KR20110055617A - 화학적 기계적 폴리싱 시스템을 위한 개선된 방법 - Google Patents

화학적 기계적 폴리싱 시스템을 위한 개선된 방법 Download PDF

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Publication number
KR20110055617A
KR20110055617A KR1020117005670A KR20117005670A KR20110055617A KR 20110055617 A KR20110055617 A KR 20110055617A KR 1020117005670 A KR1020117005670 A KR 1020117005670A KR 20117005670 A KR20117005670 A KR 20117005670A KR 20110055617 A KR20110055617 A KR 20110055617A
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KR
South Korea
Prior art keywords
polishing
substrate
polishing surface
fluid
swp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020117005670A
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English (en)
Korean (ko)
Inventor
유린 왕
로이 난고이
알페이 일마즈
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
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Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20110055617A publication Critical patent/KR20110055617A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
KR1020117005670A 2008-08-14 2009-07-15 화학적 기계적 폴리싱 시스템을 위한 개선된 방법 Withdrawn KR20110055617A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/191,959 2008-08-14
US12/191,959 US20100041316A1 (en) 2008-08-14 2008-08-14 Method for an improved chemical mechanical polishing system

Publications (1)

Publication Number Publication Date
KR20110055617A true KR20110055617A (ko) 2011-05-25

Family

ID=41669549

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117005670A Withdrawn KR20110055617A (ko) 2008-08-14 2009-07-15 화학적 기계적 폴리싱 시스템을 위한 개선된 방법

Country Status (4)

Country Link
US (1) US20100041316A1 (https=)
JP (1) JP2011530423A (https=)
KR (1) KR20110055617A (https=)
WO (1) WO2010019339A2 (https=)

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US20130115862A1 (en) * 2011-11-09 2013-05-09 Applied Materials, Inc. Chemical mechanical polishing platform architecture
US20140020830A1 (en) * 2012-07-19 2014-01-23 Applied Materials, Inc. Carrier Head Sweep Motor Current for In-Situ Monitoring
US20140024299A1 (en) * 2012-07-19 2014-01-23 Wen-Chiang Tu Polishing Pad and Multi-Head Polishing System
US9508575B2 (en) * 2013-03-15 2016-11-29 Applied Materials, Inc. Disk/pad clean with wafer and wafer edge/bevel clean module for chemical mechanical polishing
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WO2022072079A2 (en) 2020-09-08 2022-04-07 Applied Materials, Inc. Substrate handling systems and methods for cmp processing
US11929264B2 (en) 2021-03-03 2024-03-12 Applied Materials, Inc. Drying system with integrated substrate alignment stage
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Also Published As

Publication number Publication date
JP2011530423A (ja) 2011-12-22
WO2010019339A3 (en) 2010-06-03
WO2010019339A2 (en) 2010-02-18
US20100041316A1 (en) 2010-02-18

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