KR20110084062A - Printed circuit board and backlight unit having the same - Google Patents

Printed circuit board and backlight unit having the same Download PDF

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Publication number
KR20110084062A
KR20110084062A KR1020100004116A KR20100004116A KR20110084062A KR 20110084062 A KR20110084062 A KR 20110084062A KR 1020100004116 A KR1020100004116 A KR 1020100004116A KR 20100004116 A KR20100004116 A KR 20100004116A KR 20110084062 A KR20110084062 A KR 20110084062A
Authority
KR
South Korea
Prior art keywords
printed circuit
circuit board
pattern
dummy pattern
backlight unit
Prior art date
Application number
KR1020100004116A
Other languages
Korean (ko)
Inventor
박동욱
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020100004116A priority Critical patent/KR20110084062A/en
Publication of KR20110084062A publication Critical patent/KR20110084062A/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

A printed circuit board according to the embodiment includes a substrate; A conductive wire pattern disposed on the substrate; A dummy pattern disposed between the conductive line patterns; It includes.
The backlight unit according to the embodiment may include a light guide plate through which light propagates; Light supply means disposed on a side of the light guide plate to provide light to the light guide plate; A printed circuit board disposed under the light guide plate and the light supply means, the printed circuit board including a conductive pattern and a dummy pattern disposed between the lines forming the conductive pattern; It includes.

Description

Printed circuit board and backlight unit having the same

The present invention relates to a printed circuit board and a backlight unit including the same.

Printed circuit boards are being applied to electronic devices such as image display devices. Warpage may occur in a printed circuit board during manufacturing or use. As such, when a deformation of the printed circuit board occurs due to the distortion in the manufacturing process, the manufacturing yield may decrease. In addition, when the deformation of the printed circuit board due to the distortion in the use process may cause a problem in the implementation of the circuit. Therefore, it is desired to provide a printed circuit board that can prevent deformation due to distortion.

Also, a printed circuit board is applied to a backlight unit used in an image display device. The printed circuit board applied to the backlight unit may have a white ink coated on its upper surface to improve reflectivity. At this time, a difference may occur in the coated thickness of the white ink according to the spacing between the conductors implementing the circuit. By the way, when the spacing between conductors is formed larger than the predetermined distance, the thickness of the white ink formed between the conductors becomes thinner. This causes a problem that the reflectance in the corresponding area is reduced.

SUMMARY OF THE INVENTION An object of the present invention is to provide a printed circuit board and a backlight unit including the same, which can prevent deformation due to distortion and improve reflectance.

A printed circuit board according to the embodiment includes a substrate; A conductive wire pattern disposed on the substrate; A dummy pattern disposed between the lines forming the conductive pattern; .

The backlight unit according to the embodiment may include a light guide plate through which light propagates; Light supply means disposed on a side of the light guide plate to provide light to the light guide plate; A printed circuit board disposed under the light guide plate and the light supply means, the printed circuit board including a conductive pattern and a dummy pattern disposed between the lines forming the conductive pattern; .

According to an embodiment of the present invention, it is possible to provide a printed circuit board and a backlight unit including the same, which may prevent deformation due to distortion and improve reflectance.

1 is a view showing a printed circuit board according to an embodiment of the present invention.
2 is a diagram illustrating a printed circuit board according to another exemplary embodiment of the present invention.
3 is a diagram illustrating a printed circuit board according to another exemplary embodiment of the present invention.
4 is a diagram illustrating a backlight unit according to an exemplary embodiment of the present invention.

In the description of an embodiment according to the present invention, each layer (film), region, pattern or structure is "on" or "under" the substrate, each layer (film), region, pad or patterns. In the case described as being formed on, "on" and "under" include both "directly" or "indirectly" formed. In addition, the criteria for the top or bottom of each layer will be described with reference to the drawings.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not necessarily reflect the actual size.

Hereinafter, exemplary embodiments will be described with reference to the accompanying drawings.

1 is a view showing a printed circuit board according to an embodiment.

The printed circuit board according to the embodiment includes a substrate 100, a conductive line pattern 110, and a dummy pattern 120.

The conductive line pattern 110 includes a plurality of lines 111 and 113 and is disposed on the substrate 100. The conductive line pattern 110 may be formed by patterning the substrate 100. For example, the conductive pattern 110 may be formed of copper. The conductive line pattern 110 may be formed on the substrate 100 to implement a circuit.

The dummy pattern 120 may be disposed between the plurality of lines 111 and 113 constituting the conductive line pattern 110. In addition, the dummy pattern 120 may be disposed in an area where the plurality of lines 111 and 113 forming the conductive line pattern 110 are not formed. The dummy pattern 120 may be patterned on the substrate 100. For example, the dummy pattern 120 may be formed of copper. The dummy pattern 120 may be formed of the same material as the conductive pattern 110 or may be formed of another material. The dummy pattern 120 may be formed at the same time as the conductive pattern 110, or may be formed by a separate process.

For example, the dummy pattern 120 may be formed in a mesh pattern. An interval D1 between the lines 111 and 113 forming the dummy pattern 120 may be, for example, 100 μm to 400 μm. An interval D1 between the lines 111 and 113 constituting the dummy pattern 120 may be 200 μm. In addition, the width T1 of the lines 111 and 113 constituting the dummy pattern 120 may be, for example, 100 μm to 400 μm.

As described above, the printed circuit board further includes the dummy pattern 120 in addition to the conductive pattern 110 constituting the circuit. Accordingly, it is possible to secure a sufficient structural rigidity by the dummy pattern 120, it is possible to prevent the occurrence of distortion in the printed circuit board during the manufacturing process or use process. The printed circuit board according to the embodiment can improve the manufacturing yield in the manufacturing process, and also improve the stability in the use process.

2 is a diagram illustrating a printed circuit board according to another exemplary embodiment.

The printed circuit board according to the embodiment includes a substrate 200, a conductive pattern 210, and a dummy pattern 220.

The conductive line pattern 210 includes a plurality of lines 211 and 213 and is disposed on the substrate 200. The conductive line pattern 210 may be patterned on the substrate 200. For example, the conductive pattern 210 may be formed of copper. The conductive line pattern 210 may be formed on the substrate 200 to implement a circuit.

The dummy pattern 220 may be disposed between the plurality of lines 211 and 213 constituting the conductive line pattern 210. In addition, the dummy pattern 220 may be disposed in an area where the plurality of lines 211 and 213 of the conductive line pattern 210 are not formed. The dummy pattern 220 may be patterned on the substrate 200. For example, the dummy pattern 220 may be formed of copper. The dummy pattern 220 may be formed of the same material as the conductive pattern 210 or may be formed of another material. The dummy pattern 220 may be formed at the same time as the conductive pattern 210, or may be formed by a separate process.

For example, the dummy pattern 220 may be formed in a stripe pattern. An interval D2 between the lines 211 and 213 of the dummy pattern 220 may be, for example, 100 μm to 400 μm. An interval D2 between the lines 211 and 213 of the dummy pattern 220 may be 200 μm. In addition, the width T2 of the lines 211 and 213 of the dummy pattern 220 may be, for example, 100 μm to 400 μm.

As described above, the printed circuit board further includes the dummy pattern 220 in addition to the conductive pattern 210 constituting the circuit. Accordingly, it is possible to secure a sufficient structural rigidity by the dummy pattern 220, it is possible to prevent the occurrence of distortion in the printed circuit board during the manufacturing process or use process. The printed circuit board according to the embodiment can improve the manufacturing yield in the manufacturing process, and also improve the stability in the use process.

3 is a cross-sectional view illustrating a printed circuit board according to another exemplary embodiment.

The printed circuit board according to the embodiment includes a substrate 310, a dummy pattern 320, and an ink layer 330.

The dummy pattern 320 may be a dummy pattern applied to the printed circuit board described with reference to FIGS. 1 and 2. For example, the dummy pattern 320 may be disposed between a plurality of lines constituting the conductive pattern. In addition, the dummy pattern 320 may be disposed in an area where a plurality of lines forming a conductive pattern are not formed. The dummy pattern 320 may be patterned on the substrate 300. For example, the dummy pattern 320 may be formed of copper. The dummy pattern 320 may be formed of the same material as the conductive pattern, or may be formed of another material. The dummy pattern 320 may be formed simultaneously with the conductive pattern, or may be formed by a separate process.

The dummy pattern 320 may be formed, for example, in a mesh pattern or a stripe pattern. The interval between the lines forming the dummy pattern 320 may be, for example, 100 μm to 400 μm. An interval between the lines forming the dummy pattern 320 may be 200 μm. In addition, the width of the line constituting the dummy pattern 320 may be, for example, 100㎛ ~ 400㎛.

The ink layer 330 may be formed of a green ink layer, a blue ink layer, a white ink layer, or the like. The ink layer 330 may be formed of, for example, a photo solder resist (PSR). For example, when the printed circuit board according to the embodiment is applied to a backlight unit that provides light, the ink layer 330 may be formed of a white ink layer.

When the ink layer 330 is formed of a white ink layer, it is possible to improve light efficiency by reflecting light incident on the printed circuit board according to the embodiment. The thickness H1 of the ink layer 330 formed on the dummy pattern 320 may be 14 μm to 20 μm from the surface of the substrate 310. In addition, the thickness H2 of the ink layer 330 may be 3 μm to 5 μm from the surface of the dummy pattern 320. In addition, the thickness H3 of the ink layer 330 in a region where the dummy pattern 320 is not formed may be 10 μm to 17 μm.

When the thickness of the ink layer 330 in the region where the dummy pattern 320 is not formed is thinner than 10 μm, the color of the substrate 310 may be seen, thereby reducing the reflectivity. This is because when the thickness of the ink layer 330 is formed to be thinner than 10 μm, grains constituting the ink layer 330 are insufficient and mainly a binder is provided in the corresponding region. In addition, when the thickness of the ink layer 330 is formed to be thicker than 20 μm, a crack phenomenon may occur in the ink layer 330 in a corresponding region.

Accordingly, in the embodiment, the thickness H3 of the ink layer 330 in the region where the dummy pattern 320 is not formed is set to 10 μm to 17 μm. In order to implement this, in the embodiment, the dummy pattern 320 is formed in a mesh pattern or a stripe pattern. In addition, the distance between the lines constituting the dummy pattern 320 is, for example, 100㎛ ~ 400㎛, and the width of the lines constituting the dummy pattern 320 is, for example, 100㎛ ~ 400㎛. The substrate 310 may be formed of, for example, an epoxy resin.

As described above, the printed circuit board further includes the dummy pattern 320 and the ink layer 330 in addition to the conductive pattern constituting the circuit. Accordingly, it is possible to secure structurally sufficient rigidity by the dummy pattern 320, it is possible to prevent the occurrence of distortion in the printed circuit board during the manufacturing process or use process. The printed circuit board according to the embodiment can improve the manufacturing yield in the manufacturing process, and also improve the stability in the use process. In addition, the printed circuit board according to the embodiment may reflect light incident by the ink layer 330 and improve light efficiency.

Such a printed circuit board may be applied to the backlight unit. When a light emitting device such as a light emitting diode is disposed on the printed circuit board, the printed circuit board according to the embodiment may be applied as a direct type backlight unit.

Hereinafter, an edge type backlight unit to which a printed circuit board according to the embodiment is applied will be described with reference to FIG. 4. 4 is a diagram illustrating a backlight unit according to an exemplary embodiment.

The backlight unit according to the embodiment includes a light guide plate 410, a light supply means 420, and a printed circuit board 430.

The light guide plate 410 may propagate the incident light, and may provide the propagated light upward. For example, a liquid crystal panel may be disposed on the light guide plate 410.

The light supply means 420 may be disposed on the side surface of the light guide plate 410. The light supply means 420 provides light to the light guide plate 410. For example, the light supply means 420 may include a light emitting device such as a light emitting diode.

The printed circuit board 430 may be disposed under the light guide plate 410 and the light supply means 420. The embodiment described with reference to FIGS. 1 to 3 may be applied to the printed circuit board 430. That is, as described with reference to FIGS. 1 and 2, the printed circuit board 430 may include a conductive pattern and a dummy pattern disposed between the lines forming the conductive pattern. In addition, the printed circuit board 430 may further include an ink layer as described with reference to FIG. 3. In this case, the ink layer may be formed of a white ink layer to improve the reflectance of incident light.

The dummy pattern may be formed, for example, in a mesh pattern or a stripe pattern. The interval between the lines forming the dummy pattern may be, for example, 100 μm to 400 μm. The interval between the lines forming the dummy pattern may be 200 μm. In addition, the width of the line forming the dummy pattern may be, for example, 100㎛ ~ 400㎛. Accordingly, according to the embodiment, the thickness of the ink layer may be uniformly formed to have a thickness of 10 μm to 17 μm in a region where the dummy pattern is not formed.

When the ink layer is formed of a white ink layer, the light efficiency may be improved by reflecting light incident on the printed circuit board 430 according to the embodiment. That is, when the light emitted from the light supply means 420 is incident on the printed cloth substrate 430, the incident light is reflected to the light guide plate 410, thereby improving light efficiency.

As described above, the printed circuit board 430 further includes a dummy pattern and an ink layer in addition to the conductive pattern constituting the circuit. Accordingly, it is possible to secure a sufficient structural rigidity by the dummy pattern, it is possible to prevent the occurrence of distortion in the printed circuit board during the manufacturing process or use process. The printed circuit board according to the embodiment can improve the manufacturing yield in the manufacturing process, and also improve the stability in the use process. In addition, it is possible to reflect the light incident by the ink layer, and improve the light efficiency. Accordingly, the backlight unit according to the embodiment can also ensure stability and improve the light efficiency.

Although the above description has been made with reference to the embodiments, these are merely examples and are not intended to limit the present invention. Those skilled in the art to which the present invention pertains are not illustrated above without departing from the essential characteristics of the present embodiments. It will be appreciated that many variations and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

110, 210 ... conductor pattern
111, 113, 211, 213 ... lines
120, 220 ... dummy pattern
310 ... Substrate
320 ... dummy pattern
330 ... Ink layer
410 ... light guide plate
420 ... light supply means
430 ... Printed Circuit Board

Claims (18)

Board;
A conductive wire pattern disposed on the substrate;
A dummy pattern disposed between the lines forming the conductive pattern;
Printed circuit board comprising a. The printed circuit board of claim 1, wherein the conductive pattern and the dummy pattern are formed of the same material. The printed circuit board of claim 1, wherein the dummy pattern is formed in a mesh pattern. The printed circuit board of claim 1, wherein the dummy pattern is formed in a stripe pattern. The printed circuit board of claim 1, further comprising a white ink layer formed on the conductive pattern and the dummy pattern. The printed circuit board of claim 5, wherein the white ink layer has a thickness of 10 μm to 17 μm in a region where the dummy pattern is not formed. The printed circuit board of claim 5, further comprising a light emitting device on the substrate. The printed circuit board of claim 1, wherein an interval between lines forming the dummy pattern is 100 μm to 400 μm. The printed circuit board of claim 1, wherein the conductive pattern is formed of copper. A light guide plate through which light propagates;
Light supply means disposed on a side of the light guide plate to provide light to the light guide plate;
A printed circuit board disposed under the light guide plate and the light supply means, the printed circuit board including a conductive pattern and a dummy pattern disposed between the lines forming the conductive pattern;
Backlight unit comprising a. The backlight unit of claim 10, wherein the conductive pattern and the dummy pattern are made of the same material. The backlight unit of claim 10, wherein the dummy pattern is formed in a mesh pattern. The backlight unit of claim 10, wherein the dummy pattern is formed in a stripe pattern. The backlight unit of claim 10, further comprising a white ink layer formed on the conductive pattern and the dummy pattern. The backlight unit of claim 14, wherein the white ink layer has a thickness of 10 μm to 17 μm in a region where the dummy pattern is not formed. The backlight unit of claim 10, wherein an interval between the lines forming the dummy pattern is 100 μm to 400 μm. The backlight unit of claim 10, wherein the light supply means comprises a light emitting element. The backlight unit of claim 10, wherein the conductive pattern is made of copper.
KR1020100004116A 2010-01-15 2010-01-15 Printed circuit board and backlight unit having the same KR20110084062A (en)

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Application Number Priority Date Filing Date Title
KR1020100004116A KR20110084062A (en) 2010-01-15 2010-01-15 Printed circuit board and backlight unit having the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100004116A KR20110084062A (en) 2010-01-15 2010-01-15 Printed circuit board and backlight unit having the same

Publications (1)

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KR20110084062A true KR20110084062A (en) 2011-07-21

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11994771B1 (en) * 2023-01-30 2024-05-28 Tcl China Star Optoelectronics Technology Co., Ltd. Drive backplate and display device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11994771B1 (en) * 2023-01-30 2024-05-28 Tcl China Star Optoelectronics Technology Co., Ltd. Drive backplate and display device

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