KR20120070207A

KR20120070207A - Laser machining apparatus

Info

Publication number: KR20120070207A
Application number: KR1020100131659A
Authority: KR
Inventors: 도상회; 방형배
Original assignee: 도상회; 방형배
Priority date: 2010-12-21
Filing date: 2010-12-21
Publication date: 2012-06-29

Abstract

The disclosed laser processing apparatus includes at least one laser generator for generating a laser beam, a first and a second laser head for irradiating a brittle material to the brittle material, and a cooling fluid in the brittle material. Cooling fluid injector for spraying the head, the head of the first and second laser heads located in the front of the machining direction is operated in the scribing mode, the head located in the rear of the machining direction is operated in one of the split mode and off mode And a mode selector. According to such a configuration, it is possible to select a reciprocating scribing process and a reciprocating full-cutting process.

Description

Laser machining apparatus

The present invention relates to a laser processing apparatus for cutting brittle materials using a laser.

A brittle material represented by glass, in particular, a translucent brittle material, is used in various fields such as exterior panels of buildings as well as substrates of flat panel display devices such as liquid crystal panels and plasma display panels. The glass can be mechanically cut using a diamond wheel or the like. However, this mechanical cutting method implies the possibility that the glass surface may be contaminated or damaged by small debris generated during cutting. In addition, minute cracks may occur near the cutting line, and due to the nature of the brittle material, when a force is applied to the cracks, the whole material may be cracked. Therefore, a post-treatment process such as polishing to remove fine cracks around the cutting line may be added to increase the processing cost.

Recently, a method of forming a scribing line by applying a thermal stress to a brittle material using a laser and then applying a physical or thermal shock to the material to cut along the scribing line has been proposed and used.

In order to improve the working speed of the processing apparatus for cutting brittle material using a laser, a method of increasing the scanning speed of the laser, that is, the speed at which the laser scans the surface of the brittle material, or increasing the output power of the laser itself is proposed. In the former case, the energy applied to the material per unit time is reduced, and thus the speed is limited. In the latter case, a high power laser generator is not only expensive but also increases the heating temperature of the material.

In addition, when the brittle material is cut by scribing, a braking step of dividing the material along the scribing line after the scribing process is involved, and the braking equipment is separately required. Therefore, process costs and equipment costs are required.

The present invention was made to solve the above problems, and an object of the present invention is to provide a laser processing apparatus capable of scribing and breaking at a high working speed. Another object of the present invention is to provide a laser processing apparatus capable of scribing and breaking at the same time.

Laser processing apparatus according to the present invention, at least one laser generator for generating a laser beam; First and second laser heads for irradiating the laser beam onto the brittle material; A cooling fluid injector positioned between the first and second laser heads to inject a cooling fluid to the brittle material; A head positioned forward in the processing direction among the first and second laser heads is formed by irradiating the brittle material by shaping the laser beam into a plurality of beams aligned in the processing direction to form a scribing line in the brittle material. And a head positioned rearward in the processing direction among the first and second laser heads, after cooling, irradiates a lazy beam to the brittle material to cause thermal shock along the scribing line. A reciprocating scribing process and a reciprocating full-cutting process may be selected, including a mode selector which operates in one of a split mode for dividing the brittle material and an off mode in which the laser beam is not irradiated.

The mode selector may include an interrupter for controlling a laser beam delivered to the first and second laser heads, and a form for scribing and thermal shock of the laser beam delivered to the first and second laser heads. It may include a beam converter for converting.

The beam converter includes a beam splitter for dividing the laser beam into the plurality of beams, a plurality of cylindrical lenses for shaping the plurality of beams in an elliptical shape, and the plurality of cylindrical lenses in the optical axis direction. It may include a plurality of lens driving actuator for adjusting the shape of the plurality of beams.

The beam splitter may split the laser beam such that the plurality of beams have the same light intensity.

The beam transducer is configured to move each of the plurality of cylindrical lenses so that the conditions of the plurality of beams irradiated to the brittle material by the first and second laser heads during reciprocating scribing and during reciprocating full-cutting are equal. You can adjust it.

The beam transducer may adjust a length of a short axis crossing the scribing lines of the plurality of elliptical beams by moving the plurality of cylindrical lenses.

Laser processing apparatus according to the present invention, at least one laser generator for generating a laser beam; First and second laser heads which irradiate the laser beam onto the brittle material, the beam transducer converting a laser beam into a form for scribing and a form for thermal shock; An interrupter for interrupting a laser beam transmitted to the first and second laser heads; And a cooling fluid injector positioned between the first and second laser heads to inject a cooling fluid to the brittle material, wherein the beam converter comprises: a beam splitter for dividing the laser beam into the plurality of beams; A plurality of cylindrical lenses for shaping the plurality of beams in an elliptical shape, and a plurality of lens driving actuator for adjusting the shape of the plurality of beams by moving the plurality of cylindrical lenses in the optical axis direction.

The laser processing apparatus is disposed outside the first and second laser heads, respectively, and the first and second initial crack formers which form initial cracks for initiating scribing by applying mechanical processing force to the brittle material. It may be further provided.

According to the laser processing apparatus according to the present invention described above, the reciprocating scribing operation and the braking operation can be performed simultaneously in both directions, thereby improving the efficiency of the scribing and the braking operation. Therefore, high price competitiveness can be secured in the cutting of brittle materials.

Moreover, the quality of the cutting process by reciprocating scribing and braking can be made uniform by adjusting the conditions of the beam irradiated to a brittle material according to a scribing direction.

1 is a configuration of an embodiment of a laser processing apparatus according to the present invention.
2 is a configuration diagram showing a configuration example in the case of having two laser generators.
3 is a configuration diagram showing a configuration example in the case of having one laser generator.
4 shows one embodiment of a beam converter.
5 is a perspective view showing an example of a configuration for driving a cylindrical lens;
6 is a view for explaining a machining process in a first machining direction;
7 to 10 show examples of the form of spot beams irradiated onto a workpiece.
11 is a view for explaining a machining process in a second machining direction;

Hereinafter, with reference to the accompanying drawings will be described embodiments of the laser processing apparatus according to the present invention.

1 is a block diagram showing an embodiment of a laser processing apparatus according to the present invention. In the laser processing apparatus of this embodiment, a scribing line is formed on the surface of the brittle material for cutting using the heat stress generated by irradiating a laser to the surface of the brittle material and then spraying a cooling fluid, and scribing A device capable of breaking after forming a line to apply a thermal shock to the material to split the brittle material along the scribing line. The laser processing apparatus of this embodiment can work while the laser beam and the brittle material are moved relative to each other in both directions. Here, relative movement means that the laser beam and the brittle material are moved when the brittle material is moved in the processing direction and the laser beam is located at a fixed position, and the laser beam is moved in the processing direction and the brittle material is located at a fixed position. Includes the case where are moved in opposite directions. Of course, the case where the laser beam and the brittle material are moved in the same direction with each other but their speed is different.

Referring to Fig. 1, the workpiece 100 is irradiated with a workpiece 100 such as a table 100 on which a brittle material such as glass is placed, a laser generator 200 for generating a laser beam, and a laser beam. Positioned between the first and second laser heads 300a and 300b and the first and second laser heads 300a and 300b to cool the fluid to the workpiece W after irradiation of the beam for scribing. A cooling fluid injector 400 for injecting is shown.

As the laser generator 200, for example, a CO 2 laser may be employed. Although not shown in the drawings, the laser output detector, the laser driver, and the laser generator 200 which detect the output of the laser generated by the laser generator 200 and control the laser generator 200 to have a uniform output are turned on. A controller for turning on / off may be further provided. The laser output detector, the laser driver, and the controller may be integrally provided in the laser generator 200 or provided in a controller (not shown) for controlling the scribing apparatus.

The cooling fluid injector 400 may be in the form of a nozzle capable of interrupting the cooling fluid injector 400 and may receive a cooling fluid from a cooling fluid providing unit (not shown). When the machining operation is performed in the first machining direction S1, that is, when the movable body 10 is moved in the first machining direction S1, the first laser head 300a positioned in front of the machining direction is scribed. The second laser head which is also located in front of the machining direction when the ice work is performed and the machining operation is performed in the second machining direction S2, that is, when the movable body 10 is moved in the second machining direction S1. 300b performs a scribing operation. Therefore, the cooling fluid injector 400 is always located behind the first and second laser heads 300a and 300b in the processing directions S1 and S2.

Depending on the workpiece | work W, it is necessary to form the initial crack used as the starting point of a scribing line. The laser processing apparatus of this embodiment may further include first and second initial crack formers 500a and 500b which form initial cracks that are starting points of the scribing line. The first and second initial crack formers 500a and 500b are positioned outside the first and second laser heads 300a and 300b, respectively, to apply mechanical processing force to the workpiece W to form initial cracks. Can be. For example, the first and second initial crack formers 500a and 500b may be diamond wheels, but the scope of the present invention is not limited thereto. For example, the first and second initial crack formers 500a and 500b may form initial cracks by irradiating the workpiece W with a UV laser. The first initial crack former 500a is operated when the scribing operation is performed in the first processing direction S1, and the second initial crack former 500b is scribed in the second processing direction S2. It is activated when this is done. The first and second initial crack formers 500a and 500b do not necessarily need to be moved together with the first and second laser heads 300a and 300b. It may be installed so that the position movement only within the limits that can be formed.

In this embodiment, the first and second laser heads 300a and 300b, the cooling fluid injector 400, and the first and second initial crack formers 500a and 500b are formed in the first and second processing directions ( It is moved in the direction S1) (S2). To this end, the first and second laser heads 300a and 300b, the cooling fluid injector 400, and the first and second initial crack formers 500a and 500b are coupled to the first movable body 10. The first movable body 10 may be moved in the first and second processing directions S1 and S2 to the second movable body 20 extending in the first and second processing directions S1 and S2. Can be installed.

The second movable body 20 is supported by and supported by support members 31 and 32 extending in a direction perpendicular to the first and second processing directions S1 and S2, that is, a direction perpendicular to the ground in FIG. 1. It may be moved along the members 31 and 32 in a direction perpendicular to the first and second machining directions S1 and S2, that is, in the R direction.

The laser processing apparatus of this embodiment is characterized by being capable of reciprocating scribing and reciprocating full-cutting. To this end, a mode selector is provided in the laser processing apparatus of this embodiment. The mode selector controls the first and second laser heads 300a and 300b to operate in one of the scribing mode, the split mode, and the off mode to select reciprocating scribing and reciprocating full-cutting. For example, the mode selector may include a head positioned forward in the machining direction S1 and S2 of the first and second laser heads 300a and 300b so as to form a scribing line on the workpiece W. The beam is operated in a scribing mode in which the beam is shaped into a plurality of beams aligned in the machining directions S1 and S2 and irradiated to the workpiece W, and the machining direction among the first and second laser heads 300a and 300b. The head located behind (S1) (S2) irradiates the laser beam to the workpiece (W) after cooling to induce thermal shock, thereby irradiating the split mode and the laser beam to divide the workpiece (W) along the scribing line. Operate in one of the off modes.

In the laser processing apparatus of this embodiment, scribing in both directions is possible in the first and second processing directions S1 and S2. When scribing is performed in the first processing direction S1, the first laser head 300a positioned in front of the first processing direction S1 is operated in the scribing mode. At this time, the second laser head 300b is in an off mode. That is, the laser beam Lb guided to the second laser head 300b is blocked by the shutter 212. When scribing is performed in the second processing direction S2, the second laser head 300b positioned in front of the second processing direction S2 is operated in the scribing mode. At this time, the first laser head 300a is in an off mode. That is, the laser beam La guided to the first laser head 300a is blocked by the shutter 211.

The laser processing apparatus of this embodiment is capable of full-cutting in both directions in the first and second processing directions S1 and S2. In the case of performing the full-cutting in the first machining direction S1, the first laser head 300a positioned in front of the first machining direction S1 is operated in the scribing mode, and The two laser heads 300b are operated in a split mode for causing thermal shock. In the case of performing the full-cutting in the second machining direction S2, the second laser head 300b positioned in front of the second machining direction S2 is operated in the scribing mode, and 1 The laser head 300a is operated in a split mode for causing thermal shock.

The mode selector includes an interrupter for controlling the laser beams transmitted to the first and second laser heads 300a and 300b, and the first and second laser heads 300a and 300b corresponding to the scribing mode and the split mode. It may be provided with a beam converter for converting the laser beam (La) (Lb) transmitted to the form for scribing and the form for thermal shock.

For example, as shown in FIG. 2, two laser generators 200a and 200b are provided to provide laser beams La and Lb to the first and second laser heads 300a and 300b, respectively. In this case, the interrupter may be a controller embedded in the first and second laser generators 200a and 200b to turn on / off the laser beam. Of course, the interrupter may be implemented by optical shutters 211 and 212 disposed between the first and second laser heads 300a and 300b and the first and second laser generators 200a and 200b.

For example, as shown in FIG. 3, the laser beams La and Lb may be respectively provided to the second and second laser heads 300a and 300b using one laser generator 200. . The laser beam L generated by the laser generator 200 is divided into two laser beams La and Lb by the half mirror 201. The laser beam La is incident on the first laser head 300a. The laser beam Lb is guided to the second laser head 300b via the reflection mirrors 202, 203, 204. In this case, the interrupter may be implemented by shutters 211 and 212 for selectively interrupting the laser beams La and Lb incident to the first and second laser heads 300a and 300b. The laser generator 200, the half mirror 201, the reflection mirror 202, and the shutters 211 and 212 may be installed in the second movable body 20. The reflective mirrors 203 and 204 may be installed on the first movable body 10. Although not shown in the drawings, two laser generators 200 may be provided to provide laser beams to the first and second laser heads 300a and 300b, respectively. In this case, a switch for turning on / off the two laser generators 200 may be employed as the interrupting means. Hereinafter, a case in which the optical path shown in FIG. 3 is employed will be described as an example.

4 and 5, the beam converter includes beam splitters 301-304 for dividing a laser beam into a plurality of beams, cylindrical lenses 311-314 for shaping the plurality of beams in an elliptical shape, and cylindrical beams. An actuator 323 for moving the lenses 311-314 in the optical axis direction may be included.

Referring to FIG. 4, in the scribing mode, the first and second laser heads 300a and 300b receive the laser beam La Lb incident from the laser generator 200 in the first and second processing directions. The beam is divided into a plurality of beams aligned at (S1, S2), and shaped into elliptical light. In the present embodiment, as an example, the beam La (Lb) is divided into four beams L1, L2, L3, and L4. The first and second laser heads 300a and 300b have four beam splitters 301, 302, 303 and 304. The light intensities of the divided beams L1, L2, L3, L4 may be the same or different according to the reflectance of each of the beam splitters 301, 302, 303, 304. FIG. In this embodiment, the beam L is divided so that the light intensities of the beams L1, L2, L3, L4 are the same. To this end, the reflectances of the beam splitters 301, 302, 303, 304 may be selected to be 25%, 34%, 50%, and 100%, respectively. Then, the light intensities of the beams L1, L2, L3, L4 become 25% of the intensity of the beam L, respectively. The beam splitter 304 with 100% reflectivity is substantially a reflecting mirror, but is referred to herein as a beam splitter with 100% reflectivity in order to maintain functional consistency. In the above-described example, a case in which the beams La and Lb are divided such that the light intensities of the beams L1, L2, L3, and L4 are the same has been described. However, the scope of the present invention is not limited thereto. If necessary, the light intensity of at least one of the beams L1, L2, L3, and L4 may be different from the rest. For this purpose, beam splitters 301, 302, 303 and 304 having appropriate reflectances are selected. Can be. For example, beamsplitters 301, 302, 303, 304 may be replaceable.

Cylindrical lenses 311, 312, 313, 314 are employed to shape the beams L1, L2, L3, L4 into elliptical beams. In this embodiment, the cylindrical lens having the curvature in the direction (R) perpendicular to the first and second processing direction (S1, S2) in order to form a long elliptical beam in the first, second processing direction (S1, S2) (311) 312 (313) 314 are employed. As a result, four elliptical spot beams whose long axes are directed in the first and second machining directions S1 and S2 as indicated by reference numerals LS1, LS2, LS3 and LS4 in FIG. 4 can be irradiated to the workpiece W. FIG. have. Although not shown in FIG. 4, the beam converter further includes a cylindrical lens (not shown) having a curvature in the scribing direction to adjust the length of the long axis of the spot beams LS1, LS2, LS3, and LS4 as necessary. It is also possible to employ. In FIG. 4, four elliptical spot beams LS1, LS2, LS3, and LS4 are shown spaced apart from each other. However, this is for convenience of description and the scope of the present invention is not limited to the form shown in FIG. 4. . The four elliptical spot beams LS1, LS2, LS3, and LS4 may be arranged to contact adjacent beams with each other, and a predetermined amount may be disposed to overlap each other.

By moving each of the cylindrical lenses 311, 312, 313, and 314 in the optical axis direction, that is, in the Z direction of FIG. 4, the length of the short axis of the elliptical spot beams LS1, LS2, LS3, and LS4 can be adjusted. For example, as shown in FIG. 5, the laser head 300 supports one end of the cylindrical lens 311 to the guide member 321 provided in the optical axis direction, that is, in the Z direction, and the other end is also in the Z direction. It can be supported by the lead screw 322 installed as. The cylindrical lens 311 can be moved in the Z direction by rotating the lead screw 322 using a lens driving actuator 323 such as a rotary motor. Then, as illustrated in FIG. 5, the length of the short axis of the spot beam LS1 may be adjusted. In FIG. 5, only the configuration for moving the cylindrical lens 311 is disclosed, but the length of the short axis may be adjusted using the same configuration as the remaining cylindrical lenses 312, 313, and 314. Furthermore, in the case of further comprising a cylindrical lens having a curvature in the R direction, the length of the long axis of the spot beams LS1, LS2, LS3, and LS4 is also moved by moving the cylindrical lens in the optical axis direction Z by the same configuration. You can also adjust.

The structure for moving the cylindrical lens 311 shown in FIG. 5 in the optical axis direction is merely an example, and the scope of the present invention is not limited by the structure itself, and in addition to the structure shown in FIG. There may be various examples for moving 311 in the optical axis direction. For example, a linear motor capable of linear motion may be employed as the lens driving actuator 323. In this case, the cylindrical lens 311 may be supported by a guide rail (not shown) extending in the optical axis direction.

According to the above-described configuration, the beam transducers of the spot beams LS1, LS2, LS3, and LS4 may be used to obtain an optimum processing speed and quality according to conditions such as the material and thickness of the workpiece W corresponding to the scribing mode. You can adjust the shape.

In the split mode, a scribing line formed on the surface of the workpiece W grows in the thickness direction of the workpiece W by irradiating laser light to the workpiece W on which the scribing line is formed to thermally impact the workpiece W. Refers to the braking process to allow complete cutting. In the case of operating in the split mode, the configuration of the beam is not particularly limited, and depending on the kind or property of the material, the scribing line may be irradiated with a laser beam of a suitable intensity to grow in the thickness direction of the workpiece (W). Therefore, by using the above-described configuration of the beam converter, the cylindrical lenses 311, 312, 313 and 314 can be moved to form a spot of a laser beam suitable for the split mode.

Now, the laser processing operation process by the above-described configuration will be described.

First, the case where the scribing operation is performed in the first processing direction S1 will be described with reference to FIG. 6. In this case, the first laser head 300a positioned forward in the first processing direction S1 by the mode selector is operated in the scribing mode, and the laser beam Lb is blocked by the shutter 212 to perform the first operation. 2 The laser head 300b is in an off mode.

By driving the actuator 323 of the first laser head 300a, the spot beams LS1, LS2, LS3, and LS4 of the spot beam LS1, LS2, LS3, and LS4 are suitable for obtaining an optimal scribing quality in consideration of the material and thickness of the workpiece W. FIG. Adjust the shape. The shape of the spot beams LS1, LS2, LS3, and LS4 is, for example, as shown in FIG. 7, when the scribing operation is performed in the first processing direction S1, the spot beam positioned at the most upstream side ( The length of the short axis of LS1) can be made small and the length of the short axis of the spot beams LS2, LS3, LS4 can be made large. Such a form increases the relative light intensity of the spot beam LS1 with respect to the spot beams LS2, LS3, and LS4. That is, by increasing the light density of the spot beam LS1 to increase the irradiated light energy per unit area, the surface temperature of the workpiece W is quickly increased and the light density of the following spot beams LS2, LS3, LS4 is reduced. To maintain the elevated temperature.

As another example, the shape of the spot beam is, as shown in Fig. 8, the length of the short axis of the spot beam LS1 located on the most upstream side when the scribing operation is performed in the first scribing direction S1. The length of the short axis of the spot beams LS2, LS3, LS4 can be reduced. Such a form is a form which raises the temperature of the workpiece | work W gradually.

As another example, as shown in FIG. 9, the shape of the spot beams LS1, LS2, LS3, and LS4 may be the same, and the workpiece W may be heated to a uniform light density.

As another example, as shown in FIG. 10, the spot beams LS1 and LS4 positioned at the outside may have the same shape, and the spot beams LS2 and LS4 located at the inside may have the same shape. That is, the shape of the spot beams LS1, LS2, LS3, and LS4 may be symmetrical with respect to the first and processing directions S1 and S2.

The shape of the spot beams LS1, LS2, LS3, and LS4 is not limited to the above-described examples, and the physical properties of the workpiece such as the material and thickness of the workpiece W, and the plurality of beams L1, L2, L3, and L4, respectively. May be appropriately determined according to conditions such as light intensity, scribing working speed, and the like. As shown in FIG. 5, the adjustment of the beam shape is performed by moving each of the cylindrical lenses 301, 302, 303, 304 in the optical axis direction Z using a plurality of actuators 323. By adjusting Of course, when a cylindrical lens and an actuator are further provided to adjust the length of the long axis of the spot beams LS1, LS2, LS3, and LS4, the long axis of the spot beams LS1, LS2, LS3, and LS4 may be used as necessary. You can also adjust the length.

When the shaping of the spot beams LS1, LS2, LS3, and LS4 is completed, the first movable body 10 is moved in the first processing direction S1. The first initial crack former 500a positioned on the upstream side of the first processing direction S1 with respect to the first laser head 300a is lowered toward the workpiece W. As shown in FIG. When the first initial crack former 500a reaches the start position of scribing, the first initial crack former 500a applies the mechanical processing force to the surface of the workpiece W to form the initial crack C1. The length of the initial crack C1 may be, for example, within 1 mm, but the scope of the present invention is not limited thereto. Upon completion of the initial crack C1 formation, the initial crack former 501 is spaced apart from the surface of the workpiece W. FIG.

As the first movable body 10 is moved in the first processing direction S1, the spot beams LS1, LS2, LS3, and LS4 irradiated from the first laser head 300a are irradiated onto the surface of the workpiece W. As shown in FIG. . Then, the surface of the workpiece W irradiated with the spot beams LS1, LS2, LS3, and LS4 has a property of expanding in a direction perpendicular to the scribing direction S1 as the temperature increases. However, in areas other than the areas to which the spot beams LS1, LS2, LS3 and LS4 are irradiated, the temperature is low, thereby preventing expansion, thereby compressing stress in the areas to which the spot beams LS1, LS2, LS3 and LS4 are irradiated. Is generated, and tensile stress is generated in a direction perpendicular to the direction of the compressive stress.

Subsequently, the cooling fluid is irradiated to the workpiece W from the cooling fluid injector 400 located on the downstream side of the first processing direction S1 with respect to the first laser head 300a. Then, the workpiece W is cooled while the workpiece W is cooled, and the crack proceeds from the initial crack C1 to the first processing direction S1 by the tensile stress at this time. The crack proceeds from the initial crack C1 to the heating direction by the first laser head 300, whereby the scribing line SL1 is generated in the workpiece W in the first processing direction S1. . Since the depth of the scribing line SL1 is shallower than the thickness of the workpiece W, the workpiece W is not completely cut. When the formation of the first scribing line SL1 having a desired length on the workpiece W is completed, the first laser head 300a and the cooling fluid injector 400 stop the irradiation of the beam and the injection of the cooling fluid, respectively.

Next, a process of forming the scribing line SL2 in the second processing direction S2 will be described with reference to FIG. 11. In this case, the second laser head 300b positioned forward in the second processing direction S2 is operated in the scribing mode, and the laser beam La is blocked by the shutter 211 so that the first laser head ( 300a) goes into the off mode.

Since the second initial crack former 500b and the cooling fluid injector 400 are located on the upstream side and the downstream side of the second processing direction S2 of the second laser head 300b, the second movable body 20 is provided. In the R direction to align the second laser head 300 to the position where the second scribing line SL2 is to be formed, while moving the first movable body 10 in the second processing direction S2. The second scribing line SL2 may be formed by the same process as described above.

In order to improve the uniformity of the quality of the scribing lines SL1 and SL2 formed by the scribing operation in the first and second scribing directions S1 and S2, the swivel in the second processing direction S2 may be used. Before performing the scribing operation, a process of adjusting the spot beams LS1, LS2, LS3, and LS4 may be performed so as to have the same condition as the scribing operation in the first processing direction S1. For example, when the beam spot is adjusted in the form as shown in FIG. 7 when the scribing operation is performed in the first processing direction S1, that is, the light of the spot beam LS1 located at the most upstream side. The spot beams LS1, LS2, LS3, and LS4 are designed to maintain the elevated temperature by decreasing the optical density of the spot beams LS2, LS3, and LS4 that follow and rapidly increase the surface temperature of the workpiece W with the largest density. When the shape of the beam is adjusted, the shape of the spot beams LS1, LS2, LS3, and LS4 is adjusted to have the same condition even when scribing in the second processing direction S2. Such adjustment is possible by moving the cylindrical lenses 301, 302, 303, 304 in the optical axis direction Z using the actuator 323 as shown in FIG. 5. That is, as shown in FIG. 8, the light density of the spot beam LS4 located on the upstream side of the second processing direction S2 is maximized, and the light density of the following spot beams LS3, LS2, LS1 is increased. By making it small, the scribing operation can be performed under the same conditions as when the scribing operation is performed in the first processing direction S1. As a result, even when the scribing operation is performed in both directions S1 and S2, a scribing line having a uniform quality can be obtained.

When the scribing operation in the first processing direction S1 is performed using the spot beams LS1, LS2, LS3, and LS4 of the type shown in FIG. 9, the plurality of beams L1, L2, L3, and L4. If the light intensities are the same, it is not necessary to adjust the shape of the spot beams LS1, LS2, LS3, and LS4. However, if the light intensity of the plurality of beams (L1, L2, L3, L4) is different and the quality of the scribing line depends on the optical density due to the properties of the workpiece W, the second processing direction S2 Before performing the scribing operation, it may be necessary to adjust the shape of the spot beams LS1, LS2, LS3, and LS4 so as to have the same optical density condition as in the scribing operation in the first processing direction S1.

In addition, when the scribing operation in the first processing direction S1 is performed using the spot beams LS1, LS2, LS3, and LS4 of the type shown in FIG. 10, the plurality of beams L1, L2, and L3 are used. If the light intensities of L4 are the same, it is not necessary to adjust the shape of the spot beams LS1, LS2, LS3, and LS4 for the scribing operation in the second processing direction S2.

As described above, the adjustment of the shape of the spot beams LS1, LS2, LS3, and LS4 allows the second movable body 20 to move the first movable body 10 to a position where the scribing line SL2 is to be formed. May be performed before or during the movement in the R direction, or after the movement is completed.

Next, the first movable body 10 is moved in the second processing direction S2. At this time, the second initial crack former 500b positioned on the upstream side of the second processing direction S2 with respect to the second laser head 300b is lowered toward the workpiece W. FIG. When the second initial crack former 500b reaches the start position of scribing, the second initial crack former 500b applies the mechanical working force to the surface of the workpiece W to form the initial crack C2. Upon completion of the initial crack C2 formation, the second initial crack former 500b is spaced apart from the surface of the workpiece W. FIG. As the first movable body 10 is moved in the second processing direction S2, the spot beams LS1, LS2, LS3, and LS4 irradiated from the second laser head 300b are irradiated onto the surface of the workpiece W. As shown in FIG. . Subsequently, the cooling fluid is irradiated to the workpiece W from the cooling fluid injector 400 located downstream of the second scribing direction S2 with respect to the second laser head 300b. Then, the workpiece W shrinks while being cooled, and the crack proceeds from the initial crack C2 to the second processing direction S2 by the tensile stress at this time. The crack proceeds from the initial crack C2 to the direction heated by the second laser head 300b, whereby the workpiece W has a second scribing line SL2 in the second machining direction S2. Is generated. When the formation of the second scribing line SL2 having a desired length on the workpiece W is completed, the second laser head 300b and the cooling fluid injector 400 stop the irradiation of the beam and the injection of the cooling fluid, respectively.

As described above, a plurality of scribing lines arranged in the R direction can be formed while reciprocating the first and second laser heads 300a and 300b in the first and second machining directions S1 and S2. have.

In the conventional laser scribing apparatus, one cooling fluid injector is installed at one side of one laser head and an initial crack former is disposed at the other side, so that only a single scribing operation is possible. Therefore, in order to form a plurality of parallel scribing lines, the scribing lines are formed by spraying cooling fluid while moving the laser in one direction to form a scribing line, and then moving back in one direction after returning to the original position. Had to be formed.

However, as described above, according to the laser scribing apparatus of the present embodiment, a cooling fluid sprayer 400 is provided between the first and second laser heads 300a and 300b. Since the second initial crack formers 500a and 500b are disposed outside the first and second laser heads 300a and 300b, bidirectional reciprocating scribing is possible. According to this, if the laser generator of the same output is adopted and the moving speeds of the first and second movable bodies 10 and 20 are the same, it means that the scribing line can be formed twice as compared with the conventional one. . This fast work speed can lower the cost of processing, significantly improving the price competitiveness of the scribing industry. In particular, it is possible to respond quickly and competitively to the demand for cutting glass for substrates of small and large display devices, which is increasing in recent years.

If the conditions of the beam irradiated to the workpiece W in both directions of scribing vary depending on the direction, the quality of the scribing line may vary depending on the machining direction. To this end, according to the laser processing apparatus of the present invention, the cylindrical beams 301, 302, 303, 304 and the actuator 323, which can adjust the shape of the spot beams LS1, LS2, LS3, and LS4, are provided. Since the laser heads 300a and 300b are employed, the conditions of the beam irradiated to the workpiece W can be made the same during bidirectional reciprocating scribing. Thus, the quality of the scribing lines formed by the reciprocating scribing operation can be made uniform.

The laser processing apparatus of this embodiment is capable of full-cutting operation capable of scribing and breaking simultaneously.

In the case of performing the full-cutting operation in the first machining direction S1, the mode selector operates the first laser head 300a positioned forward in the first machining direction S1 in the scribing mode, and is positioned backward. The second laser head 300b is operated in the split mode.

As in the case of the scribing operation, the spot beam may be driven to drive the actuator 323 of the first laser head 300a to obtain an optimal scribing quality in consideration of the material and thickness of the workpiece W. LS1, LS2, LS3, LS4). In addition, the spot beam is adjusted in a form suitable for the split mode of the second laser head 300b. This adjustment may be performed by driving the actuator 323 of the second laser head 300b to adjust the positions of the four cylindrical lenses. For example, the shape of the beam spot by the second laser head 300b in the split mode may be the shape shown in FIG. 9, but the scope of the present invention is not limited thereto. The beam spot in the split mode is a form that can thermally impact the workpiece (W) to grow the scribing line in the thickness direction of the workpiece (W), appropriately considering the material and thickness of the workpiece (W). Can be adjusted.

Referring to FIG. 6, when shaping of the spot beams LS1, LS2, LS3, and LS4 of the first and second laser heads 300a and 300b is completed, the first movable body 10 may move in the first processing direction ( Is moved to S1). The initial crack C1 is formed at the start position of scribing by the first initial crack former 500a positioned on the upstream side of the first processing direction S1 with respect to the first laser head 300a. As the first movable body 10 moves in the first processing direction S1, the spot beams LS1, LS2, LS3, and LS4 irradiated from the first laser head 300a are irradiated onto the surface of the workpiece W. Subsequently, the cooling fluid is irradiated from the cooling fluid injector 400 to the workpiece W to generate the scribing line SL1 in the workpiece W in the first processing direction S1. Next, when the laser beam is irradiated to the workpiece W by the second laser head 300b, in detail, a portion where the first scribing line SL1 is formed, energy of the laser beam is applied to the workpiece W. The heat stress absorbed and accumulated by the first scribing line SL1 is further expanded. As a result, the crack of the first scribing line SL1 is further deepened in the depth direction of the workpiece W and completely grown in the thickness direction of the workpiece W. FIG. By this process, the workpiece W is completely divided along the first scribe line SL1.

Next, a process of performing a full-cutting operation in the second processing direction S2 will be described with reference to FIG. 11. In this case, the mode selector operates the second laser head 300b positioned forward in the second machining direction S2 in the scribing mode, and operates the first laser head 300b positioned behind in the split mode. .

In order to improve the quality uniformity of the cutting process by the full-cutting operation, the same conditions as in the full-cutting operation of the first processing direction S1 are performed before the full-cutting operation of the second processing direction S2 is performed. The process of adjusting the shape of the spot beams LS1, LS2, LS3, and LS4 of the first and second laser heads 300a and 300b may be performed so that the process is pulled in the first processing direction S1. Same as described in the case of performing the cutting operation.

Next, the first movable body 10 is moved in the second processing direction S2. The initial crack C2 is formed at the start position of scribing by the second initial crack former 500b, and the second laser head 300b is moved as the first movable member 10 moves in the second processing direction S2. The spot beams LS1, LS2, LS3, LS4 irradiated from) are irradiated onto the surface of the workpiece W. When the cooling fluid is irradiated to the workpiece (W) from the cooling fluid injector 400, the crack is advanced from the initial crack (C2) to the second machining direction (S2) to the workpiece (W) in the second machining direction (S2) Two scribe lines SL2 are generated. Next, when the laser beam is irradiated to the workpiece W by the first laser head 300a, in detail, the portion where the second scribing line SL2 is formed, the energy of the laser beam is applied to the workpiece W. The heat stress absorbed and accumulated by the second scribing line SL2 is further expanded. As a result, the crack of the second scribing line SL2 is further deepened in the depth direction of the workpiece W and completely grown in the thickness direction of the workpiece W. FIG. By this process, the workpiece W is completely divided along the second scribing line SL2.

As described above, the workpiece W can be cut while reciprocating the first and second laser heads 300a and 300b in the first and second machining directions S1 and S2. Therefore, since the scribing operation and the braking operation can be performed by an integrated process, the cutting speed can be significantly improved, and the cutting processing cost and the equipment cost can be reduced.

While many details are set forth in the foregoing description, they should be construed as illustrative of preferred embodiments, rather than to limit the scope of the invention. Therefore, the scope of the present invention should not be defined by the described embodiments, but should be determined by the technical spirit described in the claims.

10 ...... First movable body 20 ...... Second movable body
31, 32 ...... Support member 100 ...... Table
200 ...... laser generator 200a, 200b ..... 1st, 2nd laser generator
201 ... Half mirror ㅗ 202, 203, 204 ... Reflection mirror
211, 212 ... optical shutter 300a, 300b ... 1st, 2nd laser head
301, 302, 303, 304 ...... beam splitter
311, 312, 313, 314 ...... cylindrical lens
321 ... guide member 322 ... lead screw
323 ...... Lens drive actuator 400 ...... Cooling fluid injector
500a, 500b ... first and second initial crack formers
C1, C2 ...... Initial Crack S1, S2 ...... First, Second Machining Direction
LS1, LS2, LS3, LS4 ...... spot beam

Claims

One or more laser generators for generating a laser beam;
First and second laser heads for irradiating the laser beam onto the brittle material;
A cooling fluid injector positioned between the first and second laser heads to inject a cooling fluid to the brittle material;
A head positioned forward in the processing direction among the first and second laser heads is formed by irradiating the brittle material by shaping the laser beam into a plurality of beams aligned in the processing direction to form a scribing line in the brittle material. And a head positioned rearward in the processing direction among the first and second laser heads, after cooling, irradiates a lazy beam to the brittle material to cause thermal shock along the scribing line. A mode selector for operating in one of a split mode for dividing the brittle material and an off mode that does not irradiate a laser beam;
Laser processing apparatus characterized by the choice of reciprocating scribing and reciprocating full-cutting.

The method of claim 1,
The mode selector may include an interrupter for controlling a laser beam delivered to the first and second laser heads, and a form for scribing and thermal shock of the laser beam delivered to the first and second laser heads. Laser processing apparatus comprising a beam converter for converting.

The method of claim 2,
The beam converter includes a beam splitter for dividing the laser beam into the plurality of beams, a plurality of cylindrical lenses for shaping the plurality of beams in an elliptical shape, and the plurality of cylindrical lenses in the optical axis direction. Laser processing apparatus comprising a plurality of lens driving actuator for adjusting the shape of the plurality of beams.

The method of claim 2,
And the beam splitter splits the laser beam such that the plurality of beams have the same light intensity.

The method of claim 3,
The beam transducer is configured to move each of the plurality of cylindrical lenses so that the conditions of the plurality of beams irradiated to the brittle material by the first and second laser heads during reciprocating scribing and during reciprocating full-cutting are equal. Laser processing apparatus characterized in that to adjust to.

The method of claim 5,
And moving the plurality of cylindrical lenses to adjust a length of a short axis crossing the scribing lines of the plurality of elliptical beams.

One or more laser generators for generating a laser beam;
First and second laser heads which irradiate the laser beam onto the brittle material, the beam transducer converting a laser beam into a form for scribing and a form for thermal shock;
An interrupter for interrupting a laser beam transmitted to the first and second laser heads; And
And a cooling fluid injector positioned between the first and second laser heads to inject a cooling fluid to the brittle material.
The beam converter includes a beam splitter for dividing the laser beam into the plurality of beams, a plurality of cylindrical lenses for shaping the plurality of beams in an elliptical shape, and the plurality of cylindrical lenses in the optical axis direction. Laser processing apparatus comprising a plurality of lens driving actuator for adjusting the shape of the plurality of beams.

The method of claim 7, wherein
The beam transducer is configured to move each of the plurality of cylindrical lenses so that the conditions of the plurality of beams irradiated to the brittle material by the first and second laser heads during reciprocating scribing and during reciprocating full-cutting are equal. Laser processing apparatus characterized in that to adjust to.

The method according to any one of claims 1 to 8,
And first and second initial crack formers respectively disposed outside the first and second laser heads to form initial cracks for initiating scribing by applying mechanical processing force to the brittle material. Laser processing equipment.