KR20110054194A - Substrate assembly for flexible display device and method of manufacturing flexible display device using the same - Google Patents

Abstract

PURPOSE: A substrate assembly for a flexible display device is provided to increase the production yield by simplifying the bonding process and separating process for a transfer plate and a flexible substrate. CONSTITUTION: A substrate assembly for a flexible display device comprises a transfer plate, a first coating layer formed on one surface of the transfer plate by coating a first material with a magnetic force, a flexible substrate, and a second coating layer which is bonded with the first coating layer by the magnetic force. The second coating layer is formed by coating a second material on the rear surface of the flexible substrate having strong magnetic force.

Description

Substrate assembly for flexible display device and manufacturing method of flexible display device using same {SUBSTRATE ASSEMBLY FOR FLEXIBLE DISPLAY DEVICE and METHOD OF MANUFACTURING FLEXIBLE DISPLAY DEVICE USING THE SAME}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate assembly for manufacturing a flexible display device and a method of manufacturing a flexible display device using the same. In particular, the flexible substrate and the transfer substrate are easily bonded and detached to produce a flexible display device. The present invention relates to a substrate assembly for a flexible display device capable of improving yield and a method of manufacturing the flexible display device using the same.

In recent years, as the information age has entered, the display field for visually expressing electrical information signals has been rapidly developed, and various flat panel display devices having excellent performance of thinning, light weight, and low power consumption have been developed. Flat Display Device has been developed to quickly replace the existing Cathode Ray Tube (CRT). Specific examples of such a flat panel display include a liquid crystal display device (LCD), a plasma display panel device (PDP), a field emission display device (FED), and an electroluminescent display. Electro luminescence Display Device (ELD) etc. are mentioned.

Such flat panel displays essentially include a flat panel display panel that realizes an image by having a pair of insulating substrates faced to each other with a unique light emitting or polarizing material layer interposed therebetween. In this case, the insulating substrate is generally made of a rigid material that is stable to a semiconductor or metal pattern process for forming transistors, lines, etc. included in a display panel, such as glass, and maintains a flat state. . However, an insulating substrate made of glass (hereinafter, referred to as a "glass substrate") is likely to be broken by force from the outside due to the material characteristics of the glass. Therefore, the glass substrate should be thicker than a predetermined thickness that does not break due to external force, and since the glass substrate is fragile in nature, there is a disadvantage in that it is virtually impossible to change the shape freely. There is a limit to this, there is a problem that the portability is lowered because the shape deformation is not easy.

As a solution to this problem, a flexible flat display device (hereinafter, referred to as a "flexible display device") capable of lightly and easily bent shape deformation is proposed to increase portability. Technology development for the device continues. Such a flexible display device uses a flexible insulating substrate (hereinafter, referred to as a "flexible substrate") that is easily bent in accordance with a force applied from the outside, instead of a rigid glass substrate. That is, the flexible display device includes a flexible display panel having a structure in which a pair of flexible substrates are face-bonded with their light emitting layers or polarizing material layers interposed therebetween. In this case, the flexible substrate may be formed of plastic or metal foil in the form of a film.

However, the existing manufacturing equipment for manufacturing the display panel is designed to fit the glass substrate to maintain a flat state, there is a problem that it is difficult to be applied to a flexible substrate that is not easily bent to maintain a flat state. That is, when the flexible display panel is manufactured by the existing manufacturing equipment, the flexible substrate may be easily bent due to the property of the flexible substrate. A pattern may be formed on the flexible substrate, thereby causing a problem in that the pattern is not formed properly.

Accordingly, in order to manufacture a flexible display panel using existing manufacturing equipment, a substrate assembly in which a flexible substrate is bonded to a hard and flat transfer substrate such as glass is manufactured. After performing a process of forming a stack of display panels with respect to the assembly, there is a method of manufacturing a flexible display panel by removing the transfer substrate from a substrate assembly in which a stack of display panels is formed on the flexible substrate.

1 is a cross-sectional view showing a substrate assembly according to the prior art.

As shown in FIG. 1, the substrate assembly 10 according to the related art includes a transfer substrate 11 formed flat on a hard material such as glass, and an adhesive layer 12 formed on one surface of the transfer substrate 11. And a flexible substrate 13 disposed on the adhesive layer 12. Here, the adhesive layer 12 is provided with a double-sided adhesive such as OCA (Optical Clear Adhesive) or UV Resin having an adhesive force while being solidified in response to ultraviolet (UV). Then, the flexible substrate 13 is made of plastic or metal in the form of a film.

According to the prior art, since the pressure-sensitive adhesive layer 12 and the flexible substrate 13 bonded to each other are provided with materials having different expansion rates with respect to heat, the conventional substrate assembly 10 is formed by a heat treatment process, which is one of the pattern processes. The pressure-sensitive adhesive layer 12 and the flexible substrate 13 may be expanded or contracted differently by heat, so that the entire shape of the substrate assembly 10 may be deformed, such as bending. In addition, an outgassing phenomenon in which a fume is generated in the adhesive layer 12 by a heat treatment process is provided between the transfer substrate 11 and the adhesive layer 12 or between the adhesive layer 12 and the flexible substrate 13. Adhesion between the layers 1) may weaken, and the flexible substrate 13 may cry, or the flexible substrate 13 or the transfer substrate 11 may be separated from the adhesive layer 12. In addition, due to misalignment, the flexible substrate 13 may not be flatly bonded onto the adhesive layer 12. As described above, the conventional substrate assembly 10 uses the adhesive layer 12 to bond the transfer substrate 11 and the flexible substrate 12 to be deformed by the adhesive layer 12 during the heat treatment process. If the flexible substrate 12 is misaligned on the adhesive layer 12, modification is impossible, and thus, the manufacturing yield of the display panel is difficult to be improved.

Further, in the conventional substrate assembly 10, the transfer substrate 11 and the adhesive layer (so that the bonding between the transfer substrate 11 and the flexible substrate 12 are firmly maintained until the manufacturing process of the display panel is completed). A predetermined pressure is applied when bonding 12) and bonding the adhesive layer 12 and the flexible substrate 13 together. By such two pressurization processes, a large amount of stress is applied to the transfer substrate 11. When the manufacturing process of the display panel is completed, the transfer substrate 11 should be removed from the substrate assembly 10 in which the laminate of the display panel is formed on the flexible substrate 13. At this time, the transfer substrate 11 is subjected to a large amount of stress by a process of separating from the flexible substrate 13. In this way, the transfer substrate 11, which is subjected to a large amount of stress by the bonding and detaching process, is more likely to be damaged or broken, so that the number of reusable transfer substrates 11 is reduced, thereby increasing the manufacturing cost of the display panel. There is a problem.

Accordingly, the present invention facilitates the bonding process and the separating process of the transfer substrate and the flexible substrate as compared with the prior art, and therefore can improve the manufacturing yield of the flexible display panel and reduce the manufacturing cost of the flexible display panel. A substrate assembly for a flexible display device and a method of manufacturing the flexible display device using the same are provided.

In order to solve this problem, the present invention, the transfer substrate is provided flat; A first coating layer formed by coating a first material having magnetic properties on one surface of the transfer substrate; A flexible substrate provided to be flexible; And a second coating layer formed by coating a ferromagnetic second material on a rear surface of the flexible substrate, and bonded to the first coating layer by a magnetic force.

In addition, the present invention, the step of forming a first coating layer by coating a first material having a magnetic on one surface of the transfer substrate is provided flat; Forming a second coating layer by coating a ferromagnetic second material on a rear surface of the flexible substrate provided to be flexible; Bonding the transfer substrate and the flexible substrate by magnetization of the first coating layer to generate a substrate assembly; Forming a stack of display panels on an upper surface of the flexible substrate of the substrate assembly; And removing the transfer substrate from the substrate assembly on which the stack of the display panel is formed.

As described above, in the substrate assembly for the flexible display device according to the present invention, as the transfer substrate and the flexible substrate are bonded to each other by using a magnetic force instead of the adhesive force of the adhesive layer, the flexible substrate may be flatly adhered to the transfer substrate, and the display panel The flexible substrate may remain flat until the end of the manufacturing process, and the stress applied to the transfer substrate is reduced compared to the prior art, thereby increasing the number of reuse of the transfer substrate. Therefore, the manufacturing yield of the flexible display panel can be improved, and the manufacturing cost can be reduced.

Hereinafter, a substrate assembly according to an exemplary embodiment of the present invention and a method of manufacturing a flexible display device using the same will be described with reference to the accompanying drawings.

A substrate assembly according to an embodiment of the present invention described below has a configuration in which a pair of flexible substrates are bonded to each other with an inherent light emitting or polarizing material layer interposed therebetween to realize a flat panel display panel (hereinafter, referred to as 'flexible' Display panel '). Flexible display devices including the flexible display panel include active matrix liquid crystal display (AMLCD), organic light emitting diodes (OLED), electrophoretic display (Electrophoretic Display), Field Emission Display (FED), Thin Film Transistor Light Emitting Polymer, Cholesteric Liquid Crystal Display.

2 is a cross-sectional view illustrating a substrate assembly according to an exemplary embodiment of the present invention.

As shown in FIG. 2, the substrate assembly 100 according to the embodiment of the present invention is formed of a transfer substrate 110 and a first material having magnetism on one surface of the transfer substrate 110. Ferromagnetism having magnetic properties by magnetic force or electric force on the back surface of the first coating layer 120, the flexible substrate 130 provided to be flexible, and the flexible substrate 130. And a second coating layer formed by coating a second material of the second material and bonded to the first coating layer 12 by a magnetic force between the first material and the first coating layer generated by the magnetism of each of the second materials. It is composed.

The transfer substrate 110 is flat and made of a stable and hard material such as glass, chemical or heat, and the flexible substrate 130 is stable to chemical or heat, and has plastic or metal in the form of a film. metal).

The first coating layer 120 is provided with a first material that retains magnetism for a long time without an electric field or magnetic field applied from the outside, such as a magnet, and the first material is formed on a surface of the transfer substrate 110.薄膜, may be an alloy containing a neodium (Nd) -based metal or a neodymium (Nd) -based metal that can be coated in the form of a thin film.

The second coating layer 140 is provided with a ferromagnetic second material that is magnetically generated by being influenced by magnetic or magnetic energy applied from the outside of the first material, and the second material is formed on the rear surface of the flexible substrate 130. It may be a transition metal or a alloy containing a transition metal coatable with a thin film.

Here, the first coating layer 120 and the second coating layer 140 is generated by a magnetic force (magnetic force) due to the respective magnetic, this magnetic force is mutually between the first coating layer 120 and the second coating layer 140 Since it acts as an attractive force (attractive force), the first coating layer 120 and the second coating layer 140 is bonded to each other by the magnetic force between the first coating layer 120 and the second coating layer 140. As such, as the first coating layer 120 and the second coating layer 140 are bonded together, the transfer substrate 110 on which the first coating layer 120 is formed and the flexible substrate 130 on which the second coating layer 140 is formed are bonded together. do.

During the manufacturing process of the display panel, the first coating layer 120 has a Curie temperature higher than the process temperature of the heat treatment process included in the manufacturing process of the display panel so that the first coating layer 120 does not lose its magnetic properties. Curie temperature). In general, since the process temperature of the heat treatment process is about 150 degrees Celsius, the first coating layer 120 may be made of a first material having a Curie temperature of 150 degrees Celsius or more. In addition, the second coating layer 140 may also be made of a second material having a Curie temperature higher than the process temperature of the heat treatment process included in the manufacturing process of the display panel.

In addition, the magnetism of the first material and the second material is weakened by heat and strengthened by electric force or magnetic force. Accordingly, according to an embodiment of the present invention, after applying heat to the first coating layer 120 to weaken the magnetism of the first material, the flexible substrate with the first coating layer 120 and the second coating layer 140 interposed therebetween. Aligned so that the 130 is positioned flat on the transfer substrate 110, the alignment of the flexible substrate 130 is facilitated by the weak magnetism of the first coating layer (120). The transfer substrate 110 and the flexible substrate 130 aligned with the first coating layer 120 and the second coating layer 140 interposed therebetween are positioned in an electric field in which electric force exists. At this time, the magnetic properties of each of the first coating layer 120 and the second coating layer 140 is strengthened by the electric force, the magnetic force between the first coating layer 120 and the second coating layer 140 is stronger, the transfer substrate 110 The flexible substrate 130 may be firmly bonded.

As described above, the substrate assembly 100 according to the embodiment of the present invention is different from the conventional substrate assembly having a structure in which the transfer substrate and the flexible substrate are face-bonded with the adhesive layer interposed therebetween, instead of the adhesive force of the adhesive layer. The transfer substrate 110 and the flexible substrate 130 are formed by using a magnetic force between the first coating layer 120 and the second coating layer 140 generated by the magnetism of each of the first coating layer 120 and the second coating layer 140. It has a face-to-face bonded structure. Accordingly, the pressure-sensitive adhesive layer deformed by the heat treatment process or generates fumigation can be excluded.

Next, a method of manufacturing a flexible display device using the substrate assembly 100 according to an exemplary embodiment of the present invention will be described.

3 is a flowchart illustrating a method of manufacturing the flexible display device using the substrate assembly illustrated in FIG. 2, and FIGS. 4A to 4E are cross-sectional views schematically illustrating a method of manufacturing the flexible display device illustrated in FIG. 3.

In the method of manufacturing the flexible display device according to the exemplary embodiment of the present invention, as shown in FIG. 3, forming the first coating layer 120 on one surface of the transfer substrate 110 (S100) and the flexible substrate 130. Forming a second coating layer 140 on the rear surface of the substrate (S110), the transfer substrate 110 and the flexible substrate 130 are bonded to each other in a state in which the first coating layer 120 and the second coating layer 140 face each other. Generating the assembly 100 (S120), forming a laminate in which a semiconductor layer or a metal layer is patterned on the upper surface of the flexible substrate 130 of the substrate assembly 100 (S130) and the flexible substrate 130 And removing the transfer substrate 110 from the substrate assembly 100 having the stack formed thereon (S140).

In the step (S100) of forming the first coating layer 120 on one surface of the transfer substrate 110, the transfer substrate 110 is provided with a stable and hard material such as glass, chemical or heat. As shown in FIG. 4A, one surface of the transfer substrate 110 provided as described above is coated with a first material having magnetic properties to form a first coating layer 120. In this case, the first material is a material such as a magnet capable of retaining magnetism for a long time even when no external electric field or external magnetic field is applied, and a metal of neodymium (Nd) series that may be coated on the transfer substrate 110 in a thin film form. It may be an alloy containing a neodymium (Nd) -based metal. In addition, the first coating layer 120, the first having a Curie temperature higher than the process temperature in the step of forming a stack (S130) in order not to lose magnetic until the step of forming a stack (S130) is finished. It is prepared with 1 substance.

Then, the first coating layer 120 formed on the transfer substrate 110 is heated to weaken the magnetism of the first coating layer 120 (S101). As such, when the magnetization of the first coating layer 120 is weakened, the flexible substrate 130 may be aligned when the flexible substrate 130 is aligned on the transfer substrate 110 in operation S120 of generating the substrate assembly 100. It can be adjusted easily so that it may become a flat state.

In the step (S110) of forming the second coating layer 140 on the rear surface of the flexible substrate 130, the flexible substrate 130 is provided with plastic or metal in the form of a film. As shown in FIG. 4B, the ferromagnetic second material is coated on the rear surface of the flexible substrate 130 prepared as described above to form the second coating layer 140. At this time, the second material can be determined whether the magnetic retention according to the application of the external electric field or the external magnetic field, the ferromagnetic that is maintained for a certain time after the magnetic field generated by the external electric field or the external magnetic field removes the external electric field or the external magnetic field Has The second material may be a transition metal or an alloy including the transition metal, which may be coated on the flexible substrate 130 in a thin film form. In addition, the second coating layer 140 is similar to the first coating layer 120, in order to not lose the magnetic until the step of forming the stack (S130), in the step of forming a stack (S130) It may be provided with a second material having a Curie temperature higher than the temperature.

In the step of generating the substrate assembly 100 (S120), the flexible substrate 130 is aligned to be evenly spread on the transfer substrate 110 with the first coating layer 120 and the second coating layer 140 therebetween ( S121). At this time, the magnetization of the first coating layer 120 is weakened by the first heating step (S101), the magnetic force between the first coating layer 120 and the second coating layer 140 is weakened, the flexible substrate 130 Aligning the process to a flat state on the transfer substrate 110 can be easily performed.

Next, the transfer substrate 110 and the flexible substrate 130 aligned to face each other with the first coating layer 120 and the second coating layer 140 interposed therebetween to be positioned in an electric field in which electric force exists. By bonding the substrate 110 and the flexible substrate 130 together (S122), the substrate assembly 100 is generated (S120). In this case, the electric field is formed to have the same direction as the magnetism of the first coating layer 120, so that the first coating layer 120 and the second coating layer 140 have magnetism in the same direction. That is, each of the first coating layer 120 and the second coating layer 140 located in the electric field becomes stronger by the electric force, so that the magnetic force between the first coating layer 120 and the second coating layer 140 becomes stronger. The first coating layer 120 and the second coating layer 140 are bonded to each other. By the bonding of the first coating layer 120 and the second coating layer 140, the transfer substrate 110 and the flexible substrate 130 is bonded. Therefore, a structure in which the transfer substrate 110, the first coating layer 120, the second coating layer 140, and the flexible substrate 130 are bonded by the magnetic force between the first coating layer 120 and the second coating layer 140. The substrate assembly 100 is generated.

In the forming of the stack (S130), the stack refers to elements constituting a display panel such as a thin film transistor, a line, an electrode, a black matrix, and a color filter. In this case, a laminate is formed on the flexible substrate 130 by a process of depositing a metal layer or a semiconductor layer using the substrate assembly 100, a heat treatment process, a process of patterning the deposited metal layer or semiconductor layer, and a vacuum process. .

In step S140, in which the transfer substrate 110 is removed from the substrate assembly 100 on which the stack is formed, the substrate assembly 100 is heated to generate magnetic properties of each of the first coating layer 120 and the second coating layer 140. It weakens (S141). At this time, as the magnetic force between the first coating layer 120 and the second coating layer 140 is weakened, the attraction force attracting the first coating layer 120 and the second coating layer 140 to each other is weakened. By using the magnetic force between the weakened first coating layer 120 and the second coating layer 140, by separating (S142) the first coating layer 120 and the second coating layer 140 from each other, in the substrate assembly 100 Remove the transfer substrate 110.

On the other hand, according to an embodiment of the present invention, the heating step (S101) and the first coating layer 120 to weaken the magnetism of each of the first coating layer 120 before the flexible substrate 130 is aligned on the transfer substrate 110. Before the separation of the first coating layer 120 and the second coating layer 140, except for the heating step (S141) for weakening the magnetism of each of the first coating layer 120 and the second coating layer 140, the transfer substrate 110 is a large amount You will not be stressed. Accordingly, the transfer substrate 110 removed from the substrate assembly 100 does not have a high degree of damage, and thus can be reused a plurality of times. Therefore, the transfer substrate 110 determined to be reused among the transfer substrates 110 removed from the substrate assembly 100 is reused (S150). That is, since the transfer substrate 110 to be reused has the same structure as shown in FIG. 4A, the magnetism of the first coating layer 120 is also weakened in order to be removed from the substrate assembly 100, thereby removing the substrate assembly 100. In step S120 to generate.

In the above, the first coating layer 120 and the second coating layer 140 has been described as being coated on the transfer substrate 110 and the flexible substrate 130, respectively. However, alignment of the flexible substrate 130 is facilitated, and the bonding between the transfer substrate 110 and the flexible substrate 130 is maintained firmly, and the removal of the transfer substrate 110 from the substrate assembly 100 is easy. To do so, the first coating layer 120 and the second coating layer 140 may be patterned.

5A is a plan view showing a pattern of a first coating layer formed on a transfer substrate according to another embodiment of the present invention, and FIG. 5B is a plan view showing a pattern of a second coating layer formed on a flexible substrate according to another embodiment of the present invention. to be.

According to another embodiment of the present invention, as shown in FIG. 5A, the first coating layer 120 is formed to have a pattern in which the first material is arranged in the first direction. That is, in the step (S100) of forming the first coating layer 120 on one surface of the transfer substrate 110, after coating the first material on one surface of the transfer substrate 110, the first direction has a pattern in a first direction. The material is patterned to form the first coating layer 120.

The second coating layer 140 is formed to have a pattern in which the second material is arranged in a second direction perpendicular to the first direction, as shown in FIG. 5B. That is, in the step (S110) of forming the second coating layer 140 on the rear surface of the flexible substrate 130, after coating the second material on the rear surface of the flexible substrate 130, the second substrate has a pattern in the second direction. The material is patterned to form the second coating layer 140.

However, FIGS. 5A and 5B exemplarily illustrate patterns of the first coating layer 120 and the second coating layer 140 according to another embodiment of the present invention, and the alignment of the flexible substrate 130 is facilitated. According to the present invention, any combination of the transfer substrate 110 and the flexible substrate 130 may be maintained firmly, and any pattern that may facilitate removal of the transfer substrate 110 from the substrate assembly 100 may be implemented. May be applied to the example.

As described above, the substrate assembly 100 according to the embodiment of the present invention uses the magnetic force between the first coating layer 120 and the second coating layer 140 instead of the adhesive force of the adhesive layer, and the flexible substrate 110 and the flexible substrate. By bonding the 130, as the bonding and separation of the transfer substrate 110 and the flexible substrate 130 becomes easier, the number of reuse of the transfer substrate 110 is increased by reducing the stress applied to the transfer substrate 110. The manufacturing cost can be reduced.

In addition, the flexible substrate 130 is aligned to be unfolded evenly on the transfer substrate 110 in a state in which the magnetic force between the first coating layer 120 and the second coating layer 140 is weakened, and an electric force is applied to the first coating layer ( By strengthening the magnetic force between the 120 and the second coating layer 140 to strengthen the bonding of the transfer substrate 110 and the flexible substrate 130, it is possible to prevent the deformation of the shape of the substrate assembly 100, the substrate assembly Since the flexible substrate 130 of 100 may be maintained in a flat state, reliability of a process of forming a stack of display panels may be increased, and manufacturing yield may be improved.

The present invention described above is not limited to the above-described embodiment and the accompanying drawings, and various substitutions, modifications, and changes may be made without departing from the technical spirit of the present invention.

1 is a cross-sectional view showing a substrate assembly according to the prior art.

2 is a cross-sectional view illustrating a substrate assembly according to an exemplary embodiment of the present invention.

3 is a flowchart illustrating a method of manufacturing a flexible display device using the substrate assembly shown in FIG. 2.

4A through 4E are cross-sectional views schematically illustrating a method of manufacturing the flexible display device illustrated in FIG. 3.

Figure 5a is a plan view showing a pattern of the first coating layer formed on the transfer substrate according to an embodiment of the present invention.

5B is a plan view illustrating a pattern of a second coating layer formed on a flexible substrate according to an exemplary embodiment of the present invention.

<Description of identification numbers for the main parts of the drawings>

100: substrate assembly 110: transfer substrate

120: first coating layer 130: flexible substrate

140: second coating layer 200: laminate of display panel

Claims (13)

A transfer substrate provided flat; A first coating layer formed by coating a first material having magnetic properties on one surface of the transfer substrate; A flexible substrate provided to be flexible; And And a second coating layer formed by coating a ferromagnetic second material on a rear surface of the flexible substrate and bonded to the first coating layer by a magnetic force. The method of claim 1, The first coating layer is formed by coating a first material corresponding to an alloy including a neodymium-based metal or a neodymium-based metal on one surface of the transfer substrate in a thin film form, And the second coating layer is formed by coating a second material corresponding to a transition metal or an alloy including a transition metal on a rear surface of the flexible substrate in a thin film form. The method of claim 2, The first coating layer has a pattern arranged in a first direction, The second coating layer has a pattern arranged in a second direction perpendicular to the first direction substrate assembly for a flexible display device. The method of claim 2, The transfer substrate is made of glass, The flexible substrate is a substrate assembly for a flexible display device, characterized in that provided in a plastic film or metal in the form of a film. Forming a first coating layer by coating a first material having magnetic properties on one surface of the transfer substrate being flat; Forming a second coating layer by coating a ferromagnetic second material on a rear surface of the flexible substrate provided to be flexible; Bonding the transfer substrate and the flexible substrate by magnetization of the first coating layer to generate a substrate assembly; Forming a stack of display panels on an upper surface of the flexible substrate of the substrate assembly; And And removing the transfer substrate from the substrate assembly in which the stack of the display panel is formed. The method of claim 5, Generating the board assembly Arranging the flexible substrate to be flat on the transfer substrate with the first coating layer and the second coating layer interposed by the magnetism of the first coating layer; And The aligned flexible substrate and the transfer substrate are positioned in an electric field in the same direction as the magnetism of the first coating layer, so that the aligned flexible substrate is subjected to a magnetic force between the first coating layer and the second coating layer strengthened by the electric force in the electric field. And bonding the transfer substrate to each other. The method of claim 6, Before aligning the flexible substrate on the transfer substrate, And heating the first coating layer formed on the transfer substrate so that the magnetism of the first coating layer is weakened. The method of claim 6, Removing the transfer substrate from the substrate assembly Heating the substrate assembly to weaken the magnetism of each of the first and second coating layers; And And separating the first coating layer and the second coating layer by using magnetic properties of the weakened first coating layer and the second coating layer, respectively. The method of claim 8, And removing the substrate from the substrate assembly to align the flexible substrate on which the second coating layer is formed on the transfer substrate on which the first coating layer is formed. The method of claim 6, The forming of the first coating layer may include patterning the first material so that the first material is arranged in a first direction. The method of claim 10, The forming of the second coating layer may include patterning the second material so that the second material is arranged in a second direction perpendicular to the first direction. The method of claim 6, The first material is an alloy containing a neodymium-based metal or a neodymium-based metal having a Curie temperature of 150 degrees Celsius or more, And the second material is a transition metal or an alloy containing a transition metal. The method of claim 6, And wherein the electric field is formed in the same direction as the magnetism of the first material.

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