WO2016190705A1

WO2016190705A1 - Light emitting element package, lighting for vehicle, and method for manufacturing same

Info

Publication number: WO2016190705A1
Application number: PCT/KR2016/005641
Authority: WO
Inventors: 이강석; 오남석; 조영준
Original assignee: 엘지이노텍 주식회사
Priority date: 2015-05-27
Filing date: 2016-05-27
Publication date: 2016-12-01

Abstract

A light emitting element package according to an embodiment comprises: a heat conductive substrate including a first side and a second side opposite to the first side; a light emitting element module placed on the first side of the heat conductive substrate; and a driving element module which is placed on the second side of the heat conductive substrate and is electrically connected to the light emitting element module.

Description

Light emitting device package, vehicle lighting and manufacturing method thereof

An embodiment of the present invention relates to a light emitting device package, and more particularly, to a light emitting device package and a method of manufacturing the same, which can secure design freedom of a printed circuit board while improving heat dissipation characteristics.

Generally, a light emitting diode (hereinafter referred to as 'LED') basically consists of a junction of a p-type and an n-type semiconductor. In addition, the LED is a kind of photoelectronic device that emits energy corresponding to the bandgap of the semiconductor in the form of light by combining electrons and holes as voltage is applied.

Such LEDs include high-brightness light sources for flashlights, back light for liquid crystal displays (LCDs) used in portable electronic products (mobile phones, camcorders, digital cameras, and PDAs), light sources for billboards, light and switch light sources, and indicators. As a light source for traffic lights, the range of use is expanding day by day.

Such LEDs have been developed in the form of Surface Mount Device (SMD) mounted using Surface Mount Technology (SMT) according to the trend of miniaturization and slimming of information and communication devices.

However, in the case of a printed circuit board on which the LED is mounted, the size of the printed circuit board is increased in consideration of the heat dissipation characteristics of the driving element and the LED itself required for driving the LED, thereby bringing the limitation of miniaturization of the module itself. In addition, since a heat sink structure for dissipating heat-generating elements such as LEDs must be disposed essentially, a problem contrary to the above-described trend of miniaturization has arisen.

An embodiment of the present invention to provide a light emitting device package and a method of manufacturing the light emitting device and the driving device is mounted on both sides of the heat sink, respectively.

The technical problems to be achieved in the proposed embodiment are not limited to the technical problems mentioned above, and other technical problems not mentioned above are clear to those skilled in the art to which the proposed embodiments belong from the following description. Can be understood.

According to an embodiment, there is provided a light emitting device package comprising: a thermally conductive substrate having a first surface and a second surface opposite to the first surface; A light emitting device module disposed on the first surface of the thermally conductive substrate; And a driving device module disposed on the second surface of the thermally conductive substrate and electrically connected to the light emitting device module.

Vehicle lighting according to the embodiment, the lens housing; And a light emitting device package disposed in the lens housing, wherein the light emitting device package comprises a thermally conductive substrate having a first surface and a second surface opposite to the first surface, and the first of the thermally conductive substrate. And a light emitting device module disposed on a surface thereof, and a driving device module disposed on the second surface of the thermally conductive substrate and electrically connected to the light emitting device module.

In addition, the method of manufacturing a light emitting device package according to the embodiment forms a first substrate on which a light emitting device is mounted and a second substrate on which a driving device is mounted, and the first substrate and the second substrate on both surfaces of a thermally conductive substrate. Are disposed through the adhesive insulating layer, and the thermally conductive substrate, the first substrate, and the second substrate are compressed in an autoclave.

According to an embodiment of the present invention, by providing an integrated module in which the light emitting device module and the driving device module are mounted on both surfaces of the heat sink with the heat sink interposed therebetween, it is possible to improve the spatial freedom of the apparatus.

In addition, according to an embodiment of the present invention, the heat dissipation characteristics may be improved by directly attaching the light emitting device module including the light emitting device and the driving device module including the driving device with the heat sink interposed therebetween.

1 is a cross-sectional view schematically showing a light emitting device package according to an embodiment of the present invention.

FIG. 2 is a process flowchart illustrating a manufacturing process of the light emitting device package of FIG. 1.

3 illustrates an application example of a light emitting device package according to an exemplary embodiment of the present invention.

4 is a diagram illustrating a detailed configuration circuit of the first driving unit illustrated in FIG. 1.

FIG. 5 is a first configuration example of the DC-DC converter 313 shown in FIG. 4.

FIG. 6 is a second configuration example of the DC-DC converter 313 shown in FIG. 4.

FIG. 7 is a third configuration example of the DC-DC converter 313 shown in FIG. 4.

8 is a fourth configuration example of the DC-DC converter 313 shown in FIG. 4.

FIG. 9 is a first configuration example of the second driving unit illustrated in FIG. 1.

FIG. 10 is a second configuration example of the second driver illustrated in FIG. 1.

FIG. 11 is a third configuration example of the second driving unit illustrated in FIG. 3.

12 to 14 is a view showing the vehicle lighting according to an embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration and operation according to the present invention. In the description with reference to the accompanying drawings, the same components are given the same reference numerals regardless of the reference numerals, and duplicate description thereof will be omitted. Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

Referring to FIG. 1, a light emitting device package according to an exemplary embodiment of the present invention includes a heat conductive substrate 10 having one surface and the other surface facing the one surface and a light emitting device disposed on one surface of the thermal conductive substrate 10. It may be configured to include a driving device module (Y) disposed on the other surface of the module (X) and the thermal conductive substrate 10, and electrically connected to the light emitting device module (X).

The light emitting device module X may include a light emitting device 21 for emitting light and a first substrate 20 on which the light emitting device 21 is mounted.

The first substrate 20 may be arranged to be insulated from the thermally conductive substrate 10. In particular, as illustrated, the first substrate 20 may be disposed to have a surface in contact with the thermally conductive substrate. In this case, the first adhesive insulating layer 40 may be disposed between the surfaces of the thermally conductive substrate 10 in contact with one surface of the first substrate 20.

In addition, the first substrate 20 may be any one of a resin-based printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, and an FR-4 substrate. can do. In an example of the present invention, the use of the FR-4 substrate will be described as an example.

In addition, the light emitting device 21 is configured to include an optical device for emitting light, and is a concept that encompasses a variety of light sources, for example, a solid light emitting device may be applied. The solid light emitting device may be any one selected from LED, OLED, laser diode (LD), Laser, and VCSEL. In an embodiment of the present invention will be described taking an example of the LED as a light emitting device.

The first substrate 20 may mount a plurality of light emitting elements 21 to make an LED array module LAM, and the first substrate 20 may be mounted with a light emitting element 21 such as an LED. In order to allow a plurality of electrode lines to be exposed, an electrical connection may be made with the light emitting device 21.

The light emitting device 21 may be mounted in the through hole of the first substrate 20 so as to be connected to the electrode line, and the reflective member having a radial reflector on one side may be integrally fixed with epoxy resin or the like. Can be implemented.

In addition, the driving device module (Y) is disposed on the other surface of the thermal conductive substrate 10, the first driving unit 31 and the second driving unit 32 is electrically mounted to the light emitting device module is mounted It may be configured to include a second substrate (30). In addition, a second adhesive insulating layer 50 may be disposed between the second substrate 30 and the thermal conductive substrate 10.

The first driver 31 and the second driver 32 may include an IC or a chip resistor. In this case, the second substrate 30 may be a resin-based printed circuit board (PCB) or a metal core. Any one of (MetalCore) PCB, Flexible PCB, Ceramic PCB, FR-4 substrate can be applied.

The first substrate 31 and the second driver 32 are mounted on the second substrate 30 to form an LED drive module (LDM) capable of driving the light emitting device 21.

Like the first substrate 20, the second substrate 30 includes a plurality of through holes, and the plurality of chips constituting the first driver 31 and the second driver 32 through the through holes. Allow them to be mounted.

In addition, the first substrate 20 and the second substrate 30 may include a via hole for mounting a chip, a via hole for electrical connection of each layer, a through hole including a thermal via hole for easy thermal diffusion, and the like. It can be configured to include.

The thermally conductive substrate 10 receives a heat generated from the light emitting device 21 and emits heat to the outside, and at the same time, the light emitting device 21, the first driving unit 31, and the second driving unit 32. Can be implemented to support the printed circuit board mounting.

Therefore, thermally conductive plastic may be applied to the thermally conductive substrate 10. For example, the thermally conductive substrate 10 may be formed of a plastic substrate such as a PC or a resin material having excellent electrical insulation properties, heat resistance, and lifespan, such as a thermally conductive acrylic interface elastomer.

Alternatively, the thermally conductive substrate 10 may be a metal substrate having a very excellent thermal conductivity function. In this example, a substrate to which a material such as Al or an alloy containing Al is applied may be applied. When the thermally conductive substrate 10 is formed of aluminum or an alloy thereof, the thermally conductive substrate 10 may be manufactured by extruding into a thin plate and then pressing to improve heat dissipation and manufacturing efficiency. When the thermally conductive substrate 10 is manufactured by the above method, the thermally conductive substrate 10 may exhibit a high thermal conductivity of about 200 W / mK, thereby maximizing heat dissipation efficiency.

In addition, the thermally conductive substrate 10 may be made of a material such as magnesium, beryllium, aluminum, zirconium, thorium, and lithium. For example, the thermally conductive substrate 10 is extruded from a material having a magnesium content of 90% or more, and the remaining 10% content is various such as beryllium, aluminum, zirconium, thorium, lithium, etc. to improve physical properties such as heat resistance and oxidation resistance. Substances may be included.

Further, in the embodiment of the present invention, the thickness of the first substrate 20 and the second substrate 30 may be thinner than that of the thermal conductive substrate 10. This increases the thickness of the heat conductive substrate 10 having a heat sink function to increase the heat dissipation characteristics in the same space. In addition, in order to maximize the width of the thermally conductive substrate 10 serving as the heat sink, a thin layer such as FR4, which is a printed circuit board, may be implemented to be very thin, thereby maximizing heat dissipation characteristics.

A method of implementing the structure of a light emitting device package according to an embodiment of the present invention shown in FIG. 1 is as follows.

FIG. 2 is a flowchart illustrating a manufacturing process of the light emitting device package of FIG. 1. Referring to FIGS. 1 and 2, first, the light emitting device 21 is mounted on a first substrate 20 to emit light (SMT). Implement the module. In this case, for example, when the light emitting device 21 is implemented as a plurality of LEDs, the first substrate 20 on which the plurality of light emitting devices 21 is mounted constitutes an LED array module LAM.

Furthermore, the first drive unit 31 and the second drive unit 32 are mounted on the second substrate 30 to form an LED drive module (LDM).

Thereafter, the light emitting device module and the driving device module are disposed on both surfaces of the thermal conductive substrate 10. The first adhesive insulating layer 40 is disposed between the thermal conductive substrate 10 and the light emitting device module, and the second adhesive insulating layer 50 is disposed between the thermal conductive substrate 10 and the driving device module. do. Then, the thermal conductive substrate 10, the light emitting device module, the driving device module, the first adhesive insulating layer 40 and the second adhesive insulating layer 50 are disposed, and then pressed using an auto clave. .

For example, the first substrate 20 and the second substrate 30 are welded to the upper and lower surfaces of the thermal conductive substrate 10 by the first and second adhesive insulating layers 40 and 50. Then, the first and

second substrates

20 and 30 are welded to the autoclave and then sealed, and the thermally conductive substrate 10 and the first substrate have a pressure of 250 to 1,200 atm at a temperature of 150 to 600 ° C. The substrate 20 and the second substrate 30 may be compressed.

According to an embodiment of the present invention, the first adhesive insulating layer 40, the second adhesive insulating layer 50, the first substrate 20, and the second substrate 30 are bonded to the thermal conductive substrate 10. The crimping method using the clave is applied. The method of bonding the printed circuit board to the thermally conductive substrate 10 that performs the heat sinking function may be simply using an adhesive method or using a hot stacking method. At this time, in the case of simply bonding using an adhesive, the thickness of the adhesive layer is normally applied to a thickness of 250㎛ or more to ensure the reliability of the adhesive. In addition, the thickness of the adhesive layer acts as a factor that hinders heat transfer to the heat sink. Therefore, in the thermocompression method, a fine air layer is formed between the bonding interface of the heat sink and the printed circuit board, thereby degrading the adhesion reliability.

However, by using the autoclave technique according to the embodiment of the present invention, it is possible to significantly reduce the thickness of the adhesive insulating layer, it is possible to reduce the thickness of the adhesive insulating layer to a thickness of less than 50㎛ usually more than 250㎛. Will be. In addition, almost no air layer is generated at the interface between the adhesive insulating layer, the printed circuit board, and the thermal conductive substrate, thereby improving the reliability of the adhesive. Can be improved.

In the embodiment of the present invention, the first and second adhesive insulating layers 40 and 50 may be formed to a thickness of 50 μm or less, and may be applied to a thickness of 0.04 mm to 0.06 mm. In particular, the first and second adhesive insulating layers 40 and 50 may be coated with 0.05 mm. In this case, when the first and second adhesive insulating layers 40 and 50 are formed to be less than 0.04 mm, the bonding property between the thermally conductive substrate and the light emitting device module or the driving device module is remarkably degraded. It acts as a factor that causes. In addition, when the thicknesses of the first and second adhesive insulating layers 40 and 50 exceed 0.06 mm, the adhesiveness can be improved. In addition, when the thickness exceeds 0.6 mm, the adhesive insulating layer is pushed to the outer side of the first substrate 20 or the second substrate 30 when the autoclave is pressed, and the appearance is damaged, and the surface of the thermally conductive substrate is unnecessarily covered. There is a problem that the thermal conductivity is reduced.

In addition, the first and second adhesive insulating layers 40 and 50 serve as insulating layers to prevent electrical short circuits between the LED array module and the LED drive module and the thermally conductive substrate performing the heat sinking function. do.

In addition, referring to the structure of FIG. 1 according to another aspect of an embodiment of the present invention, the width W1 of the first substrate 20 and the width W2 of the second substrate 30 are formed to be substantially the same. Can be. Of course, each width or positional relationship may be freely deformed according to design, but the width W1 of the first substrate 20 and the width W2 of the second substrate 30 are substantially the same. When formed to form a uniform adhesive region on the top and bottom of the thermal conductive substrate 10, it is possible to improve the reliability of the adhesive and at the same time widen the exposed region (P) of the thermal conductive substrate to improve the heat dissipation characteristics.

As shown in FIG. 1, the first substrate 20 and the second substrate 30 are disposed at positions corresponding to the one surface and the other surface of the thermally conductive substrate 10 to be symmetrical to each other. By disposing, it is possible to prevent local warpage from occurring in accordance with the expansion rate of the thermally conductive substrate due to expansion by an external heat source.

Therefore, in this case, the thermally conductive substrate 10 is implemented to have a structure in which the surface P of the thermally conductive substrate is exposed in a region P other than the arrangement position of the first substrate 20 and the second substrate 30. It is possible to increase the heat dissipation characteristics.

Figure 3 shows an application example implemented in the form of a light emitting device package according to an embodiment of the present invention.

That is, the plate type thermally conductive substrate 10 is implemented in the form of a bar, and the first substrate 20 and the first and second driving units 20 on which the light emitting elements 21 are mounted. 31 and 32 are pressed to implement the second substrate 30 is mounted by an autoclave technique.

In the case of such a light emitting device package, the light emitting device module and the driving device module are directly attached to the heat sink, which is a thermally conductive substrate, so that the heat dissipation characteristics are excellent, and the LED array module and the LED drive module are integrated on both sides of one substrate. In this case, the design freedom can be greatly increased for the substrate having the same area.

Furthermore, in the conventional heat sink, a large number of printed circuit boards (PCBs) are required by mounting a plurality of LED chips, ICs, resistor chips, etc. on the top surface, and forming heat dissipation fins on the bottom surface of the heat sink. The LED array module and LED drive module are configured on the top and bottom surfaces of the heat sink, respectively, and the additional cost is added to solve the problem of increased product cost. The LED array module (LED) and the LED drive are solved. Since the LED Drive Module (LDM) is integrated, the space freedom of the device can be increased.

Hereinafter, the first driver 31 and the second driver 32 constituting the LED drive module will be described in detail.

Here, the first driver 31 may be a constant voltage control circuit for constant voltage control, and the second driver 32 may be a constant current control circuit for constant current control.

Referring to FIG. 4, the first driver 31 includes a battery 311, a protection circuit 312, a DC-DC converter 313, a feedback unit 314, and a pulse width modulator 316.

The battery 311 may supply input power for driving the LED array module to the first driver 31.

In this case, the battery 311 is an example of a power supply means for supplying the input power, which may be replaced by other means.

In addition, although the battery 311 is included in the first driver 31 in the drawing, the battery 311 is the first driver 31 because it is a means for supplying power to the first driver 31. It is preferable that it is comprised separately.

In other words, when the light emitting device package is used in a vehicle lamp, the battery 311 may be a battery of a vehicle, and the first driver 31 may be disposed on a substrate separated from the battery 311. Can be arranged.

In addition, the battery 311 may be configured to supply DC power to the DC-DC converter 313, but is not limited thereto. The input power may be included in a range of 9V to 16V, but It is not limited.

The protection circuit unit 312 is configured to protect the internal configuration of the first driver 31 from the power input to the battery 311.

Preferably, the protection circuit part 312 is disposed between the battery 311 and the DC-DC converter 313, thereby blocking, absorbing and absorbing noise or electromagnetic waves emitted from the device and exiting through the power line. It can be bypassed to the ground.

In addition, the protection circuit unit 312 may further include a reverse voltage prevention circuit for preventing the voltage from flowing in the reverse direction.

The DC-DC converter 313 adjusts the voltage received from the protection circuit unit 312 according to the pulse signal output through the pulse width modulator 316, which will be described later, and outputs the voltage to the second driver 32.

That is, the DC-DC converter 313 adjusts the voltage received from the protection circuit unit 313 based on a preset reference voltage Vref and outputs the voltage to the second driver 32.

In this case, the DC-DC converter 313 is a buck-boost type converter, a boost type converter, a buck type converter, a buck & boost type converter, a zeta type converter and a sepic type converter. It may be composed of any one.

The pulse width modulator 316 is disposed between the DC-DC converter 313 and the feedback unit 314, and based on the output signal of the feedback unit 314, the output voltage of the DC-DC converter 313 ( A pulse signal for adjusting Vo) may be generated and a switching state of the switching element constituting the DC-DC converter 313 may be controlled according to the generated pulse signal.

The feedback unit 314 may include a comparator 315 and a first resistor R1 and a second resistor R2 connected in series with each other at an output terminal of the DC-DC converter 313.

One end of the first resistor R1 is connected to the output terminal of the DC-DC converter 313, and the other end thereof is connected to one end of the second resistor R2.

In addition, one end of the second resistor R2 is connected to the other end of the first resistor R1 and the other end is grounded.

The first resistor R1 and the second resistor R2 are voltage divider resistors, and thus detect and output an output voltage Vo output from the DC-DC converter 313.

Comparator 315 is composed of an operational amplifier (OP-AMP), the reference voltage (Vref) is input to the positive (+) terminal of the comparator 315, the first resistor (R1) and the negative (-) terminal A voltage divided by the second resistor R2 is applied.

That is, the feedback unit 314 is a difference value between the reference voltage (Vref) and the output voltage (Vo) so that the output voltage (Vo) of the DC-DC converter 313 converges to the predetermined reference voltage (Vref). May be output to the pulse width modulator 316. Accordingly, the pulse width modulator 316 outputs a pulse signal for compensating the output value of the DC-DC converter 313 based on the difference value, so that the reference voltage is generated by the DC-DC converter 313. The output voltage Vo corresponding to Vref is output.

Hereinafter, the configuration of the DC-DC converter 313 will be described in detail.

5 is a first configuration example of the DC-DC converter 313 illustrated in FIG. 4, FIG. 6 is a second configuration example of the DC-DC converter 313 illustrated in FIG. 4, and FIG. 7 is illustrated in FIG. 4. A third configuration example of the illustrated DC-DC converter 313 is shown, and FIG. 8 is a fourth configuration example of the DC-DC converter 313 illustrated in FIG. 4.

Referring to FIG. 5, the first switch Q1 is disposed between the protection circuit unit 312 and the first inductor L1, and the switch is turned on according to the control of the pulse signal received from the pulse width modulator 316. can be turned on / off.

In the DC-DC converter 313, when the first switch Q1 is on and the second switch Q2 is in an off state, current may flow to the load through the first inductor L1. .

In addition, when the first switch Q1 is turned off, the DC-DC converter 313 may have a reverse current caused by energy stored in the first inductor L1 in the direction of the first diode D1. It may be transferred to the load and the capacitor (C1). That is, at this time, the DC-DC converter 313 may operate as a buck converter.

In the DC-DC converter 313, when both the first switch Q1 and the second switch Q2 are in an on state, current flows only in the first inductor L1 and the second switch Q2. When is turned off (off), the current by the energy stored in the first inductor (L1) can be delivered to the load and the capacitor (C1) in the direction of the second diode (D2).

The first diode D1 and the second diode D2 prevent back current from being transferred from the second driver 32 to the DC-DC converter 313. That is, the first diode D1 and the second diode D2 allow current to flow from the DC-DC converter 313 to the second driver 32 only in one direction.

With the above configuration, the DC-DC converter 313 may boost the input voltage received from the protection circuit unit 312 and output the voltage to the second driver 32.

Referring to FIG. 6, the DC-DC converter 313 may be a buck-boost type converter. Preferably, the DC-DC converter 313 may include a first switching element Q1, a first diode D1, and a first inductor L1.

Here, the first switching element Q1 is connected in series with the input power source. In this case, the first switching element Q1 may include a power factor preventing diode.

The first diode D1 may be connected in series with the first switching element Q1.

The first inductor L1 may be connected in parallel with the first switching element Q1.

As described above, in the DC-DC converter 313, the first switching element Q1 is turned on by the pulse signal supplied during the first period, and thus the first switching element Q1 is turned on. The input voltage is charged to the first inductor L1.

In addition, the DC-DC converter 313 turns off the first switching element Q1 by a pulse signal supplied during a second period, whereby the inductor voltage charged in the first inductor L1 is reduced. It may be supplied to the second driver 32.

In addition, referring to FIG. 7, the DC-DC converter 313 may be a zeta type converter.

To this end, the DC-DC converter 313 may include a first switching element Q1, a first inductor L1, a first capacitor C1, and a first diode D1.

The first switching element Q1 has a drain terminal connected to an output terminal of the protection circuit unit 312, a gate terminal connected to an output terminal of the pulse width modulation unit 316, and a source terminal of one end and a first terminal of the first inductor. It is connected to one end of the capacitor.

One end of the first inductor L1 is connected to the source terminal of the first switching element Q1 and the other end is grounded.

One end of the first capacitor C1 is connected to the source end of the first switching element Q1 and one end of the first inductor L1, and the other end thereof is connected to the anode end of the first diode D1.

The first diode D1 has an anode terminal connected to the other end of the first capacitor C1 and the output terminal of the DC-DC converter 313, and the cathode terminal is grounded.

In addition, referring to FIG. 8, the DC-DC converter 313 may be a SECIC type converter. To this end, the DC-DC converter 313 may include a first switching element Q1, a first inductor L1, a second inductor L2, a first capacitor C1, and a first diode D1. .

One end of the first inductor L1 is connected to the output end of the protection circuit unit 312, and the other end thereof is connected to the drain end of the first switching element Q1 and one end of the first capacitor C1.

The first switching element Q1 has a drain end connected to the other end of the first inductor L1 and one end of the first capacitor C1, and a gate end connected to the output end of the pulse width modulator 316. The source stage is grounded.

One end of the first capacitor C1 is connected to the other end of the first inductor L1 and the drain end of the first switching element Q1, and the other end of the first capacitor C1 is connected to one end of the second inductor L2 and the first diode D1. Is connected to the cathode end of the

The first diode D1 has a cathode terminal connected to the other end of the first capacitor C1 and one end of the second inductor L2, and an anode terminal connected to the output terminal of the DC-DC converter 313.

9 is a first configuration example of the second drive unit shown in FIG. 1, FIG. 10 is a second configuration example of the second drive unit shown in FIG. 1, and FIG. 11 is a third configuration example of the second drive unit shown in FIG. 3. Example configuration.

9 to 11 illustrate a second driver 32, which is connected to the light emitting device 21 and includes a constant current control circuit for controlling the constant current of the light emitting device 21. Here, the constant current control circuit may be a linear circuit.

Referring to FIG. 9, the second driver 32 may include a first resistor R1, a first switching device S1, a second switching device S2, and a second resistor R2.

One end of the first resistor R1 is connected to the power input terminal Vin, and the other end thereof is connected to the base terminal of the second switching element S2 and the collector terminal of the first switching element S1.

The first switching element S1 has a collector end connected to the other end of the first resistor R1 and the base end of the second switching element S2, and the base end of the first switching element S1 and the emitter end of the second switching element S2; One end of the second resistor R2 is connected and the emitter end is grounded.

The second switching element S2 has a collector end connected to an output end of the light emitting element 21, a base end connected to the other end of the first resistor R1, and a collector end of the first switching element S1, The emitter terminal is connected to the base terminal of the first switching element S1 and one end of the second resistor R2.

One end of the second resistor R2 is connected to the emitter end of the second switching element S2 and the base end of the first switching element S1, and the other end is grounded.

10, the second driver 32 includes a linear circuit unit 321, a first switching element S1, and a first resistor R1.

Here, the first switching element S1 and the first resistor R1 correspond to the second switching element S2 and the second resistor R2 in FIG. 9.

In FIG. 10, the linear driver is included in the second driver 32.

In addition, referring to FIG. 11, the second driver 32 may also be configured as a type including only the linear circuit unit 321 and the first resistor R1.

12 to 14, the vehicle 100 generally includes a head lamp unit (not shown) at the front and a tail lamp unit 110 at the rear. Hereinafter, the tail lamp unit 110, for example, will be described for the vehicle lighting of the present invention.

The tail lamp unit 110 of the vehicle 100 may be disposed on a curved surface. In addition, the tail lamp unit 110 includes a plurality of lamps, and by using the light emission of each lamp, the driver of the other vehicle and the driver may provide information on the driving state of the vehicle, such as braking, reversing, left and right width of the vehicle, direction indication, and the like. And / or allow pedestrians to know. Specifically, the tail lamp unit 110 includes the light emitting device package described above.

Accordingly, the light emitting device module constituting the tail lamp unit 110 is disposed above the thermal conductive substrate 10, and the driving device module is disposed below the thermal conductive substrate 10. The included light emitting device 21 is driven according to an operating voltage supplied from the driving device module to generate light.

The tail lamp unit 110 should have a projection area of about 12.5 square centimeters (cm ² ) or more when viewed from a horizontal angle of 45 degrees of the vehicle's outer axis with respect to the center point. To meet safety standards. Therefore, when the tail lamp unit 110 measures the amount of light in the light quantity measuring direction, the amount of light above the reference value should be provided. However, the idea of the present invention is not limited to the safety standard and the required light amount for the tail lamp unit 110, and may be applied without change even if the safety standard or the required light amount is changed.

The tail lamp unit 110 may have a curved surface in its entirety, a part of the tail lamp unit 110 may have a curved surface, and some of the lamps may not have a curved surface. In addition, the first lamp 111 disposed at the center of the tail lamp unit 110 may not have a curved surface, and the second lamp 112 disposed at the outside may have a curved surface. However, the present invention is not limited thereto, and the first lamp 111 disposed at the center may have a curved surface, and the second lamp 112 disposed outside may not have a curved surface.

FIG. 13 shows a lamp having a curved surface disposed outside the tail lamp unit.

14, the vehicle tail lamp unit 110 may include a first lamp unit 1111, a second lamp unit 1112, a third lamp unit 1113, and a housing 113. Can be.

Here, the first lamp unit 1111 may be a light source for the role of a turn signal, the second lamp unit 1112 may be a light source for the role of a road light, and the third lamp unit 1113 may serve as a stop light. It may be a light source for, but is not limited to this, the role may be interchanged.

The housing 113 may accommodate the first to

third lamp units

1111, 1112, and 1113, and may be made of a light-transmissive material.

In this case, the housing 113 may have a curvature according to the design of the vehicle body, and the first to

third lamp units

1111, 1112, and 1113 may implement a surface light source that can be bent, depending on the shape of the housing 113. Can be.

In this way, the embodiment forms a surface light source with a small number of light sources by forming a light mixing region in a vacant space between the light source and the optical system and a plurality of light emitting elements having different arrangement directions with respect to a predetermined reference direction. In addition to providing a light quantity and light intensity suitable for the safety standards of the vehicle lamp, it is possible to improve the economics of the lamp unit and the freedom of product design.

In the detailed description of the invention as described above, specific embodiments have been described. However, many modifications are possible without departing from the scope of the invention. The technical spirit of the present invention should not be limited to the described embodiments of the present invention, but should be determined not only by the claims, but also by those equivalent to the claims.

Claims

A thermally conductive substrate having a first side and a second side opposite the first side;

A light emitting device module disposed on the first surface of the thermally conductive substrate; And

A driving device module disposed on the second surface of the thermally conductive substrate and electrically connected to the light emitting device module;

Light emitting device package.
The method of claim 1,

A first adhesive insulating layer disposed between the first surface of the thermally conductive substrate and the light emitting device module; And

And a second adhesive insulating layer disposed between the second surface of the thermally conductive substrate and the drive element module.

Light emitting device package.
The method of claim 2,

The light emitting device module,

A first substrate disposed on the first adhesive insulating layer and insulated from the thermal conductive substrate;

At least one light emitting device disposed on the first substrate

Light emitting device package.
The method of claim 3, wherein

The driving device module,

A second substrate disposed on the second adhesive insulating layer and insulated from the thermally conductive substrate;

A driving unit disposed on the second substrate and supplying driving power to the light emitting device module;

Light emitting device package.
The method of claim 4, wherein

The driving unit,

A first driver supplying an operating voltage;

And a second driver configured to receive the operating voltage from the first driver and output an operating current to the light emitting device module based on the received operating voltage.

Light emitting device package.
The method of claim 5,

The first driving unit,

A power input unit for receiving input power;

A DC-DC converter including at least one switching element and converting the input power according to a switching operation of the switching element to output the operating voltage;

A feedback unit comparing the output voltage of the DC-DC converter with a predetermined reference voltage and outputting a control value according to the comparison result;

And a pulse width modulator for outputting a pulse signal to the DC-DC converter using a control value output through the feedback unit.

Light emitting device package.
The method of claim 6,

The DC-DC converter,

Including any of buck converters, boost converters, buck-boost converters, buck & boost converters, zeta converters and sepic converters

Light emitting device package.
The method of claim 6,

The feedback unit,

A voltage divider connected to an output terminal of the DC-DC converter;

And a comparator configured to compare the voltage output through the voltage divider and the reference voltage to output the control value.

Light emitting device package.
The method of claim 4, wherein

The second drive unit,

It includes a linear circuit for controlling the operating current

Light emitting device package.
The method of claim 1,

The thermally conductive substrate,

Comprising a metal substrate

Light emitting device package.
The method of claim 4, wherein

The width of the first substrate and the width of the second substrate are the same

Light emitting device package.
The method of claim 11,

The first substrate and the second substrate,

Respectively disposed at mutually corresponding positions of the first and second surfaces of the thermally conductive substrate.

Light emitting device package.
The method of claim 10,

The metal substrate,

Formed of aluminum (Al) or aluminum alloy

Light emitting device package.
The method of claim 4, wherein

The thickness of the thermally conductive substrate,

Thicker than the thickness of the first substrate and the second substrate

Light emitting device package.
Lens housings; And

A light emitting device package disposed in the lens housing;

The light emitting device package,

A thermally conductive substrate having a first side and a second side opposite to the first side;

A light emitting device module disposed on the first surface of the thermally conductive substrate;

A driving device module disposed on the second surface of the thermally conductive substrate and electrically connected to the light emitting device module;

Car lights.
The method of claim 15,

The light emitting device package,

A first adhesive insulating layer disposed between the first surface of the thermally conductive substrate and the light emitting device module;

And a second adhesive insulating layer disposed between the second surface of the thermally conductive substrate and the drive element module.

Car lights.
The method of claim 16,

The light emitting device module,

A first substrate disposed on the first adhesive insulating layer and insulated from the thermal conductive substrate;

At least one light emitting device disposed on the first substrate

Car lights.
The method of claim 17,

The driving device module,

A second substrate disposed on the second adhesive insulating layer and insulated from the thermally conductive substrate;

A driving unit disposed on the second substrate and supplying driving power to the light emitting device module;

Car lights.
The method of claim 18,

The driving unit,

A first driver supplying an operating voltage;

And a second driver configured to receive the operating voltage from the first driver and output an operating current to the light emitting device module based on the received operating voltage.

Car lights.
Forming a first substrate on which the light emitting element is mounted and a second substrate on which the driving element is mounted;

The first substrate and the second substrate are disposed on both sides of the thermally conductive substrate through an adhesive insulating layer, respectively.

Compressing the thermally conductive substrate, the first substrate and the second substrate in an auto clave,

Method of manufacturing a light emitting device package.