KR20110034768A - Ball mount apparatus comprising inkjet type flux tool - Google Patents

Ball mount apparatus comprising inkjet type flux tool Download PDF

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Publication number
KR20110034768A
KR20110034768A KR1020090092195A KR20090092195A KR20110034768A KR 20110034768 A KR20110034768 A KR 20110034768A KR 1020090092195 A KR1020090092195 A KR 1020090092195A KR 20090092195 A KR20090092195 A KR 20090092195A KR 20110034768 A KR20110034768 A KR 20110034768A
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KR
South Korea
Prior art keywords
flux
ball
substrate
tool
ball mount
Prior art date
Application number
KR1020090092195A
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Korean (ko)
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KR101162625B1 (en
Inventor
이규호
Original Assignee
(주) 에스에스피
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Priority to KR1020090092195A priority Critical patent/KR101162625B1/en
Publication of KR20110034768A publication Critical patent/KR20110034768A/en
Application granted granted Critical
Publication of KR101162625B1 publication Critical patent/KR101162625B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Abstract

The present invention discloses a ball mount equipment for attaching solder balls to a substrate. Ball mounting equipment of the present invention, the transfer means for transferring the substrate to the process position; Means for dotting flux on one surface of the substrate that has reached the process position, comprising: a flux tool having an inkjet head for quantitatively discharging flux using a built-in heating element or piezoelectric element; And a ball tool for attaching a solder ball to a flux-doped position on the substrate by the flux tool.

According to the present invention, since the flux is jetted to the substrate by the inkjet method, there is no need to use the flux fin as in the prior art. This reduces the cost of replacing the flux pins, which greatly improves the overall productivity of the machine.

Description

Ball mount apparatus comprising an inkjet flux tool

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ball mount device, and more particularly, to a ball mount device in which a flux tool for dotting flux on a substrate in an inkjet method is used in a process device for manufacturing a semiconductor package, a camera module, and the like.

As electronic products are getting smaller and slimmer, semiconductor packages used in the semiconductors are being used in high density packages such as ball grid arrays (BGAs) or chip scale packages (CSPs). In recent years, solder ball terminals are also formed in the camera module.

1 illustrates a general configuration of a BGA package, in which a BGA package includes a printed circuit board (PCB) substrate 1, a semiconductor chip 2 mounted on the PCB substrate 1, a PCB substrate 1 and a semiconductor chip. And a molding portion 4 for protecting the semiconductor chip 2 and the wire 3.

In addition, a ball pad 5 electrically connected to an internal circuit pattern is formed under the PCB 1, and the solder ball 6 is temporarily bonded to the ball pad 5 using flux. BGA package is completed by fusing the solder balls 6 through the reflow process.

On the other hand, since the productivity is reduced when the packaging process is carried out in units of individual PCB boards 1, in practice, as shown in FIG. 2, a plurality of PCB boards 1 are integrally connected using a PCB strip 10. Then, the packaging process is performed, and in most cases, the process is separated into individual units as shown in FIG. 1.

Accordingly, in order to manufacture such a BGA package, a die bonding process of attaching the semiconductor chip 2 to the upper surface of the PCB substrate 1, a molding process, and the solder ball 6 to be attached to the rear surface of the PCB substrate 1 are performed. A ball mount process or the like must be performed, and these processes are performed in the process equipment optimized for each process.

In particular, the ball mount equipment includes a flux tool for doping the flux for each ball pad 5 of the PCB 1 and a ball tool for adsorbing the solder ball to the ball pad 5 that is flux-doped. It includes.

A pin mount block is detachably mounted at the lower end of the flux tool, and a flux pin for flux dotting is mounted at the pin mount block. In addition, the lower part of the ball tool is detachably mounted to the ball mount block formed with a vacuum suction hole that can absorb the solder ball. These pin mount blocks and ball mount blocks are properly replaced according to the size of the board and the size of the solder balls.

However, when the ball mount equipment having such a structure is operated for a long time, there is a problem that excessive maintenance costs occur because the flux pins must be frequently replaced. The flux pins repeat the operation of doping the substrate after the flux is buried in the flux supply part. The flux pins must be replaced after a certain period of time because the end wears or deforms due to prolonged use.

Flux pins are expensive parts that are precision machined and are usually expensive to replace because hundreds of flux pins are usually required to be mounted on a pin mount block.

In addition, due to the recent miniaturization of the circuit pattern, the diameter of the solder balls is smaller, so the flux pins need to be processed more precisely. This causes the flux pins to be worn or deformed more quickly, resulting in a shorter replacement cycle and a higher cost burden. There is this.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and the object of the present invention is to reduce the maintenance cost of the ball mount equipment by allowing the flux to be plated onto the substrate without using the flux pin in the conventional ball mount equipment.

The present invention, the transfer means for transferring the substrate to the process position in order to achieve the above object; Means for dotting flux on one surface of the substrate that has reached the process position, comprising: a flux tool having an inkjet head for quantitatively discharging flux using a built-in heating element or piezoelectric element; Provided is a ball mount device comprising a ball tool for attaching a solder ball in the flux-doped position on the substrate by the flux tool.

The inkjet head in the ball mount equipment, the housing; A plurality of fine nozzles formed in the housing; A flux supply passage formed in the housing and connected to each of the plurality of fine nozzles, wherein at least one of the heating elements is provided at a position close to each of the plurality of fine nozzles, or the piezoelectric element is At least one may be installed at a position proximate to each of the plurality of micronozzles.

According to the present invention, since the flux is jetted to the substrate by the inkjet method, there is no need to use the flux fin as in the prior art. This reduces the cost of replacing the flux pins, which greatly improves the overall productivity of the machine.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a plan view showing a ball mount device 100 according to an exemplary embodiment of the present invention. The first and second strip feed lines 101 and 102 arranged in the x-axis direction (horizontal direction on the drawing) and the first And a loading unit 110, a ball mount unit 120, and an unloading unit 130 sequentially installed along the x-axis direction on the second strip transfer line 101 and 102.

The loading unit 110 vacuum-adsorbs the PCB strip 10 introduced into the equipment and places it on the first or second strip transfer line 101 or 102 and the loading picker 112 and the y-axis direction of the loading picker 112. And a first guide device 114 for guiding the movement (in the longitudinal direction on the drawing). On one side of the loading picker 112, a position reading camera 115 for acquiring position data of the PCB strip 10 is installed.

The ball mount unit 120 adsorbs the flux tool 170 for dotting the flux in an inkjet method on the rear surface of the PCB strip 10, and attaches the solder ball to the PCB strip 10. And a second guide device 126 for guiding movement of the flux tool 170 and the ball tool 124 in the y-axis direction. A ball mount block (not shown) having a vacuum suction hole is detachably mounted at a lower end of the ball tool 124, and the ball mount block may be replaced according to the type of the PCB strip 10 and the size of the solder ball. The flux tool 170 for doping the flux by the inkjet method will be described later.

An inspection camera 150 may be installed at one side of the strip conveying lines 101 and 102 in the lower portion of the moving path of the ball tool 124 to determine whether the solder ball is adsorbed to the ball tool 124 without missing.

The unloading unit 130 is for unloading the PCB strip 10 in which the ball mount process is completed when the PCB strip 10 is transferred along the first or second strip transfer lines 101 and 102. More specifically, the unloading picker 132 for picking up and transporting the PCB strip 10 from the first and second strip transfer lines 101 and 102 and the third guide for moving the y-axis direction of the unloading picker 132. Guide device 134 is included.

On the upper portions of the first and second strip transfer lines 101 and 102 between the ball mount unit 120 and the unloading unit 130, process defects with respect to the PCB strip 10 completed by the ball mount unit 120 are processed. The inspection camera 160 to read may be installed.

4 is a schematic diagram illustrating an inkjet flux tool 170 according to an embodiment of the present invention.

That is, the z-axis motor 172 is mounted on the horizontal frame 171 coupled to the second guide device 126 to be movable in the horizontal direction by the linear guide 176, and the z-axis motor 172 of the After connecting the vertical movement frame 174 to the drive shaft 173, the inkjet unit 200 is mounted on the vertical movement frame 74.

When the linear linear guide 175 is mounted between the horizontal frame 171 and the vertical frame 174, the inkjet unit 200 is lifted by the z-axis motor 172.

The inkjet unit 200 includes an inkjet head 210 for spraying flux to a ball pad of the PCB strip 10 at a lower end thereof. The inkjet head 210 serves to quantitatively flux flux to the ball pad 5 of the PCB strip 10 by using a plurality of individually controlled micronozzles, thereby replacing the conventional flux pin.

In this structure, the inkjet head 210 may move in the y-axis and z-axis directions by the horizontal moving frame 171 and the vertical moving frame 174. However, the configuration of the apparatus is not limited thereto, and may be modified in various forms as necessary. For example, it is also possible to move the inkjet head 210 in the x-axis direction by separately installing the driving means in the x-axis direction.

The inkjet head 210 may be implemented in various forms. For example, as shown in FIG. 5, a housing 212 having a flux supply passage (not shown) and a plurality of fine nozzles 214 connected to the flux supply passage, the housing 212. It may include a flux supply means 219 for supplying the flux into the interior of the. The flux supply means 219 may be connected to the outside of the housing 212 as described above, or may be formed integrally with or inside the housing 212.

The housing 212 may be manufactured in a size corresponding to the overall size of the PCB strip 10, or may be manufactured in a size corresponding to the individual PCB unit of the PCB strip 10. 5 shows an inkjet head 210 fabricated in a size corresponding to an individual PCB unit. In addition, as shown in FIG. 6, only the fine nozzle 214 of the unit row may be formed.

The inkjet head 210 should be provided with a predetermined ejection means for quantitatively discharging the flux through the fine nozzle 214. In the exemplary embodiment of the present invention, at least one heating element or piezoelectric element is installed corresponding to each micronozzle 214 by applying the principle of inkjet printing.

FIG. 7 is a partial cross-sectional view of the inkjet head 210 in which the heating element 216 is built, and the heating element 216 is installed in a one-to-one correspondence at the upper end of each micronozzle 214. The heat generating element 216 generates heat at a high temperature by the applied power, and it is determined whether to generate heat under the control of an apparatus controller (not shown). Between the heat generating element 216 and the inner wall of the fine nozzle 214, a plate of a metal material (eg, Al) having high thermal conductivity may be interposed.

When the heat generating element 216 generates heat at a high temperature, bubbles are generated in the flux inside the fine nozzle 214, and the flux is quantitatively discharged through the discharge port 215 due to the pressure, thereby dotting at a predetermined position of the PCB strip 10. do. After a certain amount of flux is discharged, the flux is filled from the flux supply passage U into the inside of the fine nozzle 214 due to the vacuum pressure generated by the bubble bursting.

The heat generating element 216 is not necessarily installed at the upper end of each of the fine nozzles 214, and may be provided in the vicinity of the discharge port 215 of the fine nozzle 214. In addition, two or more heating elements 216 may be installed for one micronozzle 214.

FIG. 8 is a partial cross-sectional view of the inkjet head 210 in which the piezoelectric element 218 is embedded, and the piezoelectric elements 218 correspond to the upper end of each micronozzle 214 in a one-to-one correspondence. The piezoelectric element 218 serves to generate a predetermined pressure while vibrating by an applied power source, and operates under the control of an apparatus controller (not shown).

An elastic plate may be provided on the inner wall of the fine nozzle 214 in which the piezoelectric element 218 is installed to serve as a diaphragm.

When the piezoelectric element 218 vibrates, a predetermined pressure is generated inside the fine nozzle 214, and the flux is discharged through the discharge port 215 due to this pressure.

The inkjet head 210 that fluxes the flux based on this principle is an application of the so-called inkjet printing principle, and can control the amount of flux discharged through each micronozzle 214 to a level of 1 to 10 pℓ. In addition to replacing the flux pin, there is an advantage that can cope with the recent trend that the size of the solder ball is gradually reduced due to the miniaturization of the pattern.

On the other hand, the flux supply device 219 is preferably provided with a pressure control means such as a micropump for quantitative supply of the flux, and a heating means for preventing the solidification of the flux.

In addition, although not shown, it is preferable to install a test area in the ball mount device 100 to check whether the flux tool 170 dots the flux at the correct position. Specifically, the flux tool 170 is moved to the test area to dope the flux with the inkjet method on the test substrate, and then the position and quantity of the doped flux are read using a camera not shown.

Meanwhile, the ball mount device 100 for attaching the solder ball to the PCB strip 10 in which a plurality of PCB units are integrally described has been described, but the solder ball mount device according to the embodiment of the present invention has a different type of workpiece (eg, It can also be applied to equipment for attaching solder balls to a substrate.

For example, it may be applied to equipment for attaching solder balls to individual PCB units or for attaching solder balls to a plurality of individual PCB units mounted on a transport means such as a boat. It can also be applied to equipment that attaches solder balls to wafers or individual dies (or chips). It can also be applied to the equipment for attaching the solder ball to the substrate for the camera module.

In addition, the present invention is not limited to the above-described embodiments, and may be modified or modified in various forms, and the present invention may be modified or modified as described above, provided that the technical spirit of the present invention is included in the following claims. Naturally, it belongs to the scope of rights.

1 is a cross-sectional view of a BGA package

Figure 2 illustrates a PCB strip

3 is a plan view of a solder ball mount equipment according to an embodiment of the present invention

4 is a plan view of a flux tool in accordance with an embodiment of the present invention;

5 illustrates an embodiment of an inkjet head

6 shows another embodiment of an inkjet head;

7 is a cross-sectional view of an inkjet head using a heating element.

8 is a cross-sectional view of an inkjet head using a piezoelectric element.

* Description of the symbols for the main parts of the drawings *

100: ball mount equipment 110: loading unit

112: loading picker 114: first guide device

120: ball mount unit 124: ball tool

126: second guide device 130: unloading unit

150, 160: first and second cameras

170: flux tool 200: inkjet unit

210: inkjet head 212: housing

214: fine nozzle 215: discharge part

216: heating element 218: piezoelectric element

Claims (3)

Transfer means for transferring the substrate to a process position; Means for dotting flux on one surface of the substrate that has reached the process position, comprising: a flux tool having an inkjet head for quantitatively discharging flux using a built-in heating element or piezoelectric element; A ball tool attaching a solder ball to a position where the flux is doped by the flux tool on the substrate; Ball mount equipment including The method of claim 1, The inkjet head, housing; A plurality of fine nozzles formed in the housing; A flux supply passage formed in the housing and connected to each of the plurality of fine nozzles; It includes, wherein at least one of the heating element is installed in a position close to each of the plurality of fine nozzles, or the piezoelectric element is characterized in that at least one is installed in a position close to each of the plurality of fine nozzles Ball mount equipment The method of claim 1, And a test area for inspecting the discharge amount or discharge position of the flux discharged from the inkjet head.
KR1020090092195A 2009-09-29 2009-09-29 Ball mount apparatus comprising inkjet type flux tool KR101162625B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020090092195A KR101162625B1 (en) 2009-09-29 2009-09-29 Ball mount apparatus comprising inkjet type flux tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090092195A KR101162625B1 (en) 2009-09-29 2009-09-29 Ball mount apparatus comprising inkjet type flux tool

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KR20110034768A true KR20110034768A (en) 2011-04-06
KR101162625B1 KR101162625B1 (en) 2012-07-04

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200118524A (en) 2019-04-08 2020-10-16 유홍준 Image Processing System and Method Based on Active Motion Recognition Tracking
WO2021256656A1 (en) * 2020-06-16 2021-12-23 (주) 에스에스피 Method for controlling boat/strip type solder ball placement system

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102001071B1 (en) 2017-07-20 2019-07-18 주식회사 지엔테크 Flux inkjet injection apparatus and method, and valve nozzle using the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200118524A (en) 2019-04-08 2020-10-16 유홍준 Image Processing System and Method Based on Active Motion Recognition Tracking
WO2021256656A1 (en) * 2020-06-16 2021-12-23 (주) 에스에스피 Method for controlling boat/strip type solder ball placement system

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KR101162625B1 (en) 2012-07-04

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