KR20120007759A - A cliche for printing ink and a method of fabricating thereof - Google Patents

Abstract

PURPOSE: A printing plate and a manufacturing method thereof are provided to reduce manufacturing costs by performing fine pattern formation on the printing plate which prints various patterns and circuits of electronic components with an indirect printing method. CONSTITUTION: A photosensitive resin layer(121,131) is laminated on a substrate(110). Two or more photosensitive resin layers are laminated as the photosensitive resin layer. A printed pattern is formed by patterning the photosensitive resin layer. The printed pattern is arranged with a plurality of patterns with different depths and widths from each other. The printed pattern includes a second pattern(133) which is a minimum pattern and a first pattern(123) which is a reference pattern.

Description

Printing plate and manufacturing method thereof {A CLICHE FOR PRINTING INK AND A METHOD OF FABRICATING THEREOF}

The present invention relates to a manufacturing process of a printing plate for printing a resist pattern in manufacturing a liquid crystal display device.

In order to print circuits and various patterns of electronic components using printing, direct printing methods such as inkjets are used, or indirect printing methods such as gravure printing or offset printing using printing plates on which patterns are printed.

Conventionally, a method of making a printing plate includes a method of corroding a substrate to form a pattern, or a method of forming a plate on which a photosensitive resin is first attached using photolithography. However, in this conventional method, the depth of the formed pattern remains constant regardless of which method is used. As shown in FIG. 1A, for printing, the pattern depth 11 of the printing plate 10 must be at least a predetermined level so that the printing roll does not touch the bottom of the pattern. This depth is different when the fine line width and the general pattern.

That is, as shown in (b) of FIG. 1A, the depth of the pattern is not required deeply in the case of the fine pattern portion 'a', but in the case of 'b' having a large pattern line width, the printing roll 20 touches the bottom of the pattern This may be printed incorrectly, so the depth should be larger. For this reason, in the printing plate manufactured by wet etching, the depth t of the pattern to be formed is determined to be ½ or less of the minimum fine line width of the printing plate. That is, the minimum line width that can be implemented in the printing plate is determined as follows.

{Minimum possible line width> minimum pattern depth (t) * 2}

In general, since the minimum pattern depth that can be printed using a printing plate is about 5 um, the minimum line width that can be realized by the conventional method is about 10 um. Therefore, it is difficult to manufacture a printing plate having a fine line width of less than 10um in the prior art. In addition, in the case of the printing plate 10 having the structure as shown in (a) of FIG. 1B, the fine patterns 13 and 14 can be formed, but due to the high aspect ratio, the pattern 13 is easily broken by external force as shown in (b). The problem arises.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to implement the formation of a micropattern in a printing plate for printing circuits and various patterns of electronic components by indirect printing, and thus different depths and widths are achieved. It is to provide a manufacturing method and a structure of a printing plate that can be manufactured by using a high precision and a simple process to reduce the manufacturing cost and improve the reliability of the product.

As a means for solving the above problems, the present invention is a photosensitive resin layer laminated on a substrate; And a printing pattern formed by patterning the photosensitive resin layer, wherein the printing pattern can provide a printing plate formed of a plurality of patterns having different depths or different widths.

In particular, the photosensitive resin layer in the printing plate may be formed in a structure laminated with at least two photosensitive resin layers.

In addition, the printing pattern may be formed to include at least one or more second patterns as minimum patterns and first patterns as reference patterns. Can be.

In particular, the second pattern of the above-described structure is formed on the second photosensitive resin layer, so that the thickness (d) of the second photosensitive resin layer and the line width (e) of the second pattern satisfies Equation 1 below. Can be formed.

{1}

 d≥½ * e

In addition, the first pattern in the printing plate is formed on the second and the first photosensitive resin layer, the thickness (c) of the first photosensitive resin layer may be formed to satisfy the following equation (2). Where d is the thickness of the second photosensitive resin layer and e is the line width of the second pattern.)

{Equation 2}

c≥d-½ * e

Further, the line width f of the first pattern in the printing plate may be formed so as to satisfy the following expression (where e means the line width of the second pattern).

{Equation 3}

f≥1.5 * e

The line width e of the second pattern in the above-described structure may be formed in the range of 1 to 50 μm, and the thickness d of the second photosensitive resin layer may be formed in the range of 2.5 to 12.5 μm.

In addition, the thickness (c) of the first photosensitive resin may be formed to 1.25um or more.

In addition, the printing plate of the above-described structure can be manufactured by the following process.

That is, the printing plate according to the present invention is manufactured by forming at least one photosensitive resin layer on a substrate, patterning the photosensitive resin layer to form a printing pattern, more specifically, a1) photosensitive resin layer on the substrate Stacking at least one; a2) exposing and developing the photosensitive resin layer to form a plurality of print patterns having different depths or different widths.

In particular, in this case, step a2) includes forming a first photosensitive resin layer and a second photosensitive resin layer on the substrate, and at least one second pattern as a minimum pattern and a first pattern as a reference pattern through exposure. It can be formed in a step to be processed.

In addition, the depth of the second pattern may be less than or equal to the depth of the first pattern.

In addition, unlike the above-described process may be implemented in the following process.

In the manufacturing of the printing plate according to the present invention, the printing pattern may be formed by: b1) forming a first photosensitive resin layer on the substrate and forming a lower region of the first pattern through exposure; b2) forming a second photosensitive resin layer on the first photosensitive resin layer; b3) exposing and developing the second photosensitive resin layer to form a second pattern and the first pattern.

In this case, in step b3), the depth of the second pattern may be formed to be equal to or less than the depth of the first pattern.

According to the present invention, the micro-patterns having different depths and widths are realized by indirect printing, and the micro-patterns having different depths and widths are formed using a high degree of precision and a simple process. By making it possible to manufacture, there is an effect that can reduce the manufacturing cost and improve the reliability of the product.

1A and 1B are conceptual views illustrating a problem of a printing plate according to the prior art.
2 is a conceptual view illustrating main parts of a printing plate according to the present invention.
3 is a process chart showing the manufacturing process of the printing plate according to the present invention.
Figure 4 is a process diagram showing another embodiment of the manufacturing process of the printing plate according to the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration and operation according to the present invention. In the description with reference to the accompanying drawings, the same components are given the same reference numerals regardless of the reference numerals, and duplicate description thereof will be omitted. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

Figure 2 illustrates the structure of a printing plate according to the present invention, the printing plate according to the present invention can be described in the following structure.

Referring to the drawings, the printing plate according to the present invention includes a photosensitive resin layer (121, 131) laminated on the substrate 110, the photosensitive resin layer is formed by patterning the print pattern, the print pattern is It may be formed of a structure having a plurality of patterns 123 and 133 having different depths or different widths.

The substrate 110 may secure a flatness of the surface, may be enlarged, and may be applied to any one made of a material having a similar thermal expansion coefficient to that of the substrate after being transferred. For example, a glass substrate However, a polymer substrate such as PC, PMMA, PET, or a metal may be used. In particular, in order to maintain the accuracy of the pattern, it is preferable to use a substrate having a coefficient of thermal expansion within two times the coefficient of thermal expansion of the transfer substrate.

In the present invention, the photosensitive resin layers 121 and 131 are described with an example in which two photosensitive resin layers are formed. However, the photosensitive resin layers 121 and 131 are not limited thereto. At least two or more structures having different depths by stacking layers may be included in the gist of the present invention. In one embodiment of the present invention, a photosensitive resin layer laminated on the substrate is laminated on the first photosensitive resin layer 121, and the first photosensitive resin layer 121 is formed on the second photosensitive resin layer ( 131) will be described. The first and second photosensitive resin layers may be formed through conventional spin coating or slit coating, and various materials such as photoresist, dry film resist, and ultraviolet curable resin may be used, and in particular, photosensitive properties. Of course, all of them can be applied.

The print patterns 123 and 133 may be provided with at least two patterns having different depths and widths by patterning the photosensitive resin layers 121 and 131 according to the present invention. 'Reference line width f' is defined as the line width of the pattern formed over the entire photosensitive resin layer formed on the substrate.) And a minimum having the smallest line width among the first pattern 123 and the printed pattern. At least one second pattern 133 having a fine pattern line width e may be included. In this case, the depth of the second pattern is preferably formed below the depth of the first pattern.

The second pattern 133 may be formed on the second photosensitive resin layer 131, and the illustrated shape may have a thickness T1 of the second pattern 133 of the second photosensitive resin layer 131. The structure is formed in the same structure as the thickness, but may alternatively be formed below the thickness of the second photosensitive resin according to the degree of patterning.

In addition, the line width e of the second pattern 133 formed on the second photosensitive resin layer 131 and the thickness d of the second photosensitive resin layer 131 may be formed to satisfy Equation 1 below. Do.

{1}

 d≥½ * e

That is, the thickness d of the second photosensitive resin layer is preferably formed to be 50% or more of the line width of the second pattern 133. In other words, it is preferable that the second photosensitive resin layer is formed to have a thickness greater than or equal to twice the line width of the second pattern 133 to be formed.

In addition, the first pattern 123 may be formed on the second and first photosensitive resin layers. In particular, the first pattern 123 may be formed deeper than the depth of the second pattern 133, and as shown, the depth T2 of the second pattern 133 is the first and second photosensitive water. Although one example is formed with the same depth as the thickness of the ground layer, it is also possible to form below the thickness of the first and second photosensitive resin layer.

The thickness c of the first photosensitive resin layer is preferably formed to satisfy the following range in a relationship between the thickness d of the second photosensitive resin layer and the second pattern e.

{Equation 2}

c≥d-½ * e

That is, the thickness of the first photosensitive resin layer 121 is preferably formed to be greater than the difference between the thickness d of the second photosensitive resin layer and the half value of the line width e of the second pattern.

In addition, the line width (e) of the second pattern according to the present invention satisfying the above-described formula may be formed in the range of 1 to 50㎛, more preferably may be formed to 5-25㎛.

In addition, the thickness (d) of the second photosensitive resin layer may be formed in the range of 2.5 ~ 12.5㎛, the thickness of the first photosensitive resin layer may be formed to 1.25㎛ or more.

In addition, the first photoresist layer and the second photosensitive resin layer may have a first pattern, which is a reference pattern, having a line width f, and a second pattern smaller than the first pattern may have a line width in the second photosensitive resin layer. e) can be formed. It is preferable that the line width f of the first pattern and the line width e of the second pattern be formed in the following formula.

{Equation 3}

f≥1.5 × e

3 and 4 is a process chart showing a manufacturing process of the printing plate according to the present invention. The manufacturing process of the printing plate according to the present invention described above with reference to the drawings shown as follows.

Referring to FIG. 3, the printing plate according to the present invention may be manufactured in an order of forming at least one photosensitive resin layer on a substrate and patterning the photosensitive resin layer to form a printing pattern.

Specifically, first, a process of cleanly cleaning the contaminant present on the substrate 110 may be performed through a cleaning process (step S1), and then the first photosensitive resin layer 120 may be formed on the substrate 110. Form (S 2 step). In the forming method, the first photosensitive resin layer may be coated by a method such as spin coating or slit coating and semi-cured by heat treatment.

Next, a process of forming a second photosensitive resin layer 130 on the first photosensitive resin layer 120 and semi-curing through heat treatment may also be performed (step S3).

In step S4, the second photosensitive resin layer 130 is exposed to light using the photomask M to form a second pattern 133. Of course, the upper portion 123a of the first pattern may be formed at the same time.

In step S5, the first photosensitive resin layer 130 is exposed and developed using a photomask to form a first pattern 123 having a reference line width f or more.

Through the above process, it becomes possible to form a printing plate having a structure having a pattern different in depth and width of the above-described structure.

4 illustrates an example of a manufacturing process different from that of FIG. 3.

Referring to the drawing, the cleaning process (step P1) and the process of forming the first photosensitive resin layer 120 is the same as the process of Figure 3, in this embodiment to form a second photosensitive resin layer 130 Instead, the lower portion 123b of the first pattern is formed on the first photosensitive resin layer 120 by using a photomask (step P3).

Thereafter, a second photosensitive resin layer 130 is formed on the patterned upper surface of the first photosensitive resin layer 121, and exposed and developed using a photomask to form a second pattern 133. The first pattern 123 is completed (P 4 to P 5 steps).

In the present exemplary embodiment, the exposure and development processes are performed through the photomask as an example of patterning. Alternatively, a pattern may be formed using a laser writer.

The printing plate having the micropattern according to the present invention in the above-described range is able to maintain the characteristics of the printing plate by varying the depth of the pattern according to the line width of the pattern while forming a fine pattern of several um. In addition, the minimum fine pattern is formed only on the second photosensitive resin layer so as to lower the aspect ratio of the pattern so as not to collapse in the external force, and by introducing the first photosensitive resin layer, the pattern depth is low and the printing roll touches the bottom.

In the foregoing detailed description of the present invention, specific examples have been described. However, various modifications are possible within the scope of the present invention. The technical idea of the present invention should not be limited to the embodiments of the present invention but should be determined by the equivalents of the claims and the claims.

110: substrate
120 and 121: first photosensitive resin layer
123: first pattern
130: 131: second photosensitive resin layer
133: second pattern

Claims (16)

A photosensitive resin layer laminated on the substrate;
And a printing pattern formed by patterning the photosensitive resin layer.
The printing pattern is a printing plate formed of a plurality of patterns having different depths or different widths.
The method according to claim 1,
The photosensitive resin layer,
A printing plate formed of a structure laminated with at least two photosensitive resin layers.
The method according to claim 2,
The print pattern,
A printing plate having at least one second pattern as a minimum pattern and a first pattern as a reference pattern.
The method according to claim 3,
And a depth of the second pattern is less than or equal to the depth of the first pattern.
The method of claim 4,
The second pattern is formed on the second photosensitive resin layer,
The thickness (d) of the second photosensitive resin layer and the line width (e) of the second pattern satisfies the following formula (1).
{Equation 1}
d≥½ * e
The method of claim 4,
The first pattern is formed on the second and the first photosensitive resin layer,
The thickness c of the first photosensitive resin layer satisfies the following equation 2.
{Equation 2}
c≥d-½ * e
(Where, d is the thickness of the second photosensitive resin layer, and e is the line width of the second pattern.)
The method of claim 4,
A printing plate of the first pattern, wherein line width f satisfies Equation 3 below.
{Equation 3}
f≥1.5 * e
(However, e means the line width of the second pattern.)
The method according to any one of claims 5 to 7,
Line width (e) of the second pattern is a printing plate 1㎛ ~ 50㎛.
The method according to any one of claims 5 to 7,
A printing plate having a thickness d of the second photosensitive resin layer is 2.5 μm to 12.5 μm.
The method according to any one of claims 5 to 7,
A printing plate having a thickness c of the first photosensitive resin is 1.25 μm or more.
Forming at least one photosensitive resin layer on the substrate,
The method of manufacturing a printing plate to form a printing pattern by patterning the photosensitive resin layer.
The method of claim 11,
Formation of the print pattern,
a1) laminating at least one photosensitive resin layer on the substrate;
a2) exposing and developing the photosensitive resin layer to form a plurality of printed patterns having different depths or different widths;
Method of manufacturing a printing plate consisting of.
The method of claim 12,
Step a2),
Forming a first photosensitive resin layer and a second photosensitive resin layer on the substrate,
A method of manufacturing a printing plate, the step of processing to include at least one or more of the second pattern and the first pattern of the reference pattern is the minimum pattern through the exposure phenomenon.
The method according to claim 13,
And a depth of the second pattern is less than or equal to the depth of the first pattern.
The method of claim 11,
Formation of the print pattern,
b1) forming a first photosensitive resin layer on the substrate, and forming a lower region of the first pattern through exposure and development;
b2) forming a second photosensitive resin layer on the first photosensitive resin layer;
b3) exposing and developing the second photosensitive resin layer to form a second pattern and the first pattern;
Method of manufacturing a printing plate comprising a.
Following claim 15,
Step b3),
And a depth of the second pattern is less than or equal to the depth of the first pattern.

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