KR102318526B1 - Manufacturing method of led module for signboard - Google Patents

Manufacturing method of led module for signboard Download PDF

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KR102318526B1
KR102318526B1 KR1020200131593A KR20200131593A KR102318526B1 KR 102318526 B1 KR102318526 B1 KR 102318526B1 KR 1020200131593 A KR1020200131593 A KR 1020200131593A KR 20200131593 A KR20200131593 A KR 20200131593A KR 102318526 B1 KR102318526 B1 KR 102318526B1
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South Korea
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electric wire
led
led substrate
manufacturing
surface portion
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KR1020200131593A
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Korean (ko)
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김승원
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김승원
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/69—Details of refractors forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V27/00—Cable-stowing arrangements structurally associated with lighting devices, e.g. reels 
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/40—Lighting for industrial, commercial, recreational or military use
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • G09F2013/222—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent with LEDs

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention relates to a method for manufacturing an LED module for a signboard, comprising the steps of: stacking an LED substrate having a fastening hole formed therethrough on an electric wire; coupling the LED substrate and the electric wire by inserting a pin into the fastening hole to penetrate the electric wire; inserting the LED substrate and the electric wire coupled by the pin together into a molding space in a mold; and injection-molding a case in which the LED substrate and the electric wire are integrally embedded therein by injecting a transparent resin into the molding space to solidify the same. Accordingly, a disconnection problem in a fastening process between the LED substrate and the electric wire can be solved, and not only a manufacturing process is simplified compared to the prior art, but also excellent waterproofness of a product can be achieved.

Description

간판용 ＬＥＤ 모듈의 제조방법{MANUFACTURING METHOD OF LED MODULE FOR SIGNBOARD}Manufacturing method of LED module for signboard {MANUFACTURING METHOD OF LED MODULE FOR SIGNBOARD}

본 발명은 광고용 간판에 내장되는 LED 모듈의 제조방법에 관한 것으로서, 보다 상세하게는 제품의 불량률을 크게 낮출 수 있는 간판용 LED 모듈의 제조방법에 관한 것이다.The present invention relates to a manufacturing method of an LED module embedded in an advertising sign, and more particularly, to a manufacturing method of an LED module for a sign capable of significantly lowering the defective rate of a product.

종래기술에 따른 간판용 LED 모듈(100)은 도 1에 도시된 바와 같이 전선(L)과 일체를 이루도록 사출되는 케이스(140) 상에 LED 기판(110)이 덮인 상태에서 나사(150)로 체결된다. 이때, 나사(150)는 전선(L)을 뚫고 들어가 내측의 구리선(도면 미도시)에 닿아 직접적으로 접촉됨으로써 그 전류를 LED 기판(110)으로 전달시키는 도전체로서도 기능한다. 이후, LED 기판(110) 상에 에폭시 등의 투명 경화제를 채움으로써 LED 모듈(100)의 제조가 완료된다.The LED module 100 for a sign according to the prior art is fastened with a screw 150 in a state in which the LED substrate 110 is covered on the case 140 which is injected to form an integral with the electric wire L, as shown in FIG. 1 . do. At this time, the screw 150 penetrates the electric wire L and comes into direct contact with the inner copper wire (not shown), thereby serving as a conductor to transmit the current to the LED substrate 110 . Thereafter, the LED module 100 is manufactured by filling the transparent curing agent such as epoxy on the LED substrate 110 .

그러나, 상기 체결 과정에서 나사(150)의 날카로운 하단부와 측면의 나사선이 전선(L)측의 구리선을 손상시켜 단선시키는 일이 빈번하게 발생하였다. 특히, 전선(L)을 따라 많은 수의 LED 모듈(100)이 직렬로 연결됨으로 인해 하나의 나사(150)로 인한 단선으로 간판 전체가 소등되는 문제와, 하나의 모듈(100)에서의 단선 문제가 발생할 경우에 전선(L)을 따라 간판 전체에 걸쳐 설치되는 모든 LED 모듈(100)을 제거하고 새것으로 교체해주어야 한다는 문제까지 발생할 수 있다는 점에서 상기 나사(150)를 통한 통전 구조는 개선될 필요가 있었다.However, during the fastening process, the sharp lower end of the screw 150 and the screw on the side frequently damage the copper wire on the electric wire (L) side and break the wire. In particular, a problem in which the entire sign is turned off due to disconnection due to one screw 150 due to a large number of LED modules 100 being connected in series along the electric wire L, and a disconnection problem in one module 100 The energization structure through the screw 150 needs to be improved in that it may even cause a problem that all LED modules 100 installed throughout the signboard along the electric wire L must be removed and replaced with a new one. there was

[선행기술문헌] 특허등록 제10-1469820호(등록일자: 2014.12.01)[Prior art literature] Patent Registration No. 10-1469820 (Registration Date: 2014.12.01)

특허등록 제10-0960161호(등록일자: 2010.05.19) Patent Registration No. 10-0960161 (Registration Date: 2010.05.19)

실용신안등록 제20-0413224호(등록일자: 2006.03.29) Utility Model Registration No. 20-0413224 (Registration Date: March 29, 2006)

따라서, 본 발명의 목적은 체결과정에서의 단선 문제를 해결할 수 있는 간판용 LED 모듈의 제조방법을 제공하는 데 있다.Accordingly, an object of the present invention is to provide a method of manufacturing an LED module for a sign that can solve the disconnection problem in the fastening process.

본 발명의 다른 목적은 종래기술에 비해 제조공정이 단순해진 LED 모듈의 제조방법을 제공하는 데 있다.Another object of the present invention is to provide a method of manufacturing an LED module in which the manufacturing process is simplified compared to the prior art.

본 발명의 또 다른 목적은 제품의 방수성이 우수한 LED 모듈의 제조방법을 제공하는 데 있다.Another object of the present invention is to provide a method of manufacturing an LED module having excellent waterproof properties.

상기 목적을 달성하기 위해 본 발명은 간판용 LED 모듈의 제조방법에 있어서, 체결공이 관통 형성된 LED 기판을 전선 상에 적층시키는 단계와; 상기 체결공에 핀을 박아넣어 상기 전선을 관통함으로써 상기 LED 기판과 상기 전선을 결합시키는 단계와; 상기 핀에 의해 결합된 LED 기판과 전선을 함께 금형 내 성형공간에 인서트 시키는 단계; 및 상기 성형공간에 투명수지를 주입 및 응고시킴으로써 내측에 상기 LED 기판과 전선이 일체로 내장된 케이스를 사출성형하는 단계를 포함하는 것을 특징으로 하는 간판용 LED 모듈의 제조방법을 제공한다.In order to achieve the above object, the present invention provides a method for manufacturing an LED module for a sign, comprising: laminating an LED substrate having a fastening hole formed therethrough on an electric wire; coupling the LED substrate and the electric wire by inserting a pin into the fastening hole and penetrating the electric wire; inserting the LED board and the wire coupled by the pin together into the molding space in the mold; and injection molding a case in which the LED substrate and the electric wire are integrally built therein by injecting and solidifying a transparent resin into the molding space.

여기서, 상기 간판용 LED 모듈의 제조방법은, 상기 전선 상에 적층된 LED 기판을 받쳐주는 테두리의 받침면부와 상기 받침대의 내측에 반원형으로 함입 형성되어 상기 전선을 받쳐주는 굴곡면부가 형성되는 지그를 이용하되, 상기 체결공에 박아넣어지는 핀은 상기 LED 기판의 상면으로부터 관통하여 하측의 상기 전선을 관통한 다음 상기 굴곡면부를 따라 굴곡되어 상기 전선을 감싸도록 구성될 수도 있다.Here, in the manufacturing method of the LED module for the signboard, a jig in which the support surface of the edge supporting the LED substrate stacked on the electric wire is recessed in a semicircular shape on the inside of the support, the curved surface portion supporting the electric wire is formed. However, the pin inserted into the fastening hole may be configured to penetrate from the upper surface of the LED substrate and penetrate the lower electric wire and then bend along the curved portion to surround the electric wire.

그리고, 상기 금형은 상기 성형공간에 내장되는 LED 기판의 LED 소자에 대응하여 렌즈성형면부가 형성되고, 상기 성형공간에 주입되는 투명수지는 상기 렌즈성형면부의 형상에 따라 상기 LED 소자 상에 렌즈부를 형성하도록 구성될 수도 있다.And, the mold is formed with a lens molding surface portion corresponding to the LED element of the LED substrate built into the molding space, and the transparent resin injected into the molding space is a lens portion on the LED element according to the shape of the lens molding surface portion. It may be configured to form

이상과 같이, 본 발명에 따른 간판용 LED 모듈의 제조방법에 의하면 부품간 고정 및 통전을 위한 나사체결 시 회전하는 나사의 날카로운 팁부와 나사산으로 인해 전선이 단선되는 문제를 해결할 수 있다. 즉, 핀으로 한번에 박아넣는 체결방법에 의해 전선에 대한 손상을 최소화시킬 수 있다.As described above, according to the manufacturing method of the LED module for a signboard according to the present invention, it is possible to solve the problem that the wire is disconnected due to the sharp tip portion and the screw thread of the rotating screw when the screw is fastened for fixing and energizing between parts. That is, damage to the electric wire can be minimized by the fastening method of inserting the pins at once.

또한, 종래에는 1) 전선을 인서트한 상태에서 케이스를 일체로 사출성형하고, 2) 상기 케이스에 LED 기판을 덮고 나사체결한 다음, 3) 투명 경화제를 채움으로써 제조가 이루어지던 방법이, 본 발명에 따르면 1) 전선과 LED 기판을 결합한 다음, 2) 바로 금형 내 인서트 사출을 통해 LED 모듈의 제작이 완성되므로 상기 종래의 방법에 비해 제조공정을 훨씬 단순화시킬 수 있다.In addition, in the prior art, 1) the case was integrally injection molded in a state in which an electric wire was inserted, 2) the case was covered with an LED substrate and screwed, and then 3) a transparent curing agent was filled. According to 1) after combining the electric wire and the LED substrate, 2) the production of the LED module is completed through insert injection in the mold immediately, so that the manufacturing process can be greatly simplified compared to the conventional method.

더욱이, 핀으로 결합된 LED 기판과 전선을 함께 금형 내에 인서트하여 투명수지를 주입함으로써 성형되는 케이스 내에 상기 LED 기판과 전선이 완전히 내장되도록 함으로써 외부로부터의 수분침투를 완전히 막을 수 있어 방수성이 우수한 LED 모듈을 얻을 수 있다.Furthermore, by inserting the LED board and the wire combined with the pin into the mold and injecting the transparent resin, the LED board and the wire are completely embedded in the molded case. can get

도 1은 종래기술에 따른 간판용 LED 모듈의 분해사시도,
도 2 내지 도 7은 본 발명의 실시예에 따른 간판용 LED 모듈의 제조방법을 순서에 따라 설명하기 위한 개략도,
도 8은 본 발명의 실시예에 따라 제조되는 간판용 LED 모듈의 사시도이다.1 is an exploded perspective view of an LED module for a signboard according to the prior art;
2 to 7 are schematic diagrams for explaining in order the manufacturing method of the LED module for a signboard according to an embodiment of the present invention,
8 is a perspective view of an LED module for a sign manufactured according to an embodiment of the present invention.

본 발명의 실시예에 따른 간판용 LED 모듈의 제조방법은, 먼저 도 2에 도시된 바와 같이 LED 기판(210)과 전선(220)을 준비하여 도 3에 도시된 바와 같이 상기 LED 기판(210)을 전선(220) 상에 포개어 적층시킨다.In the manufacturing method of the LED module for a signboard according to an embodiment of the present invention, the LED substrate 210 as shown in FIG. 3 by first preparing an LED substrate 210 and an electric wire 220 as shown in FIG. 2 . is stacked on top of the electric wire 220 .

그리고, LED 기판(210)에 관통 형성된 체결공(211)에 핀(도 5의 230)을 박아넣어 아래의 전선(220)까지 관통시킴으로써 LED 기판(210)과 전선(220)을 결합시킨다.Then, the LED board 210 and the wire 220 are coupled by inserting a pin (230 in FIG. 5) into the fastening hole 211 penetrating through the LED board 210 and penetrating the wire 220 below.

이때, LED 기판(210)과 전선(220)의 고정을 위해, 도 4에 도시된 바와 같이 LED 기판(210)을 받치고 위치를 고정시켜주기 위한 테두리의 받침면부(241)를 가지며 그 내측에 함입 형성된 굴곡면부(242)를 통해서는 전선(220)을 받쳐주는 지그(240)를 이용하여 핀(230)을 박을 수 있다.At this time, for fixing the LED substrate 210 and the electric wire 220, as shown in FIG. 4, it has a supporting surface portion 241 of the rim for supporting the LED substrate 210 and fixing the position, and is inserted into the inside. The pin 230 may be driven through the formed curved surface portion 242 using a jig 240 supporting the electric wire 220 .

이 상태에서, 도 5에 도시된 바와 같이 핀(230)을 LED 기판(210)의 체결공(211)에 박아넣으면 상기 핀(230)이 전선(220)을 관통함과 동시에 도 6에 도시된 바와 같이 굴곡면부(242)를 따라 굴곡되어 전선(220)의 타측(도면에서는 좌측)을 감싸주게 된다. 이에 의해, 핀(230)은 전선(220)의 전류가 LED 기판(210)에 전달되도록 하는 매개체가 됨과 동시에, 상기 전선(220)을 감싸줌으로써 LED 기판(210)과 전선(220)의 결합을 더욱 공고히 해줄 수 있다.In this state, as shown in FIG. 5, when the pin 230 is driven into the fastening hole 211 of the LED substrate 210, the pin 230 penetrates the wire 220 and at the same time as shown in FIG. As shown, it is bent along the curved surface portion 242 to surround the other side (left side in the drawing) of the electric wire 220 . Accordingly, the pin 230 serves as a medium through which the electric current of the electric wire 220 is transmitted to the LED substrate 210, and at the same time surrounds the electric wire 220, thereby preventing the combination of the LED substrate 210 and the electric wire 220. can make it more solid.

상기와 같이 결합된 LED 기판(210)과 전선(220)은 도 7에 도시된 바와 같이 금형(250) 내 성형공간(S)에 인서트되고, 상기 성형공간(S)으로 에폭시 등의 투명수지를 주입하여 응고시킴으로써 도 8에 도시된 바와 같이 내측에 LED 기판(210)과 전선(220)이 일체로 내장된 케이스(260)를 얻을 수 있다.The LED board 210 and the electric wire 220 combined as described above are inserted into the molding space (S) in the mold 250 as shown in FIG. 7, and a transparent resin such as epoxy is inserted into the molding space (S). By injecting and solidifying, it is possible to obtain a case 260 in which the LED substrate 210 and the electric wire 220 are integrally incorporated therein as shown in FIG. 8 .

이상 설명된 바와 같은 방법으로부터 간판용 LED 모듈(300)이 제조된다.The LED module 300 for a signboard is manufactured from the method as described above.

이때, LED 기판(210) 상의 LED 소자(212)에 대응하는 케이스(260) 부분에는 빛의 발산 내지 확산 성능을 높여주기 위해 렌즈부(261)가 돌출 형성되는바, 이를 위해서는 도 7에 도시된 바와 같이 금형(250)의 성형공간(S)에서 LED 소자(212)에 대응하는 부위에 렌즈성형면부(251)를 형성함으로써 주입되는 투명수지가 상기 렌즈성형면부(251)의 형상에 따라 LED 소자(212) 상에 렌즈부(도 8의 261)를 형성하도록 함이 바람직하다.At this time, the lens unit 261 is formed to protrude from the portion of the case 260 corresponding to the LED element 212 on the LED substrate 210 in order to increase light emission or diffusion performance. As shown, the transparent resin injected by forming the lens molding surface portion 251 in the portion corresponding to the LED element 212 in the molding space (S) of the mold 250 is the LED element according to the shape of the lens molding surface portion 251. It is preferable to form the lens unit (261 in FIG. 8) on the 212.

한편, 이상에서 설명된 간판용 LED 모듈의 제조방법은 본 발명의 이해를 돕기 위한 일 실시예에 불과하므로 후술하는 청구범위 내지 그 균등범위에 의해 정의되는 본 발명의 권리범위 내지 기술적 범위는 상기 설명된 바에 한정되지 않는다.On the other hand, since the manufacturing method of the LED module for a signboard described above is only an embodiment to help the understanding of the present invention, the scope of the present invention defined by the claims to be described below and the equivalents thereof are described above. not limited to what has been

210: LED 기판
211: 체결공
212: LED 소자
220: 전선
230: 핀
240: 지그
241: 받침면부
242: 굴곡면부
250: 금형
251: 렌즈성형면부
260: 케이스
261: 렌즈부210: LED substrate
211: fastener
212: LED element
220: wire
230: pin
240: jig
241: support surface part
242: curved surface portion
250: mold
251: lens molding surface part
260: case
261: lens unit

Claims (3)

삭제delete 간판용 LED 모듈의 제조방법에 있어서,
체결공이 관통 형성된 LED 기판을 전선 상에 적층시키는 단계와;
상기 체결공에 핀을 박아넣어 상기 전선을 관통함으로써 상기 LED 기판과 상기 전선을 결합시키는 단계와;
상기 핀에 의해 결합된 LED 기판과 전선을 함께 금형 내 성형공간에 인서트 시키는 단계; 및
상기 성형공간에 투명수지를 주입 및 응고시킴으로써 내측에 상기 LED 기판과 전선이 일체로 내장된 케이스를 사출성형하는 단계를 포함하며,
상기 전선 상에 적층된 LED 기판을 받쳐주는 테두리의 받침면부와, 상기 받침면부의 내측에 반원형으로 함입 형성되어 상기 전선을 받쳐주는 굴곡면부가 형성되는 지그를 이용하되,
상기 체결공에 박아넣어지는 핀은 상기 LED 기판의 상면으로부터 관통하여 하측의 상기 전선을 관통한 다음 상기 굴곡면부를 따라 굴곡되어 상기 전선을 감싸는 것을 특징으로 하는 간판용 LED 모듈의 제조방법.In the manufacturing method of the LED module for a signboard,
Laminating the LED substrate through which the fastening hole is formed on the electric wire;
coupling the LED substrate and the electric wire by inserting a pin into the fastening hole and penetrating the electric wire;
inserting the LED board and the wire coupled by the pin together into the molding space in the mold; and
Injection molding of a case in which the LED substrate and the electric wire are integrally built inside by injecting and solidifying a transparent resin into the molding space,
Using a jig in which a support surface portion of the edge supporting the LED substrate stacked on the electric wire is formed, and a semicircular depression is formed inside the support surface portion to form a curved surface portion supporting the electric wire,
The pin inserted into the fastening hole penetrates from the upper surface of the LED substrate, passes through the lower electric wire, and then is bent along the curved surface portion to surround the electric wire. 제2항에 있어서,
상기 금형은 상기 성형공간에 내장되는 LED 기판의 LED 소자에 대응하여 렌즈성형면부가 형성되고,
상기 성형공간에 주입되는 투명수지는 상기 렌즈성형면부의 형상에 따라 상기 LED 소자 상에 렌즈부를 형성하는 것을 특징으로 하는 간판용 LED 모듈의 제조방법.3. The method of claim 2,
The mold is formed with a lens molding surface portion corresponding to the LED element of the LED substrate embedded in the molding space,
The transparent resin injected into the molding space is a method of manufacturing an LED module for a sign, characterized in that the lens part is formed on the LED element according to the shape of the lens molding surface part.
KR1020200131593A 2020-10-13 2020-10-13 Manufacturing method of led module for signboard KR102318526B1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100050601A (en) * 2008-10-21 2010-05-14 우병국 Led unit for advertisement/public information illuminating system and the manufacture method
KR20150125222A (en) * 2014-04-30 2015-11-09 주식회사 인터원 Led module
KR20190001761U (en) * 2017-12-28 2019-07-09 이종인 Lens constructing possibility separation led correction module

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100050601A (en) * 2008-10-21 2010-05-14 우병국 Led unit for advertisement/public information illuminating system and the manufacture method
KR20150125222A (en) * 2014-04-30 2015-11-09 주식회사 인터원 Led module
KR20190001761U (en) * 2017-12-28 2019-07-09 이종인 Lens constructing possibility separation led correction module

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