KR20110018642A - Wire saw - Google Patents
Wire saw Download PDFInfo
- Publication number
- KR20110018642A KR20110018642A KR1020090076216A KR20090076216A KR20110018642A KR 20110018642 A KR20110018642 A KR 20110018642A KR 1020090076216 A KR1020090076216 A KR 1020090076216A KR 20090076216 A KR20090076216 A KR 20090076216A KR 20110018642 A KR20110018642 A KR 20110018642A
- Authority
- KR
- South Korea
- Prior art keywords
- ultra
- lip
- coating layer
- core wire
- wire
- Prior art date
Links
- YDOHPBBLOFQPQE-BWZSGCSDSA-N C1C(CC2)C3[C@H]2C13 Chemical compound C1C(CC2)C3[C@H]2C13 YDOHPBBLOFQPQE-BWZSGCSDSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
- B23D61/185—Saw wires; Saw cables; Twisted saw strips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P5/00—Setting gems or the like on metal parts, e.g. diamonds on tools
Abstract
The present invention relates to a wire saw, in particular, including a partial coating layer formed only on a part of the surface of the ultra-lip, it is possible to prevent excessive electrodeposition of the super-lip in the core wire and at the same time can easily form a partial coating layer in the ultra-lip It is about a wire saw.
Diamond, core, saw, electrodeposition
Description
FIELD OF THE INVENTION The present invention relates to wire saws, and more particularly, to wire saws comprising a partial coating layer formed only on a portion of the ultra-lipid surface.
In order to cut hard materials such as silicon and sapphire, electrodeposited core wire tool or resin bond core wire tool, which is fixed to the outer circumferential surface of the ship body that becomes the core wire (arranged with high hardness CBN (Cubic Boron Nitride) or diamond) It is known to use. The resin bond core wire tool in which the ultra-lip is fixed by a synthetic resin to the core wire has a problem that wear is more severe than the electrodeposited core wire tool, and the ultra-lip is easy to peel off. On the other hand, the electrodeposition core wire tool which fixed the ultra-rip to the core wire by electrodeposition is more difficult to wear than the resin bond core wire tool, but there exists a problem that the plating process which electrodeposits ultra-rip is time-consuming. Therefore, in the electrodeposition core wire tool, in order to improve the electrodeposition speed in the manufacture of a core wire tool in recent years, it is proposed to use the coating ultra-slip with the surface coat | covered with the coating layer which consists of metals, such as Ni, Ti, Cu, etc. (See patent document 1).
In Patent Literature 1, the thickness of the coating layer of the coated ultra-lip granules is in the range of 0.1 to 10 mu m, for example, thickened to 1 mu m. In addition, the mass percentage of the coating layer in the conventional coating ultra-slip is enlarged, for example to 30 to 55%, and the thick coating layer is provided. This is because it was considered important to increase the thickness of the coating layer to increase the conductivity in order to increase the electrodeposition efficiency (see Patent Document 2).
[Patent Document 1] Japanese Patent Laid-Open No. 2003-340729
[Patent Document 2] Republic of Korea Patent Publication No. 2007-0090074
BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the state in which super granulation is electrodeposited in the plating bath to the core wire of the tool of patent document 2. As shown in FIG. However, as in Patent Document 2, even if the thickness of the
Because, when the
For this reason, the
In addition, it takes time and cost to perform the process of removing the extra-electrodeposited electrode core from extra electrode, and it reduces the manufacturing efficiency of a wire tool.
SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problem, and an object thereof is to provide a wire saw capable of preventing overdeposition of ultra-adsorption on a core wire and at the same time easily forming a partial coating layer on the super-deposition.
The wire saw of the present invention for achieving the above object includes a core wire, an ultra lip, a partial coating layer formed only on a part of the surface of the ultra lip, and a plating layer for attaching the ultra lip to the core.
In the above-described configuration, the partial coating layer may be coated in a point or line shape, the partial coating layer may be less than 10% of the ultra-low grain mass.
According to the wire saw of the present invention as described above, there are the following effects.
Including a partial coating layer formed only on a part of the ultra-lip surface, it is possible to prevent excessive electrodeposition on the core wires and at the same time the amount of the partial coating layer is easily controlled even if the thickness of the partial coating layer is not formed thinly so that the partial coating layer on the ultra-lip Can be easily formed. As such, the ultra-rip is electrodeposited to the core wire in an appropriate amount so that the ultra-rip is not separated from the core wire and the life of the wire saw is also long. In addition, since the electrodepositing of the ultrafine grains is not necessary, the process of removing the extra ultrafine grains does not need to be carried out, so that labor and costs in manufacturing can be reduced. In addition, the portion where the partial coating layer is not formed has the advantage that the surface of the ultra-slip is exposed to the outside to improve the performance of the wire saw.
Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.
For reference, among the configurations of the present invention to be described below, the same configuration as the prior art will be referred to the above-described prior art, and a detailed description thereof will be omitted.
2 is a cross-sectional view of a wire saw according to a preferred embodiment of the present invention, Figure 3 is an ultra-separated front view of a wire saw according to a preferred embodiment of the present invention, Figure 4 is a candle of a wire saw according to another embodiment of the present invention An erect front view.
2 to 4, the wire saw of the present embodiment, the
The
The
The average particle diameter of the
The
The
For this reason, the
The
In addition, the mass of the partial coating layer (200, 200 ') is to be less than 10%, preferably less than 5% of the mass of the ultra-fine (160).
Further, as shown in FIGS. 3 and 4, the
As such, including the
As a result, since excessive current does not flow in the
In addition, since the
As such, the
As described above, although described with reference to a preferred embodiment of the present invention, those skilled in the art various modifications or variations of the present invention without departing from the spirit and scope of the invention described in the claims below Can be carried out.
As described above, the wire saw according to the present invention is particularly suitable for the wire saw used when cutting silicon or the like.
BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a state where ultra-lip is electrodeposited in a plating bath to a core wire of a conventional core wire tool.
2 is a cross-sectional view of the wire saw according to a preferred embodiment of the present invention.
3 is a front view of the ultra-separated wire saw according to a preferred embodiment of the present invention.
Figure 4 is an ultra-separated front view of a wire saw according to another embodiment of the present invention.
** Description of symbols for the main parts of the drawing **
120: core 160: ultra-low
180:
Claims (4)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090076216A KR20110018642A (en) | 2009-08-18 | 2009-08-18 | Wire saw |
PCT/KR2010/004752 WO2011021784A2 (en) | 2009-08-18 | 2010-07-21 | Wire saw |
JP2012522752A JP2013500170A (en) | 2009-08-18 | 2010-07-21 | Wire saw |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090076216A KR20110018642A (en) | 2009-08-18 | 2009-08-18 | Wire saw |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20110018642A true KR20110018642A (en) | 2011-02-24 |
Family
ID=43607429
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020090076216A KR20110018642A (en) | 2009-08-18 | 2009-08-18 | Wire saw |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2013500170A (en) |
KR (1) | KR20110018642A (en) |
WO (1) | WO2011021784A2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012138063A3 (en) * | 2011-04-05 | 2013-03-07 | 이화다이아몬드공업(주) | Method for manufacturing an electrodeposited diamond wire saw using patterned non-conductive materials |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004050301A (en) * | 2002-07-16 | 2004-02-19 | Noritake Co Ltd | Wire saw and its manufacturing method |
US6915796B2 (en) * | 2002-09-24 | 2005-07-12 | Chien-Min Sung | Superabrasive wire saw and associated methods of manufacture |
JP4139810B2 (en) * | 2004-12-28 | 2008-08-27 | 旭ダイヤモンド工業株式会社 | Electrodeposition wire tool |
JP2007307669A (en) * | 2006-05-19 | 2007-11-29 | Asahi Diamond Industrial Co Ltd | Wire electric discharge machine and wire electric discharge machining method |
JP2008221406A (en) * | 2007-03-13 | 2008-09-25 | Nakamura Choko:Kk | Fixed abrasive grain type wire saw and its manufacturing method |
JP5066508B2 (en) * | 2008-11-19 | 2012-11-07 | 株式会社リード | Fixed abrasive wire saw |
JP5078949B2 (en) * | 2009-07-10 | 2012-11-21 | 株式会社ノリタケカンパニーリミテド | Fixed abrasive wire and method of manufacturing fixed abrasive wire |
-
2009
- 2009-08-18 KR KR1020090076216A patent/KR20110018642A/en not_active Application Discontinuation
-
2010
- 2010-07-21 WO PCT/KR2010/004752 patent/WO2011021784A2/en active Application Filing
- 2010-07-21 JP JP2012522752A patent/JP2013500170A/en not_active Ceased
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012138063A3 (en) * | 2011-04-05 | 2013-03-07 | 이화다이아몬드공업(주) | Method for manufacturing an electrodeposited diamond wire saw using patterned non-conductive materials |
CN103476972A (en) * | 2011-04-05 | 2013-12-25 | 二和金刚石工业株式会社 | Method for manufacturing an electrodeposited diamond wire saw using patterned non-conductive materials |
US9776306B2 (en) | 2011-04-05 | 2017-10-03 | Ehwa Diamond Industrial Co., Ltd. | Method for manufacturing an electrodeposited diamond wire saw using patterned non-conductive materials |
Also Published As
Publication number | Publication date |
---|---|
JP2013500170A (en) | 2013-01-07 |
WO2011021784A3 (en) | 2011-04-14 |
WO2011021784A2 (en) | 2011-02-24 |
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