KR20110074320A - Low temperature and fast curable anisotropic conductive film composition, and low temperature and fast curable anisotropic conductive film using the same - Google Patents

Abstract

PURPOSE: A low-temperature quick-curable anisotropic conductive film composition is provided to ensure excellent electrical characteristic. CONSTITUTION: A low-temperature quick-curable anisotropic conductive film contains: 100 weight parts of epoxy resin containing cycloexane epoxy resin; 0.05-30 weight parts of sulfonium hardening agent; 20-300 weight parts of binder resin; 1-80 weight parts of conductive particles. The sulfonium hardening agent is selected from alipathic sulfonium salt, aromatic sulfonium salt, and mixture thereof.

Description

LOW TEMPERATURE AND FAST CURABLE ANISOTROPIC CONDUCTIVE FILM COMPOSITION, AND LOW TEMPERATURE AND FAST CURABLE ANISOTROPIC CONDUCTIVE FILM USING THE SAME}

The present invention relates to a composition for an anisotropic conductive film, and more particularly to a composition for an anisotropic conductive film capable of low temperature fast curing, including cyclohexane-based epoxy resin (Cycloaliphatic epoxide), sulfonium-based curing agent, binder resin and conductive particles will be.

In recent years, anisotropically conductive adhesives have been widely used as materials for electrically connecting electronic components such as semiconductor devices and circuit boards. Recently, the use of anisotropic conductive films is becoming more diversified due to the shortening and thinning of electronic components. Among them, in LCD mounting technology, COF (Chip On Film), COG (Chip On Glass), FOG (FPCB On Glass) and OLB ( Anisotropic conductive films are used for many applications such as outer lead bonding.

The anisotropic conductive film is composed of an insulating resin portion which fixes the conductive particles and the conductive particles forming the electrical passage to maintain electrical connection reliability and impart insulation between the electrode and the neighboring electrode. As conductive particles, metal coating particles having elasticity have recently been insulated and used. Insulating resins, which occupy a large part of the anisotropic conductive adhesive and express the reliability and insulation properties of the anisotropic conductive adhesive, remain stable at room temperature without reaction, and then are heated. The thermosetting resin which hardening starts and a structure becomes dense is used. The thermosetting resin generates heat during heat curing, and after completion of curing, the temperature raised by the applied temperature and the exotherm is removed to lower the temperature, and at this time, curing shrinkage is performed according to the volume change according to the temperature. When the shrinkage occurs, the dimensional stability of the ACF is poor and the failure rate is increased.

In particular, in the field of precision electronic devices, the electrode width and the electrode spacing have been narrowed considerably due to the demand for higher density and higher precision of circuits. It is rising.

In order to solve these problems, an adhesive capable of curing at a low temperature and in a short time is required. In order to achieve such low temperature fast curing, it is necessary to use a thermal latent catalyst having practical storage stability near room temperature and having a low activation energy.

An object of the present invention is to provide a composition for a low temperature fast curing type anisotropic conductive film comprising a cyclohexane-based epoxy resin, a sulfonium-based curing agent, a binder resin and conductive particles.

Still another object of the present invention is to provide a low temperature fast curing type anisotropic conductive film formed of the composition for a low temperature fast curing type anisotropic conductive film.

In one embodiment, the present invention provides a composition comprising: a) an epoxy resin comprising a cyclohexane-based epoxy resin; b) sulfonium-based curing agents; c) binder resins; And d) relates to a composition for low temperature fast curing type anisotropic conductive film containing conductive particles.

The composition for a low temperature hardening type anisotropic conductive film of the present invention simultaneously uses a cyclohexane-based epoxy resin and a sulfonium-based curing agent, suitably contains a binder resin and conductive particles, and in particular, practical storage stability at around room temperature as a cationic latent curing agent. By applying a sulfonium-based cationic latent curing agent, which is a thermal latent catalyst having a low activation energy, enables rapid curing at low temperatures and improves electrical properties.

Hereinafter, the configuration of the present invention will be described in detail.

a) epoxy resin

The epoxy resin of the present invention is characterized in that it comprises a cyclohexane-based epoxy resin. The cyclohexane-based epoxy resin is preferably a compound having two or more epoxy groups in one molecule and having an epoxy ring linked with cyclohexane, for example, 3,4-epoxycyclohexylmethyl-3,4-epoxy Cyclohexane carboxylate, bis (3,4-epoxycyclohexyl) adipate, vinylcyclohexene dioxide, 2- (3,4-epoxycyclohexyl-5,5-spiro-3,4-epoxy) cyclohexane -Meta-dioxane and mixtures thereof can be used, but not limited thereto.

In the case of such cyclohexane-based epoxy, the bonding strength of the epoxy ring is considerably weaker than other general epoxy, and ring opening is more different than other epoxy due to the attack of acid generated from the curing agent. It starts faster and allows the epoxy polymerization to proceed with a lower external activation energy. Thus, such cyclohexane-based epoxy resins, when combined with cationic latent curing agents, allow stable and rapid curing even at low temperatures.

The epoxy resin of the present invention may further include a glycidyl group-containing epoxy resin in order to control the curing rate of the cyclohexane-based epoxy resin. The glycidyl group-containing epoxy resin has a lower reactivity than the cyclohexane-based epoxy resin, and is characterized by having a reactivity in a slightly higher range.

As the glycidyl group-containing epoxy resin, bisphenol A type epoxy resins, bisphenol F type epoxy resins, polyfunctional phenol-novolac epoxy resins, cresol epoxy resins, and mixtures thereof may be used. Preferably, bisphenol A type and bisphenols are used. Although an F type epoxy resin is mixed and used, it is not limited to this.

The bisphenol A-based epoxy resin can be used without limitation bifunctional or polyfunctional bisphenol A epoxy resin containing two or more glycidyl groups per molecule, for example YD-128 (Kukdo Chemical), YD-134 (National Highway) Chemical), JER828 (JER), JER834 (JER), and the like. In addition, the bisphenol F-based epoxy resin can be used without limitation bifunctional or polyfunctional bisphenol F-type epoxy resin containing two or more glycidyl groups per molecule, for example YDF-170 (Kukdo Chemical), YDF-2004 (Kukdo Chemical), JER4007 (JER), JER4010 (JER) and the like can be used.

The cyclohexane-based epoxy resin and bisphenol A type, bisphenol F type epoxy resin may be included in 10 to 90% by weight based on the total content of the composition. If the content is less than 10% by weight relative to the total content of the composition, the physical properties of the cured final adhesive may be low. If the content exceeds 90% by weight, the curing shrinkage may be large and the adhesive strength may be reduced.

b) Sulfonium  Hardener

The composition of the present invention uses a sulfonium-based curing agent as a cationic latent curing agent, which serves to catalyze the curing reaction by ring-opening cationic polymerization of the epoxy ring of the epoxy resin. Since the sulfonium-based curing agent is used by mixing with the epoxy resin at room temperature, it should not have reactivity with the epoxy resin at room temperature after mixing, it has to be active at a certain temperature or more to be active with the epoxy resin to be expressed physical properties.

As the sulfonium-based curing agent that can be used in the present invention, aliphatic sulfonium salts and aromatic sulfonium salt compounds having high cation generation efficiency due to thermal activation energy may be used alone or in combination, and preferably aromatic sulfonium salt compounds.

The sulfonium salt compound has a storage stability near room temperature and has a low activation energy, and in particular, it is possible to induce fast and stable curing even at low temperatures. Examples of the sulfonium salt compound include SI-60L, SI-80L, SI-100L (Samshin Chemical, Japan), Adeka Optomer SP-150, Adeka Optomer SP-170 (manufactured by Asahi Denka Kogyo Co., Ltd.), CI-5102 (Made by Nippon Soda Co., Ltd.), silacure UVI-6976, silacure UVI-6992 (made by Dow Chemical Co., Ltd.), etc. are mentioned.

The sulfonium-based curing agent is preferably included in 0.05 to 30 parts by weight based on 100 parts by weight of the epoxy resin. If the content is less than 0.05 parts by weight, hardening does not occur sufficiently, and if it exceeds 30 parts by weight, compatibility may be reduced.

In addition, the composition of the present invention is an onium salt compound such as an aromatic diazonium salt, an aromatic iodine aluminum salt, a phosphonium salt, a pyridinium salt, a serenium salt, in addition to a sulfonium-based curing agent as a cationic latent curing agent; Complex compounds such as metal arene complexes and silanol / aluminum complexes; Tolylato groups, such as benzoin tosylato- and o-nitrobenzyl tosylato-, may be used to further include a compound which has an electron capture function. When such a cation generator forms a salt structure, hexafluoroantimonate, hexafluorophosphate, tetra fluoro borate, pentafluorophenyl borate and the like are suitable as counter ions in forming a salt in view of reactivity.

c) binder resin

In the present invention, the binder resin is used for thickening or filming in the composition for anisotropic conductive films.

The binder resin may be used by appropriately adding a conventional polymer used in the art, and can be used without particular limitation as long as it does not inhibit the curing of the epoxy resin. Specifically, the binder resin is a polyimide resin, polyamide resin, phenoxy resin, poly methacrylate resin, poly acrylate resin, polyurethane resin, polyester resin, polyester urethane resin, polyvinyl butyral resin, sty Styrene-butyrene-styrene (SBS) resins and epoxy modified bodies, styrene-ethylene-butylene-styrene (SEBS) resins and modified substances thereof, acrylonitrile butadiene rubber (NBR) and its hydrogenated bodies Can be. The polymer may also contain a siloxane bond or a fluorine substituent.

The larger the weight average molecular weight of the binder resin, the easier it is to form a film, but is not particularly limited. Specifically, the weight average molecular weight of the binder resin is preferably 5,000 to 150,000, more preferably 10,000 to 80,000. When the weight average molecular weight of the binder resin is less than 5,000, the film formation may be lowered, and when the weight average molecular weight of the binder resin exceeds 150,000, compatibility with other components may be worsened.

The binder resin is preferably included in 20 to 300 parts by weight based on 100 parts by weight of the epoxy resin. If the content is less than 20 parts by weight, the anisotropic conductive film may not be formed, and if it exceeds 300 parts by weight, the ratio of epoxy and the curing agent participating in other hardening parts may be too low to show thermosetting characteristics.

d) conductive particles

The electroconductive particle used for this invention can use the metal particle, or the thing coated with metal, such as gold or silver, on the organic and inorganic particle. Moreover, in order to ensure the electrical insulation at the time of excessive use, electroconductive particle can also be insulated and used.

Specifically, the conductive particles are metal particles containing Au, Ag, Ni, Cu, Pb and the like; carbon; Particles coated with a metal containing Au, Ag, Ni, etc., using resins containing polyethylene, polypropylene, polyester, polystyrene, polyvinyl alcohol, and the like, and modified resins thereof as particles; Insulated electroconductive particle etc. which further coated the insulating particle on it can be used.

The size of the conductive particles can be selected and used depending on the application in the range of 2 to 30 ㎛ by the pitch of the circuit to be applied.

It is preferable that the said electroconductive particle is contained in 1 to 80 weight part with respect to 100 weight part of said epoxy resins. When the content is less than 1 part by weight, the adhesive formed from the composition for anisotropic conductive film of the present invention may not exhibit sufficient electrical conductivity. When the content is more than 80 parts by weight, the insulation reliability between the connection circuits may not be secured, and thus the anisotropic conductivity may not be exhibited. Can be.

On the other hand, the composition of the present invention may further include a solvent. The solvent uniformly mixes the epoxy resin, the sulfonium-based curing agent, the binder resin, and the conductive particles, and lowers the viscosity of the composition to facilitate the manufacture of the film.

The solvent may be used without limitation as long as it is conventional, and specifically, toluene, xylene, propylene glycol monomethyl ether acetate, benzene, acetone, methyl ethyl ketone, tetrahydrofuran, dimethylformaldehyde, cyclohexanone, etc. may be used. .

The solvent is preferably included in 10 to 300 parts by weight based on 100 parts by weight of the epoxy resin. If the content is less than 10 parts by weight, it may not be easy to disperse between the raw materials, and if it exceeds 300 parts by weight, residual solvent may be present during drying to inhibit the physical properties of the anisotropic conductive film.

On the other hand, the composition for low-temperature fast curing type anisotropic conductive film of the present invention further includes additives such as polymerization inhibitors, antioxidants, heat stabilizers, curing accelerators, coupling agents for improving additional physical properties in a range that does not impair the basic physical properties can do.

The amount of the additive may be included in an amount of 0.01 to 5 parts by weight based on 100 parts by weight of the epoxy resin.

As the polymerization inhibitor, hydroquinone, hydroquinone monomethyl ether, p-benzoquinone, phenothiazine, and mixtures thereof may be used. In addition, as the antioxidant used for the purpose of preventing oxidation reaction and imparting thermal stability of the composition induced by heat, a branched phenolic or hydroxy cinnamate-based substance may be added. For example, tetrakis -(Methylene- (3,5-di-t-butyl-4-hydro cinnamate) methane, 3,5-bis (1,1-dimethylethyl) -4-hydroxy benzene propanoic acid thiol di- 2,1-ethanediyl ester, octadecyl 3,5-di-t-butyl-4-hydroxy hydrocinnamate (above manufactured by Ciba), 2,6-di-tertiary-p-methylphenol, and the like. As the curing accelerator for improving the reaction rate, at least one of a solid imidazole accelerator, a solid phase and a liquid amine curing accelerator can be used, etc. As the coupling agent, vinyl trichloro silane, vinyl trimethoxy silane, 3- Glycidoxy propyl trimethoxy silane, 3-methacryloxy propyl trimeth Silane, 2-aminoethyl-3-aminopropyl methyldimethoxy silane, 3-ureidopropyl triethoxy silane, and the like, and one or more of these various silane coupling agents may be used. It is not limited to kinds.

In addition, the composition for the low-temperature fast-curing anisotropic conductive film of the present invention has a size of about 5 to 20 nanometers (nm) surface-treated with an organic silane, in addition to the basic constituent factors and essential containing factors for achieving the object of the present invention. By including hydrophobic nano-silica particles having a smooth flow control according to the process conditions and the hardened structure of the cured anisotropic conductive film very hard to prevent expansion at high temperatures, thereby resulting in excellent initial adhesion and low connection It is also possible to manufacture an anisotropic conductive film that implements resistance.

Hydrophobic nano silica particles having a size of about 5-20 nanometers (nm) surface-treated with such organic silanes include Aerosil R-972, Aerosil R-202, Aerosil R-805, Aerosil R-812, Aerosil R-8200 (Degussa) and the like, and may be used in any kind, but is not necessarily limited thereto.

The composition for a low temperature fast-curing anisotropic conductive film of the present invention comprising the above components can improve the electrical connection characteristics of the packaging products generated during the circuit connection of various display devices and semiconductor devices, including liquid crystal display (LCD), in particular anisotropic There is an excellent effect in improving the indentation state and the connection resistance in the mounted state after curing of the conductive film.

As another aspect, the present invention relates to a low temperature fast curing type anisotropic conductive film formed of the composition for a low temperature fast curing type anisotropic conductive film.

The anisotropic conductive film of the present invention has a warpage degree after curing of less than 15 μm in 0.3 mmt glass, an initial resistance value of 1.8 Ω or less, and an increase in connection resistance value over time, so that electrical connection is small. It has excellent reliability.

The method for forming the anisotropic conductive film does not require a special device or equipment, and the epoxy resin, sulfonium-based curing agent, binder resin and conductive particles are dissolved in a solvent to liquefy to a certain time within the speed range that the components are not pulverized After stirring to obtain a uniform mixture, it is applied to the release film to a thickness of 10 ~ 50 ㎛ and then dried for a period of time to obtain a single layer anisotropic conductive film. In the present invention, the above-described process may be repeated two or more times to obtain a low temperature fast curing type anisotropic conductive film having a two or more multilayer structure.

The composition for a low temperature fast curing type anisotropic conductive film according to the present invention is capable of low temperature fast curing, and has an excellent electrical property.

In addition, the anisotropic conductive film according to the present invention can minimize the temperature during the main compression bonding of the LCD mounting process to minimize the warpage caused by the temperature expansion, shrinkage, curing shrinkage of the anisotropic conductive film of the bonding process By increasing the yield and reducing the deformation of the final product it can be usefully used in the manufacture of liquid crystal display and image display device that requires high connection reliability and color unevenness (Mura).

Hereinafter, the configuration and operation of the present invention through the preferred embodiment of the present invention will be described in more detail. However, the following examples are provided to help the understanding of the present invention, and the scope of the present invention is not limited to the following examples. Details that are not described herein will be omitted since those skilled in the art can sufficiently infer technically.

Example  1 ~ 2. Low temperature Fast curing  Manufacture of composition for anisotropic conductive film

Example  One

3,4-epoxycyclohexymethyl-3,4-epoxycyclohexane carboxylate (Celloxide 2021P, DAICEL, Japan) 5 parts by weight, BPA epoxy (JER 828, JER, Japan) 30 parts by weight, sulfonium-based cationic latent curing agent (SI-60L , Samshin Chemical, Japan) 2 parts by weight, phenoxy resin (PKHH, Inchemrez, USA) 38 parts by weight, conductive particles (AUL-704, average particle diameter: 4㎛, SEKISUI, Japan) 25 parts by weight and solvent xyl 50 parts by weight of ethylene and 50 parts by weight of ethyl acetate were mixed to prepare a composition for an anisotropic conductive film.

150 degreeC, 60 Mpa, and 5 sec bonding were performed about the produced composition for anisotropic conductive films.

Example  2

Except that in Example 1 17.5 parts by weight of 3,4-epoxycyclohexymethyl-3,4-epoxycyclohexane carboxylate (Celloxide 2021P, DAICEL, Japan) and 17.5 parts by weight of BPA epoxy (JER 828, JER, Japan) It carried out in the same manner as in Example 1.

Comparative example  1-4. Manufacture of composition for anisotropic conductive film

Comparative example  One

Example 1, except that the entire amount of 3,4-epoxycyclohexymethyl-3,4-epoxycyclohexane carboxylate (Celloxide 2021P, DAICEL, Japan) was replaced with BPA epoxy (JER828, JER, Japan) in Example 1 It was carried out in the same manner as.

Comparative example  2

It carried out by the same method as the comparative example 1.

However, 170 degreeC, 60 Mpa, and 5 sec bonding were performed about the manufactured composition for anisotropic conductive films.

Comparative example  3

Example 1 except that 3,4-epoxycyclohexymethyl-3,4-epoxycyclohexane carboxylate (Celloxide 2021P, DAICEL, Japan) was replaced with epoxidized polybutadiene (EPOLEAD PB3600, DAICEL, Japan) in Example 1 It was carried out in the same manner as.

Comparative example  4

Except that 2 parts by weight of sulfonium-based cationic latent curing agent (SI-60L, Samshin Chemical, Japan) in Example 1 was replaced by 2 parts by weight of phosphonium-based cationic latent curing agent (SI-110L, Samshin Chemical, Japan) Was carried out in the same manner as in Example 1.

Experimental Example . Anisotropy  Physical property evaluation of the conductive film

After applying the compositions for the anisotropic conductive films prepared in Examples 1 to 2 and Comparative Examples 1 to 4 on the white release film, respectively, the solvent was evaporated in a dryer at 80 ° C. to obtain a dried anisotropic conductive film having a thickness of 20 μm. .

The physical properties of the anisotropic conductive film formed using the compositions for anisotropic conductive films prepared in Examples 1 to 2 and Comparative Examples 1 to 4 were evaluated, and the results are shown in Tables 1, 2, 3, and 1 below. It was.

In order to evaluate the properties of each manufactured anisotropic conductive film, each ACF film was made using a glass substrate with an indium tin oxide (ITO) circuit having a bump area of 2000 µm ² and a thickness of 5000 mV, and a chip having a bump area of 2000 µm ^{2 having a} thickness of 1.7 mm. After pressing the upper and lower interfaces with each other, by pressing and heating under the bonding temperature conditions of each Example and Comparative Example, five specimens per sample were adhered. In order to understand the electrical characteristics of the sample after adhesion, the measurement of the connection resistance was carried out five times for each sample, and then the average value was taken to determine the value. The surface warpage of the chip and the glass substrate (0.3 mmt glass) was determined by surface analysis. It measured three times for each sample and obtained the average value.

In order to confirm the reliability of the connection, the sample was measured at 85 ° C, 85% high temperature and high humidity, and the sample was taken out for each hour up to 500hr, and the connection resistance was measured five times. 1 is shown.

In addition, 4 mg of each of the anisotropic conductive films before bonding was obtained, and thermal characteristics of the anisotropic conductive film were confirmed by DSC (Differential Scanning Calorimeter).

Table 1 below shows the basic properties (thermal properties according to temperature measured by DSC) before thermosetting.

Sample Onset (℃) Peak (℃) End (℃) ΔH (J / g) Example 1 86.30 112.92 141.12 104.83 Example 2 85.86 112.28 142.11 125.82 Comparative Example 1 95.69 120.42 137.47 67.35 Comparative Example 3 94.53 122.48 140.21 69.49 Comparative Example 4 - - - -  ※ In Comparative Example 4, no peak was generated and it could not be cured.

Table 2 shows the basic characteristics (Warpage, initial resistance) after thermal curing, Table 3 shows the reliability resistance value (85 ℃ / 85% humidity condition).

Sample Bonding temperature Warpage (μm) Resistance (Ω) Example 1 150 ℃ 12.24 1.79 Example 2 150 ℃ 12.64 1.76 Comparative Example 1 150 ℃ 10.31 2.21 Comparative Example 2 170 ℃ 18.09 1.60 Comparative Example 3 150 ℃ 10.18 3.12 Comparative Example 4 150 ℃ 1.5 - ※ Comparative Example 4 cannot measure resistance (high resistance)

Sample Bonding temperature Early
Resistance (Ω) 100hr
Resistance (Ω) 250hr
Resistance (Ω) 500hr
Resistance (Ω) Example 1 150 ℃ 1.79 2.51 3.21 3.84 Example 2 150 ℃ 1.76 2.48 2.62 2.76 Comparative Example 1 150 ℃ 2.21 4.87 5.41 6.16 Comparative Example 2 170 ℃ 1.60 2.42 2.71 2.12 Comparative Example 3 150 ℃ 3.12 9.52 11.92 12.51 Comparative Example 4 150 ℃ - - - -

As can be seen in Table 1, when the cyclohexane-based epoxy is used according to the present invention, the thermal curing starts at a lower temperature due to the lower thermal activation energy during the reaction between the epoxy and the cationic curing agent. there was.

Accordingly, the anisotropic conductive film was thermally cured at 150 ° C. and 5 sec, which is lower than the bonding condition of 170 ° C. and 5 sec, which is a bonding condition used in the cationic thermal curing, and analyzed physical properties.

As shown in Table 2, Table 3 and Figure 1 for Examples 1 and 2 to which the cyclohexane-based epoxy was applied, it was confirmed that the electrical reliability is good compared to Comparative Example 1 using a general BPA-based epoxy resin, cyclohexane It can be seen that Example 2, in which the content of the system epoxy is added, has better electrical characteristics than Example 1.

In addition, the bonding temperature can be lowered by 20 ° C. or more, thereby reducing the glass warpage caused by the heat history to 2/3.

In addition, in the case of Comparative Example 4 using a phosphonium-based curing agent rather than a sulfonium-based curing agent, it was difficult to evaluate the thermal characteristics according to the temperature because no peak occurred when measuring the thermal characteristics before thermosetting, and curing was impossible. In addition, the connection resistance value was too high to measure.

As described above, the low-temperature fast-curing anisotropic conductive film using the cyclohexane-based epoxy resin, the sulfonium-based curing agent, the binder resin, and the conductive particles according to the present invention showed excellent electrical properties and high connection reliability. Therefore, when the film is applied on the actual LCD module, the main bonding bonding temperature of the LCD mounting process can be lowered to minimize the occurrence of warpage due to temperature change of the material and curing shrinkage, and misalignment due to low temperature bonding. It can be expected to produce various effects such as prevention, material handling for fine pitch, and reduction of line tack time.

BRIEF DESCRIPTION OF THE DRAWINGS It is a graph which shows the connection reliability of the anisotropically conductive film formed using the composition for anisotropically conductive films manufactured in Examples 1-2 and Comparative Examples 1-3.

Claims (16)

a) an epoxy resin comprising a cyclohexane-based epoxy resin; b) sulfonium-based curing agents; c) binder resins; And d) conductive particles Composition for low temperature rapid curing type anisotropic conductive film comprising a. The method of claim 1, wherein the composition a) 100 parts by weight of an epoxy resin including a cyclohexane-based epoxy resin; b) 0.05 to 30 parts by weight of a sulfonium-based curing agent; c) 20 to 300 parts by weight of the binder resin; And d) 1 to 80 parts by weight of the conductive particles, characterized in that the composition for low temperature fast curing type anisotropic conductive film. The method of claim 1, The sulfonium-based curing agent is selected from aliphatic sulfonium salts, aromatic sulfonium salts, and mixtures thereof, the composition for a low-temperature fast curing type anisotropic conductive film. The method of claim 3, wherein The sulfonium-based curing agent is an aromatic sulfonium salt, it characterized in that the low-temperature fast curing type anisotropic conductive film composition. The method of claim 1, The cyclohexane-based epoxy resin is a compound having two or more epoxy groups in one molecule having an epoxy ring connected with cyclohexane, low-temperature fast curing type anisotropic conductive film composition. The method of claim 5, The cyclohexane epoxy resin is 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate, bis (3,4-epoxycyclohexyl) adipate, vinylcyclohexene dioxide, 2- (3 , 4-Epoxycyclohexyl-5,5-spiro-3,4-epoxy) cyclohexane-meta-dioxane, and mixtures thereof. The method of claim 1, The epoxy resin further comprises a glycidyl group-containing epoxy resin, the composition for a low-temperature fast curing type anisotropic conductive film. The method of claim 7, wherein The glycidyl group-containing epoxy resin is selected from the group consisting of bisphenol A type epoxy resin, bisphenol F type epoxy resin, polyfunctional phenol-novolac epoxy resin, cresol epoxy resin, and mixtures thereof, low temperature fast curing type Composition for anisotropic conductive film. The method of claim 1, The binder resin is polyimide resin, polyamide resin, phenoxy resin, poly methacrylate resin, poly acrylate resin, polyurethane resin, polyester resin, polyester urethane resin, polyvinyl butyral resin, styrene-buty Any one selected from the group consisting of styrene-styrene (SBS) resins and epoxy modified compounds, styrene-ethylene-butylene-styrene (SEBS) resins and their modified bodies, and acrylonitrile butadiene rubber (NBR) and their hydrogenated bodies; The composition for low temperature fast-curing anisotropic conductive films characterized by the above. The method of claim 1, The weight average molecular weight of the binder resin is 5,000 to 150,000, characterized in that the composition for low temperature fast curing type anisotropic conductive film. The method of claim 1, The conductive particles are metal particles containing Au, Ag, Ni, Cu and Pb; carbon; Particles coated with a metal containing Au, Ag, and Ni, wherein the particles are any one or more resins selected from polyethylene, polypropylene, polyester, polystyrene, and polyvinyl alcohol, and modified resins thereof; And at least one selected from the group consisting of insulated particles coated by adding insulating particles thereon. The method of claim 1, The composition further comprises a solvent, the solvent is 10 to 300 parts by weight based on 100 parts by weight of the epoxy resin, characterized in that the composition for low-temperature fast curing type anisotropic conductive film. The method of claim 12, The solvent is selected from the group consisting of toluene, xylene, propylene glycol monomethyl ether acetate, benzene, acetone, methyl ethyl ketone, tetrahydrofuran, dimethylformaldehyde, cyclohexanone and mixtures thereof. Composition for fast curing anisotropic conductive film. The method of claim 1, The composition is a low-temperature fast curing anisotropic conductive, characterized in that it further comprises 0.01 to 5 parts by weight of any one or more additives selected from polymerization inhibitors, antioxidants, heat stabilizers, curing accelerators and coupling agents based on 100 parts by weight of the epoxy resin. Composition for film. A low temperature fast curing type anisotropic conductive film formed of the composition for low temperature fast curing type anisotropic conductive film of claim 1. The method of claim 15, The anisotropic conductive film has a warpage degree (Warpage) less than 15㎛ in 0.3mmt glass (glass), the initial resistance value is characterized in that less than 1.8Ω, low temperature fast curing anisotropic conductive film.

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