KR20120030841A - Wafer marking device, marking position inspecting member and controlling method of wafer marking device - Google Patents

Wafer marking device, marking position inspecting member and controlling method of wafer marking device Download PDF

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Publication number
KR20120030841A
KR20120030841A KR1020100092635A KR20100092635A KR20120030841A KR 20120030841 A KR20120030841 A KR 20120030841A KR 1020100092635 A KR1020100092635 A KR 1020100092635A KR 20100092635 A KR20100092635 A KR 20100092635A KR 20120030841 A KR20120030841 A KR 20120030841A
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South Korea
Prior art keywords
inspection
marking
wafer
marking position
laser projection
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KR1020100092635A
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Korean (ko)
Inventor
서경석
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한미반도체 주식회사
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Priority to KR1020100092635A priority Critical patent/KR20120030841A/en
Publication of KR20120030841A publication Critical patent/KR20120030841A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67282—Marking devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)

Abstract

The present invention uses a wafer marking apparatus capable of correcting an error of each predetermined marking position on a wafer, and a marking position inspecting member and the marking position inspecting member mounted on a wafer marking apparatus instead of a wafer to determine an error of the marking position. The present invention relates to a control method of a wafer marking apparatus capable of correcting a marking position of a wafer marking apparatus.

Description

WAFER MARKING DEVICE, MARKING POSITION INSPECTING MEMBER AND CONTROLLING METHOD OF WAFER MARKING DEVICE}

The present invention relates to a method for controlling a wafer marking device, a marking position inspection member and a wafer marking device. More specifically, the present invention provides a wafer marking apparatus capable of correcting an error of each predetermined marking position on a wafer, and a marking position inspection member mounted on a wafer marking apparatus instead of a wafer to determine an error of the marking position and the marking position inspection. A method of controlling a wafer marking apparatus capable of correcting a marking position of a wafer marking apparatus using a member.

In general, a semiconductor package includes a thin film deposition process for forming a predetermined thin film to form a circuit pattern on a wafer, a photolithography process for forming a photoresist pattern by applying photoresist to the deposited thin film, and exposing and developing the photoresist. The process of forming a circuit pattern on a silicon wafer and a wafer, including an etching process of patterning a thin film using a resist pattern, an ion implantation process of injecting specific ions into a predetermined region of the substrate, and a cleaning process of removing impurities, It is manufactured through a packaging step of dicing with a semiconductor chip and sealing with an epoxy resin or the like.

In recent years, the weight reduction and miniaturization of electronic products have contributed to the miniaturization and weight reduction of semiconductor packages constituting electronic products.

Therefore, in order to produce a semiconductor package, a semiconductor package is completed by dicing a wafer to package each semiconductor package and marking product information of each semiconductor package, but recently, packaging is performed at a wafer stage. Thereafter, a technique for marking product information corresponding to each semiconductor package is required before dicing the wafer into each semiconductor package.

Conventionally, a wafer having a diameter of about 200 mm is used a lot, but a wafer having a thin thickness and a diameter of 300 mm are used.

In the marking in the wafer state, a wafer marking apparatus for marking the back surface of the wafer using a laser projection unit that projects a laser beam is used.

As wafer sizes increase and circuit density increases, the size of each semiconductor package produced from a single wafer becomes smaller. Therefore, as the area of the semiconductor package occupied on the wafer decreases, the lot numbers, product names, and identification symbols, letters, or numbers of each semiconductor package marked in the marking process are reduced in size, and the accuracy of the marking process is required.

Of course, when each wafer is mounted on the wafer marking apparatus for marking, an alignment process for aligning each wafer is performed by using a physical mark or the like displayed on each wafer, but this is performed by the position and laser projection of the alignment inspection apparatus. It is assumed that the marking positions of the units are aligned to coincide.

Galvano scanners or f-theta lenses or the like that constitute the laser projection unit of the wafer marking apparatus require marking position correction procedures to ensure a predetermined marking position after installation or operation.

The wafer alignment inspection device inspects the alignment state of the wafer or the like on the basis of the top surface of the wafer, but since the marking target surface is the bottom surface (or back surface) of the wafer, the process of determining the misalignment or deviation of the marking position for correcting the marking position Is not easy. In addition, the imaging device of the camera of the alignment inspection apparatus cannot directly receive the laser light.

Accordingly, the marking position inspection member 100 mounted on the wafer marking apparatus instead of the wafer in order to determine the error of the marking position and the wafer marking apparatus which can more easily and accurately correct the error of each predetermined marking position on the wafer, and the There is a need for a method of controlling a wafer marking apparatus capable of correcting the marking position of the wafer marking apparatus using the marking position inspecting member 100.

The present invention provides a wafer marking device that can more easily and accurately correct an error of each predetermined marking position on a wafer, and a marking position inspection member and a marking position mounted on a wafer marking device instead of a wafer to determine an error of a marking position. An object of the present invention is to provide a method of controlling a wafer marking apparatus capable of correcting a marking position of a wafer marking apparatus using an inspection member.

In order to solve the above problems, the present invention is a marking position inspection member for correcting the marking position of the wafer marking apparatus having a laser projection unit, the inspection piece provided with a plurality of inspection index, and the same area as the wafer to be marked And a marking position inspection member including a wafer jig having an opening formed thereon, the lower surface of which may be mounted to be exposed downward.

In addition, in order to solve the above problems, the present invention is a support holder including an upper support member and a lower support member inserted and supported between the marking target wafer or the marking position inspection member having the same size as the wafer, the support holder Alignment inspection apparatus for inspecting the alignment state of the marking target wafer or marking position inspection member at the upper portion, Laser projection unit for projecting the laser to the marking target wafer or marking position inspection member at the lower support holder, Marking quality by the laser projection unit It is disposed on the transport path of the support holder to inspect the marking inspection device for inspecting the marking state of the wafer or marking position inspection member to be marked under the support holder, the alignment inspection device, the laser projection unit and the marking It includes a control unit for controlling the inspection device, the laser projection unit When the marking position inspection member is mounted on the support holder for correcting the marking position, the control unit is a deviation of the marking position of the marking position inspection member and the marking position of the laser projection unit aligned by the alignment inspection device. The present invention provides a wafer marking apparatus for calculating and displaying the deviation or correcting the marking position by the laser projection unit according to the calculated deviation.

In addition, in order to solve the above problems, the present invention provides a method for controlling a wafer marking apparatus having a laser projection unit, the marking position inspection having the same shape as the wafer to be marked and detachably mounted at a predetermined position. Marking position inspection member mounting step for mounting the member to the wafer marking device, inspection marking marking step for marking the inspection mark by the laser projection unit constituting the wafer marking device on the lower surface of the inspection piece of the marking position inspection member, inspection An error in the marking position of the laser projection unit based on the position of the inspection mark photographed at the lower part of the marking position inspection member and the inspection mark photographed at the lower portion of the marking position inspection member. It provides a control method of the wafer marking apparatus comprising a; marking position determination step of determining.

According to the control method of the wafer marking apparatus, the marking position inspection member, and the wafer marking apparatus according to the present invention, the marking position of the wafer marking apparatus can be precisely controlled.

In addition, according to the control method of the wafer marking device, the marking position inspection member and the wafer marking device according to the present invention, it is possible to minimize the occurrence of defective products due to marking failure.

Further, according to the control method of the wafer marking device, the marking position inspection member and the wafer marking apparatus according to the present invention, the marking of the inspection mark by the laser projection unit is performed by photographing the marking position inspection member for inspecting the marking position of the laser projection unit. Since it is performed separately from the process, it is possible to prevent damage to the camera of the alignment inspection apparatus by the laser light.

In addition, according to the control method of the wafer marking device, the marking position inspection member and the wafer marking apparatus according to the present invention, since the marking position inspection member can be used repeatedly, the efficiency of the marking position inspection process can be improved and the required cost can be improved. It can be minimized.

1 shows a plan view of a wafer marking system equipped with a wafer marking apparatus according to the present invention.
FIG. 2 illustrates a process of mounting a marking position inspecting member to a support holder of the wafer marking system of FIG. 1.
FIG. 3 shows a side view of the laser projection unit and the alignment inspection apparatus of the wafer marking apparatus constituting the wafer marking system of FIG. 1.
4 is a diagram illustrating an inspection process by a marking inspection apparatus of a support holder on which a marking position inspection member of the wafer marking system of FIG. 1 is mounted.
Fig. 5 shows a plan view of the wafer jig and the test piece of one embodiment of the marking position checking member according to the present invention in a separated state.
6 is a side cross-sectional view of the marking position inspection member shown in FIG.
7 is a plan view and an enlarged view of main parts of the marking position inspection member shown in FIG.
8 shows a plan view and a cross-sectional view of an inspection piece of another embodiment of the marking position inspection member according to the present invention.
FIG. 9 shows a plan view and enlarged view of the main portion of the main portion of the inspection piece of the marking position inspection member shown in FIG. 8. FIG.
10 shows a block diagram of a control method of a wafer marking apparatus according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments disclosed herein are provided so that the disclosure can be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like numbers refer to like elements throughout.

1 shows a top view of a wafer marking system 1000 equipped with a wafer marking apparatus in accordance with the present invention.

The wafer marking apparatus 3000 according to the present invention includes a support holder 3200 including an upper support member and a lower support member on which a marking position inspection member having the same size as a marking target wafer or a wafer is inserted and supported therebetween. Alignment inspection apparatus 3600 for inspecting the alignment state of the marking target wafer or marking position inspection member on the support holder 3200, the laser projecting the laser to the marking target wafer or marking position inspection member from the lower support holder 3200 The projection unit 3500 is disposed on the transport path of the support holder 3200 to inspect the marking quality by the laser projection unit, and the inspection state of the marking target wafer or the marking position inspection member is inspected under the support holder. A marking inspection apparatus 3400 and a control unit (not shown) for controlling the alignment inspection apparatus, the laser projection unit, and the marking inspection apparatus. When the marking position inspection member is mounted on the support holder 3200 for correcting the marking position of the laser projection unit 3500, the control unit may arrange the alignment position of the marking position inspection member aligned through the alignment inspection apparatus. And if there is a deviation of the marking position of the laser projection unit, and calculates the deviation and provides a wafer marking device for correcting the marking position by the laser projection unit 3500 according to the calculated deviation.

That is, the control unit is mounted to the marking device for the marking position inspection member instead of the wafer before the wafer marking process to mark the inspection marker to be marked at a predetermined position, and adjust the position or projection direction of the laser projection unit according to the error. The marking position of the wafer marking apparatus is corrected.

In this case, the marking position may be automatically corrected, or an error of the marking position may be displayed through a separate display (not shown), so that the error of the marking position may be directly corrected by an operator.

The wafer marking apparatus 3000 is provided at the lower portion of the support holder 3200 to the laser projection unit 3500 that is disposed under the support holder 3200 when the wafer seated on the support holder 3200 reaches a predetermined correct position. Marking process is performed.

The wafer marking apparatus according to the present invention may constitute a wafer marking system 1000, and the wafer marking system 10000 illustrated in FIG. 1 includes a wafer supply unit 1000 for supplying a wafer to be marked and a wafer to which marking is completed is carried out. A wafer support holder 3200 comprising a wafer carrying part 4000, an upper plate and a lower plate on which the wafer to be marked is inserted and supported therebetween, the wafer marking device 3000, and the wafer to be marked. At least one wafer transfer robot 5000 may be supplied to the wafer marking unit 3000, and the wafer marking unit 3000 may be transferred to the wafer carrying unit 4000 from the wafer marking unit 3000. .

The wafer supply unit 1000 refers to a supply unit in which the marking target wafers are stacked and supplied.

The wafer supplied from the wafer supply unit 1000 is preliminarily aligned in the preliminary alignment unit 2000 and then transferred to the wafer marking apparatus 3000.

The preliminary alignment of the wafers performed by the preliminary alignment unit 2000 is a process of matching roughness according to the type of the wafer and the like, and may be distinguished from an alignment inspection performed by the wafer marking apparatus 3000 to be described later. .

The wafers aligned in the preliminary alignment unit 2000 are transferred to the wafer marking apparatus 3000.

The wafer marking apparatus 3000 is mounted on the support holder 3200 and the support holder 3200 including an upper support member 3210 and a lower support member 3260 on which a wafer to be marked is inserted and supported therebetween. And a laser projection unit 3500 marking predetermined contents on the back surface of the wafer.

Whether the wafer seated on the support holder 3200 has reached a predetermined correct position is determined by the position of the inspection index displayed on the upper surface of the wafer through the alignment inspection device 3600 provided on the support holder 3200. Can be taken at a predetermined position, and the mounting position of the wafer can be corrected according to the photographed information.

In addition, when it is determined that the mounting position of the wafer is corrected so that the mounting position of the wafer is accurately disposed at a predetermined position, the marking operation of the wafer or the marking position inspection member may be performed by the laser projection unit 3500.

Even if it is confirmed that there is no error in the wafer alignment state by the alignment inspection device 3600, the arrival position of the laser light (hereinafter referred to as the "marking position") of the lower surface of the wafer by the laser projection unit 3500 deviates from the predetermined position. In this case, accurate and precise marking process cannot be guaranteed regardless of wafer alignment.

In the trend that the size of the semiconductor device becomes smaller and smaller, the precision of the marking process is required, and the occurrence of defective products due to the defective marking can increase the cost or waste of the process.

Accordingly, the wafer marking apparatus according to the present invention proposes a new method for correcting the marking position of the laser projection unit 3500 constituting the wafer marking apparatus.

The wafer marking apparatus according to the present invention provides a method of correcting the marking position of the laser projection unit 3500 by using the marking position inspecting member 100 before the marking operation is performed in earnest.

The marking position inspecting member 100 has the same size as the wafer and may be mounted on the support holder and used as a means for determining whether the marking position by the laser projection unit 3500 is correct. Detailed description of the marking position inspection member 100 will be described later.

2 illustrates a process in which the marking position inspecting member 100 is mounted on a support holder of the wafer marking system of FIG. 1.

The marking position inspection member 100 is seated on the lower support member 3260 constituting the support holder 3200 so that the back side thereof faces downward, and when the marking position inspection member 100 is seated, the support holder 3200. The upper support member 3210 constituting the pressure supports the upper surface of the wafer to be marked.

In this case, the lower support member 3260 constituting the support holder 3200 may constitute the support holder 3200 so that the support holder 3200 can be raised or lowered, or the upper support member 3210 constituting the support holder 3200. The support holder 3200 may be configured to rise or fall.

The upper support member 3210 constituting the support holder 3200 has an opening that exposes a predetermined area of the upper surface of the wafer, and the lower support member 3260 constituting the support holder 3200. Has an opening that exposes a predetermined area of the back surface of the marking position inspection member 100.

The support holder 3200 may be transferred in a predetermined axial direction (Y axis direction, see FIG. 1) by the horizontal transfer device 3100.

The horizontal transfer apparatus 3100 may displace the position of the support holder 3200 in which the marking position inspection member 100 is accommodated in the wafer marking apparatus 3000 in the horizontal direction according to each process.

The horizontal feeder 3100 includes a Y-axis feeder (not shown) for reciprocating in the Y-axis direction, and an X-axis feeder (not shown) for feeding the Y-axis feeder in the X-axis direction. It may include.

As described above, the lower support member constituting the support holder 3200 has an opening that exposes a predetermined area of the back surface of the wafer, and the marking position inspection member 100 is mounted on the support holder 3200. When the wafer is transferred to the laser projection unit 3500 by the horizontal transfer device 3100, the laser projection unit 3500 marks the bottom surface of the marking position inspection member 100 through the opening of the lower support member. Detailed description of the marking process will be described later.

The marking position inspecting member 100 may be a metal plate having the same size (area or thickness) as the wafer to be marked. In other words, the packaging is not a completed wafer, but a tester for checking the alignment of the laser projection unit before marking the wafer.

Therefore, in order to determine whether the marking position of the laser projection unit is correct after mounting the marking position inspecting member 100 to the support holder, first check whether the alignment state of the marking position inspecting member 100 is correct, and Marking the inspection mark on the lower surface of the marking position inspection member 100 based on the laser projection unit 3500 to check the alignment state of the laser projection unit 3500 by checking whether the inspection mark is marked at a predetermined position. Can be. Hereinafter, a detailed marking position correction method will be described with reference to FIG. 3.

FIG. 3 shows a side view of the laser projection unit and the alignment inspection apparatus of the wafer marking apparatus constituting the wafer marking system of FIG. 1.

The wafer marking apparatus 3000 may further include an alignment inspection apparatus 3600 having a camera 3610 in order to improve the accuracy of marking. The alignment inspection apparatus 3600 inspects the alignment of the wafer to be marked and photographs and reads the alignment of the wafer to be marked in order to be marked at the correct position.

In the wafer marking apparatus according to the present invention, in order to determine whether the marking position by the laser projection unit 3500 coincides with the predetermined position, the marking position inspection member 100 is mounted on the wafer marking apparatus instead of the marking target wafer, The error of the marking position by the projection unit 3500 is read.

The alignment inspection apparatus 3600 may also perform imaging for inspection of alignment using a reflecting mirror, similarly to a wafer marking apparatus.

As described above, the upper support member constituting the support holder 3200 has an opening that exposes a predetermined area of the upper surface of the marking position inspection member 100.

When the support holder 3200 on which the marking position inspection member 100 is mounted is transferred to the lower portion of the alignment inspection apparatus 3600, the alignment inspection apparatus 3600 supports the upper portion of the front surface of the marking position inspection member 100. The location of the inspection index provided in the portion exposed to the opening of the member may be photographed, and then the marking position inspection member 100 may be inspected to satisfy the alignment state, similarly to the wafer to be marked, based on the photographing information.

When the alignment inspection apparatus 3600 examines the alignment state of the wafer to be marked, the alignment inspection device 3600 determines the alignment state of the wafer immediately before the marking, and the marking position inspection member 100 instead of the wafer to be marked is supported by the support holder 3200. When mounted, it may be checked whether the marking position inspection member 100 is disposed in a predetermined direction or position.

The alignment process of the marking position inspecting member 100 may be performed by checking the alignment state of the marking position inspecting member 100 and correcting the misalignment state.

The alignment inspection apparatus 3600 photographs an image near the inspection index provided in the marking position inspecting member 100 by a camera 3610 provided therein, and manually or automatically performs an inspection index based on the photographed image. The mounting position of the marking position inspection member 100 can be corrected so that the position and the reference position are the same.

When correction of the mounting position of the marking position inspection member 100 on the basis of the upper surface of the marking position inspection member 100 is completed, the marking position inspection mark is placed on the lower surface of the marking position inspection member 100. Mark through.

The marking position inspection mark is marked on the bottom surface of the inspection piece detachably mounted to the marking position inspection member 100. I'll put more details later.

In summary, in order to correct an error in the marking position of the wafer by the laser projection unit of the wafer marking apparatus for marking the wafer, the marking position inspection member 100 is mounted on the wafer marking apparatus instead of the wafer, It is possible to correct the error of the marking position that may occur.

Positions of the alignment inspection device 3600 and the laser projection unit 3500 are disposed in the upper and lower portions in the vertical direction with the support holder 3200 on which the marking position inspection member 100 is mounted, respectively. The wafer supported by the support holder 3200 may be transferred between the alignment inspection device 3600 and the laser projection unit 3500 to perform a work.

The wafer marking apparatus 3000 may further include a marking inspection apparatus for inspecting a marking state of the back surface of the wafer.

4 is a diagram illustrating an inspection process of the support holder on which the marking position inspection member 100 of the wafer marking system 100 of FIG. 1 is mounted.

The marking inspection apparatus 3400 may also include a camera like the alignment inspection apparatus 3600. As shown in FIG. 4, the camera provided in the marking inspection apparatus 3400 may not photograph the rear surface of the wafer in a vertical direction without a reflecting mirror.

It is provided to inspect the marking state of the wafer based on the information photographed by the camera. However, when the marking position inspection member 100 is mounted instead of the wafer, the marking inspection apparatus 3400 does not inspect the marking state of the wafer, but the inspection marking marked on the lower surface of the marking position inspection member 100 is performed. It is checked whether or not it is marked at a predetermined position.

Whether the inspection mark marked by the laser projection unit 3500 is marked at a predetermined position is determined by the position of the inspection mark marked on the bottom surface of the marking position inspection member 100 and the marking position inspection member 100. Judgment is made based on whether or not the location of the inspection index matches.

In the description with reference to FIG. 3, the method for correcting the mounting position of the marking position inspecting member 100 may also be determined based on whether the inspection index provided in the marking position inspecting member 100 reaches a predetermined position.

In addition, since the wafer marking apparatus according to the present invention performs the shooting of the marking position inspection member for inspecting the marking position of the laser projection unit separately from the marking process of the inspection mark by the laser projection unit, the alignment inspection apparatus by the laser light. To prevent damage to the camera.

Therefore, the inspection index provided in the marking position inspecting member 100 should be shaped to be observed on both the upper and lower surfaces of the marking position inspecting member 100. Hereinafter, the structure of the marking position inspection member 100 will be described in detail with reference to FIG. 5 or less.

Figure 5 shows a plan view of the wafer jig and the test piece of the embodiment of the marking position inspection member 100 according to the present invention in a separated state.

The marking position inspection member according to the present invention is a marking position inspection member for correcting a marking position of a wafer marking apparatus including a laser projection unit, the inspection piece (Zt) having a plurality of inspection indexes, and a wafer to be marked; It may include a wafer jig Wz having the same area and having an opening Zo formed therein so that the lower surface of the inspection piece Zt may be mounted downwardly.

The marking position inspection member 100 may have the same shape as the wafer to be marked, and the size or thickness thereof is also the same as the wafer to be marked.

The marking position inspection member 100 may include a wafer jig Wz having the same shape as a wafer shape and an inspection piece Zt detachably mounted to the wafer jig Wz.

The wafer jig Wz may have an opening so that the lower surface of the inspection piece Zt is exposed downward. The opening may have the same shape as the test piece Zt.

The wafer jig Wz of the marking position inspecting member 100 illustrated in FIG. 5 is illustrated as having a disc shape, and the inspecting piece Zt and the opening are illustrated as having a rectangular (or square) shape.

The inspection piece Zt is provided with a plurality of inspection indices. The inspection index is provided with a plurality. In the embodiment shown in Fig. 5, the inspection index is the inspection hole h. The inspection hole h is formed to vertically penetrate the upper and lower surfaces of the inspection piece Zt in a circular shape. The test piece may be made of a metal material.

In addition, the plurality of inspection holes h as the inspection index may be provided to form a plurality of rows and columns. Each row and column may be parallel to each other and may be formed at equal intervals.

The columns and rows of the inspection index form N rows and N columns and may be parallel at predetermined intervals, where N may be a multiple of three. This is to maximize the frequency of inspection by the same specimen.

The inspection hole h becomes a reference position in the process of correcting the mounting position of the marking position inspection member 100 and marking of the marking position inspection mark, and thus, a plurality of inspection holes h as the inspection index. It is configured to be observed from the upper and lower surfaces of the marking position inspection member 100 by forming a).

In the process of marking the marking position inspection mark, a plurality of inspection holes h may be used as a reference for determining an error of the marking position at the same time. This is because it is preferable to use a plurality of inspection holes h in order to accurately determine the error of the marking position even when the position of the specific inspection hole h coincides with the position of the inspection mark described later. In addition, a larger number of inspection holes h may be formed in the inspection piece Zt than the number of inspection holes h used for one inspection, which is determined by one inspection piece Zt. This means that the conference inspection process can be carried out.

For example, if three inspection holes are used in the inspection process of one marking position, the inspection pieces Zt of the marking position inspection member 100 shown in FIG. 5 are 12 times in total (3 * 12 times = 36 times). ) Can be performed.

6 is a side cross-sectional view of the marking position inspection member 100 shown in FIG.

In FIG. 6, a marking position inspection member 100 having two different wafer jigs is shown.

In the embodiment shown in Fig. 6, the test piece is mounted in an opening formed in the wafer jig. The lower surface of the test piece may be mounted to be exposed downward through the opening.

Therefore, the locking jaws Zs may be provided in the openings Zo for mounting the test pieces Zt, respectively. The edge of the test piece Zt is supported by the locking step Zs to maintain the test piece Zt mounted on the wafer jig Wz. In the following description, it is assumed that the thickness of the wafer jig Wz coincides with the thickness of the wafer to be marked.

The upper surface of the inspection piece Zt is photographed by the alignment inspection device to determine the mounting position of the marking position inspection member 100, and should be arranged at the ultra-short distance of the camera constituting the alignment inspection device.

In order to support the inspection piece, a locking projection protruding in the horizontal direction may be provided on an inner surface of the opening of the wafer jig.

In the embodiment illustrated in FIG. 6A, the locking jaw Zs is shown to protrude in the vertical direction from the inner surface of the opening Zo. When the thickness of the wafer jig Wz is t, the thickness of the locking step Zs is t2, and the side surface thickness of the opening is t1, the thickness of the test piece Zt is t1 (t> t1). In the state in which the test piece Zt is mounted on the wafer jig Wz, the upper surface of the test piece Zt has the same height as the upper surface of the wafer jig Wz.

Therefore, the upper surface of the inspection piece Zt may be disposed on the focal length of the camera of the alignment inspection device in the step of aligning the mounting position of the marking position inspection member 100. Facilitate alignment

The lower surface of the inspection piece Zt is photographed by a marking inspection device to compare and determine the position of the inspection mark and the inspection index marked on the inspection piece Zt, and the ultra-short distance of the camera constituting the alignment inspection device. It needs to be placed in.

However, in the embodiment shown in Fig. 6A, the lower surface of the inspection piece Zt is different from the lower surface of the wafer jig Wz by the thickness t2 of the locking step Zs, so that the actual marking target wafer In comparison with, a deviation in the focal length of the laser marking may occur.

Therefore, in order to support the inspection piece, a locking projection protruding in the horizontal direction may be provided on a lower surface of the edge of the opening of the wafer jig.

The latching jaw Zs' provided in the opening of the wafer jig Wz 'of the embodiment shown in FIG. 6 (b) is not provided at the side of the opening, but is disposed in the horizontal direction at the lower end of the edge of the opening Zo'. It is provided.

Since the thickness t 'of the wafer jig Wz and the thickness t1' of the inner side of the opening can be made the same, the height of the lower surface of the wafer jig Wz 'and the height of the lower surface of the inspection piece Zt' can be matched. Not only the marking position but also whether the focal length of the laser projection unit in the marking process is correct can be checked together.

Therefore, as shown in Fig. 6 (b), in order to match various focal lengths, the thickness of the test piece Zt and the thickness of the wafer jig Wz are matched, and the height of the upper surface of the test piece is the wafer. It is preferable to comprise so that it may correspond with the height of the upper surface of a jig | tool.

In the embodiment shown in Figure 6, each embodiment is the height of the upper surface of the test piece and the upper surface of the wafer jig when the test piece is mounted in the opening of the wafer jig, the thickness of the test piece and the The thickness of the wafer jig may be the same.

FIG. 7 illustrates a plan view and enlarged view of main parts of the marking position inspecting member 100 shown in FIG. 5.

The inspection index, which is hooked on the inspection piece Zt of the marking position inspection member 100 shown in FIG. 7, is the inspection hole h. Therefore, when the marking for inspection is marked by the laser projection unit 3500, the marking for the inspection hole (h) may not leave a separate mark.

However, the inspection markers may have a “╀” shape, so that the approximate location of the center of each inspection marker can be calculated.

In addition, since the position of the center of each inspection hole (h) can also be calculated, the center of the inspection hole (h) (c1, c2, c3) in the image taken by the marking inspection device of the inspection mark The distances d1, d2, d3 between the centers can be calculated respectively.

The inspection mark marked by the laser projection unit 3500 may target each inspection index (inspection hole h) provided in the inspection piece Zt. That is, when the inspection mark is marked for each inspection index, and a deviation of the distance between the inspection mark and the inspection index occurs, the setting of the laser projection unit may be interpreted as inconsistent with the alignment criteria of the alignment inspection apparatus. Can be.

The marking position inspection member 100 is in a state in which the installation position is corrected to a predetermined position in the above-described process of aligning the mounting position of the marking position inspection member 100.

That is, if there is no mechanical error of the laser projection unit itself, the center of the inspection hole (h) and the center of the inspection mark may be exactly coincident. The laser projection unit is marked by the control unit of the wafer marking apparatus so that the center of each inspection hole h and the center of inspection marks c1, c2, and c3 coincide with each other on the lower surface of the inspection specimen Zt. Because it was controlled.

However, the fact that the distances d1, d2, d3 between the center of each inspection hole h and the center of the inspection mark has been generated accurately marks the reference position of the alignment process regardless of the alignment process by the alignment inspection device. This means that the laser projection unit is not set.

Therefore, based on the information photographed by the marking inspection apparatus, the center of each inspection hole h and the center of the inspection mark coincide with the position of the laser projection unit or the galvano scanner constituting the laser projection unit. Alternatively, the marking position can be corrected by adjusting the f-theta lens.

According to the marking position inspection member having a plurality of inspection indexes, since a single marking position inspection member can be repeatedly used in a plurality of inspection processes, the marking position inspection process can be improved in efficiency and the required cost can be minimized. Can be.

8 shows a plan view and a cross-sectional view of an inspection piece Zt ″ of another embodiment of the marking position inspection member 100 according to the present invention.

In the embodiment illustrated in FIG. 8, the test piece Zt ″ may be a light transmissive material. For example, the test piece Zt ″ may be formed of a glass material or a resin material. As the index for the inspection, a plurality of inspection spots e may be provided instead of the inspection holes h. The inspection spot e may be, for example, an area where the surface is etched or printed (or attached). The inspection spot (e) should be enough to be observed on both the upper and lower surfaces of the light transmissive material. This is because it is a comparison standard when the alignment inspection apparatus and the marking inspection apparatus are photographed.

That is, even if it is etched or marked, both of the alignment inspection apparatus provided at the upper portion of the marking position inspecting member 100 and the marking inspection apparatus provided at the lower portion of the marking position inspecting member 100 can optically photograph the marking position inspecting member. It can be observed both in the alignment process and marking position correction process of (100).

As shown in FIG. 8B, the marking position inspecting member 100 illustrated in FIG. 8 may have a sheet S made of a light transmissive material attached to a lower surface thereof. The sheet S is a configuration for marking an inspection mark marked by a laser projection unit. This is because when the inspection mark is made of glass or the like, marking of the inspection mark by the laser may be impossible.

The sheet S may also be made of a light transmissive material, and after inspection marks are marked by a laser projection unit, all inspection spots may be observed together with inspection marks when photographing by a marking inspection apparatus.

When the inspection piece Zt is formed of a resin material such as acrylic, the marking for inspection by the laser projection unit can be marked, and thus the attachment of the sheet S may be omitted.

In the case where the sheet paper is attached, the test piece Zt itself can be used continuously when the new sheet paper S is replaced.

FIG. 9 shows a plan view and enlarged views of the main parts of the inspection piece Zt of the marking position inspection member 100 shown in FIG. 8.

Descriptions duplicated with the description with reference to FIG. 7 will be omitted and the description will be mainly focused on differences.

In the embodiment shown in FIG. 9, the shape of the inspection mark marked on the lower surface of the inspection piece Zt does not need to have a “╀” shape because the inspection index is not the inspection hole h. It may have the form of a point aimed at the center (c1, c2, c3) of the inspection spot (e1, e2, e3). Therefore, the efficiency of the marking process for marking the inspection marks p1, p2, and p3 can be improved.

Each distance d1, d2, d3 between the center of each inspection spot and the corresponding inspection mark is calculated and the galvano scanner or f-theta lens constituting the laser projection unit is adjusted to adjust the laser projection unit. The marking position can be corrected as in the embodiment with reference to FIG. 7.

10 shows a block diagram of a control method of a wafer marking apparatus according to the present invention.

In the method of controlling a wafer marking apparatus having a laser projection unit, the present invention provides a marking for mounting a marking position inspection member on a wafer marking apparatus, wherein the marking position inspection member has the same shape as the wafer to be marked and is detachably mounted at a predetermined position. Position inspection member mounting step (S100), the inspection marking marking step (S300), the inspection marking marking step for marking the inspection mark by the laser projection unit constituting the wafer marking device on the lower surface of the inspection piece of the marking position inspection member The laser marking unit based on the position of the inspection mark photographed in the inspection mark photographing step (S400) and the inspection mark photographing step (S400) of photographing the inspection mark marked at (S300) at the lower portion of the marking position inspection member. It provides a control method of a wafer marking apparatus comprising a marking position determination step (S500) for determining the error of the marking position.

The control method of the wafer marking apparatus according to the present invention can precisely correct the marking position of the laser projection unit by using the wafer marking apparatus to which the above-described marking position inspection member and the marking position inspection member are mounted.

Further, the method may further include a marking position inspection member alignment step S200 for aligning the mounting position of the marking position inspection member 100 after the marking position inspection member mounting step S100. If the accuracy of the mounting position of the marking position inspection member cannot be ensured during the mounting of the marking position inspection member, the marking position inspection member alignment step S200 may be additionally performed to determine the marking position error of the laser projection unit. Can minimize errors.

And, as described above, the marking position inspection member alignment step (S200) includes the step of photographing the inspection index by the alignment inspection device having a camera (S210), the marking position inspection member alignment step ( S200 may be performed by aligning the marking position inspection member (S220) such that the position of the inspection index provided on the inspection piece Zt mounted on the marking position inspection member is positioned at a predetermined position.

After the marking position inspection member alignment step (S200), the inspection marking marking step (S300) may be performed.

The inspection marking marking step S300 may be performed by displaying inspection markers on a plurality of points on the lower surface of the inspection piece Zt.

Specifically, the marking marking step (S300) is to project the laser from the laser projection unit to the lower surface of the inspection piece so that the center of the plurality of inspection index formed on the inspection piece and the center of the inspection mark or inspection mark coincide. It can be carried out in a way. Here, the inspection marking marking step (S300), as described in the description with reference to Figures 7 and 9, it is possible to mark the inspection markers on the lower surface of the three inspection indexes, respectively.

In addition, the laser marking unit in the inspection marking marking step (S300) can be marked so that the inspection marker has a "╀" form. In the case where the inspection index is an inspection hole, the marking index is not marked in an area penetrating the hole, so that the position of the center of the inspection index can be easily calculated. Here, the center of the inspection mark is a point where the vertical line and the horizontal line constituting the inspection mark in the form of "╀" cross each other.

In addition, the inspection mark photographing step (S400) may be a method of photographing the lower surface of the inspection piece (Zt) of the marking position inspection member 100 by the camera of the marking inspection apparatus (S420), for the inspection The marking photographing step S400 may be performed after the marking marking step S300 is transferred to the upper part of the marking inspecting apparatus 100 after the marking position inspecting member S300.

As described above, the marking position determining step S500 may be performed by measuring a distance between the center of each inspection index and the center of the inspection mark or inspection mark.

The method may further include a marking position correction step S600 for correcting the marking position of the laser projection unit in order to adjust the marking position determined in the marking position determination step S500. In the marking position correcting step S600, the wafer marking apparatus may be configured to be automatically corrected based on the result of the marking position determining step S500, or it may be manually corrected.

Specifically, the marking position correction step (S600) is the position or the position of the laser projection unit so that the center of the plurality of inspection holes formed in the inspection piece (Zt) mounted on the marking position inspection member and the center of the inspection mark to match. As described above, the method may be performed by adjusting the galvano scanner or the f-theta lens constituting the laser projection unit.

While the present invention has been particularly shown and described with reference to preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the following claims. . It is therefore to be understood that the modified embodiments are included in the technical scope of the present invention if they basically include elements of the claims of the present invention.

100: marking position inspection member
1000: wafer supply part 2000: preliminary alignment part
3000: Wafer marking device 3100: Horizontal transfer device
3200: support holder 3210: upper support member
3260: lower support member 3300: wafer displacement device
3400: marking inspection device 3500: laser projection unit
3600: alignment inspection device 4000: wafer carrying part
5000: Wafer Transfer Robot 10000: Wafer Marking System

Claims (34)

In the marking position inspection member for correcting the marking position of the wafer marking device having a laser projection unit,
An inspection piece having a plurality of inspection indices; And,
And a wafer jig having the same area as the wafer to be marked and having an opening to be mounted such that the lower surface of the test piece is exposed downward. The method of claim 1,
The inspection piece has a rectangular shape, the inspection index is a marking position inspection member, characterized in that it is provided to form a plurality of columns and rows. The method of claim 2,
Marking position inspection member, characterized in that the column and the row of the index for inspection forms N rows and N columns, and parallel to a predetermined interval. The method of claim 3,
Marking position inspection member, characterized in that N is a multiple of three. The method of claim 1,
The inspection index is a marking position inspection member, characterized in that the inspection hole penetrating the upper and lower surfaces of the inspection piece. The method of claim 1,
The inspection piece is made of a metal material, the inspection hole is a marking position inspection member, characterized in that the circular hole penetrating vertically through the upper and lower surfaces of the inspection piece. The method of claim 1,
The inspection piece is a light-transmissive material, the inspection index is a marking position inspection member, characterized in that the plurality of inspection spots provided on the upper or lower surface of the inspection piece. The method of claim 7, wherein
The inspection spot is a marking position inspection member, characterized in that the circular spot which is etched, marked or attached to the upper or lower surface of the test piece. The method of claim 7, wherein
The inspection piece is a marking position inspection member, characterized in that the glass material or resin material. The method of claim 7, wherein
Marking position inspection member, characterized in that the sheet of light transmissive material is attached to the lower surface of the inspection piece. The method of claim 1,
Marking position inspection member, characterized in that the locking projection protruding in the horizontal direction on the inner surface of the opening of the wafer jig to support the inspection piece. The method of claim 1,
Marking position inspection member, characterized in that the locking projection protruding in the horizontal direction is provided on the lower surface of the edge of the opening of the wafer jig to support the inspection piece. The method according to claim 11 or 12, wherein
And the height of the upper surface of the inspection piece and the upper surface of the wafer jig is the same when the inspection piece is mounted in the opening of the wafer jig. The method of claim 12,
Marking position inspection member, characterized in that the thickness of the test piece and the thickness of the wafer jig is the same. A support holder including an upper support member and a lower support member on which a marking target inspection member having the same size as the marking target wafer or the wafer is inserted and supported therebetween;
An alignment inspection device for inspecting an alignment state of a marking target wafer or a marking position inspection member on the support holder;
A laser projection unit projecting the laser onto the marking target wafer or the marking position inspection member under the support holder;
A marking inspection device disposed on a transport path of a support holder for inspecting marking quality by the laser projection unit, and inspecting a marking state of a marking target wafer or a marking position inspection member under the support holder; And,
And a control unit for controlling the alignment inspection device, the laser projection unit, and the marking inspection device.
When the marking position inspection member is mounted on the support holder for correcting the marking position of the laser projection unit, the controller is configured to determine the alignment position of the marking position inspection member aligned with the alignment inspection apparatus and the marking position of the laser projection unit. If a deviation occurs, the wafer marking device for calculating and displaying the deviation, or correcting the marking position by the laser projection unit in accordance with the calculated deviation. 16. The method of claim 15,
The marking position inspection member has a wafer jig having a plurality of inspection holes or inspection spots and the same area as the wafer to be marked, and a wafer jig having an opening that can be mounted to expose the lower surface of the inspection piece downward. Wafer marking apparatus comprising a. The method of claim 16,
The deviation of the marking position of the laser projection unit is a wafer marking apparatus, characterized in that the distance between the inspection mark and a plurality of inspection holes or inspection spots printed on the lower surface of the inspection piece by the laser projection unit. The method of claim 17,
The control unit is a position of the laser projection unit or the position of the laser projection unit constituting the laser projection unit or the galvano scanner or f such that the centers of the plurality of inspection holes formed on the inspection piece and the center of the inspection mark coincide. Wafer marking apparatus, characterized in that for adjusting theta lens. The method of claim 17,
The control unit adjusts the position of the laser projection unit or the galvano scanner or f-theta lens constituting the laser projection unit such that the centers of the plurality of inspection spots formed on the inspection piece and the inspection mark coincide with each other. Wafer marking apparatus. The method of claim 17,
The control unit is characterized in that for marking the inspection mark on the lower surface of the inspection piece by the laser projection unit after the alignment of the marking position inspection member 100 by the alignment inspection device. The method of claim 17,
And the control unit transfers the support holder to the upper portion of the marking inspection apparatus after printing of the inspection mark by the laser projection unit on the lower surface of the inspection piece. In the control method of a wafer marking apparatus having a laser projection unit,
A marking position inspection member mounting step of mounting the marking position inspection member on the wafer marking apparatus, the marking position inspection member having the same shape as the marking target wafer and detachably mounted at the predetermined position;
An inspection mark marking step of marking an inspection mark on a lower surface of an inspection piece of the marking position inspection member by a laser projection unit constituting a wafer marking device;
An inspection mark photographing step of photographing the inspection mark marked in the inspection mark marking step under the marking position inspection member; And,
And a marking position determining step of determining an error of a marking position of the laser projection unit on the basis of the position of the inspection mark photographed in the inspection marking photographing step. The method of claim 22,
And a marking position inspection member alignment step of aligning the mounting position of the marking position inspection member after the marking position inspection member mounting step. The method of claim 23, wherein
The marking position inspection member alignment step is a control method of a wafer marking apparatus, characterized in that the alignment is performed so that the position of the inspection index provided on the inspection piece mounted on the marking position inspection member is positioned at a predetermined position. 25. The method of claim 24,
The marking position inspecting member alignment step includes a step of photographing the inspection index by an alignment inspection apparatus having a camera. The method of claim 22,
The inspection marking marking step is a control method of the wafer marking apparatus, characterized in that performed by a method for displaying the inspection marks on a plurality of points on the lower surface of the inspection piece. The method of claim 26,
The marking marking step is performed by projecting the laser onto the lower surface of the inspection piece in the laser projection unit such that the centers of the plurality of inspection indexes formed on the inspection piece and the inspection mark or inspection mark coincide with each other. A method of controlling a wafer marking apparatus, characterized in that. The method of claim 26,
The inspection marking marking step is a control method of the wafer marking apparatus, characterized in that for marking the marking for each inspection mark on the lower surface of the three inspection index. The method of claim 26,
In the inspection marking marking step, the laser projection unit is a control method of the wafer marking device, characterized in that for marking so that the inspection marker has a "╀" form. The method of claim 22,
The inspection marking photographing step is a control method of a wafer marking apparatus, characterized in that the method of photographing the lower surface of the inspection piece of the marking position inspection member by a camera of the marking inspection apparatus. The method of claim 30,
The inspection marking photographing step is a control method of a wafer marking apparatus, characterized in that is carried out after transferring the marking position inspection member to the upper portion of the marking inspection apparatus after the inspection marking marking step. The method of claim 22,
The marking position determining step is a control method of a wafer marking apparatus, characterized in that for measuring the distance between the center of each inspection index and the center of the inspection mark or inspection mark. The method of claim 22,
And a marking position correction step of correcting the laser projection direction of the laser projection unit in order to adjust the marking position determined in the marking position determination step. The method of claim 33, wherein
The marking position correcting step may include a galvano scanner that configures the position of the laser projection unit or the laser projection unit such that the centers of the plurality of inspection holes formed on the inspection pieces mounted on the wafer jig coincide with the centers of the inspection marks. A method of controlling a wafer marking apparatus, characterized in that it is performed by a method for adjusting the f-theta lens.
KR1020100092635A 2010-09-20 2010-09-20 Wafer marking device, marking position inspecting member and controlling method of wafer marking device KR20120030841A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101424600B1 (en) * 2013-02-15 2014-08-01 주식회사 엘티에스 Method for calibrating marking area of wafer marking apparatus
TWI633643B (en) * 2016-02-16 2018-08-21 Eo科技股份有限公司 Laser marking apparatus and laser marking method
KR102088270B1 (en) 2018-10-04 2020-04-24 주식회사 디에스티시스템 Second alignment device for marking

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101424600B1 (en) * 2013-02-15 2014-08-01 주식회사 엘티에스 Method for calibrating marking area of wafer marking apparatus
TWI633643B (en) * 2016-02-16 2018-08-21 Eo科技股份有限公司 Laser marking apparatus and laser marking method
CN108780788A (en) * 2016-02-16 2018-11-09 Eo科技股份有限公司 A kind of laser mark device and laser mark method
US10861725B2 (en) 2016-02-16 2020-12-08 Eo Technics Co., Ltd. Laser marking device and laser marking method
CN108780788B (en) * 2016-02-16 2022-03-18 Eo科技股份有限公司 Laser marking device and laser marking method
US11621184B2 (en) 2016-02-16 2023-04-04 Eo Technics Co., Ltd. Laser marking device and laser marking method
KR102088270B1 (en) 2018-10-04 2020-04-24 주식회사 디에스티시스템 Second alignment device for marking

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