KR20130019937A - Film type optical component package and manufacturing method thereof - Google Patents

Abstract

PURPOSE: A film type optical device package and a manufacturing method thereof are provided to prevent the bottleneck phenomenon of heat flow by boning a metal plate or a heat sink to an optical device package. CONSTITUTION: An insulating film(110) is formed across a via hole. A metal layer has a recessed part(125). The recessed part is formed on the insulating film. An optical device(130) is electrically connected to the metal layer. A heat sink is bonded to the recessed part of the metal layer.

Description

Film type optical device package and manufacturing method therefor {FILM TYPE OPTICAL COMPONENT PACKAGE AND MANUFACTURING METHOD THEREOF}

The present invention relates to an optical device package and a method of manufacturing the same.

In general, a light emitting diode (hereinafter, referred to as an LED) generates a small number of carriers (electrons or holes) injected using a pn junction structure of a semiconductor, and converts electrical energy into light energy by recombination. An intermetallic compound junction diode which emits light. LEDs emit visible light as light energy generated when electrons and holes combine when power is applied to the cathode and anode terminals.

The white LED emitting white light may be implemented as a combination of a red LED, a green LED, and a blue LED, or a combination of yellow phosphors with a blue LED. With the emergence of white LEDs, the application fields of LEDs have been expanded from indicators of electronic products to consumer goods, advertising panels, etc. It has reached a stage where it can replace a general lighting source for replacing a head lamp and a fluorescent lamp.

High power and high brightness LEDs are being applied to various lighting applications. The efficiency and lifespan of an LED gets worse as the heat generated from the LED's junction gets higher. High power and high brightness LED packages are essential for the design to dissipate heat generated from the LED chip.

About 15% of the energy applied to the LED package is converted to light and about 85% is consumed as heat. The higher the temperature of the LED chip, the higher the failure rate of the LED package.

Resin molding type LED packages do not provide an efficient heat dissipation structure in LED chips of 0.2W / mK or more due to the low thermal conductivity of plastic resins. For this reason, the resin molding type LED package is used for the indicator which uses an LED chip of 0.1 W or less, and low brightness. In order to improve the heat dissipation structure of the resin molding type LED package, a heat sink made of copper (heat conductivity 300-400 W / mK) or aluminum (heat conductivity 150-180 W / mK) is placed on the bottom of the LED chip. A package structure was built that embeds the.

Heat-sink built-in resin molding type LED package can be applied to LED package of more than 0.1W by using direct heat dissipation through heat sink metal, so it can be applied to LED package of 0.1W or more, but heat between resin material and metal core for heat sink There is a problem in reliability due to cracking between them due to the expansion coefficient difference.

Heat generated from the LED package is dissipated through the metal PCB. Metal PCB is a resin layer on an aluminum metal substrate. It has a structure in which a copper foil layer and a solder resist layer are laminated. The resin layer serves to electrically insulate the copper foil layer through which the current flows and the metal substrate layer thereunder, and form a heat transfer path between the copper foil layer and the metal substrate layer below. Heat generated from the LED package is primarily conducted through the copper foil layer of the metal PCB, and the heat thus conducted is transferred to the lower metal substrate through the resin layer.

When LED packages are mounted on a metal PCB in an array form, since the heat dissipation effect is low only with the metal PCB, a separate heat sink may be mounted on the bottom of the metal PCB to dissipate heat.

1 is a cross-sectional view showing the configuration of a LED package bonded to a conventional heat sink.

Referring to FIG. 1, the LED 10 is soldered to a metal circuit, such as a copper circuit 40, by the solder 20. Then, a solder resist 30 is applied to a selected portion on the copper circuit, and the copper circuit 40 is mounted on the printed circuit board 50. The printed circuit board 50 is bonded to the thermal sheet 70 through the adhesive 60. The heat transfer sheet 70 is made of a material (Thermal Sheet) to diffuse the heat of the high-temperature electronic components, the heat transfer degree is lowered 100W / mK or more, the thickness is 1mm or less, it is preferable to have a ductility of less than 10cm of curvature radius. Do. The heat transfer sheet 70 diffuses or heats heat generated from small electronic products due to the thin and short reduction of electronic components.

The heat transfer sheet 70 is bonded to the heat sink 90 through the adhesive 80. Heat sink 90 dissipates heat generated from LED 10 and associated copper circuit 40. The heat sink 90 forms a path for dissipating heat generated in the LED to the outside through the bottom surface of the package body.

Conventionally, when the heat dissipation LED package is mounted on a substrate, the heat sink is attached to the substrate 50 by the conductive adhesive materials 60 and 80. The stronger the heat sink is attached to the substrate by the adhesive material, the better the heat dissipation performance of the LED package is. However, due to the sliding force of the heat dissipation LED package on the substrate, the adhesive strength to the substrate is often lowered, which causes the heat dissipation performance of the LED package by the heat sink 90 to be degraded.

That is, the bonding of the basic structure and the lower printed circuit board (PCB) to the LED package uses various adhesives to attach between the layers as described above, and the basic interlayer material, the thermal sheet and Attachment to the heat sink is complicated.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide an optical device package and a method of manufacturing the same, which simplifies the heat dissipation structure of the optical device package.

The film type optical device package according to an embodiment of the present invention for solving the above problems is an insulating film formed through the via hole; A metal layer disposed on one surface of the insulating film and having a depression formed in a portion of the metal layer corresponding to the via hole from one surface of the insulating film toward the other surface; An optical device mounted on the recess and electrically connected to the metal layer; And a heat sink bonded to the recessed portion of the metal layer.

The metal layer may be plated with a metal.

The heat sink may be flux treated at a surface bonded to the metal layer.

Heat sink The metal layer may be bonded to the heat sink by a solder layer, and the solder layer may be formed by any one of solder, silver paste, and copper paste.

The depression may have a depression depth smaller than the thickness of the insulation film.

In addition, the film type optical device package manufacturing method according to another embodiment of the present invention to form a via hole in the insulating film; Forming a metal layer on one surface of the insulating film; A depression is formed in the portion of the metal layer corresponding to the via hole by pressing from one surface of the insulating film toward the other surface; Mounting an optical device on the depression to be electrically connected to the metal layer; Bonding a heat sink to the recessed portion of the metal layer.

The film type optical device package manufacturing method may further include plating the metal layer with a metal.

The film type optical device package manufacturing method may further include flux treating a surface bonded to the metal layer of a pre-heatsink.

The present invention, by bonding the optical device package to a metal plate (or heat sink) without an adhesive layer, to prevent the bottleneck of the heat flow due to the existing bonding layer to maximize the heat dissipation efficiency, simplify the existing complex heat dissipation structure, economical Can be improved.

1 is a cross-sectional view illustrating a junction of a conventional LED package and a heat sink.
2 is a cross-sectional view of a film type optical device package according to an embodiment of the present invention.
3 is a cross-sectional view of a film type optical device package manufacturing process according to an embodiment of the present invention.
4 is a diagram illustrating a process of directly bonding the array of the optical device package of FIG. 3 to a heat sink in accordance with the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail a film type optical device package and a method of manufacturing the same according to a preferred embodiment. In the following description, well-known functions or constructions are not described in detail to avoid unnecessarily obscuring the subject matter of the present invention.

In addition, the size of each component in the drawings may be exaggerated for the sake of explanation and does not mean a size actually applied.

Conventionally, the bonding of the basic structure and the lower printed circuit board (PCB) to the LED package uses a variety of adhesives (Adhesive) to adhere to each layer as described above, and the basic interlayer material and the heat transfer sheet on the printed circuit board (PCB). It is complicated to attach to (Thermal Sheet) and Heat sink.

In order to solve the above problems, the present invention bonds an optical device package to a metal plate (or heat sink) having no adhesive layer. Specifically, the optical device package according to the present invention is directly attached to the lower heatsink using soldering or silver paste, copper paste, or the like. Before attaching, the surface of the heatsink is well soldered by flux treatment.

The configuration of the LED package according to the preferred embodiment of the present invention described above will be described with reference to FIG.

2 is a cross-sectional view showing an LED package according to a preferred embodiment of the present invention.

2 is a cross-sectional view of a film type optical device package according to an embodiment of the present invention. Referring to FIG. 2, an optical device package of a film type according to an embodiment of the present invention may be disposed on an insulating film 110 formed through a via hole, on one surface of the insulating film 110, and an optical device 130. The metal layer 120 having the depression 125 formed in the portion corresponding to the via hole for accommodating from one surface of the insulating film 110 toward the other surface and the depression 125 is mounted on the metal layer ( The optical device 130 is electrically connected to the 120.

The insulating film 110 is preferably a polyimide film, but the present invention is not limited thereto and may be made of a ceramic material resistant to thermal shock. In addition, the metal layer 120 is preferably made of copper (Cu). In addition, since the insulating film 110 is in the form of a film, mass production is possible through a roll-to-roll process.

The via holes formed through the insulating film 110 may include via holes in which the optical device 130 is mounted, via holes for electrical connection between layers, thermal via holes for easy heat diffusion, and alignment of the layers. It may include a via hole to be a reference.

Meanwhile, the optical device package may include an adhesive layer (not shown) formed by applying an adhesive material on one surface of the insulating film 110 on which the metal layer 120 is formed. In this case, the right metal layer 120 may be formed by the adhesive layer. It is attached to the insulating film (110). However, the present invention is not limited thereto, and the metal layer 120 without the adhesive layer may be fixed to one surface of the insulating film 110 according to a technique known in the art.

In addition, the metal layer 120 is preferably made of copper (Cu). The metal layer 120 activates a surface through various chemical treatments, and then applies a photoresist and performs an exposure and development process. After the development process is completed, a circuit pattern is formed by forming a necessary circuit through the etching process and peeling off the photoresist. In addition, the metal layer 120 may be plated with a metal, for example, silver (Ag), in which case the light from the optical device 130 may be better reflected from the metal layer 120.

As shown in FIG. 2, the metal layer 120 is positioned on one surface of the insulating film 110 and is different from one surface of the insulating film 110 to a portion corresponding to a via hole for accommodating the optical device 130. And a depression 125 formed to be recessed toward the surface. The depression 125 may be formed by a tool for punching the insulating film 110. Accordingly, the lower portion of the metal layer 120 on which the optical device 130 to be mounted is mounted protrudes through the via hole, thereby exposing copper slugs to the lower portion of the optical device 130 to be mounted. The element 130 is seated on the depression 125. Accordingly, the light emitted from the optical device 125 is directed toward the surface of the depression 125 to be reflected from the depression 125, so that the depression 125 serves as a reflector. In this way, the luminance of the optical device package 100 may be improved. The optical device 130 is electrically connected to the metal layer 120 through the wire 140.

In addition, the optical device package 100 includes the optical device 130 and the wire 140 includes a molding unit 150 for molding an epoxy or glass. The molding part 150 may include a phosphor to increase the efficiency of the optical device 60.

 The recess 125 of the optical device package 100 may be bonded to one surface of the heat sink 230 through the solder layer 210. Since the solder layer 210 has an adhesive force, the optical device package 100 is adhered to one surface of the heat sink 230. The solder layer 210 may be formed of a solder according to one embodiment, or may be formed of a metal paste such as silver paste or copper paste according to another embodiment.

In addition, the surface on which the recess 125 of the optical device package 100 of the heat sink 230 is bonded may be fluxed to form a flux layer 220 on the heat sink 230. The flux process herein refers to a process of applying flux on the optical device package bonding surface of the heat sink 230. A general flux coating apparatus includes a flux storage container for storing flux in a liquid state and a flux coating unit having a plurality of needles. When the flux application process is started, a certain amount of flux is applied to the needles by contacting end portions of the needles of the flux application unit with the flux stored in the flux storage container.

The flux layer 220 may be removed when the solder layer 210 is provided for bonding the optical device package 100 and the heat sink 230. In other words, only one of the solder layer 210 and the flux layer 220 is required for bonding the optical device package 100 and the heat sink 230.

In the optical device package having the above structure, since the integrated heat sink is bonded to the metal layer and the via hole in which the optical device is mounted, a heat pass line for thermal stress and heat dissipation may be generated to maximize heat dissipation efficiency.

A manufacturing process of the optical device package as described above will be described with reference to FIGS. 3 and 4.

3 is a cross-sectional view of a film type optical device package manufacturing process according to an embodiment of the present invention.

Referring to FIG. 3, the adhesive layer 112 is coated on one surface of the insulating film 110 (S1). Herein, the material of the insulating film 110 may be polyimide or ceramics resistant to thermal shock. Thereafter, via holes 114 are formed in the insulating film 110 (S2). As described above, in addition to the via holes for accommodating the optical device 130, the via holes may include a via hole for electrical connection between layers, a thermal via hole for facilitating heat diffusion, and a reference for aligning the layers. The via hole may be included.

The metal layer 120 is laminated on the adhesive layer 112. Then, after the expression is activated through various chemical treatments, a photoresist is applied and an exposure and development process is performed. After the development process is completed, the necessary circuit is formed through the etching process and the photoresist is peeled off to form the metal layer 120 having the circuit pattern formed thereon (S4). In FIG. 3, the metal layer 120 has a pattern, indicating that the metal layer on which the circuit pattern is formed is formed (S4). Next, a portion of the metal layer 120 corresponding to the via hole for accommodating the optical device 130 is pressed down to form a recess 125 in which the optical device 130 may be seated (S4).

The depression 125 may be formed by a tool for punching the insulating film 110. That is, the depression 125 may be formed by pressing the portion of the metal layer 120 corresponding to the via hole for accommodating the optical device 130. Specifically, when the punch tool presses a portion of the metal layer 120 corresponding to the via hole for accommodating the optical device 130 from one surface of the insulating film 110 to the other surface, the depression 125 is formed. On the other hand, the tool for forming the depression 125 may be any tool apparent to those skilled in the art.

It will be apparent to those skilled in the art that the step of forming the circuit pattern on the metal layer (S5) and the step of forming the depression 125 may be performed at the same time, the order may be changed.

Subsequently, the metal layer 120 is plated with a metal, for example, silver (Ag), and the optical device 130 or the optical device chip 130 is mounted on the recess 125 (S5). By metal plating, light from the optical device 130 may be better reflected from the metal layer 50. Accordingly, the light emitted from the optical device 130 is directed toward the surface of the depression 125 to be reflected from the depression 125, thereby improving the brightness of the optical device package.

Subsequently, the optical device 130 is electrically connected to the metal layer 120 through the wire 140 (S7). Optionally, the phosphor layer (not shown) may be further formed by filling the depression 125 with a fluorescent material. Finally, the optical device 130 and the wire 140 are molded with epoxy or glass to form the molding part 150. Each optical device package 100 is manufactured in the above manner.

Such an optical device package 100 array is illustrated in FIG. 4.

4 is a diagram illustrating a process of directly bonding the array of the optical device package of FIG. 3 to a heat sink in accordance with the present invention.

Referring to FIG. 4, the array of optical device packages 100 is bonded to the heat sink 230 through the solder layer 210. As described above, since the solder layer 210 is adhesive, the optical device package 100 is attached to the heat sink 230.

Optionally, the side to which the photonic device package array of the heat sink 230 is bonded may be fluxed for bonding with the photonic device package array. If the solder layer 210 is interposed between the optical device package 100 and the heat sink 230, the flux layer may not be formed on the surface to which the optical device package 100 of the heat sink 230 is bonded. have.

As described above, in the case of an array of optical device packages (Arrayed ALP (Advanced LED PKG)) according to the present invention, copper slugs are exposed at the bottom of the optical device chip to directly radiate heat to the heat sink. To facilitate.

In other words, the present invention bonds the optical device package to a metal plate (or heat sink) having no adhesive layer. As a result, the present invention can maximize the heat dissipation efficiency by preventing the bottleneck of the heat flow due to the existing bonding layer, and can simplify the existing complex heat dissipation structure, thereby improving economics.

In the foregoing detailed description of the present invention, specific examples have been described. However, various modifications are possible within the scope of the present invention. The technical spirit of the present invention should not be limited to the above-described embodiments of the present invention, but should be determined by the claims and equivalents thereof.

110: insulating film 120: metal layer
130: optical element 140: wire
150: molding portion 210: solder layer
220: flux layer 230: heat sink

Claims (9)

An insulation film formed through the via holes;
A metal layer disposed on one surface of the insulating film and having a depression formed in a portion of the metal layer corresponding to the via hole from one surface of the insulating film toward the other surface;
An optical device mounted on the recess and electrically connected to the metal layer; And
Film type optical device package including a heat sink bonded to the recessed portion of the metal layer. The method of claim 1,
The metal layer is a film type optical device package is plated with a metal. The method of claim 1,
The heat sink is a film type optical device package is a surface bonded to the metal layer is flux-treated. The method of claim 3,
Heat sink The metal layer is a film type optical device package bonded to the heat sink by a solder layer. 5. The method of claim 4,
The solder layer is a film type optical device package formed by any one of solder, silver paste and copper paste. The method of claim 1,
The recess is a film type optical device package having a depression depth smaller than the thickness of the insulating film. Forming via holes in the insulating film;
Forming a metal layer on one surface of the insulating film;
A depression is formed in the portion of the metal layer corresponding to the via hole by pressing from one surface of the insulating film toward the other surface;
Mounting an optical device on the depression to be electrically connected to the metal layer;
A method of manufacturing a film type optical device package comprising bonding a heat sink to a recessed portion of the metal layer. The method of claim 7, wherein
The metal layer is a film type optical device package manufacturing method further comprising plating with a metal. The method of claim 7, wherein
And flux treating a surface bonded to the metal layer of the heat sink.

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