KR20110119080A - Apparatus for inspecting substrate and method of inspecting substrate - Google Patents

Apparatus for inspecting substrate and method of inspecting substrate Download PDF

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Publication number
KR20110119080A
KR20110119080A KR1020100038570A KR20100038570A KR20110119080A KR 20110119080 A KR20110119080 A KR 20110119080A KR 1020100038570 A KR1020100038570 A KR 1020100038570A KR 20100038570 A KR20100038570 A KR 20100038570A KR 20110119080 A KR20110119080 A KR 20110119080A
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KR
South Korea
Prior art keywords
substrate
inspection
camera
angle
image information
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KR1020100038570A
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Korean (ko)
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KR101217174B1 (en
Inventor
최상진
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엘아이지에이디피 주식회사
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Priority to KR1020100038570A priority Critical patent/KR101217174B1/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306—Details
    • G02F1/1309—Repairing; Testing

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Nonlinear Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)

Abstract

PURPOSE: A substrate inspection apparatus and method are provided to efficiently detect different types of defects at the same time using two cameras. CONSTITUTION: A substrate inspection apparatus comprises a lighting part(40), a first camera part(10), a second camera part(20), and a controller. The lighting part irradiates light on a substrate. The first and second camera parts get image information on an inspection point of the substrate. The controller controls the first camera part and the second camera part.

Description

Substrate Inspection Device and Substrate Inspection Method {APPARATUS FOR INSPECTING SUBSTRATE AND METHOD OF INSPECTING SUBSTRATE}

The present invention relates to an apparatus for inspecting a workpiece and a method for inspecting a workpiece, and more particularly, to a substrate inspection apparatus and a substrate inspection method.

In the prior art, the inspector performs visual inspection to detect the presence of stains or foreign substances on the substrate of the liquid crystal display.

That is, it is directly visually determined whether a defect exists on the surface of the substrate through the light reflected by irradiating light onto the substrate.

However, according to this method, the setting conditions of the inspection apparatus may be different for each inspector, and accordingly, the inspection quality may be different.

In addition, there is a problem that the test takes a long time because it depends on the manual work of the inspector.

Because of these problems, the need for automation of inspection tasks that relies on manual labor has emerged.

There is a need for a substrate inspection apparatus and a substrate inspection method capable of faster, more accurate and efficient automatic inspection.

Technical problems of the present invention are not limited to the above-mentioned technical problems, and other technical problems that are not mentioned will be clearly understood by those skilled in the art from the following description.

Substrate inspection method according to the present invention for solving the above problems, (a) irradiating the illumination spot to the inspection point of the substrate; And (b) inspecting the inspection point with a first camera at a first inspection angle to the surface of the substrate, and inspecting the inspection point with a second camera at a second inspection angle different from the first inspection angle with respect to the surface of the substrate. It includes; checking.

Alternatively, the second inspection angle may be smaller than the first inspection angle.

Alternatively, in the step (b), the first camera may inspect the defect inside the substrate at the first inspection angle.

Alternatively, step (b) may inspect the defect on the surface of the substrate with the second camera at the second inspection angle.

According to an aspect of the present invention, there is provided a substrate inspection method comprising: (a) irradiating illumination light to an inspection point of the substrate; (b) acquiring first image information of the inspection point while the optical axis of the first camera forms a first inspection angle with respect to a surface of the substrate and is located on a plane in a uniaxial direction of the pixel; (c) acquiring second image information of the inspection point while the optical axis of the second camera has a second inspection angle smaller than the first inspection angle with respect to the surface of the substrate and is located on a plane in the uniaxial direction of the pixel; ; And (d) inspecting the inspection point using the first and second image information.

Alternatively, the method may further include detecting a short axis direction of the pixel before the step (d).

The substrate inspection apparatus according to the present invention for solving the above problems, the lighting unit for irradiating light to the substrate; A first camera unit and a second camera unit acquiring image information of an inspection point of the substrate; And controlling the first camera unit to acquire image information of the inspection point at a first inspection angle with respect to the surface of the substrate, and at the second inspection angle smaller than the first inspection angle with respect to the surface of the substrate. And a controller configured to control the second camera unit to obtain image information of the camera.

According to the present invention, it is possible to efficiently detect different types of defects simultaneously through two cameras.

The technical effects of the present invention are not limited to the above-mentioned effects, and other technical effects not mentioned will be clearly understood by those skilled in the art from the following description.

1 is a schematic configuration diagram (XZ plane) of a portion of a substrate inspection apparatus according to an embodiment of the present invention.
2 is a schematic configuration diagram (XY plane) of a portion of a substrate inspection apparatus according to an embodiment of the present invention.
3 is a diagram illustrating an optical axis direction of a preferred camera with respect to a substrate including a pixel according to another embodiment.
4 is a flowchart of a substrate inspection method according to the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present embodiment is not limited to the embodiments disclosed below, but can be implemented in various forms, and only this embodiment makes the disclosure of the present invention complete, and the scope of the invention to those skilled in the art. It is provided for complete information. Shapes of the elements in the drawings may be exaggerated parts for a more clear description, elements denoted by the same reference numerals in the drawings means the same element.

1 is a schematic configuration diagram (X-Z plane) of a portion of a substrate inspection apparatus according to an embodiment of the present invention.

2 is a schematic configuration diagram (X-Y plane) of a portion of a substrate inspection apparatus according to an embodiment of the present invention.

As shown in FIG. 1, the substrate inspection apparatus according to the present embodiment includes a first camera 10, a first camera driver 11, a second camera 20, a second camera driver 21, and a substrate stage ( 30, the substrate stage driving unit 31, the lighting unit 40, the lighting driving unit 41, the central processing unit 50, and the defect determining unit 60 may be included.

The first camera 10 and the second camera 20 are means capable of acquiring image information of the substrate S.

As shown in FIG. 1, the optical axis of the first camera 10 may be adjusted by the first camera driver 11 to form a first inspection angle A10 (based on the X-Z plane) with respect to the substrate surface.

In addition, as shown in FIG. 2, the first camera 10 may adjust the first camera 10 such that the optical axis B10 of the first camera faces the short axis direction (XY plane reference) of the pixel P. have. Hereinafter, the first camera 10 and the first camera driver 11 are collectively referred to as a first camera unit.

As shown in FIG. 1, the optical axis of the second camera 20 may be adjusted by the second camera driver 21 to form a second inspection angle A20 with respect to the substrate surface. Hereinafter, the second camera 20 and the second camera driver 21 will be collectively referred to as a second camera unit.

In addition, as shown in FIG. 2, the second camera 20 may be adjusted by the second camera driver 21 so that the optical axis B20 of the second camera faces the short axis direction (XY plane reference) of the pixel P. have.

The substrate stage 30 is a portion on which the substrate S is loaded.

The substrate stage driver 31 may adjust the position or angle of the substrate S. FIG.

The illumination part 40 is a part which irradiates illumination light with respect to the board | substrate S. FIG. The lighting unit may be configured to include a light source for irradiating light, a reflector for transmitting the irradiated light to a substrate, a lens, a polarizing plate, a scattering plate, and the like. The light source may comprise a metal halide lamp or a sodium lamp.

The lighting driver 41 may adjust the optical axis of the lighting unit 40 or adjust the position or angle of the lighting unit 40.

The defect determining unit 60 is a part for determining whether a defect exists from the image information obtained by the first camera 10 and the second camera 20. There may be a variety of methods for determining a defect, and as an example, adjusting the brightness of the acquired image information, removing noise, determining a section in which the degree of change of brightness exceeds the set value as a defect It may be a method including a step.

The central processing unit 50 may control each of the components or process the acquisition information collectively. The central processing unit 50 and the defect determination unit 60 are collectively referred to as a control unit.

In addition, it may further include a display unit (not shown), an image information storage unit, and an operation unit for the inspector to operate the inspection apparatus.

As shown in FIG. 2, in the present embodiment, the substrate S includes a substrate including a plurality of pixels, and specifically, an LCD substrate is described. As seen in the enlarged section, the LCD substrate may include rectangular pixels.

The plurality of pixels P formed on the substrate may be polygonal, and in particular, may be provided in a rectangular shape. In this case, spectroscopic phenomenon due to illumination occurs more preferably in the short axis direction than in the long axis direction of the pixel P.

That is, the illumination light spreads well along each wavelength band in the short axis direction. Illumination light spreading at each wavelength can clearly distinguish the presence of defects as light is reflected or diffusely reflected from at least some wavelength bands at abnormal defect portions of the substrate. As a result, the defect read rate is increased when looking in the direction in which the pixel P is shortened.

As shown in FIG. 2, the first camera driver 11 makes the optical axes B10 'and B20' having an angle different from the short axis direction of the pixel to be the optical axes B10 and B20 having an angle parallel to the short axis direction of the pixel. And the first camera 10 and the second camera 20 by the second camera driver 21.

Adjusting the optical axis of the camera to be parallel to the short axis direction of the pixel and adjusting to achieve a predetermined inspection angle with respect to the substrate surface may be performed irrespective of the order or afterwards.

3 is a diagram illustrating an optical axis direction of a preferred camera with respect to a substrate including a pixel according to another embodiment.

As shown in FIG. 3, even in the case of non-rectangular pixels, the short axis direction corresponds to the direction shown in FIG. 3, and it is preferable to adjust the optical axes B10 and B20 of the first camera and the second camera to the short axis direction.

The substrate inspection apparatus according to the present embodiment may be installed inside the clean room, and the substrate inspection information may be remotely transmitted to the inspector outside the clean room.

Hereinafter, a substrate inspection method according to the present invention will be described.

4 is a flowchart of a substrate inspection method according to the present invention.

As shown in FIG. 4, first, an operation (S10) of irradiating illumination light to an inspection point of a substrate may be performed.

Next, an operation (S20) of arranging the optical axes of the first camera and the second camera on a plane in the uniaxial direction of the pixel may be performed.

Next, the step S30 of automatically adjusting the first camera to the first inspection angle and automatically adjusting the second camera to the second inspection angle may be performed.

The steps S20 and S30 may be carried out by changing the front and rear, or may be carried out simultaneously.

The detecting of the short axis direction of the pixel of the substrate may be performed before the step S20. Alternatively, the short axis direction of the pixel may be set in advance. There may be various methods of detecting the short axis direction of the pixel, and as an example, the angle having the highest degree of spectral may be determined as the short axis direction of the pixel while irradiating illumination light at various angles.

The first inspection angle and the second inspection angle may use a set value, and the first inspection angle and the second inspection angle may be set to different values. The first and second inspection angles may be angles formed by the optical axis of the camera and the substrate plane.

If the first inspection angle is greater than the second inspection angle, the first camera can be used to inspect the defects inside the substrate layer, and the second camera can be used to inspect the defects on the substrate layer surface.

The larger the angle of the optical axis of the camera with respect to the substrate surface, the more easily spots that may occur inside the substrate layer are examined.

In addition, the smaller the angle formed by the optical axis of the camera with respect to the substrate surface, the more easily the unevenness of the surface of the substrate layer is inspected.

Next, an operation (S40) of inspecting a defect inside the substrate with the first camera at the first inspection angle may be performed.

Next, an operation (S50) of inspecting a defect on the surface of the substrate with the second camera at the second inspection angle may be performed.

Steps S40 and S50 are preferably performed simultaneously using two cameras.

Steps S40 and S50 may inspect the captured image information in real time, or may later check the stored image information.

Inspection of the substrate may be automatically performed in the same manner as the operation of the defect determination unit 60 described above.

An embodiment of the present invention described above and illustrated in the drawings should not be construed as limiting the technical idea of the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and those skilled in the art will be able to modify the technical idea of the present invention in various forms. Therefore, such improvements and modifications will fall within the protection scope of the present invention, as will be apparent to those skilled in the art.

Claims (7)

(a) irradiating the illumination light to the inspection point of the substrate; And
(b) inspecting the inspection point with a first camera at a first inspection angle with respect to the surface of the substrate, and inspecting the inspection point with a second camera at a second inspection angle different from the first inspection angle with respect to the surface of the substrate. Substrate inspection method comprising;
The method of claim 1,
And the second inspection angle is smaller than the first inspection angle.
The method of claim 2,
In the step (b), the defect inspection inside the substrate is inspected by the first camera at the first inspection angle.
The method of claim 2,
The step (b) is a substrate inspection method, characterized in that for inspecting the defect on the surface of the substrate with the second camera at the second inspection angle.
In the substrate inspection method for inspecting a substrate including a plurality of pixels,
(a) irradiating illumination light to an inspection point of the substrate;
(b) acquiring first image information of the inspection point while the optical axis of the first camera forms a first inspection angle with respect to a surface of the substrate and is located on a plane in a uniaxial direction of the pixel;
(c) acquiring second image information of the inspection point while the optical axis of the second camera has a second inspection angle smaller than the first inspection angle with respect to the surface of the substrate and is located on a plane in the uniaxial direction of the pixel; ; And
(d) inspecting the inspection point by using the first and second image information.
The method of claim 5,
And detecting a short axis direction of the pixel before the step (d).
An illumination unit for irradiating light onto the substrate;
A first camera unit and a second camera unit acquiring image information of an inspection point of the substrate; And
Control the first camera unit to acquire image information of the inspection point at a first inspection angle with respect to the surface of the substrate, and at the second inspection angle smaller than the first inspection angle with respect to the surface of the substrate And a control unit controlling the second camera unit to acquire image information.
KR1020100038570A 2010-04-26 2010-04-26 Apparatus for inspecting substrate and method of inspecting substrate KR101217174B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170137222A (en) * 2016-03-30 2017-12-12 닛신 세이코 가부시키가이샤 Apparatus for inspecting surface defects of steel sheet and method for inspecting surface defects

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101862312B1 (en) * 2016-01-13 2018-05-29 에이피시스템 주식회사 substrate analysis device and the treatment apparatus having it, substrate analysis method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996028721A1 (en) 1995-03-10 1996-09-19 Hitachi, Ltd. Inspection method, inspection apparatus and method of production of semiconductor device using them
KR100803043B1 (en) 2006-10-10 2008-02-18 주식회사 매크론 Apparatus and method for inspecting defects of display device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170137222A (en) * 2016-03-30 2017-12-12 닛신 세이코 가부시키가이샤 Apparatus for inspecting surface defects of steel sheet and method for inspecting surface defects
CN107533013A (en) * 2016-03-30 2018-01-02 日新制钢株式会社 The surface defect inspection apparatus and surface defect inspection method of steel plate
CN107533013B (en) * 2016-03-30 2018-11-27 日新制钢株式会社 The surface defect inspection apparatus and surface defect inspection method of steel plate
US10267747B2 (en) 2016-03-30 2019-04-23 Nisshin Steel Co., Ltd. Surface defect inspecting device and method for steel sheets

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