CN214099609U - Multi-layer variable-spacing wafer conveying manipulator for semiconductor equipment - Google Patents
Multi-layer variable-spacing wafer conveying manipulator for semiconductor equipment Download PDFInfo
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- CN214099609U CN214099609U CN202023178194.4U CN202023178194U CN214099609U CN 214099609 U CN214099609 U CN 214099609U CN 202023178194 U CN202023178194 U CN 202023178194U CN 214099609 U CN214099609 U CN 214099609U
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Abstract
The utility model discloses a multilayer variable-pitch wafer conveying manipulator for semiconductor equipment, which comprises a motor, a driving pulley, a driven pulley, a synchronous belt and a ball screw assembly, wherein the ball screw assembly comprises M parallel ball screw units, the driven pulley is fixed at the lower end of each ball screw unit, the motor is connected with the driving pulley, the synchronous belt is wound on the driving pulley and the driven pulley, and the motor drives the ball screw units through the synchronous belt; the ball screw unit comprises N ball screws, and the N ball screws are connected through a coupling; the ball screw is connected with an actuator; m and N are both integers greater than 0. The utility model provides a pair of a variable interval wafer of multilayer for semiconductor equipment removes and send manipulator can realize reliable and stable equidistant regulation, the utility model discloses the module adjustment precision is high, and interval repeated positioning accuracy can be accurate to below 0.02 mm.
Description
Technical Field
The utility model belongs to the wafer transmission field, concretely relates to a manipulator is sent and removes to variable interval wafer of multilayer for semiconductor equipment.
Background
In a semiconductor manufacturing process, a process of transporting a plurality of semiconductor wafers at a time to a processing booth where the semiconductor wafers are subjected to a predetermined process is provided with a Front Opening Unified Pod (FOUP) in which a plurality of wafers are arranged from above and below and stored. During this conveyance, the vertical spacing (also referred to as "pitch") between adjacent semiconductor wafers may be changed. To change the pitch, a pitch adjustment module is used.
Realize module of interval change among the prior art like comparison document JP6049970, utilize spring tension to realize equidistant height transformation, place the spring of the same progress coefficient between every layer of end effector, through when changing top overall height, every spring compression same length realizes equidistant transformation. The device has low cost, simple structure and small occupied area; but it is difficult to ensure that the stiffness coefficients of the springs are the same and the accurate positioning performance is poor.
The module for realizing pitch change in the prior art is also as described in a comparison document JP3999723, and realizes equal-pitch height conversion by using a link mechanism, and fixes an end effector on a link 2 by using the characteristics of equal ratio of moving length in a linear direction of each point on a shaft when the link mechanism rotates: 1: -1: at point position of-2, equidistant transformation can be realized; the device has low cost and relatively simple structure; however, the reliability of the connecting rod structure is poor, and joints are easy to wear.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a variable interval wafer of multilayer removes and send manipulator for semiconductor equipment can realize reliable and stable equidistant regulation, the utility model discloses the module is adjusted the precision height, and interval repeated positioning accuracy can be accurate to below 0.02 mm.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a multilayer variable-spacing wafer conveying manipulator for semiconductor equipment comprises a motor, a driving pulley, a driven pulley, a synchronous belt and a ball screw assembly, wherein the ball screw assembly comprises M parallel ball screw units, the driven pulley is fixed at the lower end of each ball screw unit, the motor is connected with the driving pulley, the synchronous belt is wound on the driving pulley and the driven pulley, and the motor drives the ball screw units through the synchronous belt; the ball screw unit comprises N ball screws, and the N ball screws are connected through a coupling; the ball screw is connected with an actuator; m and N are both integers greater than 0;
the number of the actuators is M multiplied by N +1, wherein the position of the reference actuator is fixed; and the other M multiplied by N actuators are sequentially connected with the ball screw. The ball screw comprises a left-handed ball screw and a right-handed ball screw, and the left-handed ball screw and the right-handed ball screw respectively drive the actuator to move upwards and downwards.
The left-handed ball screw comprises a reference left-handed ball screw, the lead of the other left-handed ball screws is n times of that of the reference left-handed ball screw, and the lead of all the left-handed ball screws is different;
the right-handed ball screw comprises a reference right-handed ball screw, the lead of the other right-handed ball screws is n times that of the reference right-handed ball screw, and the lead of all the right-handed ball screws is different; n is an integer.
Further, the actuator connected with the left-handed ball screw is positioned above the reference actuator; and the higher the lead, the higher the position of the actuator connected to the left-handed ball screw.
Further, the actuator connected with the right-handed ball screw is positioned below the reference actuator; and the position of the actuator connected with the left-handed ball screw is lower as the lead is larger.
Furthermore, the number of the ball screw units is two, each ball screw unit comprises two ball screws, and the number of the actuators is five; the four ball screws comprise a reference left-handed ball screw with a lead of 1, a left-handed ball screw with a lead of 2, a reference right-handed ball screw with a lead of 1 and a right-handed ball screw with a lead of 2.
Further, one of the ball screw units comprises a reference left-handed ball screw with a lead of 1 and a right-handed ball screw with a lead of 2, and the right-handed ball screw with a lead of 2 is positioned above the reference left-handed ball screw with a lead of 1;
the other ball screw unit comprises a reference right-handed ball screw with a lead of 1 and a left-handed ball screw with a lead of 2, and the reference right-handed ball screw with a lead of 1 is positioned above the left-handed ball screw with a lead of 2.
Further, the executor is an end executor for loading wafers, the end executor includes a fixed hand and a wafer carrying portion, the fixed hand is fixed on the ball screw, the wafer carrying portion is fixedly connected on the fixed hand, and the wafer carrying portion includes a wafer contact point thereon.
Furthermore, the wafer contact points are distributed on the periphery of the wafer carrying part, and when the wafer is carried on the wafer carrying part, the wafer contact points are in contact with the wafer.
The utility model discloses following beneficial effect has: the utility model discloses creatively utilize ball screw's direction of rotation and the cooperation relation between the helical pitch, realize reliable and stable equidistant regulation, the utility model discloses the module is adjusted the precision height, and interval repeated positioning accuracy can be accurate to below 0.02 mm.
Drawings
Fig. 1 is a schematic structural diagram of an equal interval adjustment module in embodiment 1;
FIG. 2 is a schematic structural view of an end effector in embodiment 1;
FIG. 3 is a schematic view showing a connection relationship between an adjustment module and an end effector in embodiment 1;
the device comprises a 1-datum left-handed ball screw, a 2-motion left-handed ball screw, a 3-datum right-handed ball screw, a 4-motion right-handed ball screw, a 5-motor, a 6-driven belt wheel, a 7-synchronous belt, an 81-fixed hand, a 82-wafer carrying part and a 83-wafer contact point.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the following detailed description of the embodiments of the present invention is made with reference to the accompanying drawings.
The utility model discloses a core thought lies in: the actuator is driven to move upwards or downwards through the ball screw, the ball screw can convert the self rotary motion into the vertical motion upwards or downwards, and meanwhile, as the lead and the rotary direction of the ball screw can be set, the moving distance of the ball screw with the lead of n is n times of the moving distance of the ball screw with the lead of 1; the left-handed ball screw and the right-handed ball screw move in opposite directions in the vertical direction. Therefore, the utility model discloses a lead and the positive reverse condition of control ball for the executor keeps the interval equal when upwards or the downstream along with ball.
The utility model provides a pair of variable interval wafer of multilayer for semiconductor equipment removes mechanical hand, including motor, driving pulley, driven pulley, hold-in range, ball subassembly, the ball subassembly includes M ball units side by side, and the lower extreme of each ball unit fixes driven pulley, and the driving pulley is connected to the motor, and the hold-in range twines on driving pulley and driven pulley, and the motor passes through the hold-in range and drives ball unit; the ball screw unit comprises N ball screws, and the N ball screws are connected through a coupler; the ball screw is connected with an actuator; m and N are both integers greater than 0; the lead of the ball screw and the positive and negative rotation conditions are controlled, so that the actuators keep equal intervals when moving upwards or downwards along with the ball screw.
The utility model discloses well motor can be for 1, also can be for a plurality of, when the motor is a plurality of, needs to ensure that every motor all is the same, and the action wheel is the same with following the driving wheel. The utility model discloses only need ensure ball screw's helical pitch and direction of rotation meet the requirements can, do not restrict the number of motor and the corresponding relation between motor and the ball screw unit.
The utility model has M multiplied by N +1 actuators, which comprises a fixed reference actuator and a movable actuator capable of moving upwards or downwards; this is because the utility model discloses well regulation module is adjusted be interval between the different executor, can confirm that one of them executor is unchangeable, only needs to adjust the relative position before other executor and the benchmark executor for every moves the distance that the executor removed different, and the removal executor displacement distance that is close to the benchmark executor position is less, and the removal executor displacement distance of keeping away from the benchmark executor position is great, and then ensures that the clearance between the different executor is the equidistant. The position of the reference actuator is fixed and does not need to be connected with the ball screw, and the rest M multiplied by N actuators are sequentially connected with the ball screw. The utility model discloses also can set up a M N executor, and all correspond with ball and be connected, the rethread sets up ball's helical pitch and direction of rotation, ensures that the interval between the different executors equals.
The ball screw comprises a left-handed ball screw and a right-handed ball screw, the left-handed ball screw and the right-handed ball screw respectively drive the actuator to move upwards and downwards or the left-handed ball screw and the right-handed ball screw respectively drive the actuator to move downwards and upwards; concrete corresponding relation can set up through the direction of rotation of hold-in range and the direction of rotation of motor, and does not influence the utility model discloses adjustment thinking to the executor interval.
The utility model discloses a left-handed ball screw comprises a benchmark left-handed ball screw, the lead of the other left-handed ball screws is n times of the benchmark left-handed ball screw, and the leads of all the left-handed ball screws are different; the right-handed ball screw comprises a reference right-handed ball screw, the lead of the other right-handed ball screws is n times that of the reference right-handed ball screw respectively, and the lead of all the right-handed ball screws is different; n is an integer. The actuator connected with the left-handed ball screw is positioned above the reference actuator; and the higher the lead, the higher the position of the actuator connected to the left-handed ball screw. The actuator connected with the right-handed ball screw is positioned below the reference actuator; and the position of the actuator connected with the left-handed ball screw is lower as the lead is larger. This is provided to ensure that the moving actuator closer to the reference actuator moves a smaller distance and the moving actuator farther from the reference actuator moves a larger distance, and to ensure that the adjacent actuators are always equally spaced when the actuator spacing is larger or smaller.
The middle actuator of the utility model can be an end actuator for loading wafers; including fixed hand and wafer carrying portion, fixed hand is fixed on ball, and wafer carrying portion fixed connection includes the wafer contact point on the wafer carrying portion on the fixed hand. The wafer contact points are distributed around the wafer carrying part, and only the wafer contact points contact the wafer when the wafer is carried on the wafer carrying part.
The invention is further explained below by means of a specific embodiment:
example 1
As shown in fig. 1, in the present embodiment, there are two ball screw units, each of which includes two ball screws, and five actuators; wherein, including benchmark levogyration ball 1, removal levogyration ball 2, benchmark dextrorotation ball 3, removal dextrorotation ball 4 in four ball. The lead of the mobile levorotatory ball screw 2 is twice that of the reference levorotatory ball screw 1, and the lead of the mobile dextrorotatory ball screw 4 is twice that of the reference dextrorotatory ball screw 3. The ascending distance of the actuator carried by the ball screw with the lead of 2 is twice of the ascending distance of the ball screw with the lead of 1; the ball screw with a lead of 2 has an actuator that descends twice as long as the ball screw with a lead of 1.
Referring to fig. 1, in the embodiment, there is one motor 5, an output end of the motor is connected to a driving pulley, a driven pulley 6 is disposed below each ball screw unit, the motor 5 drives the two ball screw units to rotate through a synchronous belt 7, and the two ball screws in each ball screw unit are connected through a coupling.
One ball screw unit comprises a left-handed ball screw and a movable right-handed ball screw, and the movable right-handed ball screw is positioned above the reference left-handed ball screw; the other ball screw unit comprises a reference right-handed ball screw and a moving left-handed ball screw, and the reference right-handed ball screw is positioned above the moving left-handed ball screw. In this embodiment, the left-handed ball screw is disposed below the ball screw unit, and the right-handed ball screw is disposed above the ball screw unit, because in the transmission process (the synchronizing wheel rotates clockwise when looking down), the right-handed ball screw can convert the rotational motion of the synchronizing wheel into the upward motion of the nut, and the left-handed ball screw can convert the rotational motion of the synchronizing wheel into the downward motion of the nut, therefore, the ball screw located above can be conveniently connected to the actuator moving upward, and the ball screw located below can be conveniently connected to the actuator moving downward.
Referring to fig. 2, the actuator in this embodiment is an end effector for loading a wafer, and includes a fixing hand 81 and a wafer carrying portion 82, the fixing hand 81 is fixed on a ball screw, the wafer carrying portion 82 is fixedly connected to the fixing hand, and the wafer carrying portion 82 includes a wafer contact point 83. The wafer contact points are distributed around the wafer carrying part, and only the wafer contact points contact the wafer when the wafer is carried on the wafer carrying part.
With reference to fig. 1-2, in the present embodiment, each ball screw is connected to the end effector through a nut, the nut of each ball screw is respectively connected to the fixed hand of each layer of end effector, and the connection relationship of five layers of end effectors from top to bottom is as follows:
the end effector of the first layer at the uppermost end is connected with a moving right-handed ball screw with a lead of 2;
the end effector of the second layer is connected with a reference right-handed ball screw with a lead of 1;
the end effector of the third layer is an independent fixed structure;
the end effector of the fourth layer is connected with a reference left-handed ball screw with a lead of 1;
the end effector of the fifth layer is connected with a movable left-handed ball screw with a lead of 2;
in the transmission process (the synchronous wheel is turned clockwise when looking down), the right-handed ball screw can convert the rotary motion of the driven pulley into the upward motion of the end effector, the left-handed ball screw can convert the rotary motion of the driven pulley into the upward motion of the end effector, the ascending distance of the end effector carried by the ball screw with the lead of 2 is twice the ascending distance of the end effector carried by the lead of 1, so that the motion distance of 2 can be realized: 1: -1: 2 (positive for upward movement).
The utility model discloses creatively utilize ball screw's direction of rotation and the cooperation relation between the helical pitch, realize reliable and stable equidistant adjusting module, the utility model discloses the module adjustment accuracy is high, and interval repeated positioning accuracy can be accurate to below 0.02 mm.
The above description is only a preferred embodiment of the present invention, and the embodiment is not intended to limit the scope of the present invention, so that all the structural changes equivalent to the contents of the description and the drawings of the present invention are included in the scope of the appended claims of the present invention.
Claims (7)
1. The multi-layer variable-spacing wafer conveying manipulator for the semiconductor equipment is characterized by comprising a motor, a driving pulley, a driven pulley, a synchronous belt and a ball screw assembly, wherein the ball screw assembly comprises M parallel ball screw units, the driven pulley is fixed at the lower end of each ball screw unit, the motor is connected with the driving pulley, the synchronous belt is wound on the driving pulley and the driven pulley, and the motor drives the ball screw units through the synchronous belt; the ball screw unit comprises N ball screws, and the N ball screws are connected through a coupling; the ball screw is connected with an actuator; m and N are both integers greater than 0;
the number of the actuators is M multiplied by N +1, wherein the position of the reference actuator is fixed; the other M multiplied by N actuators are sequentially connected with the ball screw; the ball screw comprises a left-handed ball screw and a right-handed ball screw, and the left-handed ball screw and the right-handed ball screw respectively drive the actuator to move upwards and downwards;
the left-handed ball screw comprises a reference left-handed ball screw, the lead of the other left-handed ball screws is n times of that of the reference left-handed ball screw, and the lead of all the left-handed ball screws is different; the right-handed ball screw comprises a reference right-handed ball screw, the lead of the other right-handed ball screws is n times that of the reference right-handed ball screw, and the lead of all the right-handed ball screws is different; n is an integer.
2. The multi-layer variable pitch wafer handling robot for semiconductor devices of claim 1, wherein the left-handed ball screw connected actuator is located above the reference actuator; and the higher the lead, the higher the position of the actuator connected to the left-handed ball screw.
3. The multi-layer variable pitch wafer handling robot for semiconductor devices of claim 1, wherein said right-handed ball screw coupled actuator is located below said reference actuator; and the position of the actuator connected with the left-handed ball screw is lower as the lead is larger.
4. The multi-layer variable pitch wafer handling robot of claim 1, wherein the number of ball screw units is two, each ball screw unit includes two ball screws, and the number of actuators is five; the four ball screws comprise a reference left-handed ball screw with a lead of 1, a left-handed ball screw with a lead of 2, a reference right-handed ball screw with a lead of 1 and a right-handed ball screw with a lead of 2.
5. The multi-layer variable pitch wafer handling robot for semiconductor devices as claimed in claim 4, wherein one of the ball screw units comprises a reference left-handed ball screw having a lead of 1 and a right-handed ball screw having a lead of 2, and the right-handed ball screw having a lead of 2 is located above the reference left-handed ball screw having a lead of 1;
the other ball screw unit comprises a reference right-handed ball screw with a lead of 1 and a left-handed ball screw with a lead of 2, and the reference right-handed ball screw with a lead of 1 is positioned above the left-handed ball screw with a lead of 2.
6. The multi-layer variable pitch wafer handling robot of claim 1, wherein the actuator is an end effector for loading wafers, the end effector comprises a fixing hand fixed to the ball screw and a wafer loading part fixedly connected to the fixing hand and including wafer contact points thereon.
7. The multi-layer variable pitch wafer handling robot for a semiconductor device as claimed in claim 6, wherein the wafer contact points are distributed around the wafer loading part and contact the wafer when the wafer is loaded on the wafer loading part.
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| CN202023178194.4U CN214099609U (en) | 2020-12-25 | 2020-12-25 | Multi-layer variable-spacing wafer conveying manipulator for semiconductor equipment |
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| CN202023178194.4U CN214099609U (en) | 2020-12-25 | 2020-12-25 | Multi-layer variable-spacing wafer conveying manipulator for semiconductor equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116922423A (en) * | 2023-07-25 | 2023-10-24 | 上海稷以科技有限公司 | Wafer transmission manipulator system and method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116922423A (en) * | 2023-07-25 | 2023-10-24 | 上海稷以科技有限公司 | Wafer transmission manipulator system and method |
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