CN117245675A - Semiconductor wafer carrying variable manipulator structure - Google Patents
Semiconductor wafer carrying variable manipulator structure Download PDFInfo
- Publication number
- CN117245675A CN117245675A CN202311461394.6A CN202311461394A CN117245675A CN 117245675 A CN117245675 A CN 117245675A CN 202311461394 A CN202311461394 A CN 202311461394A CN 117245675 A CN117245675 A CN 117245675A
- Authority
- CN
- China
- Prior art keywords
- actuators
- handed ball
- driven
- ball screw
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 230000001360 synchronised effect Effects 0.000 claims abstract description 10
- 235000012431 wafers Nutrition 0.000 claims description 34
- 239000012636 effector Substances 0.000 description 25
- 230000033001 locomotion Effects 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a semiconductor wafer carrying variable manipulator structure, which comprises a plurality of actuators arranged from top to bottom, wherein the actuators are arranged from the middle to the upper side and the lower side simultaneously, each two actuators are respectively arranged on a left-handed ball screw and a right-handed ball screw of the same pair of ball screws, the left-handed ball screws are arranged at the upper side and the lower side, the leads of the right-handed ball screws are the same and are coaxially connected, the free ends of the right-handed ball screws are coaxially connected with the central shafts of corresponding driven pulleys, zhou Changjun of the driven pulleys correspondingly increase in integral multiple, the driven pulleys are connected with a driving pulley through a synchronous belt, the driving pulley is connected with a motor, and the motor is used for driving the driving pulley to rotate and driving each driven pulley to rotate through the synchronous belt, so that the left-handed ball screws and the right-handed ball screws connected with the driving pulley are driven to synchronously rotate, and the corresponding two actuators are driven to synchronously move upwards/downwards, and equidistant variable adjustment of each actuator in the semiconductor wafer carrying manipulator is realized.
Description
Technical Field
The invention relates to the technical field of mechanical manufacturing, in particular to a semiconductor wafer carrying variable manipulator structure.
Background
In the semiconductor manufacturing process, a front opening unified pod (front opening unified pod; FOUP) is provided in which a plurality of wafers are arranged and stored from above and below, and the plurality of semiconductor wafers are transferred to the semiconductor wafers at a time to realize a predetermined processing process. In this conveyance, there is a case where the vertical interval (also referred to as "pitch") between adjacent semiconductor wafers is changed, and a pitch adjustment module is used to change the pitch.
When the existing adjusting module rotates by using a connecting rod mechanism, the end effector is fixed on a connecting rod by utilizing the characteristic that the length of each point on the shaft moves in the linear direction in an equal ratio (2): 1: -1: on the point position of-2, equidistant conversion can be realized, the cost is low, the structure is relatively simple, but the reliability of the connecting rod structure is poor, the joint is easy to wear, and the service life is short.
Disclosure of Invention
The invention provides a semiconductor wafer carrying variable manipulator structure, which utilizes the matching relation between the rotation direction of a ball screw and the number of teeth of a gear to realize a stable and reliable equidistant adjusting module, has high adjusting precision, can accurately reach less than 0.02mm in spacing repeated positioning precision, has low manufacturing cost and is convenient to popularize and apply.
The invention can be realized by the following technical scheme:
a semiconductor wafer carrying variable manipulator structure comprises a plurality of actuators which are sequentially arranged from top to bottom, a left-handed ball screw and a right-handed ball screw which are respectively arranged on the same pair of ball screws from the middle to the upper and lower sides, wherein the left-handed ball screws are arranged on the upper and lower sides, the leads of the left-handed ball screws are the same and are coaxially connected, the free ends of the right-handed ball screws are coaxially connected with the central shafts of corresponding driven pulleys,
the number of teeth of the driven pulleys and Zhou Changjun are correspondingly increased in integral multiple, the driven pulleys are connected with the driving pulleys through synchronous belts, a central shaft of the driving pulleys is coaxially connected with an output shaft of a motor, the motor is used for driving the driving pulleys to rotate, and each driven pulley is driven to rotate through the synchronous belts, so that a left-handed ball screw and a right-handed ball screw connected with the driven pulleys are driven to synchronously rotate, and accordingly the corresponding two actuators are driven to synchronously move upwards/downwards, and equidistant variable adjustment of each actuator in the semiconductor wafer carrying manipulator is achieved.
Further, the closer to the intermediate actuator, the larger the number of teeth and circumference of the driven pulley.
Further, the actuators are arranged in odd number, and the actuators in the middle are arranged to be fixedly different.
Further, the actuators are provided with five actuators, the positions of the actuators in the middle are fixed, the circumferences of the driven pulleys corresponding to the upper and lower actuators close to the middle are set to 2n, the circumferences of the driven pulleys corresponding to the upper and lower actuators far away from the middle are set to n, and n is a natural number.
Further, the actuator is configured as an end effector for loading wafers, and includes a fixed hand and a wafer loading portion connected together, the fixed hand being disposed on a corresponding left-handed ball screw or right-handed ball screw.
The beneficial technical effects of the invention are as follows:
1. the ball screw with the same lead is matched with the driven pulleys with different circumferences, linkage is realized under the connection of the same synchronous belt, and the rotation angle of the ball screw is controlled by different rotation angles of the driven pulleys, so that the movement distance of an actuator connected with the ball screw is controlled, the equidistant variable adjustment of the semiconductor wafer carrying manipulator is realized, and compared with the adjustment of the distance of the actuator realized by the rotation of a link mechanism, the adjustable manipulator structure has high section precision and the repeated interval positioning precision which can be accurate to below 0.02 mm.
2. The ball screws with the same lead are matched with driven pulleys with different sizes to realize equidistant adjustment of a plurality of actuators, so that the cost can be greatly reduced, and the popularization and the application are facilitated;
3. the whole variable manipulator is compact and simple in structure, simpler in assembly process, easier to ensure assembly precision and low in maintenance difficulty.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic diagram of a mating structure of a plurality of driven pulleys and a synchronous belt according to the present invention;
FIG. 3 is a schematic view of the end effector of the present invention;
wherein, 1-executor, 2-left-handed ball screw, 3-right-handed ball screw, 4-driven pulley.
Detailed Description
The following detailed description of the invention refers to the accompanying drawings and preferred embodiments.
As shown in fig. 1-3, the invention provides a structure of a semiconductor wafer handling variable manipulator, which comprises a plurality of actuators 1 sequentially arranged from top to bottom, wherein the actuators 1 are simultaneously arranged on the left-handed ball screw 2 and the right-handed ball screw 3 of the same pair of ball screws from the middle to the upper side and the lower side, the left-handed ball screws 2 are arranged on the upper side and the right-handed ball screws 3 are arranged on the lower side, the leads of the left-handed ball screws 2 and the right-handed ball screws 3 are identical and coaxially connected, the free ends of the right-handed ball screws 3 are coaxially connected with the central shafts of the corresponding driven pulleys 4, the teeth numbers and Zhou Changjun of the driven pulleys 4 are correspondingly increased in whole times, the driven pulleys are connected with a driving pulley through a synchronous belt, the central shaft of the driving pulley is coaxially connected with the output shaft of a motor, and the motor is used for driving the driving pulley to rotate, and the driven pulleys are driven through the synchronous belt to rotate, so that the left-handed ball screws and the right-handed ball screws connected with the driven pulleys are synchronously rotated, and the corresponding two actuators are driven to synchronously move upwards/downwards, and the equidistant variable adjustment of the actuators in the semiconductor wafer handling manipulator is realized. Therefore, the motor drives the driven pulleys to link, namely synchronously rotate, due to the fact that the driven pulleys are different in size, the rotation angle of each driven pulley is different, and the left-handed ball screw and the right-handed ball screw are driven to rotate simultaneously, so that the distance for driving the actuators connected with the driven pulleys to move upwards/downwards simultaneously is different, the distances between a plurality of actuators such as wafers carried by a manipulator can be pulled, stable and reliable variable-spacing adjustment can be achieved, the accuracy is high, the spacing repeated positioning accuracy is lower than 0.02mm, in addition, the size of the ball screws in the variable manipulator structure is the same, the size of the driven pulleys is different, the manufacturing cost of the device can be greatly reduced, and the variable-spacing variable-manipulator is convenient to popularize and apply.
Considering that the closer to the middle actuator is the smaller the movement distance, the larger the number of teeth and circumference of the driven belt pulley 4 corresponding to the closer to the middle actuator 1 can be, so that the larger the circumference is, the smaller the rotation angle of the driven belt pulley is, the smaller the rotation angle of the left-handed ball screw 2 and the right-handed ball screw 3 connected with the driven belt pulley is, the smaller the movement distance of the upper and lower actuators 1 connected with the driven belt pulley is, and the larger the movement distance of the actuators 1 away from the middle is, so that the distance between the actuators 1 is rapidly pulled.
In order to simplify the whole structure with adjustable spacing, the actuators 1 can be arranged in odd number, the actuators 1 in the middle are arranged to be fixed differently, and the rest actuators 1 move upwards and downwards simultaneously.
Specifically, the actuator may be an end effector for loading a wafer, and the end effector includes a fixed hand and a wafer carrying part, wherein the fixed hand and the wafer carrying part are connected together, the fixed hand is arranged on a corresponding left-handed ball screw or right-handed ball screw, for example, the fixed hand is connected to the ball screw through a nut, the wafer carrying part is used for carrying the wafer, and a plurality of wafer contact points are arranged around the wafer carrying part, and the wafer carrying part is only contacted with the wafer by the wafer contact points, so that carrying is realized;
the end effectors are fixed in position, the circumferences of driven pulleys corresponding to the upper and lower effectors close to the middle are set to be 2n, the circumferences of driven pulleys corresponding to the upper and lower effectors far away from the middle are set to be n, wherein n is a natural number, in this way, under the driving of a motor, the rotation angle of the driven pulleys corresponding to the middle effectors close to the middle is m, the rotation angle of the driven pulleys corresponding to the middle effectors far away from the middle is 2m, so that the two effectors close to the middle move X towards the middle effectors far from the middle at the same time, the two effectors far from the middle move 2X away from the middle at the same time, and the distance between the upper and lower four effectors is pulled away from the middle rapidly relative to the middle effectors, so that the equidistant variable adjustment of the semiconductor wafer conveying variable manipulator is realized.
The connection relationship of the five-layer end effector from top to bottom is as follows:
the end effector of the first layer is connected with the left-handed ball screw in the second pair;
the end effector of the second layer is connected with the left-handed ball screw in the first pair;
the end effector of the third layer is of an independent fixed structure;
the end effector of the fourth layer is connected with a right-handed ball screw in the first pair, and the free end of the right-handed ball screw is connected with a driven belt pulley with the size of 2 n;
the end effector of the fifth layer is connected with a right-handed ball screw in the second pair, and the free end of the right-handed ball screw is connected with a driven belt pulley with the size of n;
in the transmission process, each synchronizing wheel overlook and turn to anticlockwise rotation, the left-handed ball screw can convert the rotary motion of the driven pulley into the upward motion of the end effector, the right-handed ball screw can convert the rotary motion of the driven pulley into the upward motion of the end effector, and the rising distance of the end effector carried by the driven pulley with the size of n is twice the rising distance of the end effector carried by the driven pulley with the size of 2n, so that the movement distance can be 2:1: -1: -2, positive with upward movement.
While particular embodiments of the present invention have been described above, it will be appreciated by those skilled in the art that these are merely illustrative, and that many changes and modifications may be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims.
Claims (5)
1. A semiconductor wafer carries changeable manipulator structure, its characterized in that: comprises a plurality of actuators which are sequentially arranged from top to bottom, a middle part of the actuators are simultaneously arranged at the upper side and the lower side, each two actuators are respectively arranged on a left-handed ball screw and a right-handed ball screw of the same pair of ball screws, the left-handed ball screws are arranged at the upper side and the lower side, the leads of the left-handed ball screws are the same and are coaxially connected, the free ends of the right-handed ball screws are coaxially connected with the central shafts of the corresponding driven pulleys,
the number of teeth of the driven pulleys and Zhou Changjun are correspondingly increased in integral multiple, the driven pulleys are connected with the driving pulleys through synchronous belts, a central shaft of the driving pulleys is coaxially connected with an output shaft of a motor, the motor is used for driving the driving pulleys to rotate, and each driven pulley is driven to rotate through the synchronous belts, so that a left-handed ball screw and a right-handed ball screw connected with the driven pulleys are driven to synchronously rotate, and accordingly the corresponding two actuators are driven to synchronously move upwards/downwards, and equidistant variable adjustment of each actuator in the semiconductor wafer carrying manipulator is achieved.
2. The semiconductor wafer handling variable robot structure of claim 1, wherein: the closer to the middle actuator, the larger the number of teeth and circumference of the corresponding driven pulley.
3. The semiconductor wafer handling variable robot structure of claim 2, wherein: the actuators are arranged in odd number, and the actuators in the middle are arranged in fixed and different.
4. The semiconductor wafer handling variable robot structure of claim 3, wherein: the actuators are five, the position of the actuator in the middle is fixed, the circumferences of the driven pulleys corresponding to the upper and lower actuators close to the middle are set to 2n, the circumferences of the driven pulleys corresponding to the upper and lower actuators far away from the middle are set to n, and n is a natural number.
5. The semiconductor wafer handling variable robot structure of claim 1, wherein: the actuator is an end actuator for loading wafers and comprises a fixed hand part and a wafer carrying part which are connected together, wherein the fixed hand part is arranged on a corresponding left-handed ball screw or right-handed ball screw.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202311461394.6A CN117245675A (en) | 2023-11-06 | 2023-11-06 | Semiconductor wafer carrying variable manipulator structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202311461394.6A CN117245675A (en) | 2023-11-06 | 2023-11-06 | Semiconductor wafer carrying variable manipulator structure |
Publications (1)
Publication Number | Publication Date |
---|---|
CN117245675A true CN117245675A (en) | 2023-12-19 |
Family
ID=89131483
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202311461394.6A Pending CN117245675A (en) | 2023-11-06 | 2023-11-06 | Semiconductor wafer carrying variable manipulator structure |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN117245675A (en) |
-
2023
- 2023-11-06 CN CN202311461394.6A patent/CN117245675A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11787042B2 (en) | Robot having arm with end effector having bend portion | |
US20230330839A1 (en) | Dual arm robot | |
US20230032442A1 (en) | Robot Arm With Unequal Link Lengths And Variable Non-Linear Wrist Orientation | |
US6499936B2 (en) | Transfer system | |
JP4750231B2 (en) | Workpiece processing system | |
US5885052A (en) | Transferring apparatus and robot arm | |
US8701519B2 (en) | Robot with belt-drive system | |
US20140286736A1 (en) | Systems, apparatus and methods for transporting substrates in electronic device manufacturing | |
WO2020226024A1 (en) | Substrate transfer robot and substrate transfer method | |
KR20140140097A (en) | Articulated robot, and conveying device | |
CN117245675A (en) | Semiconductor wafer carrying variable manipulator structure | |
US7018162B2 (en) | Articulated carrying device | |
CN112635378B (en) | Wafer transmission system | |
CN112635377A (en) | Equidistant adjusting module | |
CN116985159A (en) | Manipulator with liftable arm | |
CN117438354A (en) | Intelligent semiconductor wafer carrying variable manipulator structure | |
CN103846908B (en) | The flat one turn of high-speed parallel manipulator of four side chains three | |
CN214099609U (en) | Multi-layer variable-spacing wafer conveying manipulator for semiconductor equipment | |
JP5098562B2 (en) | Workpiece transfer robot and transfer method | |
JP7191564B2 (en) | industrial robot | |
JP5871550B2 (en) | Transfer robot and vacuum device | |
JP2008258427A (en) | Conveying apparatus | |
CN217728786U (en) | Plane joint mechanical arm | |
CN113939385B (en) | Asymmetric double-end effector mechanical arm | |
CN117182962A (en) | Plane joint mechanical arm |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |