KR20110036362A - A carrier for manufacturing a printed circuit board and a method of manufacturing a printed circuit board using the same - Google Patents

Abstract

PURPOSE: A carrier for manufacturing a printed circuit board and a method of manufacturing a printed circuit board using the same are provided to reduce the degree of bending of a printed circuit board. CONSTITUTION: In a carrier for manufacturing a printed circuit board and a method of manufacturing a printed circuit board using the same, an adhesion layer(102) is formed in both sides of a release layer(101a). A thermoplastic resin layer(103) is formed on at least one side of the release layer. In the release layer, when a carrier(100a) is separated from a printed circuit board, the thermoplastic resin layer is easily separated.

Description

A carrier for manufacturing a printed circuit board and a method for manufacturing a printed circuit board using the same {A CARRIER FOR MANUFACTURING A PRINTED CIRCUIT BOARD AND A METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD USING THE SAME}

The present invention relates to a carrier for manufacturing a printed circuit board and a method of manufacturing a printed circuit board using the same.

In general, a printed circuit board is formed of copper foil on one or both sides of a board made of various thermosetting synthetic resins to arrange and fix integrated circuits (ICs) or electronic components on the board, and to implement electrical wiring therebetween and then coated with an insulator. .

Recently, due to the development of the electronics industry, the demand for high functionalization and light weight reduction of electronic components is rapidly increasing. Accordingly, printed circuit boards on which such electronic components are mounted also require high density wiring and thinning.

In particular, in order to cope with thinning of printed circuit boards, a coreless substrate that can reduce the overall thickness and shorten the signal processing time by removing the core substrate has been attracting attention. However, since the coreless key board does not use a core board, a carrier member capable of performing a support function during the manufacturing process is required.

1 to 4 illustrate a method of manufacturing a printed circuit board using a carrier according to the prior art. Hereinafter, the manufacturing method will be described with reference to FIGS. 1 to 4.

First, the carrier 10 is prepared as shown in FIG. Specifically, the adhesive layer 12, the first metal layer 13, and the second metal layer 14 are sequentially formed on both surfaces of the copper foil laminated plate 11 (CCL) having copper foil layers formed on both surfaces of the insulating layer. At this time, both ends of the adhesive layer 12 are adhered to the copper-clad laminate 11 and the second metal layer 14 by applying heating and pressurization with a high temperature / high pressure press. On the other hand, the first metal layer 13 is in contact with the second metal layer 14 but is not bonded.

Next, as shown in FIG. 2, the buildup layer 15 is formed on both sides of the carrier 10, and the third metal layer 16 is formed on the outermost insulating layer. The buildup layer 15 is generally performed by a known method, and vias connecting the respective buildup circuit layers may be additionally formed. In addition, the third metal layer 16 is formed to prevent warpage of the build-up layer 15.

Next, as shown in FIG. 3, the buildup layer 15 is separated from the carrier 10. At this time, both ends of the adhesive layer 12 bonded to the copper-clad laminate 11 and the second metal layer 14 are removed through a router process to separate the build-up layer 15 from the carrier 10. Since the first metal layer 13 serves as a release layer and is not bonded to the second metal layer 14, when the adhesive layer 12 is removed, the first metal layer 13 is easily separated from the second metal layer 14.

Next, as shown in FIG. 4, the second metal layer 14 and the third metal layer 16 formed on the buildup layer 15 are removed by etching. In addition, a printed circuit board may be completed by forming a circuit layer including vias and a solder resist layer that insulates the circuit layer from the outside in the outermost insulating layer.

However, in the case of a printed circuit board using a carrier as in the related art, the warpage phenomenon of the substrate frequently occurs due to a large difference in thermal expansion coefficient between the insulating layer of the build-up layer 15 and the first metal layer 13 and the second metal layer 14. As a result, there was a problem in that the cutting of the microcircuit and the cracking of the product occurred.

In addition, even after the carrier 10 is removed, the second metal layer 14 and the third metal layer 16 remain in the build-up layer 15, which requires an additional etching process to remove them, resulting in long manufacturing time and high manufacturing cost. As a result, the yield of the printed circuit board was lowered.

The present invention was created to solve the problems of the prior art as described above, and an object of the present invention is to provide a carrier for a printed circuit board manufacturing and a printed circuit board using the same by using a thermoplastic resin layer having a low coefficient of thermal expansion. It is to provide a manufacturing method.

Another object of the present invention is to provide a carrier for manufacturing a printed circuit board and a method of manufacturing a printed circuit board using the same, after the separation of the carrier, there is no metal layer remaining on the printed circuit board, there is no need for an additional etching process.

The carrier for manufacturing a printed circuit board according to the first exemplary embodiment of the present invention may include a release layer, an adhesive layer formed on both sides of the release layer, and a thermoplastic formed on at least one surface of the upper and lower surfaces of the release layer including the adhesive layer. It is characterized by including a resin layer.

Here, the thermoplastic resin layer is characterized by consisting of a polyimide or a liquid crystal polymer.

In the carrier for manufacturing a printed circuit board according to the second embodiment of the present invention, in the carrier for manufacturing a printed circuit board according to the first embodiment of the present invention, a metal layer is further included in the release layer. .

In the method of manufacturing a printed circuit board using a carrier according to a first preferred embodiment of the present invention, (A) an adhesive layer is formed on both sides of a release layer, and the adhesive layer is formed on at least one surface of the top and bottom surfaces of the release layer. Preparing a carrier by forming a thermoplastic resin layer, (B) forming a first circuit layer on the thermoplastic resin layer, then laminating a buildup insulating layer on the thermoplastic resin layer, and forming the thermoplastic resin layer on the buildup insulating layer After forming a build-up circuit layer connected to the first circuit layer, forming a protective layer on the build-up insulating layer, (C) removing the adhesive layer, separating the release layer and the thermoplastic resin layer And (D) processing the first open portion exposing the first pad portion of the first circuit layer to the thermoplastic resin layer, and processing the second open portion exposing the second pad portion of the build-up circuit layer to the protective layer. Ha Characterized in that it comprises the steps:

In this case, the thermoplastic resin layer is characterized by consisting of a polyimide or a liquid crystal polymer.

In addition, the protective layer is characterized in that consisting of a polyimide or a liquid crystal polymer.

In addition, in the step (C), it is characterized in that to remove the adhesive layer by cutting both sides of the release layer.

In the method of manufacturing a printed circuit board using a carrier according to the second exemplary embodiment of the present invention, in the method of manufacturing a printed circuit board using the carrier according to the first exemplary embodiment of the present invention, the step (A) may include: (A1) forming a release layer on the outer surface of the metal layer, (A2) forming an adhesive layer on both sides of the release layer, and (A3) at least one surface of the upper and lower surfaces of the release layer including the adhesive layer. Forming a thermoplastic resin layer, characterized in that it comprises the step of preparing a carrier.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to this, terms and words used in the present specification and claims should not be construed in a conventional and dictionary sense, and the inventor may appropriately define the concept of a term in order to best describe its invention The present invention should be construed in accordance with the spirit and scope of the present invention.

According to the present invention, the thermoplastic resin layer and the protective layer are formed of an insulating material having a low coefficient of thermal expansion, thereby reducing the warpage phenomenon and crack phenomenon of the printed circuit board.

In addition, according to the present invention, since the separate metal layer is not bonded to the thermoplastic resin layer after separating the printed circuit board and the carrier, an additional etching process is not required, and thus the yield of the printed circuit board is improved.

In addition, according to the present invention, by using the thermoplastic resin layer of the carrier as the outermost protective layer of the printed circuit board, there is an advantage of reducing the manufacturing cost of the printed circuit board.

In addition, according to the present invention, the thermoplastic resin layer of the carrier is composed of a material having a high rigidity such as a liquid crystal polymer or a polyimide, thereby increasing the rigidity of the carrier.

In addition, according to the present invention, there is an advantage of supplementing the rigidity of the carrier by further forming a metal layer inside the release layer.

The objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and the preferred embodiments which are connected with the accompanying drawings. In the present specification, in adding reference numerals to the components of each drawing, it should be noted that the same components as possible, even if displayed on different drawings have the same number as possible. In addition, terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. In addition, in describing the present invention, if it is determined that the detailed description of the related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

For printed circuit board manufacturing carrier

5 is a cross-sectional view of a carrier 100a for manufacturing a printed circuit board according to the first embodiment of the present invention. Hereinafter, the carrier 100a for manufacturing a printed circuit board according to the present embodiment will be described with reference to this.

As shown in FIG. 5, in the carrier 100a for manufacturing a printed circuit board according to the present embodiment, adhesive layers 102 are formed on both sides of the release layer 101a, and the release layer 101a includes the adhesive layer 102. The upper and lower surfaces of the thermoplastic resin layer 103 are formed.

The release layer 101a easily separates the thermoplastic resin layer 103 so that when the carrier 100a is separated from the printed circuit board, the printed circuit board, in particular, the thermoplastic resin layer 103 can be maintained without being damaged. It has a function to make.

Here, the release layer 101a may be a film type release material that is generally used. The release material of the film type may preferably be a release material made of an epoxy-based release material or a fluorine resin, and in this case, the release layer 101a may have a silicon coating layer (not shown).

In addition, when the release layer 101a is made of a film type release material, the release layer 101a may be formed on the first surface of the release layer 101a to improve adhesion between the first surface of the release layer 101a and the thermoplastic resin layer 103. It is preferable to carry out the surface treatment. In this case, the surface treatment may be Si coating or plasma treatment, and the surface treatment is preferably performed such that the first surface of the release layer 101a is hydrophilic. For example, the release layer 101a may be a polyethylene terephthalate plastic sheet coated with a Si-based release agent.

The adhesive layer 102 is a layer formed on both the left and right sides of the release layer 101a, and enables the thermoplastic resin layer 103 described below to remain adhered to the release layer 101a. In addition, the adhesive layer 102 may be separated from the release layer 101a by a routing process when manufacturing a printed circuit board later.

Here, as a material of the adhesive layer 102, for example, a general printed circuit board adhesive may be used, and a prepreg having excellent adhesive strength may be used.

The thermoplastic resin layer 103 maintains the rigidity as the carrier 100a and is subsequently formed as a protective layer of the printed circuit board. The thermoplastic resin layer 103 is formed on the upper and lower surfaces of the release layer 101a including the adhesive layer 102.

Here, when the printed circuit board is formed only on one surface of the carrier 100a, the thermoplastic resin layer 103 may be formed only on one surface of the release layer 101a.

On the other hand, the thermoplastic resin layer 103 means a synthetic resin that is easy to process when heated and hardens when cooled. The thermoplastic resin layer 103 is preferably made of a material having a rigidity such as polyimide or liquid crystal polymer that is stronger than that of the general insulating layer and has a low thermal expansion coefficient. This is because the bending of the printed circuit board is reduced when the thermoplastic resin layer 103 maintains the rigidity of the carrier 100a and separates the carrier 100a in the printed circuit board manufacturing process.

6 is a cross-sectional view of a carrier 100b for manufacturing a printed circuit board according to a second exemplary embodiment of the present invention. Hereinafter, the carrier 100b for manufacturing a printed circuit board according to the present embodiment will be described with reference to this. Here, the same or corresponding components are referred to by the same reference numerals, and descriptions overlapping with the first embodiment will be omitted.

As shown in FIG. 6, in the carrier 100b for manufacturing a printed circuit board according to the present embodiment, a release layer 101b is formed on an outer surface of a metal layer 105, and adhesive layers 102 are formed on both sides of the release layer 101b. ) Is formed, and the thermoplastic resin layer 103 is formed on at least one surface of the upper and lower surfaces of the release layer 101b including the adhesive layer 102.

Specifically, the metal layer 105 is a member that supplements the rigidity of the carrier 100b to further prevent the warpage of the printed circuit board when the printed circuit board is manufactured. Only the upper and lower portions of the metal layer 105 may be connected to the release layer 101b, and both sides of the metal layer 105 may be connected to the adhesive layer 102.

Manufacturing method of printed circuit board

7 to 12, a method of manufacturing a printed circuit board using a carrier according to a first exemplary embodiment of the present invention will be described.

In the present exemplary embodiment, the printed circuit boards will be manufactured on both sides of the carrier 100a, but the present invention is not limited thereto, and the printed circuit board may be manufactured only on one surface of the carrier 100a.

First, as shown in FIG. 7, the carrier 100a is prepared.

At this time, the carrier (100a) is for performing a supporting function in the manufacturing process of the printed circuit board. The carrier 100a first prepares the release layer 101a, forms the adhesive layers 102 on both sides of the release layer 101a, and then at least the upper and lower surfaces of the release layer 101a including the adhesive layer 102. The thermoplastic resin layer 103 may be formed on one surface to be produced.

Next, as shown in FIG. 8, the 1st circuit layer 106 is formed in both surfaces of the carrier 100a.

At this time, the first circuit layer 106 is formed by a plating process and an etching process, generally known subtractive method, additive method, semi-additive method, And a modified semi-additive method, a tenting method, and the like.

Next, as shown in FIG. 9, the buildup insulating layer 107 and the buildup circuit layer 108 are formed on both surfaces of the carrier 100a on which the first circuit layer 106 is formed.

At this time, the buildup insulating layer 107 is laminated while the first circuit layer 106 is impregnated, and the buildup circuit layer 108 is formed on the buildup insulating layer 107. In addition, a via 109 connecting the build-up circuit layer 108 and the first circuit layer 106 may be further formed. The build up circuit layer 108 may be formed by, for example, SAP, MSAP, or the like.

Meanwhile, in FIG. 9, the build-up insulating layer 107 and the build-up circuit layer 108 are formed of three layers, respectively, but this may be one layer or a multilayer.

Next, as shown in FIG. 10, the protective layer 110 is formed in the buildup insulating layer 107 in which the buildup circuit layer 108 was formed.

Here, the protective layer 110 protects the build-up circuit layer 108 and serves as an insulating material. In addition, the protective layer 110 is formed while the build-up circuit layer 108 is impregnated.

On the other hand, as the material of the protective layer 110, for example, epoxy resins such as prepreg, Ajinomoto Build up Film (ABF), FR-4, Bismalemide Triazine (BT), and the like can be used. Materials having a low coefficient of thermal expansion such as polyimide are preferred. This is because the separation of the printed circuit board from the carrier 100a corresponds to the thermoplastic resin layer 103 up and down to reduce the warpage of the printed circuit board.

Next, as shown in FIG. 11, the printed circuit board and the carrier 100a are separated.

At this time, if both sides of the release layer 101a are cut by, for example, a routing process, the adhesive layer 102 is removed and there is no adhesive force between the release layer 101a and the thermoplastic resin layer 103, so that the impact caused by the routing process And vibration can be easily separated. In addition, the release layer 101a is separated from the thermoplastic resin layer 103 and the thermoplastic resin layer 103 is used as the outermost protective layer of the printed circuit board to protect the first circuit layer 106.

Next, as shown in FIG. 12, the first open part 112 and the second open part 114 are formed in the thermoplastic resin layer 103 and the protective layer 110, respectively.

Specifically, the first open part 112 exposing the first pad part 111 of the first circuit layer 106 is formed in the thermoplastic resin layer 103, and the build-up circuit layer () is formed in the protective layer 110. The second open part 114 exposing the second pad part 113 is formed.

In this case, the first open part 112 and the second open part 114 may be processed by, for example, a laser method, a machining drill, or an imprint method. In addition, when the first open part 112 and the second open part 114 are processed by a laser method, the first pad part 111 and the second pad part 113 may serve as stoppers, respectively. .

Subsequently, solder balls (not shown) may be additionally formed in the first pad part 111 and the second pad part 113 to be connected to an external device.

By such a manufacturing process, a printed circuit board using a carrier according to the first preferred embodiment shown in Fig. 12 is manufactured.

Referring to Figures 13 to 18 will be described a method of manufacturing a printed circuit board using a carrier according to a second embodiment of the present invention. Here, the same or corresponding components are referred to by the same reference numerals, and descriptions overlapping with the first embodiment will be omitted.

First, as shown in FIG. 13, the carrier 100b is prepared.

At this time, after the release layer 101b is formed outside the metal layer 105, the adhesive layers 102 are formed on both sides of the release layer 101b, and the upper and lower layers of the release layer 101b including the adhesive layer 102 are formed. The thermoplastic resin layer 103 is formed on at least one surface. Here, when the release layer 101b and the thermoplastic resin layer 103 are adhered by the adhesive layer 102 and the adhesive layer 102 is removed, the release layer 101b and the thermoplastic resin layer 103 may be easily separated. have.

On the other hand, when the metal layer 105 is formed inside the release layer 101b, since the metal is generally larger in rigidity than the thermoplastic resin layer 103 and the release layer 101b, the rigidity of the carrier 100b is further increased. Can be improved. Therefore, when the build-up process is performed on the carrier 100b, the warpage of the printed circuit board is reduced.

In FIG. 13, the left and right sides of the metal layer 105 are shown to be in contact with the release layer 101b, but this is illustrative and may be in direct contact with the adhesive layer 102.

Next, as shown in FIGS. 14 to 18, the process is performed in the same manner as the method of manufacturing a printed circuit board using a carrier according to the first preferred embodiment of the present invention, and according to the second preferred embodiment of the present invention. A printed circuit board using a carrier can be manufactured.

Although the present invention has been described in detail through specific embodiments, this is for explaining the present invention in detail, and the carrier for manufacturing a printed circuit board according to the present invention and a method for manufacturing a printed circuit board using the same are not limited thereto. It will be apparent that modifications and improvements are possible by those skilled in the art within the technical spirit of the present invention.

All simple modifications and variations of the present invention fall within the scope of the present invention, and the specific scope of protection of the present invention will be apparent from the appended claims.

1 to 4 are cross-sectional views illustrating a method of manufacturing a printed circuit board using a carrier according to the prior art.

5 is a cross-sectional view of a carrier for manufacturing a printed circuit board according to the first embodiment of the present invention.

6 is a cross-sectional view of a carrier for manufacturing a printed circuit board according to a second exemplary embodiment of the present invention.

7 to 12 are cross-sectional views illustrating a method of manufacturing a printed circuit board using the carrier illustrated in FIG. 5.

13 to 18 are process cross-sectional views for describing a method of manufacturing a printed circuit board using the carrier shown in FIG. 6.

<Description of main parts of drawing>

101a, 101b: release layer 102: adhesive layer

103: thermoplastic resin layer 105: metal layer

106: first circuit layer 107: build-up insulating layer

108: build-up circuit layer 109: via

110: protective layer 111: first pad portion

112: first opening portion 113: second pad portion

114: second opening

Claims (8)

Release layer; Adhesive layers formed on both sides of the release layer; And A thermoplastic resin layer formed on at least one surface of upper and lower surfaces of the release layer including the adhesive layer; Carrier for manufacturing a printed circuit board comprising a. The method according to claim 1, Carrier for manufacturing a printed circuit board, characterized in that the metal layer is further included in the release layer. The method according to claim 1, The thermoplastic resin layer is a carrier for manufacturing a printed circuit board, characterized in that consisting of polyimide or liquid crystal polymer. (A) forming an adhesive layer on both sides of the release layer, and forming a thermoplastic resin layer on at least one surface of the upper and lower surfaces of the release layer including the adhesive layer to prepare a carrier; (B) a first circuit layer is formed on the thermoplastic resin layer, and then a buildup insulating layer is laminated on the thermoplastic resin layer, and a buildup circuit layer connected to the first circuit layer is formed on the buildup insulating layer. Thereafter, forming a protective layer on the build-up insulating layer; (C) removing the adhesive layer to separate the release layer and the thermoplastic resin layer; And (D) processing the first open portion exposing the first pad portion of the first circuit layer to the thermoplastic resin layer, and processing the second open portion exposing the second pad portion of the build-up circuit layer to the protective layer. ; Method of manufacturing a printed circuit board using a carrier comprising a. The method according to claim 4, The thermoplastic resin layer is a manufacturing method of a printed circuit board using a carrier, characterized in that consisting of polyimide or liquid crystal polymer. The method according to claim 4, The protective layer is a manufacturing method of a printed circuit board using a carrier, characterized in that consisting of polyimide or liquid crystal polymer. The method according to claim 4, Step (A) is (A1) forming a release layer on an outer surface of the metal layer; (A2) forming adhesive layers on both sides of the release layer; And (A3) preparing a carrier by forming a thermoplastic resin layer on at least one of upper and lower surfaces of the release layer including the adhesive layer; Method of manufacturing a printed circuit board using a carrier comprising a. The method according to claim 4, In the step (C), by cutting both sides of the release layer to remove the adhesive layer manufacturing method of a printed circuit board using a carrier.

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