CN105773907B - A kind of joints of optical fibre electronic tag plug and its injection moulding process - Google Patents
A kind of joints of optical fibre electronic tag plug and its injection moulding process Download PDFInfo
- Publication number
- CN105773907B CN105773907B CN201610314805.2A CN201610314805A CN105773907B CN 105773907 B CN105773907 B CN 105773907B CN 201610314805 A CN201610314805 A CN 201610314805A CN 105773907 B CN105773907 B CN 105773907B
- Authority
- CN
- China
- Prior art keywords
- pcb board
- injection
- mould
- die device
- electronic tag
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0001—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14336—Coating a portion of the article, e.g. the edge of the article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/77—Measuring, controlling or regulating of velocity or pressure of moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/78—Measuring, controlling or regulating of temperature
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76494—Controlled parameter
- B29C2945/76498—Pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76494—Controlled parameter
- B29C2945/76531—Temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76494—Controlled parameter
- B29C2945/76551—Time
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
- B29K2023/10—Polymers of propylene
- B29K2023/12—PP, i.e. polypropylene
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention discloses a kind of joints of optical fibre electronic tag plug and its injection moulding process, the plug includes plastic body, pcb board and electronic chip, electronic chip is welded on pcb board, and the plastic body is divided into intermeshing top half and the latter half, and pcb board is integrally formed with top half.The present invention is used electronic tag plug product using pcb board bottom surface as line of demarcation, and two half parts above and below production sharing are separated into injection molding.Injection for the first time is used plus fine PP is expected the pcb board of microarray strip together injection molding; the pcb board of microarray strip is first fixed in the product; to reach fixed PCB positions in the product and the purpose of protection pcb board and chip; second of injection is to be molded identical plastic material with first time; by the semi-finished product injection molding together of first time injection gained; complete electronic tag plug product is obtained, improves product quality.
Description
Technical field
The present invention relates to the injection molding process of electronic tag plug product of the joints of optical fibre with pcb board, particularly relate to
And a kind of joints of optical fibre electronic tag plug and its injection moulding process.
Background technology
Injection on the electronic tag plug product with pcb board in the prior art, is all injection molding manner routinely,
Pcb board single injection-molded technique by the way of pin positioning；Or the single injection-molded work by the way of mould core pulling
Skill.Pcb board can not position completely in mold cavity during single injection-molded technique（Pcb board in a mold upper and lower, left and right,
Forward and backward full positioning）, because the injection pressure of plastic cement, and the flowing of plastic cement can cause in product injection moulding process, pcb board exists
Can be shifted in mold cavity, torsional deformation etc., cause product appearance is bad, assembling is bad, chip is non-watertight, it is pressure-resistant bad and
It is electrically bad etc., such as the problem of chip exposed, cause to be molded by the product come bad.
In summary, trace it to its cause caused by can not being positioned completely in mold cavity for pcb board, also there is portion in the prior art
Die face after the pcb board of point product is close in rear mold, and have a locating dowel positioning, but it is hanging in pcb board and preceding mould position.
Pcb board is movable among mould, and plastic cement, which flows, when meeting is because of injection pressure and injection causes pcb board displacement, torsional deformation etc.,
So that location dislocation of the pcb board in whole product, the requirement of product is not met.
The content of the invention
It is an object of the invention to overcome the deficiencies of the prior art and provide a kind of joints of optical fibre electronic tag plug and its
Injection moulding process, pcb board is accurately positioned, improves injecting products qualification rate.
In order to achieve the above object, the technical solution adopted by the present invention is：
A kind of joints of optical fibre electronic tag plug, including plastic body, pcb board and electronic chip, electronic chip welding
In on pcb board, the plastic body is divided into intermeshing top half and the latter half, pcb board and top half one into
Type.
As presently preferred embodiments of the present invention, top half of the present invention sets upper wave with the latter half junction
Shape joggle and convex platform, lower waveform joggle corresponding with top half junction set location and shape on the latter half
And lower convex platform.
As presently preferred embodiments of the present invention, convex platform of the present invention is arranged to reverse buckling type boss, phase with lower convex platform
Mutually it is fastened.
As presently preferred embodiments of the present invention, circular locating openings are set on pcb board of the present invention.
The invention also discloses a kind of injection moulding process for being used to described joints of optical fibre electronic tag plug be made, including
Following steps：
Step 1: being molded to the top half of plastic body, pcb board and electronic chip are placed in the first mould together
The drag intracavitary of device, is positioned to pcb board and electronic chip, and the upper mould for closing the first die device is molded into
Type, complete the injection of the top half of plastic body；
Step 2: the top half of the plastic body of injection formed to be put into the drag intracavitary of the second die device, close
The upper mould of second die device carries out injection molding, completes the whole injection of plastic body.
As presently preferred embodiments of the present invention, the first die device of the present invention includes upper mould and lower mould, on upper mould
Model cavity in setting, drag chamber is set on lower mould, and drag bottom of chamber face is set and the circular locating openings position correspondence on pcb board
Pin locating dowel.
As presently preferred embodiments of the present invention, step 1 of the present invention specifically includes：
Pcb board and electronic chip are placed in the drag intracavitary of the first die device by step S101. together, and pcb board passes through
Pin locating dowel is bonded with drag bottom of chamber face, and pcb board is completed to position with the drag chamber of the first die device；
Step S102. pcb boards are completed after being positioned with the drag chamber of the first die device, then by the first die device
Ccope closing machine, upper die face push down pcb board, complete up and down positioning of the pcb board in the first die device die cavity；
Step S103. is used in the first mold injection molding plus the injection of fine PP plastic rubber materials, pcb board and electronic chip paster
Temperature is 200~210 DEG C, and 150~185 DEG C of the forming temperature of the first mold injection plastic cement, briquetting pressure is 18~22 ㎏/c ㎡,
Molding cycle is 1~1.5 minute；Cool time 25 seconds wherein after injection molding, take out after cooling, complete the upper of plastic body
The injection of half part, obtain the semi-finished product of the first mold injection completion.
As presently preferred embodiments of the present invention, the second die device of the present invention includes upper mould and lower mould, on upper mould
Model cavity in setting, drag chamber is set on lower mould,.
As presently preferred embodiments of the present invention, step 2 of the present invention specifically includes：
The semi-finished product that step S201. completes a mold injection load the drag chamber of the second injection molding mould fixed die device
In, the then Ccope closing machine injection of the second die device；
Step S202. is using fine PP plastic rubber materials injection is added, and on forming temperature, the forming temperature of the second mold injection is set
For 230~260 DEG C, briquetting pressure is 20~24 ㎏/c ㎡, and molding cycle is 1~1.5 minute, and wherein cool time is 25 seconds,
Take out after cooling, obtain joints of optical fibre electronic tag plug finished product.
Compared with prior art, the beneficial effects of the invention are as follows：By the way that plastic body is divided into two parts, and wherein one
Divide and positioned with pcb board, and in injection moulding process, be divided into quadric injection mould, reach the accurate positioning in mold cavity by pcb board
Effect, improve the qualification rate of product.
Brief description of the drawings
Fig. 1 is the overall structure decomposing schematic representation of the present invention；
Fig. 2 is the overall structure schematic cross-sectional view of the present invention；
Fig. 3 is the plastic body top half structural representation of the present invention；
Fig. 4 is the plastic body the latter half structural representation of the present invention；
Fig. 5 is the lower mould location structure schematic diagram of the first die device of the present invention；
Fig. 6 is the overall location structure schematic diagram of the first die device of the present invention；
Fig. 7 is the overall location structure schematic diagram of the second die device of the present invention；
The product structure that Fig. 8 is the present invention completes structural representation.
Embodiment
Idea of the invention is that overcome the deficiencies in the prior art, there is provided a kind of joints of optical fibre electronic tag plug and its
Injection moulding process, traditional Shooting Technique defect is made up, found by research, in current Shooting Technique, pcb board is in mold cavity
In can not normally position, or pcb board can not bear injection pressure.As long as the accurate positioning in mold cavity by pcb board, ability
It is molded by qualified product.Pcb board is fixed in mold cavity, requirement is unable to reach by existing product structure, is just needed
By existing product structure in the requirement for not changing product, it is molded production sharing two parts and at twice.Below
It is described in detail referring to the drawings in conjunction with the embodiments, so that the technical characteristic to the present invention and advantage are interpretated more in-depth.
The structural representation of the present invention as Figure 1-4, a kind of joints of optical fibre electronic tag plug, including plastic body
1st, pcb board 2 and electronic chip 3, electronic chip 3 are welded on pcb board 2, and the plastic body 1 divides for the intermeshing first half
Points 11 and the latter half 12, pcb board 2 be integrally formed with top half 11.As shown in Fig. 2 by electronic tag plug product with PCB
Plate bottom surface is line of demarcation, and two half parts above and below production sharing are separated into injection molding.Injection for the first time uses plus fine PP material will
The injection molding together of the pcb board of microarray strip, the pcb board of microarray strip is first fixed in the product, to reach fixed PCB in the product
Position and the purpose of protection pcb board and chip, second injection is to be molded identical plastic material with first time, by first
Semi-finished product injection molding together obtained by secondary injection, complete electronic tag plug product is obtained, improve product quality.
As presently preferred embodiments of the present invention, set in top half 11 of the present invention with the junction of the latter half 12
Upper waveform joggle 111 and convex platform 112, it is corresponding with the junction set location of top half 11 and shape on the latter half 12
Lower waveform joggle 121 and lower convex platform 122.In the present invention, in order to reach preferably injection effect, pcb board is fixed
In mold cavity, requirement is unable to reach by existing product structure, it is necessary to which existing product structure is not being changed into product
Requirement on, be molded production sharing two parts and at twice.Wherein upper and lower half point is independent injection, by pcb board
It is molded with top half with electronic chip, in order to prevent the conformability of defiber after being molded twice, therefore is not influenceing together
In the case of the outward appearance and requirement of product, go out to do reverse buckling type false boss and waveform joggle in two half parts, strengthen
Product after injection for the first time and second of injection will not split at defiber again.As shown in Figure 3,4, it is of the present invention convex
Platform 112 is arranged to reverse buckling type boss with lower convex platform 122, is mutually fastened.
As presently preferred embodiments of the present invention, circular locating openings 21 are set on pcb board 2 of the present invention.In the present invention
The numbers of circular locating openings 21 be arranged as required to, as shown in figure 3, setting 3 circular locating openings 21.In order to preferably fix
Pcb board, it is fitted into by pcb board in mold cavity, pcb board bottom surface is bonded completely with rear model cavity bottom surface, thus controls PCB
The position of plate lower section in die cavity, then control pcb board front, rear, left and right in mold cavity by 3 pin locating dowels
Position.
The invention also discloses a kind of injection moulding process for being used to described joints of optical fibre electronic tag plug be made, including
Following steps：
Step 1: being molded to the top half of plastic body, pcb board and electronic chip are placed in the first mould together
The drag intracavitary of device, is positioned to pcb board and electronic chip, and the upper mould for closing the first die device is molded into
Type, complete the injection of the top half of plastic body；
Step 2: the top half of the plastic body of injection formed to be put into the drag intracavitary of the second die device, close
The upper mould of second die device carries out injection molding, completes the whole injection of plastic body.
As shown in Figure 5,6, the first die device of the present invention includes upper mould 41 and lower mould 42, is set on upper mould 41
Model cavity 411, drag chamber 421 is set on lower mould 42, and the bottom surface of drag chamber 421 is set and the circular locating openings 21 on pcb board 2
The pin locating dowel 422 of position correspondence.Upper model cavity 411 and drag chamber 421 after injection by forming top half 11
Shape.The shape that upper model cavity 411 and drag chamber 421 set by the cover half device of top are molded by is top half 11
Shape.
As shown in fig. 7, the second die device of the present invention includes upper mould 51 and lower mould 52, upper mould is set on upper mould 51
Die cavity 511, drag chamber 521 is set on lower mould 52.Upper model cavity 511 is used to be molded the latter half 12, and drag chamber 521 is used for
The semi-finished product of the injection of top half are fitted into the second injection mold drag chamber.Upper model set by second die device
The shape that chamber 511 and drag chamber 521 are molded by is the shape after whole post formings.
Following three specific embodiments of specific injection moulding process point of the present invention：
Embodiment 1
A kind of injection moulding process for being used to be made described joints of optical fibre electronic tag plug comprises the following steps that：
Pcb board and electronic chip are placed in the drag intracavitary of the first die device by step S101. together, and pcb board passes through
Pin locating dowel is bonded with drag bottom of chamber face, and pcb board is completed to position with the drag chamber of the first die device；As shown in figure 5,
Pcb board is fitted into mold cavity, pcb board bottom surface is bonded completely with rear model cavity bottom surface, thus controls pcb board in die cavity
The position of middle lower section, then control the position of pcb board front, rear, left and right in mold cavity by 3 pin locating dowels；
After step S102. pcb boards complete the drag chamber positioning of the first die device, then by the upper of the first die device
Mould matched moulds, upper die face push down pcb board, complete up and down positioning of the pcb board in the first die device die cavity, this completes
Complete positioning of the pcb board in mold cavity, as shown in Figure 6；
Step S103. is used in the first mold injection molding plus fine PP（Polypropylene）Plastic rubber material is molded, pcb board and electronics
Chip paster temperature is 200 DEG C, and 150 DEG C of the forming temperature of the first mold injection plastic cement, briquetting pressure is 18 ㎏/c ㎡, shaping week
Phase is 1 minute；Cool time 25 seconds wherein after injection molding, take out after cooling, complete the note of the top half of plastic body
Modeling, the semi-finished product of completion are once molded, as shown in Figure 3；
Step S201. is fitted into what once injection was completed in the drag chamber of second of the second die device of injection, then
The Ccope closing machine injection of second die device, pcb board now, which has already passed through injection and semi-finished product for the first time, turns into an entirety,
So pcb board avoids the need for repositioning, then is molded through Ccope closing machine, with regard to that will be molded into finished product product after being now molded；
Step S202. is used plus the injection of fine PP plastic rubber materials, on forming temperature, the forming temperature of second of injection mold
230 DEG C are set to, briquetting pressure is 20 ㎏/c ㎡, and molding cycle is 1 minute, and wherein cool time is 25 seconds, is taken out after cooling,
Obtain joints of optical fibre electronic tag plug finished product.
Embodiment 2
A kind of injection moulding process for being used to be made described joints of optical fibre electronic tag plug comprises the following steps that：
Pcb board and electronic chip are placed in the drag intracavitary of the first die device by step S101. together, and pcb board passes through
Pin locating dowel is bonded with drag bottom of chamber face, and pcb board completes the drag chamber positioning of the first die device；As shown in figure 5, will
Pcb board is fitted into mold cavity, and pcb board bottom surface is bonded completely with rear model cavity bottom surface, thus controls pcb board in die cavity
The position of lower section, then control the position of pcb board front, rear, left and right in mold cavity by 3 pin locating dowels；
After step S102. pcb boards complete the drag chamber positioning of the first die device, then the upper mould conjunction by the first mould
Mould, upper die face compress pcb board, complete up and down positioning of the pcb board in the first die device die cavity, this completes PCB
Complete positioning of the plate in mold cavity, as shown in Figure 6；
Step S103. is used in the first mold injection molding plus fine PP（Polypropylene）Plastic rubber material is molded, pcb board and electronics
Chip paster temperature is 205 DEG C, and 170 DEG C of the forming temperature of the first mold injection plastic cement, briquetting pressure is 20 ㎏/c ㎡, shaping week
Phase is 1.25 minutes；Cool time 25 seconds wherein after injection molding, take out after cooling, complete the top half of plastic body
Injection, the semi-finished product of completion are once molded, as shown in Figure 3；
The semi-finished product that step S201. completes the first mold injection load the lower mould of the second die device of second of injection
In die cavity, the then Ccope closing machine injection of the second die device, pcb board now have already passed through injection for the first time and semi-finished product into
For an entirety, such pcb board avoids the need for repositioning, then is molded through Ccope closing machine, with regard to that will be molded into after being now molded
Product product；
Step S202. is using fine PP plastic rubber materials injection is added, and on forming temperature, the forming temperature of the second mold injection is set
For 245 DEG C, briquetting pressure is 22 ㎏/c ㎡, and molding cycle is 1.25 minutes, and wherein cool time is 25 seconds, is taken after cooling
Go out, obtain joints of optical fibre electronic tag plug finished product.
Embodiment 3
A kind of injection moulding process for being used to be made described joints of optical fibre electronic tag plug comprises the following steps that：
Pcb board and electronic chip are placed in the drag intracavitary of the first die device by step S101. together, and pcb board passes through
Pin locating dowel is bonded with drag bottom of chamber face, and pcb board is completed to position with the drag chamber of the first die device；As shown in figure 5,
Pcb board is fitted into mold cavity, pcb board bottom surface is bonded completely with rear model cavity bottom surface, thus controls pcb board in die cavity
The position of middle lower section, then control the position of pcb board front, rear, left and right in mold cavity by 3 pin locating dowels；
Step S102. pcb boards are completed after being positioned with the drag chamber of the first die device, then by the first die device
Ccope closing machine, upper die face push down pcb board, complete up and down positioning of the pcb board in the cover half device die cavity of top, thus complete
Complete positioning of the pcb board in mold cavity, as shown in Figure 6；
Step S103. is used in the first mold injection molding plus fine PP（Polypropylene）Plastic rubber material is molded, pcb board and electronics
Chip paster temperature is 210 DEG C, and 185 DEG C of the forming temperature of the first mold injection plastic cement, briquetting pressure is 22 ㎏/c ㎡, shaping week
Phase is 1.5 minutes；Cool time 25 seconds wherein after injection molding, take out after cooling, complete the top half of plastic body
Injection, the semi-finished product of completion are once molded, as shown in Figure 3；
The semi-finished product that step S201. completes the first mold injection load the lower mould of the second die device of second of injection
In die cavity, the then Ccope closing machine injection of the second die device, pcb board now have already passed through injection for the first time and semi-finished product into
For an entirety, such pcb board avoids the need for repositioning, then is molded through Ccope closing machine, with regard to that will be molded into after being now molded
Product product；
Step S202. is using fine PP plastic rubber materials injection is added, and on forming temperature, the forming temperature of the second mold injection is set
For 260 DEG C, briquetting pressure is 24 ㎏/c ㎡, and molding cycle is 1.5 minutes, and wherein cool time is 25 seconds, is taken out after cooling,
Obtain joints of optical fibre electronic tag plug finished product.
Improve by Shooting Technique, hence it is evident that improve the yield of product, before not improving, can not be molded qualified production substantially
Product, after being improved using new injection moulding process, the yield of product reaches 99.8 more than ﹪, improves product quality, meets user's request,
Improve company's benefit.The present invention will be unable to the product with traditional injection moulding technique productions, improve by being segmented Shooting Technique, will
Originally one-time formed production sharing double fragmentation injection, successfully solves product in injection moulding process because electronic device is in mould
The drawbacks of caused by can not being positioned in die cavity and can not being normally molded production, product is set normally to be molded production.
Clear, complete description is carried out to the present invention by the technical scheme in above example, it is clear that described reality
Apply embodiment of the example for a present invention part, rather than whole embodiments.It is common based on the embodiment in the present invention, this area
The every other embodiment that technical staff is obtained under the premise of creative work is not made, belong to the model that the present invention protects
Enclose.
Claims (6)
- A kind of 1. joints of optical fibre electronic tag plug, it is characterised in that：Including plastic body（1）, pcb board（2）And electronics core Piece（3）, electronic chip（3）It is welded in pcb board（2）On, the plastic body（1）It is divided into intermeshing top half（11）And The latter half（12）, pcb board（2）With top half（11）It is integrally formed；The top half（11）Upper and the latter half（12）Junction sets upper waveform joggle（111）And convex platform （112）, the latter half（12）Upper and top half（11）Lower waveform joggle corresponding to junction set location and shape （121）And lower convex platform（122）；The convex platform（112）With lower convex platform（122）Reverse buckling type boss is arranged to, is mutually fastened；The pcb board（2）Upper setting circular locating openings（21）.
- 2. a kind of injection moulding process for being used to the joints of optical fibre electronic tag plug described in claim 1 be made, its feature exist In comprising the following steps：Step 1: being molded for the first time, i.e., the top half of plastic body is molded, pcb board and electronic chip are put together In the drag intracavitary of the first die device, pcb board and electronic chip are positioned, the upper mould for closing the first die device enters Row injection molding, complete the injection of the top half of plastic body；Step 2: second is molded, will the plastic body of first time injection formed be that the top half of product is put into the second mould The drag intracavitary of device, the upper mould for closing the second die device carry out injection molding, complete the whole injection of plastic body.
- 3. the injection moulding process of joints of optical fibre electronic tag plug according to claim 2, it is characterised in that：Described first Die device includes upper mould（41）And lower mould（42）, upper mould（41）Model cavity in upper setting（411）, lower mould（42）Mould under upper setting Die cavity（421）, drag chamber（421）Bottom surface is set and pcb board（2）On circular locating openings（21）The pin positioning of position correspondence Post（422）.
- 4. the injection moulding process of joints of optical fibre electronic tag plug according to claim 3, it is characterised in that the step One specifically includes：Pcb board and electronic chip are placed in the drag intracavitary of the first die device by step S101. together, and pcb board passes through pin Locating dowel is bonded with drag bottom of chamber face, and pcb board completes the drag chamber positioning of the first die device；After step S102. pcb boards complete the drag chamber positioning of the first die device, then the upper mould conjunction by the first die device Mould, upper die face push down pcb board, complete up and down positioning of the pcb board in the first die device die cavity；Step S103. is used in the first mold injection molding plus the injection of fine PP plastic rubber materials, pcb board and electronic chip paster temperature For 200~210 DEG C, 150~185 DEG C of the forming temperature of the first mold injection plastic cement, briquetting pressure is 18~22 ㎏/c ㎡, shaping Cycle is 1~1.5 minute；Cool time 25 seconds wherein after injection molding, take out after cooling, complete the first half of plastic body The injection divided, once it is molded the semi-finished product of completion.
- 5. the injection moulding process of joints of optical fibre electronic tag plug according to claim 4, it is characterised in that：Described second Die device includes upper mould（51）And lower mould（52）, upper mould（51）Model cavity in upper setting（511）, lower mould（52）Mould under upper setting Die cavity（521）.
- 6. according to the injection moulding process of the joints of optical fibre electronic tag plug described in claim any one of 2-5, its feature exists In the step 2 specifically includes：The semi-finished product that first mold injection is completed are fitted into the drag chamber of the second injection molding mould fixed die device by step S201., Then the Ccope closing machine injection of the second die device；Step S202. is using fine PP plastic rubber materials injection is added, and on forming temperature, the forming temperature of the second injection mold is set to 230 ~260 DEG C, briquetting pressure is 20~24 ㎏/c ㎡, and molding cycle is 1~1.5 minute, and wherein cool time is 25 seconds, to be cooled After take out, obtain joints of optical fibre electronic tag plug finished product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610314805.2A CN105773907B (en) | 2016-05-13 | 2016-05-13 | A kind of joints of optical fibre electronic tag plug and its injection moulding process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610314805.2A CN105773907B (en) | 2016-05-13 | 2016-05-13 | A kind of joints of optical fibre electronic tag plug and its injection moulding process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105773907A CN105773907A (en) | 2016-07-20 |
| CN105773907B true CN105773907B (en) | 2018-02-06 |
Family
ID=56378606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610314805.2A Expired - Fee Related CN105773907B (en) | 2016-05-13 | 2016-05-13 | A kind of joints of optical fibre electronic tag plug and its injection moulding process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105773907B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106514941B (en) * | 2016-11-09 | 2019-10-25 | 张国清 | A kind of thermometric formable layer technique of cool-bag |
| CN106793549A (en) * | 2016-12-20 | 2017-05-31 | 曾美英 | A kind of technological process of four anti-PCBA |
| CN108724611A (en) * | 2018-07-04 | 2018-11-02 | 深圳市宝源达电子有限公司 | The injection mold and injection moulding process of WIFI devices |
| CN110355933A (en) * | 2019-06-28 | 2019-10-22 | 和平县华毅塑胶制品有限公司 | The forming method of pcb board package casing |
| CN110625869A (en) * | 2019-10-16 | 2019-12-31 | 中山市美图塑料工业有限公司 | A heating toilet cover and its preparation process |
| CN112172022A (en) * | 2020-10-14 | 2021-01-05 | 通达（厦门）精密橡塑有限公司 | Method for molding metal plastic part coated with silicon rubber |
| CN113492490B (en) * | 2021-09-08 | 2021-12-21 | 苏州百孝医疗科技有限公司 | Injection molding method and assembly of shell with built-in PCB |
Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201319258Y (en) * | 2008-12-10 | 2009-09-30 | 曾国华 | Memory card with label structure |
| CN201533045U (en) * | 2009-09-22 | 2010-07-21 | 东莞煜森精密端子有限公司 | usb interface connector |
| CN102101345A (en) * | 2009-12-22 | 2011-06-22 | 鸿富锦精密工业（深圳）有限公司 | Injection molding method |
| CN102136647A (en) * | 2011-02-18 | 2011-07-27 | 深圳立讯精密工业股份有限公司 | High-speed transmission connector plug, socket and connecting system |
| CN202042672U (en) * | 2011-03-16 | 2011-11-16 | 深圳市高科五金有限公司 | Electric connector |
| CN102377009A (en) * | 2010-08-12 | 2012-03-14 | 深圳富泰宏精密工业有限公司 | Electrical apparatus shell and manufacture method thereof |
| CN102601919A (en) * | 2012-03-26 | 2012-07-25 | 哈姆林电子(苏州)有限公司 | Sensor injection-moulding technology |
| CN202405479U (en) * | 2011-12-31 | 2012-08-29 | 昆山国技电子有限公司 | Connector |
| CN203456613U (en) * | 2013-08-23 | 2014-02-26 | 深圳市得润电子股份有限公司 | USB electric connector |
| CN103895157A (en) * | 2014-04-03 | 2014-07-02 | 新乡北方车辆仪表有限公司 | Secondary injection molding internal mould fixing device for automobile wire connection plug |
| CN103956617A (en) * | 2014-05-07 | 2014-07-30 | 永泰电子（东莞）有限公司 | Digit high-frequency female socket connector |
| CN104377481A (en) * | 2014-11-19 | 2015-02-25 | 歌尔声学股份有限公司 | Two-sided plug-in connector and manufacturing method thereof |
| CN204481179U (en) * | 2015-01-22 | 2015-07-15 | 东莞市坚诺电子有限公司 | A kind of structure improved USB A type Dual-face inserting connector male head |
| CN104972599A (en) * | 2015-06-15 | 2015-10-14 | 苏州千裕电子科技有限公司 | Injection molding technology of lampshade |
| CN105034250A (en) * | 2015-07-09 | 2015-11-11 | 震宇（芜湖）实业有限公司 | Manufacturing method for plastic part with metal part and two adopted detection tools |
| CN105242355A (en) * | 2015-06-15 | 2016-01-13 | 烽火通信科技股份有限公司 | Fiber connector plug with dual-orientation function and manufacture method thereof |
| CN105552672A (en) * | 2016-02-01 | 2016-05-04 | 东莞市联纲光电科技有限公司 | Combined connecting line for HDMI and USB and fabrication technology of combined connecting line |
| CN205767172U (en) * | 2016-05-13 | 2016-12-07 | 东莞铭普光磁股份有限公司 | An optical fiber connector electronic label plug and its injection molding device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101625563B1 (en) * | 2009-09-30 | 2016-05-30 | 서울반도체 주식회사 | Method of manufacturing a light emitting unit and light emitting device using the same |
-
2016
- 2016-05-13 CN CN201610314805.2A patent/CN105773907B/en not_active Expired - Fee Related
Patent Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201319258Y (en) * | 2008-12-10 | 2009-09-30 | 曾国华 | Memory card with label structure |
| CN201533045U (en) * | 2009-09-22 | 2010-07-21 | 东莞煜森精密端子有限公司 | usb interface connector |
| CN102101345A (en) * | 2009-12-22 | 2011-06-22 | 鸿富锦精密工业（深圳）有限公司 | Injection molding method |
| CN102377009A (en) * | 2010-08-12 | 2012-03-14 | 深圳富泰宏精密工业有限公司 | Electrical apparatus shell and manufacture method thereof |
| CN102136647A (en) * | 2011-02-18 | 2011-07-27 | 深圳立讯精密工业股份有限公司 | High-speed transmission connector plug, socket and connecting system |
| CN202042672U (en) * | 2011-03-16 | 2011-11-16 | 深圳市高科五金有限公司 | Electric connector |
| CN202405479U (en) * | 2011-12-31 | 2012-08-29 | 昆山国技电子有限公司 | Connector |
| CN102601919A (en) * | 2012-03-26 | 2012-07-25 | 哈姆林电子(苏州)有限公司 | Sensor injection-moulding technology |
| CN203456613U (en) * | 2013-08-23 | 2014-02-26 | 深圳市得润电子股份有限公司 | USB electric connector |
| CN103895157A (en) * | 2014-04-03 | 2014-07-02 | 新乡北方车辆仪表有限公司 | Secondary injection molding internal mould fixing device for automobile wire connection plug |
| CN103956617A (en) * | 2014-05-07 | 2014-07-30 | 永泰电子（东莞）有限公司 | Digit high-frequency female socket connector |
| CN104377481A (en) * | 2014-11-19 | 2015-02-25 | 歌尔声学股份有限公司 | Two-sided plug-in connector and manufacturing method thereof |
| CN204481179U (en) * | 2015-01-22 | 2015-07-15 | 东莞市坚诺电子有限公司 | A kind of structure improved USB A type Dual-face inserting connector male head |
| CN104972599A (en) * | 2015-06-15 | 2015-10-14 | 苏州千裕电子科技有限公司 | Injection molding technology of lampshade |
| CN105242355A (en) * | 2015-06-15 | 2016-01-13 | 烽火通信科技股份有限公司 | Fiber connector plug with dual-orientation function and manufacture method thereof |
| CN105034250A (en) * | 2015-07-09 | 2015-11-11 | 震宇（芜湖）实业有限公司 | Manufacturing method for plastic part with metal part and two adopted detection tools |
| CN105552672A (en) * | 2016-02-01 | 2016-05-04 | 东莞市联纲光电科技有限公司 | Combined connecting line for HDMI and USB and fabrication technology of combined connecting line |
| CN205767172U (en) * | 2016-05-13 | 2016-12-07 | 东莞铭普光磁股份有限公司 | An optical fiber connector electronic label plug and its injection molding device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105773907A (en) | 2016-07-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105773907A (en) | Electronic tag plug of optical fiber connector and injection molding method of electronic tag plug | |
| CN102609052B (en) | Carbon fiber laptop shell, manufacturing method thereof and manufacturing tool for carbon fiber laptop shell | |
| CN104924529B (en) | The tray die of convenient injection footing | |
| CN103302811A (en) | Injection mold for manufacturing product with hole, injection molding method, and product with hole | |
| CN205767172U (en) | An optical fiber connector electronic label plug and its injection molding device | |
| CN108773015A (en) | A kind of injection mold with inserts positioning | |
| CN205497953U (en) | Double -colored product mould thimble structure | |
| CN202764141U (en) | Pent-roof die structure | |
| CN208148343U (en) | It is a kind of to realize that quickly burying for multi-terminal penetrates injection mold | |
| CN205343605U (en) | Extra quality injection molding charactron | |
| CN206201334U (en) | A kind of accurate injection moulding machine | |
| CN207747369U (en) | Super-huge plastic products are injection moulded intelligence manufacture equipment without template | |
| CN202147361U (en) | Secondary high-temperature precise injection mould | |
| CN208615205U (en) | Mould plastics mould utensil of hardware | |
| CN103640161B (en) | Precise injection mould of large-frame super-narrow zinc alloy insert of cellphone front shell | |
| CN209176084U (en) | Data cable connector injection mold | |
| CN107856249A (en) | A kind of quick bury for realizing multi-terminal penetrates injection mold | |
| CN107775896A (en) | A kind of multi-color injection molded mould for different colours | |
| CN206085477U (en) | Hardware locating component | |
| CN206217059U (en) | Plastic spectacles frame mould | |
| CN100471643C (en) | Production method for forming plastic on soft cloth | |
| CN206011624U (en) | Demoulding mechanism and mould | |
| CN205951164U (en) | Mould inscribe casement utensil | |
| CN105500618A (en) | Skeleton unit injection mold | |
| CN202826254U (en) | Simple and easy built-in type plastic mould structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200818 Address after: No.22, wangshigang Road, miaobian, Shipai town, Dongguan City, Guangdong Province 523000 Patentee after: Dongguan Mingtong Precision Electronics Co.,Ltd. Address before: 523000 Guangdong Province, Dongguan City Shek Pai Zhenmiao edge Shajing Village Road nine Patentee before: DONGGUAN MENTECH OPTICAL & MAGNETIC Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180206 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |