KR20130007392A - Apparatus and method for edge processing of wafe - Google Patents

Apparatus and method for edge processing of wafe Download PDF

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Publication number
KR20130007392A
KR20130007392A KR1020110101702A KR20110101702A KR20130007392A KR 20130007392 A KR20130007392 A KR 20130007392A KR 1020110101702 A KR1020110101702 A KR 1020110101702A KR 20110101702 A KR20110101702 A KR 20110101702A KR 20130007392 A KR20130007392 A KR 20130007392A
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KR
South Korea
Prior art keywords
substrate
edge
image
support plate
inspecting
Prior art date
Application number
KR1020110101702A
Other languages
Korean (ko)
Inventor
김덕식
신원권
Original Assignee
세메스 주식회사
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Filing date
Publication date
Application filed by 세메스 주식회사 filed Critical 세메스 주식회사
Priority to CN201210227232.1A priority Critical patent/CN102856224B/en
Priority to US13/537,861 priority patent/US20130005056A1/en
Publication of KR20130007392A publication Critical patent/KR20130007392A/en

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Abstract

The present invention relates to an edge exposure method of a substrate in a photolithography facility. The present invention comprises the steps of mounting the substrate on the support plate; Inspecting a bead removal state at an edge of the substrate seated on the support plate; And exposing an edge of the substrate seated on the support plate, wherein inspecting the bead removal state comprises imaging the substrate seated on the support plate to obtain a first image of the substrate, and obtaining the first image. 1 is done by examining the image.

Description

Apparatus and Method for edge processing of wafe}

The present invention relates to a photolithography facility, and more particularly, to a method and apparatus for processing r-edges of a substrate.

Generally, a semiconductor device uses a deposition process for forming a film on a substrate, a chemical mechanical polishing process for planarizing the film, a photolithography process for forming a photoresist pattern on the film, and the photoresist pattern. An etching process for forming the film into a pattern having electrical characteristics, an ion implantation process for implanting specific ions into a predetermined region of the substrate, a cleaning process for removing impurities on the substrate, and a substrate on which the film or pattern is formed And inspection steps for inspecting the surface and the components and concentration of the film.

A photolithography process is performed to form a photoresist pattern on a semiconductor substrate made of silicon. The photolithography process includes a coating and soft baking process for forming a photoresist film on a substrate, an exposure and development process for forming a photoresist pattern from the photoresist film, and an edge for removing edge portions of the photoresist film or pattern. Edge bead removal (hereinafter referred to as 'EBR') process, edge exposure of wafer (hereinafter referred to as 'EEW') process, hard baking process for stabilizing and densifying the photoresist pattern, and the like. .

The EBR process and the EEW process decontaminate the edge of the photoresist film or pattern during the subsequent process using the photoresist film or pattern, i. This may be done so it is done to eliminate it.

However, existing photolithography equipment has no way of evaluating the progress of EBR or EEW processes.

The present invention provides a substrate edge processing method and apparatus capable of confirming the results of the edge bead removal (EBR) process and the edge exposure of wafer (EEW) process. It is to provide.

The objects of the present invention are not limited thereto, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, the substrate edge processing method according to an embodiment of the present invention comprises the steps of mounting the substrate on the support plate; Inspecting a bead removal state at an edge of the substrate seated on the support plate; And exposing an edge of the substrate seated on the support plate, wherein the checking of the bead removal state comprises photographing the substrate seated on the support plate to obtain a first image of the substrate, and obtaining the first image. This can be done by examining the image.

According to an embodiment of the present disclosure, after the exposing of the edge of the substrate, the method may further include inspecting an edge exposure state of the substrate seated on the support plate, and the inspecting the edge exposure state may include: Imaging the substrate seated at and obtaining a second image of the substrate and inspecting the obtained second image.

According to an exemplary embodiment of the present disclosure, the first image of the substrate may be continuously obtained by an imaging camera in which the substrate loaded on the support plate is fixed at a predetermined position during one rotation.

According to an embodiment of the present disclosure, the first image of the substrate may be obtained discontinuously by an imaging camera in which the substrate loaded on the support plate is fixed at a predetermined position when one rotation is performed.

According to an embodiment of the present invention, the imaging camera is an area camera that captures an image by an area scan method.

According to an embodiment of the present disclosure, the checking of the bead removal state may measure a width at which the beads are removed from the first image of the substrate and detect particles.

Substrate edge processing method of the present invention for achieving the above object comprises the steps of removing the beads at the edge of the substrate; Inspecting bead removal at the edge of the substrate; Exposing an edge of the substrate; Inspecting an edge exposure state of the substrate; The inspecting step of the bead removing state, the edge exposing step, and the inspecting edge exposing state are performed in the same apparatus.

According to an embodiment of the present disclosure, the bead removal state inspection step may be performed by acquiring a first image from the substrate and inspecting the acquired first image, wherein the edge exposure state inspection step may be performed by obtaining a second image from the substrate. By acquiring and examining the acquired second image.

Substrate edge processing method for achieving the above object is the step of mounting the substrate on the support plate; Examining a bead removal condition at an edge of the substrate seated on the support plate; The checking of the bead removal state may be performed by capturing an edge of the substrate seated on the support plate to obtain a first image of the substrate and inspecting the obtained first image.

According to an embodiment of the present disclosure, after the checking of the bead removal state, the method may further include exposing an edge of the substrate seated on the support plate.

According to an embodiment of the present disclosure, after the exposing of the edge of the substrate, the method may further include inspecting an edge exposure state of the substrate seated on the support plate.

According to an embodiment of the present disclosure, the inspecting of the edge exposure state may include capturing the substrate mounted on the support plate to obtain a second image of the substrate different from the first image, and obtaining the second image. By inspection.

Substrate edge exposure apparatus for achieving the above object is a support plate for supporting the substrate; An eccentric detector for measuring an eccentricity of the substrate placed on the support plate; An imaging member which acquires a first image from an edge of the substrate placed on the support plate; An ultraviolet irradiation member for irradiating ultraviolet rays to the edge of the substrate; And an image processor configured to receive the first image acquired from the imaging member and detect a width of the bead removal region.

According to an embodiment of the present disclosure, the imaging member may acquire the first image discontinuously from the edge of the substrate when the substrate is rotated.

According to an embodiment of the present invention, the eccentric detection unit may use a charge coupler device (CCD), and the image pickup member may use an area camera for imaging in an area scan method.

Substrate processing apparatus for achieving the above object is an index unit having a load port and the index robot is placed a container containing the substrate; A process processing unit connected to the indix unit and having a coating processing unit for applying a photoresist on a substrate, and a developing unit for developing the substrate after the exposure process; An interface unit for transferring the substrate between the exposure apparatus on which the exposure process on the substrate is performed and the process processor; And an edge exposure unit that inspects the edge exposure process of the substrate and the bead removal state of the substrate edge.

According to an embodiment of the present disclosure, the edge exposure unit may be installed in the interface unit or the processing unit.

According to an embodiment of the present invention, the edge exposure unit includes a support plate for supporting a substrate; An eccentric detector for measuring an eccentricity of the substrate placed on the support plate; An imaging member which acquires a first image from an edge of the substrate placed on the support plate; An ultraviolet irradiation member for irradiating ultraviolet rays to the edge of the substrate; And an image processor configured to receive the first image acquired from the imaging member and detect a width of the bead removal region.

According to the present invention, the results of performing the edge bead removal process and the edge exposure process can be confirmed.

The drawings described below are for illustrative purposes only and are not intended to limit the scope of the invention.
1 is a perspective view of a photolithography facility used in a substrate processing method according to an embodiment of the present invention.
2 is a view showing a coating treatment unit in the installation of FIG.
3 is a view illustrating a developing unit in the installation of FIG. 1.
4 is a side view for explaining the edge exposure unit.
5 is a plan view for explaining the edge exposure unit.
6 is a flowchart for explaining a substrate edge exposure method.

Hereinafter, a method of exposing a substrate edge in a photolithography apparatus according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used to designate the same or similar components throughout the drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

(Example)

1 is a perspective view of a photolithography facility used in a substrate processing method according to an embodiment of the present invention. FIG. 2 is a view showing a coating treatment unit in the facility of FIG. 1, and FIG. 3 is a view showing a developing treatment unit in the facility of FIG. 1.

1 to 3, the substrate processing apparatus 1 includes an index unit 100, a process processor 200, an interface unit 700, and an exposure apparatus 900. The index unit 100, the process processor 500, the interface unit 700, and the exposure apparatus 900 are sequentially arranged in one direction.

The substrate W is moved in the state accommodated in the container 20. At this time, the container 20 has a structure that can be sealed from the outside. For example, as the container 20, a front open unified pod (FOUP) having a door in front may be used.

(Index part)

The index unit 100 includes a plurality of load ports 110, an index robot 120, and a first buffer module 140.

The load port 110 has a mounting table 112 on which a container 20 in which the substrates W are accommodated is placed. The mounting table 112 is provided in plurality, and the mounting tables 112 are arranged in a line along the second direction 14. In FIG. 1 four mounting blocks 112 are provided.

The index robot 120 transfers the substrate W between the container 20 placed on the mounting table 112 of the load port 110 and the first buffer module 140. The index robot 120 drives four axes so that the hand 122 that directly handles the substrate W can be moved and rotated in the first direction 12, the second direction 14, and the third direction 16. This has a possible structure. The guide rail 130 is provided such that its longitudinal direction is disposed along the second direction 14. The index robot 120 is coupled to the guide rail 130 to be linearly moved along the guide rail 130. Although not shown,

The first buffer module 140 is provided in the shape of an empty rectangular parallelepiped capable of temporarily storing the plurality of substrates W, and is disposed between the index robot 120 and the process processor 200.

(Process Processing Unit)

In the processing unit 200, a coating processing unit 200a which performs a process of applying photoresist on the substrate W before the exposure process, and a developing unit 200b which performs a process of developing the substrate W after the exposure process. It includes.

The coating processing unit 200a and the developing processing unit 200b are disposed so as to be partitioned between each other in layers. According to an example, the coating processing unit 200a is positioned above the developing processing unit 200b.

The coating processing unit 200a includes a process of applying a photoresist such as a photoresist to the substrate W and a heat treatment process such as heating and cooling the substrate W before and after the resist coating process. The coating treatment unit has an application module 210, bake modules 220, cooling modules 250, and a transfer chamber 290.

The application module 210, the bake module 220, the cooling module 250, and the transfer chamber 290 may be sequentially disposed along the second direction 14. Therefore, the application module 210 is positioned to face the bake module 220 and the cooling module 250 with the transfer chamber 290 interposed therebetween. A plurality of application modules 210 may be provided, and a plurality of application modules 210 may be provided in the first direction 12 and the third direction 16, respectively. In the figure an example is provided in which three application chambers 210 are provided.

The transfer chamber 290 is positioned side by side in the first direction 12 with the first buffer module 140. An application part robot 292 and a guide rail 294 are positioned in the transfer chamber 290. The transfer chamber 290 has a generally rectangular shape. The applicator robot 292 transfers the substrate W between the bake module 220, the applicator module 210, and the cooling module 240 and the first buffer module 140. The guide rail 294 is disposed so that its longitudinal direction is parallel to the first direction 12. The guide rail 294 guides the applicator robot 292 to move linearly in the first direction 12.

The application modules 210 all have the same structure. However, the types of photoresists used in each coating module 410 may be different from each other. As an example, a chemical amplification resist may be used as the photoresist. The application module 410 applies a photo resist on the substrate W. The application module 210 performs an edge bead removal (EBR) process of removing edge beads by spraying thinner on the edge of the substrate in a rotating state.

The bake modules 220 heat-treat the substrate (W). For example, the bake modules 220 preheat the substrate W to a predetermined temperature before applying the photoresist to remove the organic matter or moisture on the surface of the substrate (W) or a photoresist substrate (W) A soft bake process or the like performed after coating on the substrate), and a cooling process for cooling the substrate W after each heating process is performed.

The developing unit 200b is a developing process of removing a part of the photoresist by supplying a developing solution to obtain a pattern on the substrate W, and a heat treatment process such as heating and cooling performed on the substrate W before and after the developing process. It includes.

The developing unit 200b includes the developing modules 310, the bake modules 320, the cooling modules 340, and the transfer chamber 390.

The developing modules 310, the bake modules 320, the cooling modules 340, and the transfer chamber 390 are sequentially disposed along the second direction 14. Therefore, the developing module 460 is positioned to face the bake module 470 and the cooling module with the transfer chamber 390 interposed therebetween. A plurality of developing modules 310 may be provided, and a plurality of developing modules 310 may be provided in the first direction 12 and the third direction 16, respectively. In the drawing, an example in which three developing modules 310 are provided is shown.

The transfer chamber 390 is positioned side by side in the first direction 12 with the first buffer module 140. The developing unit robot 392 and the guide rail 394 are positioned in the transfer chamber 390. The transfer chamber 390 has a generally rectangular shape. The developing unit robot 392 transfers the substrate W between the bake module 320, the developing module 310, and the cooling module 340 and the first buffer module 140. The guide rail 394 is disposed such that its longitudinal direction is parallel to the first direction 12. The guide rail 394 guides the developing unit robot 392 to move linearly in the first direction 12.

The developing modules 310 all have the same structure. However, the types of the developer used in each of the developing modules 310 may be different from each other. The developing module 310 removes the light irradiated region of the photoresist on the substrate W. FIG. At this time, the area of the protective film irradiated with the light is also removed. Depending on the type of selectively used photoresist, only the areas of the photoresist and protective film that are not irradiated with light can be removed.

The bake module 320 heat-treats the substrate (W). For example, the bake modules 320 may be a post bake process for heating the substrate W before the developing process and a hard bake process for heating the substrate W after the developing process is performed and heating after each bake process. And a cooling process for cooling the finished substrate.

(Interface part)

The interface unit 700 transfers the substrate W between the process processor 200 and the exposure apparatus 900. The interface unit 700 has a second buffer module 720 and an interface robot 740. The interface robot 740 carries the substrate W between the second buffer module 720 and the exposure apparatus 900. The interface unit 700 includes an edge exposure unit 780 on one side. The edge exposure unit 780 performs an edge exposure process that irradiates ultraviolet rays and an edge bead removal process and an inspection result of performing the edge exposure process to remove the edge portion of the photoresist film formed on the semiconductor substrate. Include.

4 and 5 are diagrams for explaining the edge exposure unit.

4 and 5, the edge exposure unit 800 includes a support plate 810, a rotating member 820, a moving member 830, an eccentric detector 840, an ultraviolet irradiation member 850, and a driving controller 860. ), An image capturing member 870, and an image processor 880.

The support plate 810 is a component for fixing the substrate W by vacuum suction of the substrate W. Rotating member 820 is a component that is coupled to the lower side of the support plate 810 to rotate the support plate 810 in a plane. The moving member 830 is coupled to the lower side of the rotating member 820 to transfer the rotating member 820 in a plane, the substrate edge detection unit 400 is the edge of the substrate (W) fixed to the support plate 810 The light irradiation unit 500 is a component for exposing the edge portion of the substrate (W) fixed to the support plate 810, the control unit 600 is a rotating member 820 and the It is a component for controlling the operation of the moving member 830.

The support plate 810 is a vacuum chuck that vacuum-adsorbs and fixes the substrate W. Although not shown, the support plate 810 is connected to the vacuum chuck body provided on the outside of the vacuum chuck body in communication with the vacuum chuck body, a plurality of vacuum suction ports formed on the vacuum chuck body, the vacuum chuck body is mounted on the upper surface of the substrate (W) And a vacuum line. On the vacuum line, a solenoid valve for adjusting the vacuum force of the vacuum chuck body is provided, and a pressure valve for detecting the vacuum force is also provided.

The rotating member 820 is coupled to the lower side of the support plate 810 to which the substrate W is fixed. The rotating member rotates the support plate 810. The rotating member 820 may include a rotating motor having a rotating shaft. The rotating member 820 is controlled by the driving controller 600 which will be described later.

The moving member 830 is coupled to the lower side of the rotating member 820 described above. The moving member 830 conveys the rotating member 820 in a plane. The moving member 830 includes an X-axis moving part 832 for reciprocating the rotating member 820 in the X-axis direction on the plane, and a Y-axis moving part for reciprocating the rotation member 820 in the Y-axis direction on the plane. 324. For example, the rotating member 820 is installed to reciprocally slide in the X-axis direction on the X-axis moving part 832, and the X-axis moving part 832 is reciprocally sliding in the Y-axis direction on the Y-axis moving part 834. Is installed to enable this. The X-axis moving unit 832 includes an X-axis driving motor 832a, and the Y-axis moving unit 834 includes a Y-axis driving motor 834a. The X-axis drive motor 832a and the Y-axis drive motor 834a are driven by control signals of the drive control unit 860, which will be described later.

The eccentric detection unit 840 measures the eccentricity of the substrate W placed on the support plate 810. The eccentric detector 840 includes a charge coupler device (CCD) for detecting an edge of the substrate W while the substrate W is rotated by the rotating member 820. The eccentric detection unit 840 detects the center point of the substrate W based on the amount of change of the edge of the substrate W detected by the CCD during one rotation of the substrate W. FIG. That is, the center point of the substrate W is detected based on the degree to which the edge of the substrate W moves away from or close to the center of the rotating member 820.

The ultraviolet irradiation member 850 irradiates ultraviolet rays to expose the edge portion of the substrate W. The ultraviolet irradiation member 850 removes the photoresist applied to the edge portion of the substrate W by irradiating the photoresist film applied to the edge portion of the upper portion of the substrate W.

The driving controller 860 controls the above-described rotating member 820 and the moving member 830. The driving controller controls the rotating member 820 and the moving member 830 such that the substrate W is planarly rotated about the center point of the substrate W detected by the eccentric detection unit 840. That is, when the driving controller 860 operates the X-axis moving unit 832 and the Y-axis moving unit 834 in synchronization with the rotational movement of the substrate W about the center point, the substrate W moves to the center point. Rotate to the center.

The imaging member 870 includes a camera that acquires an image from the edge of the substrate placed on the support plate 810. The camera may be an area camera that picks up an area scan method so that the bead removal area and the edge exposure area of the substrate edge may be included. The imaging member 870 is fixedly installed at a position capable of imaging the edge of the substrate placed on the support plate 810.

The imaging member 870 picks up the edge of the substrate when the substrate is rotated one time for eccentricity measurement. The imaging member 870 acquires a first image from the substrate rotated once in the eccentric measurement process and obtains a second image from the substrate rotated once after the edge exposure. The first image is used to inspect the bead removal state at the edge of the substrate and the second image is used to inspect the edge exposure state.

The imaging member 870 may continuously photograph the first image (or the second image) while the substrate is rotated once, but this not only delays the data processing speed of the image processor 880 but also takes up a lot of memory capacity. Done. Therefore, it is most preferable that the imaging member 870 photographs the first image discontinuously while the substrate is rotated one time. For example, the imaging member 870 may acquire a total of 12 first images by capturing the first image every 30 degrees when the substrate is rotated once.

The image processor 880 receives the first images and the second images obtained from the imaging member 870. The image processor 880 detects the width of the edge bead removal area or the width of the edge exposure area through image processing and detects particles. The image processor 880 may check the bead removal state at the edge of the substrate through the width of the bead removal region detected from the first images. The image processor 880 may check the edge exposure state at the edge of the substrate through the width of the photoresist removal region detected from the second images.

The result calculated by the image processor 880 is transferred to the controller 30 of the substrate processing apparatus 1, which is a higher controller. In the substrate processing apparatus 1 of the present invention, the result of the detection by the image processing unit 880 is based on the amount of robot distortion in the coating module which performs the edge bead removal process, the position of the nozzle which sprays thinner on the substrate edge, and the edge exposure. The position of the substrate and the like in the unit can be corrected.

An edge exposure area of the substrate W refers to an area where the photoresist film formed on the substrate W is removed through an edge exposure of wafer (EEW) process and an edge bead removal (EBR) process. do. Since the width of the edge bead removal area is narrower than the width of the edge exposure area, the step of inspecting the width of the edge bead removal area is performed before the edge exposure process. Although not shown, the image pickup member and the image processing unit for inspecting the edge bead removal state of the substrate may be provided as separate units in the processing unit instead of the edge exposure unit. That is, the unit for inspecting the edge bead removal state may be installed in the processing unit, and the configuration may include a support plate on which the substrate is seated and rotatable, an image pickup member for imaging the substrate edge, and an image processing unit.

6 is a flowchart for explaining a substrate edge exposure method.

In the edge exposing method of the edge exposing unit 800, the method of exposing the substrate to the support plate 810 (S110), detecting the eccentricity of the substrate seated on the support plate 810, and removing a bead from the edge of the substrate is performed. After inspecting (S120), exposing the edge of the substrate seated on the support plate 810 using the ultraviolet irradiation member 850 (S130), and exposing the edge of the substrate, it is seated on the support plate 810. And inspecting an edge exposure state of the substrate (S140).

Support plate mounting step (S110)

The substrate is transferred to the edge exposure unit 800 by the substrate transfer robot, loaded on the support plate 810, and vacuum-adsorbed. At this time, the center of the substrate W and the rotation axis of the support plate 810 do not have to be exactly aligned.

-Substrate eccentricity detection and edge bead removal state inspection step (S120)-

The substrate W is rotated once in a state of being seated on the support plate 810. The eccentric detection unit 840 detects the center point of the substrate W based on the amount of change of the edge of the substrate W detected from the CCD while the substrate is rotated once. The imaging member 870 acquires the first image discontinuously while the substrate is rotated one time so that the eccentric detector 840 measures the eccentricity of the substrate, and provides the obtained first images to the image processor 880.

The image processor 880 detects the width of the edge bead removal region through processing the first images acquired from the image capturing member 870, and simultaneously detects the particle. The image processor 880 checks the bead removal state at the edge of the substrate through the width of the bead removal region detected from the first images. The result calculated by the image processor 880 is transferred to the controller 30 of the substrate processing apparatus 1, which is a higher controller.

-Substrate edge exposure step (S130)-

The substrate is rotated about the center point of the substrate calculated in the substrate eccentric detection step, and the ultraviolet irradiation member 850 irradiates ultraviolet rays to the edge portion of the substrate W while the substrate is rotated, thereby exposing the substrate. The driving controller 860 controls the rotating member 820 and the moving member 830 so that the ultraviolet rays emitted from the ultraviolet irradiation member 850 can be irradiated with the same width to the substrate edge without being eccentric in one direction. When the driving controller 860 operates by synchronizing the X-axis moving unit 832 and the Y-axis moving unit 834 with the rotational movement of the substrate by the rotating member 820, the substrate W rotates about the center point. do.

-Checking the edge exposure state (S140)-

When the substrate edge exposure is completed, the substrate is rotated once again while seated on the support plate 810. The imaging member 870 acquires the second image discontinuously while the substrate rotates once, and provides the obtained second images to the image processor 880. The image processor 880 detects the width of the edge exposure area through processing of the second images acquired from the imaging member 870. The image processor 880 checks the edge exposure state of the substrate through the width of the edge exposure area detected from the second images.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of the present invention.

100: index portion 200: process treatment portion
700: interface unit 900: exposure apparatus

Claims (18)

In the substrate edge treatment method:
Mounting the substrate on the support plate;
Inspecting a bead removal state at an edge of the substrate seated on the support plate; And
Exposing an edge of the substrate seated on the support plate;
Examining the bead removal state
And photographing the substrate mounted on the support plate to obtain a first image of the substrate and inspecting the obtained first image. The method of claim 1,
After the exposing the edge of the substrate, further comprising inspecting an edge exposure state of the substrate seated on the support plate,
Examining the edge exposure state
And photographing the substrate seated on the support plate to obtain a second image of the substrate and inspecting the obtained second image. The method of claim 1,
The first image of the substrate
And a substrate loaded on the support plate is continuously obtained by an imaging camera fixed at a predetermined position in one rotation. The method of claim 1,
The first image of the substrate
And a substrate loaded on the support plate is obtained discontinuously by an imaging camera fixed at a predetermined position in one rotation. The method according to claim 3 or 4,
The imaging camera
A method of processing a substrate edge, characterized in that it is an area camera for imaging by an area scan method. The method according to claim 3 or 4,
Examining the bead removal state
Measuring a width at which beads are removed from the first image of the substrate, and detecting particles. In the substrate edge treatment method:
Removing the beads at the edge of the substrate;
Inspecting bead removal at the edge of the substrate;
Exposing an edge of the substrate;
Inspecting an edge exposure state of the substrate;
And inspecting the bead removal state, the edge exposure step, and the edge exposure state are performed in the same apparatus. The method of claim 7, wherein
The bead removal state inspection step is performed by acquiring a first image from the substrate and inspecting the acquired first image,
And the edge exposure state inspection step is performed by acquiring a second image from the substrate and inspecting the acquired second image. In the substrate edge treatment method:
Mounting the substrate on the support plate;
Examining a bead removal condition at an edge of the substrate seated on the support plate;
Examining the bead removal state
And photographing an edge of the substrate seated on the support plate to obtain a first image of the substrate and inspecting the obtained first image. 10. The method of claim 9,
And after inspecting the bead removal state, exposing an edge of the substrate seated on the support plate. The method of claim 10,
And after the exposing the edge of the substrate, inspecting an edge exposure state of the substrate seated on the support plate. The method of claim 11,
Examining the edge exposure state
And photographing the substrate seated on the support plate to obtain a second image of the substrate different from the first image, and inspecting the obtained second image. In the substrate edge exposure apparatus,
A support plate for supporting the substrate;
An eccentric detector for measuring an eccentricity of the substrate placed on the support plate;
An imaging member which acquires a first image from an edge of the substrate placed on the support plate;
An ultraviolet irradiation member for irradiating ultraviolet rays to the edge of the substrate; And
And an image processor configured to receive the first image obtained from the image pickup member and detect a width of the bead removal region. The method of claim 13,
And the imaging member acquires the first image discontinuously from the edge of the substrate when the substrate is rotated. The method of claim 13,
The eccentric detection unit uses a charge coupler device (CCD),
And an area camera for photographing the area by an area scan method. In the substrate processing apparatus,
An index unit having a load port and an index robot on which a container containing a substrate is placed;
A process processing unit connected to the indix unit and having a coating processing unit for applying a photoresist on a substrate, and a developing unit for developing the substrate after the exposure process;
An interface unit for transferring the substrate between the exposure apparatus on which the exposure process on the substrate is performed and the process processor; And
And an edge exposure unit for inspecting the edge exposure processing of the substrate and the bead removal state of the substrate edge. 17. The method of claim 16,
The edge exposure unit
The substrate processing apparatus, characterized in that provided in the interface unit or the processing unit. 17. The method of claim 16,
The edge exposure unit
A support plate for supporting the substrate;
An eccentric detector for measuring an eccentricity of the substrate placed on the support plate;
An imaging member which acquires a first image from an edge of the substrate placed on the support plate;
An ultraviolet irradiation member for irradiating ultraviolet rays to the edge of the substrate; And
And an image processor configured to receive the first image acquired from the image pickup member and detect a width of the bead removal region.
KR1020110101702A 2011-06-30 2011-10-06 Apparatus and method for edge processing of wafe KR20130007392A (en)

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CN201210227232.1A CN102856224B (en) 2011-06-30 2012-06-29 The processing method of wafer edge portion and device
US13/537,861 US20130005056A1 (en) 2011-06-30 2012-06-29 Method and apparatus for processing wafer edge portion

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190024373A (en) * 2017-08-31 2019-03-08 유민상 Apparatus for exposing edge of display glass and wafer
CN111223796A (en) * 2018-11-23 2020-06-02 细美事有限公司 Substrate processing apparatus, and apparatus and method for eccentricity inspection
KR20220097142A (en) 2020-12-31 2022-07-07 세메스 주식회사 Wafer inspection apparatus
KR20220097141A (en) 2020-12-31 2022-07-07 세메스 주식회사 Wafer inspection apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190024373A (en) * 2017-08-31 2019-03-08 유민상 Apparatus for exposing edge of display glass and wafer
CN111223796A (en) * 2018-11-23 2020-06-02 细美事有限公司 Substrate processing apparatus, and apparatus and method for eccentricity inspection
CN111223796B (en) * 2018-11-23 2023-10-27 细美事有限公司 Substrate processing apparatus, and apparatus and method for eccentric inspection
KR20220097142A (en) 2020-12-31 2022-07-07 세메스 주식회사 Wafer inspection apparatus
KR20220097141A (en) 2020-12-31 2022-07-07 세메스 주식회사 Wafer inspection apparatus

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