CN117096080A - Variable-spacing module structure of wafer transmission system - Google Patents

Variable-spacing module structure of wafer transmission system Download PDF

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Publication number
CN117096080A
CN117096080A CN202311256553.9A CN202311256553A CN117096080A CN 117096080 A CN117096080 A CN 117096080A CN 202311256553 A CN202311256553 A CN 202311256553A CN 117096080 A CN117096080 A CN 117096080A
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China
Prior art keywords
layer
finger fixing
fixing plate
finger
guide
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Pending
Application number
CN202311256553.9A
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Chinese (zh)
Inventor
苗义
王贺明
王晨旭
朱骏驰
张文磊
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Shanghai Guangchuan Technology Co ltd
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Shanghai Guangchuan Technology Co ltd
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Priority to CN202311256553.9A priority Critical patent/CN117096080A/en
Publication of CN117096080A publication Critical patent/CN117096080A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Transmission Devices (AREA)

Abstract

The variable-spacing module structure of the wafer transmission system comprises a module body, a servo motor, a synchronous wheel transmission mechanism, a cam shaft, a guide mechanism, N layers of fingers and N layers of guide wheel finger fixing plates, wherein the cam shaft is fixed at the top inside the module body and connected with the synchronous wheel transmission mechanism, and the surface of the cam shaft is provided with (N-1)/2 positive spiral sliding grooves and (N-1)/2 negative spiral sliding grooves; the middle layer is arranged between the (N-1)/2+1 layer of finger fixing plates and is fixed on the cam shaft through the annular sliding groove, when the cam shaft rotates, the guide wheel can slide up and down in the spiral sliding groove to drive the finger fixing plates to move up and down, the fingers are fixed on the finger fixing plates, the finger fixing plates are provided with linear bearings, and the guide wheels slide up and down under the guide of the guide mechanism. Therefore, the application adopts the variable-pitch module of the cam shaft, controls the finger variable pitch through the sliding grooves with different spiral distances, and has the advantages of simple structure, convenient adjustment, high precision, small vibration and the like.

Description

Variable-spacing module structure of wafer transmission system
Technical Field
The application relates to the technical field of semiconductor wafer transmission, in particular to a variable-spacing module structure of a wafer transmission system.
Background
In the field of semiconductor wafer transport, wafers are typically stored at equal intervals within FOUP cassettes. When wafers in a FOUP box are transferred into a process chamber for processing, several wafers need to be transferred at the same time in order to improve transfer efficiency.
However, if the pitch of the wafer cassettes within the process chamber is not consistent with the pitch within the FOUP box, then the handling may require the use of variable pitch fingers. At present, manufacturers at home and abroad use positive and negative screw rod combinations with different pitches to realize, the structure is complex, adjustment needs to take a long time, the shake of fingers in the pitch-changing process is large, and the falling of sheets is easy to occur.
Disclosure of Invention
The application aims to provide a variable-spacing module applied to a semiconductor wafer transmission system, which is used for solving the problem that a variable-spacing wafer carrying mechanism is large in size, the problem that the variable-spacing wafer carrying mechanism is inconvenient to adjust and the problem that the variable-spacing wafer carrying mechanism vibrates when the variable-spacing wafer carrying mechanism changes in the whole process of transferring wafers in a micro-environment space.
In order to achieve the above purpose, the present application adopts the following technical scheme:
the variable-spacing module structure of the wafer transmission system comprises a module body, a servo motor, a synchronous wheel transmission mechanism, a cam shaft, a guide mechanism, N layers of fingers and N layers of finger fixing plates provided with guide wheels, wherein the module body is fixed at the tail end of an arm robot, and the N layers of finger fixing plates are sequentially stacked up and down at intervals through the guide mechanism; the guide mechanism is perpendicular to the finger fixing plate; wherein N is an odd number;
the cam shaft is fixed at the top of the inner part of the module body and is connected with the synchronous wheel transmission mechanism, and the surface of the cam shaft is provided with (N-1)/2 positive spiral sliding grooves and (N-1)/2 negative spiral sliding grooves;
the middle layer is arranged between the (N-1)/2+1 layers of finger fixing plates, the finger fixing plates are fixed on the cam shaft through an annular sliding groove, the middle layer is used as a boundary, the finger fixing plates from the first layer of finger fixing plates to the (N-1)/2 layers of finger fixing plates are arranged on the upper layer and are called an upper layer of finger fixing plate group, the finger fixing plates from the (N-1)/2+2 layers of finger fixing plates to the Nth layer of finger fixing plates are arranged on the lower layer and are called a lower layer of finger fixing plate group, guide wheels in the upper layer of finger fixing plate group slide in a positive spiral sliding groove, and guide wheels in the lower layer of finger fixing plate group slide in a reverse spiral sliding groove; the screw pitches of the upper chute and the lower chute close to the middle layer are a, the screw pitches of the next upper chute and the next lower chute are 2a, and the screw pitches of the chutes for receiving the first layer of the finger fixing plate group and the Nth layer of the finger fixing plate group are (N-1)/2*a; the starting points of all the sliding grooves are on the same axis, the intervals are equal, and the starting interval of the sliding grooves for receiving the fingers close to the middle layer in the upper layer finger fixing plate group and the lower layer finger fixing plate group is 2b;
the servo motor transmits power to the cam shaft through the synchronous wheel transmission mechanism to drive the cam shaft to rotate; when the cam shaft rotates, the guide wheel can slide up and down in the spiral chute to drive the finger fixing plate to move up and down, the finger is fixed on the finger fixing plate, the finger fixing plate is provided with a linear bearing, and the guide wheel slides up and down under the guide of the guide mechanism.
Specifically, the N is 5, the 3 rd layer is an intermediate layer, the guide wheel of the 3 rd layer finger fixing plate is fixed on the cam shaft through an annular chute, and the guide wheel of the 1 st layer finger fixing plate, the guide wheel of the 2 nd layer finger fixing plate, the guide wheel of the 4 th layer finger fixing plate and the guide wheel of the 5 th layer finger fixing plate slide in different chutes by taking the intermediate layer as a boundary; wherein, the 1 st chute and the 2 nd chute are positive spirals, and the 4 th chute and the 5 th chute are reverse spirals; the screw pitches of the 2 nd chute and the 4 th chute are a, and the screw pitches of the 1 st chute and the 5 th chute are 2a; the starting points of all the sliding grooves are on the same axis, the distances between the starting points of the 1 st sliding groove and the 2 nd sliding groove, the starting distance between the 4 th sliding groove and the 5 th sliding groove are b, and the actual distance between the 2 nd sliding groove and the 4 th sliding groove is 2b; when the clockwise rotation angle of the cam shaft from the starting position is theta, the moving distance of the finger at the 1 st layer is 2a theta/360, the moving distance of the finger at the 2 nd layer is a theta/360, the moving distance of the finger at the 4 th layer is-a theta/360, and the moving distance of the finger at the 5 th layer is-2 a theta/360, so that equidistant variable-distance actions of the fingers at each layer are realized.
Specifically, one end of the finger fixing plate is fixed with the finger, and the opposite end is provided with a chute matched with the guiding mechanism and a guide wheel of the finger fixing plate.
Specifically, the guide mechanism is two guide rods which are arranged in parallel with the cam shaft, and the guide wheel is positioned between the two guide rods.
Compared with the prior art, the technical scheme provided by the embodiment of the application has the following advantages: the application adopts the variable-pitch module of the cam shaft, controls the finger variable pitch through the sliding grooves with different spiral distances, and has the advantages of simple structure, convenient adjustment, high precision, small vibration and the like.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application.
In order to more clearly illustrate the embodiments of the application or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, and it will be obvious to a person skilled in the art that other drawings can be obtained from these drawings without inventive effort.
FIG. 1 is a schematic view of the overall structure of a surgical manipulator according to an embodiment of the present application
FIG. 2 is a schematic view of a structure of an N-layer finger fixing plate with guide wheels according to an embodiment of the present application
FIG. 3 is a schematic view of a cam shaft according to an embodiment of the present application
Detailed Description
For a clearer understanding of technical features, objects and effects of the present application, a detailed description of embodiments of the present application will be made with reference to the accompanying drawings. In the following description, it should be understood that the directions or positional relationships indicated by "front", "rear", "upper", "lower", "left", "right", "longitudinal", "transverse", "vertical", "horizontal", "top", "bottom", "inner", "outer", "head", "tail", etc. are configured and operated in specific directions based on the directions or positional relationships shown in the drawings, and are merely for convenience of describing the present application, not to indicate that the mechanism or element referred to must have specific directions, and thus should not be construed as limiting the present application.
It should also be noted that unless explicitly stated or limited otherwise, terms such as "mounted," "connected," "secured," "disposed," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. When an element is referred to as being "on" or "under" another element, it can be "directly" or "indirectly" on the other element or one or more intervening elements may also be present. The terms "first," "second," "third," and the like are used merely for convenience in describing the present application and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, whereby features defining "first," "second," "third," etc. may explicitly or implicitly include one or more such features. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the following description, for purposes of explanation and not limitation, specific details are set forth such as the particular system architecture, techniques, etc., in order to provide a thorough understanding of the embodiments of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, mechanisms, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.
Referring to fig. 1, fig. 1 is a schematic diagram illustrating an overall structure of a surgical mechanical arm according to an embodiment of the application. As shown in fig. 1, the module body, the servo motor, the synchronous wheel transmission mechanism, the cam shaft, the guide mechanism, N layers of fingers and N layers of finger fixing plates provided with guide wheels are fixed at the tail end of the arm robot, and the N layers of finger fixing plates are sequentially stacked up and down at intervals through the guide mechanism; the guide mechanism is perpendicular to the finger fixing plate; wherein N is an odd number, the cam shaft is fixed at the top of the inner part of the module body and is connected with the synchronous wheel transmission mechanism, and the surface of the cam shaft is provided with (N-1)/2 positive spiral sliding grooves and (N-1)/2 reverse spiral sliding grooves;
the middle layer is arranged between the (N-1)/2+1 layers of finger fixing plates, the finger fixing plates are fixed on the cam shaft through an annular sliding groove, the middle layer is used as a boundary, the finger fixing plates from the first layer of finger fixing plates to the (N-1)/2 layers of finger fixing plates are arranged on the upper layer and are called an upper layer of finger fixing plate group, the finger fixing plates from the (N-1)/2+2 layers of finger fixing plates to the Nth layer of finger fixing plates are arranged on the lower layer and are called a lower layer of finger fixing plate group, guide wheels in the upper layer of finger fixing plate group slide in a positive spiral sliding groove, and guide wheels in the lower layer of finger fixing plate group slide in a reverse spiral sliding groove; the screw pitches of the upper chute and the lower chute close to the middle layer are a, the screw pitches of the next upper chute and the next lower chute are 2a, and the screw pitches of the chutes for receiving the first layer of the finger fixing plate group and the Nth layer of the finger fixing plate group are (N-1)/2*a; the starting points of all the sliding grooves are on the same axis, the intervals are equal, and the starting interval of the sliding grooves for receiving the fingers close to the middle layer in the upper layer finger fixing plate group and the lower layer finger fixing plate group is 2b;
the servo motor transmits power to the cam shaft through the synchronous wheel transmission mechanism to drive the cam shaft to rotate; when the cam shaft rotates, the guide wheel can slide up and down in the spiral chute to drive the finger fixing plate to move up and down, the finger is fixed on the finger fixing plate, the finger fixing plate is provided with a linear bearing, and the guide wheel slides up and down under the guide of the guide mechanism.
In the following examples of the present application, N is equal to 5.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a finger fixing plate with a guide wheel mounted on N layers according to an embodiment of the present application. As shown in fig. 2, one end of the finger fixing plate is fixed with the finger, and the opposite end is provided with a sliding groove matched with the guiding mechanism and a guide wheel of the finger fixing plate. The guide mechanism is two guide rods which are arranged in parallel with the cam shaft, and the guide wheel is positioned between the two guide rods. The module body is used for connecting the components and can be fixed at the tail end of the arm robot. The servo motor is a power device, and can transmit power to the cam shaft through the synchronous wheel transmission mechanism, so that the cam shaft can rotate.
Referring to fig. 3, fig. 3 is a schematic structural diagram of a cam shaft according to an embodiment of the application. As shown in fig. 3, the cam shaft is fixed on the top of the inner part of the module body and is connected with the synchronous wheel transmission mechanism, and 4 spiral sliding grooves are formed in the surface of the cam shaft. The finger fixing plate is provided with a guide wheel, when the cam shaft rotates, the guide wheel can slide up and down in the spiral chute to drive the finger fixing plate to move up and down, the finger is fixed on the finger fixing plate, the finger fixing plate is provided with a linear bearing, and the guide wheel slides up and down under the guide of the guide mechanism.
Specifically, the 3 rd layer of finger fixing plate is assumed to be an intermediate layer, the guide wheel of the 3 rd layer of finger fixing plate is fixed on the cam shaft through an annular chute, the intermediate layer is taken as a boundary, and the guide wheel of the 1 st layer of finger fixing plate, the guide wheel of the 2 nd layer of finger fixing plate, the guide wheel of the 4 th layer of finger fixing plate and the guide wheel of the 5 th layer of finger fixing plate slide in different chutes.
Wherein, the 1 st chute and the 2 nd chute are positive spirals, and the 4 th chute and the 5 th chute are reverse spirals; the screw pitches of the 2 nd chute and the 4 th chute are a, and the screw pitches of the 1 st chute and the 5 th chute are 2a; the starting points of all the sliding grooves are on the same axis, the distances between the starting points of the 1 st sliding groove and the 2 nd sliding groove and the starting distances between the 4 th sliding groove and the 5 th sliding groove are b, and the actual distances between the 2 nd sliding groove and the 4 th sliding groove are 2b; when the clockwise rotation angle of the cam shaft from the starting position is theta, the moving distance of the finger at the 1 st layer is 2a theta/360, the moving distance of the finger at the 2 nd layer is a theta/360, the moving distance of the finger at the 4 th layer is-a theta/360, and the moving distance of the finger at the 5 th layer is-2 a theta/360, so that equidistant variable-distance actions of the fingers at each layer are realized.
The design of the distance a and the distance b is determined according to the distance required for accessing the wafer.
The application designs 5 layers of fingers, wherein the 3 rd layer of fingers are fixed fingers, and guide wheels on the fixed plates of the 1 st, 2 nd, 4 th and 5 th layers of fingers slide in different sliding grooves. Wherein, the 1 st chute and the 2 nd chute are positive spirals, and the 4 th chute and the 5 th chute are reverse spirals. The pitch of the 2 nd and 4 th sliding grooves is a, and the pitch of the 1 st and 5 th sliding grooves is 2a. The starting points of all the sliding grooves are on the same axis, the distances between the starting points of the 1 st sliding groove and the 2 nd sliding groove and the starting distances between the 4 th sliding groove and the 5 th sliding groove are b, and the actual distances between the 2 nd sliding groove and the 4 th sliding groove are 2b. When the clockwise rotation angle of the cam shaft from the initial position is theta, the moving distance of the finger at the layer 1 is 2a theta/360, the moving distance of the finger at the layer 2 is a theta/360, the moving distance of the finger at the layer 4 is-a theta/360, and the moving distance of the finger at the layer 5 is-2 a theta/360. When the cam shaft rotates, each layer of fingers can realize equidistant variable-pitch action.
For the application, more layers of finger pitch-changing modules can be designed, the initial distance between two adjacent sliding grooves in the middle of the odd-layer module is 2b, and the initial distance between two adjacent sliding grooves in the middle of the even-layer module is b. The pitch of the two layers at the middle is a, the pitch of the layer outside is 2a, and so on.
It is to be understood that the above examples only represent preferred embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the application; it should be noted that, for a person skilled in the art, the above technical features can be freely combined, and several variations and modifications can be made without departing from the scope of the application; therefore, all changes and modifications that come within the meaning and range of equivalency of the claims are to be embraced within their scope.

Claims (4)

1. The variable-spacing module structure of the wafer transmission system is characterized by comprising a module body, a servo motor, a synchronous wheel transmission mechanism, a cam shaft, a guide mechanism, N layers of fingers and N layers of guide wheel finger fixing plates, wherein the module body is fixed at the tail end of an arm robot, and the N layers of finger fixing plates are sequentially stacked up and down at intervals through the guide mechanism; the guide mechanism is perpendicular to the finger fixing plate; wherein N is an odd number;
the cam shaft is fixed at the top of the inner part of the module body and is connected with the synchronous wheel transmission mechanism, and the surface of the cam shaft is provided with (N-1)/2 positive spiral sliding grooves and (N-1)/2 negative spiral sliding grooves;
the middle layer is arranged between the (N-1)/2+1 layers of finger fixing plates, the finger fixing plates are fixed on the cam shaft through an annular sliding groove, the middle layer is used as a boundary, the finger fixing plates from the first layer of finger fixing plates to the (N-1)/2 layers of finger fixing plates are arranged on the upper layer and are called an upper layer of finger fixing plate group, the finger fixing plates from the (N-1)/2+2 layers of finger fixing plates to the Nth layer of finger fixing plates are arranged on the lower layer and are called a lower layer of finger fixing plate group, guide wheels in the upper layer of finger fixing plate group slide in a positive spiral sliding groove, and guide wheels in the lower layer of finger fixing plate group slide in a reverse spiral sliding groove; the screw pitches of the upper chute and the lower chute close to the middle layer are a, the screw pitches of the next upper chute and the next lower chute are 2a, and the screw pitches of the chutes for receiving the first layer of the finger fixing plate group and the Nth layer of the finger fixing plate group are (N-1)/2*a; the starting points of all the sliding grooves are on the same axis, the intervals are equal, and the starting interval of the sliding grooves for receiving the fingers close to the middle layer in the upper layer finger fixing plate group and the lower layer finger fixing plate group is 2b;
the servo motor transmits power to the cam shaft through the synchronous wheel transmission mechanism to drive the cam shaft to rotate; when the cam shaft rotates, the guide wheel can slide up and down in the spiral chute to drive the finger fixing plate to move up and down, the finger is fixed on the finger fixing plate, the finger fixing plate is provided with a linear bearing, and the guide wheel slides up and down under the guide of the guide mechanism.
2. The variable-pitch module structure of the wafer transmission system according to claim 1, wherein N is 5, layer 3 is an intermediate layer, the guide wheels of the layer 3 finger fixing plate are fixed on the cam shaft through an annular chute, and the guide wheels of the layer 1 finger fixing plate, the guide wheels of the layer 2 finger fixing plate, the guide wheels of the layer 4 finger fixing plate and the guide wheels of the layer 5 finger fixing plate slide in different chutes by taking the intermediate layer as a boundary; wherein, the 1 st chute and the 2 nd chute are positive spirals, and the 4 th chute and the 5 th chute are reverse spirals; the screw pitches of the 2 nd chute and the 4 th chute are a, and the screw pitches of the 1 st chute and the 5 th chute are 2a; the starting points of all the sliding grooves are on the same axis, the distances between the starting points of the 1 st sliding groove and the 2 nd sliding groove, the starting distance between the 4 th sliding groove and the 5 th sliding groove are b, and the actual distance between the 2 nd sliding groove and the 4 th sliding groove is 2b; when the clockwise rotation angle of the cam shaft from the starting position is theta, the moving distance of the finger at the 1 st layer is 2a theta/360, the moving distance of the finger at the 2 nd layer is a theta/360, the moving distance of the finger at the 4 th layer is-a theta/360, and the moving distance of the finger at the 5 th layer is-2 a theta/360, so that equidistant variable-distance actions of the fingers at each layer are realized.
3. The wafer transfer system of claim 1, wherein the finger fixing plate has one end for fixing the finger and an opposite end provided with a chute adapted to the guide mechanism and a guide wheel of the finger fixing plate.
4. The wafer transport system variable pitch module structure of claim 3, wherein the guide mechanism comprises two guide bars disposed parallel to the cam shaft, the guide bars, and the guide wheel is disposed between the two guide bars.
CN202311256553.9A 2023-09-27 2023-09-27 Variable-spacing module structure of wafer transmission system Pending CN117096080A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311256553.9A CN117096080A (en) 2023-09-27 2023-09-27 Variable-spacing module structure of wafer transmission system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311256553.9A CN117096080A (en) 2023-09-27 2023-09-27 Variable-spacing module structure of wafer transmission system

Publications (1)

Publication Number Publication Date
CN117096080A true CN117096080A (en) 2023-11-21

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311256553.9A Pending CN117096080A (en) 2023-09-27 2023-09-27 Variable-spacing module structure of wafer transmission system

Country Status (1)

Country Link
CN (1) CN117096080A (en)

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