KR20130007342A - Improved suction table, and substrate suction device and method having the same - Google Patents

Improved suction table, and substrate suction device and method having the same Download PDF

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Publication number
KR20130007342A
KR20130007342A KR1020110065361A KR20110065361A KR20130007342A KR 20130007342 A KR20130007342 A KR 20130007342A KR 1020110065361 A KR1020110065361 A KR 1020110065361A KR 20110065361 A KR20110065361 A KR 20110065361A KR 20130007342 A KR20130007342 A KR 20130007342A
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South Korea
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adsorption
suction
substrate
hole
outermost
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KR1020110065361A
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Korean (ko)
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이수용
이기철
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주식회사 나래나노텍
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Priority to KR1020110065361A priority Critical patent/KR20130007342A/en
Publication of KR20130007342A publication Critical patent/KR20130007342A/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Coating Apparatus (AREA)

Abstract

PURPOSE: An improved suction table and an apparatus and method for absorbing a substrate are provided to prevent a substrate from being lifted in a solution coating on a substrate by providing an additional absorption hole which absorbs a corner region of the substrate. CONSTITUTION: A suction table(212) includes an absorbing unit(270). The absorbing unit is installed on an absorption surface to absorb a substrate and includes an absorbing hole(272a) and the outermost absorption groove(275). The absorbing hole is formed on the absorbing unit by corresponding to four corner regions formed on the substrate. The outermost absorption groove connects at least one absorption hole.

Description

Improved Suction Table and Substrate Suction Device and Method Having The Same

The present invention relates to an improved suction table and a substrate adsorption apparatus and method having the same.

More specifically, the present invention provides a separate adsorption hole capable of adsorbing at least the corner region of the substrate, thereby reducing the curling and chipping of the liquid caused by the phenomenon of lifting of the substrate when coating the liquid onto the substrate, When manufacturing Full High Definition Flat Panel Display (FPD), it satisfies the coating height uniformity deviation standard of 3% or less of coating liquid, which greatly reduces the occurrence of defects in the substrate, ultimately reducing the manufacturing cost and An improved suction table capable of reducing time and improving productivity, and a substrate adsorption apparatus and method having the same.

Generally, a nozzle dispenser or a nozzle dispenser is used to apply a coating liquid onto a substrate or work piece such as glass for manufacturing a flat panel display (FPD) including PDP, LCD, and OLED. A coating apparatus equipped with a slit die nozzle (hereinafter referred to as nozzle nozzle and collectively referred to as a "nozzle apparatus") is used.

More specifically, FIG. 1A is a schematic illustration of a table coating apparatus used to manufacture a flat panel display (FPD).

Referring to FIG. 1A, in a table coating apparatus 100 (hereinafter referred to as a “coating apparatus”) used to manufacture a flat panel display (FPD), a substrate W, which is a workpiece to be coated, is selected from a suction table 112. After positioning on the gantry 125 to move the nozzle device 120 attached to the horizontal direction, for example, a pixel consisting of R, G, B cells formed on the substrate (W) The method of apply | coating a coating liquid to form the is used.

More specifically, in order to apply the coating liquid onto the substrate W, the substrate W must first be transferred onto the suction table 112. Thereafter, the substrate W is maintained on the suction table 112 by an adsorption unit (not shown) formed on the suction table 112 and a vacuum device (not shown) connected to the adsorption. Then, the coating liquid is apply | coated on the board | substrate W using the nozzle apparatus 120. FIG.

As described above, in order to apply the coating liquid onto the substrate W, the substrate W is adsorbed by an adsorption unit (not shown) formed on the suction table 112 and a vacuum device (not shown) connected to the adsorption unit. State must be maintained.

Figure 1b is a plan view schematically showing an embodiment of the adsorption unit according to the prior art, Figure 1c is a side view schematically showing an embodiment of a specific configuration of the suction table according to the prior art. The adsorption unit and the suction table according to the prior art are filed as a Korean Patent Application No. 10-2004-0069809 under the name of "substrate processing apparatus and substrate processing method" by Takagi Yoshinori et al. On September 2, 2004, 2006. It is disclosed in detail in Korean Patent No. 10-0591568 (hereinafter referred to as "568 patent") registered on June 13, 2013. The disclosures of this 568 patent are incorporated herein by reference and form part of the invention.

1B and 1C, in the prior art, the adsorption unit 70 is a member for adsorbing and retaining the substrate W loaded on the suction table 112 on the adsorption surface 30. The suction unit 70 mainly includes a plurality of lift pins 71 (71a and 71b) for lifting and lowering the suction hole 72, the suction grooves 75 (75a and 75b), the suction surface 30, and the substrate (W). It is provided. The adsorption grooves 75, 75a and 75b are a plurality of linear grooves formed on the upper surface of the adsorption portion 70 on which the substrate W is to be mounted, so as to be in contact with the lower surface of the substrate W almost over the entire surface. It is installed in a grid shape. In addition, each adsorption groove 75 is connected and communicated with the other adsorption groove 75 which intersects with it at the lattice point 76. Some of the lattice points 76 on the plurality of suction grooves 75 communicate with the suction holes 72.

The suction hole 72 is a plurality of through holes penetrating the suction table 112, and the inner diameter of the first portion 78a is formed to be smaller than the inner diameter of the second portion 78b. In addition, each suction hole 72 communicates with the lattice point 76 on the suction groove 75 at the opening 78c of the suction surface 30. The lower part of each suction hole 72 is connected with the vacuum pump 81 through the piping 85. Therefore, by driving the vacuum pump 81, the air between the upper surface of the suction part 70 and the lower surface of the substrate W can be exhausted through the suction groove 75, the suction hole 72 and the pipe 85. . In this manner, the suction hole 72 is exhausted through the suction groove 75 and the suction hole 72 without providing the suction hole 72 almost in front of the suction part 70 of the suction table 112. It can adsorb | suck to the adsorption part 70. Here, the area surrounded by the third groove 75c having the plurality of outermost part suction holes 72 is referred to as the adsorption area SR, and the radius Dc is within 20 mm from the outer peripheral part W1 of the substrate W. The range will be referred to as the corner area (C).

The above-described spacing between the adsorption grooves 75 is a horizontal direction (Y-axis direction) space D3 and a longitudinal direction (X-axis direction) space D6 between the adsorption grooves formed near the edge of the substrate W, respectively. It is set to have a value smaller than the horizontal gap D2 and the longitudinal gap D5 between the suction grooves formed in the vicinity of the central portion of the.

Further, the distance D1 between the first groove 75a connecting four adsorption grooves of the outermost periphery of the adsorption groove 75 formed in the adsorption portion 70 and the outer peripheral portion W1 of the substrate W on the adsorption surface 30 ( Or D4) is set to 10.0 mm or less (preferably 5 mm or less). Further, the distance between the first groove 75a and the second groove 75b connecting four adsorption grooves of the second outermost circumference portion in the inward direction of the substrate W is D3 (or D6), and the second groove 75b ) And the distance (D1 + D3) or (D4 + D6) between the outer circumferential portion W1 of the substrate W are set to be 30.0 mm or less (preferably 15 mm or more and 25 mm or less), respectively.

Further, in the prior art, the substrate W loaded on the adsorption part 70 is adsorbed satisfactorily, and the lower surface side of the substrate W is influenced by the air present in the adsorption groove 75 in the adsorption part 70. In order to prevent the processing defect of the substrate W from occurring due to the temperature gradient of (1), the width of each of the suction grooves 75 is set to 2.0 mm or less (preferably 0.5 mm or less), and (2) The groove spacing D2 (or D5) of the suction groove 75 corresponding to the vicinity of the central portion of the substrate W is set to 100.0 mm or less (preferably 50.0 mm or less), and 3) the first portion of the suction hole 72. The inner diameter of 78a is set to be 2.0 mm or less (preferably 0.5 mm or less).

1D is a plan view schematically illustrating an adsorption unit of a suction table according to the prior art.

Referring to FIG. 1D together with FIG. 1B, in the adsorption portion 70 according to the prior art, the plurality of outermost portion suction holes 72 are arranged in the third outermost direction from the second groove 75b toward the substrate W. In FIG. It is formed on the 3rd groove | channel 75c which connects four suction grooves of an outer peripheral part. In this case, the distance between the first groove 75a and the third groove 75c in which the outermost portion suction hole 72 is formed corresponds to twice as large as D3, so that the outer circumferential portion W1 of the substrate W and the third groove ( The distance D0 between 75c) is D1 + (2xD3) or (D1 + D3) + D3, and is specifically set to 50.0 mm or less (preferably 25 mm or more and 45 mm or less).

As described above, in the prior art, since D0 is set to 50.0 mm or less (preferably 25 mm or more and 45 mm or less), the outermost part suction hole 72 is formed far away from the outer circumferential portion W1 of the substrate W. It is. Therefore, the outermost part adsorption hole 72 formed in the boundary surface of the adsorption | suction area SR or on the 3rd groove | channel 75c is not formed in the four corner area | regions C of the board | substrate W, and Accordingly, the following problems occur in the prior art.

FIG. 1E is a plan view illustrating a coating height distribution in a plan view when the coating liquid is applied onto the substrate W adsorbed on the adsorption unit illustrated in FIG. 1D, and FIG. 1F is a substrate adsorbed on the adsorption unit illustrated in FIG. 1D. When coating liquid is apply | coated on W), it is a figure which shows the application height distribution in three dimensions.

Referring to FIGS. 1E and 1F together with FIG. 1D, in the prior art, the uniformity of the coating height is influenced on the adsorption part 70 from the outer circumferential portion W1 of the substrate W to a range of approximately 200 mm in the direction of the center portion. Able to know. In addition, in the coating height distribution shown in FIGS. 1E and 1F, the size of the substrate W was 2,200 mm x 2,500 mm, and in this case, the uniformity deviation of the coating height of the coating liquid was 5.7%. If the size is larger than this, the uniformity deviation of the coating height of the coating liquid increases by approximately 8 to 10%.

In general, the uniformity variation of the coating height of the coating liquid on the substrate W is required to be 5% or less in a full HD flat panel display (FPD). Therefore, in the above-mentioned prior art, the uniformity variation requirement of the coating height of the coating liquid required at the time of manufacturing a large area full HD flat panel display (FPD) cannot be satisfied. In particular, the uniformity deviation of the coating height of the coating liquid on the substrate W has a high value within the range of approximately 200 mm in the direction of the center portion from the outer peripheral portion W1 of the substrate W, including the corner region C. Occurs. As a result, a part of the finally manufactured expensive flat panel display (FPD) has to be discarded, thereby greatly increasing the manufacturing cost and time of the flat panel display (FPD) and significantly lowering the productivity. In addition, mass production of large area ultra-high definition flat panel displays (FPDs) is difficult.

Therefore, a new method for solving the above-mentioned problems is required.

Republic of Korea Patent No. 10-0591568

The present invention is to solve the above-mentioned problems of the prior art, by providing a separate adsorption hole that can adsorb at least the corner area of the substrate, the coating liquid curling caused by the phenomenon of lifting of the substrate when coating the coating on the substrate And reduction of the coating liquid and satisfies the coating height uniformity deviation criteria of the coating liquid of 3% or less in manufacturing a Full High Definition flat panel display (FPD), thereby greatly reducing the occurrence of defects in the substrate. It is an object of the present invention to provide an improved suction table capable of reducing the production cost and time of the final product and improving productivity, and a substrate adsorption apparatus and method having the same.

The suction table according to the first aspect of the present invention includes an adsorption part, the adsorption part being installed on an adsorption surface on which the substrate W is adsorbed, and a plurality of adsorption grooves communicating with each other; A plurality of suction holes formed on the plurality of suction grooves and provided to penetrate the suction surface; At least one adsorption hole formed in the adsorption part corresponding to each of the four corner regions C provided in the substrate W; And an outermost suction groove connecting the at least one suction hole.

The suction table according to the second aspect of the present invention includes an adsorption unit. The adsorption unit is provided on the adsorption surface on which the substrate (W) is adsorbed, and a plurality of adsorption grooves communicating with each other; A plurality of suction holes formed on the plurality of suction grooves and provided to penetrate the suction surface; At least one adsorption hole formed in the adsorption part corresponding to each of the four corner regions C provided in the substrate W; An outermost suction groove connecting the at least one suction hole; And a plurality of additional suction holes formed on the outermost suction groove.

According to another aspect of the present invention, there is provided a substrate adsorption device, comprising: a plurality of adsorption grooves installed on an adsorption surface on a suction table on which a substrate W is to be adsorbed; A plurality of suction holes formed on the plurality of suction grooves and provided to penetrate the suction surface; At least one adsorption hole formed in the adsorption part corresponding to each of the four corner regions C provided in the substrate W; An outermost suction groove connecting the at least one suction hole; Pipes connected to the plurality of suction holes and the at least one suction hole, respectively; And a vacuum pump connected to the pipe and configured to control a vacuum state of the plurality of suction holes and the at least one suction hole.

According to a fourth aspect of the present invention, there is provided a substrate adsorption device comprising: a plurality of adsorption grooves installed on an adsorption surface on a suction table on which a substrate W is to be adsorbed, and communicating with each other; A plurality of suction holes formed on the plurality of suction grooves and provided to penetrate the suction surface; At least one adsorption hole formed in the adsorption part corresponding to each of the four corner regions C provided in the substrate W; An outermost suction groove connecting the at least one suction hole; A plurality of additional suction holes formed on the outermost suction grooves; A pipe connected to the plurality of suction holes, the at least one suction hole, and the plurality of additional suction holes, respectively; And a vacuum pump connected to the pipe and configured to control a vacuum state of the plurality of suction holes, the at least one suction hole, and the plurality of additional suction holes.

Substrate adsorption method according to a fifth aspect of the present invention comprises the steps of: a) placing the substrate (W) in the adsorption portion on the adsorption surface of the suction table; And b) adsorbing the substrate W on the adsorption region of the adsorption unit through a plurality of adsorption holes formed on the plurality of adsorption grooves communicating with each other, and at the same time, four corner regions provided on the substrate W ( Each of the four through the at least one adsorption hole formed in the adsorption unit corresponding to C), respectively formed in the four corner regions (C) provided in the adsorption unit, connected by the outermost adsorption groove And adsorbing the substrate (W) on the corner region (C).

Substrate adsorption method according to a sixth aspect of the present invention comprises the steps of: a) placing the substrate (W) in the adsorption portion on the adsorption surface of the suction table; And b) adsorbing the substrate W on the adsorption region of the adsorption unit through a plurality of adsorption holes formed on the plurality of adsorption grooves communicating with each other, and at the same time, four corner regions provided on the substrate W ( The four corner regions respectively formed in the adsorption section corresponding to C), through at least one adsorption hole connected by the outermost suction groove and a plurality of additional suction holes formed on the outermost suction groove. Adsorbing the substrate W on (C) and along the outermost adsorption groove.

Using the suction table and the substrate adsorption apparatus and method having the same according to the present invention achieves the following advantages.

1. By providing a separate adsorption hole capable of adsorbing the corner area of the substrate, the phenomenon of lifting of the substrate during coating of the coating liquid on the substrate is greatly reduced, and thus the liquid coating and the cutting of the liquid are reduced.

2. In the manufacture of ultra-high-definition flat panel display (FPD), the occurrence of substrate defects is greatly reduced by satisfying the application height uniformity deviation standard of the coating liquid of 3% or less.

3. The manufacturing cost and time of the final product is significantly reduced, and the productivity is greatly improved.

4. Mass production of large-area high-definition flat panel display (FPD) is possible.

Further advantages of the present invention can be clearly understood from the following description with reference to the accompanying drawings, in which like or similar reference numerals denote like elements.

1A is a schematic illustration of a table coating apparatus used to manufacture a flat panel display (FPD).
Figure 1b is a plan view schematically showing an embodiment of the adsorption unit according to the prior art.
Figure 1c is a side view schematically showing an embodiment of a specific configuration of a suction table according to the prior art.
1D is a plan view schematically illustrating an adsorption unit of a suction table according to the prior art.
FIG. 1E is a diagram showing a coating height distribution in a plan view when the coating liquid is applied onto the substrate W adsorbed on the adsorption unit shown in FIG. 1D.
FIG. 1F is a view showing in three dimensions the coating height distribution when the coating liquid is applied onto the substrate W adsorbed on the adsorption unit shown in FIG. 1D.
2A is a plan view schematically illustrating an adsorption unit of a suction table according to a first embodiment of the present invention.
FIG. 2B is a plan view illustrating a coating height distribution when a coating liquid is applied onto a substrate W adsorbed on an adsorption part of a suction table according to the first embodiment of the present invention illustrated in FIG. 2A.
FIG. 2C is a view showing three-dimensionally the application height distribution when the coating liquid is applied onto the substrate W adsorbed on the suction part of the suction table according to the first embodiment of the present invention shown in FIG. 2A.
3A is a flowchart illustrating a cleaning method of a nozzle apparatus according to the first embodiment of the present invention.
3B is a flowchart illustrating a cleaning method of a nozzle device according to a second embodiment of the present invention.

In the above-described prior art, the present inventors have a problem that the uniformity of the coating height of the coating liquid on the substrate W does not satisfy the uniformity deviation requirement (5% or less) required in the ultra-high definition flat panel display (FPD). It confirmed that it originated in the floating phenomenon of the board | substrate W in the corner area | region C of W). The reason why such a phenomenon of lifting of the substrate W has occurred is that the plurality of outermost suction holes 72 are formed far away from the outer circumferential portion W1 of the substrate W, particularly the corner region C. It is caused because it is not formed inside. As a result of the lifting of the substrate W, the substrate W is inclined on the adsorption surface, the coating liquid is crowded at the lower portion of the inclined surface, and the coating liquid is reduced at the upper portion of the inclined surface, thereby causing the shaving phenomenon. As a result, the uniformity of the coating height of the coating liquid applied on the substrate W becomes large.

The inventors have found that when the at least one suction hole 272a is formed in the four corner regions C of the substrate W having a radius Dc within 20 mm, the above-described problems of the prior art can be solved. It confirmed and completed this invention. In addition, when a plurality of suction holes 272a are additionally formed on the outermost suction grooves 275 connecting at least one suction hole 272a formed in the four corner regions C, the uniformity deviation is more effective. The requirement (5% or less) can be satisfied.

Hereinafter, the present invention will be described in detail with reference to embodiments and drawings.

2A is a plan view schematically illustrating an adsorption unit of a suction table according to a first embodiment of the present invention. The suction part 270 of the suction table 212 according to the first embodiment of the present invention shown in FIG. 2A corresponds to four corner regions C of the substrate W each having a radius Dc within 20 mm. It should be noted that at least one suction hole 272a is substantially the same as the suction part 70 of the suction table 112 of the prior art shown in FIGS. 1B and 1C.

Referring to FIG. 2A together with FIGS. 1B to 1C, the suction table 212 according to the first embodiment of the present invention includes an adsorption unit 270. Adsorption unit 270 is installed on the adsorption surface 30, the substrate (W) is adsorbed, a plurality of adsorption groove (75) communicating with each other; A plurality of suction holes 72 formed on the plurality of suction grooves 75 and provided to penetrate the suction surface 30; At least one adsorption hole 272a formed in the adsorption part 270 corresponding to each of the four corner regions C provided in the substrate W; And an outermost portion suction groove 275 connecting the at least one suction hole 272a.

In addition, the substrate adsorption apparatus according to the first embodiment of the present invention includes a plurality of adsorption grooves 75 installed on the adsorption surface 30 on the suction table 212 on which the substrate W is to be adsorbed; A plurality of suction holes 72 formed on the plurality of suction grooves 75 and provided to penetrate the suction surface 30; At least one adsorption hole 272a formed in the adsorption part 270 corresponding to each of the four corner regions C provided in the substrate W; An outermost suction groove 275 connecting the at least one suction hole 272a; Pipes 85 connected to the plurality of suction holes 72 and the at least one suction hole 272a, respectively; And a vacuum pump 81 connected to the pipe 85 and controlling a vacuum state of the plurality of suction holes 72 and the at least one suction hole 272a.

Hereinafter, respective configurations and operations of the suction table 212 and the substrate adsorption device according to the first embodiment of the present invention will be described in detail.

Referring back to FIG. 2A together with FIGS. 1B-1C, the suction table 212 according to the first embodiment of the present invention includes an adsorption unit 270. The adsorption part 270 is provided on the adsorption surface 30 of the substrate W and includes a plurality of adsorption grooves 75 communicating with each other. On the plurality of adsorption grooves 75, a plurality of adsorption holes 72 provided to penetrate the adsorption surface 30 are formed. In addition, the substrate W has four corner regions C. FIG. At least one adsorption hole 272a is formed on the adsorption part 270 corresponding to the four corner regions C, respectively. At least one suction hole 272a is connected by an outermost suction groove 275.

In addition, the substrate adsorption device according to the first embodiment of the present invention includes a pipe 85 and a vacuum pump 81 in addition to the adsorption part 270 formed on the suction table 212 described above. The pipe 85 is connected to each of the plurality of suction holes 72 and at least one suction hole 272a, and the vacuum pump 81 is connected to the pipe 85. The vacuum pump 81 controls the vacuum state of the plurality of adsorption holes 72 and the at least one adsorption hole 272a through the pipe 85, so that the upper surface of the adsorption part 270 (that is, the adsorption surface 30). )) And the lower surface of the substrate W can be exhausted to adsorb the substrate W onto the adsorption surface 30.

FIG. 2B is a plan view illustrating a coating height distribution in a plan view when the coating liquid is applied onto the substrate W adsorbed on the suction part of the suction table according to the first embodiment of the present invention shown in FIG. 2A. When the coating liquid is applied onto the substrate W adsorbed on the adsorption part of the suction table according to the first embodiment of the present invention illustrated in FIG. 2A, the application height distribution is shown in three dimensions. Here, also, in the coating height distribution shown in FIGS. 2B and 2C, the size of the substrate W is 2,200 mm x 2,500 mm, which is the same as the size of the substrate W used in FIGS. 1E and 1F. 2B and 2C, the uniformity deviation of the coating height of the coating liquid obtained using the suction table 212 and the substrate adsorption device according to the first embodiment of the present invention was 2.6%. Therefore, in the first embodiment of the present invention, the uniformity deviation of the coating height of the coating liquid satisfies the uniformity variation (5% or less) required in the ultra-high definition flat panel display (FPD). The result is that the substrate W is lifted in the four corner regions C by air exhausting through at least one adsorption hole 272a respectively formed in the four corner regions C provided in the adsorption portion 270. This is because the curling and chipping of the coating liquid applied on the substrate W is reduced, thereby being reduced.

Accordingly, in the present invention, the uniformity deviation of the coating height of the coating liquid on the substrate W is approximately 200 mm in the direction of the center portion from the outer peripheral portion W1 of the substrate W, including the corner region C, compared with the prior art. Significantly lowers the probability of failure. As a result, the manufacturing cost and time of the flat panel display (FPD) are greatly reduced, and the productivity is greatly improved.

2D is a plan view schematically illustrating an adsorption unit of a suction table according to a second exemplary embodiment of the present invention.

Referring to FIG. 2D, each of the four corner regions C of the substrate W having a radius Dc within 20 mm is included in the suction part 270 of the suction table 212 according to the second embodiment of the present invention. Except that at least one adsorption hole 272a is formed correspondingly, and a plurality of additional adsorption holes 272b are also formed on the outermost suction groove 275 connecting the at least one adsorption hole 272a. It should be noted that is substantially the same as the adsorption portion 70 of the suction table 112 of the prior art shown in Figures 1b and 1c.

Referring back to FIG. 2D together with FIGS. 1B and 1C, the suction table 212 according to the second embodiment of the present invention includes an adsorption unit 270. Adsorption unit 270 is installed on the adsorption surface 30, the substrate (W) is adsorbed, a plurality of adsorption groove (75) communicating with each other; A plurality of suction holes 72 formed on the plurality of suction grooves 75 and provided to penetrate the suction surface 30; At least one adsorption hole 272a formed in the adsorption part 270 corresponding to each of the four corner regions C provided in the substrate W; An outermost suction groove 275 connecting the at least one suction hole 272a; And a plurality of additional adsorption holes 272b formed on the outermost part adsorption groove 275.

In addition, the substrate adsorption apparatus according to the second embodiment of the present invention includes a plurality of adsorption grooves 75 installed on the adsorption surface 30 on the suction table 212 on which the substrate W is to be adsorbed; A plurality of suction holes 72 formed on the plurality of suction grooves 75 and provided to penetrate the suction surface 30; At least one adsorption hole 272a formed in the adsorption part 270 corresponding to each of the four corner regions C provided in the substrate W; An outermost suction groove 275 connecting the at least one suction hole 272a; A plurality of additional suction holes 272b formed on the outermost suction grooves 275; A pipe 85 connected to the plurality of suction holes 72, the at least one suction hole 272a, and the plurality of additional suction holes 272b, respectively; And a vacuum pump 81 connected to the pipe 85 and controlling a vacuum state of the plurality of suction holes 72, the at least one suction hole 272a, and the plurality of additional suction holes 272b. It includes.

In the suction table 212 and the substrate adsorption apparatus according to the second embodiment of the present invention described above, at least one adsorption hole 272a and the outermost portion suction groove 275 formed in each of four corner regions C are respectively formed. Air exhaust through the plurality of additional adsorption holes 272b formed on the C-C1 reduces the lifting phenomenon generated in the four corner regions C of the substrate W, as well as along the outermost suction grooves 275. The lifting phenomenon is further reduced. Accordingly, since the uniformity deviation of the coating height of the coating liquid on the substrate W within the range of approximately 200 mm in the direction of the center portion from the outer peripheral portion W1 of the substrate W is further reduced in comparison with the above-described first embodiment, coating liquid coating Of defects and the manufacturing cost and time of the flat panel display (FPD) is further reduced, productivity is further improved.

3A is a flowchart showing a substrate adsorption method according to the first embodiment of the present invention.

Referring to FIG. 3A in conjunction with FIGS. 1B, 1C, and 2A to 2C, the substrate adsorption method 300 according to the first embodiment of the present invention includes a) adsorption of the substrate W on the suction table 212. Placing 310 in the adsorption portion 270 on the face 30; And b) adsorbing the substrate W on the adsorption region SR of the adsorption portion 270 through a plurality of adsorption holes 72 formed on the plurality of adsorption grooves 75 communicating with each other. At least one adsorption hole 272a is formed in the adsorption part 270 corresponding to each of the four corner regions C provided in the substrate W and connected by the outermost part suction groove 275. Adsorbing the substrate (W) on the four corner areas (C) through (320).

3B is a flowchart illustrating a substrate adsorption method according to a second embodiment of the present invention.

Referring to FIG. 3B in conjunction with FIGS. 1B, 1C, and 2D, the substrate adsorption method 300 according to the second embodiment of the present invention includes a) an adsorption surface 30 of the suction table 212 with the substrate W; Positioning 310 in the adsorption unit 270 on the upper side; And b) adsorbing the substrate W on the adsorption region SR of the adsorption portion 270 through a plurality of adsorption holes 72 formed on the plurality of adsorption grooves 75 communicating with each other. At least one adsorption hole 272a formed in the adsorption part 270 corresponding to each of the four corner regions C provided in the substrate W and connected by an outermost part adsorption groove 275 and The substrate W is formed on the four corner regions C and along the outermost suction groove 275 through a plurality of additional suction holes 272b formed on the outermost suction groove 275. Adsorption step 320 is included.

In the substrate adsorption method 300 according to the first and second embodiments of the present invention described above, the four corner regions C have a radius Dc within 20 mm from the outer peripheral portion W1 of the substrate W. Has a range.

Various modifications may be made by those skilled in the art without departing from the spirit and scope of the invention as defined by the following claims. It is not. Accordingly, the scope of the present invention should not be limited by the above-described exemplary embodiments, but should be determined only in accordance with the following claims and their equivalents.

30: adsorption surface 70,270: adsorption part 72,272a, 272b: adsorption hole
75,75a, 75b, 75c, 275: Suction groove 71,71a, 71b: lift pin
76 grid point 78a first portion 78b second portion
78c: opening 85: piping 81: vacuum pump
100: table coating apparatus 112, 212: suction table
120: nozzle apparatus 125: gantry
C: corner area Dc: radius SR: adsorption area
W: Substrate W1: Outer Peripheral

Claims (12)

In the suction table,
Provided with an adsorption unit, wherein the adsorption unit
A plurality of adsorption grooves provided on an adsorption surface on which the substrate W is adsorbed and in communication with each other;
A plurality of suction holes formed on the plurality of suction grooves and provided to penetrate the suction surface;
At least one adsorption hole formed in the adsorption part corresponding to each of the four corner regions C provided in the substrate W; And
Outermost part suction groove connecting the at least one suction hole
Suction table comprising a. The method of claim 1,
The four corner regions (C) have a radius Dc within a range of 20 mm from an outer circumference (W1) of the substrate (W). In the substrate adsorption device,
A plurality of adsorption grooves provided on an adsorption surface on the suction table on which the substrate W is to be adsorbed and communicating with each other;
A plurality of suction holes formed on the plurality of suction grooves and provided to penetrate the suction surface;
At least one adsorption hole formed in the adsorption part corresponding to each of the four corner regions C provided in the substrate W;
An outermost suction groove connecting the at least one suction hole;
Pipes connected to the plurality of suction holes and the at least one suction hole, respectively; And
A vacuum pump connected to the pipe and controlling a vacuum state of the plurality of suction holes and the at least one suction hole.
Substrate adsorption apparatus comprising a. The method of claim 3,
The four corner regions (C) have a radius (Dc) within a range of 20 mm from the outer peripheral portion (W1) of the substrate (W). In the suction table,
With adsorption part. The adsorption unit
A plurality of adsorption grooves provided on an adsorption surface on which the substrate W is adsorbed and in communication with each other;
A plurality of suction holes formed on the plurality of suction grooves and provided to penetrate the suction surface;
At least one adsorption hole formed in each of the four corner regions C provided in the adsorption part;
An outermost suction groove connecting the at least one suction hole; And
A plurality of additional suction holes formed on the outermost suction grooves;
Suction table comprising a. 6. The method of claim 5,
The four corner regions (C) have a radius Dc within a range of 20 mm from an outer circumference (W1) of the substrate (W). In the substrate adsorption device,
A plurality of adsorption grooves provided on an adsorption surface on the suction table on which the substrate W is to be adsorbed and communicating with each other;
A plurality of suction holes formed on the plurality of suction grooves and provided to penetrate the suction surface;
At least one adsorption hole formed in the adsorption part corresponding to each of the four corner regions C provided in the substrate W;
An outermost suction groove connecting the at least one suction hole;
A plurality of additional suction holes formed on the outermost suction grooves;
A pipe connected to the plurality of suction holes, the at least one suction hole, and the plurality of additional suction holes, respectively; And
A vacuum pump connected to the pipe and controlling a vacuum state of the plurality of suction holes, the at least one suction hole, and the plurality of additional suction holes.
Substrate adsorption apparatus comprising a. 8. The method of claim 7,
The four corner regions (C) have a radius (Dc) within a range of 20 mm from the outer peripheral portion (W1) of the substrate (W). In the substrate adsorption method,
a) positioning the substrate W on the adsorption part on the adsorption face of the suction table; And
b) four corner regions C provided in the substrate W while adsorbing the substrate W on the adsorption region of the adsorption portion through a plurality of adsorption holes formed on the plurality of adsorption grooves communicating with each other. Adsorbing the substrate (W) on the four corner regions (C) through at least one adsorption hole formed in the adsorption unit corresponding to each other and connected by an outermost adsorption groove, respectively.
Substrate adsorption method comprising a. The method of claim 9,
The four corner regions (C) have a radius (Dc) within a range of 20 mm from the outer peripheral portion (W1) of the substrate (W). In the substrate adsorption method,
a) positioning the substrate W on the adsorption part on the adsorption face of the suction table; And
b) four corner regions C provided in the substrate W while adsorbing the substrate W on the adsorption region of the adsorption portion through a plurality of adsorption holes formed on the plurality of adsorption grooves communicating with each other. The four corner regions (2) formed in the adsorption unit corresponding to each of the at least one suction hole connected to the outermost suction hole and a plurality of additional suction holes formed on the outermost suction hole. Adsorbing the substrate W on C) and along the outermost adsorption groove
Substrate adsorption method comprising a. 12. The method of claim 11,
The four corner regions (C) have a radius (Dc) within a range of 20 mm from the outer peripheral portion (W1) of the substrate (W).
KR1020110065361A 2011-07-01 2011-07-01 Improved suction table, and substrate suction device and method having the same KR20130007342A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108883510A (en) * 2016-03-28 2018-11-23 日本麦可罗尼克斯股份有限公司 The manufacturing method of sheet material fixture, workbench, manufacturing device and secondary cell

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108883510A (en) * 2016-03-28 2018-11-23 日本麦可罗尼克斯股份有限公司 The manufacturing method of sheet material fixture, workbench, manufacturing device and secondary cell
KR20180128038A (en) * 2016-03-28 2018-11-30 가부시키가이샤 니혼 마이크로닉스 Sheet jig, stage, manufacturing apparatus, and manufacturing method of secondary battery

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