KR101198299B1 - The lead frame reformation equipment for a semiconductor - Google Patents
The lead frame reformation equipment for a semiconductor Download PDFInfo
- Publication number
- KR101198299B1 KR101198299B1 KR20100015934A KR20100015934A KR101198299B1 KR 101198299 B1 KR101198299 B1 KR 101198299B1 KR 20100015934 A KR20100015934 A KR 20100015934A KR 20100015934 A KR20100015934 A KR 20100015934A KR 101198299 B1 KR101198299 B1 KR 101198299B1
- Authority
- KR
- South Korea
- Prior art keywords
- lead
- semiconductor
- leads
- fixing block
- block
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The present invention relates to a semiconductor chip lead aligning device, which is developed to precisely align a gap between an adjacent lead and a width of a lead row positioned on the other side to reduce the possibility of a defect occurring during assembling or use of a semiconductor;
Corresponding both side surfaces of a semiconductor comprising a semiconductor body in the form of a rectangular plate, a plurality of leads formed at regular intervals on both corresponding side surfaces of the semiconductor body, and pin grooves formed perpendicular to the other side where the leads of the semiconductor body are not formed. A semiconductor chip lead straightening device for aligning a width of a lead row formed in a gap and aligning a gap between adjacent leads;
The upper surface is formed in the form of a long extending bar, the bottom of the semiconductor is in close contact with one side of the lead is in close contact with the adjacent side wall and the other side is seated in a state spaced apart from the opposite side wall, vertically penetrated in the center extending in the longitudinal direction And the work rail is formed a horizontal waybill groove;
A mounting block which is in close contact with a lower end of the work rail and has two fixing pins formed on the upper surface thereof to penetrate the horizontal conveyance groove and further protrude upward;
A lead fixing block in which a tapered hole is narrowed from an upper side to a lower side so that a plurality of leads spaced apart from the side wall adjacent to one side of the work rail and inserted downward at a predetermined interval are formed in a predetermined arrangement;
First alignment means including a motor and a screw to horizontally move the lead fixing block in a direction perpendicular to the length of the semiconductor body;
And a second alignment means configured to move the lead fixing block horizontally in a lengthwise direction parallel to the length of the semiconductor body, wherein the lead fixing block comprises at least one cylinder.
Description
BACKGROUND OF THE
In general, when a semiconductor or a semiconductor chip is recalled, a plurality of leads for transmitting an electrical signal to the semiconductors on both sides of a relatively thin rectangular plate shape are recalled in a downwardly curved shape.
Such semiconductors are becoming smaller and larger in size with the development of technology. As a result, the lead is thinner and the distance between the leads becomes smaller, which requires more careful attention when mounting it on a substrate.
However, in the process of manufacturing a semiconductor chip, the coefficient of thermal expansion is different in the process of bending down the parallel leads or in the epoxy molding process, so that the widths of the rows of leads and the gaps between the adjacent leads are distorted. This causes a defect in the process of mounting the semiconductor on the substrate.
In addition, even with the same semiconductor chip, the width of the lead row may vary depending on the substrate to be applied. Therefore, it is necessary to develop a means for controlling the width of the lead row during the manufacturing process.
SUMMARY OF THE INVENTION The present invention was developed to solve the above problems, and an object thereof is to develop a semiconductor chip lead correction apparatus capable of accurately aligning a width between a lead row in a semiconductor and an interval between adjacent leads at a desired distance. have.
In order to achieve the above object, the present invention provides a semiconductor device in the form of a square plate, a plurality of leads formed at regular intervals on both sides of the semiconductor body, and perpendicular to another side of the semiconductor body in which leads are not formed. A semiconductor chip lead correction apparatus for aligning widths of lead rows formed on both corresponding sides of a semiconductor constituted by formed pin grooves and aligning gaps between adjacent leads;
The upper surface is formed in the form of a long extending bar, the bottom of the semiconductor is in close contact with one side of the lead is in close contact with the adjacent side wall and the other side is seated in a state spaced apart from the opposite side wall, vertically penetrated in the center extending in the longitudinal direction And the work rail is formed a horizontal waybill groove;
A mounting block which is in close contact with a lower end of the work rail and has two fixing pins formed on the upper surface thereof to penetrate the horizontal conveyance groove and further protrude upward;
A lead fixing block in which a tapered hole is narrowed from an upper side to a lower side so that a plurality of leads spaced apart from the side wall adjacent to one side of the work rail and inserted downward at a predetermined interval are formed in a predetermined arrangement;
First alignment means including a motor and a screw to horizontally move the lead fixing block in a direction perpendicular to the length of the semiconductor body;
It is composed of at least one cylinder characterized in that it comprises a second alignment means for horizontally moving the lead fixing block in the longitudinal direction parallel to the length of the semiconductor body.
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In addition, the first alignment means includes a motor, a screw mounted in parallel with the shaft of the motor, a belt for interlocking the motor and the screw, a screw hole corresponding to the screw, and a lower end of the semiconductor chip. It is configured to include a moving part horizontally reciprocating in accordance with the rotation of the screw coupled to the transfer guide formed in parallel with the screw on the upper surface of the base block for supporting the lead correction device is configured to interlock with the lead fixing block It is characterized by.
In addition, an upper surface of the base block is fixedly mounted on the bottom surface is further formed to extend in the vertical upward direction to connect the lead fixing block and the moving portion, one or more bearings between the support block and the vertical block It is characterized in that it is mounted and configured to slide with each other.
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As described above, the present invention has the effect of precisely aligning the width between the rows of leads and the distance between adjacent leads in the semiconductor, which may cause slight distortion in the manufacturing process, thereby reducing defects that may occur during the assembly process and use of the semiconductor chip. .
Figure 1 is a perspective view of an embodiment of the present invention.
2 is an exploded perspective view according to an embodiment of the present invention.
3 is a plan view according to an embodiment of the present invention;
4 is a side view illustrating mounting of a semiconductor according to an embodiment of the present disclosure.
5A to 5C are conceptual views illustrating a gap adjustment between leads according to an embodiment of the present invention.
6 is a perspective view of a main part according to an embodiment of the present invention;
7 is a cross-sectional view taken along the line CC according to an embodiment of the present invention
8 is a cross-sectional view taken along line BB according to an embodiment of the present invention
Accordingly, the configuration of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily understand and reproduce.
1 is a perspective view according to an embodiment of the present invention, Figure 2 is an exploded perspective view according to an embodiment of the present invention, Figure 3 is a plan view according to an embodiment of the present invention, Figure 4 is one of the present invention 5A to 5C are conceptual views illustrating a gap adjustment between leads according to an embodiment of the present invention, and FIG. 6 is a perspective view of a main portion according to an embodiment of the present invention. 7 is a cross-sectional view taken along line CC according to an embodiment of the present invention, Figure 8 is a cross-sectional view taken along line BB according to an embodiment of the present invention.
The basic configuration of the present invention includes a
The upper surface is formed in the form of a long bar, the bottom surface of the
Two
Tapered
First alignment means (5) including a motor (51) and a screw (52) to horizontally move the lead fixing block (4) in a direction perpendicular to the length of the semiconductor body (11);
At least one cylinder (61, 62) is characterized in that it comprises a second alignment means (6) for horizontally moving the
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That is, when the
In addition, the
In this configuration, even if the position of the
In addition, when the
In a more specific embodiment of the present invention, the first alignment means 5 includes a
In addition, the upper surface of the
At this time, the mounting
In addition, two
It is provided with two
The second alignment means 6 is fixedly mounted to the
A second cylinder fixedly mounted to the
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Accordingly, the operation of the apparatus is performed by using a manual or mechanical means to first insert the
Then, when the
The movement of the
In this case, the
In addition, the
The figure also shows that the first and
As shown in FIG. 8, when the
1: semiconductor
11: semiconductor body 12: lead
13: pin groove
2: work rail
21: Horizontal waybill groove
3: mounting block
31: fixed pin
4: Lead fixing block
41: taper hole 42: guide hole
5: first alignment means
51: motor 52: screw
53: belt 54: base block
55: transfer guide 56: moving part
57: support block 571: first through hole
58: bearing 59: vertical block
591: hall
6: second alignment means
61: first cylinder 62: second cylinder
63: first cylinder rod 64: second cylinder rod
7: guide block
71: guide shaft 72: through hole
Claims (4)
The upper surface is formed in the form of a long bar, the bottom surface of the semiconductor 1 is in close contact with one side of the lead 12 is in close contact with the adjacent side wall, the other side of the lead 12 is seated spaced apart from the opposite side wall, the center The work rail (2) is formed with a horizontal conveying way groove 21 extending vertically through the longitudinal direction;
Two fixing pins 31 closely attached to the lower ends of the work rails 2 and protruding upwardly through the horizontal conveyance groove 21 to be coupled to the pin grooves 13 of the semiconductor 1. Mounting block 3 is formed;
Tapered holes 41 which are narrowed from the top to the bottom are inserted in a predetermined arrangement so that a plurality of leads 12 extending downwardly spaced apart from the side wall adjacent to one side of the work rail 2 are inserted at regular intervals. Lead fixing block 4 and;
First alignment means (5) including a motor (51) and a screw (52) to horizontally move the lead fixing block (4) in a direction perpendicular to the length of the semiconductor body (11);
A semiconductor comprising: at least one cylinder (61, 62) comprising second alignment means (6) for horizontally moving the lead fixing block (4) in a longitudinal direction parallel to the length of the semiconductor body (11) Chip lead calibrator.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20100015934A KR101198299B1 (en) | 2010-02-23 | 2010-02-23 | The lead frame reformation equipment for a semiconductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20100015934A KR101198299B1 (en) | 2010-02-23 | 2010-02-23 | The lead frame reformation equipment for a semiconductor |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20110096613A KR20110096613A (en) | 2011-08-31 |
KR101198299B1 true KR101198299B1 (en) | 2012-11-07 |
Family
ID=44931750
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR20100015934A KR101198299B1 (en) | 2010-02-23 | 2010-02-23 | The lead frame reformation equipment for a semiconductor |
Country Status (1)
Country | Link |
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KR (1) | KR101198299B1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102744872B (en) * | 2012-07-06 | 2014-11-05 | 陈长贵 | Calibrating and bending device before encapsulation |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6232546A (en) | 1985-08-05 | 1987-02-12 | Alps Electric Co Ltd | Program execution and selection control system |
JPS6315061A (en) | 1986-07-07 | 1988-01-22 | 松下冷機株式会社 | Refrigerator |
JPH1187592A (en) | 1997-09-02 | 1999-03-30 | Oki Electric Ind Co Ltd | Method and jig for correcting lead of ic package |
-
2010
- 2010-02-23 KR KR20100015934A patent/KR101198299B1/en active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6232546A (en) | 1985-08-05 | 1987-02-12 | Alps Electric Co Ltd | Program execution and selection control system |
JPS6315061A (en) | 1986-07-07 | 1988-01-22 | 松下冷機株式会社 | Refrigerator |
JPH1187592A (en) | 1997-09-02 | 1999-03-30 | Oki Electric Ind Co Ltd | Method and jig for correcting lead of ic package |
Also Published As
Publication number | Publication date |
---|---|
KR20110096613A (en) | 2011-08-31 |
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