CN111642126B - A paster equipment for production of electron class product - Google Patents
A paster equipment for production of electron class product Download PDFInfo
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- CN111642126B CN111642126B CN202010446486.7A CN202010446486A CN111642126B CN 111642126 B CN111642126 B CN 111642126B CN 202010446486 A CN202010446486 A CN 202010446486A CN 111642126 B CN111642126 B CN 111642126B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Abstract
A piece sticking device for electronic product production comprises a base, a suction nozzle, a piece sticking plate, a sealing plug and a connecting plate; the base is provided with an installation frame, a placing table and an adsorption table; the end surface of the placing table far away from the base is provided with an accommodating groove for accommodating the placing plate; a first adsorption bin connected with a second vacuumizing device is arranged in the adsorption platform; the mounting frame is provided with a power assembly for driving the connecting plate to reciprocate; the connecting plate is provided with a telescopic device for driving the patch plate to move up and down; a second adsorption bin connected with the first vacuumizing device is arranged in the patch board, and an installation groove communicated with the second adsorption bin is formed in the patch board; the plurality of groups of suction nozzles and the plurality of groups of sealing plugs are matched and connected with the mounting grooves; a first placing groove is arranged on the end surface of the placing plate; the first placing grooves correspond to the mounting grooves one to one; the adsorption table is provided with an elastic pad for placing a circuit board. The invention has simple operation and convenient use, and can meet the requirement of carrying out surface mounting on the electronic components in any arrangement sequence on the circuit boards with different sizes.
Description
Technical Field
The invention relates to the technical field of patch equipment, in particular to patch equipment for producing electronic products.
Background
The surface mount technology is a circuit mounting technology in which surface-mounted components are mounted on the surface of a circuit board or the surface of other substrates and then soldered and mounted by means of reflow soldering, dip soldering or the like; the existing chip mounter can be roughly classified into three types from the structural point of view: arch frame type, turret type and composite type structures. Different types of pick & place machines each have advantages and disadvantages, typically depending on the requirements of the application on the system and the match between speed and accuracy. The existing chip mounter pastes electronic components on a circuit board, namely, the electronic components are pasted one by one, so that the efficiency is low, although equipment capable of simultaneously pasting multiple groups of electronic components is provided, the equipment can only paste the electronic components of the same type and a circuit board of an appointed type, and the requirement of the existing circuit board for pasting cannot be met; therefore, the application provides a patch device for electronic product production.
Disclosure of Invention
Objects of the invention
The invention provides the paster equipment for producing the electronic products, which is simple to operate and convenient to use, can meet the requirement of pasting electronic components in any arrangement sequence on circuit boards with different sizes, and greatly improves the efficiency of paster production of the circuit boards.
(II) technical scheme
In order to solve the problems, the invention provides a piece sticking device for producing electronic products, which comprises a base, an installation frame, a placing table, a placing plate, a suction nozzle, a piece sticking plate, a sealing plug, an elastic pad, an adsorption table, a first vacuumizing device, a second vacuumizing device and a connecting plate, wherein the installation frame is arranged on the base;
the placing table and the adsorption table are distributed side by side, the placing table and the adsorption table are respectively connected with the base through a plurality of groups of telescopic buffer rods, and the placing table and the adsorption table are both parallel to the base; the end surface of the placing table, which is far away from the base, is provided with an accommodating groove for accommodating the placing plate; a first adsorption bin is arranged in the adsorption platform;
the mounting frame is mounted on the base, and a power assembly for driving the connecting plate to reciprocate along the connecting direction of the placing table and the adsorption table is arranged on the mounting frame; the end surface of the connecting plate facing the base is provided with a telescopic device for driving the patch board to move towards or away from the base;
the patch board is parallel to the base, a second adsorption bin is arranged in the patch board, and a plurality of groups of mounting grooves are uniformly formed in the end face, facing the base, of the patch board; each group of mounting grooves is communicated with the second adsorption bin; the air outlet hole of the second adsorption bin on the patch board is connected with an air exhaust port of a second vacuum-pumping device through a pipeline; the suction nozzles are screwed into the mounting grooves in a one-to-one threaded fit mode according to the positions of the patches on the circuit board to be patched; the multiple groups of sealing plugs are screwed into the other mounting grooves one by one;
a plurality of groups of first placing grooves for placing electronic components to be used are uniformly arranged on the end surface of the placing plate; the first placing grooves correspond to the mounting grooves one to one;
the elastic pad is arranged on the end face, far away from the base, of the adsorption table, and a second placing groove for containing a circuit board to be processed is formed in the elastic pad; a plurality of groups of vent holes for communicating the first adsorption bin are uniformly formed in the bottom surface of the second placing groove; the air outlet of the first adsorption bin on the adsorption platform is connected with an air exhaust port of the first vacuum-pumping device through a pipeline; the circuit board compresses tightly the bottom surface of second standing groove under the inside negative pressure state that is in of first absorption storehouse.
Preferably, comprises a main chassis; the main case is provided with a display screen and a key module, and a controller is arranged in the main case; the controller is respectively connected with the telescopic device, the first vacuumizing device, the second vacuumizing device and the power assembly in a control mode, and the controller is respectively electrically connected with the display screen and the key module.
Preferably, the power assembly comprises a driving device, a sliding plate, a threaded rod and a guide rod;
the sliding plate is provided with a threaded hole and is connected with the fixed end of the telescopic device;
the threaded rod and the guide rod are distributed side by side; the thread of the threaded rod penetrates through the threaded hole, the two ends of the threaded rod are rotatably connected with the mounting frame, and the threaded rod is in transmission connection with the driving device; the driving device is connected with the mounting frame; the guide rod is connected with the sliding plate in a sliding mode, and the two ends of the guide rod are connected with the mounting frame.
Preferably, the guide bar is provided with a limit switch for limiting the moving range of the sliding plate.
Preferably, each group of telescopic buffer rods comprises a fixed plate, a sliding rod, a spring, a first sliding part and an installation cylinder for connecting the adsorption table or the placing table;
the fixed plate is connected with the base; the other end of the mounting cylinder is provided with a through hole; the first sliding piece is slidably arranged in the mounting cylinder; the spring is positioned in the mounting cylinder, one end of the spring is connected with the inner end face of the mounting cylinder, and the other end of the spring is connected with one end of the first sliding piece;
one end of the sliding rod is connected with the fixing plate, the other end of the sliding rod extends into the mounting cylinder through the through hole, and in an initial state, the other end of the sliding rod abuts against the end face, far away from the spring, of the first sliding piece.
Preferably, each group of telescopic buffer rods further comprises a second sliding part and a pressure sensor;
the second sliding piece is slidably arranged in the mounting cylinder and is connected with the sliding rod; the pressure sensor is mounted on the end face of the second slide facing the first slide.
Preferably, the elastic pad is a latex pad.
Preferably, the positioning device comprises a plurality of groups of positioning columns; wherein, the bottom surface of the accommodating groove is provided with a plurality of groups of positioning blind holes;
the multiunit reference column is evenly installed at the terminal surface of placing the board, and the multiunit reference column cooperates respectively and inserts in the multiunit blind hole of location, constitutes location structure.
Preferably, the first standing groove of multiunit and multiunit mounting groove all are the array and arrange.
Preferably, the device comprises a battery, a lighting lamp and a switch; wherein, the end surface of the placing plate is provided with a plurality of groups of switch grooves for installing a plurality of groups of switches; the placing plate is provided with a power supply groove for installing a battery;
each group of first placing grooves is internally provided with a horizontal transparent plate; an installation bin for installing an illuminating lamp is enclosed between the transparent plate and the inner wall of the first placing groove; the first placing grooves, the illuminating lamps and the switches are in one-to-one correspondence; each group of illuminating lamps, each group of switches and the batteries are electrically connected.
The technical scheme of the invention has the following beneficial technical effects:
when the suction nozzle is used, a plurality of groups of suction nozzles are correspondingly arranged on the chip board according to the chip positions on the circuit board to be chip-mounted, and other installation grooves on the chip board are sealed by a plurality of groups of sealing plugs; the power assembly drives the connecting plate to move right above the placing table, the telescopic device operates to drive the patch board to move towards the placing table, the second vacuumizing device operates, and the second adsorption bin is in negative pressure so as to adsorb the electronic components placed on the placing board through the plurality of groups of suction nozzles; the telescopic device is contracted, the power assembly moves the telescopic device to be right above the adsorption table when in operation, and the circuit board with the patch is adsorbed and fixed on the elastic pad on the adsorption table; the telescopic device operates to drive the patch board to move towards the adsorption table so as to attach a plurality of groups of electronic components on the circuit board, and the operation is simple and the use is convenient; the chip mounting device can meet the requirements of carrying out chip mounting on circuit boards with different sizes and can meet the requirements of carrying out chip mounting on electronic components in any arrangement sequence on the circuit boards; in addition, when the electronic component is adsorbed or pasted by the patch board through the arranged telescopic buffer rod, the damage of a product or equipment caused by overlarge downward pressure is avoided;
when the electronic components to be pasted are placed, the electronic components are correspondingly placed in the corresponding first placing grooves according to the positions of the electronic components to be pasted on the circuit board, and meanwhile, the illuminating lamps in the first placing grooves in which the electronic components are placed are turned on, so that the electronic components to be used can be quickly and accurately placed in the multiple groups of first placing grooves after the electronic components are detached from the first placing grooves by using the pasting plate, and the feeding efficiency is greatly improved; in addition, the light is equipped with different colors, when needs place different kinds of electronic components, distinguishes different kinds of electronic components through different light colors, and is more convenient.
Drawings
Fig. 1 is a schematic structural diagram of a patch device for electronic product production according to the present invention.
Fig. 2 is a schematic structural diagram of a part a of the chip mounting device for electronic product production according to the present invention.
Fig. 3 is a partially enlarged structural schematic diagram of a patch device for electronic product production according to the present invention at B.
Fig. 4 is a top view of a patch board in a patch device for electronic product production according to the present invention.
Fig. 5 is a top view of a placement board in a sheet attaching device for electronic product production according to the present invention.
Fig. 6 is a schematic block diagram of a patch device for electronic product production according to the present invention.
Reference numerals: 1. a base; 2. a mounting frame; 3. a placing table; 4. placing the plate; 5. a suction nozzle; 6. a patch board; 61. mounting grooves; 7. a sealing plug; 8. a telescoping device; 9. a drive device; 10. a sliding plate; 11. a threaded rod; 12. an elastic pad; 13. a second placing groove; 14. an adsorption stage; 15. a first adsorption bin; 16. a fixing plate; 17. a first vacuum extractor; 18. a slide bar; 19. a positioning column; 20. a first placing groove; 21. a transparent plate; 22. an illuminating lamp; 23. a switch; 24. a battery; 25. mounting the cylinder; 26. a spring; 27. a first slider; 28. a pressure sensor; 29. a second slider; 30. a controller; 31. and a second vacuum extractor.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings in conjunction with the following detailed description. It should be understood that the description is intended to be exemplary only, and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
As shown in fig. 1 to 6, the patch device for electronic product production according to the present invention includes a base 1, a mounting frame 2, a placing table 3, a placing plate 4, a suction nozzle 5, a patch plate 6, a sealing plug 7, an elastic pad 12, an adsorption table 14, a first vacuum extractor 17, a second vacuum extractor, and a connecting plate;
the placing table 3 and the adsorption table 14 are distributed side by side, and both the placing table 3 and the adsorption table 14 are parallel to the base 1; (ii) a The end face, far away from the base 1, of the placing table 3 is provided with an accommodating groove for accommodating the placing plate 4, and the end face, facing the base 1, of the placing table 3 is provided with a plurality of groups of telescopic buffer rods connected with the base 1; a first adsorption bin 15 is arranged in the adsorption table 14, and a plurality of groups of telescopic buffer rods connected with the base 1 are arranged on the end face, facing the base 1, of the adsorption table 14;
the mounting frame 2 is mounted on the base 1, and a power component for driving the connecting plate to reciprocate along the connecting direction of the placing table 3 and the adsorption table 14 is arranged on the mounting frame 2; the connecting plate is connected with the moving end of the power assembly, and the end face, facing the base 1, of the connecting plate is provided with a telescopic device 8 for driving the patch plate 6 to move towards or away from the base 1; the fixed end of the expansion device 8 is connected with the connecting plate, the expansion end of the expansion device 8 is connected with the patch plate 6, and the expansion device 8 is selected from but not limited to a cylinder;
the patch board 6 is parallel to the base 1, a second adsorption bin is arranged in the patch board 6, and a plurality of groups of installation grooves 61 are uniformly formed in the end face, facing the base 1, of the patch board 6; each group of mounting grooves 61 is communicated with the second adsorption bin; the air outlet hole of the second adsorption bin on the patch plate 6 is connected with the air exhaust port of the second vacuum-pumping device through a pipeline; the suction nozzles 5 are screwed into the mounting grooves 61 in a one-to-one threaded fit manner according to the positions of the patches on the circuit board to be patched; the multiple groups of sealing plugs 7 are screwed into the other mounting grooves 61 one by one;
further, the sealing plug 7 is made of rubber;
a plurality of groups of first placing grooves 20 for placing electronic components to be used are uniformly arranged on the end surface of the placing plate 4; the first placing grooves 20 correspond to the mounting grooves 61 one by one;
the elastic pad 12 is arranged on the end face, far away from the base 1, of the adsorption table 14, and a second placing groove 13 for containing a circuit board to be processed is formed in the elastic pad 12; a plurality of groups of vent holes for communicating the first adsorption bin 15 are uniformly formed in the bottom surface of the second placing groove 13; the air outlet hole of the first adsorption bin 15 on the adsorption platform 14 is connected with the air exhaust port of the first vacuum pumping device 17 through a pipeline; the interior of the first adsorption bin 15 is in a negative pressure state, and the circuit board compresses the bottom surface of the second placing groove 13.
When the suction nozzle is used, a plurality of groups of suction nozzles 5 are correspondingly arranged on the patch board 6 according to the patch positions on the circuit board to be patch, and the rest mounting grooves 61 on the patch board 6 are sealed by a plurality of groups of sealing plugs 7; the power assembly drives the connecting plate to move right above the placing table 3, the telescopic device 8 operates to drive the patch plate 6 to move towards the placing table 3, the second vacuumizing device 31 operates, and the second adsorption bin is in negative pressure so as to adsorb the electronic components placed on the placing plate 4 through the plurality of groups of suction nozzles 5; the telescopic device 8 is contracted, the power assembly operates to move the telescopic device 8 to be right above the adsorption table 14, and the circuit board with the patch is adsorbed and fixed on the elastic pad 12 on the adsorption table 14; the telescopic device 8 operates to drive the patch plate 6 to move towards the adsorption table 14 so as to attach a plurality of groups of electronic components on the circuit board, and the operation is simple and the use is convenient; the demand of carrying out the paster to not equidimension circuit board can be satisfied, the demand of carrying out the paster to the electronic components of arranging the order wantonly on the circuit board can be satisfied.
In an alternative embodiment, a main chassis is included; the main case is provided with a display screen and a key module, and a controller 30 is arranged in the main case; the controller 30 is respectively connected with the telescopic device 8, the first vacuumizing device 17, the second vacuumizing device and the power assembly in a control mode, and the controller 30 is respectively electrically connected with the display screen and the key module;
it should be noted that, the controller 30 is used for intelligently controlling the telescopic device 8, the first vacuumizing device 17, the second vacuumizing device and the power assembly, so that the efficiency of mounting the circuit board is greatly improved, and the unqualified circuit board after mounting caused by improper manual operation is avoided.
In an alternative embodiment, the power assembly comprises a drive means 9, a slide plate 10, a threaded rod 11 and a guide rod;
the sliding plate 10 is provided with a threaded hole, and the sliding plate 10 is connected with the fixed end of the telescopic device 8;
the threaded rod 11 and the guide rod are distributed side by side; the thread of the threaded rod 11 penetrates through the threaded hole, both ends of the threaded rod 11 are rotatably connected with the mounting frame 2, and the threaded rod 11 is in transmission connection with the driving device 9; the driving device 9 is connected with the mounting frame 2, and the driving device 9 selects a variable frequency motor;
the guide rod is connected with the sliding plate 10 in a sliding way, and both ends of the guide rod are connected with the mounting frame 2;
it should be noted that, during the use, drive threaded rod 11 through drive arrangement 9 and rotate, threaded rod 11 threaded connection sliding plate 10 to drive sliding plate 10 and remove along the axis direction of guide bar on the guide bar, thereby drive the top reciprocating motion of paster board 6 above placing platform 3 and adsorption stage 14.
In an alternative embodiment, the guide bar is provided with a limit switch for limiting the range of movement of the slide plate 10.
In an alternative embodiment, each set of telescopic buffer rods comprises a fixed plate 16, a sliding rod 18, a spring 26, a first sliding member 27 and a mounting tube 25 for connecting the suction table 14 or the placing table 3;
the fixed plate 16 is connected with the base 1; the other end of the mounting cylinder 25 is provided with a through hole; the first sliding member 27 is slidably mounted in the mounting cylinder 25; the spring 26 is positioned in the mounting cylinder 25, one end of the spring 26 is connected with the inner end surface of the mounting cylinder 25, and the other end of the spring 26 is connected with one end of the first sliding piece 27;
one end of the sliding rod 18 is connected with the fixing plate 16, the other end of the sliding rod 18 extends into the mounting cylinder 25 through the through hole, and in an initial state, the other end of the sliding rod 18 presses against the end face, away from the spring 26, of the first sliding part 27;
through the flexible buffer beam that sets up when using paster board 6 to adsorb electronic components or carry out the paster, avoid the too big damage that causes product or equipment of holding down pressure.
In an alternative embodiment, each set of telescopic buffer rods further comprises a second slide 29 and a pressure sensor 28;
a second sliding part 29 is slidably arranged in the mounting cylinder 25, and the second sliding part 29 is connected with the sliding rod 18; the pressure sensor 28 is mounted on the end face of the second slide 29 facing the first slide 27;
when the telescopic device is used, the pressure of the first sliding part 27 on the second sliding part 29 is detected through the arranged pressure sensor 28, and when the pressure reaches a set value, the telescopic end of the telescopic device 8 is controlled to contract, so that the circuit board or the electronic component is prevented from being damaged due to the fact that the telescopic end of the telescopic device 8 extends to a large length.
In an alternative embodiment, the elastic pad 12 is a latex pad.
In an alternative embodiment, a plurality of sets of positioning posts 19 are included; wherein, the bottom surface of the accommodating groove is provided with a plurality of groups of positioning blind holes;
In an alternative embodiment, the plurality of sets of first placement grooves 20 and the plurality of sets of mounting grooves 61 are arranged in an array.
In an alternative embodiment, a battery 24, an illumination lamp 22 and a switch 23 are included; wherein, the end surface of the placing plate 4 is provided with a plurality of groups of switch slots for installing a plurality of groups of switches 23; the placing plate 4 is provided with a power supply groove for installing the battery 24;
a horizontal transparent plate 21 is arranged in each group of the first placing grooves 20; an installation cabin which is used for installing an illuminating lamp 22 is enclosed between the transparent plate 21 and the inner wall of the first placing groove 20; the first placing grooves 20, the illuminating lamps 22 and the switches 23 are in one-to-one correspondence; each group of illuminating lamps 22, each group of switches 23 and the battery 24 are electrically connected;
it should be noted that, during use, a plurality of electronic components are correspondingly placed in the corresponding first placing grooves 20 according to the positions of the to-be-mounted electronic components on the circuit board, and meanwhile, the illuminating lamps 22 in the first placing grooves 20 in which the electronic components are placed are turned on, so that the to-be-used electronic components can be rapidly and accurately correspondingly placed in the plurality of groups of first placing grooves 20 after the electronic components are detached from the first placing grooves 20 by using the mounting plate 6, and the feeding efficiency is greatly improved; in addition, the illuminating lamps 22 are provided with different colors, and when different kinds of electronic components need to be placed, the different kinds of electronic components are distinguished through different lamp colors.
It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.
Claims (10)
1. The paster equipment for producing electronic products is characterized by comprising a base (1), an installation frame (2), a placing table (3), a placing plate (4), a suction nozzle (5), a paster plate (6), a sealing plug (7), an elastic pad (12), an adsorption table (14), a first vacuumizing device (17), a second vacuumizing device and a connecting plate;
the placing table (3) and the adsorption table (14) are distributed side by side, the placing table (3) and the adsorption table (14) are respectively connected with the base (1) through a plurality of groups of telescopic buffer rods, and the placing table (3) and the adsorption table (14) are both parallel to the base (1); wherein, the end surface of the placing table (3) far away from the base (1) is provided with an accommodating groove for accommodating the placing plate (4); a first adsorption bin (15) is arranged in the adsorption platform (14);
the mounting rack (2) is mounted on the base (1), and a power assembly for driving the connecting plate to reciprocate along the connecting direction of the placing table (3) and the adsorption table (14) is arranged on the mounting rack (2); the end face of the connecting plate facing the base (1) is provided with a telescopic device (8) for driving the patch plate (6) to move towards or away from the base (1);
the patch board (6) is parallel to the base, a second adsorption bin is arranged in the patch board (6), and a plurality of groups of mounting grooves (61) are uniformly formed in the end face, facing the base (1), of the patch board (6); each group of mounting grooves is communicated with the second adsorption bin; the air outlet hole of the second adsorption bin on the patch plate (6) is connected with the air exhaust port of the second vacuum-pumping device through a pipeline; the suction nozzles (5) are screwed into the mounting grooves (61) in a one-to-one threaded fit mode according to the positions of the patches on the circuit board to be patch; the multiple groups of sealing plugs (7) are screwed into the rest mounting grooves (61) one by one;
a plurality of groups of first placing grooves (20) for placing electronic components to be used are uniformly arranged on the end surface of the placing plate (4); the first placing grooves (20) correspond to the mounting grooves (61) one by one;
the elastic pad (12) is arranged on the end face, away from the base (1), of the adsorption table (14), and a second placing groove (13) for containing a circuit board to be processed is formed in the elastic pad (12); a plurality of groups of vent holes for communicating the first adsorption bin (15) are uniformly formed in the bottom surface of the second placing groove (13); the air outlet hole of the first adsorption bin (15) on the adsorption platform (14) is connected with the air exhaust port of the first vacuum-pumping device (17) through a pipeline; the interior of the first adsorption bin (15) is in a negative pressure state, and the circuit board compresses the bottom surface of the second placing groove (13).
2. A patch device for electronic product production according to claim 1, characterized by comprising a main cabinet; the main case is provided with a display screen and a key module, and a controller (30) is arranged in the main case; the controller (30) is respectively connected with the telescopic device (8), the first vacuumizing device (17), the second vacuumizing device and the power assembly in a control mode, and the controller (30) is respectively electrically connected with the display screen and the key module.
3. A sheet device for the production of electronic products according to claim 2, characterized in that the power assembly comprises a driving means (9), a sliding plate (10), a threaded rod (11) and a guide rod;
the sliding plate (10) is provided with a threaded hole, and the sliding plate (10) is connected with the fixed end of the telescopic device (8);
the threaded rod (11) and the guide rod are distributed side by side; the thread of the threaded rod (11) penetrates through the threaded hole, two ends of the threaded rod (11) are rotatably connected with the mounting frame (2), and the threaded rod (11) is in transmission connection with the driving device (9); the driving device (9) is connected with the mounting frame (2); the guide rod is connected with the sliding plate (10) in a sliding mode, and the two ends of the guide rod are connected with the mounting frame (2).
4. A sheet sticking device for electronic product production according to claim 3, wherein the guide bar is provided with a limit switch for limiting the moving range of the sliding plate (10).
5. The paster device for electronic product production according to claim 1, wherein each set of telescopic buffer rods comprises a fixed plate (16), a slide rod (18), a spring (26), a first sliding part (27) and a mounting cylinder (25) for connecting the adsorption table (14) or the placing table (3);
the fixed plate (16) is connected with the base (1); the other end of the mounting cylinder (25) is provided with a through hole; the first sliding piece (27) is installed in the installation cylinder (25) in a sliding mode; the spring (26) is positioned in the mounting cylinder (25), one end of the spring (26) is connected with the inner end face of the mounting cylinder (25), and the other end of the spring (26) is connected with one end of the first sliding piece (27);
one end of the sliding rod (18) is connected with the fixing plate (16), the other end of the sliding rod (18) extends into the mounting cylinder (25) through the through hole, and in an initial state, the other end of the sliding rod (18) presses against the end face, away from the spring (26), of the first sliding piece (27).
6. A patch device for the production of electronic products, according to claim 5, characterized in that each set of telescopic damping rods further comprises a second slide (29) and a pressure sensor (28);
the second sliding part (29) is slidably arranged in the mounting cylinder (25), and the second sliding part (29) is connected with the sliding rod (18); a pressure sensor (28) is mounted on the end face of the second slide (29) facing the first slide (27).
7. A patch device for electronic product production according to claim 1, wherein the elastic pad (12) is a latex pad.
8. A sheet device for the production of electronic products according to claim 1, characterized in that it comprises a plurality of sets of positioning posts (19); wherein, the bottom surface of the accommodating groove is provided with a plurality of groups of positioning blind holes;
the positioning posts (19) are uniformly arranged on the end face of the placing plate (4), and the positioning posts (19) are respectively inserted into the positioning blind holes to form a positioning structure.
9. The paster device for electronic product production according to claim 1, wherein the sets of first placing grooves (20) and the sets of mounting grooves (61) are arranged in an array.
10. A patch device for the production of electronic products, according to claim 1, characterized by comprising a battery (24), a lighting lamp (22) and a switch (23); wherein, the end surface of the placing plate (4) is provided with a plurality of groups of switch grooves for installing a plurality of groups of switches (23); a power supply groove for installing a battery (24) is arranged on the placing plate (4);
a horizontal transparent plate (21) is arranged in each group of the first placing grooves (20); an installation bin for installing an illuminating lamp (22) is enclosed between the transparent plate (21) and the inner wall of the first placing groove (20); the first placing grooves (20), the illuminating lamps (22) and the switches (23) are in one-to-one correspondence; each group of illuminating lamps (22), each group of switches (23) and the battery (24) are electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010446486.7A CN111642126B (en) | 2020-05-25 | 2020-05-25 | A paster equipment for production of electron class product |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010446486.7A CN111642126B (en) | 2020-05-25 | 2020-05-25 | A paster equipment for production of electron class product |
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| Publication Number | Publication Date |
|---|---|
| CN111642126A CN111642126A (en) | 2020-09-08 |
| CN111642126B true CN111642126B (en) | 2021-04-09 |
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| CN202010446486.7A Active CN111642126B (en) | 2020-05-25 | 2020-05-25 | A paster equipment for production of electron class product |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112525063B (en) * | 2020-11-13 | 2023-02-28 | 中航电测仪器股份有限公司 | Paster pressurizing device and method for sensor |
| CN112885762B (en) * | 2021-02-01 | 2022-08-02 | 南京邮电大学 | Brain-like computing chip jointing device with chip turning function |
| CN114938622B (en) * | 2022-06-08 | 2023-06-20 | 深圳市菲昂机电有限公司 | Automatic surface mounting equipment for electronic products |
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