KR20120068900A - 곡률 제어층을 갖는 ⅲ-질화물 발광 디바이스 - Google Patents

곡률 제어층을 갖는 ⅲ-질화물 발광 디바이스 Download PDF

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Publication number
KR20120068900A
KR20120068900A KR1020127008995A KR20127008995A KR20120068900A KR 20120068900 A KR20120068900 A KR 20120068900A KR 1020127008995 A KR1020127008995 A KR 1020127008995A KR 20127008995 A KR20127008995 A KR 20127008995A KR 20120068900 A KR20120068900 A KR 20120068900A
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South Korea
Prior art keywords
layer
curvature control
control layer
type region
lattice constant
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KR1020127008995A
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Korean (ko)
Inventor
린다 티. 로마노
파리야트 프라밀 데브
앤드류 와이. 킴
존 에프. 캐딩
Original Assignee
필립스 루미리즈 라이팅 캄파니 엘엘씨
코닌클리즈케 필립스 일렉트로닉스 엔.브이.
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Application filed by 필립스 루미리즈 라이팅 캄파니 엘엘씨, 코닌클리즈케 필립스 일렉트로닉스 엔.브이. filed Critical 필립스 루미리즈 라이팅 캄파니 엘엘씨
Publication of KR20120068900A publication Critical patent/KR20120068900A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/815—Bodies having stress relaxation structures, e.g. buffer layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02373—Group 14 semiconducting materials
    • H01L21/02378—Silicon carbide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/0242—Crystalline insulating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02436—Intermediate layers between substrates and deposited layers
    • H01L21/02439—Materials
    • H01L21/02455—Group 13/15 materials
    • H01L21/02458—Nitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02436—Intermediate layers between substrates and deposited layers
    • H01L21/02494—Structure
    • H01L21/02496—Layer structure
    • H01L21/02505—Layer structure consisting of more than two layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02538—Group 13/15 materials
    • H01L21/0254—Nitrides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/817—Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/822—Materials of the light-emitting regions
    • H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Led Devices (AREA)
KR1020127008995A 2009-09-08 2010-08-04 곡률 제어층을 갖는 ⅲ-질화물 발광 디바이스 Withdrawn KR20120068900A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/555,000 US20110057213A1 (en) 2009-09-08 2009-09-08 Iii-nitride light emitting device with curvat1jre control layer
US12/555,000 2009-09-08

Publications (1)

Publication Number Publication Date
KR20120068900A true KR20120068900A (ko) 2012-06-27

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127008995A Withdrawn KR20120068900A (ko) 2009-09-08 2010-08-04 곡률 제어층을 갖는 ⅲ-질화물 발광 디바이스

Country Status (7)

Country Link
US (2) US20110057213A1 (enExample)
EP (1) EP2476144A1 (enExample)
JP (1) JP2013504197A (enExample)
KR (1) KR20120068900A (enExample)
CN (1) CN102484178A (enExample)
TW (1) TW201117418A (enExample)
WO (1) WO2011030238A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200079132A (ko) * 2018-12-24 2020-07-02 한국세라믹기술원 전기화학적 에칭법을 이용한 프리 스탠딩 질화갈륨 기판 제조 방법 및 이를 포함하는 물분해 수소생산용 광전극

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130082274A1 (en) * 2011-09-29 2013-04-04 Bridgelux, Inc. Light emitting devices having dislocation density maintaining buffer layers
JP5166594B1 (ja) 2011-12-12 2013-03-21 株式会社東芝 半導体発光素子
EP2696365B1 (en) * 2012-08-09 2021-06-23 Samsung Electronics Co., Ltd. Method of manufacturing a semiconductor device using a semiconductor buffer structure
EP2908330B1 (en) * 2012-10-12 2021-05-19 Sumitomo Electric Industries, Ltd. Group iii nitride composite substrate, manufacturing method therefor, and group iii nitride semiconductor device manufacturing method
CN107275425B (zh) * 2013-01-31 2019-10-15 欧司朗光电半导体有限公司 半导体层序列和用于制造半导体层序列的方法
CN107408933B (zh) * 2014-10-03 2020-11-20 芬兰国家技术研究中心股份公司 温度补偿复合谐振器
CN108054260A (zh) * 2017-10-25 2018-05-18 华灿光电（浙江）有限公司 一种发光二极管的外延片及制备方法
US12349528B2 (en) 2021-10-25 2025-07-01 Meta Platforms Technologies, Llc Strain management of III-P micro-LED epitaxy towards higher efficiency and low bow

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6996150B1 (en) * 1994-09-14 2006-02-07 Rohm Co., Ltd. Semiconductor light emitting device and manufacturing method therefor
US5670798A (en) * 1995-03-29 1997-09-23 North Carolina State University Integrated heterostructures of Group III-V nitride semiconductor materials including epitaxial ohmic contact non-nitride buffer layer and methods of fabricating same
JPH0964477A (ja) * 1995-08-25 1997-03-07 Toshiba Corp 半導体発光素子及びその製造方法
JPH10150245A (ja) * 1996-11-21 1998-06-02 Matsushita Electric Ind Co Ltd 窒化ガリウム系半導体の製造方法
US6194742B1 (en) * 1998-06-05 2001-02-27 Lumileds Lighting, U.S., Llc Strain engineered and impurity controlled III-V nitride semiconductor films and optoelectronic devices
JP2002261033A (ja) * 2000-12-20 2002-09-13 Matsushita Electric Ind Co Ltd 半導体の製造方法、半導体基板の製造方法及び半導体発光素子
JP3866540B2 (ja) * 2001-07-06 2007-01-10 株式会社東芝 窒化物半導体素子およびその製造方法
CN1324772C (zh) * 2002-06-19 2007-07-04 日本电信电话株式会社 半导体发光器件
WO2006054737A1 (en) * 2004-11-18 2006-05-26 Showa Denko K.K. Gallium nitride-based semiconductor stacked structure, method for fabrication thereof, gallium nitride-based semiconductor device and lamp using the device
US7795050B2 (en) * 2005-08-12 2010-09-14 Samsung Electronics Co., Ltd. Single-crystal nitride-based semiconductor substrate and method of manufacturing high-quality nitride-based light emitting device by using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200079132A (ko) * 2018-12-24 2020-07-02 한국세라믹기술원 전기화학적 에칭법을 이용한 프리 스탠딩 질화갈륨 기판 제조 방법 및 이를 포함하는 물분해 수소생산용 광전극

Also Published As

Publication number Publication date
WO2011030238A1 (en) 2011-03-17
JP2013504197A (ja) 2013-02-04
EP2476144A1 (en) 2012-07-18
US20120264248A1 (en) 2012-10-18
CN102484178A (zh) 2012-05-30
TW201117418A (en) 2011-05-16
US20110057213A1 (en) 2011-03-10

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PA0105 International application

Patent event date: 20120406

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid