KR20110018642A - 와이어쏘 - Google Patents

와이어쏘 Download PDF

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Publication number
KR20110018642A
KR20110018642A KR1020090076216A KR20090076216A KR20110018642A KR 20110018642 A KR20110018642 A KR 20110018642A KR 1020090076216 A KR1020090076216 A KR 1020090076216A KR 20090076216 A KR20090076216 A KR 20090076216A KR 20110018642 A KR20110018642 A KR 20110018642A
Authority
KR
South Korea
Prior art keywords
ultra
lip
coating layer
core wire
wire
Prior art date
Application number
KR1020090076216A
Other languages
English (en)
Korean (ko)
Inventor
류민호
이형윤
정용화
Original Assignee
일진다이아몬드(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 일진다이아몬드(주) filed Critical 일진다이아몬드(주)
Priority to KR1020090076216A priority Critical patent/KR20110018642A/ko
Priority to JP2012522752A priority patent/JP2013500170A/ja
Priority to PCT/KR2010/004752 priority patent/WO2011021784A2/ko
Publication of KR20110018642A publication Critical patent/KR20110018642A/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B23D61/185—Saw wires; Saw cables; Twisted saw strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P5/00—Setting gems or the like on metal parts, e.g. diamonds on tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020090076216A 2009-08-18 2009-08-18 와이어쏘 KR20110018642A (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020090076216A KR20110018642A (ko) 2009-08-18 2009-08-18 와이어쏘
JP2012522752A JP2013500170A (ja) 2009-08-18 2010-07-21 ワイヤーソー
PCT/KR2010/004752 WO2011021784A2 (ko) 2009-08-18 2010-07-21 와이어쏘

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090076216A KR20110018642A (ko) 2009-08-18 2009-08-18 와이어쏘

Publications (1)

Publication Number Publication Date
KR20110018642A true KR20110018642A (ko) 2011-02-24

Family

ID=43607429

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090076216A KR20110018642A (ko) 2009-08-18 2009-08-18 와이어쏘

Country Status (3)

Country Link
JP (1) JP2013500170A (ja)
KR (1) KR20110018642A (ja)
WO (1) WO2011021784A2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012138063A3 (ko) * 2011-04-05 2013-03-07 이화다이아몬드공업(주) 비전도성 물질의 패터닝 처리 방식을 이용한 전착 다이아몬드 와이어 쏘우 및 그 제조 방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004050301A (ja) * 2002-07-16 2004-02-19 Noritake Co Ltd ワイヤーソーおよびその製造方法
US6915796B2 (en) * 2002-09-24 2005-07-12 Chien-Min Sung Superabrasive wire saw and associated methods of manufacture
JP4139810B2 (ja) * 2004-12-28 2008-08-27 旭ダイヤモンド工業株式会社 電着ワイヤ工具
JP2007307669A (ja) * 2006-05-19 2007-11-29 Asahi Diamond Industrial Co Ltd ワイヤ放電加工機およびワイヤ放電加工方法
JP2008221406A (ja) * 2007-03-13 2008-09-25 Nakamura Choko:Kk 固定砥粒式ワイヤーソー及びその製造方法
JP5066508B2 (ja) * 2008-11-19 2012-11-07 株式会社リード 固定砥粒ワイヤーソー
JP5078949B2 (ja) * 2009-07-10 2012-11-21 株式会社ノリタケカンパニーリミテド 固定砥粒ワイヤ及び固定砥粒ワイヤ製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012138063A3 (ko) * 2011-04-05 2013-03-07 이화다이아몬드공업(주) 비전도성 물질의 패터닝 처리 방식을 이용한 전착 다이아몬드 와이어 쏘우 및 그 제조 방법
CN103476972A (zh) * 2011-04-05 2013-12-25 二和金刚石工业株式会社 用于使用图案化的不导电材料来制造电镀金刚石线锯的方法
US9776306B2 (en) 2011-04-05 2017-10-03 Ehwa Diamond Industrial Co., Ltd. Method for manufacturing an electrodeposited diamond wire saw using patterned non-conductive materials

Also Published As

Publication number Publication date
WO2011021784A3 (ko) 2011-04-14
JP2013500170A (ja) 2013-01-07
WO2011021784A2 (ko) 2011-02-24

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