TWI715624B - Nozzle unit - Google Patents
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- TWI715624B TWI715624B TW105128476A TW105128476A TWI715624B TW I715624 B TWI715624 B TW I715624B TW 105128476 A TW105128476 A TW 105128476A TW 105128476 A TW105128476 A TW 105128476A TW I715624 B TWI715624 B TW I715624B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
Abstract
提供一種在將氣體填充至FOUP中時防止大氣之侵入的噴嘴單元。 Provide a nozzle unit that prevents the intrusion of the atmosphere when filling gas into the FOUP.
係具備有:噴嘴本體(71),係具有與收容收容物之容器(7)相通連之氣體供給口(72)、和與氣體供給口(72)相通連之氣體流路(77);和供給噴嘴(78),係被與氣體流路(77)作連接,並經由氣體供給口(72)而對於容器(7)供給氣體;和排氣噴嘴(83),係被與氣體流路(77)作連接,並將氣體流路(77)排氣。 It is equipped with: a nozzle body (71) with a gas supply port (72) connected to the container (7) containing the contents, and a gas flow path (77) connected to the gas supply port (72); and The supply nozzle (78) is connected to the gas flow path (77) and supplies gas to the container (7) through the gas supply port (72); and the exhaust nozzle (83) is connected to the gas flow path ( 77) Make connections and exhaust the gas flow path (77).
Description
本發明,係有關於對收容搬送中之晶圓的收容容器而填充氮氣的噴嘴單元。 The present invention relates to a nozzle unit that is filled with nitrogen gas into a storage container that contains wafers being transported.
從先前技術起,便藉由對於作為基板之晶圓施加各種之處理工程,來進行半導體之製造。近年來,元件之高積體化和電路之微細化係日益進展,為了不會發生對於晶圓表面之粒子或水分的附著,係要求能夠將晶圓周邊維持於高清淨度。進而,係為了不會發生晶圓表面之氧化等的表面之性狀的改變,而亦進行有將晶圓周邊設為身為惰性氣體之氮氣氛圍或者是設為真空狀態的處理。 Since the prior art, semiconductors have been manufactured by applying various processing processes to wafers as substrates. In recent years, the high integration of components and the miniaturization of circuits have progressed. In order to prevent the adhesion of particles or moisture on the surface of the wafer, it is required to maintain high-definition clarity around the wafer. Furthermore, in order not to change the surface properties such as oxidation of the surface of the wafer, a process of setting the periphery of the wafer into a nitrogen atmosphere which is an inert gas or into a vacuum state is also performed.
為了適當地維持此種晶圓周邊之氣體氛圍,晶圓,係被裝入至被稱作FOUP(Front-Opening Unified Pod)之密閉式的儲存包(pod)之內部並進行管理,於該儲存包之內部係被填充有氮。進而,為了在對於晶圓進行處理之處理裝置與FOUP之間進行晶圓之授受,係利用有EFEM(Equipment Front End Module)。EFEM,係在框體之內部構成被作了略密閉之晶圓搬送室,並在其之對向 壁面的其中一方具備有作為與FOUP之間的介面部而起作用之裝載埠(Load Port),並且在另外一方被連接有身為處理裝置之一部分的裝載鎖定室。在晶圓搬送室內,係被設置有用以搬送晶圓之晶圓搬送裝置,使用此晶圓搬送裝置,而在被與裝載埠作了連接的FOUP與裝載鎖定室之間進行晶圓之進出。晶圓搬送室,通常係從配置在搬送室上部之風扇過濾單元而恆常流動有身為清淨之大氣的下衝流。 In order to properly maintain the gas atmosphere around the wafers, the wafers are loaded into a closed pod called FOUP (Front-Opening Unified Pod) and managed, and stored there. The inside of the bag is filled with nitrogen. Furthermore, in order to transfer wafers between the processing device that processes the wafers and the FOUP, EFEM (Equipment Front End Module) is used. EFEM is a wafer transfer chamber that is slightly sealed inside the frame and is opposite to One of the wall surfaces is provided with a load port that functions as an interface with the FOUP, and on the other side is connected a load lock chamber that is a part of the processing device. In the wafer transfer chamber, a wafer transfer device for transferring wafers is installed. Using this wafer transfer device, wafers are moved in and out between the FOUP connected to the load port and the load lock chamber. In the wafer transfer chamber, a downflow of a clean atmosphere flows constantly from the fan filter unit arranged in the upper part of the transfer chamber.
進而,近年來,在晶圓之最先進製程中,就算是在作為下衝流所使用的清淨之大氣中所包含的氧、水分等,也會有使晶圓之性狀改變之虞。因此,對於如同專利文獻1一般之以將晶圓周邊設為氮氣氛圍的方式來將惰性氣體注入至FOUP內的技術之實用化係有所需求。 Furthermore, in recent years, in the state-of-the-art wafer manufacturing process, even the oxygen and moisture contained in the clean atmosphere used as a downflow may change the properties of the wafer. Therefore, there is a demand for the practical application of the technique of injecting inert gas into the FOUP by setting the periphery of the wafer into a nitrogen atmosphere as in Patent Document 1.
[專利文獻1]日本特開2011-187539號公報 [Patent Document 1] JP 2011-187539 A
但是,在專利文獻1所記載之噴嘴單元中,在注入噴嘴內之流路中,係仍會殘留有大氣或粒子。其結果,在對於更低之氧濃度、更低之濕度有所要求的FOUP內,會混入此些之殘存的大氣或粒子,而有著會導致晶圓 之性狀改變之虞的問題。 However, in the nozzle unit described in Patent Document 1, air or particles still remain in the flow path in the injection nozzle. As a result, in the FOUP, which requires lower oxygen concentration and lower humidity, these remaining atmosphere or particles will be mixed, which will cause wafers The question of the fear of changing the traits.
因此,本發明,係為為了解決上述之課題所進行者,其目的,係在於提供一種在將惰性氣體填充至FOUP中時防止大氣之侵入的噴嘴單元。 Therefore, the present invention was made in order to solve the above-mentioned problems, and its purpose is to provide a nozzle unit that prevents the intrusion of the atmosphere when the inert gas is filled in the FOUP.
第1發明之噴嘴單元,其特徵為,係具備有:噴嘴本體,係具有與收容收容物之容器相通連之氣體供給口、和與前述氣體供給口相通連之氣體流路;和供給噴嘴,係被與前述氣體流路作連接,並經由前述氣體供給口而對於前述容器供給氣體;和排氣噴嘴,係被與前述氣體流路作連接,並將前述氣體流路內排氣。 The nozzle unit of the first invention is characterized in that it is provided with: a nozzle body having a gas supply port connected to a container containing the contents, and a gas flow path connected to the gas supply port; and a supply nozzle, It is connected to the gas flow path and supplies gas to the container through the gas supply port; and an exhaust nozzle is connected to the gas flow path to exhaust the gas flow path.
在此噴嘴單元處,係藉由排氣噴嘴來將大氣排氣。故而,在容器與噴嘴本體作了接觸之後,係將包含噴嘴本體、供給噴嘴以及排氣噴嘴之噴嘴單元內的大氣排氣,供給噴嘴係對於容器供給氣體。藉由此,係能夠防止噴嘴單元內之大氣流入至容器之內部的情形。另外,於此,所謂大氣,係指會使被收容於容器中的晶圓氧化等之如同氧、水分、粒子一般的會有導致晶圓的性狀改變之虞之物質、以及包含有此些物質之氣體。由於係防止此大氣流入至容器中,因此,係能夠防止被收容在容器中之晶圓的性狀改變。 In this nozzle unit, the air is exhausted by the exhaust nozzle. Therefore, after the container is in contact with the nozzle body, the atmosphere in the nozzle unit including the nozzle body, the supply nozzle, and the exhaust nozzle is exhausted, and the supply nozzle supplies gas to the container. By this, it is possible to prevent the air in the nozzle unit from flowing into the inside of the container. In addition, here, the “atmosphere” refers to substances that may oxidize the wafers contained in the container, such as oxygen, moisture, and particles, which may cause changes in the properties of the wafers, and contain these substances. The gas. Since this atmosphere is prevented from flowing into the container, it is possible to prevent the properties of the wafer contained in the container from changing.
第2發明之噴嘴單元,係具備有下述之特徵:亦即是,前述噴嘴本體,係具備有形成前述氣體供給 口之胴體部、和從前述胴體部之上端面而立起之第1周壁、以及藉由前述胴體部之上端面和前述第1周壁所形成之上方空間,前述氣體流路,係經由前述氣體供給口而與前述上方空間相通連。 The nozzle unit of the second invention has the following characteristics: that is, the nozzle body is provided with the gas supply The carcass part of the mouth, the first peripheral wall rising from the upper end surface of the carcass part, and the upper space formed by the upper end surface of the carcass part and the first peripheral wall, the gas flow path is through the gas supply The mouth is connected to the aforementioned upper space.
在此噴嘴單元處,排氣噴嘴係將供給噴嘴、氣體流路、上方空間以及排氣噴嘴內之大氣排氣。故而,在容器與噴嘴本體作了接觸之後,當供給噴嘴對於容器供給氣體時,係確實地防止大氣流入至容器中。藉由此,係能夠防止被收容在容器中之晶圓的性狀改變。 At this nozzle unit, the exhaust nozzle exhausts the atmosphere in the supply nozzle, gas flow path, upper space, and exhaust nozzle. Therefore, after the container is in contact with the nozzle body, when the supply nozzle supplies gas to the container, the air is surely prevented from flowing into the container. By this, it is possible to prevent the properties of the wafer contained in the container from changing.
第3發明之噴嘴單元,係具備有下述特徵:亦即是,前述供給噴嘴和前述排氣噴嘴係為一體構成。 The nozzle unit of the third invention has the following feature: that is, the supply nozzle and the exhaust nozzle are integrally formed.
在此噴嘴單元處,係藉由將供給噴嘴和排氣噴嘴作一體性設置,來使構成成為簡單,而能夠削減製造成本。 In this nozzle unit, the supply nozzle and the exhaust nozzle are integrated to simplify the structure and reduce the manufacturing cost.
第4發明之噴嘴單元,係具備有下述特徵:亦即是,係具備有對於前述噴嘴本體內之壓力作調整的壓力調整手段,在將前述噴嘴本體內置換為氣體時,前述壓力調整手段,係將前述噴嘴本體內之壓力控制在特定值以下。 The nozzle unit of the fourth invention has the following characteristics: that is, it is equipped with pressure adjusting means for adjusting the pressure in the nozzle body, and when replacing the nozzle body with gas, the pressure adjusting means , The pressure in the nozzle body is controlled below a specific value.
在此噴嘴單元處,壓力調整手段係將噴嘴本體內之壓力控制在特定值以下。故而,係能夠防止在將噴嘴本體內之大氣排氣並供給惰性氣體時、亦即是在將噴嘴本體內從大氣而置換為惰性氣體時,惰性氣體流入至容器內的情形。 At this nozzle unit, the pressure adjustment means controls the pressure in the nozzle body below a specific value. Therefore, it is possible to prevent the inert gas from flowing into the container when the atmosphere in the nozzle body is exhausted and the inert gas is supplied, that is, when the nozzle body is replaced from the atmosphere with the inert gas.
第5發明之噴嘴單元,係具備有下述之特徵:亦即是,係具備有:前述噴嘴本體、和將前述氣體供給口密閉之開閉機構、和將藉由前述開閉機構而作了密閉的前述氣體供給口開放之開放手段。 The nozzle unit of the fifth invention has the following characteristics: that is, it is provided with: the nozzle body, an opening and closing mechanism that seals the gas supply port, and a closed mechanism by the opening and closing mechanism The opening means for opening the aforementioned gas supply port.
在此噴嘴單元處,在容器與噴嘴本體作了接觸之後,開放手段係將藉由開閉機構而被作了密閉的氣體供給口開放,排氣噴嘴係將噴嘴單元內的大氣排氣。故而,由於係先使排氣噴嘴將噴嘴單元內之大氣排氣,之後再使供給噴嘴對於容器供給惰性氣體,因此,係能夠防止噴嘴單元內之大氣流入至容器之內部的情形。 In this nozzle unit, after the container and the nozzle body are in contact, the opening means opens the gas supply port sealed by the opening and closing mechanism, and the exhaust nozzle exhausts the atmosphere in the nozzle unit. Therefore, since the exhaust nozzle is used to exhaust the atmosphere in the nozzle unit first, and then the supply nozzle is used to supply inert gas to the container, it is possible to prevent the atmosphere in the nozzle unit from flowing into the container.
第6發明之噴嘴單元,係具備有下述之特徵:亦即是,前述開閉機構,係具備有位置於前述上方空間並以外周緣部來將前述氣體供給口之周緣作密閉的彈性密閉構件、和將前述彈性密閉構件固定於前述胴體部之固定部,前述開放手段,係身為藉由推壓前述彈性密閉構件來使其作彈性變形而解除前述密閉的惰性氣體。 The nozzle unit of the sixth invention has the following characteristics: that is, the opening and closing mechanism is provided with an elastic sealing member that is located in the upper space and has an outer peripheral edge portion to seal the peripheral edge of the gas supply port, And the fixing part for fixing the elastic sealing member to the carcass part, the opening means is an inert gas that releases the sealing by pressing the elastic sealing member to elastically deform it.
在此噴嘴單元處,藉由將惰性氣體之壓力設為特定值以上,惰性氣體係對彈性密閉構件作推壓並使其彈性變形,而將氣體供給口之密閉解除。藉由此,係能夠以容易之構成來供給氣體。 At this nozzle unit, by setting the pressure of the inert gas to a specific value or higher, the inert gas system pushes and deforms the elastic sealing member, thereby releasing the sealing of the gas supply port. With this, it is possible to supply gas with an easy configuration.
在第1發明中,係藉由排氣噴嘴來將大氣排氣。故而,在容器與噴嘴本體作了接觸之後,係將包含噴 嘴本體、供給噴嘴以及排氣噴嘴之噴嘴單元內的大氣排氣,供給噴嘴係對於容器供給惰性氣體。藉由此,係能夠防止噴嘴單元內之大氣流入至容器之內部的情形。另外,於此,所謂大氣,係指會使被收容於容器中的晶圓氧化等之會有導致晶圓的性狀改變之虞之氧、水分、粒子等。由於係防止此大氣流入至容器中,因此,係能夠防止被收容在容器中之晶圓的性狀改變。 In the first invention, the air is exhausted by the exhaust nozzle. Therefore, after the container is in contact with the nozzle body, the system will contain the spray The nozzle body, the supply nozzle and the exhaust nozzle are exhausted from the atmosphere in the nozzle unit, and the supply nozzle supplies inert gas to the container. By this, it is possible to prevent the air in the nozzle unit from flowing into the inside of the container. In addition, the term “atmosphere” here refers to oxygen, moisture, particles, etc., which may oxidize the wafer contained in the container, etc., which may change the properties of the wafer. Since this atmosphere is prevented from flowing into the container, it is possible to prevent the properties of the wafer contained in the container from changing.
在第2發明中,排氣噴嘴係將供給噴嘴、氣體流路、上方空間以及排氣噴嘴內之大氣排氣。故而,在容器與噴嘴本體作了接觸之後,當供給噴嘴對於容器供給氣體時,係確實地防止大氣流入至容器中。藉由此,係能夠防止被收容在容器中之晶圓的性狀改變。 In the second invention, the exhaust nozzle exhausts the atmosphere in the supply nozzle, the gas flow path, the upper space, and the exhaust nozzle. Therefore, after the container is in contact with the nozzle body, when the supply nozzle supplies gas to the container, the air is surely prevented from flowing into the container. By this, it is possible to prevent the properties of the wafer contained in the container from changing.
在第3發明中,係藉由將供給噴嘴和排氣噴嘴作一體性設置,來使構成成為簡單,而能夠削減製造成本。 In the third invention, the supply nozzle and the exhaust nozzle are integrally provided to simplify the structure and reduce the manufacturing cost.
在第4發明中,壓力調整手段係將噴嘴本體內之壓力控制在特定值以下。故而,係能夠防止在將噴嘴本體內之大氣排氣並供給惰性氣體時、亦即是在將噴嘴本體內從大氣而置換為惰性氣體時,惰性氣體流入至容器內的情形。 In the fourth invention, the pressure adjusting means controls the pressure in the nozzle body to be below a specific value. Therefore, it is possible to prevent the inert gas from flowing into the container when the atmosphere in the nozzle body is exhausted and the inert gas is supplied, that is, when the nozzle body is replaced from the atmosphere with the inert gas.
在第5發明中,在容器與噴嘴本體作了接觸之後,開放手段係將藉由開閉機構而被作了密閉的氣體供給口開放,排氣噴嘴係將噴嘴單元內的大氣排氣。故而,由於係先使排氣噴嘴將噴嘴單元內之大氣排氣,之後再使 供給噴嘴對於容器供給惰性氣體,因此,係能夠防止噴嘴單元內之大氣流入至容器之內部的情形。 In the fifth invention, after the container and the nozzle body are brought into contact, the opening means opens the gas supply port sealed by the opening and closing mechanism, and the exhaust nozzle exhausts the atmosphere in the nozzle unit. Therefore, because the exhaust nozzle is used to exhaust the atmosphere in the nozzle unit first, and then The supply nozzle supplies an inert gas to the container, so it can prevent the atmosphere in the nozzle unit from flowing into the container.
在第6發明中,藉由將惰性氣體之壓力設為特定值以上,惰性氣體係對彈性密閉構件作推壓並使其彈性變形,而將氣體供給口之密閉解除。藉由此,係能夠以容易之構成來供給惰性氣體。 In the sixth invention, by setting the pressure of the inert gas to a specific value or more, the inert gas system presses and deforms the elastic sealing member, thereby releasing the sealing of the gas supply port. With this, the inert gas can be supplied with an easy configuration.
7:FOUP(容器) 7: FOUP (container)
24:載置台 24: Mounting table
33:氣體供給閥 33: Gas supply valve
70:噴嘴單元 70: nozzle unit
71:噴嘴本體 71: Nozzle body
72:氣體供給口 72: Gas supply port
73:胴體部 73: Carcass
74:第1周壁 74: Week 1 Wall
75:第2周壁
75:
76:流量控制器(壓力調整手段) 76: Flow controller (pressure adjustment means)
77:氣體流路 77: Gas flow path
78:供給噴嘴 78: Supply nozzle
79:供給流路 79: supply flow path
81:第1排氣噴嘴 81: No. 1 exhaust nozzle
82:排氣流路 82: Exhaust flow path
86:卡止部 86: card stop
87:上方空間 87: Space above
88:突出壁 88: Protruding Wall
89:下方空間 89: Space below
90:台座 90: Pedestal
92:開閉機構 92: Opening and closing mechanism
93:蓋部 93: Lid
94:延伸部 94: Extension
96:開放手段 96: Open Means
97:支持構件(支持部) 97: Support member (support department)
98:立壁 98: Wall
99:貫通孔 99: Through hole
101:空氣汽缸 101: Air cylinder
102:彈簧(推壓構件) 102: Spring (pushing member)
111:彈性密閉構件 111: Elastic sealing member
112:固定部 112: Fixed part
W:晶圓(收容物) W: Wafer (container)
[圖1]係為對於將EFEM之側面壁作了卸下的狀態作展示之側面圖。 [Figure 1] is a side view showing the state where the side wall of EFEM is removed.
[圖2]係為圖1中所示之裝載埠的立體圖。 [Figure 2] is a perspective view of the load port shown in Figure 1.
[圖3]係為對於FOUP與裝載埠作展示之側面剖面圖。 [Figure 3] is a side cross-sectional view showing FOUP and load port.
[圖4]係為對於構成EFEM之窗單元與門部作擴大展示的重要部分擴大立體圖。 [Figure 4] is an enlarged perspective view of the important parts of the window unit and door that constitute EFEM.
[圖5]係為定位感測器之部份擴大立體圖。 [Figure 5] is an enlarged perspective view of a part of the positioning sensor.
[圖6]係為第1實施形態之噴嘴單元的剖面圖。 Fig. 6 is a cross-sectional view of the nozzle unit of the first embodiment.
[圖7]係為使圖6之噴嘴單元朝向FOUP而作了移動的剖面圖。 [Fig. 7] is a cross-sectional view showing that the nozzle unit of Fig. 6 is moved toward the FOUP.
[圖8]係為對於將圖6之噴嘴單元裝著於FOUP處的狀態作展示之剖面圖。 [Fig. 8] is a sectional view showing the state where the nozzle unit of Fig. 6 is installed in the FOUP.
[圖9]係為對於控制部之連接狀態作展示之區塊圖。 [Figure 9] is a block diagram showing the connection status of the control unit.
[圖10]係為針對對於FOUP之氣體注入動作作展示 的流程圖。 [Figure 10] It is a demonstration of the gas injection action for FOUP Flow chart.
[圖11]係為第2實施形態之噴嘴單元的剖面圖。 [Fig. 11] is a cross-sectional view of the nozzle unit of the second embodiment.
[圖12]係為使圖11之噴嘴單元朝向FOUP而作了移動的剖面圖。 [Fig. 12] is a cross-sectional view showing that the nozzle unit of Fig. 11 is moved toward the FOUP.
[圖13]係為使圖12之噴嘴單元朝向FOUP而更進而作了移動的剖面圖。 [Fig. 13] is a cross-sectional view of the nozzle unit of Fig. 12 further moved toward the FOUP.
[圖14]係為對於將圖12之噴嘴單元裝著於FOUP處的狀態作展示之剖面圖。 [Fig. 14] is a cross-sectional view showing the state where the nozzle unit of Fig. 12 is installed in the FOUP.
[圖15]係為對於第2實施形態之噴嘴單元的變形例作展示之剖面圖。 Fig. 15 is a cross-sectional view showing a modification of the nozzle unit of the second embodiment.
[圖16]係為對於將圖15之變形例之噴嘴單元裝著於FOUP處的狀態作展示之剖面圖。 [Fig. 16] is a cross-sectional view showing the state where the nozzle unit of the modification of Fig. 15 is mounted on the FOUP.
[圖17]係為對於將圖15之變形例之噴嘴單元裝著於FOUP處並注入氣體的狀態作展示之剖面圖。 [Fig. 17] is a cross-sectional view showing the state where the nozzle unit of the modified example of Fig. 15 is installed in the FOUP and gas is injected.
[圖18]係為使用有與圖15相異之彈性密閉構件的噴嘴單元之剖面圖。 [FIG. 18] is a cross-sectional view of a nozzle unit using an elastic sealing member different from that in FIG. 15.
[圖19]係為對於使圖18之彈性密閉構件作了開放的狀態作展示之剖面圖。 [FIG. 19] is a cross-sectional view showing the state where the elastic sealing member of FIG. 18 is opened.
[圖20]係為代替彈簧而採用了壓力室的第2實施形態之變形例之噴嘴單元的剖面圖。 Fig. 20 is a cross-sectional view of a nozzle unit according to a modification of the second embodiment in which a pressure chamber is used instead of a spring.
[圖21]係為採用了將氣體供給口作開閉之調整器的第2實施形態之變形例之噴嘴單元的剖面圖。 [Fig. 21] is a cross-sectional view of a nozzle unit according to a modification of the second embodiment that uses a regulator for opening and closing the gas supply port.
[圖22]係為並不使氣體置換機構進行升降地而作了固定之變形例的載置台周邊之剖面圖。 [Fig. 22] is a cross-sectional view of the periphery of the mounting table in a modified example where the gas displacement mechanism is not raised and lowered but fixed.
[圖23]係為作為定位感測器而使用了加壓感測器之變形例的載置台周邊之剖面圖。 [Fig. 23] is a cross-sectional view of the periphery of the mounting table using a modification of the pressure sensor as the positioning sensor.
以下,根據所添附之圖面,對本發明之實施形態作說明。 Hereinafter, the embodiments of the present invention will be described based on the attached drawings.
圖1,係為藉由將EFEM1的側面之壁去除而成為能夠對內部作觀察的側面圖。如同圖1中所示一般,EFEM1,係由在特定之授受位置間而進行晶圓W之搬送的晶圓搬送裝置2、和以包圍此晶圓搬送裝置2的方式所設置之箱型之框體3、和被與框體3之前面側之壁的外側作連接之裝載埠4、以及控制手段5,而構成之。於此,在本案發明中,係將從框體3作觀察而被連接有裝載埠4之側的方向定義為前方,並將從框體3作觀察而被連接有裝載埠4之側的相反側之方向定義為後方。
Fig. 1 is a side view that can observe the inside by removing the side wall of EFEM1. As shown in FIG. 1, EFEM1 is composed of a
藉由使控制手段5對於晶圓搬送裝置2之動作進行控制,係成為能夠進行將被收容在被載置於裝載埠4上的FOUP(容器)7中之晶圓(收容物)W搬送至框體3內部之搬送空間9中,以及將被進行了各處理後的晶圓W再度搬送至FOUP7內。
By controlling the operation of the
裝載埠4,係具備有門部51(參考圖2),藉由使此門部51與被設置在FOUP7處之蓋體32作連結並一同移動,FOUP7係成為相對於搬送空間9而被作開放。在FOUP7內,係於上下方向設置有多數之載置部,藉由
此,係能夠收容多數之晶圓W。又,在FOUP7內,通常係被填充有氮,並且,係成為亦能夠藉由控制手段5之控制來經由裝載埠4而對於FOUP7內之氛圍進行氮置換。
The
控制手段5,係作為被設置在框體3之上部空間的控制單元而被構成。又,控制手段5,係進行晶圓搬送裝置2之驅動控制、由裝載埠4所致之FOUP7之氮置換控制、門部51之開閉控制、以及在框體3內之氮循環控制等。控制手段5,係為藉由具備有CPU、記憶體以及介面之通常的微處理器等所構成者,在記憶體中,係預先儲存有在處理中所需要的程式,CPU,係成為逐次將必要之程式讀出並實行,而與周邊硬體資源協同動作以實現所期望之功能。另外,關於氮循環控制,係於後再述。
The control means 5 is configured as a control unit provided in the upper space of the
框體3之內部空間,係藉由區隔構件8,而被區隔為身為晶圓搬送裝置2所驅動之空間的搬送空間9、和氣體回歸路徑10。搬送空間9和氣體回歸路徑10,係僅在氣體送出口11和氣體吸引口12處相互通連,該氣體送出口11,係在搬送空間9之上部而延伸存在於寬幅方向上地被作設置,該氣體吸引口12,係在搬送空間9之下部而延伸存在於寬幅方向上地被作設置。又,係成為藉由使氣體送出口11和氣體吸引口12在搬送空間9內而產生下降氣流並在氣體回歸路徑10內而產生上升氣流,來使氮氣循環。另外,在本實施形態中,雖係設為在框體3內而使身為惰性氣體之氮循環,但是,用以進行循環之氣體係並不被限定於此,而亦可使用其他的氣體。
The internal space of the
在回歸路徑10之背面側上部處,係被連接有將氮導入至框體3內之氣體供給手段16。氣體供給手段16,係成為能夠基於從控制手段5而來之命令,來對於氮之供給和供給的停止作控制。因此,當氮的一部分流出至框體3之外部的情況時,藉由使氣體供給手段16供給與流出之量相對應之量的氮,係能夠將框體3內之氮氛圍保持為一定。又,在背面側下部處,係被連接有將框體3內之氮氣排出的氣體排出手段17。氣體排出手段17,係基於從控制手段5而來之命令而動作,並成為能夠藉由將未圖示之閘門開放,來使框體3之內部與被設置在外部的氮氣排出目標相互通連。而,藉由與由上述之氣體供給手段16所致之氮的供給一併作使用,係成為能夠將框體3內置換為氮氛圍或者是對於框體3內之壓力作控制。另外,在本實施形態中,為了將用以進行循環之氣體設為氮,氣體供給手段16係供給氮,但是,在使其他氣體進行循環的情況時,氣體供給手段16係供給該用以進行循環之氣體。
At the upper part of the back side of the
又,在氣體送出口11處,係被設置有作為第1送風手段之由風扇13a和濾網13b所構成的風扇過濾單元13(FFU13)。風扇過濾單元13,係藉由將在框體3內而循環的氮氣內所包含之粒子除去並且在搬送空間9內而朝向下方送風,來在搬送空間9內使下降氣流產生。另外,FFU13,係藉由被與區隔構件8作連結並在水平方向上延伸的支持構件18而被作支持。
In addition, at the
而,藉由上述之FFU13的風扇13a以及風扇15,框體3內之氮氣係在搬送空間9內而下降,並在氣體回歸路徑10內上升,而成為進行循環。氣體送出口11,由於係朝向下方而開口,因此,藉由FFU13,氮氣係被朝向下方而送出。由於氣體吸引口12係朝向上方而開口,因此,係能夠使藉由FFU13而產生的下降氣流並不產生紊亂地來直接朝向下方而吸引氮氣,藉由此些構成,係能夠作出順暢的氮氣之氣流。另外,係藉由在搬送空間9內產生有下降氣流,來將附著於晶圓W上部之粒子或從完成處理之晶圓所暫時性地放出之放出氣體除去,並且防止起因於搬送空間9內之晶圓搬送裝置2等的裝置之移動而導致該些之放出氣體或粒子浮游的情形。
With the
圖2,係為裝載埠4的立體圖。以下,針對裝載埠4的構成作說明。
Figure 2 is a perspective view of the
裝載埠4,係從被安裝有腳輪以及設置腳之腳部25的後方起而使基底21垂直地立起,並從此基底21之約60%程度的高度位置起來朝向前方而設置有水平基部23。進而,在此水平基部23的上部,係被設置有用以載置FOUP7之載置台24。
The
FOUP7,係如同在圖3中所示意性展示一般,由具備有用以收容晶圓W(參考圖1)之內部空間Sf的本體31、和使為了成為晶圓W之搬入搬出口而被設置於本體31之其中一面處的開口31a作開閉之蓋體32所構成。FOUP7,當被正確地載置於載置台24處的情況時,
蓋體32係成為與基底21相對向。
FOUP7, as shown schematically in FIG. 3, consists of a
回到圖2,在載置台24上,係被設置有用以進行FOUP7之定位的定位銷24a,並且係被設置有用以對於載置台24而進行FOUP7之固定的鎖死爪24b。鎖死爪24b,係在將FOUP7適當地定位於載置台24上之後,能夠藉由進行鎖死動作而將FOUP7作固定,並能夠藉由進行解鎖動作而將FOUP7設為可從載置台24分離的狀態。另外,載置台24,係在將FOUP7作了載置的狀態下,成為能夠藉由載置台驅動部(未圖示)來在前後方向上移動。於此,所謂被適當地作定位,係指相對於載置台24之FOUP7的底面之高度為位於距離載置台24之上面的特定範圍內。
Returning to FIG. 2, on the mounting table 24, a
關於FOUP7是否定位於適當之位置處一事,係藉由被配設在定位銷24a之近旁的定位感測器60(參考圖5)而被偵測出來。定位感測器60,係具備有藉由板彈簧所形成之感測器61、和在感測器61處朝向下方突出設置的旗板62、和被配置在旗板62之下方的透射型之光感測器63、以及被與光感測器63作了連接的感測器纜線64。此定位感測器60,較理想,係分別被配置於各定位銷24a之近旁處。
Regarding whether the
若是FOUP7被載置於載置台24處,則FOUP7之定位溝(未圖示)係被插入至定位銷24a中,FOUP7之底部係與感測器61作接觸。如此一來,由於藉由FOUP7之重量,旗板62係下降並將光感測器63遮
光,因此係能夠辨識(檢測)出FOUP7。檢測結果,係藉由感測器纜線64而被送訊至控制器處。如此這般,在旗板62將光感測器63作了遮光時,係能夠將FOUP7被適當地定位於載置台24處一事檢測出來。具體而言,為了檢測出FOUP7是否身為被適當地作了定位的狀態,係只要以當FOUP7乃身為被適當地作了定位的狀態時旗板62會將光感測器63作遮光的方式來預先作設計即可。除此之外,係亦可對於光感測器63所偵測出的旗板62之遮光量和特定之臨限值作比較並偵測出來。
If the FOUP7 is placed on the mounting table 24, the positioning groove (not shown) of the FOUP7 is inserted into the
又,在載置台24處,係分別在2個場所處而各設置有將氮氣供給至FOUP7內之噴嘴單元70和將氮氣從FOUP7內而排出之第2排氣噴嘴104。噴嘴單元70和第2排氣噴嘴104,通常係位置在較身為被適當地作了定位的狀態下之FOUP7的底面而更下方,於使用之時,係朝向上方作進出並成為分別連接於FOUP7所具備之氣體供給閥33(參考圖3)和氣體排出閥34。
In addition, the mounting table 24 is provided with a
於使用時,噴嘴單元70之上端係與FOUP7之氣體供給閥33作接觸,同樣的,第2排氣噴嘴104之上端係與FOUP7之氣體排氣閥34作接觸。之後,係成為能夠經由氣體供給閥33來藉由噴嘴單元70而對FOUP7之內部空間Sf供給乾燥氮氣等之氣體,並經由氣體排出閥34來藉由第2排氣噴嘴104而將內部空間Sf之氣體排出。又,藉由將氮氣供給量設為較氮氣排出量更多,係亦能夠進行相對於外部或框體3之搬送空間9的壓力而將內
部空間Sf之壓力作了提高的陽壓設定。
When in use, the upper end of the
於此,通常,當被載置於裝載埠4處之FOUP7的氣體供給閥33乃身為被稱作所謂的索環型態(Grommet Type)之彈性構件的情況時,相對應之噴嘴單元70的上端,係藉由相較於氣體供給閥33而剛性為更高之例如金屬或塑膠一般的物質、或者是藉由與索環型態相同之彈性構件,來構成之。在本實施形態中,係將噴嘴單元70之上端藉由塑膠來構成。
Here, generally, when the
構成裝載埠4之基底21,係構成將搬送空間9從外部空間而隔離的前面壁之一部分。如同圖2中所示一般,基底21,係由於兩側方而作了起立的支柱21a、21a,和藉由此些而被作支持的基底本體21b,以及被安裝於在此基底本體21b處而被開放為略矩形狀的窗部21c處之窗單元40,而構成之。於此,在本案發明中之所謂略矩形,係指以具備有四邊之長方形作為基本形狀並使四角隅藉由圓弧來平滑地作了連接之形狀。
The base 21 constituting the
窗單元40,係被設置在與上述之FOUP7的蓋體32(參考圖3)相對向的位置處。窗單元40,由於係如同於後亦會詳細敘述一般,被設置於略矩形狀之開口部42(參考圖4)處,因此,係能夠透過此開口部42而開放框體3之搬送空間9。
The
窗單元40,係由窗框部41、和被安裝於該處之作為彈性材的第1O形環43、第2O形環44、和作為用以隔著第1O形環43而使FOUP7相對於窗框部41來密著
的拉入手段之夾鉗單元45,而構成之。
The
窗框部41,係成為於內側被形成有略矩形狀之開口部42的框形狀。窗框部41,由於係身為作為窗單元40之構成要素而構成上述之基底21(參考圖2)的一部分者,因此,開口部42係能夠將框體3之前面壁開放。在窗框部41之前面,係以環繞開口部42之周緣近旁的方式而被配設有第1O形環43。在窗框部41之後面,係以環繞開口部42之周緣近旁的方式而被配設有第2O形環44。
The
開口部42,係較FOUP7之蓋體32的外周而更些許大,蓋體32係成為能夠通過此開口部42而移動。又,在將FOUP7載置於載置台24處的狀態下,成為蓋體32之周圍的本體31之前面,係作為抵接面31b而隔著第1O形環43來與窗框部41之前面相抵接。藉由此,在將FOUP7安裝於窗單元40處時,第1O形環43係將開口部42(基底21)的周緣和FOUP7之間作密封(密閉)。
The
又,在窗框部41之後面,上述之門部51係成為隔著第2O形環44而作抵接。藉由此,第2O形環44係將開口部42的周緣和門部51之間作密封。
In addition, on the rear surface of the
夾鉗單元45,係被設置在窗框部41之兩側部處的於上下方向而分離之合計4個場所。各夾鉗單元45,係概略由卡合片46和使其動作之汽缸47所構成,並在FOUP7被安裝於窗單元40處的狀態下,將FOUP7朝向基底21側作推壓。
The
又,當卡合片46朝向前方而彈出的情況時,其之前端係朝向上方向,當成為了被拉入至後方之狀態的情況時,前端係成為朝向內側之FOUP7的方向。藉由夾鉗操作,卡合片46係使前端朝向內側,藉由此,係成為能夠與較FOUP7而更朝向側方向作了突出的鍔部相卡合。
In addition, when the engaging
又,裝載埠4,係具備有用以將構成為可安裝FOUP7的窗單元40作開閉之開閉機構50。
In addition, the
如同圖3中所示一般,開閉機構50,係具備有用以開閉開口部42之門部51、和用以支持此之支持框52、和將此支持框52經由滑動支持手段53來可在前後方向上移動地作支持之可動塊54、以及將此可動塊54相對於基底本體21b來可在上下方向移動地作支持之滑動軌55。
As shown in FIG. 3, the opening and
進而,係在各方向之每一者處,設置有用以進行門部51之朝向前後方向的移動以及朝向上下方向的移動之致動器(未圖示),藉由對於此些賦予從控制部Cp而來之驅動指令,係成為能夠使門部51朝向前後方向以及上下方向移動。如此這般,裝載埠4,係成為藉由控制部Cp來使各部被賦予驅動指令一事而動作。
Furthermore, in each of the directions, an actuator (not shown) for performing the movement of the
門部51,係具備有吸附FOUP7之蓋體32的吸附部56(參考圖4)、和用以進行用以開閉FOUP7之蓋體32的閂鎖操作和蓋體32之保持的連結手段57。門部51,係進行蓋體32之固定以及固定之解除,而成為能
夠將蓋體32從FOUP7而卸下或者是對其進行安裝。在連結手段57處,係能夠藉由進行蓋體32之解閂鎖動作而將蓋體32設為可開放之狀態並且將蓋體32連結於門部51處而設為作了一體化的狀態。又,與此相反的,係亦可解除蓋體32與門部51之間的連結並且將蓋體32安裝於本體31處而設為密閉狀態。
The
以下,針對本發明之噴嘴單元70,一面參考圖面一面作說明。
Hereinafter, the
如同圖6中所示一般,第1實施形態之噴嘴單元70,係具備有:具有將氮氣供給至FOUP7處的氣體供給口72之噴嘴本體71、和使噴嘴本體71作上下驅動的驅動手段96。
As shown in Fig. 6, the
噴嘴本體71,係具備有形成氣體供給口72之胴體部73、和從胴體部73之上端面的外周緣起而朝向上方立起之第1周壁74、以及從胴體部73之下端面的外周緣起而朝向下方垂下的第2周壁75。
The
胴體部73,係為沿著噴嘴本體71之軸方向而延伸的圓柱形狀。胴體部73,係包含有與氣體供給口72相通連之氣體流路77、和從胴體部73之外周面起朝向徑方向外側而突出的圓環狀之卡止部86。
The
氣體流路77,係在與噴嘴本體71之軸方向相正交的水平方向上而於胴體部73之內部延伸為直線狀,
並在中央部處與氣體供給口72相通連。氣體流路77之其中一方之開口,係被與供給噴嘴78作連接,並形成供給流路79。供給噴嘴78,係經由供給閥80(參考圖3)而被與未圖示之氮供給源作連接,並對於FOUP7供給氮氣。氣體流路77之另外一方之開口,係被與第1排氣噴嘴81作連接,並形成排氣流路82。第1排氣噴嘴81,係經由排氣閥83而被與未圖示之真空幫浦作連接,並將氣體流路77以及後述之上方空間87的大氣排氣。
The
在第1周壁74和胴體部73的上端面之間,係被形成有較胴體部73而更上方的上方空間87。在第1周壁74之前端部處,係被形成有朝向FOUP7而突出的突出壁88。
Between the first
在第2周壁75和胴體部73的下端面之間,係被形成有較胴體部73而更下方的下方空間89。第2周壁75之下端,係被台座90所支持,該台座90係被固定於載置台24處。
Between the second
又,在上述噴嘴本體71處,係被設置有接觸偵測感測器(未圖示)、和被與供給閥80作了連接的身為壓力調整手段之流量控制器76(參考圖3)。
In addition, the
接觸偵測感測器,係將FOUP7和噴嘴單元70作了接觸一事偵測出來。此偵測,係可根據空氣汽缸101之衝程量來進行,或者是根據空氣汽缸101之壓力來間接性地進行偵測。
The contact detection sensor detects the contact between the FOUP7 and the
流量控制器76,係藉由對於供給閥80之開度
作調整,來控制被供給之氮氣的流量,並對噴嘴單元70內之壓力作調整。具體而言,在將噴嘴單元70內之大氣排氣並供給氮氣時,係將噴嘴單元70內之壓力控制在特定值以下。於此,所謂噴嘴單元70,係包含有氣體流路77、上方空間87、供給噴嘴78以及第1排氣噴嘴81之內部。
The
驅動手段96,係具備有圓板狀之支持構件(支持部)97、和從支持構件97之上面起而朝向上方立起之圓環狀之立壁98。在支持構件97之立壁98的內側,係被形成有於厚度方向而貫通支持構件97之貫通孔99,第2周壁75係插通於貫通孔99中。
The driving means 96 is provided with a disc-shaped support member (support portion) 97 and an
支持構件97之徑方向外側,係被與被配設於載置台24處的空氣汽缸101之下端作連接。藉由此,係藉由使空氣汽缸101將支持構件97作升降驅動,來以使噴嘴本體71作升降的方式來進行驅動。
The radially outer side of the
又,如同圖9中所示一般,控制部Ct之輸入側,係與定位感測器60和接觸偵測感測器作連接,該定位感測器60,係將FOUP7被適當地作了定位一事偵測出來,該接觸偵測感測器,係將FOUP7和噴嘴本體71作了接觸一事偵測出來。控制部Ct之輸出側,係被與供給閥80和排氣閥83以及空氣汽缸101作連接。控制部Ct,係被設置於EFEM1處,並內藏有各種記憶體和受理由使用者所致之操作輸入的控制器。
In addition, as shown in FIG. 9, the input side of the control unit Ct is connected with the
以下,使用圖6~圖10,針對使用第1實施
形態之噴嘴單元70的情況之動作例作說明。另外,在初期狀態下,供給閥80以及排氣閥83係被關閉。
Below, using Figure 6 to Figure 10, for the first implementation
The operation example in the case of the
如同圖10中所示一般,在步驟S1處,定位感測器60係將FOUP7被適當地定位於載置台24處一事檢測出來,並前進至步驟S2。
As shown in FIG. 10, at step S1, the
在步驟S2處,在將FOUP7定位於載置台24處之後,空氣汽缸101係經由支持構件97來使噴嘴單元70朝向FOUP7上升(參考圖7)。此時,第2周壁75之下端係從台座90而分離。
At step S2, after positioning the FOUP7 at the mounting table 24, the
在步驟S3處,係藉由接觸偵測感測器來將FOUP7和噴嘴本體71之突出壁88作了接觸一事偵測出來。另外,在並不使用接觸偵測感測器的情況時,係只要以身為被適當地定位在載置台24處的狀態下之FOUP7之底面作為基準,來預先設定噴嘴本體71之上升位置即可。藉由此,係能夠藉由將空氣汽缸101之衝程量或者是空氣汽缸101之壓力檢測出來,而間接性地偵測到FOUP7和噴嘴本體71之突出壁88之間的接觸。
At step S3, the contact between the
在步驟S4處,係將排氣閥83開啟,並從氣體流路77、上方空間87、供給噴嘴78以及第1排氣噴嘴81之內部而將大氣排氣。若是排氣結束,則係將排氣閥83關閉。但是,係並不被限定於此,亦可在使第1排氣噴嘴81將噴嘴單元70內之大氣排氣時,同時地使供給噴嘴78對於包含上方空間87之噴嘴單元70供給氮氣並與大氣作置換。又,在從供給噴嘴78而對於上方空間87供
給氮氣時,流量控制器76係將噴嘴單元70內之壓力控制在特定值以下。另外,於此之所謂特定值,係指不會使被設置在氣體供給口72處之如同逆止閥一般之開閉閥(未圖示)開放的程度之壓力。此開閉閥,係在被作了關閉的狀態下而將氣體供給口72密封,來防止FOUP7內之氣體流出至FOUP7之外,並且防止FOUP7外之大氣流入至FOUP7內。但是,此開閉閥,係藉由受到特定之壓力而被開放,並使經由氣體供給口72而對於FOUP7內之氮氣的流入成為可能。
In step S4, the
之後,在步驟S5處,係將供給閥80開啟,氮氣係從供給噴嘴78而依序在供給流路79、氣體供給口72以及上方空間87中流動,並被供給至FOUP7處。藉由此,FOUP7內係被氮氣所填充,置換為氮氣之處理係被進行。若是此置換結束,則係將供給閥80關閉。
After that, in step S5, the
在步驟S6中,若是裝載埠4接收氮氣之停止命令,則係將供給閥80關閉,並停止從噴嘴單元70而來之氮氣的供給。之後,在步驟S7處,藉由讓空氣汽缸101使支持構件97朝向下方移動,噴嘴單元70係朝向下方移動並從FOUP7而分離(參考圖7)。之後,若是第2周壁75之下端與台座90相抵接,則噴嘴單元70之下降係結束(參考圖6)。
In step S6, if the
在本實施形態之噴嘴單元70中,係具備有以下之特
徵。
The
在第1實施形態之噴嘴單元70中,係藉由排氣噴嘴83來將大氣排氣。故而,在FOUP7與噴嘴本體71作了接觸之後,係先將包含噴嘴本體71、供給噴嘴78以及第1排氣噴嘴81之噴嘴單元70內的大氣排氣,之後供給噴嘴78係對於FOUP7供給氮氣。藉由此,係能夠防止噴嘴單元70內之大氣流入至FOUP7之內部的情形。由於係防止此大氣流入至FOUP7中,因此,係能夠防止被收容在FOUP7中之晶圓的性狀改變。
In the
在第1實施形態之噴嘴單元70中,第1排氣噴嘴81係將供給噴嘴80、氣體流路77、上方空間87以及第1排氣噴嘴81內之大氣排氣。故而,在FOUP7與噴嘴本體71作了接觸之後,當供給噴嘴78對於FOUP7供給氮氣時,係確實地防止大氣流入至FOUP7中。藉由此,係能夠防止被收容在FOUP7中之晶圓的性狀改變。
In the
在第1實施形態之噴嘴單元70中,流量控制器76係將噴嘴本體71內之壓力控制在特定值以下。故而,係能夠防止在將噴嘴本體71內之大氣排氣並供給氮氣時、亦即是在將噴嘴本體71內從大氣而置換為氮氣時,氮氣流入至FOUP7內的情形。
In the
以下,針對第2實施形態之噴嘴單元70作說明,另外,針對與第1實施形態相同的要素,係附加相同的元件
符號,並省略其說明。
Hereinafter, the
如同圖11中所示一般,噴嘴單元70,係具備有:噴嘴本體71,係具有對於FOUP7供給氮氣之氣體供給口72;和開閉機構92,係密封氣體供給口72;和開放手段96,係使藉由開閉機構92而被作了密封的氣體供給口72開放。
As shown in FIG. 11, the
胴體部73,係包含有與氣體供給口72相通連之氣體流路77、和被設置在氣體供給口72之上側緣部處的第1密封部85、以及從胴體部73之外周面起朝向徑方向外側而突出的圓環狀之卡止部86。
The
開閉機構92,係為剖面T字形狀,並具備有圓板狀之蓋部93、和從蓋部93之下面中央部起朝向下方延伸的圓柱形狀之延伸部94。蓋部93,係位置於上方空間87中,下面之外周緣部係與第1密封部85相抵接並將氣體供給口72之周緣作密封。延伸部94,係從蓋部93起貫通胴體部73而一直延伸至下方空間89處。延伸部94和胴體部73之間,係藉由被配設在胴體部73之下端的第2密封部95而被作密封。
The opening and
開放手段96,係被連接於延伸部94之下端,並將延伸部94朝向上方推壓而使開閉機構92朝向上方移動。開放手段96,係具備有圓板狀之支持構件(支持部)97、和從支持構件97之上面起而朝向上方立起之圓環狀之立壁98。在支持構件97之立壁98的內側,係被形成有於厚度方向而貫通支持構件97之貫通孔99。藉由
使第2周壁75插通於貫通孔99中,開放手段96係在下方空間89處而可相對於胴體部73來上下移動地被作安裝。另外,第2實施形態之開放手段96,係為與第1實施形態之驅動手段96相同的要素,並基於在各實施形態中之功能的差異而對於構件之名稱作變更。
The opening means 96 is connected to the lower end of the
支持構件97之徑方向外側,係被與被配設於載置台24處的空氣汽缸101之下端作連接。藉由此,係藉由使空氣汽缸101將支持構件97作升降驅動,來以經由彈簧102而使噴嘴本體71作升降的方式來進行驅動(參考圖12、13)。
The radially outer side of the
在胴體部73和支持構件97之間,係被配設有身為推壓構件之彈簧102。開放手段96,係與由彈簧102所致之彈性力相抗衡而將開閉機構92朝向上方作推壓。另外,開放手段96和開閉機構92,係被一體性地形成。
Between the
在本實施形態之噴嘴單元70中,係具備有以下之特徵。
The
在第2實施形態之噴嘴單元70中,於將氣體流路77作了排氣之後,係將藉由開閉機構82來作了密閉的氣體供給口72開放(參考圖14)。故而,係防止氣體流路77內之大氣流入至接受氮氣之供給的FOUP7之內部,而能夠防止被收容在FOUP7中之晶圓的性狀改變。
又,由於開放手段96係將藉由開閉機構92而被密閉的氣體供給口72開放,因此係能夠從氣體供給口72而容易地供給氮氣。
In the
在第2實施形態之噴嘴單元70中,僅需使開放手段96朝向上方移動,開閉機構92也會朝向上方移動,而能夠將由蓋部93所致之氣體供給口72的密封解除。故而,係能夠從氣體供給口72而容易地供給氮氣。
In the
在第2實施形態之噴嘴單元70中,由於係藉由彈簧102來使開放手段96相對於噴嘴本體71而被朝向下方推壓,因此,係能夠使被連接於開放手段96處之開閉機構92的蓋部93確實地將氣體供給口72密封。又,由於就算是使開放手段96朝向上方移動,彈簧102也會將胴體部73朝向蓋部93作推壓,因此,係能夠確實地維持由蓋部93所致之氣體供給口72的密封。
In the
在第2實施形態之噴嘴單元70中,於使噴嘴本體71之上端與FOUP7相抵接並從氣體供給口72而供給氮氣之前,係能夠藉由第1排氣噴嘴81來將氣體流路77內之大氣排氣。故而,係能夠防止在供給氮氣時氣體流路77內之大氣流入至接受氮氣之供給的FOUP7之內部的情形。
In the
在第2實施形態之噴嘴單元70中,係藉由第1排氣噴嘴81來將氣體流路77內之大氣排氣,並使噴嘴本體71之上端與FOUP7作接觸,之後,將氣體供給口72開放並開始對於FOUP7之氮氣注入。故而,係能夠防止
在開始對於FOUP7之氮氣注入時氣體流路77內之大氣流入至FOUP7之內部的情形。藉由此,係能夠防止被收容在FOUP7中之晶圓的性狀改變。於此,較理想,在使噴嘴本體71之上端與FOUP7作了接觸之後,於將氣體供給口72開放時,係藉由一面將噴嘴內作排氣一面使開放手段96朝向上方移動,來將上方空間內之大氣作排氣。又,對於FOUP7之氮氣注入,較理想,係在上述之將上方空間內的大氣作了排氣之後,再進行之。若是設為此種構成,則係能夠防止上方空間內之大氣進入至FOUP內。
In the
在第2實施形態之噴嘴單元70中,在對於FOUP7之氮氣注入結束後,開閉機構92係將氣體供給口72作密封。之後,將噴嘴本體71從FOUP7而切離。故而,係能夠防止在氮氣注入結束後氮氣從氣體供給口72而漏出的情形。除此之外,亦可在對於FOUP7之氮氣注入結束之後,在將噴嘴本體71維持於特定值以下之陽壓狀態的狀態下,而在將噴嘴本體71從FOUP7來將噴嘴本體71作了切離之後、或者是與切離同時地,來藉由開閉機構92而將氣體供給口密閉(密封)。另外,於此之所謂特定值,係指不會使被設置在氣體供給口72處之逆止閥(未圖示)開放的程度之壓力。
In the
以上,雖係針對本發明之實施形態而根據圖面來作了說明,但是,係並不應將具體性之構成視為被此些之實施形態所限定者。本發明之範圍,係並非僅藉由上述之實施形態的說明、而亦藉由申請專利範圍的記載來作 界定,並進而亦包含有與申請專利範圍均等之意義以及範圍內的所有之變更。 The above description is based on the drawings for the embodiments of the present invention, but the specific configuration should not be regarded as limited by these embodiments. The scope of the present invention is not only by the description of the above-mentioned embodiment, but also by the description of the scope of patent application. Definition, and further includes the meaning equivalent to the scope of the patent application and all changes within the scope.
在第2實施形態中,係藉由使開閉機構92作上下移動,而進行了氣體供給口72的密封以及密封的解除。但是,係並不被限定於此,亦可如同圖15中所示一般,採用具備有位置於上方空間87中並藉由下面之外周緣部來將氣體供給口72之周緣作密封的彈性密閉構件111和將彈性密閉構件111固定於胴體部73處之固定部112的開閉機構110。另外,在以下之變形例中,於圖中,對於與前述實施形態相同的要素,係附加相同的元件符號,並省略其說明。
In the second embodiment, the
在此開閉機構110處,未圖示之空氣汽缸係使胴體部73朝向上方移動(參考圖16),並使突出壁88與FOUP7之氣體供給閥33作接觸。在此狀態下,若是從供給噴嘴78來朝向上方空間87而使氮氣流動,則如同圖17中所示一般,藉由氮氣之壓力,彈性密閉構件111係作彈性變形並將氣體供給口72之密封解除。如此這般,藉由將氮氣之壓力設為特定值以上,氮氣係對彈性密閉構件111作推壓並使其彈性變形,而將氣體供給口72之密閉解除。於此之所謂特定值,係指能夠使彈性密閉構件111彈性變形並將由逆止閥所致之氣體供給口72之密閉解除的壓力值。藉由此,係能夠以容易之構成來從供給流路79而經由上方空間87來對於FOUP7供給氮氣。另外,於此情況,係並非如同上述實施形態一般地而需要排
氣流路82,而將供給噴嘴78和第1排氣噴嘴81作一體化來共通使用。例如,在使噴嘴本體71從FOUP7而分離之前,係停止氮氣供給並藉由彈性密閉構件111來進行氣體供給口72之密封。藉由此,就算是在使噴嘴本體71從FOUP7而作了分離之後,也能夠實質性地防止在供給流路79內而殘存有大氣的情形。作為此開閉機構110,係發揮作為逆止閥之功能,而能夠使用既知之逆止閥。
At the opening and
作為開閉機構110之更進一步的變形例,亦可如同圖18中所示一般,採用具備有藉由使中央部作抵接並密著而將氣體供給口72作密封的彈性密閉構件113和被形成於此彈性密閉構件113之徑方向外側並將彈性密閉構件113固定於胴體部73處之固定部114的開閉機構110。
As a further modification of the opening and
在此開閉機構110處,若是從供給噴嘴78來朝向上方空間87而使氮氣流動,則如同圖19中所示一般,藉由氮氣之壓力,彈性密閉構件113係作彈性變形並被朝向外側彎折,而將氣體供給口72之密封解除。藉由此,係能夠以容易之構成來對於FOUP7供給氮氣。
At this opening and
在第2實施形態中,藉由使彈簧102相對於支持構件97而將噴嘴本體71朝向上方推壓,由開閉機構92所致之氣體供給口72的密封係被作了維持。但是,係並不被限定於此,係亦可藉由作為推壓構件來代替彈簧102而使用壓力室115,而進行氣體供給口72之密封或密封之解除。如同圖20中所示一般,壓力室115,係被形
成於被與噴嘴本體71作了一體化的支持構件97與胴體部73之間。又,壓力室115,係被與將氣體作供給或者是排氣的壓力調整噴嘴116作連接。
In the second embodiment, by pressing the
壓力調整噴嘴116,係藉由對於壓力室115供給氣體來將壓力提高,並將開閉機構92之下端部117朝向下方作推壓而將開閉機構92朝向下方推壓。藉由此,蓋部93係將氣體供給口72作密封。另一方面,壓力調整噴嘴116,係藉由從壓力室115來將氣體排氣而使壓力降低,並藉由負壓來將下端部117朝向下方作上拉而使開閉機構92朝向上方移動。藉由此,來將由蓋部93所致之氣體供給口72的密封解除。
The
在第2實施形態中,作為FOUP7之氣體供給閥33,係採用了被稱作索環型態(Grommet Type)之彈性構件。但是,作為氣體供給閥33,係亦可採用被稱作所謂的唇部形態之例如金屬或塑膠一般的剛性為高之素材。於此情況,所對應的噴嘴單元70之上端,係藉由如同索環型態一般之彈性構件37(參考圖20)而構成。如此這般,係將氣體供給閥33和噴嘴單元70之上端,設定為彈性構件與剛性構件之關係、或者是彼此均為彈性構件之關係。藉由此,在使氣體注入裝置70之上端與氣體供給閥33作了接觸時,係能夠使氣體供給閥33之突起33a與彈性構件37相接觸並帶來密閉性。故而,係能夠防止被供給至FOUP7內之氮氣漏洩至外部的情形。
In the second embodiment, as the
在第2實施形態中,係將開放手段96和開閉
機構92一體性地形成。但是,為了使組裝成為容易,係亦可分別設為相互獨立之構件,並例如作為對相對於開放手段96之開閉機構92的相對位置作限制之公螺133以及母螺134之關係來可裝卸地構成之。藉由此,組裝以及閥機構92之交換係成為容易。
In the second embodiment, the opening means 96 and the opening and closing
The
又,亦可藉由對於氣體流路77內之氮氣的壓力作調整,來進行氣體供給口72之密封或密封之解除。具體而言,如同圖21中所示一般,在供給噴嘴78處,連結被與流量控制器120作了並聯連接的第1調整器121以及第2調整器122。藉由此,藉由驅動吐出高壓氮氣之第1調整器121,在供給噴嘴78中係流動高壓之氮氣。藉由此氮氣之壓力,來使開閉機構92朝向上方移動,並將由蓋部93所致之氣體供給口72的密封解除。此時,排氣閥83係被關閉。另一方面,藉由驅動吐出低壓氮氣之第2調整器122,在供給噴嘴78中係流動低壓之氮氣。藉由此低壓氮氣,來使開閉機構92朝向下方移動,並藉由蓋部93來將氣體供給口72密封。
In addition, by adjusting the pressure of the nitrogen gas in the
在第1以及第2實施形態中,係藉由空氣汽缸101而使噴嘴單元70作了升降。但是,係並不被限定於此,亦可採用並不使噴嘴單元70升降之構成。如同圖22中所示一般,氣體置換機構125,係具備填充有惰性氣體之省略圖示的氣體供給裝置,並對於被配置在載置台24處之FOUP7內供給惰性氣體。在氣體置換機構125處,係被設置有氣體供給口126和氣體排氣口127。氣體
供給口126係被與載置台24之導入用沖洗埠128作連接,氣體排出口127係被與載置台24之導出用沖洗埠129作連接。藉由此些構件,氣體供給口126和氣體排氣口127係相對於載置台24而被作固定,並成為不會進行升降之構成。
In the first and second embodiments, the
在第1以及第2實施形態中,關於FOUP7是否被固定於適當之位置處一事,係藉由定位感測器60而偵測出來。但是,係並不被限定於此,亦可如同圖23中所示一般,藉由檢測出被設置在FOUP7之底部處的突出部130係將被設置在載置台24之上部處的加壓感測器131之推壓部131a作了推壓一事,來偵測到FOUP7之適當的定位。
In the first and second embodiments, whether the
在前述實施形態中,作為惰性氣體,雖係以氮為例,但是,係並不被限定於此,亦可使用乾燥氣體、氬氣等之所期望的氣體。 In the foregoing embodiment, nitrogen is taken as an example as the inert gas, but the system is not limited to this, and a desired gas such as dry gas and argon may be used.
在前述實施形態中,定位感測器,雖係以光學式感測器或壓力感測器為例,但是,係並不被限定於此,亦可使用機械式感測器或電式感測器等。 In the foregoing embodiment, although the positioning sensor is an optical sensor or a pressure sensor as an example, it is not limited to this, and a mechanical sensor or an electrical sensor can also be used.器等。
在前述實施形態中,雖係對於裝載埠作了適用,但是,係並不被限定於此。例如,對用以對於FOUP內供給惰性氣體的沖洗站(沖洗裝置)裝置、具備有複數之載置台並用以保管複數之FOUP的FOUP儲存器、或者是用以暫時放置FOUP之緩衝裝置,係亦可作適用。 In the foregoing embodiment, although it is applied to the load port, the system is not limited to this. For example, it is also applicable to a flushing station (flushing device) device used to supply inert gas to the FOUP, a FOUP storage device equipped with a plurality of stages for storing a plurality of FOUPs, or a buffer device for temporarily placing FOUPs. Can be used.
7‧‧‧FOUP(容器) 7‧‧‧FOUP (container)
24‧‧‧載置台 24‧‧‧Settable
33‧‧‧氣體供給閥 33‧‧‧Gas supply valve
70‧‧‧噴嘴單元 70‧‧‧Nozzle unit
71‧‧‧噴嘴本體 71‧‧‧Nozzle body
72‧‧‧氣體供給口 72‧‧‧Gas supply port
73‧‧‧胴體部 73‧‧‧Carcass
74‧‧‧第1周壁 74‧‧‧1st week wall
75‧‧‧第2周壁 75‧‧‧2nd week wall
77‧‧‧氣體流路 77‧‧‧Gas flow path
78‧‧‧供給噴嘴 78‧‧‧Supply nozzle
79‧‧‧供給流路 79‧‧‧Supply flow path
81‧‧‧第1排氣噴嘴 81‧‧‧The first exhaust nozzle
82‧‧‧排氣流路 82‧‧‧Exhaust flow path
86‧‧‧卡止部 86‧‧‧Locking part
87‧‧‧上方空間 87‧‧‧Above space
88‧‧‧突出壁 88‧‧‧Protruding Wall
90‧‧‧台座 90‧‧‧Pedest
96‧‧‧開放手段 96‧‧‧Open Means
97‧‧‧支持構件(支持部) 97‧‧‧Supporting member (support department)
98‧‧‧立壁 98‧‧‧Wall
99‧‧‧貫通孔 99‧‧‧Through hole
101‧‧‧空氣汽缸 101‧‧‧Air cylinder
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JPH0748004A (en) * | 1993-08-04 | 1995-02-21 | Dainippon Screen Mfg Co Ltd | Substrate holding container and substrate processing device using said container |
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WO2017038501A1 (en) | 2017-03-09 |
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