KR20110096613A - The lead frame reformation equipment for a semiconductor - Google Patents

The lead frame reformation equipment for a semiconductor Download PDF

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Publication number
KR20110096613A
KR20110096613A KR1020100015934A KR20100015934A KR20110096613A KR 20110096613 A KR20110096613 A KR 20110096613A KR 1020100015934 A KR1020100015934 A KR 1020100015934A KR 20100015934 A KR20100015934 A KR 20100015934A KR 20110096613 A KR20110096613 A KR 20110096613A
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KR
South Korea
Prior art keywords
lead
block
semiconductor
leads
fixing block
Prior art date
Application number
KR1020100015934A
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Korean (ko)
Other versions
KR101198299B1 (en
Inventor
김종은
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김종은
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Publication date
Application filed by 김종은 filed Critical 김종은
Priority to KR20100015934A priority Critical patent/KR101198299B1/en
Publication of KR20110096613A publication Critical patent/KR20110096613A/en
Application granted granted Critical
Publication of KR101198299B1 publication Critical patent/KR101198299B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Lead Frames For Integrated Circuits (AREA)

Abstract

The present invention relates to a semiconductor chip lead aligning device, which is developed to reduce the possibility of defects during assembly or use of a semiconductor by accurately aligning a gap between an adjacent lead and a width of a lead row positioned on the other side; A lead row corresponding to a lead of a semiconductor comprising a semiconductor body having a shape, a plurality of leads formed at regular intervals on both corresponding side surfaces of the semiconductor body, and pin grooves formed perpendicularly to another side where the leads of the semiconductor body are not formed; A semiconductor chip lead straightening device for aligning a width between a lead and a gap between adjacent leads;
The upper surface is formed in the form of a long bar, the bottom surface of the semiconductor is in close contact, the lead on one side is in close contact with the side wall and the other side is seated slightly spaced apart from the opposite side wall, the center has a long horizontal transfer groove formed vertically through Working rails;
A mounting block in close contact with a lower end of the work rail, and having two fixing pins formed on the upper surface thereof to further protrude upward through the horizontal transfer grooves and to couple with the pin grooves of the semiconductor;
A lead fixing block in which a tapered hole is narrowed from an upper portion to a lower portion so that a plurality of leads extending downwardly spaced apart from the side wall adjacent to one side of the work rail are inserted at regular intervals;
First alignment means for horizontally moving the lead fixing block in a horizontal direction including a motor and a screw;
And a second alignment means configured to move the lead fixing block horizontally in the front-rear direction by the at least one cylinder.

Description

Semiconductor chip lead straightening device {The lead frame reformation equipment for a semiconductor}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip lead calibration apparatus, and more particularly, to a semiconductor chip lead calibration apparatus developed to accurately align a gap between an adjacent lead and a width of a lead row positioned on the other side.

In general, when a semiconductor or a semiconductor chip is recalled, a plurality of leads for transmitting an electrical signal to the semiconductors on both sides of a relatively thin rectangular plate shape are recalled in a downwardly curved shape.

Such semiconductors are becoming smaller and larger in size with the development of technology. As a result, the lead is thinner and the distance between the leads becomes smaller, which requires more careful attention when mounting it on a substrate.

However, in the process of manufacturing a semiconductor chip, the coefficient of thermal expansion is different in the process of bending down the parallel leads or in the epoxy molding process, so that the widths of the rows of leads and the gaps between the adjacent leads are distorted. This causes a defect in the process of mounting the semiconductor on the substrate.

In addition, even with the same semiconductor chip, the width of the lead row may vary depending on the substrate to be applied. Therefore, it is necessary to develop a means for controlling the width of the lead row during the manufacturing process.

SUMMARY OF THE INVENTION The present invention was developed to solve the above problems, and an object thereof is to develop a semiconductor chip lead correction apparatus capable of accurately aligning a width between a lead row in a semiconductor and an interval between adjacent leads at a desired distance. have.

In order to achieve the above object, the present invention provides a semiconductor device in the form of a square plate, a plurality of leads formed at regular intervals on both sides of the semiconductor body, and perpendicular to another side of the semiconductor body in which leads are not formed. A semiconductor chip lead correcting apparatus for arranging a lead of a semiconductor constituted by formed pin grooves with a width between a corresponding lead row and an interval between adjacent leads;

The upper surface is formed in the form of a long bar, the bottom surface of the semiconductor is in close contact with one side of the lead is in close contact with the side wall and the other side is seated with a small distance from the opposite side wall, the center has a long horizontal transfer groove formed vertically through Working rails;

A mounting block in close contact with a lower end of the work rail, and having two fixing pins formed on the upper surface thereof to further protrude upward through the horizontal transfer grooves and to couple with the pin grooves of the semiconductor;

A lead fixing block in which a tapered hole is narrowed from an upper portion to a lower portion so that a plurality of leads extending downwardly spaced apart from the side wall adjacent to one side of the work rail are inserted at regular intervals;

First alignment means for horizontally moving the lead fixing block in a horizontal direction including a motor and a screw;

It is composed of the at least one cylinder is characterized in that it comprises a second alignment means for horizontally moving the lead fixing block in the front and rear direction.

In addition, the first alignment means is formed with a motor, a screw mounted in parallel with the axis of the motor, a belt for interlocking the motor and the screw, a screw hole corresponding to the screw is formed and the lower end of the device Combining with the transfer guide formed in parallel with the screw on the upper surface of the supporting base block is configured to include a moving part for horizontal reciprocating movement according to the rotation of the screw is characterized in that the moving part is configured to interlock with the lead fixing block. .

In addition, the upper surface of the base block is additionally formed in the vertical direction to support the fixed block is formed, and is configured to interlock by the vertical block that is connected to the lead fixed block and the moving portion, one or more bearings mounted on the sliding surface It is characterized by.

In addition, the two guide shafts are fixed and mounted extending in the vertical block direction, the lead fixing block is formed with a guide hole corresponding to the guide shaft, both ends are bent and extended in the vertical block direction fixed mounting A guide block is further formed;

The second alignment means may include: a first cylinder fixedly mounted to the vertical block, the first cylinder rod passing through a first through hole formed through the support block, and through a long hole formed horizontally in the vertical block;

And a second cylinder fixedly mounted to the guide block and mounted to interlock with the lead fixing block by passing through a through hole formed in the guide block.

As described above, the present invention has the effect of precisely aligning the width between the rows of leads and the distance between adjacent leads in the semiconductor, which may cause slight distortion in the manufacturing process, thereby reducing defects that may occur during the assembly process and use of the semiconductor chip. .

Figure 1 is a perspective view of an embodiment of the present invention.
2 is an exploded perspective view according to an embodiment of the present invention.
3 is a plan view according to an embodiment of the present invention;
4 is a side view illustrating mounting of a semiconductor according to an embodiment of the present disclosure.
5A to 5C are conceptual views illustrating a gap adjustment between leads according to an embodiment of the present invention.
6 is a perspective view of a main part according to an embodiment of the present invention;
7 is a cross-sectional view taken along the line CC according to an embodiment of the present invention
8 is a cross-sectional view taken along line BB according to an embodiment of the present invention

Accordingly, the configuration of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily understand and reproduce.

1 is a perspective view according to an embodiment of the present invention, Figure 2 is an exploded perspective view according to an embodiment of the present invention, Figure 3 is a plan view according to an embodiment of the present invention, Figure 4 is one of the present invention 5A to 5C are conceptual views illustrating a gap adjustment between leads according to an embodiment of the present invention, and FIG. 6 is a perspective view of a main portion according to an embodiment of the present invention. 7 is a cross-sectional view taken along line CC according to an embodiment of the present invention, Figure 8 is a cross-sectional view taken along line BB according to an embodiment of the present invention.

The basic configuration of the present invention includes a semiconductor body 11 having a rectangular plate shape, a plurality of leads 12 formed at regular intervals on both sides of the semiconductor body 11, and the leads 12 of the semiconductor body 11. Semiconductor chip lead calibration in which the leads 12 of the semiconductor 1 consisting of the pin grooves 13 formed perpendicular to the other side where the cavities are not formed are aligned with the widths of the corresponding rows of leads and the spacing between adjacent leads 12. In an apparatus;

The upper surface is formed in the form of a long bar, the bottom surface of the semiconductor 1 is in close contact, the lead 12 on one side is in close contact with the side wall and the other side of the lead 12 is seated with a small distance from the opposite side wall, vertical in the center A work rail 2 having a long horizontal feed groove 21 formed therethrough;

It is in close contact with the lower end of the work rail (2), the upper surface of the two fixing pins 31 are further protruded upward through the horizontal transfer groove 21 to engage with the pin groove 13 of the semiconductor (1) A mounting block 3 formed;

The tapered holes 41 which are narrowed from the upper side to the lower side are inserted in a predetermined arrangement so that a plurality of leads 12 extending downwardly spaced apart from the side wall adjacent to one side of the work rail 2 are inserted at regular intervals. Lead fixing block 4 is formed;

First alignment means (5) including a motor (51) and a screw (52) for horizontally moving the lead fixing block (4) in left and right directions;

It is characterized in that it consists of at least one cylinder (61, 62) is composed of a second alignment means (6) for horizontally moving the lead fixing block (4) in the front and rear direction.

That is, when the semiconductor 1 is fixed by the work rail 2, the fixing pin 31 of the mounting block 3, and the taper hole 41 of the lead fixing block 4, the lead fixing block 4 is formed of the first rail. 1 When the lead fixing block 4 is slightly reciprocated in the left and right direction by the alignment means 4, the distance between the lead fixing block 4 and the adjacent lead 12 is adjusted at the correct interval.

In addition, the mounting block 3 is fixed so as to adjust the distance from the lead 12 on the other side while performing a slight reciprocating movement in the front and rear direction of the second alignment means 6 in a state where the semiconductor 1 is fixed.

In this configuration, even if the position of the lead 12 is bent to a desired position by only one operation, the lead 12 is not aligned at the correct position by a slight restoring force, so that the lead 12 is simply bent or This configuration is chosen because it is not precisely aligned by inserting it into the same means as the tapered hole 41.

In addition, when the tapered hole 41 of the lead fixing block 4 has a form in which at least one or more pairs are arranged in parallel, as shown in FIG. It can be selected to insert into the product, which can be useful for products with different widths or for different lead spacing in the same product.

In a more specific embodiment of the present invention, the first alignment means 5 includes a motor 51, a screw 52 mounted in parallel with an axis of the motor 51, the motor 51 and the screw 52. Belt 53 and the screw hole for coupling to the screw 52 is formed and the lower end is formed in parallel with the screw 52 on the upper surface of the base block 54 for supporting the device Combination with the transfer guide 55 is configured to include a moving part 56 for horizontal reciprocating motion in accordance with the rotation of the screw 52 is configured to interlock with the lead fixing block 4 the moving part 56 Examples are presented.

In addition, the upper surface of the base block 54 is further formed with a support block 57 which is installed in the vertical direction and fixed, the lead fixing block 4 and the moving part 56 is connected to the sliding surface It is further shown that the at least one bearing 58 is configured to interlock by a vertical block 59 to which it is mounted.

At this time, the mounting block 3 is maintained in a fixed state in combination with the support block (57).

In addition, the two guide shafts 71 extend fixedly mounted in the direction of the vertical block 59 for effective interworking between the first alignment means 5 and the second alignment means 6, and the lead fixing block ( 4) a guide hole 42 corresponding to the guide shaft 71 is formed, and both ends are additionally formed with a guide block 7 which is bent and extended in a direction of the vertical block 59;

The second alignment means 6 is fixedly mounted to the vertical block 59 and a first through hole 571 and the vertical block 59 through which the first cylinder rod 63 penetrates the support block 57. A first cylinder 61 penetrating through the long hole 591 formed in the horizontal direction;

A second cylinder fixedly mounted to the guide block 7 and mounted to interlock with the lead fixing block 4 by passing through a through hole 72 formed in the guide block 7; An embodiment consisting of 62) is further presented.

Accordingly, the operation of the apparatus is performed by using a manual or mechanical means to first insert the semiconductor 1 into the tapered hole 41 of the lead fixing block 4 so that the lead 12 can be neatly inserted into the work rail 2. Settle on

Then, when the motor 51 of the first alignment means 5 is driven, the screw 52 rotates and the transfer part 56 moves according to the rotation of the screw 52.

The movement of the transfer part 56 allows the lead 12 to be aligned at a desired position and interval by moving the lead fixing block 4 connected to the vertical block 59.

In this case, the vertical block 59 has a long hole 591 in order to move the lead fixing block 4 irrespective of the driving of the second alignment means 6 presented in a further embodiment. The movement of the first cylinder rod 63 of) can be made possible within the length range of the long hole 591.

In addition, the lead fixing block 4 is preferably to be easily replaced with a different standard according to the situation.

The figure also shows that the first and second cylinder rods 63, 64 in the second alignment means 6 are combined with separate axes, but these axes are generally extended by the cylinder rods 63, 64. The shape of the end of the cylinder rod, which is separately produced in the shape of a simple cylinder, is combined with an extension shaft so as to be suitable for the apparatus of the present application.

As shown in FIG. 8, when the second cylinder 62 is operated to the right, the lead 12 is bent to the right by the lead fixing block 4 connected to the second cylinder rod 64, and the first cylinder 61 is connected to the second cylinder rod 64. Is moved to the left side and the second cylinder 62 is moved to the left side, the lid 12 is bent to the left side and if the second cylinder 62 is moved to the right side, the lid 12 is bent to the right side and the first cylinder ( When the second cylinder 62 is moved to the left after the 61 is moved to the right, the lid 12 can be easily adjusted in width with the left lid.

1: semiconductor
11: semiconductor body 12: lead
13: pin groove
2: work rail
21: horizontal feed groove
3: mounting block
31: fixed pin
4: Lead fixing block
41: taper hole 42: guide hole
5: first alignment means
51: motor 52: screw
53: belt 54: base block
55: transfer guide 56: moving part
57: support block 571: first through hole
58: bearing 59: vertical block
591: hall
6: second alignment means
61: first cylinder 62: second cylinder
63: first cylinder rod 64: second cylinder rod
7: guide block
71: guide shaft 72: through hole

Claims (4)

A semiconductor body 11 having a rectangular plate shape, a plurality of leads 12 formed at regular intervals on both corresponding side surfaces of the semiconductor body 11, and another in which the leads 12 of the semiconductor body 11 are not formed. 1. A semiconductor chip lead aligning device for arranging a lead 12 of a semiconductor 1 composed of pin grooves 13 formed perpendicularly to a side thereof, and a width between a corresponding row of leads and an interval between adjacent leads 12;
The upper surface is formed in the form of a long bar, the bottom surface of the semiconductor 1 is in close contact, the lead 12 on one side is in close contact with the side wall and the other side of the lead 12 is seated with a small distance from the opposite side wall, vertical in the center A work rail 2 having a long horizontal feed groove 21 formed therethrough;
It is in close contact with the lower end of the work rail (2), the upper surface of the two fixing pins 31 are further protruded upward through the horizontal transfer groove 21 to engage with the pin groove 13 of the semiconductor (1) A mounting block 3 formed;
The tapered holes 41 which are narrowed from the upper side to the lower side are inserted in a predetermined arrangement so that a plurality of leads 12 extending downwardly spaced apart from the side wall adjacent to one side of the work rail 2 are inserted at regular intervals. Lead fixing block 4 is formed;
First alignment means (5) including a motor (51) and a screw (52) for horizontally moving the lead fixing block (4) in left and right directions;
Comprising the at least one cylinder (61, 62) is a semiconductor chip lead calibration device, characterized in that it comprises a second alignment means (6) for horizontally moving the lead fixing block (4) in the front and rear direction. The method of claim 1, wherein the first alignment means (5) comprises a motor 51, a screw 52 mounted in parallel with the axis of the motor 51, the motor 51 and the screw 52 A conveying guide formed in parallel with the screw 52 is formed on the upper surface of the base block 54 supporting the device and the belt 53 and the screw hole corresponding to the screw 52 is formed to be interlocked. Combination with the 55 is configured to include a moving part 56 for horizontal reciprocating motion in accordance with the rotation of the screw 52 is characterized in that the moving part 56 is configured to interlock with the lead fixing block (4) Semiconductor chip lead correction apparatus. According to claim 2, wherein the base block 54 is formed on the upper surface of the support block 57 is further formed in the vertical direction is fixed, the lead fixing block 4 and the moving part 56 is connected to The semiconductor chip lead correction apparatus, characterized in that configured to be interlocked by a vertical block (59) on which at least one bearing (58) is mounted on the sliding surface. According to claim 3, The two guide shafts 71 are fixedly mounted extending in the direction of the vertical block (59), the lead fixing block 4 in the guide hole 42 corresponding to the guide shaft (71) Is formed, and both ends are further formed with a guide block (7) which is bent and extended in the direction of the vertical block (59);
The second alignment means 6 is fixedly mounted to the vertical block 59 and a first through hole 571 and the vertical block 59 through which the first cylinder rod 63 penetrates the support block 57. A first cylinder 61 penetrating through the long hole 591 formed in the horizontal direction;
A second cylinder fixedly mounted to the guide block 7 and mounted to interlock with the lead fixing block 4 by passing through a through hole 72 formed in the guide block 7; 62) A semiconductor chip lead calibration apparatus, characterized in that consisting of.
KR20100015934A 2010-02-23 2010-02-23 The lead frame reformation equipment for a semiconductor KR101198299B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR20100015934A KR101198299B1 (en) 2010-02-23 2010-02-23 The lead frame reformation equipment for a semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20100015934A KR101198299B1 (en) 2010-02-23 2010-02-23 The lead frame reformation equipment for a semiconductor

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KR20110096613A true KR20110096613A (en) 2011-08-31
KR101198299B1 KR101198299B1 (en) 2012-11-07

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102744872A (en) * 2012-07-06 2012-10-24 陈长贵 Calibrating and bending device before encapsulation

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6232546A (en) 1985-08-05 1987-02-12 Alps Electric Co Ltd Program execution and selection control system
JPS6315061A (en) 1986-07-07 1988-01-22 松下冷機株式会社 Refrigerator
JP3841934B2 (en) 1997-09-02 2006-11-08 沖電気工業株式会社 IC package lead correction method and correction jig

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102744872A (en) * 2012-07-06 2012-10-24 陈长贵 Calibrating and bending device before encapsulation

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KR101198299B1 (en) 2012-11-07

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