KR20110036783A - Method of manufacturing a light emitting unit and light emitting device using the same - Google Patents

Abstract

PURPOSE: A method for manufacturing a light emitting unit is provided to connect a plurality of light emitting units each other, thereby arranging the light emitting units at desired locations. CONSTITUTION: At least one light emitting device is mounted on a printed circuit board(S100). At least one power supply terminal applies power to the light emitting device and is connected to the printed circuit board(S200). A housing surrounds the light emitting unit which includes the printed circuit board and the power supply terminal(S300). A light emitting unit is inserted into a first mold with the shape corresponding to one side of the housing(S310). The first mold is covered by a second mold(S320). The first and second molds are filled with resins(S330).

Description

Method for manufacturing light emitting unit and light emitting device manufactured using the same {METHOD OF MANUFACTURING A LIGHT EMITTING UNIT AND LIGHT EMITTING DEVICE USING THE SAME}

The present invention relates to a method of manufacturing a light emitting unit and a light emitting device including the light emitting unit manufactured by the present invention, and more particularly, to a method of manufacturing a light emitting unit that can be used in general lighting, such as billboards, signs, lamps, etc. A light emitting device comprising a light emitting unit.

In general, billboards used for outdoor advertising are a lot of fluorescent lamps, neon, etc. as a light source. Recently, a light emitting diode (LED) is employed as a light source of the billboard in order to solve the problems of fluorescent lamps, neon lights, etc., the limitation of color implementation, lack of durability, and short lifespan.

The advertisement board arranges a plurality of light emitting units including the light emitting diodes in the shape of letters in the advertisement board in order to display advertisement contents for the purpose of advertisement.

Since the light emitting units for the channel letter are manufactured by being connected to each other by a wire having a standardized length, the operator who manufactures the advertisement board cuts and connects the wires to electrically connect the light emitting units. Therefore, since the wires are electrically connected by soldering or the like, there are time and cost limitations that require a plurality of work processes. In addition, when some of the light emitting units have reached the end of their lifespan or defects have occurred, troublesome occurrence of an electrical connection process using soldering or the like also occurs when the light emitting unit having a problem is replaced with a new light emitting unit.

Accordingly, the first problem to be solved by the present invention is to provide a method of manufacturing a light emitting unit that can simplify the process and improve the yield.

In addition, a second problem to be solved by the present invention is to provide a light emitting device including a light emitting unit manufactured by the manufacturing method.

In one embodiment, a method of manufacturing a light emitting unit includes mounting at least one light emitting device on a printed circuit board, and connecting at least one power supply terminal for applying power to the light emitting device with the printed circuit board. And forming a housing integrally surrounding the light emitting unit including the printed circuit board and the power supply terminal protruding from the printed circuit board.

The forming of the housing may include inserting the light emitting part into a first mold having a shape corresponding to one side of the housing, combining the first mold into which the light emitting part is inserted, with the first mold. Covering with a second mold having a shape corresponding to the outside of the and may include the step of injecting a resin into the first mold and the second mold.

A hole penetrating is formed in the printed circuit board, and the first mold includes a support for fixing the light emitting portion introduced therein, and the step of introducing the light emitting portion into the first mold aligns the hole to coincide with the support. And penetrating the support part through the hole.

The support part includes a fixing protrusion for contacting one side of the printed circuit board to fix the printed circuit board, and injecting resin into the first mold and the second mold may include a position where the fixing protrusion is formed. This can be done by injecting the resin in the opposite direction.

According to an embodiment of the present invention, there is provided a light emitting device including: a printed circuit board including at least one light emitting device; The housing includes a housing integrally surrounding the power supply terminal and including a body part corresponding to the printed circuit board and a coupling part protruding from the body part to surround the power supply terminal.

In one embodiment, the light emitting device may include a detachable wire connection member coupled to the housing corresponding to the coupling portion and the power supply terminal, such that a wire provided from the outside is electrically connected to the power supply terminal. have.

When the wire connecting member is coupled to the housing, the wire connecting member may include a waterproof member formed at a portion contacting the housing to prevent external water from penetrating.

According to the present invention, by forming a housing that integrally surrounds a printed circuit board on which the light emitting element is mounted and a wire applying terminal and connects a plurality of light emitting units to each other through a wire connecting member to which wires of various lengths are connected, to a channel letter. The length between the light emitting units to be utilized can be easily adjusted, and a plurality of light emitting units can be disposed at a free position to implement.

In addition, since the housing is formed to integrally surround the printed circuit board on which the light emitting device is mounted and the power supply terminal, productivity of the light emitting unit can be improved.

As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

The terms first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "having" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described in the specification, and that one or more other features It should be understood that it does not exclude in advance the possibility of the presence or addition of numbers, steps, actions, components, parts or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art.

Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the meaning in the context of the relevant art and are to be interpreted as ideal or overly formal in meaning unless explicitly defined in the present application Do not.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.

<Method of manufacturing light emitting unit>

1 is a flowchart illustrating a method of manufacturing a light emitting unit according to an embodiment of the present invention. FIG. 2 is a diagram for specifically describing a configuration of a light emitting part used in the manufacturing method of FIG. 1.

1 and 2, in the method of manufacturing the light emitting unit, the light emitting device 111a is mounted on the printed circuit board 111 (S100). Subsequently, the power supply terminal 112 is connected to the printed circuit board 111 (S200). Thereafter, the housing 120 which integrally surrounds the printed circuit board 111 to which the power supply terminal 112 is connected is molded (S300).

Hereinafter, the steps will be described in detail. First, the light emitting device 111a is mounted on the printed circuit board 111 (S100). For example, the printed circuit board 111 and the light emitting device 111a may be coupled by screws, pins, or the like. Alternatively, the printed circuit board 111 and the light emitting device 111a may be fixed to the printed circuit board 111 by using a molding resin. A plurality of light emitting devices 111a may be formed on the printed circuit board 111 in consideration of illuminance required for the light emitting unit, and may be disposed on the printed circuit board 111 on both sides instead of one side thereof. Therefore, the mounting of the light emitting element 111a on the printed circuit board 111 may be repeatedly performed in the same manner.

Subsequently, the power supply terminal 112 is connected to the printed circuit board 111 (S200). For example, a lead wire (not shown) connected to the light emitting element 111a and a power supply terminal 112 may be electrically connected to an end portion of the printed circuit board 111 by soldering or the like. For example, the power supply terminal 112 may include a plurality of pins formed according to the number of light emitting devices 111a mounted on the printed circuit board 111. Therefore, the step of connecting the power supply terminal 112 and the printed circuit board 111 may be repeatedly performed several times in the same manner.

Subsequently, the housing 120 surrounding the light emitting unit 110 including the power supply terminal 112 and the printed circuit board 111 is integrally formed (S300). For example, the power supply terminal 112 connected to the printed circuit board 111 may have a shape protruding from the printed circuit board 111, and may be a part of the printed circuit board 111 and the light emitting device 111a. Covering the housing 120 may be formed to surround the power supply terminal 112.

The molding method is injection molding, air cushion molding, autoclave molding, automatic compression molding, bag molding, cream cell vacuum molding. sell vaccum forming, compression molding, foam molding, dip molding, casting, and the like.

FIG. 3 is a diagram for describing a forming of the housing of FIG. 1 according to one embodiment. FIG.

Referring to Figure 3, this embodiment uses an injection molding method of the above-described molding method.

Specifically, the light emitting unit 110 is introduced into the first mold 10 having a shape corresponding to one side of the housing 120 to be molded (S310). The first mold 10 may be disposed in a direction parallel to the ground in consideration of a work space, or may be disposed in a direction perpendicular to the ground.

Here, the first mold 10 has a hole 111b penetrating through the printed circuit board 111 to be spaced apart from the light emitting unit 110, the first mold 10 is It may include a support portion 30 for fixing the printed circuit board 111 inserted through the hole (111b).

At this time, the step of introducing the light emitting unit 110 into the first mold 10 (S310) is a hole 111b formed in the printed circuit board 111 is the support portion formed in the first mold (10) Alignment (S311) to match the position of 30, and passes through the support portion 30 to the hole (111b) (S312).

The length of the support part 30 may protrude from one side surface of the first mold 10 to penetrate the printed circuit board 111 and penetrate the other side surface of the first mold 10. In order to form a constant, it may include a fixing protrusion 40 for fixing the printed circuit board 111 in contact with one side of the printed circuit board 111.

Subsequently, the first mold 10 into which the light emitting unit 110 is introduced is covered with the second mold 20 (S320). Here, the second mold 20 has a shape corresponding to the external shape of the housing 120 to be combined with the first mold 10 to be molded.

First, the second mold 20 is aligned at a position coinciding with the first mold 10, and the second mold 20 is lowered in the direction in which the first mold 10 is formed. Here, the order of aligning the second mold 20 and the first mold 10 and descending the second mold 20 may be changed, and may be performed simultaneously.

Subsequently, resin is injected into the first mold 10 and the second mold 20 (S330). Here, the second mold 20 may include a resin injection unit 50 through which the resin can be injected. The resin injection unit 50 may be formed in a direction opposite to the position where the fixing protrusion 40 is formed. In this case, when the resin is injected into the resin injecting part 40, the resin starts to be filled from the opposite direction in which the fixing protrusion 40 is formed. Thus, the resin to be filled is to press the printed circuit board 111 in the opposite direction in which the resin is filled. The fixing protrusion 40 may fix the printed circuit board 111 so as not to move against the force of the resin to be filled to press the printed circuit board 111.

After the resin is completely filled in the first mold 10 and the second mold 20, the support part 30 is opened from the inside of the first mold 10 and the second mold 20. It can be taken out of the 1st metal mold | die 10. Alternatively, when the resin starts to harden slowly between the first mold 10 and the second mold 20, the support 30 may be pulled out. Subsequently, after removing the support part 30, a small amount of resin may be injected into the first mold 10 and the second mold 20 to fill an empty space in which the support part 30 is removed.

Subsequently, after the resin is completely cured, the second mold 20 is separated from the first mold 10, and the light emitting unit 100 including the molded housing 120 is formed in the first mold ( 10).

<Light emitting device>

FIG. 4 is an exploded perspective view for describing a configuration of a light emitting device including the light emitting unit manufactured by FIG. 1.

Referring to FIG. 4, the light emitting device 1000 includes a light emitting unit 100.

The light emitting unit 100 includes a light emitting unit 110 and a housing 120, and the light emitting unit 110 includes a printed circuit board 111 and a power supply terminal 112. The printed circuit board 111 may include at least one light emitting device 111a. The light emitting element 111a may emit various kinds of light such as white light and red light. In addition, a plurality of light emitting devices 111a may be formed on the printed circuit board 111 in consideration of illuminance of the light emitting device 1000, and are formed on the printed circuit board 111 by maintaining a constant interval. Can be.

The power supply terminal 112 is electrically connected to the printed circuit board 111 to supply power to the light emitting device 111a. The power supply terminal 112 may be connected to contact the end of the printed circuit board 111. Therefore, the power supply terminal 112 may be formed to protrude from the printed circuit board 111. The power supply terminal 112 may be formed in a number corresponding to the number of light emitting elements 111a formed on the printed circuit board 111.

The printed circuit board 111 may further include a hole 111b. The hole 111b may have a shape penetrating the printed circuit board 111. A plurality of holes 111b may be formed in the printed circuit board 111. As described above with reference to FIG. 3, the hole 111b is to be fixed to the first mold 10 when the housing 120 is molded. The hole 111b is the same as the hole 111b in FIG. 3. Will be omitted.

The light emitting device 1000 includes a housing 120. The housing 120 integrally surrounds the printed circuit board 111 and the power supply terminal 112. However, as shown in FIG. 4, the housing 120 does not have a shape that encapsulates the printed circuit board 111 and the power supply terminal 112. For example, the housing 120 may not surround a portion where the light emitting element 111a is formed on the printed circuit board 111. In addition, the housing 120 may surround the power supply terminal 112 and be spaced apart from the power supply terminal 112.

The housing 120 may include a body portion 122 and a coupling portion 124. The main body 122 may correspond to the printed circuit board 111 and may cover at least one of a front surface and a rear surface of the printed circuit board 111. The coupling part 124 protrudes from the main body part 122 to surround the power supply terminal 112.

The light emitting device 1000 may further include a wire connection member 200. The wire connection member 200 supplies power to the light emitting unit 110. The portion where the wire connecting member 200 is in contact with the power supply terminal 112 and the housing 120 is formed in a shape corresponding to the space shape between the power supply terminal 112 and the housing 120. Can be. Therefore, the wire connection member 200 may be detached between the power supply terminal 112 and the housing 120.

The wire connection member 200 may include a waterproof member 210. The waterproof member 210 may prevent external water from penetrating when the wire connecting member 200 is inserted between the power supply terminal 112 and the housing 120. The waterproof member 210 may be freely changed in shape and may be formed of a material having elasticity.

FIG. 5 is a coupling diagram of the light emitting device shown in FIG. 4.

Referring to FIG. 5, a plurality of the light emitting devices 1000 are connected by the wire connection member 200. The light emitting device 1000 may further include a wire 300 electrically connected to the wire connection member 200. The light emitting device 1000 can freely implement the shape of the font that is the purpose of advertising by adjusting the length of the wire (300).

As described above, according to the manufacturing method of the light emitting unit according to the present invention, the productivity of the light emitting unit can be improved by molding a housing integrally covering a portion where the light emitting portion and the wire connecting member contact each other.

In addition, by forming a hole in the printed circuit board, penetrating the hole and including a support protrusion including a fixing protrusion for fixing a predetermined position of the printed circuit board in the first mold can be more accurately implement the shape of the housing to be molded. .

According to the light emitting device according to the present invention, it is possible to freely implement the shape of the channel letter to be displayed by adjusting the length of the wire when the billboard is manufactured using the channel letter. In addition, it is possible to easily replace the light emitting device that has reached the end of its life or has a defect.

In the detailed description of the present invention described above with reference to the preferred embodiments of the present invention, those skilled in the art or those skilled in the art having ordinary skill in the art will be described in the claims to be described later It will be understood that various modifications and variations can be made in the present invention without departing from the scope of the present invention.

1 is a flowchart illustrating a method of manufacturing a light emitting device according to an embodiment of the present invention.

FIG. 2 is a diagram for specifically describing a configuration of a light emitting part used in the manufacturing method of FIG. 1.

FIG. 3 is a diagram for describing a forming of the housing of FIG. 1 according to one embodiment. FIG.

FIG. 4 is an exploded perspective view for describing a configuration of a light emitting device including the light emitting unit manufactured by FIG. 1.

FIG. 5 is a coupling diagram of the light emitting device shown in FIG. 4.

<Short description of the major reference symbols>

1000: light emitting device 100: light emitting unit

110: light emitting unit 111: printed circuit board

111a: light emitting element 111b: hole

112: power supply terminal 120: housing

200: wire connecting member 210: waterproof member

300: wire

10: first mold 20: second mold

30: support portion 40: fixing protrusion

50: resin injection unit

Claims (7)

Mounting at least one light emitting element on a printed circuit board; Connecting at least one power supply terminal for supplying power to the light emitting device with the printed circuit board; And And forming a housing integrally enclosing a light emitting unit including the printed circuit board and the power supply terminal protruding from the printed circuit board. According to claim 1, Forming the housing, Introducing the light emitting part into a first mold having a shape corresponding to one side of the housing; Covering the first mold into which the light emitting part is introduced, with a second mold having a shape corresponding to the outside of the housing by combining with the first mold; And And injecting resin into the first mold and the second mold. The method of claim 2, The printed circuit board is formed with a through hole, The first mold includes a support for fixing the drawn light emitting portion, The step of introducing the light emitting part into the first mold, Aligning the hole to coincide with the support; And And passing the support part through the hole. The method of claim 3, The support part includes a fixing protrusion for fixing the printed circuit board in contact with one side of the printed circuit board, And injecting the resin into the first mold and the second mold is performed by injecting the resin in a direction opposite to the position where the fixing protrusion is formed. A light emitting unit including a printed circuit board on which at least one light emitting element is mounted, and at least one power supply terminal for applying power to the printed circuit board; And And a housing which integrally surrounds the printed circuit board and the power supply terminal, and includes a body part corresponding to the printed circuit board and a coupling part protruding from the body part to surround the power supply terminal. 6. The method of claim 5, And a detachable wire connecting member coupled to the housing in correspondence with the coupling part and the power applying terminal so that the wire provided from the outside is electrically connected to the power applying terminal. The method according to claim 6, The wire connecting member, when coupled to the housing, is formed in a portion in contact with the housing, characterized in that it comprises a waterproof member for preventing the penetration of external water.

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