apparatus as claimed in claim 13 is characterized in that, the inclined to one side aligning gear in described position comprises that one can make each pick up the whirligig that mouth rotates around its center.
15. electronic component mounting apparatus as claimed in claim 14 is characterized in that, described offset aligning gear comprises that also one makes workbench in travel mechanism that second party moves up.
16. automatic electronic parts mounting apparatus as claimed in claim 15 is characterized in that, described offset aligning gear also comprises one in move up second travel mechanism of first and second installation head of first party.
CN96123135A 1995-12-15 1996-12-16 Automatic electronic parts mounting apparatus Expired - Fee Related CN1071536C (en)

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JP32677395 1995-12-15
JP326773/95 1995-12-15
JP326773/1995 1995-12-15
JP117633/1996 1996-05-13
JP11763396 1996-05-13
JP117633/96 1996-05-13

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CN1071536C true CN1071536C (en) 2001-09-19

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EP (1) EP0779777B1 (en)
KR (1) KR100285148B1 (en)
CN (1) CN1071536C (en)
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MY (1) MY133263A (en)
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DE69606963D1 (en) 2000-04-13
TW324882B (en) 1998-01-11
EP0779777A1 (en) 1997-06-18
US6691400B1 (en) 2004-02-17
SG43451A1 (en) 1997-10-17
KR970058510A (en) 1997-07-31
EP0779777B1 (en) 2000-03-08
CN1159139A (en) 1997-09-10
DE69606963T2 (en) 2000-07-27
KR100285148B1 (en) 2001-03-15
MY133263A (en) 2007-10-31

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