KR20120041885A - Multi-wafer finger robot capable of varing the pitch easily - Google Patents
Multi-wafer finger robot capable of varing the pitch easily Download PDFInfo
- Publication number
- KR20120041885A KR20120041885A KR1020100103280A KR20100103280A KR20120041885A KR 20120041885 A KR20120041885 A KR 20120041885A KR 1020100103280 A KR1020100103280 A KR 1020100103280A KR 20100103280 A KR20100103280 A KR 20100103280A KR 20120041885 A KR20120041885 A KR 20120041885A
- Authority
- KR
- South Korea
- Prior art keywords
- ball screw
- coupled
- pitch
- finger
- nut
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/102—Gears specially adapted therefor, e.g. reduction gears
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
- Transmission Devices (AREA)
Abstract
Description
The present invention relates to a multi-wafer finger robot having a variable pitch that can easily change a pitch for each finger in a robot having a multi-wafer finger.
The semiconductor forms a plurality of circuit patterns through selective and repetitive processes such as photolithography, etching, implantation, diffusion, and deposition on a wafer. At this time, the wafer is not only transferred to a semiconductor manufacturing facility that performs each unit process until the semiconductor device is completed, but also a transfer process of a process performing position or a setting position assisting the process is performed within the semiconductor device manufacturing facility. Going through.
In order to perform this transfer process, finger robots are used in semiconductor manufacturing facilities to transfer wafers to each unit process and to align wafers to perform each unit process.
Recently, in order to improve the work efficiency of the wafer finger robot, it is common to use a multi-finger mounted to be able to transfer a plurality of wafers at the same time. In the conventional multi-finger robot, since the vertical pitch of the fingers is fixed, the vertical pitch of the self to transfer and convey the wafers is different from each other. .
In order to solve this problem, Patent Publication No. 10-2009-0052424 discloses a variable pitch multi-finger robot that can collectively transfer wafers by varying the pitch of the finger according to the pitch of the self to transfer and transport the wafer. .
According to the present invention, in a multi-finger robot having a plurality of fingers in a vertical direction for collectively transferring wafers, a vertical transfer guide in which each finger is fixed to be vertically transported, and a vertical of the fingers A transfer belt connected to different sides of a pair of fingers symmetrically on the upper side and the lower side with respect to the center of the direction, and on the upper side and the lower side of the vertical transfer guide to wind each transfer belt to vary the pitch between the fingers. And a feed motor for driving each of the feed pulleys. With this configuration, the pitch between the fingers can be varied using a transfer belt and a transfer pulley.
However, although the pitch between the fingers can be varied by the Patent Publication No. 10-2009-0052424, there is a problem that the position of the finger does not have the required pitch value due to the weakening of the tension caused by the long time use of the belt, accordingly The belt should be replaced at regular intervals. On the other hand, since the semiconductor process is usually carried out about 14 days, there is a problem in that the production disruption due to the replacement of the belt is deviated.
Therefore, there is a need for the development of a variable pitch multi-finger robot with improved durability and simple configuration. In addition, in the conventional pitch-variable multi-finger robot, since the center of the pulley must be coupled to the drive shaft of the motor while the belt is coupled to the pulley every time the pitch is adjusted according to the change in the field, the pitch is not easily changed. There is a feeling.
Disclosure of Invention An object of the present invention is to provide a multi-finger robot that can easily change pitch with a structure having improved durability in a pitch-variable multi-finger robot.
In addition, another object of the present invention is to provide a multi-finger robot that is easy to change the pitch that can easily adjust the pitch between the fingers according to each process of the semiconductor wafer.
In addition, another object of the present invention is to provide a multi-finger robot that is easy to change the pitch can be made compact by performing a function in a simple structure in varying the pitch of the multi-finger.
According to the present invention, the
Here, the
In addition, the
In addition, the first moving
In addition, the
In addition, the fourth moving
In addition, the
In addition, the
In addition, the
Therefore, according to the present invention, it is possible to provide a structure with improved durability in a variable pitch multi-finger robot. In addition, the pitch between the fingers can be easily adjusted by separating and coupling the ball screw and the ball screw nut by the coupler for each pitch according to each process of the semiconductor wafer. In addition, it is to provide a multi-finger robot that is easy to change the pitch can be made compact by performing a function in a simple structure in changing the pitch of the multi-finger.
1 is a left side perspective view of a multi-finger robot with easy pitch change according to a first preferred embodiment of the present invention.
2 is a right side perspective view of a multi-finger robot having a variable pitch according to a first preferred embodiment of the present invention.
Fig. 3 is a schematic diagram of a main portion of pitch variation for a multi-finger robot with easy pitch variation according to a modification of the first preferred embodiment of the present invention.
Fig. 4 is a schematic diagram of an essential part of pitch variation for a multi-finger robot with easy pitch variation according to a second preferred embodiment of the present invention.
Hereinafter, with reference to the accompanying drawings it will be described in detail with respect to the multi-finger robot easy to change the pitch according to an embodiment of the present invention.
1 is a left side perspective view of a multi-finger robot with easy pitch change according to a first preferred embodiment of the present invention, and FIG. 2 is a right side of a multi-finger robot with easy pitch change according to a first preferred embodiment of the present invention. Perspective view.
As shown in Figure 1 and 2, the multi-finger robot easy to change the pitch according to the first embodiment of the present invention, the
Here, the
The
In addition, the
The
The first moving
The second moving
Here, it is preferable that ratio of the 1st pitch which the thread of the
The
Therefore, when the
The
The fourth moving
The fifth moving
The
Therefore, when the
On the other hand, a plurality of fingers of the
The other end of the
Therefore, when the
At this time, since the
On the other hand, the
As described above, the multi-finger robot having a variable pitch according to the first exemplary embodiment of the present invention may have
As described above, the multi-finger robot which can be easily changed in pitch according to the first exemplary embodiment of the present invention has a second driving unit that reversely rotates with the
According to the multi-finger robot with easy pitch change according to the first preferred embodiment of the present invention, each of the
Fig. 3 is a schematic diagram of a main portion of pitch variation for a multi-finger robot with easy pitch variation according to a modification of the first preferred embodiment of the present invention.
As shown in FIG. 3, the
The multi-finger robot having a variable pitch easily according to the first embodiment of the present invention described above has a
In the multi-finger robot having a variable pitch according to the second preferred embodiment of the present invention, the description of the same configuration as that of the first embodiment will be omitted, and the difference will be described with reference to FIG. 4.
Fig. 4 is a schematic diagram of an essential part of pitch variation for a multi-finger robot with easy pitch variation according to a second preferred embodiment of the present invention.
As shown in FIG. 4, in the multi-finger robot having a variable pitch according to the second exemplary embodiment of the present invention, the
First, second, fourth, and fifth moving
At this time, the
The first, second, fourth and fifth
Accordingly, when the
As described above, the multi-finger robot which can easily change the pitch according to the second preferred embodiment of the present invention has the same function as the first embodiment, but in the configuration, the process of transmitting power is greatly simplified, and thus the power transmission loss. As well as reducing the energy savings, there is an effect that can reduce the size of the robot.
100: frame
110: floor frame
120: vertical frame
122: upper frame
130: support
300: power generating unit
302: motor
304: motor shaft
304a: first pulley
304b: second pulley
304c: third pulley
304d: belt
306: transmission shaft
308a: electric gear
308b: driven gear
310: first drive shaft
320: second drive shaft
400: first driving unit
410: first moving part
412: first ball screw
414: first ball screw nut
416: First guide
420: second moving part
422: second ball screw
424: second ball screw nut
426: Second guide
460: first coupler
500: second drive unit
540: fourth moving part
542: fourth ball screw
544: fourth ball screw nut
546: Fourth Guide
550: fifth moving part
552: fifth ball screw
554: fifth ball screw nut
556: Fifth Guide
560: second coupler
600: finger
610: first finger
612: first connecting rod
614: first bracket
620: second finger
622: second connecting rod
624: second bracket
630: third finger
632: third connecting rod
634: third bracket
640: fourth finger
642: fourth connecting rod
644: fourth bracket
650: fifth finger
652: fifth connecting rod
654: fifth bracket
710: first coupler
720: second coupler
730: third coupler
Claims (9)
Receiving power from the power generating unit 300 by a ball screw having a thread of different pitches for converting the rotational movement into vertical movements of different pitches by a nut coupled to the ball screw and a guide coupled to the nut First drive unit 400;
Corresponding to the first drive unit 400 by receiving the power from the power generating unit 300 by the ball screw having a screw thread of different pitch to rotate the rotational movement by the nut coupled to the ball screw and the guide coupled to the nut A second driver 500 for converting the pitch into vertical movements; And
The first driver 400 and the second driver 500 to have different separation spaces with respect to the wafer by vertical movements of different pitches switched by the first driver 400 and the second driver 500. Pitch variable easy multi-finger robot, characterized in that it comprises a finger portion 600 coupled to.
The second moving part 420 has a second pitch, which is smaller than the first pitch, and a second ball screw nut nut-coupled to the second ball screw 422 and the second ball screw 422 having threads in the forward direction. And a second guide 426 coupled to the second ball screw nut 424 for guiding in linear upward motion with respect to the forward rotation of the second ball screw 422. This easy multi finger robot.
The fifth moving part 550 has a fifth pitch equal to the first pitch and a pitch larger than the fourth pitch, and is nut-coupled to the fifth ball screw 552 and the fifth ball screw 552 having threads in the reverse direction. A fifth guide 556 coupled to the fifth ball screw nut 554 and the fifth ball screw nut 554 for guiding in a linear downward motion with respect to the reverse rotation of the fifth ball screw 552. Multi-finger robot easy pitch variable, characterized in that.
The first driving unit 400 is coupled to the first ball screw 412 and the second ball screw 422 having a gap of the first pitch and the thread direction opposite to each other,
The fourth ball screw 542 and the fifth ball screw 552 of the second driving part 500 have a pitch smaller than the first pitch and the thread directions are coupled to each other in opposite directions.
The first finger 610 is coupled to the first guide 416 for linear movement coupled to the first ball screw nut 414,
The fifth finger 650 is coupled to the second guide 426 for linear movement by being coupled to the second ball screw nut 424,
The second finger 620 is coupled to the fourth guide 546 coupled to the fourth ball screw nut 544 for linear movement.
Pitch variable easy multi-finger robot, characterized in that the fourth finger 640 is coupled to the fifth guide 556 for linear movement coupled to the fifth ball screw nut (554).
First, second, second, fourth, fifth moving parts 410, 420, 540, 550 coupled to an output shaft of the power generator 300 and sequentially coupled in a space between the upper frame 122 and the bottom frame 110. ),
The first, second, fourth, and fifth moving parts 410, 420, 540, and 550 have first, second, fourth, and fifth ball screws 412, 422, 542, and 552, respectively, and the first, second, and fourth ball screws 412, 422, 542, and 552, respectively. , 4, 5 ball screw nuts (414. 424. 544. 554), and the first, 2, 4, 5 ball screw nuts (414. 424. 544. 554), respectively, to transmit the linear motion in the vertical direction The first, second, fourth, and fifth guides 416, 426, 546, 556, and the first, second, fourth, and fifth guides 416, 426, 546, 556, respectively. It is coupled to the five fingers (610, 620, 640, 650), the third finger 630 is coupled to the support 130 fixed to the frame 100,
The first ball screw 412 has a thread of the first pitch in the first direction and the first ball screw nut 414 is coupled, the second ball screw 422 is a thread of the second pitch in the first direction. The second ball screw nut 424 is coupled, the fourth ball screw 542 is coupled to the fourth ball screw nut 544 having a thread of the second pitch in a second direction opposite to the first direction. , The fifth ball screw 552 has a thread of the first pitch in the second direction and is coupled to the fifth ball screw nut (554) multi-finger robot easy to change the pitch.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100103280A KR20120041885A (en) | 2010-10-22 | 2010-10-22 | Multi-wafer finger robot capable of varing the pitch easily |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100103280A KR20120041885A (en) | 2010-10-22 | 2010-10-22 | Multi-wafer finger robot capable of varing the pitch easily |
Publications (1)
Publication Number | Publication Date |
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KR20120041885A true KR20120041885A (en) | 2012-05-03 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020100103280A KR20120041885A (en) | 2010-10-22 | 2010-10-22 | Multi-wafer finger robot capable of varing the pitch easily |
Country Status (1)
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KR (1) | KR20120041885A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230026037A (en) | 2021-08-17 | 2023-02-24 | ㈜온새미로 | Apparatus for transferring wafers of vertical diffusion furnace |
KR20230064995A (en) * | 2021-11-04 | 2023-05-11 | 주식회사 유케이로보틱스 | An apparatus for transporting semiconductor wafers |
CN116110836A (en) * | 2023-04-13 | 2023-05-12 | 北京锐洁机器人科技有限公司 | Semiconductor single-chip-to-multi-chip wafer carrying executing mechanism, manipulator and operating method |
-
2010
- 2010-10-22 KR KR1020100103280A patent/KR20120041885A/en not_active Application Discontinuation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230026037A (en) | 2021-08-17 | 2023-02-24 | ㈜온새미로 | Apparatus for transferring wafers of vertical diffusion furnace |
KR20230064995A (en) * | 2021-11-04 | 2023-05-11 | 주식회사 유케이로보틱스 | An apparatus for transporting semiconductor wafers |
CN116110836A (en) * | 2023-04-13 | 2023-05-12 | 北京锐洁机器人科技有限公司 | Semiconductor single-chip-to-multi-chip wafer carrying executing mechanism, manipulator and operating method |
CN116110836B (en) * | 2023-04-13 | 2023-07-04 | 北京锐洁机器人科技有限公司 | Semiconductor single-chip-to-multi-chip wafer carrying executing mechanism, manipulator and operating method |
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E601 | Decision to refuse application |