CN117438354A - Intelligent semiconductor wafer carrying variable manipulator structure - Google Patents
Intelligent semiconductor wafer carrying variable manipulator structure Download PDFInfo
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- CN117438354A CN117438354A CN202311461393.1A CN202311461393A CN117438354A CN 117438354 A CN117438354 A CN 117438354A CN 202311461393 A CN202311461393 A CN 202311461393A CN 117438354 A CN117438354 A CN 117438354A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 230000007246 mechanism Effects 0.000 claims abstract description 37
- 230000033001 locomotion Effects 0.000 claims abstract description 18
- 230000001360 synchronised effect Effects 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 230000000903 blocking effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 235000012431 wafers Nutrition 0.000 description 49
- 239000012636 effector Substances 0.000 description 22
- 238000000034 method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of mechanical manufacturing, and discloses an intelligent semiconductor wafer carrying variable manipulator structure, which is characterized in that: the device comprises a plurality of actuators which are sequentially arranged from top to bottom, wherein each actuator is connected with an equidistant adjusting mechanism, and the equidistant adjusting mechanism is used for driving a plurality of pairs of ball screws with the same lead through driven pulleys with different sizes so as to drive each actuator to simultaneously make equidistant approaching or moving away from the middle actuator, so that equidistant adjustment among the actuators is realized; each actuator is provided with a connecting rod telescopic mechanism, each connecting rod telescopic mechanism is connected with the same driver, and the driver is used for driving the connecting rod telescopic mechanisms to do telescopic motion so as to realize clamping or unclamping of the wafer on the corresponding actuator.
Description
Technical Field
The invention relates to the technical field of mechanical manufacturing, in particular to an intelligent semiconductor wafer carrying variable manipulator structure.
Background
In the semiconductor manufacturing process, a front opening unified pod (front opening unified pod; FOUP) is provided in which a plurality of wafers are arranged and stored from above and below, and the plurality of semiconductor wafers are transferred to the semiconductor wafers at a time to realize a predetermined processing process. In this conveyance, there is a case where the vertical interval (also referred to as "pitch") between adjacent semiconductor wafers is changed, and a pitch adjustment module is used to change the pitch.
When the existing adjusting module rotates by using a connecting rod mechanism, the end effector is fixed on a connecting rod by utilizing the characteristic that the length of each point on the shaft moves in the linear direction in an equal ratio (2): 1: -1: on the point position of-2, equidistant conversion can be realized, the cost is low, the structure is relatively simple, but the reliability of the connecting rod structure is poor, the joint is easy to wear, and the service life is short.
Meanwhile, the manipulator matched with the adjusting module in the conventional wafer carrying equipment is used for carrying and transporting wafers in a friction contact mode, the friction force of the manipulator is relatively small, the moving speed of wafer carrying is limited, the wafer carrying operation efficiency is low, and the operation requirement of a wafer production line cannot be met.
Disclosure of Invention
The invention provides an intelligent semiconductor wafer carrying variable manipulator structure, which utilizes the matching relation between the rotation direction of a ball screw and the number of teeth of a gear to realize a stable and reliable equidistant adjusting module, has high adjusting precision, can accurately achieve the spacing repeated positioning precision below 0.02mm, has low manufacturing cost, is convenient to popularize and apply, locks a wafer on an actuator by adopting a clamping mode, has high stability and is more beneficial to the rapid carrying of the wafer.
The invention can be realized by the following technical scheme:
the utility model provides an intelligent semiconductor wafer transport variable manipulator structure, includes a plurality of executors that top-down set gradually, every executor all with equidistant adjustment mechanism, equidistant adjustment mechanism is used for driving the multiple pairs of ball screw of the same helical pitch through the driven pulley of different sizes to drive each executor and do equidistant approaching or keeping away from the motion to the executor in the centre simultaneously, realizes equidistant adjustment between each executor;
each actuator is provided with a connecting rod telescopic mechanism, each connecting rod telescopic mechanism is connected with the same driver, and the driver is used for driving the connecting rod telescopic mechanisms to do telescopic motion so as to realize clamping or unclamping of the wafer on the corresponding actuator.
Further, the equidistant adjusting mechanism comprises a plurality of pairs of ball screws, each pair of ball screws comprises a left-handed ball screw and a right-handed ball screw which are coaxially connected, the left-handed ball screw is arranged at the upper part, the right-handed ball screw is arranged at the lower part, the leads of the left-handed ball screw and the right-handed ball screw are the same,
each two actuators are respectively arranged on the left-handed ball screw and the right-handed ball screw of the same pair of ball screws from the middle to the upper side and the lower side simultaneously, the free end of the right-handed ball screw is coaxially connected with the central shaft of the corresponding driven belt wheel,
the number of teeth of the driven pulleys and Zhou Changjun are correspondingly increased in integral multiple, the driven pulleys are connected with the driving pulleys through synchronous belts, a central shaft of the driving pulleys is coaxially connected with an output shaft of a motor, the motor is used for driving the driving pulleys to rotate, each driven pulley is driven to rotate through the synchronous belts, and then a left-handed ball screw and a right-handed ball screw connected with the driven pulleys are driven to synchronously rotate, so that corresponding two actuators are driven to synchronously move upwards/downwards, and equidistant variable adjustment of each actuator is realized.
Further, the closer to the intermediate actuator, the larger the number of teeth and circumference of the driven pulley.
Further, the actuators are arranged in odd number, and the actuators in the middle are arranged to be fixedly different.
Further, the actuators are provided with five actuators, the positions of the actuators in the middle are fixed, the circumferences of the driven pulleys corresponding to the upper and lower actuators close to the middle are set to 2n, the circumferences of the driven pulleys corresponding to the upper and lower actuators far away from the middle are set to n, and n is a natural number.
Further, each connecting rod telescopic mechanism is matched with a transverse plate of the T-shaped push plate through a corresponding sliding block and can move along the transverse plate, a vertical plate of the T-shaped push plate is connected with a driver, and the setting direction of the transverse plate is parallel to the moving direction of the actuator.
Further, each connecting rod telescopic mechanism comprises a push rod, one end of the push rod is provided with a push block, the other end of the push rod passes through a linear bearing and a spring to be connected with a sliding block, one end of the spring is connected with the end part of the linear bearing, the other end of the spring is connected with the sliding block and is always in a compressed state, each linear bearing is fixedly arranged,
the sliding block is provided with a U-shaped bayonet which is clamped on a transverse plate of the T-shaped push plate and can move along the transverse plate,
the driver drives all the sliding blocks, the push rods and the push blocks to move in the direction close to the wafer through the T-shaped push plate, the wafer is clamped on the actuator, and the springs are further compressed at the moment;
the driver drives the T-shaped push plate to move in a direction away from the wafer, and the corresponding sliding block is pushed to move in a direction close to the T-shaped push plate by the reaction force generated by the spring in a compressed state so as to drive the push rod and the push block to move in a direction away from the wafer until the sliding block and the T-shaped push plate are matched again, so that the clamping of the wafer is relieved.
Further, a light shielding plate is arranged on each sliding block, each light shielding plate is matched with the corresponding detection end of the photoelectric sensor and moves synchronously with the sliding block, and whether the photoelectric sensor generates detection signals or not is promoted to detect whether a wafer is in place or not by blocking the light path or not.
The beneficial technical effects of the invention are as follows:
1. the ball screw with the same lead is matched with the driven pulleys with different circumferences, linkage is realized under the connection of the same synchronous belt, and the rotation angle of the ball screw is controlled by different rotation angles of the driven pulleys, so that the movement distance of an actuator connected with the ball screw is controlled, the equidistant variable adjustment of the semiconductor wafer carrying manipulator is realized, and compared with the adjustment of the distance of the actuator realized by the rotation of a link mechanism, the adjustable manipulator structure has high section precision and the repeated interval positioning precision which can be accurate to below 0.02 mm.
2. The ball screws with the same lead are matched with driven pulleys with different sizes to realize equidistant adjustment of a plurality of actuators, so that the cost can be greatly reduced, and the popularization and the application are facilitated.
3. By means of the cooperation of the T-shaped push plate and each sliding block, the plurality of connecting rod telescopic mechanisms can be connected together, meanwhile, the adjustment of the distance between the actuators is not affected, driving can be achieved only by one driver, the number of parts can be greatly reduced, the integration level of the device is improved, and the cost is reduced.
4. When the clamping is released, the spring arranged between the sliding block and the linear bearing can reversely push the sliding block to move along with the T-shaped push plate all the time, so that the connecting rod is driven to retract to the original position, and the sliding block is matched with the T-shaped push plate again to be ready for the next clamping operation.
The whole variable manipulator structure is compact and simple, the assembly process is simpler, the assembly precision is easier to ensure, the maintenance difficulty is low, meanwhile, the wafer is fixed on the actuator in a clamping mode, the wafer can be carried at a relatively high speed, and the operation efficiency is improved.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic diagram of a matching structure of a driven pulley and a driving pulley according to the present invention;
FIG. 3 is a schematic diagram of the cooperation structure of the ball screw and the driven pulley and the actuator of the present invention;
FIG. 4 is a schematic view of a connecting rod telescopic mechanism of the present invention;
FIG. 5 is a schematic top view of the link telescoping mechanism of the present invention;
the device comprises a 1-driven belt wheel, a 2-ball screw, a 3-connecting rod telescopic mechanism, a 31-sliding block, a 32-T-shaped push plate, a 33-push rod, a 34-linear bearing, a 35-spring, a 36-push block, a 37-light shielding plate, a 38-photoelectric sensor, a 4-driver and a 5-actuator.
Detailed Description
The following detailed description of the invention refers to the accompanying drawings and preferred embodiments.
As shown in fig. 1-3, the invention provides an intelligent semiconductor wafer carrying variable manipulator structure, which comprises a plurality of actuators 5 sequentially arranged from top to bottom, wherein each actuator 5 is connected with an equidistant adjusting mechanism, and the equidistant adjusting mechanism is used for driving a plurality of pairs of ball screws 2 with the same lead through driven pulleys 1 with different sizes so as to drive each actuator to simultaneously make equidistant approaching or separating movement to the middle actuator, so that equidistant adjustment among the actuators is realized; each actuator is provided with a connecting rod telescopic mechanism 3, each connecting rod telescopic mechanism 3 is connected with the same driver 4, and the driver 4 is used for driving the connecting rod telescopic mechanisms 3 to do telescopic motion so as to realize clamping or unclamping of the wafer on the corresponding actuator 5. In this way, the driven pulleys with different sizes drive the pairs of ball screws with the same lead, so that the equidistant adjustment among the actuators is realized, the manufacturing cost of the equidistant adjustment mechanism can be greatly reduced, the practicability of the variable manipulator structure is provided, the applicability of clamping wafers with different sizes can be improved by means of the connecting rod telescopic mechanism, and the application range of the variable manipulator structure is enlarged.
The method comprises the following steps:
the equidistant adjusting mechanism comprises a plurality of pairs of ball screws 2, each pair of ball screws 2 comprises a left-handed ball screw and a right-handed ball screw which are coaxially connected, the left-handed ball screw is arranged at the upper part, the right-handed ball screw is arranged at the lower part, the leads of the left-handed ball screw and the right-handed ball screw are the same,
from the middle, two actuators 5 are respectively arranged on a left-handed ball screw and a right-handed ball screw of the same pair of ball screws 2, the free ends of the right-handed ball screws are coaxially connected with the central shafts of the corresponding driven pulleys 1, the numbers of teeth and Zhou Changjun of the driven pulleys 1 are correspondingly increased in integral multiple, the driven pulleys are connected with a driving pulley through a synchronous belt, the central shaft of the driving pulley is coaxially connected with an output shaft of a motor, the motor is used for driving the driving pulley to rotate, and driving the driven pulleys 1 to rotate through the synchronous belt, and further driving the left-handed ball screws and the right-handed ball screws connected with the driving pulleys to synchronously rotate, so that the corresponding two actuators are driven to synchronously move upwards/downwards, and the equidistant variable adjustment of each actuator in the semiconductor wafer conveying manipulator is realized. Therefore, the motor drives the driven pulleys to link, namely synchronously rotate, due to the fact that the driven pulleys are different in size, the rotation angle of each driven pulley is different, and the left-handed ball screw and the right-handed ball screw are driven to rotate simultaneously, so that the distance for driving the actuators connected with the driven pulleys to move upwards/downwards simultaneously is different, the distances between a plurality of actuators such as wafers carried by a manipulator can be pulled, stable and reliable variable-spacing adjustment can be achieved, the accuracy is high, the spacing repeated positioning accuracy is lower than 0.02mm, in addition, the size of the ball screws in the variable manipulator structure is the same, the size of the driven pulleys is different, the manufacturing cost of the device can be greatly reduced, and the variable-spacing variable-manipulator is convenient to popularize and apply.
Considering that the closer to the middle actuator 5 is the smaller the movement distance, the larger the number of teeth and the circumference of the driven pulley 1 corresponding to the closer to the middle actuator 5 can be, so that the larger the circumference is, the smaller the rotation angle of the driven pulley 1 is, the smaller the rotation angles of the left-handed ball screw and the right-handed ball screw connected with the driven pulley are, the smaller the movement distance of the upper and lower actuators connected with the driven pulley is, the larger the movement distance of the actuator which is away from the middle is, and the distance between the actuators is pulled out rapidly.
In order to simplify the whole structure with adjustable spacing, the actuators 5 can be arranged in odd number, the actuators 5 in the middle are arranged to be fixed differently, and the rest actuators 5 move upwards and downwards simultaneously.
Specifically, the actuator 5 may be configured as an end effector for loading a wafer, and includes a fixed hand portion and a wafer carrying portion, where the fixed hand portion is connected to the corresponding left-handed ball screw or right-handed ball screw, and the wafer carrying portion is connected to the ball screw by a nut, and is configured to carry the wafer, and a plurality of wafer contact points are disposed around the wafer carrying portion, and the wafer carrying portion is configured to carry the wafer by only contacting the wafer contact points with the wafer;
the end effectors are fixed in position, the circumferences of driven pulleys corresponding to the upper and lower effectors close to the middle are set to be 2n, the circumferences of driven pulleys corresponding to the upper and lower effectors far away from the middle are set to be n, wherein n is a natural number, in this way, under the driving of a motor, the rotation angle of the driven pulleys corresponding to the middle effectors close to the middle is m, the rotation angle of the driven pulleys corresponding to the middle effectors far away from the middle is 2m, so that the two effectors close to the middle move X towards the middle effectors far from the middle at the same time, the two effectors far from the middle move 2X away from the middle at the same time, and the distance between the upper and lower four effectors is pulled away from the middle rapidly relative to the middle effectors, so that the equidistant variable adjustment of the semiconductor wafer conveying variable manipulator is realized.
The connection relationship of the five-layer end effector from top to bottom is as follows:
the end effector of the first layer is connected with the left-handed ball screw in the second pair;
the end effector of the second layer is connected with the left-handed ball screw in the first pair;
the end effector of the third layer is of an independent fixed structure;
the end effector of the fourth layer is connected with a right-handed ball screw in the first pair, and the free end of the right-handed ball screw is connected with a driven belt pulley with the size of 2 n;
the end effector of the fifth layer is connected with a right-handed ball screw in the second pair, and the free end of the right-handed ball screw is connected with a driven belt pulley with the size of n;
in the transmission process, each synchronizing wheel overlook and turn to anticlockwise rotation, the left-handed ball screw can convert the rotary motion of the driven pulley into the upward motion of the end effector, the right-handed ball screw can convert the rotary motion of the driven pulley into the upward motion of the end effector, and the rising distance of the end effector carried by the driven pulley with the size of n is twice the rising distance of the end effector carried by the driven pulley with the size of 2n, so that the movement distance can be 2:1: -1: -2, positive with upward movement.
As shown in fig. 4-5, each link telescoping mechanism 3 is matched with a transverse plate of a T-shaped push plate 32 through a respective sliding block 31, and can move along the transverse plate, a vertical plate of the T-shaped push plate 32 is connected with the driver 4, and the setting direction of the transverse plate is parallel to the moving direction of the actuator 5, so that all link telescoping mechanisms can be connected together by means of the T-shaped push plate 32, and meanwhile, the distance adjustment of the actuator can not be influenced, thereby saving connecting parts, reducing cost, keeping consistency of clamping actions and avoiding control redundancy.
Specifically, each telescopic mechanism includes a push rod 33, one end of the push rod 33 is provided with a push block 36, the other end passes through a linear bearing 34, a spring 35 is connected with the slide block 31, one end of the spring 35 is connected with the end of the linear bearing 34, the other end is connected with the slide block 31 and is always in a compressed state, each linear bearing 34 is fixedly arranged, a U-shaped bayonet is arranged on the slide block 31, the U-shaped bayonet is clamped on a transverse plate of the T-shaped push plate 32 and can move along the transverse plate, in this way, the driver 4 drives all the slide blocks 31 together with the push rod 33 and the push block 36 to move in a direction approaching to a wafer through the T-shaped push plate 32, the wafer is clamped on the actuator 5, and the spring 35 is further compressed at this time;
when the driver 4 drives the T-shaped push plate 32 to move in a direction away from the wafer, the spring 35 in a compressed state generates a reaction force to push the corresponding slide block 31 to move in a direction close to the T-shaped push plate 32, namely to move along with the T-shaped push plate 32, so as to drive the push rod 33 and the push block 36 to move in a direction away from the wafer until the slide block 31 and the T-shaped push plate 32 are recombined, and therefore the clamping of the wafer is relieved.
In addition, a light shielding plate 37 is disposed on each slider 31, each light shielding plate 37 is matched with the corresponding detection end of the corresponding photoelectric sensor 38 and moves synchronously with the slider 31, and the photoelectric sensor 38 is fixed, so that along with the movement of the light shielding plate 37, the light path is blocked sometimes, and the light path is not blocked sometimes, so that the photoelectric sensor is caused to generate detection signals, whether a wafer is in place or not can be detected, if the position where the light shielding plate blocks the light path is arranged at the position where the wafer is clamped, whether the wafer is in place or not can be fed back.
While particular embodiments of the present invention have been described above, it will be appreciated by those skilled in the art that these are merely illustrative, and that many changes and modifications may be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims.
Claims (8)
1. An intelligent semiconductor wafer transport variable manipulator structure, its characterized in that: the device comprises a plurality of actuators which are sequentially arranged from top to bottom, wherein each actuator is connected with an equidistant adjusting mechanism, and the equidistant adjusting mechanism is used for driving a plurality of pairs of ball screws with the same lead through driven pulleys with different sizes so as to drive each actuator to simultaneously make equidistant approaching or moving away from the middle actuator, so that equidistant adjustment among the actuators is realized;
each actuator is provided with a connecting rod telescopic mechanism, each connecting rod telescopic mechanism is connected with the same driver, and the driver is used for driving the connecting rod telescopic mechanisms to do telescopic motion so as to realize clamping or unclamping of the wafer on the corresponding actuator.
2. The intelligent semiconductor wafer handling variable manipulator structure of claim 1, wherein: the equidistant adjusting mechanism comprises a plurality of pairs of ball screws, each pair of ball screws comprises a left-handed ball screw and a right-handed ball screw which are coaxially connected, the left-handed ball screw is arranged at the upper part, the right-handed ball screw is arranged at the lower part, the leads of the left-handed ball screw and the right-handed ball screw are the same,
each two actuators are respectively arranged on the left-handed ball screw and the right-handed ball screw of the same pair of ball screws from the middle to the upper side and the lower side simultaneously, the free end of the right-handed ball screw is coaxially connected with the central shaft of the corresponding driven belt wheel,
the number of teeth of the driven pulleys and Zhou Changjun are correspondingly increased in integral multiple, the driven pulleys are connected with the driving pulleys through synchronous belts, a central shaft of the driving pulleys is coaxially connected with an output shaft of a motor, the motor is used for driving the driving pulleys to rotate, each driven pulley is driven to rotate through the synchronous belts, and then a left-handed ball screw and a right-handed ball screw connected with the driven pulleys are driven to synchronously rotate, so that corresponding two actuators are driven to synchronously move upwards/downwards, and equidistant variable adjustment of each actuator is realized.
3. The intelligent semiconductor wafer handling variable manipulator structure of claim 2, wherein: the closer to the middle actuator, the larger the number of teeth and circumference of the corresponding driven pulley.
4. The intelligent semiconductor wafer handling variable robot structure of claim 3, wherein: the actuators are arranged in odd number, and the actuators in the middle are arranged in fixed and different.
5. The intelligent semiconductor wafer handling variable manipulator structure of claim 4, wherein: the actuators are five, the position of the actuator in the middle is fixed, the circumferences of the driven pulleys corresponding to the upper and lower actuators close to the middle are set to 2n, the circumferences of the driven pulleys corresponding to the upper and lower actuators far away from the middle are set to n, and n is a natural number.
6. The intelligent semiconductor wafer handling variable manipulator structure of claim 1, wherein: every connecting rod telescopic machanism all cooperates with the diaphragm of T shape push pedal through respective slider, and can follow the diaphragm and remove, the riser of T shape push pedal links to each other with the driver, the setting direction of diaphragm is parallel with the direction of movement of executor.
7. The intelligent semiconductor wafer handling variable manipulator structure of claim 6, wherein: each connecting rod telescopic mechanism comprises a push rod, one end of the push rod is provided with a push block, the other end of the push rod passes through a linear bearing and a spring to be connected with a sliding block, one end of the spring is connected with the end part of the linear bearing, the other end of the spring is connected with the sliding block and is always in a compressed state, each linear bearing is fixedly arranged,
the sliding block is provided with a U-shaped bayonet which is clamped on a transverse plate of the T-shaped push plate and can move along the transverse plate,
the driver drives all the sliding blocks, the push rods and the push blocks to move in the direction close to the wafer through the T-shaped push plate, the wafer is clamped on the actuator, and the springs are further compressed at the moment;
the driver drives the T-shaped push plate to move in a direction away from the wafer, and the corresponding sliding block is pushed to move in a direction close to the T-shaped push plate by the reaction force generated by the spring in a compressed state so as to drive the push rod and the push block to move in a direction away from the wafer until the sliding block and the T-shaped push plate are matched again, so that the clamping of the wafer is relieved.
8. The intelligent semiconductor wafer handling variable manipulator structure of claim 7, wherein: and each light shielding plate is matched with the corresponding detection end of the photoelectric sensor and moves synchronously with the slide block, and the photoelectric sensor is caused to generate detection signals by blocking the light path or not so as to detect whether the wafer is in place or not.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311461393.1A CN117438354A (en) | 2023-11-06 | 2023-11-06 | Intelligent semiconductor wafer carrying variable manipulator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311461393.1A CN117438354A (en) | 2023-11-06 | 2023-11-06 | Intelligent semiconductor wafer carrying variable manipulator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117438354A true CN117438354A (en) | 2024-01-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311461393.1A Pending CN117438354A (en) | 2023-11-06 | 2023-11-06 | Intelligent semiconductor wafer carrying variable manipulator structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117438354A (en) |
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2023
- 2023-11-06 CN CN202311461393.1A patent/CN117438354A/en active Pending
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