KR20110059005A - Light of led - Google Patents

Light of led Download PDF

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Publication number
KR20110059005A
KR20110059005A KR1020090115589A KR20090115589A KR20110059005A KR 20110059005 A KR20110059005 A KR 20110059005A KR 1020090115589 A KR1020090115589 A KR 1020090115589A KR 20090115589 A KR20090115589 A KR 20090115589A KR 20110059005 A KR20110059005 A KR 20110059005A
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South Korea
Prior art keywords
heat
heat dissipation
led
hole
holes
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KR1020090115589A
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Korean (ko)
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KR101101256B1 (en
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임명춘
윤재두
송명석
최태헌
서호진
이동휘
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임명춘
(주)파트라
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

PURPOSE: An LED lamp is provided to increase the contact surface area of a heat sink and air by discharging the heat from the LED module through a convection current. CONSTITUTION: In an LED lamp, an LED module comprises an LED(12) in the bottom A heat sink(33) is contacted with the top side of the LED module and includes main heat dissipation hole(301) at the center. The heat sink comprises a plurality of auxiliary heat dissipation holes(303.304.305,306) The main dissipation hole and the auxiliary heat dissipation holes are connected to each other. A circuit board(31) is installed in the top side of the heat sink.

Description

엘이디 등{light of LED}LED light {light of LED}

본 발명은 방열효과가 우수한 방열체가 설치된 엘이디 등에 관한 것이다.The present invention relates to an LED and the like provided with a heat dissipation excellent in the heat dissipation effect.

LED는 수명이 반영구적이면서, 효율이 백열전구 및 형광등에 비하여 우수하기 때문에 점차 사용이 증가되고 있는 추세에 있으며, 이러한 LED에서 발생되는 열을 방열시키기 위한 다양한 방열구조를 갖는 LED 등이 연구개발되었다.LEDs are semi-permanent, and their efficiency is increasing because they are superior to incandescent bulbs and fluorescent lamps. LEDs having various heat dissipation structures for dissipating heat generated from such LEDs have been researched and developed.

도 1은 종래의 LED 등의 전체 구성을 나타내는 분해사시도이다.1 is an exploded perspective view showing the overall configuration of a conventional LED and the like.

도 1에 도시된 LED 등(1)은 전원 소켓에 결합되어 외부 전원이 유입되는 베이스(3), 베이스(3)의 전원을 공급받아 LED를 점등시키기 위한 전원으로 변환하는 전력변환부, 노이즈 등을 제거하기 위한 회로 및 LED 보호회로가 설치되는 전력변환 회로기판(7)과, 하부면에 LED(12)가 설치된 LED 모듈(11)과, 상부면에 전력변환 회로기판(7)이 설치되고 하부면에 LED 모듈(11)이 설치되며 중앙에 통공(8)이 형성된 방열체(9)와, LED 모듈(11)을 보호하고, LED 빛을 확산시키는 하부 커버(13)와, 전력변환 회로기판(7)을 보호하는 상부 커버(5)로 이루어진다.The LED lamp 1 shown in FIG. 1 is coupled to a power socket and receives a power source of the base 3 and the base 3 into which external power is introduced, and converts it into a power source for turning on the LED, noise, and the like. A power conversion circuit board 7 having a circuit and an LED protection circuit installed thereon, an LED module 11 having an LED 12 installed on a lower surface thereof, and a power conversion circuit board 7 installed on an upper surface thereof. LED module 11 is installed on the lower surface and the heat sink 9 formed with a through hole 8 in the center, the lower cover 13 to protect the LED module 11, diffuse the LED light, and a power conversion circuit It consists of an upper cover 5 which protects the substrate 7.

도 2는 도 1의 방열구조를 설명하는 구성도이다.2 is a configuration diagram illustrating the heat dissipation structure of FIG. 1.

방열체(9)는 전체적으로 원주형상으로 이루어지며 중앙에 방열공(8)이 형성 되어 있어 하면에 설치된 LED 모듈(11)에서 발생된 열을 방열체(9)의 하면을 통하여 상부로 전도되면 방열체의 원주형상의 외주면으로 전달되어 공냉되는 한편, 중앙의 방열공을 통하여 열이 상부로 전달되어 방열되게 된다.The heat radiator 9 is formed in a circumferential shape as a whole, and heat radiating holes 8 are formed at the center thereof to radiate heat generated from the LED module 11 installed on the bottom surface to the top through the bottom surface of the heat radiator 9. It is delivered to the outer circumferential surface of the sieve and air-cooled, while heat is transferred to the upper part through heat radiating holes in the center to radiate heat.

그러나 이와 같이 중앙의 방열공을 통하여 외부로 전달되는 열은 전력변환 회로기판(7)에 의하여 더 이상 열의 이동이 발생되지 않게 되어 냉각효율이 떨어지게 된다.However, the heat transferred to the outside through the heat radiating hole in the center is no longer the heat transfer by the power conversion circuit board 7 is reduced cooling efficiency.

또한, 방열체(9)의 열의 대류는 단순히 방열공에서만 발생하게 되고, 공기와 방열체의 접촉 표면적이 극히 제한적으로 이루어지기 때문에 원활한 방열효과를 기대할 수 없다. In addition, convection of the heat of the heat sink 9 only occurs in the heat sink, and since the contact surface area between the air and the heat sink is extremely limited, a smooth heat dissipation effect cannot be expected.

본원은 이러한 문제점을 해결하기 위한 것으로, 본 발명의 해결과제는 방열체에서 LED 모듈의 열이 대류 현상에 의하여 열이 방출될 수 있도록 하며, 공기와 방열체의 접촉표면적을 최대한 증가시키는 구조를 갖도록 함으로써 높은 효율을 갖는 LED 등을 제공하기 위한 것이다.The present invention is to solve this problem, the problem of the present invention is that the heat from the heat dissipation of the LED module by the convection phenomenon in the heat dissipation, and to have a structure to increase the contact surface area of the air and the heat dissipation as possible. This is to provide an LED lamp having a high efficiency.

상기 과제를 해결하기 위한 수단은 하면에 LED가 설치된 LED 모듈; 상기 LED 모듈의 상면에 접촉되며 중앙에 상하 방향으로 주 방열공이 형성되며, 상기 주 방열공을 중심으로 대칭으로 형성되는 보조 방열공들이 복수개 형성되며, 상기 주 방열공과 상기 보조 방열공들이 상호 연결되는 방열체; 상기 방열체의 상면에 설치되는 회로기판을 포함하는 것이다.Means for solving the above problems the LED module is installed on the lower surface; The main heat dissipation hole is formed in contact with the upper surface of the LED module in the vertical direction, and a plurality of auxiliary heat dissipation holes are formed symmetrically about the main heat dissipation hole, and the main heat dissipation hole and the auxiliary heat dissipation hole are interconnected. Radiator; It includes a circuit board installed on the upper surface of the heat sink.

또한 본 발명에서 상기 방열체의 상면에는 상기 방열체의 외주면으로부터 상기 주 방열공과 상기 보조 방열공들을 연결하는 홈이 형성되는 것이 바람직하다.In the present invention, it is preferable that a groove is formed on the upper surface of the heat sink to connect the main heat sink and the auxiliary heat sink from the outer circumferential surface of the heat sink.

또한 본 발명에서 상기 방열체에는 상기 방열체의 외주면으로부터 상기 보조 방열공까지 관통되는 수평 방열공이 형성되는 것이 바람직하다.In the present invention, it is preferable that the heat dissipation body is formed with a horizontal heat dissipation hole penetrating from the outer circumferential surface of the heat dissipation body to the auxiliary heat dissipation hole.

또한 본 발명에서 상기 방열체에는 상기 방열체의 외주면으로부터 상기 보조 방열공을 통과하여 상기 주 방열공에 연결되는 수평 방열공이 형성되는 것이 바람직하다.In the present invention, it is preferable that the heat dissipation body is formed with a horizontal heat dissipation hole connected to the main heat dissipation hole through the auxiliary heat dissipation hole from the outer circumferential surface of the heat dissipation body.

또한 본 발명에서 상기 회로기판 또는 상기 LED 모듈에는 상기 방열체에 접 속될 때 상기 주 방열공에 연장되도록 형성되는 방열공이 형성되는 것이 바람직하다. In addition, in the present invention, the circuit board or the LED module is preferably formed with a heat radiation hole is formed so as to extend to the main heat radiation hole when connected to the heat sink.

상기 과제와 해결수단을 갖는 본 발명에서 LED 모듈에서 발생되는 열을 방열시키는 방열체가 공기와 접촉되는 표면적을 넓혀주도록 함으로써 방열효과를 높이도록 하고, 주 방열공 뿐만 아니라 보조 방열공, 수평 방열공으로 인하여 원활한 대류 현상이 발생하도록 한다. In the present invention having the above-mentioned problems and solving means to increase the heat dissipation effect by increasing the surface area in contact with the air radiating heat generated from the LED module, due to not only the main heat dissipation hole but also auxiliary heat dissipation hole, horizontal heat dissipation hole Allow for smooth convection.

이하 첨부된 도면에 따라서 본 발명의 실시예를 상세히 설명하기로 한다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 3은 본 발명의 전체적인 구성을 설명하는 분해사시도이고, 도 4는 본 발명에서 열의 대류현상을 설명하는 단면도이다.Figure 3 is an exploded perspective view illustrating the overall configuration of the present invention, Figure 4 is a cross-sectional view illustrating the convection of heat in the present invention.

도 3에 도시된 실시예의 LED 등(100)에서 도 1과 동일한 구성에 대해서는 동일한 도면부호를 부가하고 설명을 생략하기로 한다.In the LED light 100 of the embodiment shown in FIG. 3, the same components as in FIG. 1 are added with the same reference numerals, and description thereof will be omitted.

베이스(3)에서 전원을 공급받아 LED(12)를 점등시키는 전원으로 변환하는 전력변환 회로기판(31)은 중앙에 방열공이 형성되어 있어 방열체(33)로부터 발산되는 열을 외부로 방출하도록 구성된다.The power conversion circuit board 31, which receives power from the base 3 and converts the power to the LED 12, has a heat radiating hole formed at the center thereof to radiate heat emitted from the heat radiating element 33 to the outside. It is composed.

또한 방열체(33)에는 중앙에 상하로 관통하는 주 방열공(301)이 형성되어 있으며, 방열공(301)을 중심으로 대칭으로 상하로 관통하여 열을 대류시키는 보조 방열공(303), (304), (305), (306)이 형성된다. 또한 방열체(33)의 상면은 전력변환 회로기판(31)이 접촉될 때 보조 방열공(303), (304), (305), (306)과 주 방열공(301)으로 방출된 열을 내포하는 기체가 외부로 대류될 수 있도록 방열체(33)의 외주면과 보조 방열공(303), (304), (305), (306)과 주 방열공(301)을 연결하는 대류 홈(307), (308), (309), (310)이 형성된다.In addition, the heat radiator 33 has a main heat dissipation hole 301 penetrating up and down in the center, and the auxiliary heat dissipation hole 303 through which the heat dissipation penetrates up and down symmetrically with respect to the heat dissipation hole 301, ( 304, 305, 306 are formed. In addition, the upper surface of the heat dissipating element 33 heats the heat emitted to the auxiliary heat dissipating holes 303, 304, 305, and 306 and the main heat dissipating hole 301 when the power conversion circuit board 31 is in contact with the heat dissipating element 33. Convection groove 307 connecting the outer circumferential surface of the heat sink 33 and the auxiliary heat dissipation holes 303, 304, 305, and 306 and the main heat dissipation hole 301 so that the gas contained therein can be convection to the outside. ), 308, 309, 310 are formed.

또한 방열체(33)에는 방열체(33)의 외주면으로부터 수평 방열공(311), (313), (315)이 내측으로 형성되어 있어 주 방열공(301)과 보조 방열공(303), (304), (305), (306)을 관통함으로써 주 방열공(301)과 보조 방열공(303), (304), (305), (306)의 열을 외부로 방출시키도록 한다.In addition, the heat dissipating member 33 has horizontal heat dissipating holes 311, 313, and 315 formed inward from the outer circumferential surface of the heat dissipating body 33, so that the main heat dissipating hole 301 and the auxiliary heat dissipating hole 303, ( By passing through the 304, 305, and 306, the heat of the main heat dissipation hole 301 and the auxiliary heat dissipation holes 303, 304, 305, and 306 is discharged to the outside.

또한 전력변환 회로기판(31)과 방열체(33) 사이에는 대류 홈(307), (309)에 의한 공간이 형성되어 LED 모듈(35)로부터 발열된 열이 도 4에 도시된 바와 같이 보조 방열공(303), (304), (305), (306)과 주 방열공(301)을 통하여 대류되어 대류 홈(307), (308), (309), (310)을 통하여 방열체(33)의 외부로 방출되게 된다.In addition, a space formed by the convection grooves 307 and 309 is formed between the power conversion circuit board 31 and the heat sink 33 so that the heat generated from the LED module 35 is shown in FIG. Heat condensed through the convex grooves 307, 308, 309, and 310 by convection through the hot holes 303, 304, 305, 306 and the main heat dissipation hole 301. ) Will be released to the outside.

또한 하면에 설치된 LED(12)가 설치된 LED 모듈(35)은 중앙에 방열공이 형성되어 있어 주 방열공(301)으로부터 방출되는 열이 외부로 발산되도록 한다.In addition, the LED module 35 installed on the lower surface of the LED module 35 is formed with a heat radiating hole in the center so that the heat emitted from the main heat radiating hole 301 to the outside.

또한, 방열체(33)의 하면도 LED 모듈(35)와 접촉하게 되나 상면과 마찬가지로 동일 형상의 주 방열공(301)과 보조 방열공(303), (304), (305), (306)에 연결되는 대류 홈들이 형성되어 LED 모듈(35)에서 발열되는 열이 하면에 형성된 대류 홈을 따라서 방열되도록 한다.In addition, the lower surface of the heat sink 33 also comes into contact with the LED module 35, but similarly to the upper surface, the main heat dissipation hole 301 and the auxiliary heat dissipation holes 303, 304, 305, and 306 have the same shape. Convection grooves are connected to each other so that heat generated from the LED module 35 is radiated along the convection groove formed on the lower surface.

도 1은 종래의 LED 등의 전체 구성을 나타내는 분해사시도이다.1 is an exploded perspective view showing the overall configuration of a conventional LED and the like.

도 2는 도 1의 방열구조를 설명하는 구성도이다.2 is a configuration diagram illustrating the heat dissipation structure of FIG. 1.

도 3은 본 발명의 전체적인 구성을 설명하는 분해사시도이다.3 is an exploded perspective view illustrating the overall configuration of the present invention.

도 4는 본 발명에서 열의 대류현상을 설명하는 단면도이다.4 is a cross-sectional view illustrating the convection phenomenon of heat in the present invention.

Claims (5)

하면에 LED가 설치된 LED 모듈;LED module installed on the bottom surface; 상기 LED 모듈의 상면에 접촉되며 중앙에 상하 방향으로 주방열공이 형성되며, 상기 주 방열공을 중심으로 대칭으로 형성되는 보조 방열공들이 복수개 형성되며, 상기 주방열공과 상기 보조 방열공들이 상호 연결되는 방열체;The kitchen heat hole is formed in the vertical direction in contact with the upper surface of the LED module, a plurality of auxiliary heat radiation holes are formed symmetrically around the main heat hole is formed, the kitchen heat holes and the auxiliary heat radiation holes are interconnected Heat sink; 상기 방열체의 상면에 설치되는 회로기판을 포함하는 것을 특징으로 하는 LED 등.LED, characterized in that it comprises a circuit board installed on the upper surface of the heat sink. 청구항 1에서, 상기 방열체의 상면에는 상기 방열체의 외주면으로부터 상기 주 방열공과 상기 보조 방열공들을 연결하는 대류 홈이 형성되는 것을 특징으로 하는 LED 등The method of claim 1, wherein the upper surface of the heat dissipating LED, characterized in that the convection groove for connecting the main heat dissipation hole and the auxiliary heat dissipation from the outer peripheral surface of the heat sink 청구항 1에서, 상기 방열체에는 상기 방열체의 외주면으로부터 상기 보조 방열공까지 관통되는 수평 방열공이 형성되는 것을 특징으로 하는 LED 등.The LED lamp of claim 1, wherein the heat dissipating body has horizontal heat dissipation holes penetrating from an outer circumferential surface of the heat dissipating body to the auxiliary heat dissipation hole. 청구항 1에서, 상기 방열체에는 상기 방열체의 외주면으로부터 상기 보조 방열공을 통과하여 상기 주 방열공에 연결되는 수평 방열공이 형성되는 것을 특징으로 하는 LED 등.The LED lamp of claim 1, wherein the heat dissipating body has horizontal heat dissipation holes connected to the main heat dissipation holes through the auxiliary heat dissipation holes from an outer circumferential surface of the heat dissipation body. 청구항 1에서, 상기 회로기판 또는 상기 LED 모듈에는 상기 방열체에 접속될 때 상기 주 방열공에 연장되도록 형성되는 방열공이 형성되는 것을 특징으로 하는 LED 등.The LED lamp of claim 1, wherein the circuit board or the LED module is provided with a heat radiation hole formed to extend to the main heat radiation hole when connected to the heat sink.
KR1020090115589A 2009-11-27 2009-11-27 light of LED KR101101256B1 (en)

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KR101231551B1 (en) * 2011-07-26 2013-02-08 주식회사 삼광산전 LED lighting apparatus with heat dissipation frame of air rotation type

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KR101309843B1 (en) * 2013-03-25 2013-09-23 에스앤피글로벌주식회사 Manufacturing method of led light
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* Cited by examiner, † Cited by third party
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KR101231551B1 (en) * 2011-07-26 2013-02-08 주식회사 삼광산전 LED lighting apparatus with heat dissipation frame of air rotation type

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