KR20110041984A - Decompression drying apparatus - Google Patents

Abstract

PURPOSE: A reduced-pressure drying unit is provided to improve the quality of the spread layer by lowering the variation of the temperature of the atmosphere inside the chamber through the overall process time. CONSTITUTION: A chamber(40) be decompressed and has the space for accepting the substrate(G) to the horizontal state. A delivering apparatus has the roller carrier way continuing in outside and inside of the chamber. The delivering apparatus carries in the substrate into the roller return on the roller carrier way in the chamber, or it in other words takes out from the chamber. A substrate lift apparatus(60) support the substrate horizontally and has a plurality of lift pins arranged inside the chamber.

Description

Decompression Drying Apparatus

The present invention relates to a reduced pressure drying apparatus for applying a drying treatment in a reduced pressure state to a film (coating film) of a coating liquid formed on a substrate to be processed.

For example, in the photolithography process of flat panel display (FPD) manufacture, the pressure reduction drying apparatus is used in order to dry suitably the coating film of the resist liquid apply | coated on to-be-processed substrates, such as a glass substrate, before prebaking.

The conventional representative pressure reduction drying apparatus is, for example, as described in Patent Document 1, and has a lower chamber in the form of a tray or a lower bottom container having an upper surface opened, and an airtight close contact or fit to the upper surface of the lower chamber. It has a lid-shaped upper chamber. The stage is arranged in the lower chamber, and the substrate is placed horizontally on the stage, and then the chamber is closed (adhering the upper chamber to the lower chamber) to perform the pressure reduction drying process.

However, the disadvantage that such a stage type pressure reduction drying apparatus requires a transfer robot or a large upper chamber opening / closing mechanism to carry in and out of a substrate is revealed with the increase in size of the substrate.

In view of such a problem, the present applicant can efficiently and safely carry out the substrate by the conveyance of the roller, and supports the substrate with a special micro lift pin having a diameter of the pin tip of 0.8 mm or less during the vacuum drying process. Patent Document 2 discloses a pressure reduction drying apparatus that minimizes the transfer trace of the substrate contact portion on the coating film on the substrate.

Further, in the vacuum drying apparatus, during the vacuum drying (vacuum exhaust), the ambient temperature in the chamber rapidly decreases from the initial temperature (usually room temperature), stops the vacuum drying (vacuum exhaust), and purges the chamber with nitrogen gas or the like. This time, the atmosphere temperature rises significantly to a temperature exceeding the initial temperature, and when the purging is stopped, the atmosphere temperature decreases toward room temperature. In response to such fluctuations in the ambient temperature in the chamber, the temperature of the fin supporting the substrate also changes, which leaves a transfer trace (a kind of variation in the film thickness) of the support fin in the resist film.

In view of the above problems, the present applicants can safely and smoothly carry out the substrates by conveying the rolls, and at the same time, the support pins are formed of a hollow cylinder having a tip end of the support pin and a vent hole formed in the side wall. By decompressing the gas for temperature control inside the support pins, a pressure reducing drying apparatus has been developed that compensates the thermal effects of the support pins from ambient or ambient temperatures, and further reduces the thermal effects of the substrate from the support pins. This is disclosed in Patent Document 3.

[Patent Document 1] Japanese Unexamined Patent Publication No. 2000-181079 [Patent Document 2] Japanese Unexamined Patent Publication No. 2008-124366 [Patent Document 3] Japanese Unexamined Patent Publication No. 2009-38231

The present applicant, apart from the decompression drying apparatus disclosed in the above Patent Documents 2 and 3, also uses a thermally inexpensive support pin without a temperature control mechanism, the thermal effect that the coating film on the substrate is received through the support pin ( In particular, as a result of the development of a reduced pressure drying apparatus in which pin transfer traces) are suppressed as much as possible, the present invention has been achieved as one of the results.

That is, the present invention efficiently and safely carries out the substrate in and out by the roller conveyance, and supports the substrate with an arbitrary thickness pin (lift pin or support pin) during the vacuum drying process, while the substrate is coated on the coating film on the substrate. Provided is a reduced pressure drying apparatus for suppressing the transfer trace of the contact portion as possible.

In addition, the present invention efficiently and safely carries out the loading and unloading of the substrate by the conveyance of the roller, and at the same time, the fluctuation of the ambient temperature in the chamber is reduced through the entire processing step from the start of the reduced pressure drying process to the end of purging, Provided is a reduced pressure drying apparatus for reducing the thermal effect of the substrate through the support pins and improving the quality of the coating film.

A pressure reduction drying apparatus according to the first aspect of the present invention is a pressure reduction drying apparatus for performing a drying treatment in a reduced pressure state on a film of a coating liquid formed on a substrate to be processed, wherein the pressure reduction drying apparatus has a space for accommodating the substrate in a horizontal state. A substrate having a possible chamber, an exhaust mechanism for evacuating the inside of the chamber in a hermetically sealed state for the drying process, and a roller conveyance path continuous in and out of the chamber; And a plurality of lift pins disposed discretely in the chamber to carry and move the substrate into or out of the chamber, and to support and move the substrate horizontally at the pin tip. In this case, the tip of the lift pin is made higher than the roller conveyance path to support the substrate, and the substrate is carried in and out. A substrate lift mechanism capable of lowering the pin tip of the lift pin than the roller conveyance path to enable the roller conveyance of the substrate by the conveying mechanism; and being generated below the substrate by vacuum evacuation during the drying process. It has a shielding plate for preventing the air flow to affect the substrate.

In the above apparatus configuration, the conveyance mechanism carries out the carrying out of the substrate by the roll conveyance, and the substrate lift mechanism raises the substrate in the chamber between the conveyance surface of the roll conveyance path and the height position for the reduced pressure drying process higher than that. Get off. During the vacuum drying process, airflow is generated in the chamber by vacuum evacuation of the exhaust mechanism. At this time, even if turbulence occurs below the substrate, particularly around the lift pins, since the shielding plate is disposed close to the substrate and directly below it, the turbulence is caused by the shielding plate. It is blocked and never touches the lower surface of the substrate. Thereby, the influence of the airflow on a board | substrate is prevented or suppressed, and also the pin trace trace (film thickness fluctuation) to remain in the coating film on a board | substrate is suppressed or suppressed.

A pressure reducing drying apparatus according to the second aspect of the present invention is a pressure reducing drying apparatus for performing a drying treatment in a reduced pressure state on a film of a coating liquid formed on a substrate to be processed, wherein the pressure reducing drying apparatus has a space for accommodating the substrate in a horizontal state. A substrate having a possible chamber, an exhaust mechanism for evacuating the inside of the chamber in a hermetically sealed state for the drying process, and a roller conveyance path continuous in and out of the chamber; A conveyance mechanism for carrying the product into or out of the chamber, a shielding plate for preventing the airflow generated below the substrate from being affected by the vacuum exhaust during the drying process, and affecting the substrate. A plurality of support pins disposed discretely on the shielding plate to horizontally support the substrate at the pin tip during processing; It is coupled to a shielding plate, and the tip of the support pin is higher than the roller conveyance path when the drying process is performed to enable the support of the substrate by the support pin, the support when carrying in and out of the substrate And a shield plate elevating mechanism for raising and lowering the shield plate so that the pin tip of the pin is lower than the roller conveyance path so that the roller conveyance of the substrate can be carried by the conveying mechanism.

In the above apparatus configuration, the conveyance mechanism carries out the carrying out of the substrate by the roll conveyance, and the shielding plate elevating mechanism moves the substrate through the shielding plate and the support pin to the conveying surface of the roll conveyance path and the height for the reduced pressure drying process higher than that. Move up and down between locations. During the vacuum drying process, airflow is generated in the chamber by vacuum evacuation of the exhaust mechanism. At this time, even if turbulence occurs below the substrate, since the shielding plate is disposed close to the substrate and directly below it, the turbulence is prevented by the shielding plate. It is blocked and never touches the lower surface of the substrate. Thereby, the influence of the airflow on a board | substrate is prevented or suppressed, and also the pin trace trace (film thickness fluctuation) to remain in the coating film on a board | substrate is suppressed or suppressed.

A pressure reduction drying apparatus according to a third aspect of the present invention is a pressure reduction drying apparatus for performing a drying treatment in a reduced pressure state on a film of a coating liquid formed on a substrate to be processed, wherein the pressure reduction drying apparatus has a space for accommodating the substrate in a horizontal state. A substrate having a possible chamber, an exhaust mechanism for evacuating the inside of the chamber in a hermetically sealed state for the drying process, and a roller conveyance path continuous in and out of the chamber; And a plurality of lift pins disposed discretely in the chamber to carry and move the substrate into or out of the chamber, and to support and move the substrate horizontally at the pin tip. In this case, the tip of the lift pin is made higher than the roller conveyance path to support the substrate, and the substrate is carried in and out. A substrate lift mechanism capable of lowering the pin tip of the lift pin than the roller conveyance path to enable the roller conveyance of the substrate by the conveying mechanism; and being generated below the substrate by vacuum evacuation during the drying process. And an airflow shielding member integrally attached to the lift pin to prevent the airflow from affecting the substrate around the lift pin.

In the above apparatus configuration, the conveyance mechanism carries out the carrying out of the substrate by the roll conveyance, and the substrate lift mechanism raises and lowers the substrate between the conveyance surface of the roll conveyance path and the height position for the reduced pressure drying process higher than that. During the vacuum drying process, airflow is generated in the chamber by vacuum evacuation of the exhaust mechanism. At this time, even if turbulence occurs below the substrate, particularly around the lift pins, since the airflow shielding member is attached to the lift pins at a height position close to the substrate, the turbulence around the lift pins is blocked by the airflow shielding member. It does not touch the lower surface of a board | substrate. Thereby, the influence of the airflow on a board | substrate is prevented or suppressed, and also the pin trace trace (film thickness fluctuation) to remain in the coating film on a board | substrate is suppressed or suppressed.

A pressure reduction drying apparatus according to a fourth aspect of the present invention is a pressure reduction drying apparatus for performing a pressure reduction drying process on a film of a coating liquid formed on a substrate to be processed, the pressure reducing chamber having a space for accommodating the substrate in a horizontal state; And an exhaust mechanism for evacuating the inside of the chamber in a closed state for the vacuum drying process, and a roller conveyance path continuous to the outside of the chamber and into the chamber, and transferring the substrate to the roller conveyance on the roller conveyance path. And a transport mechanism carried in or out of the chamber, and a plurality of support pins disposed discretely in the chamber for horizontally supporting and descending the substrate at the pin tip. When the tip of the support pin is higher than the roller conveyance path to support the substrate, and the carrying out of the substrate is performed, A substrate lift mechanism for lowering the pin tip of the support pin lower than the roller conveyance path to enable the roller conveyance of the substrate by the conveying mechanism; and supplying purging gas into the chamber to terminate the reduced pressure drying process. In order to reduce the fluctuation | variation of the atmospheric temperature in the said chamber, and a purge mechanism, it has a shielding board provided in the position which covers below the said board | substrate in the vicinity of the said roll conveyance path.

In the above apparatus configuration, the conveying mechanism carries out the loading and unloading of the substrate by the roller conveyance, and the substrate lift mechanism raises the substrate in the chamber between the conveying surface of the roller conveyance path and the height position for the reduced pressure drying process higher than that. Get off. During the vacuum drying process, airflow is generated in the chamber by vacuum exhaust of the exhaust mechanism, and a liquid (solvent) volatilizes from the coating film on the substrate, and the ambient temperature in the chamber is lower than the initial temperature (for example, room temperature). Then, in order to end the vacuum drying process, when the purging gas is supplied from the purging mechanism into the chamber, the purging gas flows in the chamber, and the atmosphere temperature in the chamber rises to a height exceeding the initial temperature. In this invention, since the shielding plate is arrange | positioned so that the board | substrate may be covered in the vicinity of a roller conveyance path, the airflow in a chamber is controlled by a shielding plate, and the fluctuation | variation of the atmospheric temperature in a chamber is reduced. Thereby, the thermal effect which a board | substrate receives through a support pin is reduced, and the film quality of the coating film on a board | substrate improves.

A pressure reduction drying apparatus according to a fifth aspect of the present invention is a pressure reduction drying apparatus for performing a pressure reduction drying process on a film of a coating liquid formed on a substrate to be processed, the pressure reducing chamber having a space for accommodating the substrate in a horizontal state; And a conveying mechanism which has a roller conveyance path continuous outside and inside of the chamber, and which carries or transports the substrate into or out of the chamber by conveying rollers on the roller conveyance path. An exhaust mechanism for evacuating the inside of the chamber in a hermetically sealed state, a purging mechanism for supplying a purging gas into the chamber for terminating the reduced pressure drying process, and an atmospheric temperature in the chamber during the reduced pressure drying process and the purging In order to reduce the size, a shielding plate provided to cover the bottom of the substrate, and the tip of the substrate pins during the reduced pressure drying process A plurality of support pins discretely installed on the shielding plate for supporting horizontally, and the shielding plate, and when the drying process is performed, the tip of the support pin is higher than the roller conveyance path when the drying process is performed. In order to enable the support of the substrate by the pin, and to carry out the substrate, the pin tip of the support pin may be lower than the roller conveyance path to enable the conveyance of the substrate by the conveyance mechanism. And a shielding plate lift mechanism for lifting and lowering the shielding plate.

In the above device configuration, the transport mechanism carries out the transport of the substrate by the roll transport, and the shielding plate lift mechanism transports the substrate through the shield plate and the support pin to the transport surface of the transport transport path and the height for the reduced pressure drying process higher than that. Move up and down between locations. During the decompression drying process, airflow is generated in the chamber by vacuum evacuation of the exhaust mechanism, and the liquid (solvent) volatilizes from the coating film on the substrate, so that the ambient temperature in the chamber is lower than the initial temperature (for example, room temperature). Then, in order to end the vacuum drying process, when the purging gas is supplied from the purging mechanism into the chamber, the purging gas flows in the chamber, and the atmosphere temperature in the chamber rises to a height exceeding the initial temperature. In this invention, since the shielding plate is arrange | positioned so that the board | substrate may be covered in the vicinity of a roller conveyance path, the airflow in a chamber is controlled by a shielding plate, and the fluctuation | variation of the atmospheric temperature in a chamber is reduced. From this, the thermal effect which a board | substrate receives through a support pin is reduced, and the film quality of the coating film on a board | substrate improves.

A pressure reduction drying apparatus according to a sixth aspect of the present invention is a pressure reduction drying apparatus for performing a pressure reduction drying process on a film of a coating liquid formed on a substrate to be processed, the pressure reducing chamber having a space for accommodating the substrate in a horizontal state; And an exhaust mechanism for evacuating the inside of the chamber in a hermetically sealed state for the reduced pressure drying process, and a roller conveyance path that is continuous in and out of the chamber, and the substrate is conveyed by a roller conveyance on the roller conveyance path. And a conveying mechanism carried in or out of the chamber, and a plurality of lift pins disposed discretely in the chamber for horizontally supporting and descending the substrate at the pin tip. When the tip of the lift pin is higher than the roller conveyance path, the substrate is supported and the substrate is loaded and unloaded. A substrate lift mechanism capable of lowering the pin tip of the lift pin than the roller conveyance path to enable the roller conveyance of the substrate by the conveying mechanism; and purging gas supplied into the chamber to terminate the reduced pressure drying process. A purge mechanism is provided, and the purge mechanism has a gas ejection part for ejecting the purging gas at a position higher than the roller conveyance path.

In the above apparatus configuration, the conveying mechanism carries out the loading and unloading of the substrate by the roller conveyance, and the substrate lift mechanism raises the substrate in the chamber between the conveying surface of the roller conveyance path and the height position for the reduced pressure drying process higher than that. Get off. During the decompression drying process, airflow is generated in the chamber by vacuum evacuation of the exhaust mechanism, and the liquid (solvent) volatilizes from the coating film on the substrate, so that the ambient temperature in the chamber is lower than the initial temperature (for example, room temperature). Then, in order to end the vacuum drying process, when the purging gas is supplied from the purging mechanism into the chamber, the purging gas flows in the chamber, and the atmosphere temperature in the chamber rises to a height exceeding the initial temperature. In the present invention, the gas blowing portion of the purging mechanism blows out the purging gas at a position higher than the roller conveyance path, whereby the fluctuation in the ambient temperature in the chamber is reduced. Thereby, the thermal effect which a board | substrate receives through a support pin is reduced, and the film quality of the coating film on a board | substrate improves.

According to the reduced pressure drying apparatus of the present invention, by carrying out the transfer of the substrate efficiently and safely by the roller conveyance, the pins of any thickness (lift pins or support pins) during the reduced pressure drying process are carried out by the roller conveyance. It is possible to prevent or suppress the transfer trace of the substrate contact portion from remaining on the coating film on the substrate while supporting the substrate.

In addition, according to the reduced pressure drying apparatus of the present invention, carrying out of the substrate is efficiently and safely carried out by the conveyance of the rollers by the above-described configuration and operation, and at the same time, the whole process from the start of the reduced pressure drying process to the end of purging. Through the process time, the fluctuation of the ambient temperature in the chamber can be reduced, the thermal effect on the support pins or the substrate can be reduced, and the processing quality can be improved.

BRIEF DESCRIPTION OF THE DRAWINGS It is a top view which shows the structure of the resist coating apparatus which assembled the vacuum drying unit (pressure reduction drying apparatus) in one Embodiment of this invention.
Fig. 2 is a plan view showing the configuration of the pressure reduction drying unit.
It is a front longitudinal cross-sectional view which shows the state of each part at the time of carrying in and carrying out the board | substrate in the said pressure reduction drying unit.
It is a front longitudinal cross-sectional view which shows the state of each part during the pressure reduction drying process in the said pressure reduction drying unit.
FIG. 5 is a partially enlarged perspective view showing the configuration of the shielding plate in the embodiment. FIG.
Fig. 6 is a partial lateral longitudinal cross-sectional view showing the state of each part during the vacuum drying treatment in the vacuum drying unit.
Fig. 7 is a partial lateral longitudinal cross-sectional view showing the state of each part when the substrate in the vacuum drying unit is carried in and out.
FIG. 8 is a photograph showing the relationship between the size of the clearance formed between the substrate and the shielding plate and the presence or absence of occurrence of pin transfer traces during the vacuum drying treatment in the embodiment.
Fig. 9 is a partial lateral longitudinal cross-sectional view showing the state of each part when the substrate is carried in and out of the vacuum drying unit of the second embodiment.
Fig. 10 is a partial lateral longitudinal sectional view showing the state of each part during the vacuum drying treatment in the vacuum drying unit.
It is a partial side cross-sectional view which shows the state of each part at the time of carrying out the board | substrate in the pressure reduction drying unit of 3rd Embodiment.
Fig. 11B is a partial lateral longitudinal cross-sectional view showing the state of each part during the vacuum drying treatment in the vacuum drying unit.
It is a top view which shows the structure in the pressure reduction drying unit (pressure reduction drying apparatus) in 4th Embodiment of this invention.
It is a front longitudinal cross-sectional view which shows the state of each part at the time of carrying in / out of the board | substrate in the said pressure reduction drying unit.
It is a front longitudinal cross-sectional view which shows the state of each part during the pressure reduction drying process in the said pressure reduction drying unit.
Fig. 15 is a partial lateral longitudinal cross-sectional view showing the state of each part during the reduced pressure drying process in the reduced pressure drying unit.
Fig. 16 is a partial lateral longitudinal cross-sectional view showing the state of each part during purging in the reduced pressure drying unit.
FIG. 17 is a schematic plan view showing the positions of representative measurement points selected for measurement of the ambient temperature in the chamber in the fourth embodiment and the comparative example. FIG.
Fig. 18 is a plot showing the characteristic of changing the ambient temperature and pressure in the chamber during the reduced pressure drying process and purging in the configuration of the fourth embodiment.
Fig. 19 is a plot diagram showing the characteristic of changing the ambient temperature and pressure in the chamber during the reduced pressure drying process and purging in the configuration of the first modification.
Fig. 20 is a plot showing the characteristic of changing the ambient temperature and pressure in the chamber during the reduced pressure drying process and purging in the configuration of the second modification.
Fig. 21 is a view showing a characteristic in which the atmosphere temperature and pressure in the chamber change during the reduced pressure drying process and purging in the configuration of the comparative example (prior art).
It is a figure which shows the change of the lift fin temperature just before the pressure reduction drying process when the pressure reduction drying process / purging process is repeated many times.
It is a front longitudinal cross-sectional view which shows the state of each part at the time of carrying out the board | substrate in the pressure reduction drying unit of 5th Embodiment.
Fig. 24 is a partial lateral longitudinal cross-sectional view showing the state of each part during the reduced pressure drying process in the reduced pressure drying unit.

EMBODIMENT OF THE INVENTION Below, preferred embodiment of this invention is described with reference to an accompanying drawing.

Fig. 1 shows an example of the configuration of a resist coating apparatus for manufacturing FPD to which the reduced pressure drying apparatus of the present invention can be applied.

This resist coating device is The flat application resist coating unit 10 and the vacuum drying unit 12 are arranged side by side in the same substrate conveyance direction (X direction). First, the structure and operation | movement of the resist coating unit 10 are demonstrated.

The resist coating unit 10 includes a floating stage 14 which floats a substrate to be processed, for example, a glass substrate G, and supports it horizontally, and floats horizontally on the floating stage 14. A substrate conveyance mechanism 16 for conveying the substrate G in the longitudinal direction (X direction) of the stage, a resist nozzle 18 for supplying a resist liquid to the upper surface of the substrate G conveyed on the floating stage 14; And a nozzle refresh section 20 for refreshing the resist nozzle 18 in the middle of the coating process.

On the upper surface of the floating stage 14, a plurality of gas injection holes 22 for injecting a predetermined gas (for example, air) upward are provided, and the substrate ( It is comprised so that G) may rise to a fixed height from the upper surface of a stage.

The substrate transfer mechanism 16 includes a pair of guide rails 24A and 24B extending in the X direction with the floating stage 14 interposed therebetween, and a slider 26 capable of reciprocating along these guide rails 24A and 24B. And a substrate holding member (not shown), such as a suction pad, provided on the slider 26 so as to detachably hold both end portions of the substrate G on the floating stage 14. By moving the slider 26 in a conveyance direction (X direction) by the non-), it is comprised so that the floating conveyance of the board | substrate G on the floating stage 14 may be performed.

The resist nozzle 18 is a long nozzle which crosses the upper side of the floating stage 14 in the horizontal direction (Y direction) orthogonal to the conveyance direction (X direction), and passes directly below it at a predetermined application position. The resist liquid is discharged in a band from the slit-shaped discharge port to the upper surface of the substrate G. Moreover, the resist nozzle 18 is comprised so that it may move to an X direction integrally with the nozzle support member 28 which supports this nozzle, and it may be able to raise / lower in a perpendicular direction (Z direction), The said application | coating position and a nozzle It is possible to move between the refresh units 20.

The nozzle refresh unit 20 is held on the support member 30 at a predetermined position above the floating stage 14 and is a priming processing unit for discharging the resist liquid to the resist nozzle 18 as a preparation for the coating process. (32), the nozzle bath 34 for maintaining the resist discharge port of the resist nozzle 18 in the atmosphere of solvent vapor from the purpose of drying prevention, and removing the resist adhering to the resist discharge port vicinity of the resist nozzle 18 For nozzle cleaning mechanism 36 is provided.

Next, the main operation in the resist coating unit 10 will be described. First, for example, the substrate G sent from the front end processing unit (not shown) to the roller conveyance is carried into the carrying-in part set on the front end side on the stage 14, and the slider 26 waiting there is The substrate G is held and received. On the floating stage 14, the substrate G receives the pressure of the gas (air) injected from the gas injection port 22 to maintain the floating state in a substantially horizontal posture.

And the slider 26 moves to a conveyance direction (X direction) toward the pressure reduction drying unit 12 side, holding a board | substrate, and when the board | substrate G passes under the resist nozzle 18, the resist nozzle 18 By discharging the resist liquid in a band toward the upper surface of the substrate G, the liquid film of the resist liquid is formed on one surface as if the carpet was spread from the front end to the rear end of the substrate G on the substrate G. In this way, the substrate G coated with the resist liquid is subsequently conveyed onto the floating stage 14 by the slider 26, and the roller transfer path 38 described later beyond the rear end of the floating stage 14. The holding by the slider 26 is released there. Roll for conveying a carbon substrate (G) transferred to 38 is from there is the front, and is brought into the reduced pressure drying unit 12 of the later stage by moving the roll 38 to the stand carrying a roll for transport, as described below .

After the application | coating process board | substrate G is sent to the pressure reduction drying unit 12 side as mentioned above, the slider 26 returns to the carry-in part of the front end side of the floating stage 14 in order to receive the next board | substrate G. As shown in FIG. In addition, the resist nozzle 18 moves from the application | coating position (resist liquid discharge position) to the nozzle refresh part 20, after completion | finish of application | coating process 1 time or several times, and refreshes or preparations, such as nozzle cleaning and a priming process, therefrom. After returning to the application position.

The roller conveyance path 38 is provided in the extended image (downstream of the conveyance direction) of the floating stage 14 of the resist coating unit 10. This roller conveyance path 38 is continuously provided in the chamber 40 of the pressure reduction drying unit 12, and outside (front and back).

Below, the structure and effect | action of the pressure reduction drying unit 12 in this embodiment are demonstrated.

As shown in FIG. 1, the roller conveyance path 38 of the pressure reduction drying unit 12 circumference is 38 A of carrying-in roll side conveyance paths provided in the conveyance upstream of the chamber 40, ie, a carry-in side. And an internal roller transfer path 38B attached to the chamber 40 and a carrying side roller transfer path 38C attached to the transport downstream side of the chamber 40, that is, the carry-out side.

Each roll roller conveyance path 38A, 38B, 38C rotates several rolls 42A, 42B, 42C arrange | positioned at appropriate intervals, respectively in a conveyance direction (X direction) by independent or common conveyance drive parts, respectively. The board | substrate G is sent to a conveyance direction (X direction) by roller conveyance. Here, 38 A of carrying-in side roll conveyance paths accept | subject the board | substrate G carried out by the extension of floating conveyance from the floating stage 14 of the resist coating unit 10, and the chamber ( 40) to send to the roller conveyance. The internal roller conveyance path 38B draws the board | substrate G sent from the carry-in side roller conveyance path 38A by roller conveyance into the chamber 40 by the roller conveyance of the same speed, and the chamber ( It functions to send the board | substrate G which completed the pressure reduction drying process in 40) outside the chamber 40 by the roll conveyance. The unloading side roller conveyance path 38C draws the processed board | substrate G sent from the internal roller conveyance path 38B in the chamber 40 to the roller conveyance of the same speed, and is a process part of a rear end (not shown). Function).

As shown in FIGS. 1-4, the chamber 40 of the pressure reduction drying unit 12 is formed in the comparatively flat rectangular parallelepiped, and has the space which can accommodate the board | substrate G horizontally in it. A slit-shaped inlet formed in the chamber sidewalls facing each other in the conveyance direction (X direction) of the chamber 40 in such a size that the substrate G can barely pass in flat flow. 44 and the discharge outlet 46 are provided, respectively. In addition, gate mechanisms 48 and 50 for opening and closing each of the inlet 44 and the outlet 46 are attached to the outer wall of the chamber 40. The upper wall portion or the upper lid 52 of the chamber 40 is detachable for maintenance.

Although not shown, each gate mechanism 48 and 50 has a cover body or a valve body which can close the slit-shaped carry-in / out ports 44 and 46 in an airtight manner, and a carry-in / out port of this cover body ( 1st cylinder (not shown) which raises and lowers, and moves a cover body between the vertically reciprocating position which opposes 44 and 46 horizontally, and the vertical double-acting position lower than it, and a cover body is carried in and out. The second cylinder (not shown) which moves horizontally between the horizontal reciprocating position which closely closes to 44 and 46 and the horizontal double reciprocating position which separates apart is provided.

In the chamber 40, the roller 42B which comprises the internal roller conveyance path 38B has a moderate space | interval in a conveyance direction (X direction) at the height position corresponding to the carry-in / out port 44,46. Some or all of the rolls 42B are connected to the rotation drive source 54, such as a motor, provided outside the chamber 40 via the rotation shaft 56 of a suitable electric mechanism. Each roll 42B adheres a plurality of thick diameter rings or rollers 45 to a relatively thin shaft 43 at predetermined intervals, and both ends of the shaft 43 are left and right of the chamber 40. It is supported so that it may rotate to the bearing 58 provided in the both side walls or its vicinity.

Since the roller 42A of the carry-in roller conveyance path 38A has the same structure as the roller 42B of the internal roller conveyance path 38B, illustration is abbreviate | omitted, but the both ends are fixed to the frame etc. It is rotatably supported at the inside, and is rotatably driven by the rotation drive source common or separate from the rotation drive source 54 for the said internal roller conveyance path 38B. The roll table 42C of the carry-out roll table conveyance path 38C is also the same.

As shown in FIG. 3 and FIG. 4, this reduced pressure drying unit 12 includes a substrate lift mechanism 60 for horizontally supporting and lowering the substrate G in the chamber 40. The substrate lift mechanism 60 includes a plurality of lift pins (preferably 20 or more) 62 which are discretely arranged in a predetermined arrangement pattern (for example, in a matrix shape) in the chamber 40. ), A pin base 64 of a plurality of horizontal rods or horizontal plates which support these lift pins 62 at positions lower than the internal roller conveyance path 38B for each predetermined group or group, and each pin base 64. In order to move up and down, it has one or more lifting drive sources, such as the cylinder 66, arrange | positioned outside (below) of the chamber 40. As shown in FIG.

More specifically, the plurality of lift pins 62 (preferably three or more) at regular intervals in parallel with the roller 42B (in the Y direction) in the gap between two rollers 42B and 42B adjacent to each other. ) Are arranged in a vertical line, and a plurality of rows (preferably six or more rows) are provided at appropriate intervals in the conveying direction (X direction), and a pair or a plurality of sets of such lift pin rows are arranged in each pin base 64. The lift pin row (in the example shown in the figure 2) is supported. Then, the upper end of the elevating support shaft 70 which tightly penetrates the bottom wall of the chamber 40 with the sealing member 68 interposed therebetween, is coupled to the lower surface of each pin base 64, and the outside of the chamber 40. In (below), the lower end of each pin base 64 is connected to the elevating drive source 66 with the common horizontal support plate 72 interposed between them.

In the board | substrate lift mechanism 60 of such a structure, all the lifts are lifted through the lifting support shaft 70 and the pin base 64 by letting the lifting driving source 66 drive forward (upward) or backward (falling) driving of a fixed stroke. With the pin 62 at the height of the pin tip, as shown in FIGS. 3 and 7, the double-ended (falling) position where the pin tip is lower than the roller conveyance path 38B, and FIGS. 4 and 6 are shown. As described above, the tip of the pin is capable of lifting and lowering between the reciprocating (rising) positions that are higher than the roller conveyance path 38B.

In one preferred embodiment, the lift pin 62 is not a type with a temperature control mechanism for exiting the air-cooled gas, nor is it a special ultrafine type, and is a hollow hollow tube made of, for example, stainless steel (SUS). The diameter of the pin tip is, for example, about 2mm, and has a cheap structure. Since the lift pins 62 are relatively thick and rigid in this manner, the number of the lift pins 62 required for the substrate lift mechanism 60 to stably and smoothly move the substrate G up and down is of a special ultrafine type. It is at least significantly reduced. First of all, it is also possible to use the above-mentioned temperature adjusting mechanism attachment type or the special ultrafine type support pins for the lift pins 62.

In the bottom wall of the chamber 40, the exhaust port 74 is formed in one place or a plurality of places. A vacuum exhaust device 78 is connected to these exhaust ports 74 with an exhaust pipe 76 interposed therebetween. Each vacuum exhaust device 78 has a vacuum pump for sucking the inside of the chamber 40 from an atmospheric pressure state and maintaining a reduced pressure state at a predetermined vacuum degree. On the other hand, in order to average the gap of the exhaust capacity of these vacuum evacuation apparatus 78, you may connect each exhaust pipe 76 with a connection pipe (not shown).

Cylindrical purging gas ejection portion extending in the Y direction at both ends of the chamber 40, that is, at a position lower (or higher position) than the roller conveyance path 38B in the vicinity of the inlet 44 and the outlet 46. 80 is provided. These purge gas ejection parts 80 consist of a porous hollow tube which sinters a metal powder, for example, and is connected to the purging gas supply source (not shown) through the piping 82 (FIG. 2). have. After returning from the reduced pressure state to the atmospheric pressure state while the chamber 40 is closed after the reduced pressure drying process, these purge gas ejection portions 80 eject the purge gas from the entire circumferential surface of the tube.

This vacuum drying unit 12 draws the roller conveyance path 38 which carries out the horizontal flow conveyance of the board | substrate G in the chamber 40 as mentioned above, and lifts the board | substrate G in the chamber 40, and lifts a pin. In the apparatus structure provided with the board | substrate lift mechanism 60 going up and down to 62, the shielding plate 100 is horizontally provided in the position somewhat lower (usually 10 mm or less) than the pin tip part of the lift pin 62, The height position of the shield plate 100 can be changed by the shield plate elevating mechanism 102.

The shielding plate 100 is made of any material, for example, aluminum plate or resin, has a larger area around the substrate G (FIGS. 1 and 2), and the lift pin 62 can be lifted and lowered. It has a circular opening 100a for penetrating and the rectangular opening 100b for avoiding interference with the roller 42B of the internal roller conveyance path 38B (FIGS. 4-6).

The shielding plate elevating mechanism 102 includes one or more elevating drive sources, for example, a cylinder 104, disposed between the horizontal support plate 106 and the elevating support shaft 108 disposed outside (below) the chamber 40. Is connected to the shielding plate 100. The lifting support shaft 108 is hermetically passed through the bottom wall of the chamber 40 with the sealing member 110 interposed therebetween, and an upper end thereof is coupled to the lower surface of the shielding plate 100.

Next, the operation of the reduced pressure drying unit 12 in this embodiment will be described.

As above-mentioned, the board | substrate G by which the resist liquid was apply | coated in the resist application | coating unit 10 adjacent to an upstream side moves from the floating conveyance path on the floating stage 14 to the carry-in roll side conveyance path 38A in the horizontal flow. Burn. Then, as shown in FIG. 3, the board | substrate G moves on 38 A of carrying-in side roll conveyance paths to a roll conveyance, and the delivery opening (in the chamber 40 of the pressure reduction drying unit 12) is carried out. 44). At this time, the gate mechanism 48 leaves the carrying in opening 44 open.

The internal roller conveyance path 38B also performs the roller conveyance operation | movement of the same conveyance speed which matched the timing of the roller conveyance operation of the carry-in side roller conveyance path 38A by the rotation drive of the rotation drive source 54, As shown in FIG. 3, the board | substrate G drawn in from the delivery opening 44 is drawn in in the chamber 40 by roller conveyance. At this time, the board | substrate lift mechanism 60 makes all the lift pins 62 stand by the double acting (falling | falling) position where each pin tip becomes lower than the conveyance surface of the internal roller conveyance path 38B. And when the board | substrate G arrives at the predetermined position of the substantially center in the chamber 40, the roller conveyance operation | movement of the internal roller conveyance path 38B stops there. Simultaneously or immediately before this, the roll conveyance operation | movement of 38 A of carrying-in side roll conveyance paths may also be stopped.

On the other hand, when the substrate G to be subjected to the vacuum drying treatment from the resist coating unit 10 adjacent to the front end or the upstream side as described above is brought into the chamber 40, the same time (or immediately before) as shown in FIG. As described above, the preceding substrate G, which has just been subjected to the decompression drying process in the chamber 40, is returned to the continuous roller conveyance at a constant velocity on the internal roller transfer path 38B and the export-side roller transfer path 38C. It exits from the exit 46 out of the chamber 40 and is sent straight to the processing section adjacent to the rear or downstream side.

As mentioned above, the board | substrate G to which the resist liquid was apply | coated in the resist coating unit 10 is carried out by continuous roll conveyance on 38 A of carrying-in side roll conveyance paths, and the internal roll conveyance path 38B. It is carried in the chamber 40 of the pressure reduction drying unit 12. Immediately after this, the gate mechanisms 48 and 50 operate to close the delivery openings 44 and the delivery openings 46, which have been opened until then, to seal the chamber 40.

Subsequently, the substrate lift mechanism 60 raises and lowers the lifting cylinder 66, and the predetermined tip height of the entire lift pins 62 in the chamber 40 exceeds the conveyance surface of the internal roller conveyance path 38B. The entire pin base 64 is raised simultaneously by a predetermined stroke until the position. As shown in FIG. 4, the substrate G is moved from the internal roller transfer path 38B to the pin end of the lift pin 62 with the horizontal posture by the swinging operation of the substrate lift mechanism 60. It is lifted up and lifted upward of the internal roller conveyance path 38B as it is.

In addition, at the same time as or immediately after the substrate lift mechanism 60 moves the lift pin 62 upward as described above, the shield plate elevating mechanism 102 raises the shield plate 100 by a predetermined stroke.

In this way, a first desired clearance (for example, 4 to 15 mm) is provided between the upper surface of the substrate G loaded on the pin end of the lift pin 62 and the ceiling 52 of the chamber 40 that are lifted to the reciprocating position. (C ₁ ) is formed, and a second desired clearance (C ₂ ) is formed between the lower surface of the substrate (G) and the shielding plate 100 that has risen to the reciprocating position. (FIG. 6).

On the other hand, immediately after the chamber 40 is closed, the vacuum exhaust device 78 operates to start evacuation of the chamber 40. By this vacuum exhaust, the gas (mostly air) remaining in the chamber 40 flows toward the exhaust port 74 at the bottom of the chamber 40, and airflow is generated in each part of the chamber 40. The problem here is that in the chamber 40, various members of the roller conveyance path 38B and the substrate lift mechanism 60 are provided, and airflow touches the members and tends to become turbulent. In particular, airflow is easily wound up around the lift pins 62, and it is the main reason that the pin transfer traces (film thickness fluctuations) remain in the resist coating film on the substrate because the airflow is easily wound up.

In this embodiment, since the shielding plate 100 is arrange | positioned directly under the board | substrate G supported by the pin end of the lift pin 62 which rose to the reciprocating position, and undergoing a pressure reduction drying process, Even if the airflow is wound around, the turbulence is not blocked by the shielding plate 100 so that the bottom surface of the substrate G does not reach.

As described above, even if turbulence occurs under the substrate G, particularly around the lift pin 62 during the vacuum drying process, the turbulence does not reach the lower surface of the substrate G, so that the substrate G ) And the influence of turbulence on the resist coating film can be prevented, and further, the traces of pin transfer (film thickness variation) can be prevented from remaining on the resist coating film on the substrate G.

On the other hand, even if airflow flows into the gap between the substrate G and the shielding plate 100, since the clearance C ₂ therein is narrow (preferably 10 mm or less), turbulence that reaches the lower surface of the substrate G upwards It does not happen in this gap.

In the illustrated example, the height position of the shielding plate 100 is higher than the conveying surface of the roller conveyance path 38B during the decompression drying process. However, even if the height position of the shielding plate 100 is lower than the conveyance surface of the roller conveyance path 38B, even if the roller 45 of the roller 42B sticks out on the opening 100b of the shielding plate 100 partially, There is no particular problem. That is, as long as a sufficient separation distance between the roller 45 and the substrate G (preferably 20 mm or more) is ensured, the roller 45 of the rolling table 42B opens the opening 100b of the shielding plate 100. Even if a part does not stick out, the influence of the airflow from the roller 45 side to the substrate G can be largely ignored.

During the reduced pressure drying process, the solvent (thinner) evaporates from the resist liquid film on the substrate G under reduced pressure, and the temperature of the substrate G is significantly lower than the normal temperature (for example, about 10 ° C.) by the heat of vaporization. Lowers.

This vacuum drying process is complete | finished after a fixed time passes, and the vacuum exhaust apparatus 78 stops a vacuum exhaust operation. Alternately with this, the nitrogen gas ejection part 80 flows nitrogen gas into the chamber 40. Then, after the pressure in the room rises to the atmospheric pressure, the gate mechanisms 48 and 50 operate to open the inlet 44 and the outlet 46. Before and after this, the board | substrate lift mechanism 60 doubles the lifting cylinder 66, and all the pins to the predetermined height position by which the pin front-end | tip of all the lift pins 62 becomes lower than the conveyance surface of the internal roller conveyance path 38B. The base 64 is lowered by a predetermined stroke all at once. By the double acting (falling) operation of the substrate lift mechanism 60, the substrate G is moved from the pin end of the lift pin 62 to the internal roller transfer path 38B in a horizontal position.

In addition, while the board | substrate lift mechanism 60 lowers the lift pin 62, or just before, the shield plate elevating mechanism 102 lowers the shield plate 100, and returns it to the original height position.

As described above, immediately after the substrate G is transferred to the internal roller conveyance path 38B, the roller conveyance operation is started on the internal roller conveyance path 38B and the unloading side conveyance path conveyance path 38C to reduce the pressure. The board | substrate G which just received the process is carried out by the conveyance stand conveyance from the carrying out opening 46, and is sent to flat processing directly as it is to a process part of a rear end. Simultaneously with this carrying out operation | movement of the processed board | substrate G, as shown in FIG. 3, the following board | substrate G from the resist application | coating unit 10 carries out 38 A of carrying-in side roll conveyance paths, and an internal roll base. It is carried in into the chamber 40 from the loading port 44 by continuous roller conveyance on the conveyance path 38B.

As described above, the reduced pressure drying unit 12 is for preventing the airflow generated below the substrate G from affecting the substrate G by vacuum evacuation during the drying process in the chamber 40. Since the shielding plate 100 is provided, the pin transfer traces are preferably prevented from being left in the resist coating film on the substrate G despite the use of the inexpensive lift pin 62 as the substrate lift mechanism 60. It can be suppressed.

In the present invention, the size of the gap or clearance C ₂ formed between the substrate G and the shielding plate 100 is important for the shielding plate 100 to exhibit an airflow shielding effect that prevents the pin transfer trace. Do.

The resist film after pre-baking process, as the inventors, as shown in this embodiment carried out the experiment under a reduced pressure drying unit 12 in the form of bars, in the case where the clearance (C ₂₎ in a 5mm, Figure 8 (a) There was not much trace of the pin warrior. However, in the case where the clearance C ₂ was set to 20 mm, as shown in FIG. 8 (b), the traces of the pin transfer were apparently visible to the naked eye in the resist film after the prebaking treatment.

In other words, when the clearance C ₂ is about 20 mm, turbulence tends to occur around the lift pin 62 during vacuum evacuation, and this causes contact with the bottom surface of the substrate G so that the resist coating film on the substrate is subjected to local heat. It is thought to be affected, and thus a pin transfer trace (film thickness variation) occurs.

On the other hand, in this reduced pressure drying unit 12, the clearance C ₁ formed between the upper surface of the substrate G supported by the pin end of the lift pin 62 and the ceiling 52 of the chamber 40 is reduced in pressure. It is an important process parameter of the drying treatment, and is adjusted to various values in relation to the specification of the resist coating and other conditions. In this embodiment, since the lift pin 62 and the shielding plate 100 are moved up and down individually by the substrate lift mechanism 60 and the shielding plate lifting mechanism 102, both clearances C ₁ and C ₂ are simultaneously moved. Can be optimized for each individual.

9 and 10 show the configuration of the reduced pressure drying unit 12 in the second embodiment. This second embodiment does not include the substrate lift mechanism 60, but instead, a plurality of fixed support pins 112 are attached discretely (for example, in a matrix form) to the upper surface of the shielding plate 100. Doing. The shielding plate elevating mechanism 102 enables the support of the substrate G by the supporting pin 112 by making the tip of the supporting pin 112 higher than the roller conveyance path 38B when performing the drying process ( 10) When carrying out the carrying out of the board | substrate G, the pin tip of the support pin 112 is made lower than the roll feed path 38B so that the roll feed of a board | substrate by a roll feed mechanism can be carried out (FIG. 9). ), Lifting and lowering (rising) of the shielding plate 100 is performed. In this case, the said clearance C ₂ is decided by the height (length) of the support pin 112, and may be set in the range of 2-10 mm preferably like the said 1st Embodiment.

Also in this 2nd Embodiment, the board | substrate G is rolled in the chamber 40 by the shielding board elevating mechanism 102, enabling the board | substrate G to carry in and out by roll conveyance conveyance 38. It is possible to move up and down between the conveying surface of and the height position for the drying process higher than that, and shielding that the airflow generated below the substrate G by the vacuum exhaust during the drying process affects the substrate G. It is prevented by the board | plate 100, and it can prevent or suppress as much as possible that a trace of pin transfer remains in the resist coating film on the board | substrate G.

11A and 11B show the configuration of the reduced pressure drying unit 12 in the third embodiment. This embodiment is not provided with the shielding plate 100 and the shielding plate lifting mechanism 102, but instead from a site lowered by a predetermined distance (preferably 2 to 10 mm) from the pin tip of each lift pin 62. It is provided with the airflow shielding member 114 which continues in a blade shape toward the circumference. In this case, the clearance C ₂ is determined by the attachment position of the airflow shield member 114 at the lift pin 62.

Also in this 3rd Embodiment, the board | substrate G is moved in the chamber 40 by the board lift mechanism 60, and the board | substrate G of the roll carrier conveyance path 38 is made possible, carrying out the carrying out of the board | substrate G by roller conveyance. Airflow shielding that the airflow generated below the substrate G by the vacuum exhaust during the drying process can be raised and lowered between the conveying surface and the height position for drying processing higher than that. It is prevented by the member 114, and it can prevent or suppress as much as possible leaving a trace of pin transfer in the resist coating film on the board | substrate G.

12-16, the structure of the pressure reduction drying unit 12 in 4th Embodiment is shown. This fourth embodiment does not include the shielding plate elevating mechanism 102, but instead the conveying direction (X direction) along the chamber sidewalls on the left and right sides of the internal roller conveyance path 38B within the chamber 40. A pair of purging gas ejection parts 80 leading to) is provided.

As one of the features in this embodiment, the purging gas ejection part 80 is installed at a position higher than the internal roller conveyance path 38B and ejects purging gas horizontally (or upwards) at a position higher than the roller conveyance surface. It is supposed to be. Preferably, the gas ejection port of the purging gas ejection part 80 is provided at a position 10 mm or more (more preferably 20 mm to 30 mm) higher than the conveyance surface of the roller conveyance path.

This vacuum drying unit 12 draws the roller conveyance path 38 which carries out the horizontal flow conveyance of the board | substrate G in the chamber 40 as mentioned above, and lifts the board | substrate G in the chamber 40, and lifts a pin. In the apparatus structure provided with the board | substrate lift mechanism 60 which moves up and down to 62, in order to reduce the fluctuation | variation of the atmospheric temperature in the chamber 40, it is arrange | positioned so that the board | substrate G may be covered in the vicinity of the roller conveyance path. The shielding plate 100 is provided.

In one preferred embodiment, the shielding plate 100 has a fixed height position, ie, the shaft 43 of the roller 42B, for example by means of a plurality of support rods 103 running vertically upwards from the bottom of the chamber 40. It is supported horizontally at a position higher than and lower than the parietal surface (rolling table conveying surface) of the roller 45.

As shown in FIGS. 12-14, the roller conveyance path of this embodiment is an internal roller conveyance path 38B and the lower surface (or the vicinity) of the passage 44 of the delivery opening 44 and the delivery opening 46, and Roller-type roller stands 47 and 49 for connecting the outside (loading-side and carrying-out side) roller conveyance paths 38A and 38C are provided, respectively.

Next, the operation of the reduced pressure drying unit 12 in this embodiment will be described.

As in the first embodiment, the substrate G, to which the resist liquid has been applied in the resist coating unit 10, is continuously rolled on the carry-in roll table conveyance path 38A and the internal roll table conveyance path 38B. It carries in to the chamber 40 of the pressure reduction drying unit 12 by large conveyance. Immediately after this, the gate mechanisms 48 and 50 operate to close the delivery openings 44 and the delivery openings 46, which have been opened until then, to seal the chamber 40.

Subsequently, the substrate lift mechanism 60 raises and lowers the lifting cylinder 66, and the predetermined tip height of the entire lift pins 62 in the chamber 40 exceeds the conveyance surface of the internal roller conveyance path 38B. The entire pin base 64 is raised simultaneously by a predetermined stroke until the position. As shown in FIG. 15, the substrate G is moved from the internal roller transfer path 38B to the pin end of the lift pin 62 with the horizontal posture by the swinging operation of the substrate lift mechanism 60. It is lifted up and lifted upward of the internal roller conveyance path 38B as it is.

In this way, the clearance H of a desired (for example, 4-15 mm) is provided between the upper surface of the board | substrate G loaded on the pin end of the lift pin 62 which rose to the reciprocating position, and the ceiling 52 of the chamber 40. Is formed (FIG. 15).

On the other hand, immediately after the chamber 40 is closed, the vacuum exhaust device 78 is operated to start vacuum exhaust in the chamber 40. By this vacuum exhaust, the pressure in the chamber 40 becomes a vacuum pressure from the conventional atmospheric pressure 101325 Pa, and the solvent (thinner) evaporates from the resist liquid film | membrane on the board | substrate G in this atmosphere of reduced pressure, and this heat of vaporization As a result, the ambient temperature in the chamber 40 rapidly decreases from the conventional room temperature (about 25 ° C).

The fluctuation range of the fall of the atmospheric temperature in the chamber during the vacuum evacuation (especially immediately after the start of vacuum drying) varies depending on the place, and there is a considerable gap. As will be described later, the ambient temperature in the chamber during vacuum evacuation has conventionally lowered to about -15 ° C (FIG. 21). However, in this embodiment, the atmosphere temperature is only lowered to about 0 ° C (FIG. 18). .

During vacuum evacuation, the gas (mostly air) remaining in the chamber 40 flows toward the exhaust port 74 at the bottom of the chamber 40, and airflow is generated in each part of the chamber 40 (FIG. 15). . In this embodiment, since the shielding plate 100 is provided in the position higher than the shaft 43 of the roller 42B, even if airflow is wound up around the shaft 43, the pin base 64, etc., a shielding plate The turbulence is blocked by the 100 so as not to touch the lower surface of the substrate G.

After a predetermined time has elapsed since the start of vacuum drying (vacuum exhaust) or when the vacuum pressure in the chamber 40 reached the set value (for example, about 30 Pa), the timer or the pressure sensor (not shown) It operates in accordance with the output signal to end the vacuum drying process. For this reason, the board | substrate lift mechanism 60 lowers the lifting cylinder 66, and the all pin base to the predetermined height position by which the pin front-end | tip of all the lift pins 62 becomes lower than the conveyance surface of the internal roller conveyance path 38B. The 64 is lowered by a predetermined stroke all at once. By the double acting (falling) operation of the substrate lift mechanism 60, the substrate G is moved from the pin end of the lift pin 62 to the internal roller conveyance path 38B in a horizontal posture. Then, the purging mechanism is operated to supply the purging gas from the purging gas ejection unit 80 into the chamber 40 at a predetermined flow rate. In this embodiment, the purging gas ejection part 80 ejects purging gas substantially horizontally in the position 20-30 mm higher than the conveyance surface of the roller conveyance path 38B. The exhaust operation of the vacuum exhaust device 78 may be stopped at the same time as the start of purging, but may be stopped after a predetermined time has elapsed.

Purging a purging ejected in a substantially horizontal gas from the gas ejection portion 80, as shown in Fig. 16, the top spacing between the chamber 40, the ceiling 52 and the substrate (G) (SP _1), the substrate (G ) And an intermediate space SP ₂ between the shield plate 100 and the bottom space SP ₃ between the shield plate 100 and the bottom surface of the chamber 40.

The purging gas sent to the uppermost space SP ₁ rapidly spreads widely in this space SP ₁ , then escapes the gaps before and after the substrate G downward, and flows toward the exhaust port 74 at the bottom of the chamber 40. .

The purging gas sent to the intermediate space SP ₂ exits the openings 100a and 100b of the shielding plate 100 here and there while diffusing into the space SP ₂ , or before and after the substrate G. The gap exits downward and flows to the bottom space SP ₃ .

The purging gas sent to the lowermost space SP ₃ and the purging gas exiting the openings 100a and 100b of the shielding plate 100 from the intermediate space SP ₂ and descending to the lowermost space SP ₃ are the lowermost space SP. ₃ ) flows toward the exhaust port 74 at the bottom of the chamber 40 while colliding with a member such as the shaft 43 of the roller 42B, the pin base 64, or the like.

By this purging, the pressure in the chamber 40 rises at once from the set value or the lowest value (about 30 Pa) toward the atmospheric pressure, so that the ambient temperature in the chamber also rapidly rises to a temperature far above the temperature (room temperature) before the decompression drying process.

The fluctuation range of the rise of the ambient temperature in the chamber by this purging varies considerably from place to place, and there is a considerable gap. As will be described later, although the ambient temperature in the chamber during purging has conventionally exceeded about 50 ° C. (FIG. 21), in this embodiment, the temperature rises only up to about 32 ° C. (FIG. 18).

In this way, when the pressure in the chamber 40 rises by purging and reaches atmospheric pressure, the purge gas ejection part 80 stops supply of the purging gas at this timing (time T _e ). do. When the purging gas does not flow in the chamber 40, the atmosphere temperature in the chamber is lowered to be equal to the temperature of the purging gas (usually about the same as room temperature) filled in the chamber.

After a predetermined time has elapsed since the supply of the purging gas was stopped, the gate mechanisms 48 and 50 are operated to open the delivery port 44 and the delivery port 46. Subsequently, the roller conveyance operation is started on the internal roller conveyance path 38B and the export-side roller conveyance path 38C, and the substrate G which has just been subjected to the decompression drying process is transferred from the discharging opening 46 to the roller conveyance. It is taken out and sent to flat stream as it is to a process part of a later stage. Simultaneously with this carrying out operation | movement of the processed board | substrate G, as shown in FIG. 13, the following board | substrate G from the resist application | coating unit 10 carries out 38 A of carrying-in roll side conveyance paths, and an internal roll base. It is carried in into the chamber 40 from the loading port 44 by continuous roller conveyance on the conveyance path 38B.

As mentioned above, the pressure reduction drying unit 12 of this embodiment is higher than the shaft 43 of the roller 42B at the position which covers under the board | substrate G in the vicinity of the roller conveyance path, Preferably it is a roller The shielding plate 100 is provided horizontally at the position lower than the top surface (rolling surface conveyance surface) of (45). The shielding plate 100 is formed not only during the period in which the substrate G stays in the chamber 40 but also during the period in which the substrate G does not exist in the chamber 40. The space in the chamber 40 is separated up and down at a constant height position slightly lower than the carrying surface. Here, the intermediate space SP ₂ and the lower space SP ₃ separated up and down communicate with each other through the gaps around the openings 100a and 100b of the shielding plate 100 and the shielding plate 100.

Moreover, the pressure reduction drying unit 12 of this embodiment has the position (most preferably, higher than the roll conveyance path 38) of the gas ejection outlet of the purging gas ejection part 80 arrange | positioned near the side wall of the chamber 40. 20-30 mm higher than the roller conveyance surface). As a result, the purging gas ejected from the purging gas ejection unit 80 includes the upper space SP ₁ , the substrate G, and the shielding plate 100 between the ceiling 52 and the substrate G of the chamber 40. It is divided into the intermediate space SP ₂ between, and the lower space SP ₃ between the shielding plate 100 and the bottom surface of the chamber 40.

According to this configuration, the airflow flowing in the chamber 40 during the vacuum evacuation and purging is separated from the top space SP ₁ , the intermediate space SP ₂ , and the bottom space by the substrate G and the shielding plate 100. Individually controlled by each of SP ₃ , variations in the ambient temperature in the chamber are significantly reduced.

In the vacuum drying unit 12 of this embodiment, the present inventors select 13 representative measurement points ch1 to ch13 distributed over the central part, the middle part, and the peripheral part in the chamber 40, as shown in FIG. Under the same conditions, the vacuum drying treatment and purging were performed for each of the following four methods A, B, C, and D. During this experiment, the atmospheric temperature and pressure in the chamber during the vacuum drying treatment and purging at each representative point were measured, and the maximum temperature Max was recorded among the atmospheric temperature characteristics J1 to J13 for 13 places (ch1 to ch13) ( Ji) and two of the characteristics (Jj) recording the minimum temperature Min were extracted and plotted to obtain the results shown in FIGS. 18 to 21. In addition, in this experiment, the measurement height position of each representative measuring point ch1-ch13 was selected at the position of 120 mm from the bottom surface of the chamber 40, and the temperature sensor which is a thermocouple was used.

A: [with shield plate, purge on conveying path]. Figure 18

Like the said embodiment, it is the structure which provides the shielding plate 100, and arrange | positions the gas ejection opening of the purging gas ejection part 80 in the position higher than the roller conveyance path 38B.

B: [with shield board, purge under conveying path]. Figure 19

Although the shielding plate 100 is provided similarly to the said embodiment, it is a structure which arrange | positions the gas ejection opening of the purging gas ejection part 80 in the position lower than the roller conveyance path 38B (about 100 mm lower than a conveyance surface). It is a modification (1st modification) of one of the said embodiments.

C: [no shielding plate, purge on return line]. Figure 20

Although the said shielding plate 100 is not provided, it is a structure which provides the gas blowing port of the purging gas blowing part 80 in the position higher than the roller conveyance path 38B. This is also a modification (second modification) of one of the above embodiments.

D: [No shield plate, purge under conveyance path]. Figure 21

In addition, the shielding plate 100 is not provided, and the gas ejection opening of the purging gas ejection section 80 is provided at a position lower than the roller conveyance path 38B (about 100 mm lower than the conveying surface). This corresponds to the structure of the prior art.

As shown in FIG. 18, in the structure (embodiment) of said A, the minimum value of the atmospheric temperature in a chamber during vacuum exhaust is -0.2 degreeC, the maximum value of the atmospheric temperature in the chamber during purging is 32 degreeC, and the maximum fluctuation range is 32.2. ° C.

As shown in FIG. 19, in the structure of said B, the minimum value of the atmospheric temperature in the chamber in vacuum exhaust was -2.0 degreeC, the maximum value of the atmospheric temperature in the chamber in purging was 39.0 degreeC, and the maximum fluctuation range was 41.0 degreeC.

As shown in FIG. 20, in the structure of said C, the minimum of the atmospheric temperature in the chamber in vacuum exhaust was -15.0 degreeC, the maximum of the atmospheric temperature in the chamber in purging was 36.7 degreeC, and the maximum fluctuation range was 51.7 degreeC.

As shown in FIG. 21, in the structure of said D, the minimum value of the atmospheric temperature in the chamber in vacuum exhaust was -16.0 degreeC, the maximum value of the atmospheric temperature in the chamber in purging was 49.3 degreeC, and the maximum fluctuation range was 65.3 degreeC.

Thus, according to the structure of said A (embodiment), compared with the structure of said D (prior art), it is possible to halve the maximum fluctuation range of the atmospheric temperature in a chamber. Also in the configuration of B (the first modification), the maximum variation in the ambient temperature in the chamber can be reduced to about 60% as compared to the configuration of D (prior art). Moreover, also in the structure of said C (2nd modification), compared with the structure of said D (prior art), the maximum fluctuation range of the atmospheric temperature in a chamber can be reduced to about 78%.

As an extension of the above experiment, the inventor repeated the process of vacuum drying / purging under the same conditions for each of the above constitutions A, B, C, and D several times (9 times) at a constant cycle, and then each time the vacuum drying treatment. The temperature shown in FIG. 22 was obtained when the temperature of the lift pin 62 immediately before starting was measured and plotted.

As shown, according to the structure of said A (embodiment), the lift pin temperature of normal temperature (about 25 degreeC) can be stabilized to the range of 26 degreeC-27 degreeC only slightly higher than normal temperature from the 2nd time.

In addition, in the structure of said B (1st modification), lift pin temperature can be stopped in the range of 26 degreeC-27 degreeC on the 2nd time, and can stabilize to the range of 27 degreeC-28 degreeC after the 3rd time.

In addition, in the structure of said C (2nd modification), lift pin temperature can be stabilized in the range of 27 degreeC-28 degreeC from the 2nd time.

On the other hand, in the configuration of D (prior art), the lift pin temperature gradually increases every time the decompression drying treatment / purging step is repeated, and takes a while until stabilization. Of course, the temperature at the time of stabilization (saturation) becomes considerably high and becomes near 30 degreeC.

Thus, according to the said embodiment and its modified example, since the fluctuation range of the atmospheric temperature in the chamber during pressure reduction drying process and purging can be reduced, the thermal which each lift pin 62 of the lift mechanism 60 receives from atmospheric temperature It is possible to reduce the influence and further reduce the thermal influence that the substrate G receives from the lift pins 62, thereby suppressing the trace of pin transfer on the resist coating film on the substrate G. Thereby, the film quality of the resist coating film on the board | substrate G can be improved.

23 and 24 show the configuration of the reduced pressure drying unit 12 in the fifth embodiment. This fifth embodiment does not include the substrate lift mechanism 60 as in the second embodiment, and instead, the fixed support pin 112 is discretely disposed on the upper surface of the shielding plate 100 (for example, In matrix form). The clearance H is determined by the height (length) of the support pin 112. The double acting (lower limit) height position of the shielding plate 100 is set to a position higher than the shaft 43 of the roller 42B and lower than the top surface (rolling roller conveyance surface) of the roller 45.

Also in this fifth embodiment, as in the fourth embodiment, it is possible to reduce the fluctuation range of the ambient temperature in the chamber during the reduced pressure drying process and purging, and the respective support pins 112 on the shielding plate 100 are separated from the ambient temperature. The thermal effect received is reduced, and further, the thermal effect received by the substrate G from the support pin 112 can be reduced, so that the trace of the pin transfer on the resist coating film on the substrate G can be suppressed.

In the above embodiment, the fixed (or lower limit) height position of the shielding plate 100 is set to a position higher than the shaft 43 of the roller 42B. However, although the effect of the shielding plate 100 is reduced to some extent, it is also possible to set the fixed (or lower limit) height position of the shielding plate 100 at a position slightly lower than the shaft 43 of the roller 42B. Do.

The chamber 40 of the pressure reduction drying unit 12 in the above-described embodiment is provided with the inlet 44 and the outlet 46, respectively, on a pair of chamber side walls facing each other in the conveying direction (X direction), The substrate G is configured to exit the chamber 40. However, it is also possible to combine the inlet and the outlet with one carrying in and out provided in one sidewall of the chamber 40, and in that case, the carry-in roll table conveyance path 38A and the carry-out roll conveyance path 38C are possible. Can also be used.

The substrate to be processed in the present invention is not limited to the glass substrate for LCD, and other flat panel display substrates, semiconductor wafers, CD substrates, photomasks, printed substrates, and the like can also be used. The coating liquid to be subjected to the vacuum drying process is not limited to the resist liquid, but for example, a processing liquid such as an interlayer insulating material, a dielectric material, a wiring material, or the like can be used.

Claims (19)

A pressure reducing drying apparatus for performing a drying treatment under reduced pressure on a film of a coating liquid formed on a substrate to be processed,
A pressure sensitive chamber having a space for accommodating the substrate in a horizontal state;
An exhaust mechanism for evacuating the inside of the chamber in a closed state for the drying treatment;
A conveying mechanism having a roll conveyance path continuous outside and inside of said chamber, and carrying or transferring said substrate to or from said chamber by a roll conveyance on said roll conveyance path;
It has a plurality of lift pins disposed discretely in the chamber to support and move the substrate horizontally at the pin tip, and when the drying process is performed, the tip of the lift pin is higher than the roller conveyance path A substrate lift mechanism for supporting a substrate and carrying the substrate by the conveyance mechanism by lowering the pin tip of the lift pin to the lower conveyance path when carrying out the substrate;
And a shielding plate for preventing the airflow generated below the substrate from affecting the substrate by vacuum evacuation during the drying process. The pressure reduction drying apparatus of Claim 1 in which the said shielding plate is located in the height which is lower than the front-end | tip of the said lift pin near the said board | substrate during the said drying process. The pressure reduction drying apparatus of Claim 1 whose clearance of the said board | substrate and the said shielding plate in the said drying process exists in the range of 2 mm-10 mm. The pressure reduction drying apparatus according to claim 1, wherein the shielding plate has a first opening for allowing the lift pin to move up and down and a second opening for avoiding interference with the roller conveyance path. The pressure reduction drying apparatus in any one of Claim 1 to 4 which changes the height position of the said shielding plate at the time of performing the said drying process, and at the time of conveying the roll of the said board | substrate on the said roll conveyance path. The pressure reduction drying apparatus of Claim 5 which has a shielding board lift mechanism for varying the height position of a shielding board independently of the said lift pin. A pressure reducing drying apparatus for performing a drying treatment under reduced pressure on a film of a coating liquid formed on a substrate to be processed,
A pressure sensitive chamber having a space for accommodating the substrate in a horizontal state;
An exhaust mechanism for evacuating the inside of the chamber in a closed state for the drying treatment;
A conveying mechanism having a roll conveyance path continuous outside and inside of said chamber, and carrying or transferring said substrate to or from said chamber by a roll conveyance on said roll conveyance path;
A shielding plate for preventing the airflow generated below the substrate from affecting the substrate by vacuum evacuation during the drying process;
A plurality of support pins discretely installed on the shielding plate to horizontally support the substrate at the pin tip during the drying process;
Coupled to the shielding plate, the tip of the support pin is made higher than the roller conveyance path when the drying process is performed to enable the support of the substrate by the support pin, and the support is carried out when carrying out the substrate. And a shielding plate elevating mechanism for moving the shielding plate up and down so that the tip of the pin is lower than the roller conveyance path so that the roller conveyance of the substrate can be carried by the conveying mechanism. The pressure reduction drying apparatus of Claim 7 whose clearance of the said board | substrate and the said shielding plate in the said drying process exists in the range of 2 mm-10 mm. A pressure reducing drying apparatus for applying a drying treatment under reduced pressure to a film of a coating liquid formed on a substrate to be processed,
A pressure sensitive chamber having a space for accommodating the substrate in a horizontal state;
An exhaust mechanism for evacuating the inside of the chamber in a closed state for the drying treatment;
A conveying mechanism having a roll conveyance path continuous outside and inside of said chamber, and carrying or transferring said substrate to or from said chamber by a roll conveyance on said roll conveyance path;
It has a plurality of lift pins disposed discretely in the chamber to support and move the substrate horizontally at the pin tip, and when the drying process is performed, the tip of the lift pin is higher than the roller conveyance path A lift mechanism for supporting a substrate and carrying the substrate in and out of the substrate by lowering the pin tip of the lift pin than the roller conveyance path;
And a airflow shielding member integrally attached to said lift pin in order to prevent the airflow generated below the substrate from being affected by the vacuum during the drying process affecting the substrate around the lift pin. The pressure reduction drying apparatus according to claim 10, wherein the airflow shielding member extends in a blade shape toward the circumference from a portion lower by a predetermined distance from the pin tip of the lift pin. The pressure reduction drying apparatus according to claim 10, wherein the predetermined distance is in a range of 2 mm to 10 mm. A pressure reducing drying apparatus for performing a vacuum drying treatment on a film of a coating liquid formed on a substrate to be processed,
A pressure sensitive chamber having a space for accommodating the substrate in a horizontal state;
A conveying mechanism having a roll conveyance path continuous outside and inside of said chamber, and carrying or transferring said substrate to or from said chamber by a roll conveyance on said roll conveyance path;
An exhaust mechanism for evacuating the inside of the chamber in a closed state for the vacuum drying treatment;
A purging mechanism for supplying a purging gas into the chamber to terminate the reduced pressure drying process;
It has a plurality of support pins disposed discretely in the chamber to support the substrate horizontally up and down at the tip of the pin, when the pressure-drying process is performed, the tip of the support pin is higher than the roller conveyance path A substrate lift mechanism for supporting a substrate and carrying the substrate by the conveyance mechanism by lowering the pin tip of the support pin than the roller conveyance path when carrying out the substrate;
And a shielding plate provided to cover the bottom of the substrate in the vicinity of the roller conveyance path in order to reduce fluctuations in the ambient temperature in the chamber. The pressure reduction drying apparatus according to claim 12, wherein the shielding plate is fixedly installed at a constant height position. A pressure reducing drying apparatus for performing a vacuum drying treatment on a film of a coating liquid formed on a substrate to be processed,
A pressure sensitive chamber having a space for accommodating the substrate in a horizontal state;
A conveying mechanism having a roll conveyance path continuous outside and inside of said chamber, and carrying or transferring said substrate to or from said chamber by a roll conveyance on said roll conveyance path;
An exhaust mechanism for evacuating the inside of the chamber in a closed state for the vacuum drying treatment;
A purging mechanism for supplying a purging gas into the chamber to terminate the reduced pressure drying process;
A shielding plate provided to cover the bottom of the substrate in order to reduce the ambient temperature in the chamber during the vacuum drying and purging;
A plurality of support pins discretely installed on the shielding plate to horizontally support the substrate at the pin tip during the decompression drying process;
Coupled to the shielding plate, the tip of the support pin is made higher than the roller conveyance path when the drying process is performed to enable the support of the substrate by the support pin; And a shielding plate elevating mechanism for moving the shielding plate up and down so that the tip of the pin is lower than the roller conveyance path so that the roller conveyance of the substrate can be carried by the conveying mechanism. The said shielding plate has a 1st opening for penetrating the said support pin up and down, and a 2nd opening for avoiding interference with the said roll conveyance path, The said any one of Claims 12-14. Decompression Dryer. The pressure purge drying apparatus according to any one of claims 12 to 14, wherein the purging mechanism has a purging gas ejecting unit that ejects the purging gas at a position higher than a conveying surface of the roller conveying path. 17. The reduced pressure drying apparatus according to claim 16, wherein a gas ejection port of the purging gas ejection section is provided at a position 20 mm to 30 mm higher than a conveyance surface of the roller conveyance path. A pressure reducing drying apparatus for performing a vacuum drying treatment on a film of a coating liquid formed on a substrate to be processed,
A pressure sensitive chamber having a space for accommodating the substrate in a horizontal state;
An exhaust mechanism for evacuating the inside of the chamber in a closed state for the vacuum drying treatment;
A conveying mechanism having a roll conveyance path continuous outside and inside of said chamber, and carrying or transferring said substrate to or from said chamber by a roll conveyance on said roll conveyance path;
It has a plurality of support pins disposed discretely in the chamber to support and move the substrate horizontally at the tip of the pin, and when the decompression drying process is performed, the tip of the support pin is higher than the roller conveyance path A substrate lift mechanism for supporting a substrate and carrying the substrate by the conveyance mechanism by lowering the pin tip of the support pin than the roller conveyance path when carrying out the substrate;
A purging mechanism for supplying a purging gas into the chamber to terminate the reduced pressure drying process,
And the purging mechanism has a gas ejecting section for ejecting the purging gas at a position higher than the roller conveyance path. 19. The reduced pressure drying apparatus according to claim 18, wherein a gas ejection port of the purging gas ejection section is provided at a position 20 mm to 30 mm higher than a conveyance surface of the roller conveyance path.

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