KR20120095736A - Test handler - Google Patents

Abstract

PURPOSE: A test handler is provided to improve test reliability by forming the diameter of a spray hole placed on the location in which spray pressure is low larger than other spray holes and reducing the deviation between set temperature and temperature of semiconductor devices. CONSTITUTION: A temperature controller(60) controls semiconductor devices loaded on a test tray by the temperature state of required conditions. The test tray is formed inside a test chamber. A duct has an inlet port. The inlet port induces air for temperature control in an internal space. The air for the temperature control is sprayed to the semiconductor devices loaded on the test tray through the inlet port. The temperature controller supplies the air for the temperature control to the internal space through the inlet port.

Description

Test handler {TEST HANDLER}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to test handlers and, more particularly, to techniques for controlling temperature of semiconductor devices.

The semiconductor device produced is tested by a tester prior to shipment, and a test handler is used as a device for supplying the semiconductor device to be electrically connected to the tester.

The test handler has a test chamber at a portion coupled to the tester side, and when the test tray is located in the test chamber, the semiconductor devices loaded on the test tray are tested.

 In general, as in the technique disclosed in Korean Patent Laid-Open Publication No. 10-2005-0055685 (name of the test handler) (hereinafter referred to as 'Background Art 1'), a semiconductor device loaded in a matrix form loaded in a test tray in a test chamber. Is electrically connected to the tester side while being pressed to the tester side by the matchplate (163c). As in the technique described in JP 10-2008-0086320 (Pusher for Match Plate of Test Handler) (hereinafter referred to as 'Background Art 2'), the match plate has a pusher corresponding one-to-one with a semiconductor device loaded in the test tray. It is provided in the same number as the number of semiconductor elements. That is, the pusher pushes the semiconductor element while contacting the semiconductor element so that the semiconductor element is electrically connected to the tester side.

On the other hand, since the semiconductor device can be used in various environments (particularly temperature), it is necessary to perform the test in a state in which thermal stress (high or low heat, etc.) is artificially applied to the semiconductor device in the test chamber. At this time, ideally, it is desirable to ensure that the test is performed in a state where all the semiconductor devices loaded on the test tray have the same temperature.

However, in the related art, since temperature control air (hot or cold air) is configured to be directly supplied to the internal space of the test chamber from one side, there is inevitably a temperature deviation between semiconductor elements loaded in the test tray.

Therefore, as in the background art 1, a duct (symbol 163b) has been developed for directly supplying the temperature control air from the temperature controller to each semiconductor device loaded in the test tray. Through-holes through which the air can pass through the pusher, as in Background 2, so that the temperature-controlled air supplied from the hole can be passed through the pusher to the semiconductor element being pushed from the front of the pusher. In 2, a technique for forming a 'public pipe hole' has been developed.

With the introduction of Background Art 1 and 2, the temperature control air is directly supplied to each semiconductor device, thereby greatly reducing the temperature variation between semiconductor elements in the test chamber.

On the other hand, as the specifications of the semiconductor device to be tested are changed, it is often necessary to change the test method of the test handler.

For example, when 10 electrical contact terminals are arranged in a semiconductor device to be tested, and 20 electrical contact terminals are arranged in a semiconductor device to be tested, a high-fix board (electric contact terminal of a semiconductor device) is basically used. Interface board with test sockets in electrical contact with the This is because the capacity at which the tester can be in electrical contact with the semiconductor element is limited.

In other words, in the past, 16 semiconductor devices having 10 electrical contact terminals could be tested at once. When it is necessary to test semiconductor devices having 20 electrical contact terminals, the tester has only 160 electrical connection lines. Only semiconductor devices can be electrically connected to the tester (for reference, for the sake of brevity, the description below shows a significant reduction in the number of semiconductor devices tested at one time; in practice, 256, 512 or thousands at a time). Semiconductor devices are implemented to be tested at one time).

In such a case, 16 semiconductor elements (having 10 electrical contact terminals) loaded in a 4 ■ 4 matrix form in the test tray TT as shown in FIG. It is in electrical contact with the test socket TS arranged in 4 ■ 4 matrix form on the high resolution board.

However, in the case of semiconductor devices having 20 electrical contact terminals to be newly tested, only eight can be electrically connected to the tester at a time, so as shown in FIGS. 2A and 2B, the odd number is first. After conducting the test by electrically connecting the semiconductor devices (D) in rows (1 and 3 columns) to the tester (TESTER), the test tray (TT) is placed between the semiconductor devices (D) loaded in the test tray (TT). It must be converted to a method of conducting a test by electrically connecting even-numbered rows (two rows and four columns) of semiconductor devices D to the tester by moving the gap slightly. For reference, the former method is called a 16 para 1 step test, the latter method is called an 8 para 2 step test, and sometimes a transition to a 4 para 4 step test occurs. .

By changing the test method as described above, the number of test sockets installed on the high fix board of the tester should be changed from 16 to 8 in order to be in electrical contact with the semiconductor devices, and the semiconductor devices loaded in the test trays are electrically connected to the test sockets. The number of pushers pushed to make contact with them should also be changed from 16 to 8. In addition, the installation position of the test socket and the pusher may vary. The same is true when switching from the 8 para 2 step test to the 16 para 1 step test.

On the other hand, as described above, when the duct is provided to control the temperature of the semiconductor device, not only the number of injection holes formed in the duct should be changed, but also the position of the injection holes should be changed when the arrangement of the test socket is changed. Therefore, the necessity to replace the part in which the injection hole of the duct or the duct is formed arises.

An object of the present invention is to provide a technique that does not require replacement of the duct or the portion in which the injection hole of the duct is formed even if the test method is switched.

The test handler according to the first aspect of the present invention for achieving the above object, the test tray capable of loading L (L is a natural number greater than 1) of semiconductor devices; A test chamber provided to allow the L semiconductor devices loaded on the test tray to be tested at a temperature condition required; When the test tray is accommodated in the test chamber, the L semiconductor devices loaded in the test tray are pushed to the tester side and provided in the test chamber to electrically connect the semiconductor devices to the tester side, and A loaded in the test tray. (A is a natural number equal to or less than L) Match plates in which A through holes corresponding to one to one semiconductor elements are formed; And a temperature regulating device for adjusting the semiconductor devices loaded in the test tray in the test chamber to a temperature state of a required condition. It includes, The temperature control device, has an inlet for allowing the temperature control air is introduced into the internal space, supplying the temperature control air introduced into the internal space through the inlet to the A semiconductor device loaded in the test tray M (M is a natural number larger than L) injection holes are formed in the front surface for injecting temperature control air, and A injection holes of the injection holes are located at a position corresponding to the A through holes one-to-one. Formed ducts; A temperature controller for supplying air for temperature control to the internal space through the inlet of the duct; .

In addition, the test handler according to the second aspect of the present invention for achieving the above object, the test tray capable of loading L (L is a natural number greater than 1) semiconductor elements; A test chamber provided to allow the L semiconductor devices loaded on the test tray to be tested at a temperature condition required; When the test tray is accommodated in the test chamber, the A (A is a natural number equal to or less than L) semiconductor devices loaded in the test tray are pushed to the tester side to electrically connect the semiconductor devices to the tester side. A match plate provided in the test chamber and having A through holes one-to-one corresponding to the A semiconductor devices loaded in the test tray; And a temperature regulating device for adjusting the semiconductor devices loaded in the test tray in the test chamber to a temperature state of a required condition. It includes, The temperature control device, has an inlet for allowing the temperature control air is introduced into the internal space, supplying the temperature control air introduced into the internal space through the inlet to the A semiconductor device loaded in the test tray M (M is a natural number equal to or greater than L) injection holes are formed on the front surface for the purpose of injecting the temperature control air, and A injection holes among the above-mentioned injection holes are spaced between the through holes. A duct formed at a one-to-one corresponding position to have the same spacing as; An injection hole opening / closing device provided to selectively close or open the remaining (M-A) injection holes except for the A injection holes one-to-one corresponding to the A through holes; And a temperature controller for supplying air for temperature control to the internal space through the inlet of the duct. It includes.

When M is equal to L, the injection hole opening and closing device, the opening and closing plate is coupled to the front surface of the duct, the N (N is a natural water larger than M) through which the air for temperature control can pass; And a fixing member for fixing the opening and closing plate at a first position or at a second position different from the first position. And the M injection holes are all open when the opening and closing plate is fixed at the first position, and (NM) of the M injection holes when the opening and closing plate is fixed at the second position. It may have a structure in which only the injection hole is selectively opened.

When M is larger than L, the injection hole opening and closing device is coupled to the front surface of the duct, the opening and closing plate is formed L passage holes through which the air for temperature control can be formed; And a fixing member for fixing the opening and closing plate at a first position or at a second position spaced apart from the first position. In the case where the opening and closing plate is fixed in the first position, only the L injection holes of the M injection holes are opened, and when the opening and closing plate is fixed in the second position, the M injection holes Only medium (ML) injection holes may have a structure in which the open state.

When M is larger than L, the injection hole opening and closing device is coupled to the front surface of the duct, and opens and closes with L first passage holes and (ML) second passage holes through which air for adjusting temperature can pass. plate; And a fixing member for fixing the opening and closing plate at a first position or at a second position spaced apart from the first position. In the case where the opening and closing plate is fixed in the first position, only L injection holes of the M injection holes are opened through the first through holes, and the opening and closing plate is fixed in the second position. In this case, only the ML injection holes of the M injection holes may be opened through the second through holes.

The opening and closing plate is provided with a positioning hole for selectively determining the position of the opening and closing plate in the first position or the second position, the fixing member is provided with a fitting protrusion which can be fitted into the positioning hole. The positioning hole includes a first positioning portion for positioning the opening and closing plate in the first position, a second positioning portion for positioning the opening and closing plate in the second position, and the first positioning. And a connecting portion for connecting the portion and the second positioning portion to each other.

Test handler according to the present invention for achieving the above object, the test tray that can be loaded L (L is a natural number greater than 1) of semiconductor devices; A test chamber provided to allow the L semiconductor devices loaded on the test tray to be tested at a temperature condition required; When the test tray is accommodated in the test chamber, the A (A is a natural number equal to or less than L) semiconductor devices loaded in the test tray are pushed to the tester side to electrically connect the semiconductor devices to the tester side. A match plate provided in the test chamber and having A through holes one-to-one corresponding to the A semiconductor devices loaded in the test tray; And a temperature regulating device for adjusting the semiconductor devices loaded in the test tray in the test chamber to a temperature state of a required condition. It includes, The temperature control device, has an inlet for allowing the temperature control air is introduced into the internal space, supplying the temperature control air introduced into the internal space through the inlet to the A semiconductor device loaded in the test tray M (M is a natural number equal to or greater than L) injection holes are formed on the front surface for the purpose of injecting temperature control air, and A injection holes of the above-mentioned injection holes are provided in the A through holes. A duct formed at a one-to-one corresponding position; And injection hole opening and closing device that can open and close some of the M injection holes; And a temperature controller for supplying air for temperature control to the internal space through the inlet of the duct. . ≪ / RTI >

According to the present invention, even when the test method is switched, there is no need to replace the duct or a part of the duct (the part where the injection hole is formed), so that the test method can be changed as fast as possible, while reducing the waste of resources. It is effective to reduce the cost.

1 and 2 are reference diagrams for explaining a general test method.
3 is a conceptual plan view of a test handler according to the present invention.
4 is a reference diagram for explaining that a semiconductor device is electrically connected to a tester by the test handler of FIG. 3.
5 is a schematic diagram of a temperature control device according to a first example that may be applied to the test handler of FIG.
6A to 6B are reference views for explaining a temperature adjusting device according to a second example that may be applied to the test handler of FIG. 3.
7A and 7B are reference diagrams for describing a temperature control device according to a third example that may be applied to the test handler of FIG. 3.
8A and 8B are reference diagrams for describing a temperature adjusting device according to a fourth example that may be applied to the test handler of FIG. 3.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. For simplicity of description, redundant description is omitted or compressed as much as possible.

<Description of the basic configuration of the test handler>

3 is a conceptual plan view of the main part of the test handler TH according to the present invention.

As shown in FIG. 3, the test handler TH according to the present invention includes a test tray 310, a test chamber 320, a match plate 330, a temperature control device TC, and the like.

The test tray 310 may load 4 ㅧ 4 (16) semiconductor elements and circulate a predetermined circulation path (C).

The test chamber 320, which is coupled to the tester TESTER, is provided to allow the plurality of semiconductor devices mounted in the test tray 310 accommodated therein to be tested at a temperature condition of a required condition.

The match plate 330 may push the semiconductor devices loaded in the test tray 310 accommodated in the test chamber 320 to the tester side to electrically connect the semiconductor devices to the tester side. 4 and through holes 331 corresponding to the semiconductor devices D loaded in the test tray 310 in a one-to-one manner, are formed in a 4 × 4 matrix form.

The temperature control device TC is provided to adjust the semiconductor devices mounted in the test tray 310 in the test chamber 320 to a temperature state of a required condition. The present invention is characterized by such a thermostat TC. Therefore, the temperature control device TC according to various embodiments of the present invention will be described by example with different contents.

<First example of temperature controller>

5 is a schematic diagram of a temperature regulating device 50 according to the first example.

As shown in Figure 5, the temperature control device 50 according to the present example is provided with a duct 51, a temperature controller 53 and the like.

As shown in FIG. 5, the duct 51 has an accommodating space S capable of accommodating temperature controlling air therein, and the temperature controlling air coming from the temperature controller 53 flows into the accommodating space S. There is an inlet (I), which is located in front of the receiving space (S) at a position corresponding to the one-to-one corresponding to the position of the semiconductor device loaded in a 4 ■ 4 matrix form on the test tray and the through hole formed in the 4 ■ 4 matrix form on the match plate Gaps between the semiconductor elements loaded on the test tray and the through holes formed in the test plate with sixteen first injection holes 51a (holes treated with thick solid lines in the drawing) for injecting the temperature-controlled air introduced into the semiconductor element side. It is formed to have a column spacing t and an arrangement form (4 ■ 4 matrix form) equal to the space | interval, and between the 1st and 2nd rows of the 1st injection holes 51a, and between the 3rd and 4th rows. Under The eight second injection holes 51b (holes treated by the dotted lines in the drawing to distinguish them from the first injection holes) have a hot spacing 2t twice the hot spacing t of the first injection holes 51a. It is formed to have.

Therefore, the temperature control air is supplied to the semiconductor device through the first injection hole 51a during the 16-para one-step test, and the temperature control air is supplied to the semiconductor device through the second injection hole 51b during the two-paragraph 8 step. Will be. Of course, the position of the first injection hole 51a coincides with the position of the 16 through holes formed in the 16 test sockets and the match plate in the 16-para one-step test, and in the 8-para two-step test, the second injection hole ( The position of 51b) coincides with the positions of the eight through holes formed in the eight test sockets and the match plate (consider the replacement of the high fix board and match plate as the test method is switched).

The temperature controller 53 is provided to supply air for temperature control to the accommodation space S of the duct 51 through the inlet I.

This example shows a case where the equipment to be delivered (test handler) is delivered with a 16-para, 1-step test method. However, when delivered with 8-para, 2-step test, a through hole formed in the initial match plate is used. Should have fewer than 16, with a form of 2 ■ 4 matrices.

According to the first example as described above, even if the test method is switched, the high resolution of the match plate and the tester without replacing the duct 51 or the part (front part) in which the injection holes 51a and 51b of the duct 51 are formed, etc. The advantage is that only the board needs to be replaced.

On the other hand, as the size of semiconductor devices decreases with the development of integrated technology, it is required to further reduce the temperature deflection of semiconductor devices tested at one time because semiconductor devices are sensitive to temperature changes.

However, according to the first example, since the air for temperature control is injected from a total of 24 (1.5 16 16) injection holes 51a and 51b, some difficulty may occur in controlling the temperature of the semiconductor device. This can be avoided by the other examples described below.

<2nd example of temperature controller>

6A is a schematic diagram of a thermostat 60 according to a second example.

As shown in Figure 6a, the temperature control device 60 according to the present example includes a duct 61, the injection hole opening and closing device 62, the temperature controller 63 and the like.

On the front surface of the duct 61 (the side facing the test tray and the match plate), sixteen injection holes 61a are provided in the test tray such as the number of semiconductor elements loaded in the test tray and the number of through holes formed in the match plate. It is formed at a position corresponding one to one to the position of the semiconductor element to be loaded and the position of the through hole formed in the match plate. The hot spacing of the injection holes 61a has a hot spacing t equal to the hot spacing between the 16 semiconductor elements loaded in the test tray TT and the hot spacing between the 16 through holes formed in the match plate.

The injection hole opening and closing device 62 includes an opening and closing plate 62-1, a fitting protrusion 62-2, and the like.

The opening and closing plate 62-1 is treated with sixteen first through holes 62a through which the temperature control air can pass, and eight second through holes 62b with thin dotted lines on the drawing. Holes) are formed.

The sixteen first through holes 62a have a hot spacing t equal to the hot spacing between the sixteen semiconductor elements loaded in the test tray and the hot spacing between the sixteen through holes formed in the match plate.

In addition, the eight second through holes 62b are located between the first and second rows of the first through holes 62a and between the third and fourth rows, and between the eight second through holes 62b. The hot spacing 2t is twice the hot spacing of the first through holes 62a.

On the other hand, the opening and closing plate 62-1 is formed with a positioning hole 62c having a U-shape each of which is open at four corners. As shown in Fig. 6B, one side of the positioning hole 62c is formed. The first positioning portion 62c-1 for positioning the opening and closing plate 62-1 at the first position and the second positioning portion 62c-2 for positioning the opening and closing plate 62-1 at the second position. )to be. The distance between the center of the first positioning portion 62c-1 and the center of the second positioning portion 62c-2, which are spaced apart from each other, is equal to half of the interval between adjacent hot spacings t of the first through holes. t / 2). And a connecting portion connecting the first positioning portion 62c-1 and the second positioning portion 62c-2 between the first positioning portion 62c-1 and the second positioning portion 62c-2. (62c-3).

The fitting protrusion 62-2 is provided as a fixing member for fixing the opening and closing plate 62-1 to the first position or the second position, and has a form that can be fitted to the positioning hole 62c. In this embodiment, the bolt fitting protrusion 62-2 is constituted. The head portion of the fitting protrusion 62-2 composed of bolts extends beyond the width of the first positioning portion 62c-1 and the second positioning portion 62c-2, so that the release plate 62-1 is separated. It is to be prevented, and the opposite end of the head is bolted to the duct 61. Therefore, the opening and closing plate 62-1 is coupled to be in close contact with the front surface of the duct 61 by the fitting protrusion 62-2, the operator needs to completely separate the opening and closing plate 62-1 from the duct 61. The engagement position of the opening and closing plate 62-1 from the first position to the second position or the second position by slightly lifting the opening and closing plate 62-1 upward and then moving left or right and then lowering again. It is possible to simply switch from the position to the first position.

 The temperature controller 63 is provided to supply air for temperature control to the accommodation space S of the duct 61 through the inlet I.

Next, the operation of the temperature control device 60 having the above configuration will be described.

In the case of the 16-para one-step test method, as shown in Fig. 6A, the fitting projection 62-2 is brought into the state positioned at the first positioning portion 62c-1 of the positioning hole 62c. 16 jets formed in the duct 61 such that the positions of the 16 first through holes 62a formed in the opening and closing plate 62-1 correspond one-to-one with the positions of the 16 jet holes 61a formed in the duct 61. Allow the holes 61a to open. Therefore, the temperature control air is injected toward the 16 through holes formed in the match plate through the 16 injection holes 61a and the 16 first through holes 62a.

On the other hand, in the case of the 8-para two-step test method, as shown in Fig. 6C, the fitting protrusion 62-2 is positioned in the second positioning portion 62c-2 of the positioning hole 62c. The position of the eight second through holes 62b formed in the opening and closing plate 62-1 is such that the eight injection holes in the first row and the third row of the sixteen injection holes 61a formed in the duct 61 are formed. The one of the sixteen injection holes 61a formed in the duct 61 and the eight injection holes 61a in the second and fourth rows of the sixteen injection holes 61a formed in the duct 61 are opened by the opening and closing plate 62-1. To be closed. Therefore, the temperature control air is injected toward the sixteen through holes formed in the match plate through the eight injection holes 61a and the eight second through holes 62b in the first row and the third row.

<Third example of temperature controller>

7A is a schematic diagram of a temperature regulating device 70 according to a third example.

As shown in Figure 7a, the temperature control device 70 according to the present example includes a duct 71, the injection hole opening and closing device 72, the temperature controller 73 and the like.

The front surface of the duct 71 (the side facing the test tray and the match plate) has sixteen first injection holes 71a, the same number of semiconductor elements loaded in the test tray and the number of through holes formed in the match plate. Is formed at a position corresponding to the position of the semiconductor element to be loaded in the test tray and the position of the through hole formed in the match plate. The hot spacing of the first injection holes 71a has a hot spacing t equal to the hot spacing between the sixteen semiconductor elements loaded in the test tray and the hot spacing between the sixteen through holes formed in the match plate.

In addition, eight second injection holes 71b are formed on the front surface of the duct 71 between the first row and the second row and the third row and the fourth row of the first injection holes 71a. The hot spacing 2t between the two spray holes 71b is twice the hot spacing of the first spray holes 71a.

The injection hole opening and closing device 72 includes an opening and closing plate 72-1, a fitting protrusion 72-2, and the like.

The opening and closing plate 72-1 is formed with sixteen through holes 72a through which air for temperature regulation can pass. The sixteen first through holes 72a may include a hot gap between sixteen semiconductor elements loaded in a test tray, a hot gap between sixteen through holes formed in a match plate, and a first injection hole formed in the front surface of the duct 71. It has a hot spacing t equal to the hot spacing of 71a).

Similarly, in the opening and closing plate 72-1, a positioning hole 72c having a first positioning portion, a connecting portion, and a second positioning portion is formed near the four corners as in the second example.

Since the fitting protrusion 72-2 and the temperature controller 73 are the same as in the second example, description thereof is omitted.

Subsequently, the operation of the temperature regulating device 70 having the above configuration will be described.

In the case of the 16-para one-step test method, as shown in Fig. 7, the fitting projection 72-2 is brought into the state of being positioned in the first positioning portion of the positioning hole 72c to open and close the plate 72-. 16 first injection holes 71a formed in the duct 71 such that the positions of the sixteen through holes 72a formed in 1) correspond one-to-one with the positions of the sixteen first injection holes 61a formed in the duct 71. ) Are open and the eight second injection holes 72b are closed. Therefore, the temperature control air is injected toward the 16 through holes formed in the match plate through the 16 first injection holes 71a and the 16 through holes 71b.

On the other hand, in the case of the 8-para, 2-step test method, as shown in FIG. 7B, the opening and closing plate (72-2) is brought into the state of being positioned in the second positioning portion of the positioning hole 72c. The positions of the eight through holes 72a in the second row and the fourth row among the sixteen through holes 72a formed in 72-1 are determined by the positions of the eight second injection holes 71b formed in the duct 71. The one-to-one correspondence allows the second injection holes 71b to be opened and the first injection holes 71a to be closed. Therefore, the temperature control air is sprayed toward the eight through holes formed in the match plate through the eight second injection holes 71b and the eight through holes 72a in the second and fourth rows (the existing match plates are 8 Recall that the two through holes are replaced with matched plates).

<Fourth example of temperature controller>

8A is a schematic diagram of a temperature regulating device 80 according to a fourth example.

As referred to in Figure 8a, the temperature control device 80 according to the present example includes a duct 81, the injection hole opening and closing device 82, the temperature controller 83 and the like.

The duct 81 has the same structure as the duct 71 in the third example. Therefore, sixteen first injection holes 81a and eight second injection holes 81b are formed on the front surface of the duct 81.

The injection hole opening and closing apparatus 82 includes an opening and closing plate 82-1, a fitting protrusion 82-2, and the like.

The opening and closing plate 82-1 is provided with sixteen first through holes 82 a and eight second through holes 82 b through which temperature control air can pass.

The sixteen first through holes 82a have a hot spacing t equal to the hot spacing between the sixteen semiconductor elements loaded in the test tray and the hot spacing between the sixteen through holes formed in the match plate.

In addition, the eight second through holes 82b are located between the first and second rows of the first through holes 82a and between the third and fourth rows, and between the eight second through holes 82b. The hot spacing 2t is twice the hot spacing t of the first through holes 82a. These second through holes 82b are formed close to the first through holes 82a in the first row and the third row and far from the first through holes 82a in the second row and the fourth row. The interval t / 4 between the second through hole 82b and the first through hole 82a in the first row, and between the second through hole 82b adjacent to each other and the first through hole 82a in the third row. The interval t / 4 is one quarter of the hot interval of the first through holes 82a.

Similarly, in the opening and closing plate 82-1, a positioning hole 82c having a first positioning portion, a connecting portion, and a second positioning portion is formed near four corners as in the second example. Here, the interval between the center of the first positioning portion and the center of the second positioning portion spaced apart from each other is a quarter interval t / 4 of the adjacent gaps t of the first through holes 82a. to be.

Since the fitting protrusion 82-2 and the temperature controller 83 are the same as in the second example, description thereof is omitted.

Subsequently, the operation of the temperature regulating device 80 having the above configuration will be described.

In the case of the 16-para one-step test method, as shown in Fig. 8, the opening and closing plate 82-2 is brought into a state where it is positioned in the first positioning portion of the positioning hole 82c. 16 first injection holes formed in the duct 81 such that the positions of the 16 first through holes 82a formed in 1) correspond one-to-one with the positions of the 16 first injection holes 81a formed in the duct 81. The 81a are opened and the eight second injection holes 81b are closed. Therefore, the temperature control air is sprayed toward the sixteen through holes formed in the match plate through the sixteen first injection holes 81a and the sixteen first through holes 82a.

On the other hand, in the case of the 8-para, 2-step test method, as shown in Fig. 8B, the opening and closing plate (82-2) is placed in the state of being positioned at the second positioning portion of the positioning hole 82c. The positions of the eight second through holes 82 b formed in the 82-1 correspond one-to-one with the positions of the eight second injection holes 81 b formed in the duct 81 so that the second injection holes 81 b are opened. And close the first injection holes 81a. Therefore, the temperature control air is injected toward the eight through holes formed in the match plate through the eight second injection holes 812 and the eight second through holes 82b.

That is, according to the second to fourth embodiments, the opening and closing plates 62-1, 72-1, and 82-1 selectively open or close some of the injection holes formed in the ducts 61, 71, and 81 so that the semiconductor By opening only the injection holes in the position corresponding to the element, it is possible to easily adjust the temperature.

In this example, for the sake of explanation, it is assumed that the injection holes of the duct are the same as t or 2t, but depending on the equipment, the spacing between the semiconductor elements loaded in the test tray is alternately different as t or s (t <S). The spacing of the injection holes may be the same based on odd or even rows, or may have spacing corresponding to other examples, since the spacing of the injection holes may be different.

Although the present invention has been fully described by way of example only with reference to the accompanying drawings, it is to be understood that the present invention is not limited thereto. It is to be understood that the scope of the invention is to be construed as being limited only by the following claims and their equivalents.

TH: Test Handler
310: test tray
320: test chamber
330: Match Plate
331: through hole
TC, 50, 60, 70, 80: Temperature controller
51, 61, 71, 81: duct
52: injection hole opening and closing device
53, 63, 73, 83: temperature controller

Claims (7)

A test tray capable of stacking L (L is a natural number greater than 1) semiconductor elements;
A test chamber provided to allow the L semiconductor devices loaded on the test tray to be tested at a temperature condition required;
When the test tray is accommodated in the test chamber, the A (A is a natural number equal to or less than L) semiconductor devices loaded in the test tray are pushed to the tester side to electrically connect the semiconductor devices to the tester side. A match plate provided in the test chamber and having A through holes one-to-one corresponding to the A semiconductor devices loaded in the test tray; And
A temperature regulating device for regulating the semiconductor elements loaded in the test tray in the test chamber to a temperature condition of a required condition; Including,
The temperature control device,
It has an inlet for introducing the temperature control air into the interior space, and spraying the temperature control air to the front to supply the temperature control air introduced into the interior space through the inlet to the A semiconductor device loaded in the test tray A duct for forming M (M is a natural number larger than L), wherein A injection holes are formed at positions corresponding to the A through holes one-to-one;
A temperature controller for supplying air for temperature control to the internal space through the inlet of the duct; &Lt; RTI ID = 0.0 &gt;
Test handler. A test tray capable of stacking L (L is a natural number greater than 1) semiconductor elements;
A test chamber provided to allow the L semiconductor devices loaded on the test tray to be tested at a temperature condition required;
When the test tray is accommodated in the test chamber, A loaded semiconductor devices (A is a natural number equal to or less than L) are pushed to the tester side to electrically connect the semiconductor devices to the tester side. A match plate provided in the test chamber and having A through holes one-to-one corresponding to the A semiconductor devices loaded in the test tray; And
A temperature regulating device for regulating the semiconductor elements loaded in the test tray in the test chamber to a temperature condition of a required condition; Including,
The temperature control device,
It has an inlet for introducing the temperature control air into the interior space, and spraying the temperature control air to the front to supply the temperature control air introduced into the interior space through the inlet to the A semiconductor device loaded in the test tray M (M is a natural number equal to or greater than L) number of injection holes are formed, wherein A injection holes among the above-mentioned injection holes have a one-to-one corresponding position so as to have the same distance between the through holes. Ducts formed in the;
An injection hole opening / closing device provided to selectively close or open the remaining (MA) injection holes except for the A injection holes one-to-one corresponding to the A through holes; And
A temperature controller for supplying air for temperature control to the internal space through the inlet of the duct; &Lt; RTI ID = 0.0 &gt;
Test handler. The method of claim 2,
If M is equal to L,
The injection hole opening and closing device,
An opening and closing plate coupled to the front surface of the duct and having N through holes (N being a natural number larger than M) through which temperature control air can pass; And
A fixing member which fixes the opening and closing plate at a first position or at a second position different from the first position; Including,
When the opening and closing plate is fixed in the first position, all the M injection holes are opened, and when the opening and closing plate is fixed in the second position, only the (NM) injection holes of the M injection holes are selectively selected. Characterized in that the open state
Test handler. The method of claim 2,
If M is greater than L
The injection hole opening and closing device,
An opening and closing plate coupled to the front surface of the duct and having L passage holes through which air for adjusting temperature can pass; And
A fixing member for fixing the opening and closing plate at a first position or at a second position spaced apart from the first position; Including,
When the opening / closing plate is fixed in the first position, only L injection holes of the M injection holes are opened, and when the opening / closing plate is fixed in the second position (ML) of the M injection holes Characterized in that only the four injection holes are opened
Test handler. The method of claim 2,
If M is greater than L
The injection hole opening and closing device,
An opening and closing plate coupled to the front surface of the duct and having L first through holes and ML second through holes through which temperature control air can pass; And
A fixing member for fixing the opening and closing plate at a first position or at a second position spaced apart from the first position; Including,
When the opening and closing plate is fixed at the first position, only L injection holes of the M injection holes are opened through the first through holes, and when the opening and closing plate is fixed at the second position, the M Characterized in that only (ML) injection holes of the four injection holes are opened through the above-mentioned second through holes.
Test handler. 6. The method according to any one of claims 3 to 5,
The opening and closing plate is provided with a positioning hole for selectively determining the position of the opening and closing plate to the first position or the second position.
The fixing member is provided with a fitting protrusion that can be fitted into the positioning hole,
The positioning hole includes a first positioning portion for positioning the opening and closing plate at the first position, a second positioning portion for positioning the opening and closing plate at the second position, and the first positioning portion; Characterized in that it comprises a connecting portion for connecting the second positioning portion to each other
Test handler. A test tray capable of stacking L (L is a natural number greater than 1) semiconductor elements;
A test chamber provided to allow the L semiconductor devices loaded on the test tray to be tested at a temperature condition required;
When the test tray is accommodated in the test chamber, A semiconductor devices loaded in the test tray (A is a natural number equal to or less than L) are pushed to the tester side to electrically connect the semiconductor devices to the tester side. A match plate provided in the test chamber and having one through hole corresponding to one A semiconductor device loaded in the test tray; And
A temperature regulating device for regulating the semiconductor elements loaded in the test tray in the test chamber to a temperature condition of a required condition; Including,
The temperature control device,
It has an inlet for introducing the temperature control air into the interior space, and spraying the temperature control air to the front to supply the temperature control air introduced into the interior space through the inlet to the A semiconductor device loaded in the test tray A duct for forming M (M is a natural number equal to or greater than L), wherein A injection holes are formed at positions corresponding to the A through holes one-to-one; And
An injection hole opening and closing device capable of opening and closing some of the M injection holes; And
A temperature controller for supplying air for temperature control to the internal space through the inlet of the duct; &Lt; RTI ID = 0.0 &gt;
Test handler.

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