KR20120126269A - Wafer processing apparatus - Google Patents

Wafer processing apparatus Download PDF

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Publication number
KR20120126269A
KR20120126269A KR1020110043932A KR20110043932A KR20120126269A KR 20120126269 A KR20120126269 A KR 20120126269A KR 1020110043932 A KR1020110043932 A KR 1020110043932A KR 20110043932 A KR20110043932 A KR 20110043932A KR 20120126269 A KR20120126269 A KR 20120126269A
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South Korea
Prior art keywords
support plate
support
counterpart
wafer processing
processing apparatus
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KR1020110043932A
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Korean (ko)
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KR101235337B1 (en
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이병일
이경복
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주식회사 테라세미콘
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Abstract

PURPOSE: A wafer processing apparatus is provided to reduce the generation of error by dually supporting a supporting plate and combining the supporting plate with an object. CONSTITUTION: A supporting plate(110) is combined with an object(200). An opening part(112) is formed on the supporting plate. A stage is combined with a section of the supporting plate which is adjacent to the opening part. An FOUP(Front Opening Unified Pod) storing a wafer is loaded in the stage. A door(130) is installed on the supporting plate which can ascend and descend. The door is detachably combined with a cover of the FOUP. The door opens and closes the opening part while lifting the cover in order to connect or block the opening part to an internal space of the FOUP.

Description

웨이퍼 처리 장치 {WAFER PROCESSING APPARATUS}Wafer Processing Equipment {WAFER PROCESSING APPARATUS}

본 발명은 웨이퍼 처리 장치의 수평 상태를 맞추어서 상대물에 결합할 때, 2중으로 지지하여 상대물에 결합할 수 있는 웨이퍼 처리 장치에 관한 것이다.The present invention relates to a wafer processing apparatus that can be double-supported and bonded to the counterpart when the wafer processing apparatus is coupled to the counterpart while keeping the horizontal state of the wafer processing apparatus.

전방 개구부 인터페이스 기계적 표준(FIMS: Front-opening Interface Mechanical Standard)(이하, "FIMS"라 함) 시스템은, 반도체 제조 공정에 있어서, 세계 반도체 제조 장비 재료 협회(SEMI: Semiconductor Equipment and Materials International)에서 권고하는 표준안이다.Front-opening Interface Mechanical Standard (FIMS) systems (hereinafter referred to as "FIMS") systems are recommended by the World Semiconductor Equipment and Materials International (SEMI) for semiconductor manufacturing processes. It is a standard.

FIMS 시스템에는 웨이퍼(Wafer) 또는 레티클(Reticle) 등을 자동으로 반송하는 로더(Loader)라는 웨이퍼 처리 장치가 사용된다. 로더는 로봇아암을 매개로 웨이터가 적재 저장된 풉(FOUP: Front Opening Unified Pod)을 FIMS 시스템의 다음 공정을 위한 필요처로 전달한다.In the FIMS system, a wafer processing apparatus called a loader which automatically conveys a wafer or a reticle is used. The loader delivers the FOUP (Front Opening Unified Pod) via the robot arm to the next stage of the FIMS system.

즉, 로더는 웨이퍼를 FIMS 시스템의 이송장치인 로봇 등으로 넘겨주는 인터페이스 장치로써, SMIF(Standard Mechanical Interface) 시스템을 구성하는 장비에 포함된다. SMIF는 웨이퍼 제조 공정 중 발생하는 공기 중의 미세 오염물질인 파티클의 차단에 대해 최소한의 공통 규격을 제안하고 있다.That is, the loader is an interface device that delivers a wafer to a robot, which is a transfer device of a FIMS system, and is included in equipment that constitutes a standard mechanical interface (SMIF) system. SMIF proposes a minimum common standard for the blocking of particles, air pollutants generated during the wafer manufacturing process.

웨이퍼 처리 장치인 로더는, 개방부가 형성되며 상대물인 상기 FIMS 시스템의 어느 장치에 결합되는 지지판, 상기 지지판에 결합되며 풉이 탑재 지지되는 스테이지, 상기 지지판에 결합되어 상기 개방부를 개폐함과 동시에 상기 풉의 커버를 개폐하는 도어 등을 포함한다.The loader, which is a wafer processing apparatus, includes a support plate having an opening formed therein and coupled to any device of the FIMS system as a counterpart, a stage coupled to the support plate and supported by mounting a pull, coupled to the support plate to open and close the opening and simultaneously Door to open and close the cover.

상기와 같은 종래의 웨이퍼 처리 장치는 상기 지지판을 상대물에 결합할 때, 상기 스테이지 등에 놓인 수평계를 보면서 상기 상대물에 대한 상기 지지판의 수평을 맞춘 후, 지그로 상기 지지판을 지지한 다음, 상기 지지판을 상기 상대물에 결합한다. 즉, 상기 지그로만 상기 지지판을 지지한 상태에서 상기 지지판을 상기 상대물에 결합한다. 이로 인해, 상기 상대물에 대한 상기 지지판의 수평도가 오차 범위 밖인 경우가 종종 발생하여, 웨이퍼 처리 공정시, 에러가 발생하는 단점이 있었다.In the conventional wafer processing apparatus as described above, when the support plate is coupled to the counterpart, the support plate is leveled with respect to the counterpart while looking at the level placed on the stage, and then the support plate is supported by a jig. To the counterpart. That is, the support plate is coupled to the counterpart while the support plate is supported only by the jig. For this reason, the level of the support plate relative to the counterpart is often out of the error range, and an error occurs in the wafer processing process.

본 발명은 상기와 같은 종래 기술의 문제점을 해소하기 위하여 안출된 것으로, 본 발명의 목적은 지지판을 이중으로 지지하여 지지판을 정확한 수평 상태로 상대물에 결합함으로써, 웨이퍼 처리 공정시, 에러의 발생을 줄일 수 있는 웨이퍼 처리 장치를 제공함에 있다.The present invention has been made in order to solve the problems of the prior art as described above, an object of the present invention is to support the support plate in a double, the support plate is bonded to the counterpart in an accurate horizontal state, the occurrence of errors in the wafer processing process It is to provide a wafer processing apparatus that can be reduced.

상기 목적을 달성하기 위한 본 발명에 따른 웨이퍼 처리 장치는, 상대물에 결합되며 개방부가 형성된 지지판; 상기 개방부와 인접하는 상기 지지판의 부위에 결합되며 웨이퍼가 적재 저장된 풉(FOUP: Front Opening Unified Pod)이 탑재 지지되는 스테이지; 상기 개방부측 상기 지지판에 승강가능하게 설치되고, 상기 풉의 커버에 착탈가능하게 결합되며, 승강하면서 상기 개방부를 개폐함과 동시에 상기 커버를 승강시켜 상기 풉의 내부 공간을 상기 개방부와 연통 또는 차단시키는 도어; 및 상기 상대물이 설치된 바닥에 대하여 상기 지지판을 수평 상태로 맞추어 상기 지지판을 상기 상대물에 결합할 때, 상기 지지판의 일측을 상기 상대물에 접촉시켜 상기 지지판을 지지하는 수단을 포함한다.Wafer processing apparatus according to the present invention for achieving the above object, a support plate coupled to the counterpart and formed with an opening; A stage coupled to a portion of the support plate adjacent to the opening and mounted and supported by a front opening Unified Pod (FOUP) loaded and stored with a wafer; The opening part is installed on the support plate in a liftable manner, is detachably coupled to the cover of the spool, opens and closes the opening while lifting, and lifts the cover to communicate or block the inner space of the spool with the opening. Letting doors; And means for supporting the support plate by bringing one side of the support plate into contact with the counterpart when the support plate is coupled to the counterpart by setting the support plate in a horizontal state with respect to the bottom on which the counterpart is installed.

상기 수단은 상기 지지판에 승강가능하게 설치되어 일측이 상기 상대물과 접촉하는 지지핀을 포함할 수 있다.The means may include a support pin which is installed to be liftable on the support plate and one side is in contact with the counterpart.

상기 지지핀은 적어도 2개 마련되어 상호 간격을 가질 수 있다.At least two support pins may be provided to have a mutual gap.

상기 지지판에는 상기 지지핀이 삽입 지지되는 지지블럭이 설치될 수 있다.The support plate may be provided with a support block in which the support pin is inserted and supported.

하나의 상기 지지블럭에 복수의 상기 지지핀이 삽입 지지될 수 있다.A plurality of the support pins may be inserted and supported in one of the support blocks.

상기 지지핀은 정역 회전함에 따라 상기 지지블럭의 상하측으로 승강할 수 있다.The support pin may move up and down of the support block as it rotates forward and backward.

본 발명에 따른 웨이퍼 처리 장치는, FIMS 시스템이 설치된 바닥에 대하여 지지판의 수평을 맞추어서 지지판을 상대물에 결합할 때, 지그로 지지판을 지지할 뿐만 아니라 지지판의 일측이 상대물에 지지된다. 즉, 지지판이 이중으로 지지되므로, 지지판이 정확한 수평도를 유지하면서 상대물에 결합된다. 따라서, 웨이퍼 처리 공정시 에러의 발생이 감소하는 효과가 있다.In the wafer processing apparatus according to the present invention, when the support plate is coupled to the counterpart by leveling the support plate with respect to the floor on which the FIMS system is installed, not only the support plate is supported by the jig but also one side of the support plate is supported on the counterpart. That is, since the support plate is supported in duplicate, the support plate is coupled to the counterpart while maintaining the correct horizontality. Therefore, there is an effect that the occurrence of errors in the wafer processing process is reduced.

도 1은 본 발명의 일 실시예에 따른 웨이퍼 처리 장치의 사시도.
도 2는 도 1에 도시된 "A"부 확대도.
도 3a 및 도 3b는 본 발명의 일 실시예에 따른 웨이퍼 처리 장치를 상대물에 결합하는 것을 보인 정면도.1 is a perspective view of a wafer processing apparatus according to an embodiment of the present invention.
2 is an enlarged view of a portion “A” shown in FIG. 1.
3A and 3B are front views illustrating coupling a wafer processing apparatus to a counterpart according to an embodiment of the present invention.

후술하는 본 발명에 대한 상세한 설명은, 본 발명이 실시될 수 있는 특정 실시예를 예시하여 도시한 첨부 도면을 참조한다. 이들 실시예는 당업자가 본 발명을 실시할 수 있도록 충분히 상세하게 설명된다. 본 발명의 다양한 실시예는 상호 다르지만 상호 배타적일 필요는 없음이 이해되어야 한다. 예를 들어, 여기에 기재되어 있는 특정 형상, 특정 구조 및 특성은 실시예와 관련하여 본 발명의 정신 및 범위를 벗어나지 않으면서 다른 실시예로 구현될 수 있다. 또한, 각각의 개시된 실시예 내의 개별 구성요소의 위치 또는 배치는 본 발명의 정신 및 범위를 벗어나지 않으면서 변경될 수 있음이 이해되어야 한다. 따라서, 후술하는 상세한 설명은 한정적인 의미가 아니며, 본 발명의 범위는, 적절하게 설명된다면, 그 청구항들이 주장하는 것과 균등한 모든 범위와 더불어 첨부된 청구항에 의해서만 한정된다. 도면에 도시된 실시예들의 길이, 면적, 두께 및 형태는, 편의상, 과장되어 표현될 수도 있다.DETAILED DESCRIPTION OF THE INVENTION The following detailed description of the invention refers to the accompanying drawings that illustrate specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It should be understood that the various embodiments of the present invention are mutually exclusive, but need not be mutually exclusive. For example, certain shapes, specific structures, and features described herein may be embodied in other embodiments without departing from the spirit and scope of the invention in connection with the embodiments. It is also to be understood that the position or arrangement of the individual components within each disclosed embodiment may be varied without departing from the spirit and scope of the invention. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present invention is defined only by the appended claims, along with the full scope of equivalents to which such claims are entitled. The length, area, thickness, and shape of the embodiments shown in the drawings may be exaggerated for convenience.

이하, 첨부된 도면을 참조하여 본 발명의 일 실시예에 따른 웨이퍼 처리 장치를 상세히 설명한다.Hereinafter, a wafer processing apparatus according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

도 1은 본 발명의 일 실시예에 따른 웨이퍼 처리 장치의 사시도이다.1 is a perspective view of a wafer processing apparatus according to an embodiment of the present invention.

도시된 바와 같이, 웨이퍼 처리 장치는 사각 형상으로 형성되어 FIMS(Front-opening Interface Mechanical Standard) 시스템의 어느 장치인 상대물(200)에 결합되는 지지판(110)을 포함한다. 지지판(110)은 상대물(200)이 설치된 바닥에 대하여 수직을 이루면서 상대물(200)에 결합되며, 개방부(112)가 형성된다.As shown, the wafer processing apparatus includes a support plate 110 that is formed in a rectangular shape and coupled to the counterpart 200, which is a device of a front-opening interface mechanical standard (FIMS) system. The support plate 110 is coupled to the counterpart 200 while being perpendicular to the floor on which the counterpart 200 is installed, and an opening 112 is formed.

개방부(112) 하측의 지지판(110)의 전면 부위에는 스테이지(120)가 결합되고, 스테이지(120)에는 웨이퍼(미도시)가 적재 저장되는 풉(FOUP: Front Opening Unified Pod)(51)이 탑재 지지된다.The stage 120 is coupled to the front portion of the support plate 110 below the opening 112, and the stage 120 has a front opening Unified Pod (FOUP) 51 in which a wafer (not shown) is loaded and stored. Mounted and supported.

풉(51)의 전면은 개방되어 커버(51a)가 결합되고, 커버(51a)는 후술할 도어(130)에 의하여 승강 운동하면서 풉(51)의 내부 공간을 개방부(112)와 연통 또는 차단시킨다.The front surface of the pull 51 is opened so that the cover 51a is coupled, and the cover 51a communicates or blocks the internal space of the pull 51 with the opening 112 while lifting and lowering by the door 130 to be described later. Let's do it.

스테이지(120)에는 풉(51)의 하면에 형성된 삽입공(미도시)에 삽입되어 풉(51)을 지지하는 복수의 지지핀(121), 풉(51)의 위치를 감지하는 센서(123), 회전 및 승강가능하게 설치되며 스테이지(120)에 탑재된 풉(51)을 스테이지(120)측으로 압착하여 풉(51)을 지지하는 클램퍼(125)를 가진다.The stage 120 is inserted into an insertion hole (not shown) formed in the lower surface of the pull 51 to support the pull 51, the plurality of support pins 121 and the sensor 123 for detecting the position of the pull 51. And a clamp 51 which is installed to be rotatable and liftable and is mounted on the stage 120 to press the pull 51 toward the stage 120 to support the pull 51.

개방부(112)가 형성된 지지판(110)의 후면에는 도어(130)가 승강가능하게 설치되어, 커버(51a)에 착탈가능하게 결합된다. 도어(130)는 실린더(미도시) 또는 모터(미도시) 등과 같은 구동수단에 의하여 승강한다.The door 130 is provided on the rear side of the support plate 110 in which the opening part 112 is formed, and is detachably coupled to the cover 51a. The door 130 is elevated by driving means such as a cylinder (not shown) or a motor (not shown).

도어(130)에는 래치(131)가 설치되고, 래치(131)는 커버(51a)에 형성된 래치홈(미도시)에 삽탈된다. 상세히 설명하면, 풉(51)이 스테이지(120)에 탑재되면, 풉(51)의 커버(51a)가 도어(130)에 밀착되고, 래치(131)는 상기 래치홈에 삽입 결합된다. 그리고, 래치(131)가 회전하여, 풉(51)에 대한 커버(51a)의 잠금 상태를 해제한 다음, 도어(130)가 하강하면, 커버(51a)도 함께 하강한다. 그러면, 도어(130)에 의하여 개방부(112)가 개방되고, 커버(51a)에 의하여 풉(51)의 내부 공간이 개방부(112)와 연통된다.A latch 131 is installed in the door 130, and the latch 131 is inserted into a latch groove (not shown) formed in the cover 51a. In detail, when the pull 51 is mounted on the stage 120, the cover 51a of the pull 51 is brought into close contact with the door 130, and the latch 131 is inserted into the latch groove. Then, when the latch 131 rotates to release the lock state of the cover 51a with respect to the release 51, and the door 130 descends, the cover 51a also descends together. Then, the opening part 112 is opened by the door 130, and the inner space of the fulcrum 51 communicates with the opening part 112 by the cover 51a.

개방부(112) 및 풉(51)의 내부 공간이 개방되면, FIMS(Front-opening Interface Mechanical Standard) 시스템 내의 로봇(미도시)이 상기 웨이퍼를 다음 공정을 위한 필요처로 반송한다.When the inner space of the opening 112 and the pull 51 is opened, a robot (not shown) in the front-opening interface mechanical standard (FIMS) system conveys the wafer to the required place for the next process.

도어(130)가 상승하면, 커버(51a)도 함께 상승한다. 그러면, 도어(130)에 의하여 개방부(112)가 폐쇄되고, 커버(51a)에 의하여 풉(51)의 내부 공간이 폐쇄된다. 커버(51a)에 의하여 풉(51)의 내부 공간이 폐쇄되면, 풉(51)에 대하여 커버(51a)가 잠긴다.When the door 130 rises, the cover 51a also rises together. Then, the opening part 112 is closed by the door 130, and the inner space of the pull 51 is closed by the cover 51a. When the inner space of the pull 51 is closed by the cover 51a, the cover 51a is locked to the pull 51.

개방부(112)의 내주면측에는 커버(51a)측 풉(51)의 외면에 밀착되어, 풉(51)의 내부 공간이 개방되었을 때, 이물질이 풉(51)의 내부로 유입되는 것을 방지하는 실링부재(미도시)가 설치된다. 그리고, 도어(130)와 풉(51)을 견고하게 밀착시키기 위하여, 도어(130)에는 풉(51)의 커버(51a)를 흡착하는 흡착패드(133)가 설치된다. 흡착패드(133)는 진공으로 커버(51a)를 흡착한다.The inner circumferential surface side of the opening portion 112 is in close contact with the outer surface of the cover 51a side spool 51, and when the inner space of the spool 51 is opened, a seal for preventing foreign matter from entering the interior of the spool 51. A member (not shown) is provided. In addition, in order to firmly adhere the door 130 and the pull 51, the door 130 is provided with a suction pad 133 for sucking the cover 51a of the pull 51. The suction pad 133 sucks the cover 51a in a vacuum.

지지판(110)은 상기 바닥에 대하여 수직을 이루면서 상대물(200)에 결합된다. 이때, 지지판(110)이 상기 바닥에 대하여 수평을 이루면서 상대물(200)에 결합되지 않으면, 스테이지(120)에 탑재된 풉(51)이 기울어진 상태가 되므로, 웨이퍼 처리 공정시, 에러가 발생할 수 있다.The support plate 110 is coupled to the counterpart 200 while being perpendicular to the bottom. At this time, when the support plate 110 is not horizontally coupled to the counterpart 200 while being horizontal to the bottom, the pull 51 mounted on the stage 120 is inclined, so that an error may occur during the wafer processing process. Can be.

본 실시예에 따른 웨이퍼 처리 장치에는 지지판(110)의 수평을 맞추어서 지지판(110)을 상대물(200)에 결합할 때, 지지판(110)의 일측을 상대물(200)에 접촉시켜 지지판(110)을 지지하는 수단이 마련된다. 이를 도 1 및 도 2를 참조하여 설명한다. 도 2는 도 1에 도시된 "A"부 확대도이다.In the wafer processing apparatus according to the present embodiment, when the support plate 110 is coupled to the counterpart 200 by leveling the support plate 110, one side of the support plate 110 contacts the counterpart 200 to support the support plate 110. Means are provided. This will be described with reference to FIGS. 1 and 2. FIG. 2 is an enlarged view of a portion “A” shown in FIG. 1.

상기 수단은 지지판(110)에 승강가능하게 설치되어 하단부가 상대물(200)과 접촉하는 지지핀(141)을 포함한다. 지지핀(141)은 지지판(110)에 설치된 지지블럭(145)에 삽입 지지되며, 지지핀(141)을 지지블럭(145)에 삽입한 상태에서, 지지핀(141)을 정방향 또는 역방향으로 회전시키면 지지핀(141)이 승강한다. 이를 위하여, 지지핀(141)의 외주면 및 지지블럭(145)에는 상호 맞물리는 치(齒)가 형성된다.The means includes a support pin 141 which is installed to be elevated on the support plate 110 and has a lower end in contact with the counterpart 200. The support pin 141 is inserted and supported by the support block 145 installed on the support plate 110, and the support pin 141 is rotated in the forward or reverse direction while the support pin 141 is inserted into the support block 145. The support pin 141 is raised and lowered. To this end, the outer peripheral surface of the support pin 141 and the support block 145 is formed with the teeth interlocking with each other.

지지핀(141)은 적어도 2개 마련되어 상호 간격을 가지는 것이 바람직하다. 그리고, 하나의 지지블럭(145)에 복수의 지지핀(141)의 삽입 지지될 수도 있다.At least two support pins 141 may be provided to have a mutual gap therebetween. In addition, the plurality of support pins 141 may be inserted and supported in one support block 145.

도 1 및 도 2에는 지지핀(141)과 지지블럭(145)이 지지판(110)의 전면 하부 좌측(도 3a 및 도 3b) 및 우측에 설치된 것을 도시하고 있으나, 지지핀(141)과 지지블럭(145)은 상대물(200)의 구조에 따라 지지판(110)의 다양한 부위에 설치될 수 있다.1 and 2 show that the support pins 141 and the support block 145 are installed on the lower left front side (FIGS. 3A and 3B) and the right side of the support plate 110, but the support pins 141 and the support block are shown. The 145 may be installed at various portions of the support plate 110 according to the structure of the counterpart 200.

도 1의 미설명 부호 150 웨이퍼 처리 장치를 제어하는 콘트롤 박스이다.It is a control box which controls the 150 description of the wafer processing apparatus of FIG.

도 3a 및 도 3b는 본 발명의 일 실시예에 따른 웨이퍼 처리 장치를 상대물에 결합하는 것을 보인 정면도로서, 이를 설명한다.3A and 3B are front views illustrating the coupling of a wafer processing apparatus to a counterpart according to an embodiment of the present invention.

도 3a에 도시된 바와 같이, 웨이퍼 처리 장치의 지지판(110)을 지그(미도시)로 지지하여, 지지판(110)이 결합될 상대물(200)의 부위에 위치시킨 다음, 지지핀(141)의 하단부를 상대물(200)의 소정 부위에 접촉시킨다.As shown in FIG. 3A, the support plate 110 of the wafer processing apparatus is supported by a jig (not shown), and the support plate 110 is positioned at a portion of the counterpart 200 to which the support plate 110 is to be coupled, and then the support pin 141. The lower end of the contact with a predetermined portion of the counterpart 200.

도 3a의 상태에서, 웨이퍼 처리 장치의 소정 부위에 놓인 수평계(미도시)를 보면서, 지지핀(141)을 회전시켜 지지판(110)의 수평을, 도 3b에 도시된 바와 같이, 맞춘다. 지지판(110)의 수평이 맞으면 체결부재(115)를 이용하여 지지판(110)을 상대물(200)에 체결하면 된다.In the state of FIG. 3A, the support pin 141 is rotated to align the level of the support plate 110, as shown in FIG. 3B, while looking at a horizontal system (not shown) placed on a predetermined portion of the wafer processing apparatus. When the level of the support plate 110 is aligned, the support plate 110 may be fastened to the counterpart 200 using the fastening member 115.

본 실시예에 따른 웨이퍼 처리 장치는 FIMS 시스템이 설치된 상기 바닥에 대하여 지지판(110)의 수평을 맞추어서 지지판(110)을 상대물(200)에 결합할 때, 상기 지그에 의하여 지지판(110)이 지지될 뿐만 아니라, 지지판(110)의 일측이 상대물(200)에 지지된다. 즉, 지지판(110)을 이중으로 지지하여, 지지판(110)의 수평을 맞추어 지지판(110)을 상대물(200)에 결합하므로, 지지판(110)이 정확한 수평도를 유지하면서 상대물(200)에 결합된다.In the wafer processing apparatus according to the present embodiment, the support plate 110 is supported by the jig when the support plate 110 is coupled to the counterpart 200 by leveling the support plate 110 with respect to the bottom on which the FIMS system is installed. In addition, one side of the support plate 110 is supported by the counterpart 200. That is, by supporting the support plate 110 in a double, the support plate 110 is coupled to the counterpart 200 by leveling the support plate 110, so that the support plate 110 maintains the correct level of the counterpart 200. Is coupled to.

이상에서는, 본 발명의 실시예들에 따라 본 발명을 설명하였지만, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자가 본 발명의 기술적 사상을 벗어나지 않는 범위 내에서 변경 및 변형한 것도 본 발명에 속함은 당연하다.In the above, the present invention has been described in accordance with the embodiments of the present invention, but those skilled in the art to which the present invention belongs, the changes and modifications within the scope without departing from the spirit of the present invention. Of course.

110: 지지판 120: 스테이지
130: 도어 141: 지지핀
145: 지지블럭110: support plate 120: stage
130: door 141: support pin
145: support block

Claims (6)

상대물에 결합되며 개방부가 형성된 지지판;
상기 개방부와 인접하는 상기 지지판의 부위에 결합되며 웨이퍼가 적재 저장된 풉(FOUP: Front Opening Unified Pod)이 탑재 지지되는 스테이지;
상기 개방부측 상기 지지판에 승강가능하게 설치되고, 상기 풉의 커버에 착탈가능하게 결합되며, 승강하면서 상기 개방부를 개폐함과 동시에 상기 커버를 승강시켜 상기 풉의 내부 공간을 상기 개방부와 연통 또는 차단시키는 도어;
상기 상대물이 설치된 바닥에 대하여 상기 지지판을 수평 상태로 맞추어 상기 지지판을 상기 상대물에 결합할 때, 상기 지지판의 일측을 상기 상대물에 접촉시켜 상기 지지판을 지지하는 수단을 포함하는 것을 특징으로 하는 웨이퍼 처리 장치.A support plate coupled to the counterpart and having an opening;
A stage coupled to a portion of the support plate adjacent to the opening and mounted and supported by a front opening Unified Pod (FOUP) loaded and stored with a wafer;
The opening part is installed on the support plate in a liftable manner, is detachably coupled to the cover of the spool, opens and closes the opening while lifting, and lifts the cover to communicate or block the inner space of the spool with the opening. Letting doors;
And means for supporting the support plate by bringing one side of the support plate into contact with the counterpart when the support plate is coupled to the counterpart by setting the support plate in a horizontal state with respect to the bottom on which the counterpart is installed. Wafer processing apparatus. 제1항에 있어서,
상기 수단은 상기 지지판에 승강가능하게 설치되어 일측이 상기 상대물과 접촉하는 지지핀을 포함하는 것을 특징으로 하는 웨이퍼 처리 장치.The method of claim 1,
The means is a wafer processing apparatus, characterized in that it comprises a support pin which is installed on the support plate to be lifted and the one side in contact with the counterpart. 제2항에 있어서,
상기 지지핀은 적어도 2개 마련되어 상호 간격을 가지는 것을 특징으로 하는 웨이퍼 처리 장치.The method of claim 2,
And at least two support pins having a mutual gap therebetween. 제3항에 있어서,
상기 지지판에는 상기 지지핀이 삽입 지지되는 지지블럭이 설치된 것을 특징으로 하는 웨이퍼 처리 장치.The method of claim 3,
And a support block on which the support pin is inserted and supported. 제4항에 있어서,
하나의 상기 지지블럭에 복수의 상기 지지핀이 삽입 지지된 것을 특징으로 하는 웨이퍼 처리 장치.5. The method of claim 4,
And a plurality of the support pins are inserted and supported in one of the support blocks. 제5항에 있어서,
상기 지지핀은 정역 회전함에 따라 상기 지지블럭의 상하측으로 승강하는 것을 특징으로 하는 웨이퍼 처리 장치.The method of claim 5,
The support pin is a wafer processing apparatus, characterized in that the lifting up and down the support block as the forward and reverse rotation.
KR1020110043932A 2011-05-11 2011-05-11 Wafer processing apparatus KR101235337B1 (en)

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