KR20120006757A - Metal printed circuit board panel and method of fabricating the same, and method of fabricating liquid crystal display device module - Google Patents

Abstract

PURPOSE: A metal PCB(Printing Circuit Board) panel, manufacturing method thereof, and liquid crystal display apparatus module manufacturing method are provided to reduce manufacturing costs without additionally including a jig unit. CONSTITUTION: Plural opening units are extended according to a first direction. A metal PCB(10) for including plural light emitting diodes is located between the opening units. A cutting line is formed between an outline unit and both ends of the metal PCB. The one side of the cutting line includes a groove. A wiring pattern is changed in a metal PCB area. A back light unit and a liquid display panel are modulated.

Description

Metal printed circuit board panel and method of fabricating the same, and method of fabricating liquid crystal display device module

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal PCB panel, and more particularly, to a metal PCB panel, a method for manufacturing the same, and a method for manufacturing a liquid crystal display device module.

In the recent rapid development of new image media, light emitting diodes (LEDs) have been widely used as light sources for display devices such as liquid crystal display devices, having features such as small size, low power consumption, and high reliability.

As described above, a plurality of light emitting diodes used as light sources are arranged on the substrate in a plurality of light emitting diodes arranged along the longitudinal direction of the substrate. As such, as a substrate on which a light emitting diode is mounted, recently, a metal printed circuit board (PCB) having excellent heat dissipation function using a metal material as a base has been used.

In the metal PCB, an insulating layer is formed on a base layer made of a metal material, and a wiring pattern is formed on the insulating layer. As such, the base layer is made of a metal material, thereby effectively dissipating heat generated from the light emitting diodes.

Such a conventional metal PCB is separated from the metal PCB panel by performing a press punch process on the metal PCB panel which is a mother substrate. That is, a plurality of metal PCB is manufactured in the metal PCB panel, such a plurality of metal PCB is arranged in parallel spaced apart from each other at regular intervals.

For a plurality of metal PCBs prepared as described above, the punching process is performed to punch the metal PCBs. Accordingly, the plurality of metal PCBs are separated in a unit unit from the metal PCB panel. Thereafter, the separated metal PCB is packaged in a single unit.

This series of processes is carried out by the so-called metal PCB manufacturers, and the packaged metal PCB is delivered to the so-called LCD manufacturers.

The LCD manufacturer mounts a large number of metal PCBs delivered in a single unit on a jig, and then mounts the light emitting diodes on the metal PCB. When the mounting of the light emitting diode is completed, the metal PCB is detached from the jig.

However, as described above, a process of separating the metal PCB from the metal PCB panel in a unit unit after manufacturing is preceded, which causes the following problems.

After the separation of the metal PCB, the washing process for the single unit metal PCB is not easy, which makes it vulnerable to foreign material defects.

In addition, when the final inspection of the metal PCB is in progress, it is not easy to deal with the metal PCB of the unit unit work time is delayed.

In addition, the packaging time of the metal PCB in a single unit is not easy, the packaging time is delayed.

In addition, the jig should be additionally provided for ease of operation when mounting the light emitting diode, and additional work for mounting and detaching the jig is required. And, the cost for the jig is additionally required.

As described above, when the metal PCB is manufactured and used by the conventional method, problems such as a decrease in production yield and work efficiency and an increase in cost occur.

The present invention provides a metal PCB panel, a method for manufacturing the same, and a method for manufacturing a liquid crystal display module, which can improve production yield, work efficiency, and reduce cost in manufacturing and using a metal PCB on which a light emitting diode is mounted. .

In order to achieve the above object, the present invention, the outer portion; A plurality of openings extending along the first direction; A plurality of light emitting diode mounting metal PCBs extending in a first direction and positioned between the openings adjacent to each other, wherein both ends of the light emitting diode mounting metal PCB are connected to the outer portion; to provide.

Here, a cutting line may be formed between both ends of the metal PCB and the outer portion.

The cross section of the cutting line may be formed as a groove having a "V" shape.

Ends of the neighboring openings may be bent in the width direction of the light emitting diode mounting metal PCB positioned therebetween so as to face each other.

In another aspect, the present invention, the outer region; A plurality of cutting regions extending along the first direction; A method of manufacturing a metal PCB panel extending in a first direction and defining a metal PCB region, which is a region for mounting a light emitting diode located between adjacent cutting regions, wherein a wiring pattern is formed in the metal PCB region. Steps; It provides a method of manufacturing a metal PCB panel comprising the step of removing the cutting area to form an opening.

The method may further include forming a cutting line between both ends of the metal PCB region and the outer region.

The cross section of the cutting line may be formed as a groove having a "V" shape.

Ends of the neighboring cutting regions may be bent along the width direction of the metal PCB region disposed therebetween so as to face each other.

In still another aspect, the present invention provides a method for manufacturing a metal PCB panel including a plurality of metal PCBs extending in a first direction and positioned between adjacent openings, and both ends connected to an outer portion thereof; Mounting light emitting diodes on a plurality of metal PCBs of the metal PCB panel; Separating the plurality of metal PCBs on which the light emitting diodes are mounted, from the metal PCB panel; It provides a liquid crystal display module module manufacturing method comprising the step of modularizing the backlight unit and the liquid crystal panel including the separated metal PCB.

Here, in the prepared metal PCB panel, a cutting line is formed between both ends of the metal PCB and the outer portion, and through the cutting process along the cutting line, the metal PCB can be separated from the metal PCB panel.

The cross section of the cutting line may be formed as a groove having a "V" shape.

Ends of the neighboring openings may be bent along the width direction of the metal PCB positioned therebetween so as to face each other.

In the present invention, various operations can be performed in a state where the metal PCB is not separated from the metal PCB panel.

Therefore, the washing process for the metal PCB performed after the openings can be easily performed.

Then, the final inspection work on the metal PCB becomes easy, and the inspection time is shortened.

In addition, the packaging is carried out in the unit of the metal PCB panel, the operation is easy and the packaging time is shortened.

In addition, the jig used for mounting the light emitting diode device does not need to be additionally provided as in the related art, and the work for attaching and detaching the jig does not need to be involved. Then, the cost for the jig can be reduced.

As a result, in manufacturing and using the metal PCB on which the light emitting diode is mounted, it is possible to achieve an effect of improving production yield and work efficiency and reducing costs.

1 is a plan view schematically showing a metal PCB mounted with a light emitting diode device according to an embodiment of the present invention.
2 is a cross-sectional view taken along the line II-II of FIG. 1.
3A and 3B are plan views schematically illustrating a method of manufacturing a metal PCB panel according to an embodiment of the present invention.
4A and 4B are plan views schematically illustrating a method of mounting a light emitting diode device and a method of separating a metal PCB according to an embodiment of the present invention.
5 and 6 schematically show a metal PCB panel according to another embodiment of the present invention.
7 is a schematic cross-sectional view of a liquid crystal display module including a metal PCB mounted with a light emitting diode device manufactured according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

1 is a plan view schematically illustrating a metal PCB on which a light emitting diode device is mounted according to an exemplary embodiment of the present invention, and is a cross-sectional view taken along a cutting line II-II of FIG. 1.

As shown, on the metal PCB 10 according to the embodiment of the present invention, a plurality of light emitting diode elements 20 are arranged along the extension direction, that is, the longitudinal direction of the metal PCB 10, on the metal PCB 10. It is mounted.

The metal PCB 10 may include a base layer 11, an insulating layer 12 on the base layer, and a wiring pattern 13 on the insulating layer.

The base layer 11 corresponding to the base of the metal PCB 10 may be made of a metal material having excellent heat dissipation characteristics. For example, the base layer may be formed using aluminum (Al). Accordingly, it is possible to perform an effective heat dissipation function for the heat generated from the light emitting diode device 20.

The insulating layer 12 is positioned between the wiring pattern 13 and the base layer 11 of the metal material to electrically insulate them. As the insulating layer 12, a resin-based material may be used.

The wiring pattern 13 is in contact with the light emitting diode chip 20. For example, the wiring pattern 13 transmits the light emitting diode driving power, and the driving power thus transmitted is transmitted to the light emitting diode element 20.

The light emitting diode device 20 may include a housing 21 serving as a case, a light emitting diode 22 emitting light, and a transparent resin layer 23 in which phosphors are mixed. The light emitting diode 22 emits light by combining electrons and holes. For example, the light emitting diode 22 may include a p-n semiconductor multilayer film, a p electrode, and an n electrode. The transparent resin layer 23 may be made of, for example, a material in which a phosphor and a resin are mixed. Therefore, the light emitting diode device 20 may emit light to the outside by mixing the light emitted from the light emitting diode 22 and the light emitted by the phosphor of the transparent resin layer 23.

Meanwhile, the light emitting diode device 20 may further include various components, for example, mechanical components, electrical components, optical components, and the like, in addition to the above-described configuration.

In relation to the metal PCB 10 according to the embodiment of the present invention as described above, unlike the prior art, the light emitting diode device 20 in a state where a plurality of metal PCB 10 is mounted on the metal PCB panel of the mother substrate Then, the metal PCB 10 is separated into unit units. As such, a method of manufacturing a metal PCB panel in a state in which a plurality of metal PCBs 10 are not separated by a single unit may be referred to as a kit array type.

Hereinafter, a metal PCB panel manufacturing method, a light emitting diode mounting method, and a metal PCB separation method according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

First, a metal PCB panel manufacturing method of a so-called metal PCB panel manufacturer will be described with reference to FIGS. 3A and 3B.

3A and 3B are plan views schematically illustrating a method of manufacturing a metal PCB panel according to an embodiment of the present invention.

Referring to FIG. 3A, a metal PCB panel 1 having a base layer 11 made of a metal material is prepared as a mother substrate. In the metal PCB panel 1, a plurality of metal PCB regions R1, a plurality of cutting regions R2, and an outer region R3 may be defined.

Here, the metal PCB region R1 corresponds to a region functioning as the metal PCB 10 by a subsequent step. The cutting region R2 is a region located on both sides of the metal PCB region R2 in the width direction, and corresponds to a region removed by a subsequent cutting process. The outer region R3 corresponds to a region located outside the metal PCB region R1 and the cut region R2.

The metal PCB region R1 extends along the first direction. The plurality of metal PCB regions R1 are arranged in parallel with each other along a second direction perpendicular to the first direction.

The cutting region R2 is located above and below the metal PCB region R1 and extends along the first direction. Meanwhile, both ends of the cutting region R2 may further include the bending region R2_b bent in the second direction. That is, the bending area R2_b corresponds to an area extending along the second direction in an area extending along the first direction of the cutting area R2. Such bending region R2_b extends to a part of the side surface of the end of the corresponding metal PCB region R1.

Here, at both ends of the remaining cutting region R2 except for the cutting region R2 positioned at the uppermost and lowermost portions, the bending regions R2_b may be formed at both sides of the second direction, that is, the upper and lower sides. In addition, at both ends of the cutting region R2 positioned at the uppermost portion, the bending region R2_b may be formed in one side of the second direction, that is, in the lower direction, and each of both ends of the cutting region R2 positioned at the lowermost portion. The bending region R2_b may be formed in one side of the second direction, that is, in an upward direction.

Meanwhile, the bending regions R2_b of the cutting regions R2 adjacent to each other with the metal PCB region R1 interposed therebetween are spaced apart from each other without being connected to each other. In this way, the spaced apart areas between the bending regions R2_b of the cutting regions R2 adjacent to each other may be referred to as the protruding regions R3_p extending from the outer region R3. By this protruding region R3_p, the metal PCB region R1 and the outer region R3 are connected to each other.

In the state where the plurality of regions as defined above are defined, the insulating layer 12 is formed on the base layer 11. Here, the base layer 11 may be aluminum (Al) as a metal material having excellent heat dissipation properties, and the insulating layer 12 may be made of a resin-based material.

Next, a metal material is deposited on the insulating layer 12 to form a metal layer. For such a metal layer, a patterning process is performed. For example, a photoresist layer is formed on the metal layer, and then an exposure process is performed on the photoresist layer using an exposure mask, and then a development process is performed on the exposed photoresist layer to form a photoresist pattern. Next, the etching process is performed on the metal layer using the photoresist pattern as an etching mask, and then the photoresist pattern is removed. By patterning the metal layer through such a series of processes, the desired wiring pattern 13 is formed in the metal PCB region R1.

Through the above-described process, the metal PCB 10 can be manufactured in the metal PCB region R1.

Next, referring to FIG. 3B, a process of removing the cutting region R2 is performed. For example, the cutting region R2 is removed through a cutting process such as a press punch. Accordingly, an opening op is formed in the cutting region R2.

Meanwhile, during the cutting process, a cutting line CL may be formed between the metal PCB region R1 and the protruding region R3_p of the outer region R3. The cutting line CL is formed to easily separate the metal PCB 10 from the metal PCB panel 1 after mounting the light emitting diode device 20 on the metal PCB 10. The formation of the cutting line CL is performed by forming a groove up to a predetermined depth in the thickness direction on the upper surface of the metal PCB panel 1. As the cutting line CL, for example, a V-cutting line CL in which the shape of the cross-sectional groove is "V" may be formed.

Meanwhile, the process of forming the cutting line CL may be performed before or after the removal of the cutting region R2.

Through the process as described above, the metal PCB panel 1 can be manufactured. In the metal PCB panel 1 manufactured as described above, the cutting region R2 is removed to form an opening op, and the plurality of metal PCBs 10 are not separated from the metal PCB panel 1 and the outer region R3 is removed. Will be connected to

The metal PCB panel 1 manufactured as described above is manufactured by a so-called metal PCB panel manufacturer. The metal PCB panel manufacturer packs the metal PCB panel 1 manufactured as described above in panel units, and delivers it to a so-called LED mounting company such as an LCD manufacturer.

Hereinafter, a method of mounting a light emitting diode device and a method of separating a metal PCB from an LCD manufacturer will be described with reference to FIGS. 4A and 4B.

4A and 4B are plan views schematically illustrating a method of mounting a light emitting diode device and a method of separating a metal PCB according to an exemplary embodiment of the present invention.

As shown in FIG. 4A, a process of mounting the light emitting diode device 20 is performed on the metal PCB panel 1 delivered with a plurality of metal PCBs 10 mounted thereon. In the mounting step, the light emitting diode elements 20 are mounted on the metal PCB 10 so that the plurality of light emitting diode elements 20 are arranged along the longitudinal direction of each metal PCB 10.

Next, as shown in FIG. 4B, a cutting process is performed along the cutting line CL of the metal PCB panel 1. As described above, the cutting line CL is formed between the protruding region R3_p of the outer region R3 and the metal PCB region R1, that is, the metal PCB 10.

By performing the cutting process along the cutting line CL as described above, the plurality of metal PCBs 10 mounted on the metal PCB panel 1 can be separated from the metal PCB panel 1.

As described above, the metal PCB 10 separated from the metal PCB panel 1 in a unit unit is assembled with the liquid crystal panel and a plurality of other components, thereby completing the liquid crystal display device. The liquid crystal display device thus completed may be referred to as a liquid crystal display module.

5 and 6 schematically show a metal PCB panel according to another embodiment of the present invention. 5 and 6 show the states of the metal PCB channels before and after the cutting region of the metal PCB panel is removed.

The metal PCB panel 1 shown in Figs. 5 and 6 is similar to the metal PCB panel 1 shown in Figs. 3 and 4 described above except for the cutting region R2. Therefore, in the following description, the description of the matters similar to those of FIGS. 3 and 4 described above may be omitted.

5 and 6, in the metal PCB panel 1 according to another embodiment of the present invention, the cutting region R2 may not have a bending region (see R2_b in FIG. 3A). That is, the cutting region R2 has a region extending in the first direction similarly to the metal PCB region R1, and both ends thereof may coincide with both ends of the metal PCB region R1.

As such, since the cutting region R2 does not have a separate bending region, the outer region R3 may also have no protruding region (see R3_p in FIG. 3A).

According to the configuration as described above, the cutting line CL can be formed to substantially match both ends of the cutting area (R2).

For the metal PCB panel 1 manufactured as described above, as shown in FIGS. 4A and 4B, a light emitting diode device mounting process and a metal PCB separation process are performed. Accordingly, the metal PCB 10 in which the light emitting diode elements (see 20 in FIG. 4A) are mounted can be separated into unit units.

According to the embodiments of the present invention as described above, the metal PCB panel 1 is manufactured and packaged with a plurality of metal PCB 10 is connected, the light emitting diode device for the metal PCB panel 1 in this state 20 is mounted on the metal PCB 10, after which the metal PCB 10 is separated from the metal PCB panel 1.

As such, in the embodiment of the present invention, various operations can be performed without the metal PCB being separated from the metal PCB panel.

Therefore, the washing process for the metal PCB performed after the openings can be easily performed.

Then, the final inspection work on the metal PCB becomes easy, and the inspection time is shortened.

In addition, the packaging is carried out in the unit of the metal PCB panel, the operation is easy and the packaging time is shortened.

In addition, the jig used for mounting the light emitting diode device does not need to be additionally provided as in the related art, and the work for attaching and detaching the jig does not need to be involved. Then, the cost for the jig can be reduced.

As a result, in manufacturing and using the metal PCB on which the light emitting diode is mounted, it is possible to achieve an effect of improving production yield and work efficiency and reducing costs.

Hereinafter, a liquid crystal display module including a metal PCB having a light emitting diode device manufactured according to an embodiment of the present invention will be described with reference to FIG. 7.

7 is a schematic cross-sectional view of a liquid crystal display module including a metal PCB on which a light emitting diode device manufactured according to an embodiment of the present invention is mounted.

Referring to FIG. 7, the liquid crystal display device module 100 according to the embodiment of the present invention includes a liquid crystal panel 310, a backlight unit 320, a top case 340, and a bottom case. a case 350 and a main supporter 330.

The liquid crystal panel 310 includes first and second substrates 312 and 314 facing each other, and a liquid crystal layer (not shown) filled between the first and second substrates 312 and 314.

The first substrate 312, which is a lower substrate, is referred to as an array substrate. Although not illustrated, the first substrate 312 may be formed with gate wirings and data wirings crossing each other to define pixel regions. In the pixel region, a switching transistor connected to the gate wiring and a data wiring and a pixel electrode connected to the switching transistor may be formed.

The second substrate 314, which is an upper substrate, is referred to as a color filter substrate or an opposing substrate. Although not shown, a black matrix, a color filter layer, and a common electrode may be formed on the second substrate 314. The black matrix may be formed to correspond to the gate wiring, the data wiring, and the switching transistor. The color filter layer may be formed to correspond to the pixel area. The common electrode is positioned on the black matrix and the color filter layer and faces the pixel electrode.

First and second polarizers 319a and 319b may be positioned on outer surfaces of the first and second substrates 312 and 314, respectively. Each of the first and second polarizing plates 310a and 319b has a polarization axis. Each of the first and second polarizing plates 319a and 319b pass light of a polarization component parallel to the corresponding polarization axis.

The backlight unit 320 may include a light emitting diode device 20 mounted on the metal PCB 10, a light guide plate 323, a reflector plate 325, and a plurality of optical sheets 321.

The plurality of light emitting diode elements 20 mounted on the metal PCB 10 are disposed along one side of the light guide plate 323, that is, the light incident surface, and emit light toward the light incident surface of the light guide plate 323.

The light guide plate 323 receives the light emitted from the light emitting diode device 20, and the light incident on the light guide plate 323 is uniformly directed to the front surface of the light guide plate 323 while traveling in the light guide plate 323 by total reflection. It can spread to provide surface light sources.

On the other hand, in order to provide a more efficient surface light source, a pattern of a specific shape may be formed on at least one of the rear surface or the upper surface of the light guide plate 323.

The reflecting plate 325 is positioned on the rear surface of the light guide plate 323. As a result, the light emitted through the rear surface of the light guide plate 323 is reflected toward the liquid crystal panel 310, thereby improving luminance.

The plurality of optical sheets 321 are positioned on the upper surface of the light guide plate 323. For example, the plurality of optical sheets 321 may include a diffusion sheet and at least one light collecting sheet, for example, a prism sheet. The plurality of optical sheets 321 may diffuse and / or condense the light emitted through the light guide plate 323 to provide a more uniform surface light source to the liquid crystal panel 310.

The liquid crystal panel 310 and the backlight unit 320 as described above may be coupled through the top case 340, the bottom case 350, the main supporter 330, and the like as mechanical parts.

The top case 340 may have a rectangular frame having a cross section bent in a shape to cover the front and side edges of the liquid crystal panel 310. An opening is formed in the front surface of the top gay 340 such that an image implemented in the liquid crystal panel 310 can be displayed to the outside.

The bottom case 350 corresponds to a configuration in which the liquid crystal panel and the backlight units 310 and 320 are seated so as to be the basis for assembling the entire apparatus of the liquid crystal display device module 100. The bottom case 350 may have a square plate shape and four edges thereof may be vertically bent at a predetermined height.

The main supporter 330 may be seated on the bottom case 350 and may have a rectangular frame that surrounds edges of the liquid crystal panel and the backlight units 310 and 320. The main supporter 330 as described above may be combined with the top case and the bottom case 340 and 350.

On the other hand, as described above, the top case 340 may be called a top cover or a case top. The main supporter 330 may be called a support main, a guide panel, or a mold frame. In addition, the bottom case 350 may be referred to as a cover bottom or a bottom cover.

Although not shown, the liquid crystal display module 100 may further include a driving circuit component for driving the liquid crystal panel 310. Such a driving circuit component may include, for example, a control PCB, a source PCB, a source driving circuit, and a gate driving circuit. In this case, for example, the source driving circuit and the gate driving circuit may be mounted on the flexible circuit film, respectively, and connected to the liquid crystal panel 310 through the flexible circuit film. On the other hand, the driving circuit components presented above as an example, various other driving circuit components may be used, and two or more circuit components may be integrated and used.

An example of a method of manufacturing the above-described liquid crystal display module 100 will be briefly described with reference to FIG. 7.

After manufacturing the first and second substrates 312 and 314, the liquid crystal panel 310 is manufactured by filling and bonding liquid crystals between the two substrates 312 and 314. The polarizing plates 310a and 319b are attached to the outer surface of the liquid crystal panel 310 manufactured as described above.

On the other hand, as described above, the light emitting diode element 20 is mounted on a metal PCB panel (see 1 in FIG. 4A) in which a plurality of metal PCBs 10 are mounted, and then the metal PCB 10 is mounted on the metal PCB. Remove from panel.

Next, as the components constituting the liquid crystal panel 310, the backlight unit 320, a metal PCB 10 on which the light emitting diode element 20 is mounted, a light guide plate 323, a reflector plate 325, and a plurality of components. The optical sheet 321 is modularized using the top case 340, the bottom case 350, the main supporter 330, and the like. In such a modularization process, a process of connecting the driving circuit component for driving the liquid crystal panel 310 to the liquid crystal panel 310 may be performed.

Through the above processes, it is possible to manufacture the liquid crystal display module 100 according to the embodiment of the present invention.

In the above-described liquid crystal display device module 100, the case where the light emitting diode element 20 is located on one side portion of the liquid crystal panel 310 has been described as an example. On the other hand, in order to improve the brightness, the light emitting diode device 20 may be located on both side portions of the liquid crystal panel 310 facing each other.

Further, in addition to the so-called edge type in which the light emitting diode elements 20 are positioned on the side surfaces of the liquid crystal panel 310, a plurality of light emitting diode elements 20 may be disposed directly below the liquid crystal panel 310. Direct type may be adopted. In this case, when the direct type is used, the light guide plate 323 may not be used.

Embodiment of the present invention described above is an example of the present invention, it is possible to change freely within the scope included in the spirit of the present invention. Accordingly, the invention includes modifications of the invention within the scope of the appended claims and their equivalents.

1: Metal PCB Panel 10: Metal PCB
20: light emitting diode element
op: opening R1: metal PCB area
R3: Outer area

Claims (12)

Outer periphery;
A plurality of openings extending along the first direction;
A plurality of light emitting diode mounting metal PCBs extending in a first direction and positioned between the openings adjacent to each other;
Both ends of the light emitting diode mounting metal PCB are connected to the outer portion.
Metal PCB panels.
The method of claim 1,
Cutting lines are formed between both ends of the metal PCB and the outer portion.
Metal PCB panels.
The method of claim 2,
The cross section of the cutting line is formed with a groove of "V" shape
Metal PCB panels.
The method of claim 1,
Ends of the neighboring openings are bent in the width direction of the LED mounting metal PCB positioned therebetween to be spaced apart from each other.
Metal PCB panels.
An outer region; A plurality of cutting regions extending along the first direction; In the method of manufacturing a metal PCB panel extending in a first direction, the metal PCB region is defined for mounting the light emitting diodes located between the adjacent cutting regions.
Forming a wiring pattern in the metal PCB region;
Removing the cutting region to form an opening
Method of manufacturing a metal PCB panel comprising a.
The method of claim 5, wherein
The method may further include forming a cutting line between both ends of the metal PCB region and the outer region.
Method of manufacturing metal PCB panels.
The method according to claim 6,
The cross section of the cutting line is formed with a groove of "V" shape
Method of manufacturing metal PCB panels.
The method of claim 5, wherein
The ends of the adjacent cutting regions are bent along the width direction of the metal PCB region located therebetween to face each other and to be spaced apart from each other.
Method of manufacturing metal PCB panels.
Preparing a metal PCB panel extending in a first direction and positioned between neighboring openings, each end including a plurality of metal PCBs connected to an outer portion thereof;
Mounting light emitting diodes on a plurality of metal PCBs of the metal PCB panel;
Separating the plurality of metal PCBs on which the light emitting diodes are mounted, from the metal PCB panel;
Modularizing the backlight unit and the liquid crystal panel including the separated metal PCB;
Liquid crystal display module manufacturing method comprising a.
The method of claim 9,
In the prepared metal PCB panel, a cutting line is formed between both ends of the metal PCB and the outer portion,
Through the cutting process along the cutting line, the metal PCB is separated from the metal PCB panel
Method of manufacturing LCD module.
The method of claim 10,
The cross section of the cutting line is formed with a groove of "V" shape
Method of manufacturing LCD module.
The method of claim 9,
Ends of the neighboring openings are bent along the width direction of the metal PCB positioned therebetween to face each other and to be spaced apart from each other.
Method of manufacturing LCD module.

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