KR20120084738A - 고속, 고해상도, 3차원 태양 전지 검사 시스템 - Google Patents

고속, 고해상도, 3차원 태양 전지 검사 시스템 Download PDF

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Publication number
KR20120084738A
KR20120084738A KR1020127009863A KR20127009863A KR20120084738A KR 20120084738 A KR20120084738 A KR 20120084738A KR 1020127009863 A KR1020127009863 A KR 1020127009863A KR 20127009863 A KR20127009863 A KR 20127009863A KR 20120084738 A KR20120084738 A KR 20120084738A
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KR
South Korea
Prior art keywords
camera array
illumination
inspection system
workpiece
optical inspection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
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KR1020127009863A
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English (en)
Korean (ko)
Inventor
칼 이. 하우건
티모시 에이. 스쿠네스
폴 알. 하우젠
스티븐 케이. 카세
Original Assignee
사이버옵틱스 코포레이션
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Application filed by 사이버옵틱스 코포레이션 filed Critical 사이버옵틱스 코포레이션
Publication of KR20120084738A publication Critical patent/KR20120084738A/ko
Withdrawn legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/8901—Optical details; Scanning details
    • G01N21/8903—Optical details; Scanning details using a multiple detector array
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N2021/845—Objects on a conveyor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8838—Stroboscopic illumination; synchronised illumination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's

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  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Pathology (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1020127009863A 2009-09-22 2010-09-21 고속, 고해상도, 3차원 태양 전지 검사 시스템 Withdrawn KR20120084738A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US24467109P 2009-09-22 2009-09-22
US24461609P 2009-09-22 2009-09-22
US61/244,671 2009-09-22
US61/244,616 2009-09-22

Publications (1)

Publication Number Publication Date
KR20120084738A true KR20120084738A (ko) 2012-07-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127009863A Withdrawn KR20120084738A (ko) 2009-09-22 2010-09-21 고속, 고해상도, 3차원 태양 전지 검사 시스템

Country Status (5)

Country Link
JP (2) JP5809628B2 (enExample)
KR (1) KR20120084738A (enExample)
CN (2) CN102656444B (enExample)
DE (1) DE112010003742T5 (enExample)
WO (2) WO2011037903A1 (enExample)

Cited By (4)

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KR20210113955A (ko) * 2020-03-09 2021-09-17 파스포드 테크놀로지 주식회사 다이 본딩 장치 및 반도체 장치의 제조 방법
KR20210118488A (ko) * 2017-02-02 2021-09-30 이스메카 세미컨덕터 홀딩 에스.아. 부품을 검사하는 방법 및 조립체
KR20220050661A (ko) * 2020-10-16 2022-04-25 삼성전자주식회사 다채널 액체 파티클 계수기
KR20220136279A (ko) * 2021-03-31 2022-10-07 스카이버스 테크놀로지 씨오., 엘티디. 검출 장치, 검출 기기 및 검출 방법

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US20120133920A1 (en) * 2009-09-22 2012-05-31 Skunes Timothy A High speed, high resolution, three dimensional printed circuit board inspection system
CN102253051A (zh) * 2011-05-03 2011-11-23 3i系统公司 一种线扫描探测器检测太阳能电池片缺陷的系统
CN103076330A (zh) * 2013-01-05 2013-05-01 王锦峰 多面阵相机aoi设备及其拍摄图像方法
US20140198185A1 (en) * 2013-01-17 2014-07-17 Cyberoptics Corporation Multi-camera sensor for three-dimensional imaging of a circuit board
KR101351000B1 (ko) * 2013-04-10 2014-01-15 주식회사 미루시스템즈 복수 개의 검사 모드를 가지는 인라인 카메라 검사 장치
US10126252B2 (en) 2013-04-29 2018-11-13 Cyberoptics Corporation Enhanced illumination control for three-dimensional imaging
US9599572B2 (en) * 2014-04-07 2017-03-21 Orbotech Ltd. Optical inspection system and method
US9927367B2 (en) 2014-05-05 2018-03-27 Arconic Inc. Apparatus and methods for weld measurement
CN106796721B (zh) * 2014-09-11 2021-05-04 赛博光学公司 三维轮廓测量中根据多个相机和源的点云合并
DE102015101252B4 (de) * 2015-01-28 2023-10-19 Chromasens Gmbh Beleuchtungsvorrichtung, optisches Analysesystem sowie Verfahren zum Abtasten einer Oberfläche
CN106706657A (zh) * 2015-11-17 2017-05-24 北大方正集团有限公司 基于喷墨印刷的在线检测系统及方法
US10976535B2 (en) * 2016-03-30 2021-04-13 Optical Wavefront Laboratories Multiple camera microscope imaging with patterned illumination
CN106093068A (zh) * 2016-08-10 2016-11-09 武汉科技大学 锂电池极片表面缺陷检测装置的成像系统及其使用方法
CN106501267A (zh) * 2016-10-18 2017-03-15 凌云光技术集团有限责任公司 用于表面缺陷检测的线性光源装置及系统
CN106525874A (zh) * 2016-11-01 2017-03-22 凌云光技术集团有限责任公司 一种大幅面工业品表面检测系统
TWI647444B (zh) * 2017-05-12 2019-01-11 廣盈自動化工程股份有限公司 Battery yield automatic detecting device and method thereof
JP6584454B2 (ja) 2017-06-14 2019-10-02 キヤノン株式会社 画像処理装置及び方法
CN109425617A (zh) * 2017-08-31 2019-03-05 菱光科技股份有限公司 光学检测系统及图像处理方法
CN107478661A (zh) * 2017-09-11 2017-12-15 深圳市中天元光学玻璃有限公司 一种玻璃屏幕在线检测装置
WO2019188198A1 (ja) * 2018-03-30 2019-10-03 倉敷紡績株式会社 線状物の３次元計測装置、および、線状物の３次元計測方法
CN109000566B (zh) * 2018-08-15 2020-09-11 深圳科瑞技术股份有限公司 激光扫描三维成像和ccd二维成像组合测量方法及装置
WO2020148749A1 (en) * 2019-01-14 2020-07-23 Orbotech Ltd. Multiplexed image acquisition device for optical system
CN111060516B (zh) * 2019-12-10 2022-03-08 中国工程物理研究院激光聚变研究中心 光学元件亚表面缺陷的多通道原位检测装置及检测方法
DE102021104947B4 (de) 2021-03-02 2023-05-25 Gerhard Schubert Gesellschaft mit beschränkter Haftung Scanner, damit ausgestattete Ermittlungs-Vorrichtung sowie Verfahren für deren Betrieb
CN113075232A (zh) * 2021-03-31 2021-07-06 深圳中科飞测科技股份有限公司 一种检测设备及检测方法
JP2022160288A (ja) * 2021-04-06 2022-10-19 パナソニックＩｐマネジメント株式会社 検査システムおよび画像処理装置
KR102528246B1 (ko) * 2021-04-30 2023-05-03 (주)자비스 배터리 내부 전체 전극 상태 검사 시스템
CN115629076B (zh) * 2022-09-27 2025-02-18 威海华菱光电股份有限公司 一种阵列式图像检测装置
CN116500050B (zh) * 2023-06-28 2024-01-12 四川托璞勒科技有限公司 一种pcb板视觉检测系统
EP4641176A1 (en) * 2024-04-24 2025-10-29 Automatizacion y Sistemas de Inspeccion en Linea Global, S.L. Vision system for an inspection apparatus

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US1577388A (en) 1923-05-19 1926-03-16 Hilger Ltd Adam Projection apparatus
JP4558112B2 (ja) * 1998-10-13 2010-10-06 山形カシオ株式会社 部品搭載装置用の照明装置とその照明装置を備える部品搭載装置
GB9828109D0 (en) * 1998-12-19 1999-02-17 Kestra Ltd Inspection equipment and methods of inspection
GB2375392B (en) 2000-01-07 2004-12-15 Cyberoptics Corp Phase profilometry system with telecentric projector
CN1242290C (zh) * 2003-09-18 2006-02-15 中国科学院上海技术物理研究所 一种能使光束光能分布均匀的均化光学组件
WO2009094489A1 (en) * 2008-01-23 2009-07-30 Cyberoptics Corporation High speed optical inspection system with multiple illumination imagery
US20100074515A1 (en) * 2008-02-05 2010-03-25 Kla-Tencor Corporation Defect Detection and Response

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210118488A (ko) * 2017-02-02 2021-09-30 이스메카 세미컨덕터 홀딩 에스.아. 부품을 검사하는 방법 및 조립체
KR20210113955A (ko) * 2020-03-09 2021-09-17 파스포드 테크놀로지 주식회사 다이 본딩 장치 및 반도체 장치의 제조 방법
KR20220050661A (ko) * 2020-10-16 2022-04-25 삼성전자주식회사 다채널 액체 파티클 계수기
KR20220136279A (ko) * 2021-03-31 2022-10-07 스카이버스 테크놀로지 씨오., 엘티디. 검출 장치, 검출 기기 및 검출 방법

Also Published As

Publication number Publication date
WO2011037903A1 (en) 2011-03-31
CN102498387A (zh) 2012-06-13
JP2013505464A (ja) 2013-02-14
DE112010003742T5 (de) 2013-06-06
WO2011037905A1 (en) 2011-03-31
JP5809628B2 (ja) 2015-11-11
CN102656444B (zh) 2016-08-03
CN102656444A (zh) 2012-09-05
JP2013505465A (ja) 2013-02-14

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Date Code Title Description
PA0105 International application

Patent event date: 20120417

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid