KR20110100403A - Vision system of test heander in socket and the method thereof - Google Patents

Vision system of test heander in socket and the method thereof Download PDF

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Publication number
KR20110100403A
KR20110100403A KR1020100019357A KR20100019357A KR20110100403A KR 20110100403 A KR20110100403 A KR 20110100403A KR 1020100019357 A KR1020100019357 A KR 1020100019357A KR 20100019357 A KR20100019357 A KR 20100019357A KR 20110100403 A KR20110100403 A KR 20110100403A
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South Korea
Prior art keywords
test
socket
semiconductor
vision
shape
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KR1020100019357A
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Korean (ko)
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KR101076741B1 (en
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정유환
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(주)에스엠솔루션즈
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Quality & Reliability (AREA)
  • Theoretical Computer Science (AREA)
  • Signal Processing (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)

Abstract

The present invention relates to a vision inspection system used in a semiconductor inspection process, and more particularly, to a vision system that detects residual semiconductors and foreign substances inside a socket and simultaneously cools them during electrical performance inspection using a semiconductor test handler. .
The present invention includes a test target semiconductor including a test target semiconductor and moving up / down, left / right or forward / backward to seat a socket, a vision camera positioned inside a test box and photographing the shape of the socket, and the vision. Control module for controlling the shooting time of the camera and the determination module for comparing and determining the socket-shaped image taken by the vision camera, despite the lack of vacuum suction force or inaccuracy of the robot arm, variations in the size of the semiconductor Accurate inspection has the effect of improving reliability.

Description

VISION SYSTEM OF TEST HEANDER IN SOCKET AND THE METHOD THEREOF}

The present invention relates to a vision inspection system used in a semiconductor inspection process, and more particularly, to a vision system that detects residual semiconductors and foreign substances inside a socket and simultaneously cools them during electrical performance inspection using a semiconductor test handler. .

In general, after a semiconductor is manufactured through a series of processes, a test handler is used to test the electrical performance of the semiconductor to test the electrical performance of the IC device.

Each semiconductor element (hereinafter referred to as 'semiconductor') is contained in a rectangular container called a tray, and is transferred to the inside of the handler by a tray transfer robot. During high temperature testing, the semiconductor of the tray is preheated in a preheating plate called a hot plate. The transferred semiconductor is transferred to the input shuttle, which moves the semiconductor to the test box. After that, the test robot's arm transfers the input shuttle's semiconductor into the socket of the dock plate, and the test arm operates up and down to test the semiconductor.

The test arm moves the test arm to the output shuttle, and the output shuttle transfers the material to the outside of the test zone, and the loaded semiconductor is sorted and loaded into the robot arm tray according to the test result.

However, during this process, the tested semiconductor should be transferred from the socket to the output shuttle, but the semiconductor is not discharged from the socket due to various reasons such as lack of vacuum suction force, inaccuracy of the robot arm, or variation in the size of the semiconductor. 'S semiconductor is moved to the test socket, which causes the test to proceed with overlapping semiconductors.

In this case, if the semiconductor inspection proceeds while overlapping the double, only the lower semiconductor is tested, so the upper semiconductor has been tested without the inspection at the actual socket and has a big problem.

Therefore, there is an urgent need to develop a semiconductor device vision inspection system of a new test handler that can accurately detect a double device and a foreign object of a socket in real time.

The present invention captures the inspection target socket according to the layout of the socket of the test zone before starting the test, the image information is taken with the camera at the end of the test and compared with the photos before the test to check whether there is an abnormality and the correct double device and It is an object of the present invention to provide a semiconductor device vision inspection system of a test handler that can detect foreign substances.

An object of the present invention is to provide a semiconductor device vision inspection system of a test handler that can be easily applied to a semiconductor requiring a high temperature test, including a cooling unit that extends the airline of compressed air to the vision camera and circulates the cooling.

The present invention includes a test target semiconductor including a test target semiconductor and moving up / down, left / right or forward / backward to seat a socket, a vision camera positioned inside a test box and photographing the shape of the socket, and the vision. The control module for controlling the photographing time of the camera and the determination module for comparing and determining the socket-shaped image taken by the vision camera.

The vision camera further includes a cooling unit extending in the air line of the compressed air to circulate and cool.

The control module is electrically connected to a proximity sensor that checks the test start and return of the test arm to photograph the shape of the socket.

The determination module compares the socket shape image before the test with each socket shape image after the test to determine whether the socket module is normal.

The present invention includes the steps of seating the test target semiconductor in the socket by moving up / down, left / right or forward / backward, controlling the photographing point of the vision camera, photographing the shape of the socket, and socket-shaped image. Comparing and judging.

The above-described step further includes the step of circulating cooling the vision camera by using the air extended to the air line of the compressed air.

The photographing of the shape of the socket by controlling the photographing timing of the vision camera is a step of controlling the photographing of the shape of the socket by checking the start and return of the test arm.

The comparing and determining of the socket shape image is a step of comparing the socket shape image before the test with each socket shape image after the test to determine whether the socket shape image is normal.

The semiconductor device vision inspection system of the test handler of the present invention has an effect of improving reliability due to accurate inspection despite the lack of vacuum adsorption force or inaccuracy of the robot arm and variation in the size of the semiconductor.

The present invention should be discharged after the end of the test and re-stored in the tray according to the test results, but the semiconductor remains in the socket without being re-received for various reasons (hereinafter referred to as 'double device'), and foreign matters that may be unknown during the test It is effective at removing elements that, when present in a socket, may affect the test results.

Vision camera of the present invention has an effect that can be easily applied to a semiconductor requiring a high temperature test, including a cooling unit extending to the air line of the compressed air to circulate cooling.

1 shows a semiconductor device vision inspection system of a test handler in accordance with the present invention being subjected to semiconductor testing.
2 is a front view of a semiconductor device vision inspection system of the test handler according to the present invention.
3 is a layout of a semiconductor device vision inspection system of the test handler according to the present invention.
Figure 4 is a perspective view of the hot plate mounting for high temperature test of the semiconductor device vision inspection system of the test handler according to the present invention.
Figure 5 is a perspective view of the Shuttle Jig mounting of the semiconductor device vision inspection system of the test handler according to the present invention.
Figure 6 is a cross-sectional view of the pogo pin using socket of the semiconductor device vision inspection system of the test handler according to the present invention.
7 is a cross-sectional view of a situation under normal semiconductor testing in a semiconductor device vision inspection system of a test handler in accordance with the present invention.
8 is a cross-sectional view of a situation in which a double device occurs in the semiconductor device vision inspection system of the test handler according to the present invention.
9 is a cross-sectional view of a situation under test in a state where foreign substances are inserted in a semiconductor device vision inspection system of a test handler according to the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail for the practice of the present invention.

As shown in FIGS. 1A and 1B, the semiconductor device vision inspection system 100 of the test handler according to the present invention includes a test arm, a vision camera 17, and the like. It consists of a test arm (15, 16) for seating on the socket by moving the lower, left or right or forward / backward, and a vision camera (17) located inside the test box (6), and photographing the shape of the socket. As a software module for controlling, the control module 110 controls a photographing time point of the vision camera 17 and a determination module 120 for comparing and determining the socket-shaped image photographed by the vision camera 17. It is desirable to be.

At this time, the shape of the socket and the type and size of the device is made in various ways, the vision camera 17 can take all kinds of semiconductor images, such as BGA, FBGA, TQFN.

As shown in FIG. 1A, the proximity sensor 20 is installed at a predetermined position before the test is performed, and the shape of the socket 22 is photographed before the test.

In this case, it is important to determine the position of the photographing at the time when the test is completed and the test arm operates, that is, the test arm performs mechanical movement so that the proximity sensor is installed at the correct position when the test arm is raised and moved.

And the captured image is stored in the storage device under the control of the control module 110, the control of the control module 110 according to the signal of the proximity sensor 20 when the test arm 15 starts the test and returns to Shooting is performed through the vision camera 17 as a signal.

Therefore, after the test of the test arm 15, the presence of a residual device and foreign matters can be compared with the pre-test image. That is, it is possible to set a plurality of inspection positions in the visual photographing area of the vision camera 17, and it is determined whether there is an abnormality by comparing the image photographed at the portion set as the inspection position with the image changed during the test.

Similarly, the test arm 16 which is laterally moved is moved again and tested, and photographing is performed at the time of returning. Thus, real-time socket inspection can be performed during the test in comparison with the pre-test image.

That is, the control module 110 is electrically connected to the proximity sensor 20 for controlling the photographing of the shape of the socket 22 by checking the start and the return of the test arms 15 and 16. The module 120 compares the socket shape image before the test with each socket shape image after the test to determine whether the module is normal.

In other words, the position and size of the target to be compared can be freely selected according to the layout of the socket of the dock plate, which is a test zone, and the area selected by the mouse drag of the display device can be programmed as the comparison target area.

When the test handler is operated normally with the system 100 programmed as described above, if an abnormality is detected, an alarm is sounded as an abnormality and the operation of the test handler is stopped.

On the other hand, the test is a room temperature and a high temperature test, there is also a semiconductor that requires a high temperature test about 130 ° C high temperature requires the cooling of the vision camera 17, the vision camera 17 is extended to the air line of compressed air It is preferable to further include a cooling unit (not shown) for circulation cooling.

The cooling of the vision camera 17 is controlled by the control module 110 by extending an air line of compressed air for using a test handler to connect an air hose to the inlet 18 and the outlet 19 of the camera 17. Cooling according to the semiconductor test temperature conditions through, the cooling temperature of the vision camera 17 is attached to the temperature sensor 21 inside the camera 17 so that the high temperature test can always be kept below 40˚C .

As shown in Figure 2, the shape and type of the semiconductor device vision inspection system 100 of the test handler according to an embodiment of the present invention is various, but the same as the shape of the conventional Pick & Place Type.

In addition, there is a unit layout test box 6 of FIG. 3, and the tester 15 and 16 move to each other, and the handler equipment for performing a test by operating up and down is typical.

In addition, since the present invention is to analyze the image of the socket 22 in the test box 6 and to compare and analyze the image after the test, the camera 17 on the upper portion of the socket 22 even if the layout as well as the unit layout as shown in FIG. It can be applied to almost all handler equipment if it can be attached.

That is, it can be applied to a hot plate mounted for high temperature test as shown in FIG. 4 or a semiconductor for a room temperature test transferred directly from a tray to a shuttle without going through a hot plate or a type as shown in FIG. 5 equipped with a semiconductor transfer shuttle. .

Hereinafter, a semiconductor device vision inspection method of a test handler according to the present invention will be described in detail with reference to the accompanying drawings.

As shown in FIG. 6, first, a test target semiconductor inside a semiconductor device vision inspection system of a test handler according to the present invention is placed in a socket by moving up / down, left / right or forward / backward.

Then, the control module controls the photographing time of the vision camera, photographs the shape of the socket and stores it in the storage device.

Subsequently, the determination module compares and determines the socket shape image stored in the storage device.

In addition to the above-described process, it is preferable to further include the step of circulating cooling the vision camera using the air extending in the air line of the compressed air.

The photographing of the shape of the socket by controlling the photographing time point of the vision camera is a step of controlling the photographing of the shape of the socket by checking the start and return of the test arm and comparing the shape of the socket. The determining step is preferably a step of determining whether the socket shape image before the test and each socket shape image after the test is normal.

Specifically, the test handler according to the present invention shows a phenomenon in which a semiconductor is double overlapped due to a semiconductor pinching phenomenon inside a socket during the test as shown in FIG. 7C, in contrast to the case of a normal semiconductor test as shown in FIGS. 7A and 7B. By using the semiconductor device vision inspection system 100 of the discovery can improve the reliability of the inspection.

In addition, as shown in FIG. 7D, when the inside of the socket is not kept clean differently from the start of the test due to various causes such as foreign matter, dust or semiconductor breakage during the test, the semiconductor device vision of the test handler The inspection system 100 compares and determines the shape of the socket photographed at the start of the test stored in the storage device with the shape under test.

Here, the reference value of the comparison judgment is to set the average value through a variety of tests, when the non-identity of the above average value occurs, it is possible to immediately detect the abnormality in the equipment to maximize the inspection reliability.

Although the present invention has been described above with reference to the accompanying drawings and the above embodiments, the present invention is not limited to the embodiments related to the semiconductor device vision inspection system of the attached drawings and the disclosed test handlers, and is also useful for various semiconductor device inspection systems. Can be applied.

It will also be understood by those skilled in the art that modifications can be made in accordance with the spirit of the invention, and such modifications also fall within the scope of the invention.

1: Tray Loader 2: Loading Robot
3: Empty Tray Arm 4: Hot Plates 1 and 2
5: Shuttle 1 and 2 6: Test Box
7: Unlonding Robot 8: Tray Unloaders 1,2,3
9: Test Socket 10: Fixed Trays 1,2 and 3
11: Main Frame, Cover and Door 12: IC Lead Scaner
13: Empty Tray Unloader 14: Empty Tray Loader
15: Tester Arm 1 16: Tester Arm 2
17: Camera 18: Cooling Air In
19: Cooling Air Out
20: Inductive Proximity Sensor
21: Temp Sensor 22: Socket

Claims (8)

In the semiconductor device vision inspection system of the test handler,
A test arm including a semiconductor to be tested and mounted in a socket by moving up / down, left / right or forward / backward;
A vision camera located inside a test box and photographing a shape of the socket;
A control module for controlling a photographing time of the vision camera;
A determination module for comparing and determining the socket shape image photographed by the vision camera;
Semiconductor device vision inspection system of the test handler, characterized in that consisting of.
The method of claim 1,
In the vision camera,
The semiconductor device vision inspection system of the test handler, characterized in that it further comprises a cooling unit extending to the air line of the compressed air for circulation cooling.
The method of claim 1,
The control module,
The semiconductor device vision inspection system of the test handler, characterized in that it is electrically connected to a proximity sensor for controlling the test start and return of the test arm to photograph the shape of the socket.
The method of claim 1,
The determination module,
A semiconductor device vision inspection system of a test handler, characterized by comparing the socket shape image before the test with each socket shape image after the test.
Moving the semiconductor to be tested up / down, left / right or forward / backward to seat the socket;
Controlling the photographing time of the vision camera to photograph the shape of the socket;
Comparing and determining the socket shape image;
Semiconductor device vision inspection method of the test handler, characterized in that consisting of.
6. The method of claim 5,
And circulating and cooling the vision camera by using the air extended in the airline of the compressed air.
6. The method of claim 5,
Taking the shape of the socket by controlling the photographing time point of the vision camera,
And checking the test start and return of the test arm so that the shape of the socket can be photographed.
6. The method of claim 5,
Comparing the socket shape image is determined,
And comparing each socket shape image after the test with each socket shape image after the test to determine whether the socket shape image is normal.
KR1020100019357A 2010-03-04 2010-03-04 Vision system of test heander in socket and the method thereof KR101076741B1 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140125465A (en) * 2013-04-17 2014-10-29 (주)테크윙 Handler for testing semiconductor
KR20150103577A (en) * 2014-03-03 2015-09-11 (주)제이티 Device handler and method for handling device
KR20150139258A (en) * 2014-06-03 2015-12-11 세메스 주식회사 Apparatus for testing semiconductor chip
US9958500B2 (en) 2015-07-08 2018-05-01 Samsung Electronics Co., Ltd. Vacuum socket and semiconductor testing system including the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160001275A (en) 2014-06-27 2016-01-06 주식회사 엘지화학 Apparatus for manufacturing glass and method for manufacturing glass using the same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100833716B1 (en) * 2007-03-30 2008-05-29 (주) 인텍플러스 System for vision inspection of semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140125465A (en) * 2013-04-17 2014-10-29 (주)테크윙 Handler for testing semiconductor
KR20150103577A (en) * 2014-03-03 2015-09-11 (주)제이티 Device handler and method for handling device
KR20150139258A (en) * 2014-06-03 2015-12-11 세메스 주식회사 Apparatus for testing semiconductor chip
US9958500B2 (en) 2015-07-08 2018-05-01 Samsung Electronics Co., Ltd. Vacuum socket and semiconductor testing system including the same

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