KR20110058534A - 가스분사장치 및 이를 갖는 공정 챔버 - Google Patents
가스분사장치 및 이를 갖는 공정 챔버 Download PDFInfo
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- KR20110058534A KR20110058534A KR1020090115358A KR20090115358A KR20110058534A KR 20110058534 A KR20110058534 A KR 20110058534A KR 1020090115358 A KR1020090115358 A KR 1020090115358A KR 20090115358 A KR20090115358 A KR 20090115358A KR 20110058534 A KR20110058534 A KR 20110058534A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45565—Shower nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
Description
Claims (10)
- 가스 유입구가 형성된 지지판;상기 지지판으로부터 일정 거리 이격되게 배치되며, 상기 가스 유입구를 통해 유입된 가스를 피처리 기판 방향으로 분사하기 위한 다수의 가스 분사홀들이 형성된 가스 분사판;상기 가스 분사판의 가장자리를 따라 서로 이격되게 배치되며, 일단부는 상기 가스 분사판에 결합 고정되고 타단부는 상기 가스 분사판의 열변형에 따라 유동되도록 상기 지지판에 의해 지지되는 다수의 연결 블록들; 및상기 가스 분사판의 가장자리를 따라 상기 연결 블록들 사이에 형성되어 상기 지지판과 상기 가스 분사판 사이의 공간을 밀폐시키는 차단막을 포함하는 가스분사장치.
- 제1항에 있어서,상기 지지판의 측면에는 내측으로 오목하게 홈부가 형성되며,상기 연결 블록의 타단부에는 측면으로부터 돌출되어 상기 지지판에 의해 유동 가능하게 지지되도록 상기 홈부에 삽입되는 삽입부가 형성된 것을 특징으로 하는 가스분사장치.
- 제2항에 있어서,상기 연결 블록은 상기 삽입부가 형성된 측면의 수직한 측면에 형성되어 상기 차단막의 단부가 삽입되는 결합홈을 포함하는 것을 특징으로 하는 가스분사장치.
- 제2항에 있어서,상기 연결 블록과 상기 지지판 중 어느 하나에는 상기 지지판에 상기 삽입부가 지지되는 부분에 열팽창 방향을 규제하기 위한 방향규제 돌기가 형성되며, 상기 연결 블록과 상기 지지판 중 다른 하나에는 상기 방향규제 돌기가 삽입되는 방향규제 홈이 형성된 것을 특징으로 하는 가스분사장치.
- 제4항에 있어서,상기 방향규제 돌기는 상기 연결 블록의 상기 삽입부로부터 상기 일단부 방향으로 돌출된 것을 특징으로 하는 가스분사장치.
- 제5항에 있어서,상기 방향규제 돌기가 형성된 상기 연결 블록은 상기 지지판의 4변 각각에 적어도 하나가 배치되는 것을 특징으로 하는 가스분사장치.
- 제2항에 있어서,상기 연결 블록의 삽입부와 상기 지지판의 홈부 사이에 형성되어 마찰을 감 소시키는 슬라이딩 패드를 더 포함하는 것을 특징으로 하는 가스분사장치.
- 제2항에 있어서,고주파 전원이 인가되는 상기 지지판과 상기 연결 블록을 전기적으로 연결하는 도전 부재를 더 포함하는 것을 특징으로 하는 가스분사장치.
- 챔버 몸체;상기 챔버 몸체의 내부에 설치되어 피처리 기판을 지지하는 기판 지지부; 및상기 챔버 몸체의 내부에 상기 기판 지지부와 대향하게 설치되어 상기 피처리 기판 방향으로 가스를 분사하는 가스분사장치를 포함하며,상기 가스분사장치는,가스 유입구가 형성된 지지판,상기 지지판으로부터 일정 거리 이격되게 배치되며, 상기 가스 유입구를 통해 유입된 가스를 피처리 기판 방향으로 분사하기 위한 다수의 가스 분사홀들이 형성된 가스 분사판,상기 가스 분사판의 가장자리를 따라 서로 이격되게 배치되며, 일단부는 상기 가스 분사판에 결합 고정되고 타단부는 상기 가스 분사판의 열변형에 따라 유동되도록 상기 지지판의 측면에 형성된 홈부에 삽입되어 지지되는 다수의 연결 블록들; 및상기 가스 분사판의 가장자리를 따라 상기 연결 블록들 사이에 형성되어 상 기 지지판과 상기 가스 분사판 사이의 공간을 밀폐시키는 차단막을 포함하는 것을 특징으로 하는 공정 챔버.
- 제9항에 있어서,상기 연결 블록과 상기 지지판 중 어느 하나에는 상기 지지판에 상기 연결 블록이 지지되는 부분에 열팽창 방향을 규제하기 위한 방향규제 돌기가 형성되며, 상기 연결 블록과 상기 지지판 중 다른 하나에는 상기 방향규제 돌기가 삽입되는 방향규제 홈이 형성된 것을 특징으로 하는 공정 챔버.
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KR1020090115358A KR101128267B1 (ko) | 2009-11-26 | 2009-11-26 | 가스분사장치 및 이를 갖는 공정 챔버 |
CN2010101242387A CN102082072B (zh) | 2009-11-26 | 2010-03-15 | 气体喷射装置及具备该气体喷射装置的处理室 |
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KR100203780B1 (ko) * | 1996-09-23 | 1999-06-15 | 윤종용 | 반도체 웨이퍼 열처리 장치 |
JP2002045683A (ja) | 2000-08-08 | 2002-02-12 | Hitachi Kokusai Electric Inc | 基板処理装置 |
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JP2007046141A (ja) * | 2005-08-12 | 2007-02-22 | Ngk Insulators Ltd | 加熱装置 |
KR100718643B1 (ko) | 2005-11-28 | 2007-05-15 | 주식회사 유진테크 | 샤워헤드의 체결구조 |
KR100981039B1 (ko) * | 2008-05-20 | 2010-09-10 | 주식회사 테스 | 가스 공급 어셈블리 |
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CN102082072B (zh) | 2013-05-29 |
KR101128267B1 (ko) | 2012-03-26 |
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