CN102445805A - Electronic paper structure and manufacturing method thereof - Google Patents
Electronic paper structure and manufacturing method thereof Download PDFInfo
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- CN102445805A CN102445805A CN201010518013XA CN201010518013A CN102445805A CN 102445805 A CN102445805 A CN 102445805A CN 201010518013X A CN201010518013X A CN 201010518013XA CN 201010518013 A CN201010518013 A CN 201010518013A CN 102445805 A CN102445805 A CN 102445805A
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Abstract
The invention discloses an electronic paper structure and a manufacturing method. The electronic paper structure comprises a hard base plate, a soft base plate, at least one magnetic element for temporarily fixing the soft base plate to the hard base plate, a drive base plate which is arranged on the soft base plate, an electronic paper display layer which is arranged on the drive base plate, and a protective layer which is arranged on the electronic paper display layer.
Description
Technical field
The invention relates to a kind of display device, and particularly about a kind of Electronic Paper structure and Electronic Paper manufacturing approach.
Background technology
Display device of electronic paper (Electronic Paper Display, EPD) be a kind of have high to Presentation Function such as paper, utmost point low-power consumption, and frivolous and resilient profile.Therefore, this electronic paper display device makes the observer to have to read the impression as the books, has the function of data for updating simultaneously.
The technology of soft electronic paper now; Include plastic sheeting is attached on the substrate; Then on plastic sheeting, make the driving substrate that comprises thin film transistor (TFT) again; And the Electronic Paper display layer is arranged on the driving substrate, and on the Electronic Paper display layer, form protective seam, peel off plastic sheeting and substrate with the heating or the mode of UV-irradiation more at last.Perhaps; The technology of another kind of soft electronic paper is earlier pi to be coated on the substrate; Then on polyimide, make driving substrate, Electronic Paper display layer and protective seam equally in regular turn, destroy chemical bonded refractory between pi and substrate with laser excitation more at last, substrate is separated.
Above-mentioned use heat, ultraviolet light or the operation of laser lift-off substrate need spend the extra time, and in peeling off the process of substrate, also might cause damage to the thin film transistor (TFT) in the driving substrate thereby reduce the product yield.
Summary of the invention
Therefore the purpose of this invention is to provide a kind of Electronic Paper structure and manufacturing approach thereof, in order to reduce the situation that causes the thin film transistor (TFT) damage because of strippable substrate.
According to one side of the present invention a kind of Electronic Paper structure is proposed; Comprise rigid substrate, soft substrate, in order to temporarily fixing soft substrate on rigid substrate at least one magnetic element, be arranged on the flexible base plate driving substrate, be arranged on the driving substrate the Electronic Paper display layer, and be arranged on the Electronic Paper display layer protective seam.Magnetic element can be arranged at respectively rigid substrate both sides first magnetic material layer and second magnetic material layer, wherein second magnetic material layer and soft substrate bonded.Magnetic element can be arranged at rigid real estate to soft substrate one side on first magnetic material layer and second magnetic material layer, wherein second magnetic material layer and this soft substrate bonded.Rigid substrate can be the magnetic substrate, magnetic element can be arranged on the magnetic substrate magnetic material layer, wherein magnetic material layer and soft substrate bonded.Rigid substrate can be the magnetic substrate, and magnetic element can be magnetic clamp, and soft substrate is seized on both sides by the arms between between magnetic substrate and the magnetic clamp.
Another aspect of the present invention be a kind of application of aforementioned the Electronic Paper manufacturing approach of Electronic Paper structure, comprising provides the Electronic Paper structure, and demagnetization magnetic element or remove magnetic clamp, and soft substrate is separated with rigid substrate.
Another aspect of the present invention is a kind of Electronic Paper structure; Comprise rigid magnetic substrate, temporarily be fixed on the rigid magnetic substrate soft magnetic substrate, be arranged on the soft magnetic substrate driving substrate, be arranged on the driving substrate the Electronic Paper display layer, and be arranged on the Electronic Paper display layer protective seam.
An aspect more of the present invention be a kind of application of aforementioned the Electronic Paper manufacturing approach of Electronic Paper structure, comprising provides this Electronic Paper structure, and the soft magnetic substrate of demagnetization, and soft magnetic substrate is separated with rigid magnetic substrate.
Useful technique effect of the present invention is: Electronic Paper structure provided by the present invention is in manufacture process; Can flexible base plate temporarily be fixed on the rigid substrate through the principle that different in nature magnetic force is inhaled mutually, through demagnetization or the mode that removes magnetic element soft substrate be separated with rigid substrate more afterwards.Except reducing the time that technology spends, more can effectively avoid over because of peeling off the situation that substrate causes the thin film transistor (TFT) damage.
Description of drawings
For let above and other objects of the present invention, characteristic, advantage can be more obviously understandable, below will combine accompanying drawing that preferred embodiment of the present invention is elaborated, wherein:
Fig. 1 is the synoptic diagram of manufacturing process that illustrates first embodiment of Electronic Paper structure of the present invention.
Fig. 2 is the synoptic diagram of manufacturing process that illustrates second embodiment of Electronic Paper structure of the present invention.
Fig. 3 is the synoptic diagram of manufacturing process that illustrates the 3rd embodiment of Electronic Paper structure of the present invention.
Fig. 4 is the synoptic diagram of manufacturing process that illustrates the 4th embodiment of Electronic Paper structure of the present invention.
Fig. 5 is the synoptic diagram of manufacturing process that illustrates the 5th embodiment of Electronic Paper structure of the present invention.
Embodiment
Below will with combine accompanying drawing to the detailed description of preferred embodiment of the present invention to clearly demonstrate spirit of the present invention; Has common knowledge the knowledgeable under any in the technical field after understanding preferred embodiment of the present invention; When can be by the technology of teachings of the present invention; Change and modification, it does not break away from spirit of the present invention and scope.
With reference to Fig. 1, it is the synoptic diagram of manufacturing process that illustrates first embodiment of Electronic Paper structure of the present invention.Step S10 forms magnetic element 120 on rigid substrate 110.Magnetic element 120 includes first magnetic material layer 122 and second magnetic material 124 on the relative two sides that is arranged on rigid substrate 110.Step S10 also comprises magnetization first magnetic material layer 122 and second magnetic material layer 124, and first magnetic material layer 122 and second magnetic material layer 124 can be attracted each other.The method of magnetizing first magnetic material layer 122 and second magnetic material layer 124 is included between first magnetic material layer 122 and second magnetic material layer 124 and applies electric field.
Then, among the step S12, soft substrate 130 is formed on second magnetic material layer 124, and this moment, soft substrate 130 can combine with second magnetic material layer 124.Attractive force between first magnetic material layer 122 and second magnetic material layer 124 can temporarily be fixed on soft substrate 130 on the rigid substrate 110.Then, on soft substrate 130, form driving substrate 140, Electronic Paper display layer 150 and protective seam 160 in regular turn, to obtain Electronic Paper structure 100.Wherein driving substrate 140 includes thin film transistor (TFT) array and driver circuit.
At last, among the step S14, demagnetization first magnetic material layer 122 and second magnetic material layer 124 comprise the electric field of removing between first magnetic material layer 122 and second magnetic material layer 124.Thus, no longer have the magnetic force that attracts each other between first magnetic material layer 122 and second magnetic material layer 124, just can be so that soft substrate 130 separates with rigid substrate 110.At this moment, soft substrate 130 and the driving substrate 140 on it, Electronic Paper display layer 150 promptly constitute soft Electronic Paper with protective seam 160.
With reference to Fig. 2, it is the synoptic diagram of manufacturing process that illustrates second embodiment of Electronic Paper structure of the present invention.Step S20 forms magnetic element 220 on rigid substrate 210.Magnetic element 220 includes first magnetic material layer 222 of a side that is arranged at rigid substrate 210, and is arranged at second magnetic material layer 224 on first magnetic material layer 222.Step S20 also comprises magnetization first magnetic material layer 222 and second magnetic material layer 224, and first magnetic material layer 222 and second magnetic material layer 224 can be attracted each other.The method of magnetizing first magnetic material layer 222 and second magnetic material layer 224 is included between first magnetic material layer 222 and second magnetic material layer 224 and applies electric field.
Then, among the step S22, soft substrate 230 is formed on second magnetic material layer 224, and this moment, soft substrate 230 can combine with second magnetic material layer 224.Attractive force between first magnetic material layer 222 and second magnetic material layer 224 can temporarily be fixed on soft substrate 230 on the rigid substrate 210.Then, on soft substrate 230, form driving substrate 240, Electronic Paper display layer 250 and protective seam 260 in regular turn, to obtain Electronic Paper structure 200.Wherein driving substrate 240 includes thin film transistor (TFT) array and driver circuit.
At last, among the step S24, demagnetization first magnetic material layer 222 and second magnetic material layer 224 comprise the electric field of removing between first magnetic material layer 222 and second magnetic material layer 224.Thus, no longer have the magnetic force that attracts each other between first magnetic material layer 222 and second magnetic material layer 224, just can be so that soft substrate 230 separates with rigid substrate 210.At this moment, soft substrate 230 and the driving substrate 240 on it, Electronic Paper display layer 250 promptly constitute soft Electronic Paper with protective seam 260.
With reference to Fig. 3, it is the synoptic diagram of manufacturing process that illustrates the 3rd embodiment of Electronic Paper structure of the present invention.Step S30 forms magnetic element 320 on rigid substrate 310.Rigid substrate 310 in the present embodiment is the magnetic substrate.Magnetic element 320 includes the magnetic material layer of a side that is arranged at rigid substrate 310.Step S30 also comprises magnetized magnetic element 320 and rigid substrate 310, and magnetic element 320 and rigid substrate 310 can be attracted each other.The method of magnetized magnetic element 320 and rigid substrate 310 is included between magnetic element 320 and the rigid substrate 310 and applies electric field.
Then, among the step S32, soft substrate 330 is formed on the magnetic element 320 of magnetic material layer, and this moment, soft substrate 330 can combine with magnetic element 320.Magnetic element 320 after the magnetization and the attractive force between the rigid substrate 310 can temporarily be fixed on soft substrate 330 on the rigid substrate 310.Then, on soft substrate 330, form driving substrate 340, Electronic Paper display layer 350 and protective seam 360 in regular turn, to obtain Electronic Paper structure 300.Wherein driving substrate 340 includes thin film transistor (TFT) array and driver circuit.
At last, among the step S34, demagnetization magnetic element 320 and rigid substrate 310 comprise the electric field of removing between magnetic element 320 and the rigid substrate 310.Thus, no longer have the magnetic force that attracts each other between magnetic element 320 and the rigid substrate 310, just can be so that soft substrate 330 separates with rigid substrate 310.At this moment, soft substrate 330 and the driving substrate 340 on it, Electronic Paper display layer 350 promptly constitute soft Electronic Paper with protective seam 360.
With reference to Fig. 4, it is the synoptic diagram of manufacturing process that illustrates the 4th embodiment of Electronic Paper structure of the present invention.Step S40 is the rigid substrate 410 that magnetic material is provided, and the magnetic element that at least one magnetic clamp 420 is provided.Wherein rigid substrate 410 can be permanent magnet with the material of magnetic clamp 420.
Then; Step S42 is for providing soft substrate 430; Soft substrate 430 is seized on both sides by the arms between magnetic clamp 420 and rigid substrate 410, through the magnetic force that attracts each other between magnetic clamp 420 and the rigid substrate 410 soft substrate 430 temporarily is fixed on the rigid substrate 410.Then, on soft substrate 430, form driving substrate 440, Electronic Paper display layer 450 and protective seam 460 in regular turn, to obtain Electronic Paper structure 400.Wherein driving substrate 440 includes thin film transistor (TFT) array and driver circuit.
At last, step S44 to remove the attractive force between magnetic clamp 420 and the rigid substrate 410, makes soft substrate 430 separate with rigid substrate 410 for removing magnetic clamp 420.At this moment, soft substrate 430 and the driving substrate 440 on it, Electronic Paper display layer 450 promptly constitute soft Electronic Paper with protective seam 460.Unnecessary flexible base plate 430 can after the excision.
With reference to Fig. 5, it is the synoptic diagram of manufacturing process that illustrates the 5th embodiment of Electronic Paper structure of the present invention.Step S50 is for providing rigid magnetic substrate 510, and soft magnetic substrate 520 is provided.Wherein step S50 also comprises rigid magnetic substrate 510 of magnetization and soft magnetic substrate 520; Be included between rigid magnetic substrate 510 and the soft magnetic substrate 520 and apply electric field, soft magnetic substrate 520 temporarily is fixed on the rigid magnetic substrate 510 through the magnetic force that attracts each other between rigid magnetic substrate 510 and the soft magnetic substrate 520.
Then, in step S52, on soft magnetic substrate 520, form driving substrate 530, Electronic Paper display layer 540 and protective seam 550 in regular turn, to obtain Electronic Paper structure 500.Wherein driving substrate 530 includes thin film transistor (TFT) array and driver circuit.
At last; Step S54 is rigid magnetic substrate 510 of demagnetization and soft magnetic substrate 520; Comprise the electric field of removing between rigid magnetic substrate 510 and the soft magnetic substrate 520; To eliminate the attractive force between rigid magnetic substrate 510 and the soft magnetic substrate 520, make rigid magnetic substrate 510 separate with soft magnetic substrate 520.At this moment, soft magnetic substrate 520 and the driving substrate 530 on it, Electronic Paper display layer 540 promptly constitute soft Electronic Paper with protective seam 550.
Rigid substrate can be glass.The magnetic substrate then can be metal substrates such as containing iron, cobalt, nickel, or the alloy with magnetic, or oxide substrate.Magnetic material layer can be formed on the rigid substrate through the vapor deposition or the mode of sputter.The material of magnetic material layer can include metals such as iron, cobalt, nickel, or the alloy with magnetic, or oxide substrate.Protective layer material can be plastics.
Can know by the invention described above preferred embodiment, use the present invention and have advantage.Electronic Paper structure provided by the present invention is in manufacture process; Can flexible base plate temporarily be fixed on the rigid substrate through the principle that different in nature magnetic force is inhaled mutually, through demagnetization or the mode that removes magnetic element soft substrate be separated with rigid substrate more afterwards.Except reducing the time that technology spends, more can effectively avoid over because of peeling off the situation that substrate causes the thin film transistor (TFT) damage.
Though the present invention discloses as above with preferred embodiment; Yet it is not in order to limit the present invention; Anyly be familiar with this operator; Do not breaking away from the spirit and scope of the present invention, when can making various changes that are equal to or replacement, so protection scope of the present invention is when looking accompanying being as the criterion that the application's claim scope defined.
Claims (10)
1. an Electronic Paper structure is characterized in that, comprises:
One rigid substrate;
One soft substrate;
At least one magnetic element is temporarily to fix this soft substrate on this rigid substrate;
One driving substrate is arranged on this flexible base plate;
One Electronic Paper display layer is arranged on this driving substrate; And
One protective seam is arranged on this Electronic Paper display layer.
2. Electronic Paper structure according to claim 1; It is characterized in that; This at least one magnetic element comprises one first magnetic material layer and one second magnetic material layer that is arranged at these rigid substrate both sides respectively, wherein this second magnetic material layer and this soft substrate bonded.
3. Electronic Paper structure according to claim 1; It is characterized in that; This at least one magnetic element comprises and is arranged at this rigid real estate to one first magnetic material layer on the one side of this soft substrate and one second magnetic material layer, wherein this second magnetic material layer and this soft substrate bonded.
4. Electronic Paper structure according to claim 1 is characterized in that, this rigid substrate is a magnetic substrate, and this at least one magnetic element is a magnetic material layer that is arranged on this magnetic substrate, wherein this magnetic material layer and this soft substrate bonded.
5. Electronic Paper structure according to claim 1 is characterized in that, this rigid substrate is a magnetic substrate, and this at least one magnetic element is at least one magnetic clamp, and this soft substrate is seized on both sides by the arms between this magnetic substrate and this at least one magnetic clamp.
6. an application is characterized in that according to the Electronic Paper manufacturing approach of claim 2,3 or 4 described Electronic Paper structures, comprises:
This Electronic Paper structure is provided; And
This at least one magnetic element of demagnetization makes this soft substrate separate with this rigid substrate.
7. an Electronic Paper manufacturing approach of using Electronic Paper structure according to claim 5 is characterized in that, comprises:
This Electronic Paper structure is provided; And
Remove this at least one magnetic clamp, this soft substrate is separated with this rigid substrate.
8. an Electronic Paper structure is characterized in that, comprises:
One rigid magnetic substrate;
One soft magnetic substrate temporarily is fixed on this rigid magnetic substrate;
One driving substrate is arranged on this soft magnetic substrate;
One Electronic Paper display layer is arranged on this driving substrate; And
One protective seam is arranged on this Electronic Paper display layer.
9. an Electronic Paper manufacturing approach of using Electronic Paper structure according to claim 8 is characterized in that, comprises:
This Electronic Paper structure is provided; And
This soft magnetic substrate of demagnetization makes this soft magnetic substrate separate with this rigid magnetic substrate.
10. a soft electronic paper is characterized in that, comprises:
One magnetic material layer;
One soft substrate is arranged on this magnetic material layer;
One driving substrate is arranged on this flexible base plate;
One Electronic Paper display layer is arranged on this driving substrate; And
One protective seam is arranged on this Electronic Paper display layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010518013.XA CN102445805B (en) | 2010-10-13 | 2010-10-13 | Electronic paper structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010518013.XA CN102445805B (en) | 2010-10-13 | 2010-10-13 | Electronic paper structure and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
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| CN102445805A true CN102445805A (en) | 2012-05-09 |
| CN102445805B CN102445805B (en) | 2014-12-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201010518013.XA Active CN102445805B (en) | 2010-10-13 | 2010-10-13 | Electronic paper structure and manufacturing method thereof |
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| CN (1) | CN102445805B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104793385A (en) * | 2015-04-23 | 2015-07-22 | 京东方科技集团股份有限公司 | Stripping method for ultrathin substrate, display substrate and display device |
| CN105320336A (en) * | 2014-07-29 | 2016-02-10 | 南京瀚宇彩欣科技有限责任公司 | Method for manufacturing anti-interference flexible electronic structure |
| CN105679806A (en) * | 2016-04-13 | 2016-06-15 | 京东方科技集团股份有限公司 | Flexible display substrate and mother board thereof, preparation method, flexible display panel and mother board thereof |
| US9842862B2 (en) | 2014-07-29 | 2017-12-12 | Hannstar Display (Nanjing) Corporation | Flexible electronic device with anti-interference structures and manufacturing method thereof |
| US9846500B2 (en) | 2014-07-29 | 2017-12-19 | Hannstar Display (Nanjing) Corporation | Organic electroluminescent touch panel with anti-interference structures |
| US9865223B2 (en) | 2014-07-29 | 2018-01-09 | Hannstar Display (Nanjing) Corporation | Optoelectronic modulation stack |
| US9910547B2 (en) | 2014-07-29 | 2018-03-06 | Hannstar Display (Nanjing) Corporation | Anti-interference touch sensing structure |
Citations (2)
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| CN1734338A (en) * | 2004-08-04 | 2006-02-15 | 精工爱普生株式会社 | Electronic display system comprising electronic paper and a writing device, electronic paper and method of manufacturing this electronic paper |
| US20100151601A1 (en) * | 2008-12-12 | 2010-06-17 | Duk-Hyun Park | Apparatus for hardening seal of electrophoretic display device and method of fabricating electrophoretic display device using thereof |
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2010
- 2010-10-13 CN CN201010518013.XA patent/CN102445805B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1734338A (en) * | 2004-08-04 | 2006-02-15 | 精工爱普生株式会社 | Electronic display system comprising electronic paper and a writing device, electronic paper and method of manufacturing this electronic paper |
| US20100151601A1 (en) * | 2008-12-12 | 2010-06-17 | Duk-Hyun Park | Apparatus for hardening seal of electrophoretic display device and method of fabricating electrophoretic display device using thereof |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105320336A (en) * | 2014-07-29 | 2016-02-10 | 南京瀚宇彩欣科技有限责任公司 | Method for manufacturing anti-interference flexible electronic structure |
| US9842862B2 (en) | 2014-07-29 | 2017-12-12 | Hannstar Display (Nanjing) Corporation | Flexible electronic device with anti-interference structures and manufacturing method thereof |
| US9846500B2 (en) | 2014-07-29 | 2017-12-19 | Hannstar Display (Nanjing) Corporation | Organic electroluminescent touch panel with anti-interference structures |
| US9865223B2 (en) | 2014-07-29 | 2018-01-09 | Hannstar Display (Nanjing) Corporation | Optoelectronic modulation stack |
| US9910547B2 (en) | 2014-07-29 | 2018-03-06 | Hannstar Display (Nanjing) Corporation | Anti-interference touch sensing structure |
| CN105320336B (en) * | 2014-07-29 | 2018-06-19 | 南京瀚宇彩欣科技有限责任公司 | The manufacturing method of the soft electronic structure of anti-interference |
| CN104793385A (en) * | 2015-04-23 | 2015-07-22 | 京东方科技集团股份有限公司 | Stripping method for ultrathin substrate, display substrate and display device |
| CN105679806A (en) * | 2016-04-13 | 2016-06-15 | 京东方科技集团股份有限公司 | Flexible display substrate and mother board thereof, preparation method, flexible display panel and mother board thereof |
| CN105679806B (en) * | 2016-04-13 | 2018-07-17 | 京东方科技集团股份有限公司 | Flexible display substrates and its motherboard, preparation method, flexible display panels and its motherboard |
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| Publication number | Publication date |
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| CN102445805B (en) | 2014-12-10 |
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