KR101198299B1 - The lead frame reformation equipment for a semiconductor - Google Patents

The lead frame reformation equipment for a semiconductor Download PDF

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Publication number
KR101198299B1
KR101198299B1 KR20100015934A KR20100015934A KR101198299B1 KR 101198299 B1 KR101198299 B1 KR 101198299B1 KR 20100015934 A KR20100015934 A KR 20100015934A KR 20100015934 A KR20100015934 A KR 20100015934A KR 101198299 B1 KR101198299 B1 KR 101198299B1
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KR
South Korea
Prior art keywords
lead
semiconductor
leads
fixing block
block
Prior art date
Application number
KR20100015934A
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Korean (ko)
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KR20110096613A (en
Inventor
김종은
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김종은
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Publication date
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Priority to KR20100015934A priority Critical patent/KR101198299B1/en
Publication of KR20110096613A publication Critical patent/KR20110096613A/en
Application granted granted Critical
Publication of KR101198299B1 publication Critical patent/KR101198299B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Lead Frames For Integrated Circuits (AREA)

Abstract

The present invention relates to a semiconductor chip lead aligning device, which is developed to precisely align a gap between an adjacent lead and a width of a lead row positioned on the other side to reduce the possibility of a defect occurring during assembling or use of a semiconductor;
Corresponding both side surfaces of a semiconductor comprising a semiconductor body in the form of a rectangular plate, a plurality of leads formed at regular intervals on both corresponding side surfaces of the semiconductor body, and pin grooves formed perpendicular to the other side where the leads of the semiconductor body are not formed. A semiconductor chip lead straightening device for aligning a width of a lead row formed in a gap and aligning a gap between adjacent leads;
The upper surface is formed in the form of a long extending bar, the bottom of the semiconductor is in close contact with one side of the lead is in close contact with the adjacent side wall and the other side is seated in a state spaced apart from the opposite side wall, vertically penetrated in the center extending in the longitudinal direction And the work rail is formed a horizontal waybill groove;
A mounting block which is in close contact with a lower end of the work rail and has two fixing pins formed on the upper surface thereof to penetrate the horizontal conveyance groove and further protrude upward;
A lead fixing block in which a tapered hole is narrowed from an upper side to a lower side so that a plurality of leads spaced apart from the side wall adjacent to one side of the work rail and inserted downward at a predetermined interval are formed in a predetermined arrangement;
First alignment means including a motor and a screw to horizontally move the lead fixing block in a direction perpendicular to the length of the semiconductor body;
And a second alignment means configured to move the lead fixing block horizontally in a lengthwise direction parallel to the length of the semiconductor body, wherein the lead fixing block comprises at least one cylinder.

Description

Semiconductor chip lead straightening device {The lead frame reformation equipment for a semiconductor}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip lead calibration apparatus, and more particularly, to a semiconductor chip lead calibration apparatus developed to accurately align a gap between an adjacent lead and a width of a lead row positioned on the other side.

In general, when a semiconductor or a semiconductor chip is recalled, a plurality of leads for transmitting an electrical signal to the semiconductors on both sides of a relatively thin rectangular plate shape are recalled in a downwardly curved shape.

Such semiconductors are becoming smaller and larger in size with the development of technology. As a result, the lead is thinner and the distance between the leads becomes smaller, which requires more careful attention when mounting it on a substrate.

However, in the process of manufacturing a semiconductor chip, the coefficient of thermal expansion is different in the process of bending down the parallel leads or in the epoxy molding process, so that the widths of the rows of leads and the gaps between the adjacent leads are distorted. This causes a defect in the process of mounting the semiconductor on the substrate.

In addition, even with the same semiconductor chip, the width of the lead row may vary depending on the substrate to be applied. Therefore, it is necessary to develop a means for controlling the width of the lead row during the manufacturing process.

SUMMARY OF THE INVENTION The present invention was developed to solve the above problems, and an object thereof is to develop a semiconductor chip lead correction apparatus capable of accurately aligning a width between a lead row in a semiconductor and an interval between adjacent leads at a desired distance. have.

In order to achieve the above object, the present invention provides a semiconductor device in the form of a square plate, a plurality of leads formed at regular intervals on both sides of the semiconductor body, and perpendicular to another side of the semiconductor body in which leads are not formed. A semiconductor chip lead correction apparatus for aligning widths of lead rows formed on both corresponding sides of a semiconductor constituted by formed pin grooves and aligning gaps between adjacent leads;
The upper surface is formed in the form of a long extending bar, the bottom of the semiconductor is in close contact with one side of the lead is in close contact with the adjacent side wall and the other side is seated in a state spaced apart from the opposite side wall, vertically penetrated in the center extending in the longitudinal direction And the work rail is formed a horizontal waybill groove;
A mounting block which is in close contact with a lower end of the work rail and has two fixing pins formed on the upper surface thereof to penetrate the horizontal conveyance groove and further protrude upward;
A lead fixing block in which a tapered hole is narrowed from an upper side to a lower side so that a plurality of leads spaced apart from the side wall adjacent to one side of the work rail and inserted downward at a predetermined interval are formed in a predetermined arrangement;
First alignment means including a motor and a screw to horizontally move the lead fixing block in a direction perpendicular to the length of the semiconductor body;
It is composed of at least one cylinder characterized in that it comprises a second alignment means for horizontally moving the lead fixing block in the longitudinal direction parallel to the length of the semiconductor body.

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In addition, the first alignment means includes a motor, a screw mounted in parallel with the shaft of the motor, a belt for interlocking the motor and the screw, a screw hole corresponding to the screw, and a lower end of the semiconductor chip. It is configured to include a moving part horizontally reciprocating in accordance with the rotation of the screw coupled to the transfer guide formed in parallel with the screw on the upper surface of the base block for supporting the lead correction device is configured to interlock with the lead fixing block It is characterized by.

In addition, an upper surface of the base block is fixedly mounted on the bottom surface is further formed to extend in the vertical upward direction to connect the lead fixing block and the moving portion, one or more bearings between the support block and the vertical block It is characterized in that it is mounted and configured to slide with each other.

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As described above, the present invention has the effect of precisely aligning the width between the rows of leads and the distance between adjacent leads in the semiconductor, which may cause slight distortion in the manufacturing process, thereby reducing defects that may occur during the assembly process and use of the semiconductor chip. .

Figure 1 is a perspective view of an embodiment of the present invention.
2 is an exploded perspective view according to an embodiment of the present invention.
3 is a plan view according to an embodiment of the present invention;
4 is a side view illustrating mounting of a semiconductor according to an embodiment of the present disclosure.
5A to 5C are conceptual views illustrating a gap adjustment between leads according to an embodiment of the present invention.
6 is a perspective view of a main part according to an embodiment of the present invention;
7 is a cross-sectional view taken along the line CC according to an embodiment of the present invention
8 is a cross-sectional view taken along line BB according to an embodiment of the present invention

Accordingly, the configuration of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily understand and reproduce.

1 is a perspective view according to an embodiment of the present invention, Figure 2 is an exploded perspective view according to an embodiment of the present invention, Figure 3 is a plan view according to an embodiment of the present invention, Figure 4 is one of the present invention 5A to 5C are conceptual views illustrating a gap adjustment between leads according to an embodiment of the present invention, and FIG. 6 is a perspective view of a main portion according to an embodiment of the present invention. 7 is a cross-sectional view taken along line CC according to an embodiment of the present invention, Figure 8 is a cross-sectional view taken along line BB according to an embodiment of the present invention.

The basic configuration of the present invention includes a semiconductor body 11 having a rectangular plate shape, a plurality of leads 12 formed at regular intervals on both sides of the semiconductor body 11, and the leads 12 of the semiconductor body 11. ) Is a semiconductor chip lead that aligns the widths of the rows of leads formed on both corresponding sides of the semiconductor 1 composed of the pin grooves 13 formed perpendicularly to the other side not formed, and the spacing between adjacent leads 12. In a calibration device;
The upper surface is formed in the form of a long bar, the bottom surface of the semiconductor 1 is in close contact with one side of the lead 12 is in close contact with the adjacent side wall, the other side of the lead 12 is seated spaced apart from the opposite side wall, the center The work rail (2) is formed with a horizontal conveying way groove 21 extending vertically through the longitudinal direction;
Two fixing pins 31 closely attached to the lower ends of the work rails 2 and protruding upwardly through the horizontal conveyance groove 21 to be coupled to the pin grooves 13 of the semiconductor 1. Mounting block 3 is formed;
Tapered holes 41 which are narrowed from the top to the bottom are inserted in a predetermined arrangement so that a plurality of leads 12 extending downwardly spaced apart from the side wall adjacent to one side of the work rail 2 are inserted at regular intervals. Lead fixing block 4 and;
First alignment means (5) including a motor (51) and a screw (52) to horizontally move the lead fixing block (4) in a direction perpendicular to the length of the semiconductor body (11);
At least one cylinder (61, 62) is characterized in that it comprises a second alignment means (6) for horizontally moving the lead fixing block 4 in the longitudinal direction parallel to the length of the semiconductor body (11).

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That is, when the semiconductor 1 is fixed by the work rail 2, the fixing pin 31 of the mounting block 3, and the taper hole 41 of the lead fixing block 4, the lead fixing block 4 is formed of the first rail. 1 When the lead fixing block 4 is slightly reciprocated in the left and right direction by the alignment means 4, the distance between the lead fixing block 4 and the adjacent lead 12 is adjusted at the correct interval.

In addition, the mounting block 3 is fixed so as to adjust the distance from the lead 12 on the other side while performing a slight reciprocating movement in the front and rear direction of the second alignment means 6 in a state where the semiconductor 1 is fixed.

In this configuration, even if the position of the lead 12 is bent to a desired position by only one operation, the lead 12 is not aligned at the correct position by a slight restoring force, so that the lead 12 is simply bent or This configuration is chosen because it is not precisely aligned by inserting it into the same means as the tapered hole 41.

In addition, when the tapered hole 41 of the lead fixing block 4 has a form in which at least one or more pairs are arranged in parallel, as shown in FIG. It can be selected to insert into the product, which can be useful for products with different widths or for different lead spacing in the same product.

In a more specific embodiment of the present invention, the first alignment means 5 includes a motor 51, a screw 52 mounted in parallel with an axis of the motor 51, the motor 51 and the screw 52. Belt 53 and a screw hole coupled to the screw 52 are formed, and a lower end of the belt 53 is formed on the upper surface of the base block 54 for supporting the semiconductor chip lead calibration apparatus. Combination with the transfer guide 55 is formed in parallel comprising a moving part 56 for horizontal reciprocating motion in accordance with the rotation of the screw 52 is the moving part 56 and the lead fixing block (4) An embodiment configured to interlock is presented.

In addition, the upper surface of the base block 54 is further formed with a support block 57 which is fixedly mounted on the bottom surface and extending in the vertical upward direction to connect the lead fixing block 4 and the moving part 56, It is further suggested that one or more bearings 58 are mounted between the support block 57 and the vertical block 59 to slide each other.

At this time, the mounting block 3 is maintained in a fixed state in combination with the support block (57).

In addition, two guide holes 42 are formed in the lead fixing block 4 for effective interworking between the first alignment means 5 and the second alignment means 6;
It is provided with two guide shafts 71 inserted corresponding to the guide hole 42 extending and fixed in the vertical block 59 direction, both ends are bent toward the vertical block 59 'c''Shaped guide block 7 is further formed;
The second alignment means 6 is fixedly mounted to the vertical block 59 and a first through hole 571 and the vertical block 59 through which the first cylinder rod 63 penetrates the support block 57. A first cylinder 61 penetrating through the long hole 591 formed in the horizontal direction;
A second cylinder fixedly mounted to the guide block 7 and mounted to interlock with the lead fixing block 4 by passing through a through hole 72 formed in the guide block 7; An embodiment consisting of 62) is further presented.

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Accordingly, the operation of the apparatus is performed by using a manual or mechanical means to first insert the semiconductor 1 into the tapered hole 41 of the lead fixing block 4 so that the lead 12 can be neatly inserted into the work rail 2. Settle on

Then, when the motor 51 of the first alignment means 5 is driven, the screw 52 rotates and the transfer part 56 moves according to the rotation of the screw 52.

The movement of the transfer part 56 allows the lead 12 to be aligned at a desired position and interval by moving the lead fixing block 4 connected to the vertical block 59.

In this case, the vertical block 59 has a long hole 591 in order to move the lead fixing block 4 irrespective of the driving of the second alignment means 6 presented in a further embodiment. The movement of the first cylinder rod 63 of) can be made possible within the length range of the long hole 591.

In addition, the lead fixing block 4 is preferably to be easily replaced with a different standard according to the situation.

The figure also shows that the first and second cylinder rods 63, 64 in the second alignment means 6 are combined with separate axes, but these axes are generally extended by the cylinder rods 63, 64. The shape of the end of the cylinder rod, which is separately produced in the shape of a simple cylinder, is combined with an extension shaft so as to be suitable for the apparatus of the present application.

As shown in FIG. 8, when the second cylinder 62 is operated to the right, the lead 12 is bent to the right by the lead fixing block 4 connected to the second cylinder rod 64, and the first cylinder 61 is connected to the second cylinder rod 64. Is moved to the left side and the second cylinder 62 is moved to the left side, the lid 12 is bent to the left side and if the second cylinder 62 is moved to the right side, the lid 12 is bent to the right side and the first cylinder ( When the second cylinder 62 is moved to the left after the 61 is moved to the right, the lid 12 can be easily adjusted in width with the left lid.

1: semiconductor
11: semiconductor body 12: lead
13: pin groove
2: work rail
21: Horizontal waybill groove
3: mounting block
31: fixed pin
4: Lead fixing block
41: taper hole 42: guide hole
5: first alignment means
51: motor 52: screw
53: belt 54: base block
55: transfer guide 56: moving part
57: support block 571: first through hole
58: bearing 59: vertical block
591: hall
6: second alignment means
61: first cylinder 62: second cylinder
63: first cylinder rod 64: second cylinder rod
7: guide block
71: guide shaft 72: through hole

Claims (4)

A semiconductor body 11 having a rectangular plate shape, a plurality of leads 12 formed at regular intervals on both corresponding side surfaces of the semiconductor body 11, and another in which the leads 12 of the semiconductor body 11 are not formed. A semiconductor chip lead correction apparatus for aligning widths of lead rows formed on both corresponding sides of a semiconductor (1) composed of pin grooves (13) formed perpendicularly to side surfaces and aligning intervals between adjacent leads (12);
The upper surface is formed in the form of a long bar, the bottom surface of the semiconductor 1 is in close contact with one side of the lead 12 is in close contact with the adjacent side wall, the other side of the lead 12 is seated spaced apart from the opposite side wall, the center The work rail (2) is formed with a horizontal conveying way groove 21 extending vertically through the longitudinal direction;
Two fixing pins 31 closely attached to the lower ends of the work rails 2 and protruding upwardly through the horizontal conveyance groove 21 to be coupled to the pin grooves 13 of the semiconductor 1. Mounting block 3 is formed;
Tapered holes 41 which are narrowed from the top to the bottom are inserted in a predetermined arrangement so that a plurality of leads 12 extending downwardly spaced apart from the side wall adjacent to one side of the work rail 2 are inserted at regular intervals. Lead fixing block 4 and;
First alignment means (5) including a motor (51) and a screw (52) to horizontally move the lead fixing block (4) in a direction perpendicular to the length of the semiconductor body (11);
A semiconductor comprising: at least one cylinder (61, 62) comprising second alignment means (6) for horizontally moving the lead fixing block (4) in a longitudinal direction parallel to the length of the semiconductor body (11) Chip lead calibrator. The method of claim 1, wherein the first alignment means (5) comprises a motor 51, a screw 52 mounted in parallel with the axis of the motor 51, the motor 51 and the screw 52 A belt 53 for interlocking and a screw hole corresponding to the screw 52 are formed and the lower end thereof is parallel to the screw 52 on the upper surface of the base block 54 supporting the semiconductor chip lead straightening device. Combination with the transfer guide 55 is formed to include a moving part 56 for horizontal reciprocating motion in accordance with the rotation of the screw 52 so that the moving part 56 is interlocked with the lead fixing block (4) The semiconductor chip lead correction apparatus, characterized in that configured. The upper surface of the base block 54 is further provided with a support block (57) fixedly mounted on the bottom surface and extending in the vertical upward direction, the lead fixing block (4) and the moving part (56) And a support block (57) and a vertical block (59) between the semiconductor chip lead correction device, characterized in that the one or more bearings (58) is configured to slide with each other. delete
KR20100015934A 2010-02-23 2010-02-23 The lead frame reformation equipment for a semiconductor KR101198299B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR20100015934A KR101198299B1 (en) 2010-02-23 2010-02-23 The lead frame reformation equipment for a semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20100015934A KR101198299B1 (en) 2010-02-23 2010-02-23 The lead frame reformation equipment for a semiconductor

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KR20110096613A KR20110096613A (en) 2011-08-31
KR101198299B1 true KR101198299B1 (en) 2012-11-07

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KR20100015934A KR101198299B1 (en) 2010-02-23 2010-02-23 The lead frame reformation equipment for a semiconductor

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102744872B (en) * 2012-07-06 2014-11-05 陈长贵 Calibrating and bending device before encapsulation

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6232546A (en) 1985-08-05 1987-02-12 Alps Electric Co Ltd Program execution and selection control system
JPS6315061A (en) 1986-07-07 1988-01-22 松下冷機株式会社 Refrigerator
JPH1187592A (en) 1997-09-02 1999-03-30 Oki Electric Ind Co Ltd Method and jig for correcting lead of ic package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6232546A (en) 1985-08-05 1987-02-12 Alps Electric Co Ltd Program execution and selection control system
JPS6315061A (en) 1986-07-07 1988-01-22 松下冷機株式会社 Refrigerator
JPH1187592A (en) 1997-09-02 1999-03-30 Oki Electric Ind Co Ltd Method and jig for correcting lead of ic package

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KR20110096613A (en) 2011-08-31

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