KR20130007224A - Oled manufacturing apparatus comprising inspection unit - Google Patents

Abstract

PURPOSE: An OLED manufacturing device including an inspection unit is provided to improve the yield of a panel process by inspecting defects in an OLED manufacturing process using a buffer chamber in real time. CONSTITUTION: A first buffer chamber(102) transfers a substrate inputted through a first chamber to a first transfer chamber(210). A second buffer chamber(300) is connected to the first transfer chamber and receives the substrate from the first chamber. A second chamber is connected to the first buffer chamber and receives the substrate from the first buffer chamber. An inspection unit inspects the substrate in the first buffer chamber. A repair chamber(670) repairs the defective substrate which is determined as the defect by the inspection unit.

Description

OLED manufacturing apparatus including an inspection unit {OLED MANUFACTURING APPARATUS COMPRISING INSPECTION UNIT}

The present invention relates to an OLED manufacturing apparatus, and more particularly, to an OLED manufacturing apparatus including an inspection unit.

Among flat panel displays, organic light emitting diodes (OLEDs), also called organic diodes and organic ELs, are self-luminous displays that emit light by using an electroluminescence phenomenon that emits light when a current flows through a fluorescent organic compound.

The lifespan of an OLED comes in two forms: a sudden decrease in brightness due to dark spots and a decrease in brightness due to deterioration of the device itself. In general, the decrease in brightness due to dark spots is caused by the formation and growth of non-light emitting portions, which are caused by external factors such as moisture and oxygen introduced from the outside, impurities on the surface of the substrate, irregular projections on the ITO surface, and organic material deposition. It forms by element internal factors, such as defect formation in a process. The formation of dark spots is accelerated by the inflow of moisture and oxygen from the outside, and the formation of dark spots is accompanied by an increase in leakage current and a sharp decrease in luminance due to a short circuit. The formation of dark spots leads to product defects in OLED TVs that use large areas, so thorough management is required.

On the other hand, due to the characteristics of OLED, all deposition processes are carried out in a vacuum environment, so if the quality and process evaluation of the deposition process are necessary, it is discarded after manual sampling inspection in the air (in the air). there is a problem. While the mass production yield of small AMOLED panels is very high, the yield tends to decrease significantly as the substrate size increases from medium to large. As a result, the unit price of OLED panels will rise and it will be an important variable to secure the yield of panel processes in the mass production of large-scale OLED TVs.

OLED is sensitive to oxygen and moisture, so when the OLED is inspected in the air, the performance of the device is reduced and the life is shortened. According to the prior art, the yield of the panel process due to the sampling inspection in the atmospheric state is drastically decreased. Has a problem.

Unlike other display equipment, the equipment for manufacturing OLED performs a majority of processes by forming a plurality of chambers to form a system, which makes the composition of the equipment complicated. Due to such complex system characteristics, the OLED manufacturing equipment according to the prior art has been installed with separate equipment for panel inspection.

OLEDs are sensitive to oxygen and moisture, so it is necessary to solve problems such as deterioration of device performance, shortening of life, and remarkable drop in yield of panel processes when inspecting OLEDs in the air.

Due to the complex system characteristics of OLED manufacturing equipment, it is difficult to combine the panel inspection unit with OLED manufacturing equipment.

Technical problems of the present invention are not limited to the above-mentioned technical problems, and other technical problems that are not mentioned will be clearly understood by those skilled in the art from the following description.

An OLED manufacturing apparatus according to the present invention for solving the above problems, the first chamber; A first buffer chamber connected to the first chamber so that the substrate carried out from the first chamber is carried in; A second chamber connected to the first buffer chamber so that the substrate carried out from the first buffer chamber is carried in; And an inspection unit installed in the first buffer chamber to perform inspection of the substrate loaded into the first buffer chamber.

The apparatus may further include a repair chamber in which the substrate, which is determined to be defective in the inspection unit, may be taken out of the first buffer chamber and then carried in to repair the defective portion.

In addition, the repair chamber may be connected to the first buffer chamber as a separate chamber different from the first and second chambers.

The repair chamber may be at least one of the first chamber, the second chamber, a third chamber connected to the first chamber, and a fourth chamber connected to the second chamber.

In addition, the first chamber includes a first robot arm to carry the substrate in and out of the third chamber, and the second chamber includes a second robot arm to carry the substrate in and out of the fourth chamber. can do.

The apparatus may further include a second buffer chamber connected to the first chamber so that the substrate to be transported from the inside may be carried into the first chamber. And a transfer chamber connected to the first buffer chamber and the other side connected to the second buffer chamber.

In addition, a support pin installed inside the first buffer chamber to support a substrate carried in the first buffer chamber from the first chamber, and a through hole is formed to allow the support pin to be inserted therethrough. It further includes a loading unit for loading the substrate on the upper surface, at least one of the support pin and the loading portion may be installed to be liftable.

The apparatus may further include an alignment unit for aligning the substrate loaded into the first buffer chamber.

In addition, a substrate transfer module for transporting the substrate loaded into the first buffer chamber in the first buffer chamber to allow the inspection unit to photograph a predetermined area of the substrate, and the inspection unit in the first buffer chamber. By transporting from the inspection unit may include at least any one of the inspection unit transfer module to allow the inspection unit to photograph the predetermined area of the substrate.

Also, while the inspection unit inspects the first substrate, a bypass module for transporting the second substrate so that the second substrate different from the first substrate can be carried out to the second chamber without inspection by the inspection unit. It may further include.

In addition, the inspection unit comprises a first inspection unit; Second inspection unit; And control the first inspection unit to photograph the substrate, calculate coordinates of the defective point based on the image obtained from the first inspection unit, and allow the second inspection unit to photograph the coordinates of the defective point. It may include a control unit for controlling.

In addition, the first inspection unit includes a first camera; And a first beam splitter positioned on an optical path between the first camera and the substrate and transferring the incident light toward the substrate and transferring the light reflected from the substrate to the first camera.

In addition, the inspection unit may further include a moving module for moving the first camera and the first beam splitter in a parallel direction with respect to the substrate.

In addition, the second inspection unit may further include a focusing unit for irradiating a focusing beam to a substrate so as to measure a focal length up to a point where imaging is required.

In addition, the second inspection unit includes a second camera; A first reflecting member positioned on an optical path between the second camera and the substrate; A second beam splitter which transmits incident light to the first reflecting member and transmits light reflected from the first reflecting member to the second camera; And a third beam splitter configured to transfer the incident focusing beam to the first reflection member and to transfer the focusing beam reflected from the first reflection member to the second camera.

The second inspection unit may further include a second reflecting member which transmits the light transmitted from the first reflecting member to the substrate and transmits the light reflected from the substrate to the first reflecting member, wherein the second reflecting member The member may be movable parallel to the substrate.

The apparatus may further include a vacuum unit to form a vacuum in the first buffer chamber while inspecting the substrate loaded into the first buffer chamber.

According to the present invention, by using the buffer chamber, it is not an OLED finished product, it can be easily inspected in real time whether the defect is in the OLED manufacturing process, and the yield of the panel process is improved.

In addition, since the defects can be easily repaired through the repair chamber as well as the inspection of defects, the yield of the panel process is improved.

In addition, another conventional deposition chamber or etching chamber can be used as the repair chamber, thereby increasing the efficiency of the apparatus.

In addition, there is an effect that the substrate can be precisely inspected while the substrate is loaded and aligned in the buffer chamber by using the loading unit and the alignment unit.

In addition, there is an effect that can perform a sampling test using the bypass module.

In addition, since the first inspection unit is used for inspection, and the second inspection unit is used, it is possible to intensively inspect a portion suspected of being defective at a high magnification, thereby shortening inspection time and improving inspection efficiency .

In addition, as the substrate inspection is performed in the vacuum chamber inside the buffer chamber, there is an effect of preventing the degradation of the substrate quality.

The technical effects of the present invention are not limited to the above-mentioned effects, and other technical effects not mentioned will be clearly understood by those skilled in the art from the following description.

1 is a schematic configuration diagram of an OLED manufacturing apparatus including an inspection unit according to a first embodiment of the present invention.
2 is a schematic configuration diagram of an OLED manufacturing apparatus including an inspection unit according to a second embodiment of the present invention.
3 is a schematic configuration diagram of an OLED manufacturing apparatus including an inspection unit according to a third embodiment of the present invention.
4 is a schematic partial cross-sectional view of a third buffer chamber A-A 'in an OLED manufacturing apparatus including an inspection unit according to an embodiment of the present invention.
5 and 6 are partially enlarged cross-sectional views of B and C of FIG. 4, respectively.
7 is a schematic partial cross-sectional view of a third buffer chamber A-A 'in an OLED manufacturing apparatus including a substrate inspection apparatus according to another embodiment of the present invention.
8 is a schematic cross-sectional view of each line scan unit that may be applied to a substrate inspection apparatus according to an exemplary embodiment of the present invention.
9 is a schematic enlarged cross-sectional view of the line scanning unit of the substrate inspection apparatus according to the embodiment of the present invention as viewed in the Y-axis direction.
10 is a schematic enlarged cross-sectional view of the line scan unit of the substrate inspection apparatus according to the embodiment of the present invention as viewed in the X-axis direction.
11 is a schematic cross-sectional view for each type of area scan unit applicable to a substrate inspection apparatus according to an exemplary embodiment of the present invention.
12 is a schematic cross-sectional view of the area scanning unit of the substrate inspection apparatus according to the embodiment of the present invention, viewed in the Y-axis direction.
13 is a schematic cross-sectional view of the area scan unit of the substrate inspection apparatus according to the embodiment of the present invention as viewed in the X-axis direction.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present embodiment is not limited to the embodiments disclosed below, but can be implemented in various forms, and only this embodiment makes the disclosure of the present invention complete, and the scope of the invention to those skilled in the art. It is provided for complete information. Shapes of the elements in the drawings may be exaggerated parts for a more clear description, elements denoted by the same reference numerals in the drawings means the same element.

Hereinafter, “first, second, ...,” such as “first (buffer) chamber”, “second (buffer) chamber”,…, means different components, and the process order or progression of the substrate. It is not intended to limit the direction. In addition, the "first (buffer) chamber" described in the detailed description of the invention and the "first (buffer) chamber" described in the claims may mean different "(buffer) chambers".

1 is a schematic configuration diagram of an OLED manufacturing apparatus including an inspection unit according to a first embodiment of the present invention.

As shown in FIG. 1, an OLED manufacturing apparatus including a substrate inspection apparatus (inspection unit) according to an embodiment of the present invention may include a loading chamber unit 100. The loading chamber 101 is a component that allows the substrate to be loaded into the apparatus. The loading chamber 101 is connected to the first buffer chamber 102. The first buffer chamber 102 is a chamber that serves as a passage through which the substrate loaded into the interior of the loading chamber 101 is transferred to the first transport chamber 210. When a gate valve (not shown) installed between the loading chamber 101 and the first conveying chamber 210 is opened, a conveying robot (robot arm) (not shown) installed inside the first conveying chamber 210 is loaded with the loading chamber 101. The substrate inside the gripping unit may be gripped and transferred to the first transfer chamber 210.

A pretreatment chamber 220, a CFx treatment chamber 230, a HIL chamber 240 forming a hole injection layer, a cooling chamber 250, and a periphery of the first transfer chamber 210. The mask chamber 260 and the heating chamber 270 may be connected to each other. A transport robot (robot arm) (not shown) installed in the first transport chamber 210 (similarly, a transport robot may also be installed in the second transport chamber 610) may carry in and out of the substrate. have. A gate valve (not shown) may be installed between the chamber around the first conveying chamber 210 and the first conveying chamber 210. The process performed in the plurality of process chambers coupled around the first transfer chamber 210 may be set differently according to the type of substrate or the type of process method.

The second buffer chamber 300 may be connected to the first conveying chamber 210. That is, the first transport chamber 210 may be connected to one side of the second buffer chamber 300, and the second transport chamber 410 may be connected to the other side of the second buffer chamber 300. The HTL chamber 420 forming the hole transport layer, the red chamber 430 forming the red light emitting layer, the green chamber 440 forming the green light emitting layer, and the white forming the white light emitting layer are formed around the second transport chamber 410. The chamber 450, the mask chamber 460, and the blue chamber 470 forming the blue light emitting layer may be connected.

The third buffer chamber 500 may be connected to the second conveying chamber 410. That is, the second conveying chamber 410 may be connected to one side of the third buffer chamber 500, and the third conveying chamber 610 may be connected to the other side of the third buffer chamber 500. Around the third transfer chamber 610, a metal chamber 620 for forming a metal film, an EIL chamber 630 for forming an electron injection layer, an ETL chamber 640 for forming an electron transport layer, and an additional process may be used. The extra buffer chamber 650, the mask chamber 660, the repair chamber 670, and the fourth buffer chamber 701 connected to the unloading chamber 702 may be connected.

Here, a substrate inspection apparatus (inspection unit) for inspecting a state of the substrate transported from the second transfer chamber 410 to the third transfer chamber 500 may be installed inside the third buffer chamber 500. As the substrate inspection device (inspection unit) is installed inside the third buffer chamber 500, it is possible to inspect in real time whether the substrate is defective in the intermediate stage before the OLED is completed, and if it is defective, repair it to be good. To be transferred to the next process. If it is determined that the defect is due to the inspection result of the substrate and repair is required, the substrate may be repaired by bringing the substrate into the repair chamber (670). That is, when repair is required, the board may be repaired by bringing the substrate into one of the chambers (repair chamber 670) connected to the third transport chamber 610. In addition, when repair is necessary, the board may be repaired by bringing the substrate into one chamber connected to the second transport chamber 410, and in some cases, the repair may be performed in the second transport chamber or the third transport chamber. have.

As another embodiment, the third buffer chamber 500 may be provided with a discharge port so that the substrate determined to be impossible to repair can be carried out to the outside.

In addition, the substrate, which is determined to be impossible to repair, may be transported to the unloading chamber 702 instead of a separate discharge port, and then taken out of the unloading chamber 702. The unloading unit 700 includes a fourth buffer chamber 701 and an unloading chamber 702.

According to the inspection result of the substrate, the type judged to be defective is that the surface of the substrate which has undergone the deposition process is not uniform and there are some protruding portions, and when the partial deposition is performed to the unnecessary portion, the deposition is performed on the portion requiring deposition. If this is not done, etc. are mentioned. With respect to the substrate of the type judged to be defective, the repair chamber (repair chamber) 670 is cut in the protruding portion or the portion deposited on the unnecessary portion by using etching means including a laser or the like. The inner working process may be performed or a local deposition process may be performed on the portion where the deposition is not performed. This repair process may be performed in one repair chamber or may be performed in a plurality of repair chambers.

2 is a schematic configuration diagram of an OLED manufacturing apparatus including an inspection unit according to a second embodiment of the present invention. For convenience of description, like reference numerals are used for like elements.

As shown in FIG. 2, the state of the substrate transported from the second conveying chamber 410 to the third conveying chamber 610 in the third buffer chamber 500 so as to immediately check whether there is a defect in the OLED manufacturing process. An inspection unit (substrate inspection device) for inspecting may be installed. If it is determined that the defect is necessary according to the inspection result of the substrate and the repair is required, the substrate may be carried into the repair chamber 802a through the fifth buffer chamber 801a to proceed with the repair work. In the third buffer chamber 500 or the fifth buffer chamber 801a, a transport robot (not shown) and a conveyor (not shown) may be used to transport the substrate from the third buffer chamber 500 to the repair chamber 802a. Etc. may be installed.

The difference from the first embodiment is that the at least one repair chamber 802a is directly connected to the third buffer chamber 500 without being connected to the second conveying chamber 410 or the third conveying chamber 610. Of course, the repair chamber may include a plurality of repair chambers, and another repair chamber may be at least one of a plurality of process chambers connected to the second transport chamber 410 or the third transport chamber 610.

As another example, the fifth buffer chamber 801a or the repair chamber 802a may be provided with an outlet port for carrying out a substrate that is determined to be impossible to repair.

3 is a schematic configuration diagram of an OLED manufacturing apparatus including an inspection unit according to a third embodiment of the present invention. For convenience of description, like reference numerals are used for like elements.

As shown in FIG. 3, the state of the substrate transported from the second conveying chamber 410 to the third conveying chamber 500 in the third buffer chamber 500 so as to immediately check whether there is a defect in the OLED manufacturing process. An inspection unit (substrate inspection device) for inspecting may be installed.

If it is determined that the defect is determined according to the inspection result of the substrate and the repair is required, the substrate may be returned to the second buffer chamber 300 through the sixth buffer chamber 800b.

The difference from the first and second embodiments is that repair, that is, etching or deposition using an existing chamber without having a separate repair chamber is performed.

In another embodiment, the sixth buffer chamber (transfer chamber) 800b may be connected to the first buffer chamber 102 instead of the second buffer chamber 300.

As another embodiment, the sixth buffer chamber 800b may be provided with a discharge port for carrying out a substrate that is determined to be impossible to repair.

In order to transport the substrate from the third buffer chamber 500 to the second buffer chamber 300, a carrier robot (not shown) and a conveyor (not shown) are provided inside the third buffer chamber 500 or the sixth buffer chamber 800b. May be installed.

4 is a schematic partial cross-sectional view of a third buffer chamber A-A 'in an OLED manufacturing apparatus including an inspection unit according to an embodiment of the present invention.

5 and 6 are partially enlarged cross-sectional views of B and C of FIG. 4, respectively.

4 to 6, the third buffer chamber 500 of the OLED manufacturing apparatus including the inspection unit according to the embodiment of the present invention may include a table 501 located on the bottom surface. An upper surface of the table 501 may be provided with an isolator 502 to block the vibration between the frame 503. The upper surface of the isolator 502 may be installed with a frame 503 for supporting the inspection chamber 504. An inspection chamber 504 may be installed on the upper surface of the frame 503.

The first elevating units 505a to 505d are coupled to the inspection chamber 504 so that the elevating unit can be lifted up and down. The board loaded into the inspection chamber 504 by the robot arm (carrying robot) is loaded on the upper surface of the first lifting units 505a to 505d, and the chuck 512 is loaded on the upper surface of the first lifting units 505a to 505d. The substrate S thus held is held.

The first elevating units 505a to 505d are installed at the horizontal portions 505a, one side of each of the horizontal portions 505a, and the other side of the first elevating units 505a to 505d is inserted into through holes formed in the inspection chamber 504. The vertical portion 505b located on the inner side, the substrate can be loaded on the upper surface, and the loading portion 505c and horizontal portion 505a respectively connecting the plurality of vertical portions 505b positioned on the inside of the inspection chamber 504. It is provided in the lower surface and includes the lifting drive part 505d which can raise and lower the board | substrate by raising and lowering the horizontal part 505a. The support part 506 is provided with a support pin 506a inserted into a plurality of through holes formed in the loading part 505c, and a plurality of support pins 506a and a support plate 506b fixed inside the inspection chamber 504. It includes. That is, the support pin 506a is installed inside the inspection chamber 504 so as to support a substrate carried into the inspection chamber 504.

When the substrate S is brought into the inspection chamber 504 from the second conveying chamber 410 by a robot arm (not shown) through the gate valve 516 opened by the damper 515, a support pin ( The loading part 505c is lowered so that the upper end of 506a may be exposed. When the robot arm lowers the substrate S on the upper end of the support pin 506a and is taken out of the inspection chamber 504, the lifting driving part 505d pushes the horizontal part 505a upward. Accordingly, the mounting portion 505c also rises, and the substrate S is transferred from the support pin 506a to the loading portion 505c. That is, as the support pin 506a is lowered, the substrate supported by the support pin 506a is loaded on the upper surface of the mounting portion 505c.

In another embodiment, the mounting portion may be fixedly installed and may be formed in a configuration in which the support pin may be elevated. In such a case, the loaded substrate is placed on the upper support pin, and when the support pin is lowered, the substrate is transferred to the loading part.

On the other hand, the first alignment unit (507a ~ 507b) is the alignment driving unit 507a located under the inspection chamber 504, one side is connected to the alignment driving unit 507a, the other side is located inside the inspection chamber 504 It includes a substrate push unit 507b that can push the side surface of the substrate by the alignment driver 507a. The substrate push unit 507b may be provided in a form in which the upper end portion is bent in a horizontal direction to extend a predetermined distance (horizontal bend portion) and then extends upwards a predetermined distance (upward bending portion). Accordingly, when the substrate push unit 507b is rotated by a predetermined angle by the alignment driver 507a, the upper bent portion pushes the side surface of the substrate, thereby adjusting the position of the substrate. When a quadrangular substrate is used, a total of eight first alignment units 507 may be provided. When the substrate S is loaded on the upper end of the support pin 506a or on the upper surface of the loading part 505c, the first alignment unit 507 is xy with respect to the ground so that the substrate S is placed in the correct position. Direction.

The substrate transfer module transfers the substrate carried into the inspection chamber 504 in the inspection chamber 504 so that the inspection unit can photograph a predetermined area of the substrate. The substrate transfer module may include a chuck 512, a guide rail unit 511, and a driver (not shown).

As another example, the inspection unit may include an inspection unit transfer module that allows the inspection unit to capture an area of the substrate by transferring the inspection unit within the inspection chamber 504. In addition, an embodiment including both the substrate transfer module and the inspection unit transfer module is possible.

The substrate S loaded on the upper surface of the mounting portion 505c can be gripped by the chuck 512. The chuck 512 may be an electrostatic chuck, a sticky chuck or a gecko chuck, and various other kinds of chucks may be applied. The chuck 512 holding the substrate S is transported horizontally along the guide rail unit 511.

While the substrate S is transferred in the horizontal direction by the chuck 512 and the guide rail unit 511, the substrate S passes over the line scan unit 509 and the area scan unit 510. In another embodiment, the line scan unit and the area scan unit may be installed above the chamber.

The line scanning unit 509 (first inspection unit) is a unit that primarily inspects the surface of the substrate S. As shown in FIG. The area scan unit 510 (second inspection unit) is a unit for more precisely inspecting a portion determined to be defective in the inspection by the line scan unit 509. It will be described in more detail below.

The air inside the inspection chamber 504 may be evacuated using the vacuum pump 513 (or the vacuum unit) to obtain a vacuum state. The air conditioning unit 514 may be used to increase or decrease the temperature inside the inspection chamber 504 to a required temperature.

The holding force of the substrate S passing through the line scan unit 509 and the area scan unit 510 is released above the mounting portion 555c of the second lifting unit 555. Accordingly, the substrate S is separated from the chuck 512 and loaded on the mounting portion 555c. Subsequently, the mounting portion 555c is lowered by the lifting driving portion 555d. As the support pin 556a penetrates the through hole of the loading part 555c so that the robot arm can hold the substrate, the substrate S is moved to the upper end of the support pin 556a. Meanwhile, the robot arm carried through the gate valve 518 opened by the damper 519 and carried in from the third conveying chamber 610 grips the substrate S loaded on the upper end of the support pin 556a to inspect the inspection chamber. The transfer from the 504 to the third transfer chamber 610. The second lifting units 555a to 555d may be provided in a substantially similar configuration to the first lifting units 505a to 505d. The second alignment units 557a to 557b may be provided in a substantially similar configuration to the first alignment units 507a to 507b.

In another embodiment, the second alignment unit may be omitted.

7 is a schematic partial cross-sectional view of a third buffer chamber A-A 'in an OLED manufacturing apparatus including a substrate inspection apparatus according to another embodiment of the present invention. The same reference numerals are used for constituent elements substantially the same as those of FIG. 4.

As shown in FIG. 7, the present embodiment further includes a bypass module 561 inside the inspection chamber 504. When the bypass module 561 uses a sampling test method that does not inspect all the boards but inspects some boards, the other board does not check while the board is being inspected. The bypass module 561 is used as it is.

That is, while a substrate is gripped by the chuck 512 and transferred along the guide rail 511, another substrate carried through the gate valve 516 by the robot arm during the substrate inspection is bypass module 561. It is loaded on the upper surface of the conveyor can be transferred to the opposite gate valve 518. The bypass module 561 may include a conveyor method as well as a method in which a separate robot arm grips and transfers a substrate, and is attached to a separate chuck (adhesive chuck, electrostatic chuck, gecko chuck, etc.) along a guide rail. It may also include the manner in which it is conveyed.

8 is a schematic cross-sectional view of each line scan unit that may be applied to a substrate inspection apparatus according to an exemplary embodiment of the present invention.

In FIG. 8A, a viewport is installed in a through hole formed in a chamber wall, and a lens is positioned outside the chamber. Light irradiated from the light source (inspection light) may be installed to form an optical path that passes through the beam splitter and then passes through the lens and viewport to the substrate.

In FIG. 8B, a lens is installed in the chamber, a viewport is installed in a through hole formed in the chamber wall, and a beam splitter is located outside the chamber. Thereby, the light irradiated from the light source (inspection light) may pass through the beam splitter and then pass through the viewport first and then pass through the lens to form an optical path reaching the substrate.

8 (c) shows a through-hole formed in the chamber wall without a separate viewport, a lens is installed to serve as a viewport. Accordingly, the light (inspection light) irradiated from the light source may be installed to form an optical path that passes through the beam splitter and then immediately passes through the lens to the substrate.

9 is a schematic enlarged cross-sectional view of the line scanning unit of the substrate inspection apparatus according to the embodiment of the present invention as viewed in the Y-axis direction.

As shown in FIG. 9, the present embodiment is an embodiment to which the configuration corresponding to FIG. 8A is applied. The line scan mounting portion 504a of the inspection chamber 504 is a wall protruding toward the inside of the chamber, and a viewport mounting portion 504b penetrated to the viewport 504c is formed at the upper end thereof. The line scan camera 509a, the lens 509b, and the beam splitter 509c may be installed in the line scan installation unit 504a. Accordingly, the light irradiated from the light source (not shown) passes through the beam splitter 509c and enters into the inspection chamber 504 through the viewport 504c, and the light reflected from the substrate is returned to the viewport 504c and the beam splitter. 509c passes through the lens 509b to reach the line scan camera 509a. That is, the beam splitter 509c is positioned on the optical path between the line scan camera 509a and the substrate, transmits incident light (inspection light) to the substrate, and transmits the light reflected from the substrate to the line scan camera 509a. Will be sent to.

10 is a schematic enlarged cross-sectional view of the line scan unit of the substrate inspection apparatus according to the embodiment of the present invention as viewed in the X-axis direction.

As shown in FIG. 10, the present embodiment is a moving module that allows the beam splitter 509c, the lens 509b, and the line scan camera 509a of FIG. 9 to inspect the substrate while moving in the forward or reverse direction of the Y-axis integrally. (Not shown) further. That is, the presence or absence of defects is examined for the entire area of the substrate while moving in the Y-axis forward direction or the reverse direction in parallel with the substrate (the traveling direction of the substrate is the X-axis direction).

11 is a schematic cross-sectional view for each type of area scan unit applicable to a substrate inspection apparatus according to an exemplary embodiment of the present invention.

In FIG. 11A, a viewport is installed in a through hole formed in a chamber wall, and a lens is located outside the chamber. The autofocusing beam passes through the lens and viewport through the beam splitter and reaches the substrate, thereby making it possible to measure the focal length. Then, the light irradiated from the light source may pass through the beam splitter and then pass through the lens and the viewport to form a light path reaching the substrate. The lens can move up and down for focusing.

In FIG. 11B, a lens is installed in the chamber, a viewport is installed in a through hole formed in the chamber wall, and a beam splitter is located outside the chamber. Accordingly, the light emitted from the light source may pass through the beam splitter, pass through the viewport, and then pass through the lens to form a light path reaching the substrate. The lens can move up and down for focusing.

In FIG. 11C, a lens is installed inside the chamber, and the lens may move left and right as well as up and down directions. Two mirrors (reflective members) (one reflects the light passing through the viewport in the horizontal direction and the other reflects the reflected light into the lens) so that the light can be transmitted even if the lens moves left and right inside the chamber. Can be installed.

In FIG. 11D, a lens is installed outside the chamber, and the lens may move left and right as well as up and down directions. Two mirrors (one reflecting the light passing through the beam splitter in the horizontal direction and the other reflecting the reflected light into the lens) can be installed outside the chamber so that the light can be transmitted even if the lens moves left and right. have.

12 is a schematic cross-sectional view of the area scanning unit of the substrate inspection apparatus according to the embodiment of the present invention, viewed in the Y-axis direction.

13 is a schematic cross-sectional view of the area scan unit of the substrate inspection apparatus according to the embodiment of the present invention as viewed in the X-axis direction.

As shown in FIG. 12 and FIG. 13, this embodiment is an embodiment to which the configuration corresponding to FIG. 11D is applied. This embodiment includes a focusing unit to irradiate a substrate with a focusing beam (autofocusing beam) (focusing light) so that the area scanning unit 510 can measure a focal length to a point necessary for photographing. The focusing unit includes an autofocusing light source (not shown), a second beam splitter 510d, and a lifting unit (not shown) for elevating the second lens 510g.

The area scan installation part 504d of the inspection chamber 504 is a wall which protrudes toward the inside of the chamber, and the viewport installation part 504e which penetrated so that the viewport 504f can be installed in the upper end part is formed. Inside the area scan installation part 504d, an area scan camera 510a, a first lens 510b, a first beam splitter 510c, a second beam splitter 510d, a first mirror 510e (first reflecting member) ), A second mirror 510f (second reflecting member), and a second lens 510g may be installed. Accordingly, the auto focusing beam (focusing light) (focus control light) irradiated from the auto focusing light source (not shown) is transmitted to the second beam splitter 510d, the first mirror 510e, the second mirror 510f, and the second. It passes through the lens 510g and the viewport 504f in order to reach the substrate. The reflected autofocusing beam then passes through the optical path in the reverse order to the camera. The focal length is calculated by analyzing the auto focusing beam received by the camera. The focal length may be adjusted by elevating the second lens 510g based on the calculated focal length.

Since the resolution of the image acquired by the line scan unit is lower than that of the area scan unit, the need for adjusting the focal length is low. Of course, in the line scan unit, an additional unit for adjusting the focal length may be installed. In order to save the time to adjust the focal length, even if shooting based on a fixed value (focal length) by the preset value may not be a big problem. However, since the area scanning unit 510 performs shooting in high resolution, it is necessary to adjust the focal length every time shooting. If the installation accuracy of the scan unit is very high, the unit for measuring and adjusting the focal length may be omitted.

When the focal length is adjusted, the light (inspection light) irradiated from a light source (not shown) is transmitted to the first beam splitter 510c, the second beam splitter 510d, the first mirror (first reflecting member) 510e, and the second. It passes through the mirror (second reflecting member) 510f, the second lens 510g, and the viewport 504f in order to reach the substrate. The light reflected from the substrate (inspection light) proceeds in the reverse order to reach the area scan camera 510a.

When the coordinates of the portion determined to be defective in the line scan unit 509 are transmitted through a controller (not shown), the area scan unit 510 moves to the coordinates and photographs at a higher resolution. In this case, the second mirror 510f and the second lens 510g integrally move in a forward or reverse direction of the Y-axis, and include a parallel mover (not shown) for parallel movement so as to approach a coordinate to be photographed. Of course, embodiments in which the entire area scan unit 510 is movable are also possible. That is, the controller (not shown) controls the line scan unit 509 to photograph the substrate, calculates coordinates of the defective point based on the image secured by the line scan unit 509, and scans the area scan unit 510. It can be controlled to photograph the coordinates of the bad point.

An embodiment of the present invention described above and illustrated in the drawings should not be construed as limiting the technical idea of the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and those skilled in the art will be able to modify the technical idea of the present invention in various forms. Accordingly, such improvements and modifications will fall within the scope of the present invention as long as they are obvious to those skilled in the art.

Claims (17)

A first chamber;
A first buffer chamber connected to the first chamber so that the substrate carried out from the first chamber is carried in;
A second chamber connected to the first buffer chamber so that the substrate carried out from the first buffer chamber is carried in; And
And an inspection unit installed in the first buffer chamber to perform inspection of the substrate loaded into the first buffer chamber. The method of claim 1,
The OLED manufacturing apparatus of claim 1, further comprising a repair chamber which is carried out from the first buffer chamber after the substrate determined to be defective in the inspection unit to repair the defective portion. The method of claim 2,
And the repair chamber is connected to the first buffer chamber as a separate chamber from the first and second chambers. The method of claim 2,
And the repair chamber is at least one of the first chamber, the second chamber, a third chamber connected to the first chamber, and a fourth chamber connected to the second chamber. 5. The method of claim 4,
The first chamber includes a first robot arm to carry the substrate in and out of the third chamber, and the second chamber includes a second robot arm to carry the substrate in and out of the fourth chamber. Manufacturing equipment. The method of claim 1,
The apparatus further includes a second buffer chamber connected to the first chamber to allow the substrate to be carried out into the first chamber and to transfer the substrate determined to be defective in the inspection unit to the second buffer chamber. And a transfer chamber connected to the first buffer chamber and the other side connected to the second buffer chamber. The method of claim 1,
A support pin is installed in the first buffer chamber to support the substrate carried in the first buffer chamber from the first chamber, and a through hole is formed to allow the support pin to be inserted therethrough. An OLED manufacturing apparatus further comprising a loading unit on which a substrate can be loaded, wherein at least one of the support pin and the loading unit is liftable. The method of claim 1,
And an alignment unit for aligning the substrate loaded into the first buffer chamber. The method of claim 1,
A substrate transfer module which transfers the substrate loaded into the first buffer chamber into the first buffer chamber so that the inspection unit can photograph a predetermined region of the substrate, and transfers the inspection unit into the first buffer chamber. OLED manufacturing apparatus comprising at least any one of the inspection unit transfer module to enable the inspection unit to photograph a predetermined region of the substrate. The method of claim 1,
And a bypass module for transferring the second substrate so that the second substrate and the second substrate different from the first substrate can be taken out to the second chamber without the inspection unit being inspected while the inspection unit inspects the first substrate. OLED manufacturing apparatus. The method of claim 1, wherein the inspection unit
A first inspection unit;
Second inspection unit; And
Control the first inspection unit to photograph the substrate, calculate coordinates of the defective point based on the image obtained from the first inspection unit, and control the second inspection unit to photograph the coordinates of the defective point OLED manufacturing apparatus comprising a control unit. The method of claim 11, wherein the first inspection unit
A first camera; And
And a first beam splitter positioned on an optical path between the first camera and the substrate and transferring the incident light toward the substrate and transmitting the light reflected from the substrate to the first camera. The method of claim 12, wherein the inspection unit
And a moving module to move the first camera and the first beam splitter in a parallel direction with respect to a substrate. The method of claim 11, wherein the second inspection unit
An OLED manufacturing apparatus further comprising a focusing unit for irradiating a focusing beam to a substrate so as to measure a focal length to a point where photography is required. The method of claim 11, wherein the second inspection unit
A second camera;
A first reflecting member positioned on an optical path between the second camera and the substrate;
A second beam splitter which transmits incident light to the first reflecting member and transmits light reflected from the first reflecting member to the second camera; And
And a third beam splitter configured to transfer the incident focusing beam to the first reflecting member and to transfer the focusing beam reflected from the first reflecting member to the second camera. The method of claim 15, wherein the second inspection unit
And a second reflecting member which transmits the light transmitted from the first reflecting member to the substrate and transmits the light reflected from the substrate to the first reflecting member, wherein the second reflecting member moves in parallel with the substrate. OLED manufacturing equipment possible. The method of claim 1,
And a vacuum unit to form a vacuum in the first buffer chamber while performing the inspection of the substrate loaded into the first buffer chamber.

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