KR20110061335A - Apparatus for inspecting light emitting diode - Google Patents

Abstract

PURPOSE: An apparatus for inspecting a light emitting diode package is provided to automate an inspecting operation and a marking operation with respect to bad light emitting packages. CONSTITUTION: A loading part(110) loads the array type group of light emitting diodes into a cassette. An inspecting part(120) inspects defects in the group of the light emitting diodes through a visual inspection process. A marking part(130) implements a marking process with respect to bad light emitting diodes based on the inspection result of the inspecting part. An unloading part(140) loads a vacant cassette in order to receive the group of the light emitting diode packages.

Description

Light emitting diode package inspection device {Apparatus for inspecting light emitting diode}

The present invention relates to a light emitting diode package inspection apparatus that inspects whether a light emitting diode package is defective and can mark a light emitting diode package that is defective after inspection.

A light emitting diode (LED) is an electronic component that generates a small number of carriers (electrons or holes) injected using a p-n junction structure of a semiconductor and emits light by recombination thereof. In other words, when a forward voltage is applied to a semiconductor of a specific element, holes of electrons recombine with each other while the holes of the electrons move through the junction of the anode and the cathode. Emits light.

Such light emitting diodes have recently been improved in light emission efficiency, and their application ranges are light sources of flat panel display devices such as backlight units (BLUs) and liquid crystal displays (LCDs) for mobile phones in the early signal display. It is getting wider for lighting purposes. This is because the light emitting diode consumes less power and has a longer life than a light bulb or a fluorescent lamp used as a conventional lighting.

The light emitting diode may be manufactured in a light emitting diode package. In general, the light emitting diode package includes a light emitting diode chip, a body on which the light emitting diode chip is mounted, and fluorescent silicon covering the light emitting diode chip on the body. The light emitting diode package may further include a zener diode next to the light emitting diode chip.

A light emitting diode chip is manufactured by growing different conductive semiconductor layers on a substrate and an active layer activating light emission therebetween, and then forming electrodes on each semiconductor layer. The light emitting diode chip is electrically connected to a lead through wire bonding.

After the wire bonding, if the bonding wire is broken or bent, it causes a defect of the light emitting diode package such as leakage current when the light emitting diode package is operated. It is necessary.

In addition, in the process of filling the fluorescent silicon on the top of the light emitting diode chip and the zener diode, if the fluorescent silicon is excessively charged, the internal bonding wire is exposed and may be disconnected due to heat generation. On the contrary, when the fluorescent silicon is overcharged, it becomes impossible to assemble the module when it is assembled later, resulting in a defect that the divergence angle of light becomes larger than the set value. Therefore, when manufacturing the light emitting diode package, a process for checking the state of charge of the fluorescent silicon is required.

However, according to the related art, after the operator visually inspects the state of the bonding wire and the state of charge of the fluorescent silicon, most of the defects are marked on the defective LED package. Accordingly, skilled workers are required, and there is a limit to productivity improvement due to manual work.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above problems, and to provide a light emitting diode package inspection apparatus that can improve productivity by automating the defect inspection and defect marking of the light emitting diode package and performing a rapid process in a series of processes. In providing.

According to an aspect of the present invention, there is provided a light emitting diode package inspection apparatus including: a loading unit configured to load a cassette including a plurality of package assemblies in which light emitting diode packages are connected in an array; An inspection unit for inspecting whether the light emitting diode packages of the package assembly supplied from the loading unit are defective through vision inspection; A defective marking unit for performing a defective marking on the light emitting diode package determined as defective based on the inspection result of the inspection unit among the light emitting diode packages of the package assembly supplied from the inspection unit; And an unloading unit for storing an empty cassette for accommodating a package assembly discharged through the defective marking unit.

According to the present invention, in the manufacturing process of the light emitting diode package, the process of inspecting the light emitting diode package and marking the bad light on the light emitting diode package determined as bad based on the inspected result can be automated. In addition, the inspection and bad marking process can be quickly processed as a series of processes. Therefore, there is an effect that the productivity is improved when manufacturing the light emitting diode package.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view of a light emitting diode package inspection apparatus according to an embodiment of the present invention.

Referring to FIG. 1, the LED package inspecting apparatus 100 includes a loading unit 110, an inspection unit 120, a defective marking unit 130, and an unloading unit 140.

The loading unit 110 loads the cassette 10 shown in FIG. The loading unit 110 may be disposed on one side of the frame 101 adjacent to the inspection unit 120. The cassette 10 has a structure in which a plurality of package assemblies 20 can be stacked and stored. The package assembly 20 has a structure in which the light emitting diode packages 21 are connected in an array form, in order to increase productivity in manufacturing the light emitting diode package 21. After the manufacture of the light emitting diode packages 21 is completed, the package assembly 20 may cut the connection portions of the light emitting diode packages 21 to be separated into respective light emitting diode packages 21.

As shown in FIG. 3A, the light emitting diode packages 21 positioned in the loading unit 110 are connected to the light emitting diode chip 22 in a state in which the light emitting diode chip 22 and the lead 23 are connected by the bonding wire 24. 22) may be in a state in which the fluorescent silicon is not covered.

As another example, the light emitting diode packages 21 may be connected to the light emitting diode chip 22 while the light emitting diode chip 22 and the zener diode 26 are connected by a bonding wire 24, as shown in FIG. 3B. The zener diode 26 may have a structure in which the fluorescent silicon 25 is covered.

The inspection unit 120 receives the package assembly 20 from the loading unit 110, and inspects the light emitting diode packages 21 of the supplied package assembly 20 through vision inspection for vision defects. For example, in the light emitting diode package 21 shown in FIG. 3A, the inspection unit 120 processes the captured image to determine whether the bonding wire 24 of the light emitting diode package 21 is broken or warped. Can be checked In the case of the light emitting diode package 21 shown in FIG. 3B, the captured image may be processed to check whether the fluorescent silicon 25 is excessively or undercharged.

The inspection unit 120 may be disposed above the light emitting diode packages 21 to be inspected. The inspection unit 120 may be supported by the column 102 on the frame 101 to slide in the direction orthogonal to the supply direction of the package assembly 20. Accordingly, the inspection unit 120 may be positioned in the inspection area or moved to a standby position for maintenance or the like.

As described above, when the light emitting diode package 21 arranged in a plurality of rows and a plurality of columns is supplied one by one, the inspecting unit 120 may be configured to photograph and inspect each line. As another example, when the light emitting diode package 21 is supplied with a plurality of rows, the inspecting unit 120 may be configured to photograph and inspect each region.

The defective marking unit 130 is laser-defects the LED package of the LED package 21 of the package assembly 20 supplied from the inspection unit 120 that is determined to be defective based on the inspection result of the inspection unit 120. Marking The defective marking unit 130 may be disposed above the light emitting diode packages 21 supplied. The defective marking unit 130 may be supported by the column 103 on the frame 101 to slide in a direction orthogonal to the supply direction of the package assembly 20. Accordingly, the defective marking unit 130 may be adjusted in the marking area or moved to the standby position for maintenance.

The defective marking unit 130 may be configured to imprint a defective mark on the surface of the defective LED package 21 by irradiating a laser beam. In this case, when the defective marking unit 130 receives the light emitting diode packages 21 arranged in a plurality of rows and a plurality of rows one by one, it moves the laser beam only in a direction orthogonal to the supply direction of the light emitting diode package 21. It may be configured to perform poor marking on the defective LED package. As another example, the defective marking unit 130 may be configured to mark the defective LED package while moving the laser beam in the X-Y direction. Movement and operation of the laser beam may be performed by the controller 104 provided with information provided from the inspection unit 120. The controller 104 may be a computer or the like. On the other hand, the bad marking unit 130 may be configured to print a bad mark on the surface of the light emitting diode package 21 is bad by spraying ink.

The unloading unit 140 loads the empty cassette 10 for accommodating the package assembly 20 discharged through the defective marking unit 130. The package assemblies 20 accommodated in the empty cassette 10 in the unloading unit 140 may be sent to a process for charging the fluorescent silicon when the fluorescent silicon is not filled in the upper portion of the light emitting diode chip 22. have. If the fluorescent silicon is filled in the upper portion of the light emitting diode chip 22, it may be sent to a process for discarding the defective light emitting diode chip.

According to the LED package inspection apparatus 100 having the above-described configuration, in the manufacturing process of the LED package 21, the LED package 21 is inspected, and the LED package determined as defective based on the inspected result. The defect marking process can be automated and the inspection and defect marking process can be quickly processed in a series of steps. Therefore, productivity can be improved in manufacturing the light emitting diode package 21.

On the other hand, the LED package inspection apparatus 100 may include a transfer guide rail 150 and the transfer unit 160. As shown in FIG. 4, the transport guide rail 150 guides the package assembly 20 supplied from the loading unit 110 to be mounted and transported. The transfer unit 160 is for transferring the package assembly 20 mounted on the transfer guide rail 150 to the inspection unit 120 and the defective marking unit 130.

The transfer unit 160 may be provided in plurality. For example, the transfer unit 160 may include a first transfer unit 161 for transferring the package assembly 20 supplied from the loading unit 110 to the inspection unit 120, and the package assembly 20 in the inspection region of the inspection unit 120. The unloading part from the second conveying part 162 for conveying the oil, the third conveying part 163 for conveying the package assembly 20 in the marking area of the defective marking part 130, and the defective marking part 130. 140 may include a fourth transfer unit 164 for transferring the side. The first, second, third and fourth transfer parts 161, 162, 163 and 164 are configured to operate individually.

The first conveying unit 161 includes a conveying belt for mounting and conveying the package assembly 20, a motor for rotating the conveying belt, and a pair of guide rollers for guiding the supply of the package assembly 20 from the loading unit 110. It may be configured to include.

The second transfer unit 162 may include a picker, a linear motion guide, and a linear motor. The picker has a structure in which the hook portion can be fitted into a plurality of holes formed along both edges of the package assembly 20. The linear motion guide guides the picker to move back and forth along the transport direction of the package assembly 20. The linear motor makes it possible to transfer the package assembly 20 by moving the picker while the hook portion of the picker is fitted into the hole of the package assembly 20.

When the inspection unit 120 is configured to inspect the light emitting diode packages 21 line by line, the linear motor may be configured as a linear step motor to transfer the light emitting diode packages 21 line by line. Similar to the second transfer unit 162, the third transfer unit 163 may be configured to include a picker, a linear motion guide and a linear motor, and the fourth transfer unit 164 also includes a picker, a linear motion guide, and a linear motor. Can be configured.

An inspection unit clamping unit 171 may be provided on the inspection unit 120 side. The inspection part clamping part 171 transfers the package assembly 20 positioned in the inspection part 120 during the inspection of the light emitting diode packages 21 of the package assembly 20 by the inspection part 120, that is, during imaging. It is fixed in close contact with (150). Accordingly, the inspection unit 120 may obtain accurate images of the light emitting diode packages 21.

For example, the clamping unit 171 for the inspection unit may be configured to include a clamp member moving near or apart from the transfer guide rail 150 at an upper portion of the transfer guide rail 150, and a clamp driver moving the clamp. . The clamp drive may comprise a solenoid actuator.

The defective marking portion 130 may be provided with a clamping portion 172 for the defective marking portion. The bad marking part clamping part 172 transfers the package assembly 20 positioned on the bad marking part 130 while the bad marking is performed on the light emitting diode package 21 determined as bad by the bad marking part 130. It is fixed in close contact with (150). Accordingly, the defective marking unit 130 can accurately mark the defective light emitting diode package 21. Like the inspection part clamping part 171, the defective marking part clamping part 172 may include a clamp member and a clamp driving part.

As shown in FIG. 5, the loading unit 110 may be provided with a first supply conveyor 111, a first elevator 112, a first pusher 113, and a first discharge conveyor 114. have. The first supply conveyor 111 is for supplying the cassette 10 to the supply position of the package assembly 20 when the cassette 10 accommodated by stacking a plurality of package assemblies 20 is loaded. The 1st elevator 112 is for holding and raising the cassette 10 supplied by the 1st supply conveyor 111. As shown in FIG.

The first elevator 112 may be controlled to raise or lower the held cassette 10 by one step. As shown, if the first discharge conveyor 114 is disposed below the first supply conveyor 111, the first elevator 112 controls to lower the gripped cassette 10 by one step. Can be. Here, the one-step movement interval of the first elevator 112 corresponds to the interval in which the package assembly 20 is stacked.

The first elevator 112 may be approached or spaced apart from the first supply conveyor 111 by a driving unit to receive the cassette 10 from the first supply conveyor 111 to return to the original state and descend. As a result, the empty cassette 10 can be transferred from the first elevator 112 to the first discharge conveyor 114.

Each time the cassette 10 held by the first elevator 112 descends by one step, the first pusher 113 moves the package assemblies 20 stored in the gripped cassette 10 toward the inspection unit 120 one by one. Supply. The first pusher 113 includes a pushing member that moves back and forth along the supply direction of the package assembly 20, and a pushing member driving unit that moves the pushing member. The pushing member driving unit may be configured with various actuators in a range capable of linearly moving the pushing member.

The first discharge conveyor 114 receives and discharges the empty cassette 10 from the first elevator 112. When the loading unit 110 is configured as described above, since the package assembly 20 can be automatically supplied to the inspection unit 120 continuously, the production efficiency can be increased.

Meanwhile, referring back to FIGS. 1 and 4, the unloading unit 140, similarly to the loading unit 110, automatically stores the package assembly 20 in the empty cassette 10 to be discharged. The second feed conveyor 141, the second elevator 142, the second pusher 143, and the second discharge conveyor 144 may be included.

The second supply conveyor 141 enables the empty cassette 10 to be supplied to the discharge position of the package assembly 20. The second elevator 142 is for holding and elevating the cassette 10 supplied by the second supply conveyor 141.

When the second discharge conveyor 144 is disposed below the second supply conveyor 141, the second elevator 142 may be controlled to lower the gripped cassette 10 by one step. The second elevator 142 may be approached or spaced apart from the second supply conveyor 141 by the driving unit to receive the empty cassette 10 from the second supply conveyor 141 to return to the original state and descend. Thereby, it becomes possible to transfer the cassette 10 in which the package assembly 20 was stored from the 2nd elevator 142 to the 2nd discharge conveyor 144. As shown in FIG.

Each time the cassette 10 held by the second elevator 142 descends by one step, the second pusher 143 draws the package assembly 20 transferred from the defective marking unit 130 one by one. It is housed in. The second pusher 143 includes a pushing member that moves back and forth along the discharge direction of the package assembly 20, and a pushing member driving unit that moves the pushing member. The pushing member driving unit may be configured with various actuators in a range capable of linearly moving the pushing member.

The second discharge conveyor 144 receives and discharges the cassette 10 in which the package assembly 20 is received from the second elevator 142. As described above, when the unloading unit 140 is configured, the package assembly 20 that has been inspected and badly marked can be automatically discharged to the unloading unit 140 continuously, thereby increasing production efficiency.

Meanwhile, the inspection unit 120 may include an illumination unit, an imaging unit, and an image processing unit. In the case of inspecting a state of the bonding wire 24 of the light emitting diode package 21 illustrated in FIG. 3A, the inspection unit 120 may be configured as follows.

The lighting unit causes the path of the bonding wire 24 to appear over the entire area of the light emitting diode package 21. The lighting unit may be configured to irradiate a first illumination including coaxial illumination of a blue wavelength range and a fall light of a blue wavelength range or a second illumination including coaxial illumination of a red wavelength range. This is to clearly obtain the bonding wire image of the inner pattern region of the light emitting diode package 21 and the bonding wire image of the lead frame region. Coaxial illumination is light irradiated consistent with the optical axis of the imaging unit, and fall illumination is ambient light. The imaging unit is for photographing an upper surface of the light emitting diode package 21, and may be a CCD camera or the like.

The image processor acquires the first image photographed by the first illumination and the second image photographed by the second illumination through the image capturing unit, merges the acquired first and second images with corresponding pixels, and then merges the merged image. By processing, the state of the bonding wire 24 of the light emitting diode package 21 can be determined. Information processed by the image processor may be output to the controller 104 that controls the entire apparatus. The image processor may not be included in the inspection unit 120 but may be included in the controller 104.

If the state of the fluorescent silicon 25 of the light emitting diode package 21 shown in FIG. 3B is inspected, the inspection unit 120 may be configured as follows.

The illumination unit irradiates UV (ultraviolet), which is a wavelength band emitted by the fluorescent silicon 25, so that different images according to the charging state of the fluorescent silicon 25 may be obtained. The image processor may determine the state of the fluorescent silicon 25 by comparing the image captured by the UV light with the reference image through the imager. The reference image is an image obtained when the state of charge of the fluorescent silicon 25 is normal.

An operation of the LED package inspecting apparatus 100 having the above-described configuration will be described below with reference to FIGS. 1 to 6.

First, a plurality of package assemblies 20 to be inspected are stacked and loaded into the loading unit 110. Then, the first supply conveyor 111 moves the cassette 10 toward the first elevator 112, and the first elevator 112 moves toward the first supply conveyor 111 to hold the cassette 10. Return to its original state. Thereafter, the first elevator 112 lowers the cassette 10 by one step, and each time the cassette 10 descends by one step, the first pusher 113 moves the package assembly 20 from the cassette 10. It is supplied to the first transfer unit 161 one by one. Then, the first transfer unit 161 transfers the package assembly 20 toward the inspection unit 120.

The inspection unit 120 inspects the defective image by processing an image of the light emitting diode packages 21 of the package assembly 20 supplied. In this case, the second transfer unit 162 may transfer the package assembly 20 so that the LED package 21 may be sequentially inspected one by one or a plurality of rows. Then, while the inspection unit 120 captures the light emitting diode package 21, the inspection unit clamping unit 171 fixes the package assembly 20.

When the second transfer unit 162 supplies the inspected package assembly 20 to the defective marking unit 130, the defective marking unit 130 is determined to be defective based on the inspection result of the inspection unit 120. Mark bad for. In this case, the third transfer unit 163 may move the light emitting diode package 21 by one row or a plurality of rows, and accordingly, the bad marking unit 130 may move the laser beam to mark the bad light emitting diode package. Can be. In addition, the bad marking part clamping part 172 fixes the package assembly 20 while the bad marking part 130 performs a bad marking on the bad light emitting diode package.

When the fourth conveying unit 164 discharges the poorly marked package assembly 20 toward the unloading unit 140, the second pusher 143 is formed by the second supply conveyor 141 at the unloading unit 140. 2 is stored in the empty cassette 10 that is delivered to the elevator 142 and waiting. At this time, the second elevator 142 lowers the cassette 10 by one step, and each time the cassette 10 descends by one step, the second pusher 143 passes through the defective marking unit 130. 20 are stored one by one into the empty space of the cassette 10. When the storage of the package assembly 20 is completed in the cassette 10, the second elevator 142 transfers the cassette 10 to the second discharge conveyor 144, and the second discharge conveyor 144 is the cassette 10. ).

Although the present invention has been described with reference to one embodiment shown in the accompanying drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Could be. Accordingly, the true scope of protection of the present invention should be determined only by the appended claims.

1 is a perspective view of a light emitting diode package inspection apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view illustrating a cassette for storing a light emitting diode package to be inspected and defectively marked by the inspection apparatus of FIG. 1; FIG.

3A is a plan view of the light emitting diode package of FIG. 2;

3B is a sectional view of another example of the light emitting diode package of FIG. 2;

FIG. 4 is a perspective view illustrating the transfer rail and the transfer unit in FIG. 1; FIG.

FIG. 5 is a perspective view illustrating the loading unit in FIG. 1; FIG.

FIG. 6 is a view for schematically explaining a transfer process of a package assembly in FIG. 1. FIG.

<Brief description of the major symbols in the drawings>

10.cassette 20.package assembly

21. Light emitting diode package 24. Bonding wire

25. Fluorescent silicon 110. Loading part

120. Inspection unit 130. Defective marking unit

140. Unloading 150. Transfer guide rail

160. Transfer part 171. Inspection part clamping part

172..Clamping part for defective marking part

Claims (9)

A loading unit for storing a cassette including a plurality of package assemblies in which the light emitting diode packages are connected in an array; An inspection unit for inspecting whether the light emitting diode packages of the package assembly supplied from the loading unit are defective through vision inspection; A defective marking unit for performing a defective marking on the light emitting diode package determined as defective based on the inspection result of the inspection unit among the light emitting diode packages of the package assembly supplied from the inspection unit; And The light emitting diode package inspection apparatus including an unloading unit for loading an empty cassette for accommodating the package assembly discharged through the defective marking unit. The method of claim 1, A transport guide rail for guiding the package assembly supplied from the loading unit on a transport basis; And a transfer unit for transferring the package assembly mounted on the transfer guide rail to the inspection unit and the defective marking unit. 3. The method of claim 2, And a clamping part for inspecting part which closely fixes and fixes the package assembly located on the inspecting part to the transfer guide rail while inspecting the light emitting diode packages of the package assembly by the inspecting part. The method of claim 2 or 3, A light emitting diode comprising: a clamping portion for a defective marking portion for tightly fixing the package assembly located on the defective marking portion to the transfer guide rail while performing a defective marking on the light emitting diode package determined by the defective marking portion. Package inspection device. The method of claim 1, In the loading unit, A first supply conveyor for supplying a cassette, in which a plurality of package assemblies are stacked, to a supply position of the package assembly; A first elevator that grasps the cassette supplied by the first supply conveyor and raises or lowers by one step; A first pusher for supplying the package assemblies stored in the gripped cassettes one by one toward the inspection unit each time the cassette held by the first elevator rises or descends by one step; And a first discharge conveyor configured to receive and discharge an empty cassette from the first elevator. The method of claim 1, In the unloading unit, A second supply conveyor for supplying an empty cassette to a discharge position of the package assembly; A second elevator that grasps the cassette supplied by the second supply conveyor and moves up or down by one step; A second pusher for storing the package assembly discharged from the defective marking unit one by one in an empty storage space of the gripped cassette each time the cassette held by the second elevator rises or descends by one step; And And a second discharge conveyor configured to receive and discharge a cassette containing the package assembly from the second elevator. The method of claim 1, The inspection unit, The light emitting diode package inspection apparatus, characterized in that for inspecting the state of the bonding wires of the light emitting diode package by processing the image taken by the light emitting diode package. The method of claim 1, The inspection unit, The LED package inspection apparatus, characterized in that for processing the image taken by the LED package to inspect the state of charge of the fluorescent silicon of the LED package. The method of claim 1, The defective marking portion, The light emitting diode package inspection apparatus, characterized in that the laser beam is irradiated on the surface of the defective light emitting diode package to stamp the bad marker or spray ink to print the bad marker.

Images