KR20110026318A - Flexible gas barrier film, method for preparing thereof and flexible display device using the same - Google Patents

Abstract

PURPOSE: A flexible gas barrier film, a method for manufacturing the same, a flexible display device using the same are provided to reduce water permeation rate by controlling energy on the surface of the barrier film. CONSTITUTION: A hydrophobic pattern layer(2) is repetitively formed on a transparent base film. A pattern includes an embossed pattern. The width of the pattern is less than 10um. A gap of the centers of the patterns is 0.1 to 10 times of the width of the pattern. The thickness of the hydrophobic pattern layer is between 100 and 3000nm. The height of the pattern is between 50 and 2500nm.

Description

Flexible gas barrier film, its manufacturing method and flexible display device using the same {Flexible Gas Barrier Film, Method for Preparing Thereof and Flexible Display Device Using the Same}

The present invention relates to a gas barrier film that can be used for a flexible display substrate and a method of manufacturing the same. More specifically, the present invention comprises a transparent base film and a hydrophobic pattern layer formed on the base film, and by forming a hydrophobic layer can maximize the hydrophobicity and can effectively reduce the moisture permeability gas barrier film and its manufacture It is about a method.

The flexible display can be folded, bent or rolled while maintaining excellent display characteristics. Therefore, the flexible display has been evaluated as the next generation technology of the current flat panel display market, and the research is rapidly being conducted worldwide. Since the substrate used for the flexible display is difficult to realize with a conventional rigid glass substrate, a transparent plastic substrate is used. In the case of glass substrates, however, the penetration of moisture or oxygen is sufficiently prevented, but in the case of plastic substrates, there is a problem in that gas barrier properties are inferior because the transmittance of moisture or oxygen is larger than that of glass substrates. In this way, when a substrate having poor gas barrier properties is used, the organic material reacts due to moisture permeation, which shortens the lifespan, and water vapor or air penetrates, deteriorates the device, resulting in display defects, thereby degrading the display quality. Accordingly, a technique of coating a protective film such as ceramic on the surface of the plastic substrate or the film has been used. However, there is a problem in that moisture is diffused by small pin holes or cracks in the ceramic-based layer. In order to prevent this, a technology of coating a material such as polymer-based acrylic or melamine on a ceramic protective layer or using a multilayer structure in the structure has been developed to block moisture permeation. 1 illustrates a structure in which a hydrophobic layer is formed on a transparent base film.

Japanese Patent Laid-Open No. 53-12953 discloses a gas barrier film in which silicon oxide is deposited on a plastic film, and Japanese Patent Laid-Open No. 58-217344 discloses a gas barrier film in which aluminum oxide is deposited. In addition, Japanese Patent Laid-Open No. 2002-100469 discloses a gas barrier film in which a silicon nitride oxide film is formed on a plastic film substrate.

However, in the case of the conventionally developed gas barrier film, it only serves to slow down the diffusion rate of the moisture in the protective film or to increase the diffusion path, and thus, sufficient moisture barrier performance cannot be obtained because the moisture permeability exceeds 0.1 g / m 2 day. However, there is a disadvantage that it is impossible to prevent the entry of a very small amount of water into the device by the change over time. On the other hand, a method of forming a gas barrier layer in multiple layers has been proposed for sufficient gas barrier performance, but the thickness of the gas barrier film becomes thick, resulting in a problem that cracking may occur due to a decrease in productivity or generation of tension in the barrier layer.

Korean Patent No. 5537777 discloses a structure using perylene as a hard coat film. However, in order to obtain sufficient gas barrier properties, a perylene layer needs to be deposited to 5 μm or more.

An object of the present invention is to provide a flexible gas barrier film that can increase the water repellency by maximizing hydrophobicity by patterning the hydrophobic layer.

Another object of the present invention is to form a patterned hydrophilic layer on the patterned hydrophobic layer to discharge moisture from the hydrophobic surface to the hydrophilic region of the outer surface to lower the moisture permeability of the flexible gas barrier film It is to provide.

It is still another object of the present invention to provide a flexible gas barrier film that can effectively lower the moisture permeability without raising the manufacturing cost by controlling the energy at the surface based on existing barrier materials.

Another object of the present invention is to provide a gas barrier film that can be applied to a flexible display device, a touch panel, a solar cell, various packaging materials and the like with excellent gas barrier performance.

It is another object of the present invention to provide a method which can easily produce a flexible gas barrier film without adding complicated processes.

Still another object of the present invention is to provide a flexible display device having excellent durability and reliability by using the flexible gas barrier film as a substrate.

One aspect of the invention relates to a flexible gas barrier film. The flexible gas barrier film is a transparent base film; And a hydrophobic pattern layer formed on the base film.

In embodiments, the hydrophobic pattern layer may be a polymer material having a surface energy of 1 mN / m to 40 mN / m.

In embodiments, the hydrophobic pattern layer may have an embossed pattern.

In embodiments, the hydrophobic pattern layer has a pattern width of 1 to 500 nm, and a spacing between pattern centers is 0.1 to 10 times the pattern width.

In one embodiment, the gas barrier film has a water vapor transmission rate of 0.08 g / m ² day or less.

In another embodiment, a hydrophilic pattern layer may be formed on the hydrophobic pattern layer. In embodiments, the hydrophilic pattern layer may have a surface energy of 70 mN / m to 100 mN / m, Si-based material.

In embodiments, the hydrophilic pattern layer may have an embossed pattern. Preferably, the hydrophilic pattern layer may be formed discontinuously.

In embodiments, the hydrophilic pattern layer has a pattern width of 0.1 to 1 mm, the spacing between the center of the pattern is 0.1 to 10 times the pattern width.

In another embodiment the gas barrier film has a water vapor transmission rate of 1 × 10 ⁻³ g / m ² day or less.

In another embodiment, at least one surface of the transparent base film, oxides, nitrides, containing at least one metal selected from the group consisting of Si, Al, In, Sn, Zn, Ti, Cu, Ce and Ta, An inorganic layer made of carbide, oxynitride, oxidized carbide, nitride, oxynitride carbide may be formed.

The transparent base film is polyethylene naphthalate, (meth) acrylate resin, polyester resin, styrene resin, transparent fluorine resin, polyimide resin, polyamide resin, polyetherimide resin, cellulose acylate Resin, polyurethane resin, polyether ether ketone resin, polycarbonate resin, alicyclic polyolefin resin, polyallylate resin, polyether sulfone resin, polysulfone resin, cycloolefin copolymer, fluorene ring modified polycarbonate resin, polyethylenyl Lean, alicyclic modified polycarbonate resin and the like can be used.

As the hydrophobic pattern layer, acrylic resin, perylene, melamine, or the like may be used.

As the hydrophilic pattern layer, SiO ₂ , SiO, TiO _2, or the like may be used.

Another aspect of the invention relates to a flexible display element. The flexible display element uses the flexible gas barrier film as a substrate.

Another aspect of the invention relates to a method for producing a flexible gas barrier film. The method includes coating or depositing a surface of the transparent base film with a polymer material having a surface energy of 1 mN / m to 40 mN / m to form a hydrophobic layer; And patterning the hydrophobic layer to form a hydrophobic pattern layer.

In embodiments, the method may further include patterning a hydrophilic layer having a surface energy of 70 mN / m to 100 mN / m on the hydrophobic pattern layer.

In embodiments, the method of patterning the hydrophobic layer may be patterned by UV imprint, photolithography, micro contact printing, inkjet printing, screen printing, or the like.

In embodiments, the method of patterning the hydrophilic layer may be patterned by a method such as electron beam deposition, sputtering, solution coating, thermal deposition, or printing using a mask.

The flexible gas barrier film of the present invention can dramatically lower the moisture permeability without increasing the manufacturing cost by controlling energy on the surface based on the existing barrier material, and excellent gas barrier performance, flexible display device, touch panel, solar cell And the gas barrier film which can be applied to various packaging materials and the like. In addition, the flexible gas barrier film may be used as a substrate to provide a flexible display device having excellent durability and reliability.

In addition, a flexible gas barrier film can be easily manufactured without adding a complicated process.

Flexible gas barrier film

In one embodiment the flexible gas barrier film of the present invention; And a hydrophobic pattern layer formed on the base film. In an embodiment, the water vapor transmission rate of the gas barrier film on which the hydrophobic pattern layer is formed may be 0.08 g / m ² day or less, preferably 0.065 g / m ² day or less.

In another embodiment, an inorganic layer may be further formed between the transparent base film and the hydrophobic pattern layer.

In another embodiment, inorganic layers are formed on both sides of the transparent base film, and a hydrophobic pattern layer may be formed on the inorganic layer.

In another embodiment, a hydrophilic pattern layer may be further formed on the hydrophobic pattern layer. The water vapor transmission rate of the gas barrier film in which both the hydrophobic pattern layer and the hydrophilic pattern layer are formed is 1 × 10 ^-3 g / m ² day or less, preferably 1 × 10 ^-4 g / m ² day or less, more preferably 1 × It may be up to 10 ^-5 g / m ² day.

Transparent base film

The transparent base film may be a flexible plastic film, there is no particular limitation on the material or thickness, and may be appropriately selected according to the purpose of use.

Specific examples include polyethylene naphthalate, (meth) acrylate resin, polyester resin, styrene resin, transparent fluorine resin, polyimide resin, polyamide resin, polyetherimide resin, cellulose acylate resin, Polyurethane resin, polyether ether ketone resin, polycarbonate resin, alicyclic polyolefin resin, polyalgal resin, polyether sulfone resin, polysulfone resin, cycloolefin copolymer, fluorene ring modified polycarbonate resin, polyethylene , Alicyclic modified polycarbonate resin, etc. may be used, and these may be used alone or in combination of two or more kinds.

When the transparent base film is used as a display substrate for an organic EL device or the like, the glass transition temperature (Tg) is 100 ° C or higher, preferably 150 ° C or higher, more preferably 200 ° C or higher, and most preferably 250 ° C or higher. A material may be selected, and a material having a total light transmittance of 80% or more, preferably 85% or more, more preferably 90% or more, may be applied. Specific examples include polyethylene naphthalate (PEN), polycarbonate (PC), alicyclic polyolefin, polyarylate, polyethersulfone (PES), polysulfone (PSF), cycloolefin copolymer (COC), polyimide, fluorene Ring modified polycarbonate (BCF-PC), alicyclic modified polycarbonate (IP-PC), acryloyl compound and the like can be used.

The thickness of the transparent base film may be selected according to the use, there is no particular limitation, but usually in the range of 1 to 1,000 ㎛. In embodiments, 10 to 300 μm may be applied. In other embodiments 100-400 μm may be used and in other embodiments 500-800 μm may be used.

Hydrophobic pattern layer

As the material used for the hydrophobic pattern layer, even before the pattern formation, the surface energy in the solid state is smaller than the surface tension of water, and basically a material having hydrophobicity is used.

In embodiments, the polymer has a surface energy of 45 mN / m or less, preferably 0.1 mN / m to 40 mN / m, more preferably 0.5 to 35 mN / m, and most preferably 1 to 30 mN / m after curing. Materials can be used.

In addition, the surface contact angle of DI water is 50 ° or more, preferably 70 to 135 °, the surface contact angle of Formamide is 65 ° or more, preferably 70 to 125 ° can be used.

In embodiments, the polymer material may be a solution process, and acrylic resin, perylene, melamine, and the like may be used.

FIG. 2 is one specific example of a flexible gas barrier film having a hydrophobic pattern layer 2 formed on a transparent base film. As shown in FIG. 2, in the hydrophobic pattern layer 2 of the present invention, a pattern is repeatedly formed on the transparent base film 1. Preferably the pattern has an embossed pattern. The shape of the pattern is not particularly limited, and may be a circular or polygonal (triangle, square, pentagon, octagon, etc.).

In the specific example, the hydrophobic pattern layer has a width w2 of less than 10 μm. If the above range is exceeded, it may be difficult to effectively block gas because it is larger than gas particles. The width w2 of the preferred pattern is 1 to 500 nm, more preferably 1 to 350 nm and most preferably 1 to 250 nm.

In addition, the distance d2 between the center of the pattern is 0.1 to 10 times, preferably 1 to 5 times, more preferably 1.2 to 3.5 times, and most preferably 1.5 to 2.5 times the pattern width w2. Gas blocking effect can be maximized in the above range.

The thickness of the hydrophobic pattern layer is not particularly limited, but is 100 to 3,000 nm, preferably 200 to 2,000 nm, more preferably 250 to 1500 nm.

As shown in FIG. 2, the hydrophobic pattern layer 2 of the present invention may have a continuous layer formed on a surface thereof in contact with the transparent base film 1, and a discontinuous pattern may be formed on the opposite side thereof.

The height of the pattern itself is not particularly limited, and may be 50 to 2,500 nm, preferably 100 to 1,500 nm, more preferably 150 to 1,000 nm. In an embodiment 200-500 nm.

As such, when the pattern is formed on the hydrophobic layer, the moisture repelling force may be increased to lower the surface energy by 75-99% or more, thereby lowering the moisture permeability significantly. In embodiments, the surface energy of the patterned hydrophobic layer is 15 mN / m or less, preferably 0.01 mN / m to 10 mN / m, more preferably 0.1 to 7.5 mN / m. In addition, the surface contact angle of DI water is 100 ° or more, preferably 110 to 140 °, the surface contact angle of Formamide is 90 ° or more, preferably 100 to 130 °.

The method of forming the hydrophobic pattern layer is not particularly limited. Considering the normal temperature process, the invariance of the pattern after the process, the chemical invariance, and the like, it may include methods of forming a pattern using the ultraviolet, in particular, ultraviolet imprint, photo lithography and the like can be used.

Hydrophilic Pattern Layer

In another embodiment of the present invention, a hydrophilic pattern layer may be further formed on the hydrophobic pattern layer.

As the material used for the hydrophilic pattern layer, a surface energy in a solid state is greater than the surface tension of water, and a material having a hydrophilic nature may be used.

In an embodiment an inorganic material, preferably Si-based material, having a surface energy of at least 60 mN / m, preferably 65 mN / m to 120 mN / m, more preferably 70 mN / m to 100 mN / m, is used. Can be.

In addition, a surface contact angle of DI water is 15 ° or less, preferably 0.01 to 7 °, and a surface contact angle of Formamide is 10 ° or less, preferably 0.01 to 7 °.

In specific embodiments, the hydrophilic pattern layer may be SiO ₂ , SiO, TiO _2, or the like.

FIG. 3 is one specific example of the flexible gas barrier film in which the hydrophilic pattern layer 3 is formed on the hydrophobic pattern layer 2. As shown in FIG. 3, the hydrophilic pattern layer 3 of the present invention is formed in a repeating pattern on the hydrophobic pattern layer 2. Preferably the pattern has an embossed pattern. The shape of the pattern is not particularly limited, and may be a circular or polygonal (triangle, square, pentagon, octagon, etc.). Preferably, the hydrophilic pattern layer may be formed discontinuously. The term "discontinuity" here means a state that is not connected to each other.

In a specific embodiment, the hydrophilic pattern layer has a width w3 of less than 10 μm. If the above range is exceeded, it may be difficult to effectively block gas because it is larger than gas particles. The width w3 of the preferred pattern is 0.05 to 2 mm, preferably 0.1 to 1 mm, more preferably 0.2 to 0.7 mm, most preferably 0.3 to 0.6 mm. It is possible to exhibit an excellent gas barrier effect in the above range.

In addition, the distance d3 between the center of the pattern is 0.1 to 10 times, preferably 1 to 5 times, more preferably 1.2 to 3.5 times, and most preferably 1.5 to 2.5 times the pattern width w3. Gas blocking effect can be maximized in the above range.

The thickness of the hydrophilic pattern layer is not particularly limited, but is 100 to 2,000 nm, preferably 200 to 1,000 nm, more preferably 250 to 700 nm, most preferably 300 to 600 nm.

As such, when the pattern is formed on the hydrophilic layer, the hydrophilicity is increased, and the surface energy can be further increased. In addition, by forming a hydrophilic pattern layer on the hydrophobic pattern layer, water is discharged from the hydrophobic surface to the outer hydrophilic region, the gas or moisture can be absorbed to significantly lower the moisture permeability of the film.

The method of forming the hydrophilic pattern layer is not particularly limited. In consideration of room temperature process, pattern invariant, chemical invariant, selected material properties, pattern size, shadow mask process can be included, and solution coating such as vacuum deposition method such as e-beam deposition using mask, sputtering and printing Law can be used.

Inorganic layer

In the present invention, an inorganic layer may be further formed on at least one surface of the transparent base film. 4 is a specific example of the flexible gas barrier film in which the inorganic layer 4 is formed between the hydrophobic pattern layer 2 and the transparent base film 1.

In another embodiment, an inorganic layer may be formed on both sides of the transparent base film, and a hydrophobic pattern layer may be formed on the inorganic layer.

In another specific example, two or more inorganic layers of different components may be laminated.

The inorganic layer is an oxide, nitride, carbide, oxynitride, oxidized carbide, nitride carbide or oxide containing at least one metal selected from the group consisting of Si, Al, In, Sn, Zn, Ti, Cu, Ce and Ta. Nitride carbide may be used, but is not necessarily limited thereto.

The method of forming the inorganic layer can be formed by a conventional method, and can be easily carried out by those skilled in the art to which the present invention pertains. In embodiments, a coating method, a sputtering method, a vacuum deposition method, an ion plating method, a plasma CVD method, or the like may be used, but is not necessarily limited thereto.

The thickness of the inorganic layer is not particularly limited, but is in the range of 1 to 1,000 nm, preferably 10 to 500 nm, more preferably 50 to 350 nm.

Manufacturing Method of Flexible Gas Barrier Film

Another aspect of the invention relates to a method for producing a flexible gas barrier film. The method includes coating or depositing a surface of the transparent base film with a polymer material having a surface energy of 1 mN / m to 40 mN / m to form a hydrophobic layer; And patterning the hydrophobic layer to form a hydrophobic pattern layer.

In embodiments, the hydrophobic layer may be formed by drop casting and curing the polymer material. The hydrophobic layer formed as described above forms a continuous layer on the surface of the transparent base film, and may form a hydrophobic pattern layer by patterning the hydrophobic layer.

The method of patterning the hydrophobic layer may include a low temperature process, a three-dimensional pattern capable process, a solution process, and the like. Preferably, the patterning may be performed by ultraviolet imprint, photolithography, micro contact printing, inkjet printing, screen printing, or the like.

In an embodiment, the method may further include forming an inorganic layer on the surface of the transparent base film before forming the hydrophobic layer. The inorganic layer may be formed on one or both surfaces of the transparent base film.

The method may further include patterning a hydrophilic layer having a surface energy of 70 mN / m to 100 mN / m on the hydrophobic pattern layer.

In embodiments, the method of patterning the hydrophilic layer may be patterned by a method such as electron beam deposition, sputtering, solution coating, thermal deposition, or printing using a mask. The hydrophilic pattern layer may be formed discontinuously on the hydrophobic pattern layer.

Flexible display elements

Another aspect of the invention relates to a flexible display element. The flexible display element uses the flexible gas barrier film of the present invention as a substrate. The flexible display device applicable to the present invention may be used as a transparent electrode substrate, an upper substrate of an LCD element, a substrate of an organic EL element, a substrate for a thin film transistor (TFT) image display element, and the like.

In addition, the flexible gas barrier film of the present invention may be used as a sealing film of a touch panel or a solar cell device.

The invention can be better understood by the following examples, which are intended for the purpose of illustration of the invention and are not intended to limit the scope of protection defined by the appended claims.

Example 1

A 200 nm thick Polyethersulfone (PES) substrate (glass transition temperature of 223 ° C, manufactured by i-Components Co., Ltd.) was subjected to electron beam deposition of 300 nm thick Al ₂ O ₃ (purity: 99.99%) as a gas barrier. cure 984-LVF (manufactured by DYMAX Co.) was coated with a 1 μm thickness by UV curing after drop casting to form a hydrophobic layer. The UV curing time is 1 minute and the UV curing equipment is Daeho Glue Tech. It is CURE ZONE HO2 of Co., Ltd. and used the power of 120 mW / cm at 365 nm wavelength. The surface energy of the hydrophobic surface was 25.8 mN / m, the surface contact angle of DI water was 79.8 °, and the surface contact angle of Formamide was 72.8 °. Before the hydrophobic layer formed above was cured by contacting the patterned polydimethysiloxane (PDMS) with 400 nm size 700 nm intervals, UV curing was performed by the method described above, and the film and PDMS were separated after curing. The surface energy of the patterned hydrophobic layer after hydrophobic patterning was 7.29 mN / m, the surface contact angle was 122.6 ° for DI water, and the surface contact angle was 110.2 ° for Formamide. The water vapor transmission rate of the produced film was 0.0624 g / m ² day. The patterning process is shown in FIG. 5, and a schematic diagram of the flexible gas barrier film on which the hydrophobic pattern layer is formed is shown in FIG. 6.

Example 2

The same procedure as in Example 1 was carried out except that Al ₂ O ₃ (purity: 99.99%) was deposited on both sides of a polyethersulfone (PES) substrate at a thickness of 300 nm. The water vapor transmission rate of the produced film was 0.00208 g / m ² day.

Example 3

SiO2 (99.99%) on the hydrophobic pattern layer was carried out in the same manner as in Example 2 except that the electron beam deposition to a 450 nm thickness using a stainless shadow mask. At this time, the size of Dot was 0.5 mm and the distance between centers was 1 mm. The surface energy of the hydrophilic pattern layer was 73.12 mN / m, and the surface contact angles of DI water and Formamide were less than 5 °. The water vapor transmission rate of the produced film was 0.000534 g / m ² day. The patterning process is shown in FIG. 7, and the schematic diagram of the flexible gas barrier film in which the hydrophilic pattern layer was formed is shown in FIG. Moisture permeability according to time of Example 2 and Example 3 was compared in FIG.

Comparative Example 1

Multi-cure 984-LVF (manufactured by DYMAX Co.) The same procedure as in Example 1 except that the hydrophobic layer was not patterned. The water vapor transmission rate of the produced film was 0.306 g / m ² day. Moisture permeability according to time of Example 1 and Comparative Example 1 was compared in FIG.

Comparative Example 2

Multi-cure 984-LVF (manufactured by DYMAX Co.) was the same as in Example 2 except that the hydrophobic layer was not patterned. The water vapor transmission rate of the produced film was 0.0098 g / m ² day.

Comparative Example 3

The hydrophobic layer was carried out in the same manner as in Comparative Example 1 except that the surface of the hydrophobic layer was further hydrophobized by plasma treatment with CF4 gas. The hydrophobic effect by surface treatment was not sustained.

rescue Moisture permeability (g / m ² day) Example 1 PES (200 μm) / Al2O3 (300 nm) / hydrophobic pattern layer 0.0624 Example 2 Al2O3 (300 nm) / PES (200 μm) / Al2O3 (300 nm) / hydrophobic pattern layer 0.00208 Example 3 Al2O3 (300 nm) / PES (200 μm) / Al2O3 (300 nm) / hydrophobic pattern layer / hydrophilic pattern layer (450 nm) 0.000534 Comparative Example 1 PES (200 μm) / Al2O3 (300 nm) / hydrophobic layer (1 μm) 0.306 Comparative Example 2 Al2O3 (300 nm) / PES (200 μm) / Al2O3 (300 nm) / hydrophobic layer (1 μm) 0.0098 Comparative Example 3 PES (200 μm) / Al2O3 (300 nm) / plasma treated hydrophobic layer (1 μm) -

As shown in Table 1, in the case of Example 1 in which the hydrophobic pattern layer is formed, it can be seen that the gas barrier properties are remarkably superior to Comparative Example 1, which is not patterned. This can be seen that even in Example 2 and Comparative Example 2, the water vapor transmission rate is significantly lowered when the hydrophobic layer is patterned. In addition, in the case of Example 3 in which the hydrophilic pattern layer is formed, it can be seen that the gas barrier effect is better than that in the case of forming only the hydrophobic pattern layer. On the other hand, the hydrophobic effect was not sustained when the hydrophobic layer was increased by plasma treatment.

Simple modifications and variations of the present invention can be easily made by those skilled in the art, and all such modifications or changes can be seen to be included in the scope of the present invention.

1 illustrates a structure in which a hydrophobic layer is formed on a transparent base film.

2 is a schematic cross-sectional view of a flexible gas barrier film having a hydrophobic pattern layer formed on a transparent base film.

3 is a schematic cross-sectional view of a flexible gas barrier film having a hydrophilic pattern layer formed on a hydrophobic pattern layer.

4 is one specific example of a flexible gas barrier film having an inorganic layer formed between a hydrophobic pattern layer and a transparent base film.

5 shows a step of forming a hydrophobic pattern layer of Example 1. FIG.

It is a schematic diagram of the flexible gas barrier film in which the hydrophobic pattern layer of Example 1 was formed.

FIG. 7 shows a step of forming a hydrophilic pattern layer of Example 3. FIG.

It is a schematic diagram of the flexible gas barrier film in which the hydrophilic pattern layer of Example 3 was formed.

9 is a graph comparing moisture permeability according to time of Example 1 and Comparative Example 1.

10 is a graph comparing moisture permeability according to time of Example 2 and Example 3.

* Description of the symbols for the main parts of the drawings *

1: transparent base film 2: hydrophobic pattern layer

3: hydrophilic pattern layer 4: inorganic layer

Claims (20)

Transparent base film; And A hydrophobic pattern layer formed on the base film; Flexible gas barrier film comprising a. The flexible gas barrier film of claim 1, wherein the hydrophobic pattern layer is a polymer material having a surface energy of 1 mN / m to 40 mN / m. The flexible gas barrier film of claim 1, wherein the hydrophobic pattern layer is an embossed pattern. The flexible gas barrier film of claim 3, wherein the hydrophobic pattern layer has a pattern width of 1 to 500 nm, and a spacing between pattern centers is 0.1 to 10 times the pattern width. The flexible gas barrier film of claim 1, wherein a water vapor transmission rate of the gas barrier film is 0.08 g / m ² day or less. The flexible gas barrier film of claim 1, wherein a hydrophilic pattern layer is formed on the hydrophobic pattern layer. The flexible gas barrier film of claim 6, wherein the hydrophilic pattern layer is a Si-based material having a surface energy of 70 mN / m to 100 mN / m. The flexible gas barrier film of claim 6, wherein the hydrophilic pattern layer is an embossed pattern. The flexible gas barrier film of claim 8, wherein the hydrophilic pattern layer is formed discontinuously. The flexible gas barrier film of claim 8, wherein the hydrophilic pattern layer has a pattern width of 0.1 to 1 mm, and a spacing between pattern centers is 0.1 to 10 times the pattern width. 7. The flexible gas barrier film according to claim 6, wherein the gas barrier film has a water vapor transmission rate of 1 × 10 ⁻³ g / m ² day or less. According to claim 1, At least one surface of the transparent substrate film, oxides, nitrides, containing at least one metal selected from the group consisting of Si, Al, In, Sn, Zn, Ti, Cu, Ce and Ta, A flexible gas barrier film, characterized in that an inorganic layer consisting of carbide, oxynitride, oxidized carbide, nitride, oxynitride carbide is formed. The method of claim 1, wherein the transparent base film is polyethylene naphthalate, (meth) acrylate resin, polyester resin, styrene resin, transparent fluorine resin, polyimide resin, polyamide resin, polyetherimide Resin, cellulose acylate resin, polyurethane resin, polyether ether ketone resin, polycarbonate resin, alicyclic polyolefin resin, polyallylate resin, polyether sulfone resin, polysulfone resin, cycloolefin copolymer, fluorene ring modified Flexible gas barrier film, characterized in that at least one selected from the group consisting of polycarbonate resin, polyethylene and alicyclic modified polycarbonate resin. The flexible gas barrier film of claim 2, wherein the hydrophobic pattern layer is selected from the group consisting of acrylic resin, perylene, and melamine. The flexible gas barrier film of claim 6, wherein the hydrophilic pattern layer is selected from the group consisting of SiO ₂ , SiO, and TiO ₂ . The flexible display element which used the flexible gas barrier film of any one of Claims 1-14 as a board | substrate. Coating or depositing a surface of the transparent base film with a polymer material having a surface energy of 1 mN / m to 40 mN / m to form a hydrophobic layer; And Patterning the hydrophobic layer to form a hydrophobic pattern layer; Method for producing a flexible gas barrier film comprising the step of. 18. The method of claim 17, further comprising patterning a hydrophilic layer having a surface energy of 70 mN / m to 100 mN / m on the hydrophobic pattern layer. 18. The method of claim 17, wherein the method of patterning the hydrophobic layer is patterned by ultraviolet imprint, photolithography, micro contact printing, inkjet printing or screen printing. 19. The method of claim 18, wherein the method for patterning the hydrophilic layer is characterized by patterning by electron beam deposition, sputtering, solution coating, thermal deposition or printing using a mask.

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