KR20120126730A - Wafer processing apparatus - Google Patents

Wafer processing apparatus Download PDF

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Publication number
KR20120126730A
KR20120126730A KR1020110044750A KR20110044750A KR20120126730A KR 20120126730 A KR20120126730 A KR 20120126730A KR 1020110044750 A KR1020110044750 A KR 1020110044750A KR 20110044750 A KR20110044750 A KR 20110044750A KR 20120126730 A KR20120126730 A KR 20120126730A
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South Korea
Prior art keywords
suction
plate
suction plate
door
cover
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KR1020110044750A
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Korean (ko)
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이병일
이경복
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주식회사 테라세미콘
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Priority to KR1020110044750A priority Critical patent/KR20120126730A/en
Publication of KR20120126730A publication Critical patent/KR20120126730A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0297—Wafer cassette

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE: A wafer processing apparatus is provided to minimize the generation of errors in the wafer processing process by improving the reliability of adhesion for absorbing a cover of a FOUP(Front Opening Unified Pod). CONSTITUTION: A supporting plate(110) is combined with an object(200). A stage(120) is combined with the front side of the supporting plate. The stage comprises a plurality supporting pins(121) for supporting a FOUP(Front Opening Unified Pod)(51), a sensor(123), and a clamper(125). A door(130) is detachably combined with a cover(51) of the FOUP. An absorption member(140) transfers elevating movement of the door to the cover.

Description

웨이퍼 처리 장치 {WAFER PROCESSING APPARATUS}Wafer Processing Equipment {WAFER PROCESSING APPARATUS}

본 발명은 풉에 대한 흡착력의 신뢰성을 향상시킨 웨이퍼 처리 장치에 관한 것이다.The present invention relates to a wafer processing apparatus that improves the reliability of the adsorption force on the pool.

전방 개구부 인터페이스 기계적 표준(FIMS: Front-opening Interface Mechanical Standard)(이하, "FIMS"라 함) 시스템은, 반도체 제조 공정에 있어서, 세계 반도체 제조 장비 재료 협회(SEMI: Semiconductor Equipment and Materials International)에서 권고하는 표준안이다.Front-opening Interface Mechanical Standard (FIMS) systems (hereinafter referred to as "FIMS") systems are recommended by the World Semiconductor Equipment and Materials International (SEMI) for semiconductor manufacturing processes. It is a standard.

FIMS 시스템에는 웨이퍼(Wafer) 또는 레티클(Reticle) 등을 자동으로 반송하는 로더(Loader)라는 웨이퍼 처리 장치가 사용된다. 로더는 로봇아암을 매개로 웨이터가 적재 저장된 풉(FOUP: Front Opening Unified Pod)을 FIMS 시스템의 다음 공정을 위한 필요처로 전달한다.In the FIMS system, a wafer processing apparatus called a loader which automatically conveys a wafer or a reticle is used. The loader delivers the FOUP (Front Opening Unified Pod) via the robot arm to the next stage of the FIMS system.

즉, 로더는 웨이퍼를 FIMS 시스템의 이송장치인 로봇 등으로 넘겨주는 인터페이스 장치로써, SMIF(Standard Mechanical Interface) 시스템을 구성하는 장비에 포함된다. SMIF는 웨이퍼 제조 공정 중 발생하는 공기 중의 미세 오염물질인 파티클의 차단에 대해 최소한의 공통 규격을 제안하고 있다.That is, the loader is an interface device that delivers a wafer to a robot, which is a transfer device of a FIMS system, and is included in equipment that constitutes a standard mechanical interface (SMIF) system. SMIF proposes a minimum common standard for the blocking of particles, air pollutants generated during the wafer manufacturing process.

웨이퍼 처리 장치인 로더는, 개방부가 형성되며 상대물인 상기 FIMS 시스템의 어느 장치에 결합되는 지지판, 상기 지지판에 결합되며 풉이 탑재 지지되는 스테이지, 상기 지지판에 결합되어 상기 개방부를 개폐함과 동시에 상기 풉의 커버를 개폐하는 도어 등을 포함한다.The loader, which is a wafer processing apparatus, includes a support plate having an opening formed therein and coupled to any device of the FIMS system as a counterpart, a stage coupled to the support plate and supported by mounting a pull, coupled to the support plate to open and close the opening and simultaneously Door to open and close the cover.

상기 도어에는 상기 풉의 커버를 상기 도어측으로 흡착하는 흡착부재가 설치되는데, 이를 도 1을 참조하여 설명한다. 도 1은 종래의 웨이퍼 처리 장치의 흡착부재의 사시도이다.The door is provided with a suction member for sucking the cover of the pull toward the door, which will be described with reference to FIG. 1. 1 is a perspective view of a suction member of a conventional wafer processing apparatus.

도시된 바와 같이, 흡착부재(10)는 흡입관(11)과 흡입관(11)의 일측에 형성된 깔때기 형상의 흡착판(13)을 가진다. 그리하여, 풉의 커버(미도시)가 흡착판(13)의 직경이 큰 부위측에 밀착되면, 흡입관(11)의 타측과 연결된 펌프(20)가 흡착판(13) 내부의 공기를 흡입한다. 그러면, 상기 풉의 커버에 흡착판(13)이 견고하게 흡착된다.As shown, the suction member 10 has a suction pipe 11 and a funnel-shaped suction plate 13 formed on one side of the suction pipe 11. Thus, when the cover (not shown) of the pull is in close contact with the side of the large diameter portion of the suction plate 13, the pump 20 connected to the other side of the suction pipe 11 sucks air in the suction plate 13. Then, the suction plate 13 is firmly adsorbed to the cover of the pool.

상기와 같은 종래의 웨이퍼 처리 장치는 흡착판(13)이 하나의 판으로만 구성되어 있으므로, 흡착판(13)에 미세한 구멍이 생긴 경우, 또는 흡착판(13)의 직경이 큰 부위가 미세하게 불균일할 경우, 흡착판(13) 내부의 진공도가 저하되므로, 상기 풉의 커버에 대한 흡착부재(10)의 흡착력이 저하된다. 그러면, 흡착부재(10)가 설치된 도어(미도시)가 승강할 때, 상기 풉의 커버는 승강하지 못할 우려가 있으므로, 웨이퍼 처리 공정시 에러가 발생할 우려가 있었다.In the conventional wafer processing apparatus as described above, since the adsorption plate 13 is composed of only one plate, when a minute hole is formed in the adsorption plate 13, or when a portion having a large diameter of the adsorption plate 13 is minutely non-uniform. Since the vacuum degree inside the adsorption plate 13 falls, the adsorption force of the adsorption member 10 with respect to the cover of the said pool falls. Then, when the door (not shown) provided with the adsorption member 10 is raised and lowered, the cover of the pull may not be raised and lowered, which may cause an error in the wafer processing process.

본 발명은 상기와 같은 종래 기술의 문제점을 해소하기 위하여 안출된 것으로, 본 발명의 목적은 풉의 커버를 흡착하는 흡착력에 대한 신뢰성을 향상시킴으로써, 웨이퍼 처리 공정시, 에러의 발생을 줄일 수 있는 웨이퍼 처리 장치를 제공함에 있다.The present invention has been made to solve the problems of the prior art as described above, an object of the present invention is to improve the reliability of the adsorption force for the adsorption of the cover of the pool, thereby reducing the occurrence of errors in the wafer processing process In providing a processing device.

상기 목적을 달성하기 위한 본 발명에 따른 웨이퍼 처리 장치는, 상대물에 결합되며 개방부가 형성된 지지판; 상기 개방부와 인접하는 상기 지지판의 부위에 결합되며 웨이퍼가 적재 저장된 풉(FOUP: Front Opening Unified Pod)이 탑재 지지되는 스테이지; 상기 개방부측 상기 지지판에 승강가능하게 설치되고, 승강하면서 상기 개방부를 개폐함과 동시에 상기 풉의 커버를 승강시켜 상기 풉의 내부 공간을 상기 개방부와 연통 또는 차단시키는 도어; 및 상기 도어에 설치되며 일측이 펌프측과 연통된 흡입관, 상기 흡입관의 타측 외주면에 형성되어 상기 도어의 외측으로 노출되며 깔때기 형상으로 형성되어 상기 커버에 흡착되는 외측흡착판, 상기 흡입관의 타측 외주면에 형성되어 상기 도어의 외측으로 노출되고 상기 외측흡착판의 내부에 위치되며 깔때기 형상으로 형성되어 상기 커버에 흡착되는 내측흡착판을 가지면서 상기 도어의 운동을 상기 커버로 전달하는 흡착부재를 포함한다.Wafer processing apparatus according to the present invention for achieving the above object, a support plate coupled to the counterpart and formed with an opening; A stage coupled to a portion of the support plate adjacent to the opening and mounted and supported by a front opening Unified Pod (FOUP) loaded and stored with a wafer; A door which is installed to be liftable on the opening plate side of the support plate and opens and closes the opening while lifting and lowering the cover of the pool to move or block the internal space of the pool from the opening; And an suction tube installed at the door and having one side communicated with the pump side, the other outer peripheral surface of the suction tube being exposed to the outside of the door and having a funnel shape, the outer suction plate adsorbed to the cover, and formed at the other outer peripheral surface of the suction tube. And an adsorption member which is exposed to the outside of the door and is positioned inside the outer suction plate and is formed in a funnel shape and has an inner suction plate which is sucked to the cover while transferring the movement of the door to the cover.

본 발명에 따른 웨이퍼 처리 장치는, 흡착부재의 흡착판이 다중으로 형성되어 커버에 흡착된다. 그러므로, 어느 하나의 흡착판이 손상되어도, 다른 흡착판이 커버에 흡착되므로, 흡착부재는 항상 견고하게 커버에 흡착된다. 즉, 흡착부재의 흡착력에 대한 신뢰성이 향상된다. 따라서, 도어에 의하여 커버가 정확하게 운동하므로, 웨이퍼 처리 공정시, 에러의 발생이 감소되는 효과가 있다.In the wafer processing apparatus according to the present invention, a plurality of adsorption plates of the adsorption member are formed and adsorbed onto the cover. Therefore, even if one of the adsorption plates is damaged, the other adsorption plate is adsorbed to the cover, so that the adsorption member is always firmly adsorbed to the cover. That is, the reliability of the adsorption force of the adsorption member is improved. Therefore, since the cover moves precisely by the door, there is an effect that the occurrence of errors in the wafer processing process is reduced.

도 1은 종래의 웨이퍼 처리 장치의 흡착부재의 사시도.
도 2는 본 발명의 일 실시예에 따른 웨이퍼 처리 장치의 사시도.
도 3a는 도 2에 도시된 흡착부재의 확대 사시도.
도 3b는 도 3a의 단면도.
도 4는 본 발명의 다른 실시예에 따른 흡착부재의 단면도.1 is a perspective view of a suction member of a conventional wafer processing apparatus.
2 is a perspective view of a wafer processing apparatus according to an embodiment of the present invention.
Figure 3a is an enlarged perspective view of the adsorption member shown in FIG.
3B is a cross-sectional view of FIG. 3A.
Figure 4 is a cross-sectional view of the adsorption member according to another embodiment of the present invention.

후술하는 본 발명에 대한 상세한 설명은, 본 발명이 실시될 수 있는 특정 실시예를 예시하여 도시한 첨부 도면을 참조한다. 이들 실시예는 당업자가 본 발명을 실시할 수 있도록 충분히 상세하게 설명된다. 본 발명의 다양한 실시예는 상호 다르지만 상호 배타적일 필요는 없음이 이해되어야 한다. 예를 들어, 여기에 기재되어 있는 특정 형상, 특정 구조 및 특성은 실시예와 관련하여 본 발명의 정신 및 범위를 벗어나지 않으면서 다른 실시예로 구현될 수 있다. 또한, 각각의 개시된 실시예 내의 개별 구성요소의 위치 또는 배치는 본 발명의 정신 및 범위를 벗어나지 않으면서 변경될 수 있음이 이해되어야 한다. 따라서, 후술하는 상세한 설명은 한정적인 의미가 아니며, 본 발명의 범위는, 적절하게 설명된다면, 그 청구항들이 주장하는 것과 균등한 모든 범위와 더불어 첨부된 청구항에 의해서만 한정된다. 도면에 도시된 실시예들의 길이, 면적, 두께 및 형태는, 편의상, 과장되어 표현될 수도 있다.DETAILED DESCRIPTION OF THE INVENTION The following detailed description of the invention refers to the accompanying drawings that illustrate specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It should be understood that the various embodiments of the present invention are mutually exclusive, but need not be mutually exclusive. For example, certain shapes, specific structures, and features described herein may be embodied in other embodiments without departing from the spirit and scope of the invention in connection with the embodiments. It is also to be understood that the position or arrangement of the individual components within each disclosed embodiment may be varied without departing from the spirit and scope of the invention. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present invention is defined only by the appended claims, along with the full scope of equivalents to which such claims are entitled. The length, area, thickness, and shape of the embodiments shown in the drawings may be exaggerated for convenience.

이하, 첨부된 도면을 참조하여 본 발명의 실시예들에 따른 웨이퍼 처리 장치를 상세히 설명한다.Hereinafter, a wafer processing apparatus according to embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 2는 본 발명의 일 실시예에 따른 웨이퍼 처리 장치의 사시도이다.2 is a perspective view of a wafer processing apparatus according to an embodiment of the present invention.

도시된 바와 같이, 웨이퍼 처리 장치는 사각 형상으로 형성되어 FIMS(Front-opening Interface Mechanical Standard) 시스템의 어느 장치인 상대물(200)에 결합되는 지지판(110)을 포함한다. 지지판(110)은 상대물(200)이 설치된 바닥에 대하여 수직을 이룸과 동시에 수평을 이루면서 상대물(200)에 결합되며, 개방부(112)가 형성된다.As shown, the wafer processing apparatus includes a support plate 110 that is formed in a rectangular shape and coupled to the counterpart 200, which is a device of a front-opening interface mechanical standard (FIMS) system. The support plate 110 is coupled to the counterpart 200 while being perpendicular to the bottom of the counterpart 200 on which the counterpart 200 is installed and being horizontal, and an opening 112 is formed.

개방부(112) 하측의 지지판(110)의 전면 부위에는 스테이지(120)가 결합되고, 스테이지(120)에는 웨이퍼(미도시)가 적재 저장되는 풉(FOUP: Front Opening Unified Pod)(50)이 탑재 지지된다.The stage 120 is coupled to the front portion of the support plate 110 below the opening 112, and the stage 120 has a front opening Unified Pod (FOUP) 50 in which a wafer (not shown) is loaded and stored. Mounted and supported.

풉(50)의 전면은 개방되어 커버(51)가 결합되고, 커버(51)는 후술할 도어(130)에 의하여 승강운동하면서 풉(50)의 내부 공간을 개방부(112)와 연통 또는 차단시킨다.The front surface of the spool 50 is opened so that the cover 51 is coupled, and the cover 51 communicates or blocks the internal space of the spool 50 with the opening 112 while lifting up and down by the door 130 to be described later. Let's do it.

스테이지(120)에는 풉(50)의 하면에 형성된 삽입공(미도시)에 삽입되어 풉(50)을 지지하는 복수의 지지핀(121), 풉(50)의 위치를 감지하는 센서(123), 회전 및 승강가능하게 설치되며 스테이지(120)에 탑재된 풉(50)을 스테이지(120)측으로 압착하여 풉(50)을 지지하는 클램퍼(125)를 가진다.The stage 120 is inserted into an insertion hole (not shown) formed in the lower surface of the pull 50 to support the pull 50, a plurality of support pins 121, the sensor 123 for detecting the position of the pull 50 , Rotatably and elevatingly installed, has a clamper 125 that supports the puller 50 by pressing the puller 50 mounted on the stage 120 to the stage 120 side.

개방부(112)가 형성된 지지판(110)의 후면에는 도어(130)가 승강가능하게 설치되어, 커버(51)에 착탈가능하게 결합된다. 도어(130)는 실린더(미도시) 또는 모터(미도시) 등과 같은 구동수단에 의하여 승강한다.The door 130 is provided on the rear side of the support plate 110 in which the opening part 112 is formed, and is detachably coupled to the cover 51. The door 130 is elevated by driving means such as a cylinder (not shown) or a motor (not shown).

도어(130)에는 래치(131)가 설치되고, 래치(131)는 커버(51)에 형성된 래치홈(미도시)에 삽탈된다. 상세히 설명하면, 풉(50)이 스테이지(120)에 탑재되면, 풉(50)의 커버(51)가 도어(130)에 밀착되고, 래치(131)는 상기 래치홈에 삽입 결합된다. 그리고, 래치(131)가 회전하여, 풉(50)에 대한 커버(51)의 잠금 상태를 해제 한 다음, 도어(130)가 하강하면, 커버(51)도 함께 하강한다. 그러면, 도어(130)에 의하여 개방부(112)가 개방되고, 커버(51)에 의하여 풉(50)의 내부 공간이 개방부(112)와 연통된다.A latch 131 is installed in the door 130, and the latch 131 is inserted into a latch groove (not shown) formed in the cover 51. In detail, when the pull 50 is mounted on the stage 120, the cover 51 of the pull 50 is in close contact with the door 130, and the latch 131 is inserted into the latch groove. Then, the latch 131 rotates to release the lock state of the cover 51 with respect to the release 50, and then, when the door 130 descends, the cover 51 also descends together. Then, the opening part 112 is opened by the door 130, and the inner space of the fulcrum 50 communicates with the opening part 112 by the cover 51.

개방부(112) 및 풉(50)의 내부 공간이 개방되면, FIMS(Front-opening Interface Mechanical Standard) 시스템 내의 로봇(미도시)이 상기 웨이퍼를 다음 공정을 위한 필요처로 반송한다.When the inner space of the opening 112 and the pull 50 is opened, a robot (not shown) in the front-opening interface mechanical standard (FIMS) system carries the wafer to the required place for the next process.

도어(130)가 상승하면, 커버(51)도 함께 상승한다. 그러면, 도어(130)에 의하여 개방부(112)가 폐쇄되고, 커버(51)에 의하여 풉(50)의 내부 공간이 폐쇄된다. 커버(51)에 의하여 풉(50)의 내부 공간이 폐쇄되면, 풉(50)에 대하여 커버(51)가 잠긴다. 개방부(112)의 내주면측에는 커버(51)측 풉(50)의 외면에 밀착되어, 풉(50)의 내부 공간이 개방되었을 때, 이물질이 풉(50)의 내부로 유입되는 것을 방지하는 실링부재(미도시)가 설치된다.When the door 130 rises, the cover 51 also rises together. Then, the opening 112 is closed by the door 130, and the inner space of the pull 50 is closed by the cover 51. When the inner space of the pull 50 is closed by the cover 51, the cover 51 is locked to the pull 50. The inner circumferential surface side of the opening portion 112 is in close contact with the outer surface of the cover 50 side spool 50, and when the inner space of the spool 50 is opened, a sealing to prevent foreign matter from entering the interior of the spool 50; A member (not shown) is provided.

도어(130)에는 커버(51)에 흡착되어 도어(130)의 승강운동을 커버(51)로 전달하는 흡착부재(140)가 설치된다. 흡착부재(140)는 진공에 의하여 커버(51)에 흡착되며, 흡착부재(140)가 견고하게 커버(51)에 흡착되어야 도어(130)의 승강에 대응하여 커버(51)가 승강한다.The door 130 is provided with an adsorption member 140 that is adsorbed by the cover 51 and transfers the lifting movement of the door 130 to the cover 51. The adsorption member 140 is adsorbed to the cover 51 by vacuum, and the adsorption member 140 is firmly adsorbed to the cover 51 so that the cover 51 is elevated in response to the elevation of the door 130.

본 실시예에 따른 웨이퍼 처리 장치는 흡착부재(140)가 항상 견고하게 커버(51)에 흡착될 수 있도록 구성되는데, 이를 도 2 내지 도 3b를 참조하여 설명한다. 도 3a는 도 2에 도시된 흡착부재의 확대 사시도이고, 도 3b는 도 3a의 단면도이다.The wafer processing apparatus according to the present embodiment is configured such that the adsorption member 140 may be firmly adsorbed to the cover 51 at all times, which will be described with reference to FIGS. 2 and 3B. 3A is an enlarged perspective view of the adsorption member shown in FIG. 2, and FIG. 3B is a cross-sectional view of FIG. 3A.

도시된 바와 같이, 흡착부재(140)는 흡입관(141), 외측흡착판(143) 및 내측흡착판(145)을 포함한다. 흡입관(141)은 도어(130)의 내부에 설치되며, 일단부측은 펌프(150)측과 연통되고 타단부측은 도어(130)의 외측을 향한다.As shown, the adsorption member 140 includes a suction pipe 141, an outer suction plate 143, and an inner suction plate 145. The suction pipe 141 is installed inside the door 130, one end side is in communication with the pump 150 side, and the other end side is toward the outside of the door 130.

외측흡착판(143)은 흡입관(141)의 타측 외주면에 형성되어 도어(130)의 외측으로 노출되며, 깔때기 형상으로 형성되어 커버(51)에 흡착된다. 내측흡착판(145)은 흡입관(141)의 타측 외주면에 형성되어 외측흡착판(143)의 내부에 위치되고, 도어(130)의 외측으로 노출되며, 깔때기 형상으로 형성되어 커버(51)에 흡착된다. 외측흡착판(143)과 내측흡착판(145)이 커버(51)에 흡착되어, 도어(130)의 승강 운동을 커버(51)로 전달한다.The outer suction plate 143 is formed on the other outer peripheral surface of the suction pipe 141 is exposed to the outside of the door 130, is formed in a funnel shape is adsorbed on the cover 51. The inner suction plate 145 is formed on the other outer circumferential surface of the suction pipe 141, is located inside the outer suction plate 143, is exposed to the outside of the door 130, is formed in a funnel shape, and is adsorbed on the cover 51. The outer suction plate 143 and the inner suction plate 145 are absorbed by the cover 51 to transfer the lifting motion of the door 130 to the cover 51.

외측흡착판(143)의 직경이 큰 부위의 단면(端面)은 직경이 작은 부위의 단면(端面) 보다 도어(130)의 외측으로 더 돌출된다. 그리고, 내측흡착판(145)의 직경이 큰 부위의 단면(端面)은 직경이 작은 부위의 단면(端面) 보다 도어(130)의 외측으로 더 돌출된다.A cross section of a portion having a larger diameter of the outer suction plate 143 protrudes outward of the door 130 than a cross section of a portion having a small diameter. And the end surface of the site | part with a large diameter of the inner side adsorption plate 145 protrudes more toward the outer side of the door 130 than the cross section of the site | part with small diameter.

이때, 외측흡착판(143)의 직경이 큰 부위의 단면은 내측흡착판(145)의 직경이 큰 부위의 단면 보다 도어(130)의 외측으로 더 돌출된다. 그러면, 외측흡착판(143)의 단면이 커버(51)와 먼저 접촉되고, 이러한 상태에서 펌프(150)의 구동에 의하여 외측흡착판(143) 내부가 진공이 되면, 내측흡착판(145)의 단면이 커버(51)와 접촉되면서 내측흡착판(145) 내부가 진공이 된다. 펌프(150)의 구동에 의하여 외측흡착판(143) 및 내측흡착판(145)의 내부가 진공이 되면, 외측흡착판(143) 및 내측흡착판(145)은 완전히 펴진 상태로 커버(51)에 흡착된다.At this time, the cross section of the large diameter portion of the outer suction plate 143 protrudes to the outside of the door 130 more than the cross section of the large diameter portion of the inner suction plate 145. Then, the end face of the outer side suction plate 143 contacts the cover 51 first, and in this state, when the inside of the outer side suction plate 143 becomes vacuum by driving the pump 150, the end face of the inner side suction plate 145 covers. The inner suction plate 145 becomes a vacuum while being in contact with the 51. When the inside of the outer suction plate 143 and the inner suction plate 145 is vacuumed by the driving of the pump 150, the outer suction plate 143 and the inner suction plate 145 are adsorbed to the cover 51 in a fully opened state.

내측흡착판(145)은 복수개 형성될 수 있다. 내측흡착판(145)이 복수개 형성된 경우, 최내측에 위치된 내측흡착판(145a)에서 최외측에 위치된 내측흡착판(145b)으로 갈수록, 내측흡착판(145a, 145b)의 직경이 큰 부위의 단면(端面)은 도어(130)의 외측으로 더 돌출된다. 이는 전술한 바와 같이, 최외측에 위치된 내측흡착판(145b)의 단면이 커버(51)와 먼저 접촉되게 하고, 순차적으로 최내측에 위치된 내측흡착판(145a)의 단면이 커버(51)와 접촉되게 하기 위함이다.The inner suction plate 145 may be formed in plural. In the case where a plurality of inner side suction plates 145 are formed, a cross section of a portion having a larger diameter of the inner side suction plates 145a and 145b toward the inner side suction plate 145b located at the outermost side from the inner side suction plate 145a positioned at the innermost side. ) Further protrudes outward of the door 130. This causes the end face of the inner side suction plate 145b positioned at the outermost side to contact the cover 51 first, as described above, and the end face of the inner side suction plate 145a positioned at the innermost side sequentially contacts the cover 51. To do so.

외측흡착판(143)의 내부가 진공상태로 될 때 내측흡착판(145)의 단면의 간섭을 받을 수 있고, 최외측의 내측흡착판(145b)의 내부가 진공상태로 될 때 최내측의 내측흡착판(145a)의 단면의 간섭을 받을 수 있다. 그러면, 외측흡착판(143)의 내부 진공도 및 내측흡착판(145b)의 내부 진공도가 저하되어, 외측흡착판(143) 및 내측흡착판(145)의 흡착력이 저하될 수 있다.When the inside of the outer side adsorption plate 143 is in a vacuum state, the end face of the inner side adsorption plate 145 may be interfered with, and when the inside of the outer side inner side adsorption plate 145b is in a vacuum state, the inner side inner side adsorption plate 145a is in a vacuum state. May interfere with the cross section. As a result, the inner vacuum degree of the outer suction plate 143 and the inner vacuum degree of the inner suction plate 145b may be lowered, and the suction force of the outer suction plate 143 and the inner suction plate 145 may be lowered.

이를 방지하기 위하여, 외측흡착판(143)과 내측흡착판(145) 사이의 흡입관(141)의 부위 및 상호 인접하는 내측흡착판(145a, 145b) 사이의 흡입관(141)의 부위에는 흡입공(141a)이 각각 형성된다. 그러면, 흡입공(141a)을 통해서도 외측흡착판(143) 내부의 공기 및 내측흡착판(145) 내부의 공기가 흡입되어 배출된다. 따라서, 외측흡착판(143)이 내측흡착판(145)의 간섭을 받아도 외측흡착판(143)의 내부는 설정된 진공도를 얻을 수 있고, 내측흡착판(145b)이 내측흡착판(145a)의 간섭을 받아도 내측흡착판(145b)의 내부는 설정된 진공도를 얻을 수 있다.In order to prevent this, a suction hole 141a is provided at a portion of the suction tube 141 between the outer suction plate 143 and the inner suction plate 145 and a portion of the suction tube 141 between the inner suction plates 145a and 145b adjacent to each other. Each is formed. Then, the air inside the outer suction plate 143 and the air inside the inner suction plate 145 are also sucked out through the suction hole 141a. Therefore, even if the outer side adsorption plate 143 interferes with the inner side adsorption plate 145, the inside of the outer side adsorption plate 143 can obtain a set vacuum degree, and even if the inner side adsorption plate 145b receives the interference of the inner side adsorption plate 145a, The inside of 145b) can obtain a set degree of vacuum.

외측흡착판(143)과 내측흡착판(145a, 145b)은 흡입관(141)의 중심을 기준으로 동심(同心)을 이루는 것이 바람직하다.The outer side suction plate 143 and the inner side suction plates 145a and 145b may be concentric with respect to the center of the suction pipe 141.

도 2의 미설명 부호 160 웨이퍼 처리 장치를 제어하는 콘트롤 박스이다.It is a control box which controls the non-explanatory code 160 wafer processing apparatus of FIG.

본 실시예에 따른 웨이퍼 처리 장치는 흡착부재(140)의 외측흡착판(143)과 내측흡착판(145)이 커버(51)에 흡착된다. 즉, 흡착부재(140)는 이중 이상으로 커버(51)에 흡착된다. 그러므로, 최외측에 위치된 외측흡착판(143)이 손상되어도, 내측흡착판(145)이 커버(51)에 흡착되므로, 커버(51)는 항상 견고하게 흡착부재(140)에 흡착된다. 즉, 어느 하나의 흡착판이 손상되어도, 다른 흡착판들이 견고하게 커버(51)에 흡착된다. 따라서, 도어(130)에 의하여 커버(51)가 정확하게 운동하므로, 웨이퍼 처리 공정시, 에러의 발생이 감소된다.In the wafer processing apparatus according to the present exemplary embodiment, the outer suction plate 143 and the inner suction plate 145 of the suction member 140 are sucked onto the cover 51. That is, the adsorption member 140 is adsorbed to the cover 51 more than double. Therefore, even if the outer side adsorption plate 143 located at the outermost side is damaged, since the inner side adsorption plate 145 is adsorbed to the cover 51, the cover 51 is always firmly adsorbed to the adsorption member 140. That is, even if one of the adsorption plates is damaged, the other adsorption plates are firmly adsorbed to the cover 51. Therefore, since the cover 51 moves precisely by the door 130, the occurrence of an error is reduced during the wafer processing process.

도 4는 본 발명의 다른 실시예에 따른 흡착부재의 단면도로서, 도 3b와의 차이점만을 설명한다.Figure 4 is a cross-sectional view of the adsorption member according to another embodiment of the present invention, only the difference from Figure 3b.

도시된 바와 같이, 외측흡착판(243)과 내측흡착판(245)은 자바라관 형태로 주름지게 형성된다. 이는, 외측흡착판(243)과 커버(51)(도 2참조)의 흡착 면적 및 내측흡착판(245)과 커버(51)의 흡착 면적을 넓게 하기 위함이다.As shown, the outer suction plate 243 and the inner suction plate 245 are formed to be corrugated in the form of a bellows tube. This is to widen the adsorption area of the outer side adsorption plate 243 and the cover 51 (see FIG. 2) and the adsorption area of the inner side adsorption plate 245 and the cover 51.

상세히 설명하면, 외측흡착판(243)의 내부와 내측흡착판(245)의 내부가 진공 상태가 되어 커버(51)에 흡착되면, 외측흡착판(243) 및 내측흡착판(245)은 각각 주름이 완전히 펴진 상태가 되어 커버(51)에 흡착된다. 그러면, 커버(51)와의 흡착 면적이 넓어지므로, 흡착부재(240)가 더욱 견고하게 커버(51)에 흡착된다.In detail, when the inside of the outside adsorption plate 243 and the inside of the inside adsorption plate 245 are in a vacuum state and adsorbed to the cover 51, the outside adsorption plate 243 and the inside adsorption plate 245 are each fully wrinkled. To be absorbed by the cover 51. Then, since the adsorption area with the cover 51 becomes wider, the adsorption member 240 is adsorb | sucked to the cover 51 more firmly.

이상에서는, 본 발명의 실시예들에 따라 본 발명을 설명하였지만, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자가 본 발명의 기술적 사상을 벗어나지 않는 범위 내에서 변경 및 변형한 것도 본 발명에 속함은 당연하다.In the above, the present invention has been described in accordance with the embodiments of the present invention, but those skilled in the art to which the present invention belongs, the changes and modifications within the scope without departing from the spirit of the present invention. Of course.

110: 지지판 120: 스테이지
130: 도어 140: 흡착부재
141: 흡입관 143: 외측흡착판
145: 내측흡착판110: support plate 120: stage
130: door 140: suction member
141: suction pipe 143: outer suction plate
145: inner suction plate

Claims (7)

상대물에 결합되며 개방부가 형성된 지지판;
상기 개방부와 인접하는 상기 지지판의 부위에 결합되며 웨이퍼가 적재 저장된 풉(FOUP: Front Opening Unified Pod)이 탑재 지지되는 스테이지;
상기 개방부측 상기 지지판에 승강가능하게 설치되고, 승강하면서 상기 개방부를 개폐함과 동시에 상기 풉의 커버를 승강시켜 상기 풉의 내부 공간을 상기 개방부와 연통 또는 차단시키는 도어; 및
상기 도어에 설치되며 일측이 펌프측과 연통된 흡입관, 상기 흡입관의 타측 외주면에 형성되어 상기 도어의 외측으로 노출되며 깔때기 형상으로 형성되어 상기 커버에 흡착되는 외측흡착판, 상기 흡입관의 타측 외주면에 형성되어 상기 도어의 외측으로 노출되고 상기 외측흡착판의 내부에 위치되며 깔때기 형상으로 형성되어 상기 커버에 흡착되는 내측흡착판을 가지면서 상기 도어의 운동을 상기 커버로 전달하는 흡착부재를 포함하는 것을 특징으로 하는 웨이퍼 처리 장치.A support plate coupled to the counterpart and having an opening;
A stage coupled to a portion of the support plate adjacent to the opening and mounted and supported by a front opening Unified Pod (FOUP) loaded and stored with a wafer;
A door which is installed to be liftable on the opening plate side of the support plate and opens and closes the opening while lifting and lowering the cover of the pool to move or block the internal space of the pool from the opening; And
Suction pipe is installed on the door and one side is in communication with the pump side, formed on the other outer peripheral surface of the suction pipe is exposed to the outside of the door and formed in a funnel shape is formed on the outer suction plate adsorbed to the cover, the other outer peripheral surface of the suction pipe And a suction member which is exposed to the outside of the door and is positioned inside the outer suction plate and is formed in a funnel shape and has an inner suction plate that is sucked to the cover to transfer the movement of the door to the cover. Processing unit. 제1항에 있어서,
상기 외측흡착판의 직경이 큰 부위의 단면(端面)은 상기 내측흡착판의 직경이 큰 부위의 단면(端面) 보다 상기 도어의 외측으로 더 돌출된 것을 특징으로 하는 웨이퍼 처리 장치.The method of claim 1,
A cross section of a portion having a large diameter of the outer side suction plate protrudes outward from the door than a cross section of a portion having a large diameter side of the inner side suction plate. 제2항에 있어서,
상기 외측흡착판과 상기 내측흡착판 사이의 상기 흡입관의 부위에는 흡입공이 형성된 것을 특징으로 하는 웨이퍼 처리 장치.The method of claim 2,
And a suction hole is formed in a portion of the suction pipe between the outer suction plate and the inner suction plate. 제2항에 있어서,
상기 내측흡착판은 복수개 형성되고,
최내측에 위치된 상기 내측흡착판에서 최외측에 위치된 상기 내측흡착판으로 갈수록, 상기 내측흡착판의 직경이 큰 부위의 단면(端面)은 상기 도어의 외측으로 순차적으로 더 돌출된 것을 특징으로 하는 웨이퍼 처리 장치.The method of claim 2,
The inner suction plate is formed in plurality,
Wafer processing, characterized in that a cross section of a portion having a larger diameter of the inner suction plate further protrudes outwardly of the door from the inner suction plate positioned at the innermost side to the inner suction plate positioned at the outermost side. Device. 제4항에 있어서,
상호 인접하는 상기 내측흡착판 사이의 상기 흡입관의 부위에는 흡입공이 각각 형성된 것을 특징으로 하는 웨이퍼 처리 장치.5. The method of claim 4,
And a suction hole is formed in each of the suction pipes between the adjacent inner suction plates. 제4항에 있어서,
상기 외측흡착판과 상기 내측흡착판은 상기 흡입관의 중심을 기준으로 동심(同心)을 이루는 것을 특징으로 하는 웨이퍼 처리 장치.5. The method of claim 4,
And the outer suction plate and the inner suction plate are concentric with respect to the center of the suction pipe. 제1항에 있어서,
상기 외측흡착판과 상기 내측흡착판은 주름지게 형성된 것을 특징으로 하는 웨이퍼 처리 장치.The method of claim 1,
Wafer processing apparatus, characterized in that the outer suction plate and the inner suction plate is formed corrugated.
KR1020110044750A 2011-05-12 2011-05-12 Wafer processing apparatus KR20120126730A (en)

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