KR20110020043A - Cooling system for a junction apparatus by using a thermoelectric module - Google Patents

Abstract

PURPOSE: An air cooling system for a fusing machine using a thermoelectric semiconductor is provided to improve the cooling efficiency by directly spraying cooling air to a fusing machine. CONSTITUTION: An air cooling system for a fusing machine comprises a plurality of tubes(20), an air inlet, an air outlet, a thermoelectric semiconductor unit(30), a heat insulating unit(50), a power supply unit(40), a first case(10), and a second case(60). A cooling fin(21) is inserted in the tubes. The air inlet and the air outlet are respectively arranged on the upper and lower sides of the tubes. The thermoelectric semiconductor unit is connected to the tubes and transfers cooling heat. The heat insulating unit is formed on the rear side of the thermoelectric semiconductor unit. The power supply unit controls the temperature of the thermoelectric semiconductor unit and supplies power to the thermoelectric semiconductor unit. The first case accommodates the tubes, the thermoelectric semiconductor unit, and the power supply unit. The second case is formed in the rear side of the first case and accommodates the heat insulating unit.

Description

Cooling System For A junction apparatus By Using A Thermoelectric Module}

The present invention relates to a splicer air cooler, and more particularly, to a splicer air cooler capable of increasing the cooling effect by reducing the heat source of the splicer using a thermoelectric semiconductor and reducing the air consumption and cooling noise.

In general, for cooling the heat source of the automobile fusion machine, a vortex tube is used.

The vortex tube is an energy separation device that separates low-temperature air and high-temperature air from compressed air (3 ~ 10kg / ㎠) without chemical or combustion without using electricity or chemicals, and is a cooling device for cooling various kinds of superheated machines. It is used a lot.

1 shows a cooling device using a vortex tube.

As shown in FIG. 1, the vortex tube 300 is first compressed air into the rotary chamber 303 in the cylindrical body portion 302 through the air inlet 301 connected to the compressed air injection pipe. When supplied, the vortex rotation guide groove 305 of the rotating body 304 is primarily guided to rotate at a very high speed.

The rotated air moves along the tangential direction of the moving space 306 to form primary vortex air (heated air), and the primary vortex air is located at the point of the spindle 308 of the control valve 307. As early as some pass through the spindle 308 and is discharged through the warmth discharge groove 311, the remaining part of the primary vortex air is returned to form a secondary vortex air (cooling air), where the secondary The vortex air stream is positioned inward of the primary vortex air stream so that it loses heat as it passes through a low pressure region and is cooled and diverted outward through a coupler 310 coupled to the tip of the nozzle socket 309. .

However, the compressed air injected along the rotation guide groove 305 is changed to a vortex air that rotates at a high speed to lose the rotational force by the friction force during the process of moving to the moving space 306 of the body portion 302 As the refractory injection into the body portion 302 in a state, the air having a temperature opposite to the intended air to the warm air discharge groove 311 and the nozzle socket 309 in a state where the separation of the cold and warm air is not made smoothly As a result of being mixed together and discharged together, a problem arises in that suitable cold or warm air required in the workplace cannot be used.

In addition, the cooling of the fusion equipment using the vortex tube has a problem that the cooling efficiency is low due to excessive air consumption, noise occurs.

Therefore, it is necessary to improve the cooling apparatus of the fusion machine so as to shorten the operation time of the fusion equipments and to improve the working environment and quality of the operator.

The present invention has been made to solve such a problem, and an object of the present invention is to provide a fusion machine air cooling apparatus that can improve the cooling efficiency and reduce the cooling noise.

Specifically, the present invention is to provide a fusion machine air cooling apparatus that can improve the cooling efficiency by using a thermoelectric semiconductor by avoiding the cooling method using a conventional vortex tube.

A fusion machine air cooling apparatus provided with a fusion machine of the present invention for achieving the above object, and formed to be connected to the automotive fusion equipment including an air tank,

A plurality of tubes in which cooling fins are inserted; Air inlets and air outlets respectively disposed above and below the different tubes); A thermoelectric semiconductor portion connected to the tube to transfer cooling heat; An insulation portion formed at a rear end of the thermoelectric semiconductor portion; A power supply unit for temperature control and power supply to the thermoelectric semiconductor unit; A first case including the tube, the thermoelectric semiconductor unit 30, and a power supply unit; And a second case formed on a rear surface of the first case and including the heat insulating part.

A tube holder formed in the first case to fix the tube; A cooling fin formed to be inserted into the tube; A cover formed at the top of the tube; And an air hose connecting the plurality of tubes to each other.

The thermoelectric semiconductor unit is connected to the cooling fins, characterized in that a cooling conductor, a cooling plate, and a thermoelectric semiconductor are combined.

The heat insulating part, the heat insulating material coupled to the back of the first case; A heat sink coated with thermal grease; Screws for fixing the heat sink to the heat insulating material; And a cooling fan fixed to the heat sink.

The screw, flat washer; And heat insulating material for preventing heat transfer to the cooling plate.

The cooling fan is for lowering the heat of the heat sink, characterized in that formed in plural,

The air tank unit is characterized in that for supplying compressed air to the air inlet,

Cooling air through the air outlet is characterized in that it is radiated to the fusion splicer through a hose connected to the fusion facility,

The air tank unit relates to a thermoelectric semiconductor fusion splicer air cooler, characterized in that formed on the lower end of the welding device for the automobile.

As described above, the present invention has a technical advantage in that the heat source of the fusion machine can be cooled more effectively by using a thermoelectric semiconductor element.

In addition, the present invention has a technical advantage in that the cooling efficiency is improved by directly injecting the cooling air discharged from the air cooling apparatus to the fusion machine.

In addition, the present invention has a technical advantage in that it can improve the working environment by reducing the noise generated when cooling the fusion machine in the prior art.

In addition, the present invention has a technical advantage in that it reduces the air consumption to reduce the weight and utility operating cost of equipment.

The foregoing description relates to specific embodiments and can be easily understood by those of ordinary skill in the art that various modifications and changes can be made without departing from the spirit and scope of the invention as indicated by the claims. Could be.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 2 shows a perspective view of a thermoelectric semiconductor fusion splicer cooling apparatus according to the present invention, Figure 3 shows a cross-sectional view of the thermoelectric semiconductor fusion splicer air cooling apparatus according to the present invention.

The technical feature of the present invention is that in order to cool the fusion splicer of the automobile, the introduced compressed air uses a thermoelectric semiconductor. Cooling apparatus using a thermoelectric semiconductor as in the present invention has a technical feature in that the cooling efficiency is high, the noise generation is less.

In the thermoelectric semiconductor according to the present invention, when two types of conductors are joined to each other and a current flows through both ends, endothermic heat occurs on one side and heat generation occurs on the other side. By this principle, cold air is generated on the surface in contact with the cooling plate, and heat is released on the surface in contact with the heat sink. Therefore, the cold air and hot air are conducted to the cooling plate 32 and the heat sink 52 which are in contact with the thermoelectric semiconductor 33, and are discharged to the outside.

The thermoelectric semiconductor fusion splicer air cooling apparatus 100 according to the present invention includes a plurality of tubes 20 having a cooling fin inserted therein, a thermoelectric semiconductor portion 30 connected to the tube to transmit cooling heat, and the thermoelectric semiconductor portion. The air inlet 23 and the air outlet 25 and the cooling device disposed at the upper side and the lower side of the heat insulating part 50 and the tube 20 formed at the rear end of the 30 for temperature control and power supply, respectively. It is configured to include a power supply 40.

Figure 4 shows an exploded view of the thermoelectric semiconductor fusion splicer air cooling apparatus according to the present invention.

As shown in FIG. 4, the first case 10 includes a tube 20 and a thermoelectric semiconductor portion 30, and the second case 60 includes a heat insulating portion 50.

The tube holder 11 is fixed in the first case 10, and the tube 20 can be conveniently fixed by inserting the tube 20 into the tube holder 11.

The tube 20 is formed integrally by inserting a cooling fin 21, the cooling fin 21 is formed of a corrugated shape made to widen the surface area in order to increase the cooling effect.

In addition, the upper end of the cooling fin 21 includes a tube cover 22 to seal it.

In addition, a plurality of tubes 20 are formed, and the air hoses 24 are connected between the tubes so that the compressed air can be moved stepwise to the tubes.

 In one embodiment of the present invention, the three thermotubes in the thermo-conductor fusion splicer air cooler provided with a tube 20, the air inlet 23 and the air outlet 25 are respectively disposed on the upper and lower sides of the different tubes. It includes.

That is, the compressed air introduced through the air inlet 23 formed on the upper side of the first tube is moved to the second tube along the air hose 24 connected to the lower end, and the air cooled second in the second tube is the second tube. It is moved to the 3rd tube along with the air hose 24 formed in the upper side, and is cooled 3rd. The cooled air is discharged through the air outlet 25 formed at the lower end of the third tube to be supplied to the heat source portion of the fusion machine 210.

The thermoconductor portion 30 of the thermoconductor type fusion splicer air cooling apparatus according to the present invention is connected to the tube 20 to transmit cooling heat, and the cooling conductor 31 and the cooling plate on the outer surface of the tube 20. The 32 and the thermoelectric semiconductor 33 are laminated | stacked and comprised.

At this time, a hole is formed at the rear end of the first case 10 in which the thermoelectric semiconductor 33 is in contact with each other, so that the thermoelectric semiconductor 33 may be coupled to the heat insulating part to be described later.

The thermoelectric semiconductor 33 is made of an insulating material using a copolymer of a flexible resin having high flexibility and high thermal conductivity and a high thermal conductivity resin to cope with thermal expansion, and is coated with an electrical insulating film, and formed between an N-type metal substrate and the two metal plates. The semiconductor chip and the P-type semiconductor chip can be arranged in an arrangement. In addition, a temperature sensor may be further included to maintain the cooling temperature at a constant temperature.

In addition, the cooling plate 32 is in close contact with the thermoconductor 33, and is characterized in that the material is composed of excellent thermal conductivity to prevent heat loss.

In addition, the power supply unit 40 is provided inside the first case 10 to supply power of 0V to 16V to the thermoelectric semiconductor to supply energy for temperature control. According to the present invention, the power supply unit 40 may be formed in the first case 10 so as not to occupy unnecessary space and add mobility.

On the other hand, the second case 60 is formed with a heat insulating part 50, the heat insulating part 50 is a heat insulating material 51 coupled to the back of the first case, the heat sink 52 coated with thermal grease, And a screw 53 for fixing the heat sink 52 to the heat insulating material 51, and a cooling fan 54 fixed to the heat sink 52.

The heat insulating part 50 stacks the heat insulating material 51 on the rear surface of the first case and couples a heat sink 52 coated with thermal grease to the heat insulating material 51. The heat insulating material 51 is thermally insulated between the thermoelectric semiconductor portion 30 and the heat insulating portion 50 to improve thermal efficiency.

In order to use the cooling air generated by using the thermoelectric semiconductor as in the present invention, the cooling fan 54 is additionally formed because the heat of the hot heat generating portion must be discharged quickly. The cooling fan 54 is configured to absorb / release external heat to increase heat exchange efficiency of the heat sink.

On the other hand, the present invention uses a screw 53 including the heat insulating material to couple the heat sink to the heat insulating material. The screw 53 may prevent heat from being transferred to the cooling plate 32 by including a heat insulating material and a flat washer at the top of the screw.

The present invention is formed to include all the components in the first and second cases, it can be fixed fixed to the conventional fusion splicer cooling facility. It is also possible to recycle and use the modular cooling device.

5 is a description of the driving of the thermoelectric semiconductor fusion splicer air cooling apparatus according to the present invention.

The thermoelectric semiconductor fusion splicer air cooling apparatus 100 according to the present invention is formed on the top of the fusion facility to radiate cooling air to the fusion machine 210, but is formed to further include an air tank 220 at the bottom of the fusion facility. .

Compressed air of the air tank 220 is introduced into the air inlet 23, the air cooled by the action of the thermoelectric semiconductor is discharged through the air outlet 25, the discharged cooling air is the fusion machine ( 210 is sprayed directly on.

When the power (1 ~ 16V) is applied from the power supply unit 40, the temperature of the cooling plate 21 of the thermoelectric semiconductor is lowered and the temperature of the heat sink 52 is increased. That is, when power is supplied to the thermoelectric semiconductor, cold air is generated on one side of the thermoelectric semiconductor, and heat is generated on the other side.

The cold air generated by the thermoelectric semiconductor is conducted to the cooling plate 32 and is transferred to the cooling fin 21 formed inside the tube via the cooling conductor 31 so that the air in the tube is further cooled. Cooling air moved through the air hose 24 formed between the tubes is discharged through the air outlet 25.

Heat is generated on the opposite surface where the cold air of the thermoelectric semiconductor is generated, and the heat generated by the heat insulating part 50 is conducted to the heat dissipating plate 52 which is in contact, and radiated to the cooling fan 54. At this time, the radiating heat is sent to the front by rotating the cooling fan 54 to reflux.

On the other hand, the thermoelectric semiconductor is proportional to the cooling of heat generated in the heat sink 52 and the cooling amount generated in the cooling plate 32. That is, since the cooling temperature is lowered according to the cooling of the heat generating unit, in order to maximize the cooling efficiency, the heat generated by operating the cooling fan 54 attached to the heat sink 52 is cooled. In one embodiment of the present invention, six cooling fans are installed.

The thermoelectric semiconductor fusion splicer air cooler as described above has a technical advantage in that the cooling noise can be reduced, and the air consumption can be reduced, while the splicer can be cooled quickly.

1 is a fusion splicer cooling apparatus according to the prior art.

Figure 2 is a perspective view of a thermoelectric semiconductor fusion splicer air cooling apparatus according to the present invention.

Figure 3 is a cross-sectional view of the thermoelectric semiconductor fusion splicer air cooling apparatus according to the present invention.

Figure 4 is an exploded view of the thermoelectric semiconductor fusion splicer air cooling apparatus according to the present invention.

Figure 5 is a front view of the thermoelectric semiconductor type fusion machine air cooling apparatus installed in the fusion splicer according to the present invention.

* Drawing symbol *

100: thermoelectric semiconductor fusion splicer air cooler

10: first case 11: tube holder

20 tube 21 cooling fin 22 cover

23: air inlet 24: air hose 25: air outlet

30: thermoelectric semiconductor portion 31: cooling conductor 32: cooling plate

33: thermoelectric semiconductor 40: power supply

60: second case

50: heat insulating part 51: heat insulating material 52: heat sink

53: screw 54: cooling fan

200: fusion equipment 210: fusion machine 220: air tank

Claims (9)

A fusion machine air cooler 100 having a fusion machine 210 and formed to be connected to an automobile fusion welding facility 200 including an air tank unit 220, A plurality of tubes 20 in which cooling fins 21 are inserted; An air inlet 23 and an air outlet 25 respectively disposed above and below the different tubes 20; A thermoelectric semiconductor unit 30 connected to the tube 20 to transfer cooling heat; A heat insulation part 50 formed at a rear end of the thermoelectric semiconductor part 30; A power supply unit 40 for temperature control and power supply to the thermoelectric semiconductor unit 30; A first case 10 including the tube 20, the thermoelectric semiconductor unit 30, and the power supply unit 40; And a second case (60) formed on a rear surface of the first case (10) and including the heat insulating part (50). The method of claim 1, A tube holder formed in the first case 10 to fix the tube 20; Cooling fins 21 are inserted into the tube 20; A cover 22 formed at an upper end of the tube; And And a plurality of air hoses (24) connecting the plurality of tubes (20) to each other. The method of claim 1, The thermoelectric semiconductor unit 30, Is connected to the cooling fins 21, the cooling conductor 31, the cooling plate 32, and the thermoelectric semiconductor fusion splicer air cooler, characterized in that the heat conductor 33 is combined. The method of claim 1, The heat insulation part 50, Insulation material (51) coupled to the back of the first case (10); A heat sink 52 coated with thermal grease; Screw 53 for fixing the heat sink 52 to the heat insulating material (51); And a cooling fan (54) fixed to the heat dissipation plate (52). The method of claim 4, wherein The screw 53 is, Flat washer; Thermoelectric semiconductor fusion splicer air cooler comprising a; heat insulating material for preventing heat transfer to the cooling plate (32). The method of claim 4, wherein The cooling fan 54 is, To reduce the heat of the heat dissipation plate 52, a thermoelectric semiconductor type fusion splicer air cooler, characterized in that a plurality is formed. The method of claim 1, The air tank unit 220 is a thermoelectric semiconductor fusion splicer air cooling device, characterized in that for supplying compressed air to the air inlet (23). The method of claim 1, Cooling air coming out through the air outlet 25 is radiated to the fusion splicer 210 through a hose connected to the fusion device 200, characterized in that the thermo-conductor fusion splicer air cooler. The method of claim 1, The air tank unit 220 is a thermoelectric semiconductor fusion splicer air cooler, characterized in that formed on the lower end of the automotive welding equipment 200.

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