KR20130029882A - Particle measurement apparatus for semiconductor equipment - Google Patents
Particle measurement apparatus for semiconductor equipment Download PDFInfo
- Publication number
- KR20130029882A KR20130029882A KR1020110093256A KR20110093256A KR20130029882A KR 20130029882 A KR20130029882 A KR 20130029882A KR 1020110093256 A KR1020110093256 A KR 1020110093256A KR 20110093256 A KR20110093256 A KR 20110093256A KR 20130029882 A KR20130029882 A KR 20130029882A
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- particles
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- main body
- tube
- semiconductor equipment
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/02—Devices for withdrawing samples
- G01N1/22—Devices for withdrawing samples in the gaseous state
- G01N1/24—Suction devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/94—Investigating contamination, e.g. dust
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/02—Devices for withdrawing samples
- G01N1/22—Devices for withdrawing samples in the gaseous state
- G01N1/24—Suction devices
- G01N2001/245—Fans
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- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Biomedical Technology (AREA)
- Molecular Biology (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
The present invention relates to a particle measuring device for semiconductor equipment.
In detail, the present invention, by measuring the size and number of particles introduced into the closed working space inside the semiconductor equipment processing the wafer and floating in the working space, and filtering the measured particles with a filter, the semiconductor equipment In the process of driving the real-time measurement of the particles, and accordingly relates to a particle measuring device for semiconductor equipment to obtain more accurate measurement data.
In addition, the present invention relates to a particle measuring device for semiconductor equipment that employs a sensor applied to the optical technology for the measurement of finer particles, so that the measurement information of the particles can be confirmed to the administrator through wireless communication.
A wafer is a material for fabricating a semiconductor chip, and is manufactured in the form of a disk in which a thin ingot formed by circumferentially growing a material type crystal of a silicon semiconductor. Such wafers are subjected to a surface treatment or a chip cutting process in a post-production process, which is performed by a dedicated semiconductor device.
At this time, the semiconductor equipment for processing the wafer forms a working space inside the closed space, and maintains the working space as a clean space in order to perform a very precise work. For reference, the biggest product defects during the semiconductor manufacturing process can be attributed to the fine particles and particles. Particularly, as the production of circuits with a pattern of less than 50 nm increases, Microparticles present inside semiconductor equipment cause fatal defects in products. Therefore, the semiconductor device as described above essentially measures the size and quantity of the fine particles or fine dust contained in the air or gas in the closed workspace.
As a device for measuring particles existing inside the semiconductor device as described above, a measurement device called a "particle counter" has been released and used. Such a particle counter has an air inlet formed at an upper portion thereof, and a tube is coupled to the air inlet so as to communicate with a chamber inside the semiconductor equipment, and configured to measure particles.
In order to measure a particle, such a conventional particle counter needs to perform work after stopping operation of semiconductor equipment, and inconvenient work and measurement results because the measurement is performed after suctioning particles from the semiconductor equipment. Is exposed.
According to Korean Patent Laid-Open Publication No. 10-2006-2177 (Name: Particle measuring equipment of a semiconductor manufacturing facility and a method of measuring the same, hereinafter referred to as the invention), the invention of the invention is a chamber inside a semiconductor device for processing a wafer The present invention provides an apparatus and method for measuring particles in a chamber.
Such an invention of the present invention is to measure the particles in the chamber and the degree of particle floating in the chamber more accurately to measure the particles in real time by measuring the particles inside the chamber in the state in which the semiconductor equipment is driven in real time.
As described above, the present invention is installed in a chamber of a relatively small (narrow, high and low height) point where a wafer is transferred in an automated wafer processing process because a measurement sensor for measuring particles is mainly installed at one side of the chamber. Difficult disadvantages are exposed.
In particular, the above-described invention has a problem that it is impossible to precisely measure the particles floating on the entire path to convey the wafer when the particles are floated due to the measurement sensor is installed on one side of the chamber is biased on any one inside the chamber Is exposed.
The present invention has been invented to solve the above problems.
Accordingly, the present invention, by moving the transfer path of the wafer for processing inside the semiconductor equipment, it is possible to measure the size and number of particles floating in the work space as a whole in real time without stopping the operation of the semiconductor equipment more accurate Its purpose is to provide a particle measuring instrument for obtaining measurement data.
Another object of the present invention is to implement a sensor using optical components such as laser diodes and photodiodes to measure finer particles in a workspace of semiconductor equipment, and to obtain measurement information of particles by wireless communication. To provide particle measuring equipment.
In order to achieve the above object, the present invention has the following configuration.
The present invention includes a main body formed in a shape and size corresponding to a wafer moved inside a semiconductor device and introduced into the semiconductor device for measuring particles; A sensor module installed on the main body and inserted into the semiconductor equipment together with the main body to detect and measure particles floating in the work space; And a control unit installed on the main body to receive data of particles detected by the sensor module, and convert the received data into particle size and number information.
The sensor module may include: a module housing coupled to a main body and having an inner space for allowing particles suspended in a work space to pass through one side to another side; A suction fan installed at one side of the module housing to suck particles into the inner space; A sensing unit installed in a passage through which particles of the module housing pass and passing the particles inside and sensing the size and quantity of the particles; And a filter for collecting particles discharged to the work space by being installed in the inner space of the module housing for discharging particles passing through the sensing unit to the outside.
In order to achieve the above other objects, the present invention has the following configuration.
The present invention is the sensor unit, the sensor housing is installed inside the tube through which the particles pass; A laser diode mounted at a point where the tube of the sensor housing is installed and irradiating a laser to penetrate a tube through which particles pass; And a photodiode mounted so as to face the laser diode in the sensor housing and detecting a laser beam radiated from the laser diode and passing through the tube to measure the size and quantity of particles traveling through the tube.
In addition, the control unit, the current sensing unit for the information of the size and quantity of particles detected by the sensor module to be sensed as the current value; And a control processor converting information on the size and quantity of particles detected by the current sensing unit into data and outputting the data.
In particular, the control unit, a wireless communication unit for wireless transmission and reception of data of the size and quantity of particles output from the control processor; And a user display unit for visually confirming data of the size and quantity of particles transmitted by the wireless communication unit.
As described above, the present invention has the effect of obtaining accurate particle data in real time without stopping the operation of semiconductor equipment by measuring the size and number of particles floating along the transfer path of the wafer to be processed and floating in the work space. have.
In addition, the present invention is that the sensor is manufactured by the optical component to be able to measure the finer particles, and the measurement information of the particles can be obtained by wireless communication to manage the particle measurement more efficiently and perform work It has an effect.
1 is a perspective view of a particle measuring device according to the present invention.
Figure 2 is a perspective view of the sensor module of the particle measuring apparatus according to the present invention.
Figure 3 is a perspective view of the sensing unit of the particle measuring device according to the present invention.
Figure 4 is an illustration of the sensing unit particle measurement of the particle measuring apparatus according to the present invention.
Figure 5 is an enlarged view of the main part of the sensing unit of the particle measuring apparatus according to the present invention.
6 is a block diagram of the control unit of the particle measuring apparatus according to the present invention.
7 is an exemplary state of use of the particle measuring apparatus according to the present invention.
1 is a perspective view of a particle measuring device according to the present invention, Figure 2 is a perspective view of an extract of the sensor module of the particle measuring device according to the present invention.
Referring to the drawings, the particle measuring apparatus according to the present invention has a basic configuration consisting of the
The
In addition, the upper surface of the
For reference, the size of the flat plate is about 300mm, 200mm, 150mm, 450mm in diameter and the same as the semiconductor wafer, the thickness is about 8mm ~ 15mm to pass through each space inside the semiconductor equipment Is produced. In addition, the plate has a notch or flatzone based on the 'SEMI-STD Wafer standard technology' in order to be detected as a wafer inside the semiconductor equipment.
The
The
The
The
The
Figure 3 is a perspective view of the sensing unit of the particle measuring apparatus according to the present invention, Figure 4 is an illustration of the sensing unit particle measurement of the particle measuring apparatus according to the present invention, Figure 5 is an enlarged view of the main part of the sensing unit of the particle measuring apparatus according to the present invention. to be.
Referring to the figure, the
The
The
The
In the configuration of the
6 is a block diagram of a control unit of the particle measuring apparatus according to the present invention.
Referring to the drawings, the
To this end, the
The
The
The
The
7 is an exemplary view illustrating a state of use of the particle measuring device according to the present invention.
Referring to the drawings, the particle measuring apparatus is manufactured in a shape and a standard corresponding to the specifications of the wafer is introduced into the space of the semiconductor equipment to be able to measure the particles inside the workspace in real time. In the drawing, a scene passing through a slit valve, which is the narrowest space inside a semiconductor device, is illustrated.
10: body 11: PCB
20: sensor module 21: module housing
22: suction fan 23: sensing unit
24: filter 25: sensor housing
26: laser diode 27: photodiode
28: tube 30: control unit
31: current sensing unit 32: control processor
33: wireless communication unit 34: user display unit
Claims (5)
A sensor module 20 installed on the main body 10 for sensing and measuring particles floating in the work space after being introduced into the semiconductor equipment together with the main body 10;
And a control unit 30 installed on the main body 10 to receive data of particles detected by the sensor module 20, convert the received data into size and number information of the particles, and output the converted information. Particle measuring device for semiconductor equipment.
A module housing 21 coupled to the main body 10 and having an inner space for allowing particles suspended in the work space to pass through one side to the other side;
A suction fan 22 installed at one side of the module housing 21 to suck particles into the inner space;
A sensing unit 23 installed in a passage through which particles of the module housing 21 pass and passing the particles inside and sensing the size and quantity of the particles;
And a filter (24) installed in the interior space of the module housing (21) for discharging particles passing through the sensing unit (23) to the outside to collect the particles discharged to the work space. Particle measuring equipment for equipment.
A sensor housing 25 provided with a tube 28 through which particles are passed;
A laser diode (26) mounted at a point where the tube (28) of the sensor housing (25) is installed and irradiating a laser to penetrate the tube (28) through which particles pass;
The sensor housing 25 is mounted to face the laser diode 26 to detect the laser beam irradiated from the laser diode 26 and passed through the tube 28 to determine the size and quantity of particles proceeding through the tube 28. Particle measuring apparatus for semiconductor equipment comprising a; photodiode for measuring (27).
A current sensing unit 31 for sensing information of the size and quantity of particles detected by the sensor module 20 as a current value;
And a control processor (32) for converting information on the size and quantity of particles detected by the current sensing unit (31) into data and outputting the data.
A wireless communication unit 33 for wirelessly transmitting and receiving data of the size and quantity of particles output from the control processor 32;
And a user display unit (34) for visually confirming data of the size and quantity of particles transmitted by the wireless communication unit (33).
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020110093256A KR20130029882A (en) | 2011-09-16 | 2011-09-16 | Particle measurement apparatus for semiconductor equipment |
PCT/KR2011/008652 WO2013039280A1 (en) | 2011-09-16 | 2011-11-14 | Measurement device for diagnosing semiconductor equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020110093256A KR20130029882A (en) | 2011-09-16 | 2011-09-16 | Particle measurement apparatus for semiconductor equipment |
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KR20130029882A true KR20130029882A (en) | 2013-03-26 |
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KR1020110093256A KR20130029882A (en) | 2011-09-16 | 2011-09-16 | Particle measurement apparatus for semiconductor equipment |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101958192B1 (en) * | 2017-12-19 | 2019-03-18 | (주)에스티글로벌 | Wafer Processing Apparatus Having Particle Sensor |
KR20190032743A (en) * | 2017-09-20 | 2019-03-28 | (주)에스엔텍 | Sensor and Apparatus for Measuring Gas Flow |
CN110034037A (en) * | 2018-01-12 | 2019-07-19 | 机体爱思艾姆有限公司 | The wafer type gap detection sensor that the gap of wafer chamber is detected |
WO2021020602A1 (en) * | 2019-07-29 | 2021-02-04 | (주)에스티글로벌 | Wafer processing apparatus including particle sensor |
KR102477434B1 (en) * | 2022-07-08 | 2022-12-15 | (주)에스티글로벌 | Particle Detection System of Wafer Processing Apparatus Including a Fixed Particle Detection Unit |
-
2011
- 2011-09-16 KR KR1020110093256A patent/KR20130029882A/en active IP Right Grant
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190032743A (en) * | 2017-09-20 | 2019-03-28 | (주)에스엔텍 | Sensor and Apparatus for Measuring Gas Flow |
KR101958192B1 (en) * | 2017-12-19 | 2019-03-18 | (주)에스티글로벌 | Wafer Processing Apparatus Having Particle Sensor |
CN110034037A (en) * | 2018-01-12 | 2019-07-19 | 机体爱思艾姆有限公司 | The wafer type gap detection sensor that the gap of wafer chamber is detected |
KR20190086261A (en) * | 2018-01-12 | 2019-07-22 | 주식회사 지티에스엠 | Wafer-type gapping detection sensor for sensing gapping of the wafer in chamber |
WO2021020602A1 (en) * | 2019-07-29 | 2021-02-04 | (주)에스티글로벌 | Wafer processing apparatus including particle sensor |
KR102477434B1 (en) * | 2022-07-08 | 2022-12-15 | (주)에스티글로벌 | Particle Detection System of Wafer Processing Apparatus Including a Fixed Particle Detection Unit |
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