WO2011021784A2

WO2011021784A2 - Wire saw

Info

Publication number: WO2011021784A2
Application number: PCT/KR2010/004752
Authority: WO
Inventors: 류민호; 이형윤; 정용화
Original assignee: 일진다이아몬드 주식회사
Priority date: 2009-08-18
Filing date: 2010-07-21
Publication date: 2011-02-24
Also published as: KR20110018642A; JP2013500170A; WO2011021784A3

Abstract

The present invention relates to a wire saw, and particularly, to a wire saw that includes a partial coating layer formed on only a portion of ultrafine particle surfaces, in order to prevent the ultrafine particles from being over-deposited on a core line and also to enable the partial coating layer to be easily formed on the ultrafine particles.

Description

Wire saw

FIELD OF THE INVENTION The present invention relates to wire saws, and more particularly, to wire saws comprising a partial coating layer formed only on a portion of the ultra-lipid surface.

In order to cut hard materials such as silicon and sapphire, electrodeposited core wire tool or resin bond core wire tool which is fixed to the outer circumferential surface of the wire body to be the core wire (arranged with high hardness CBN (Cubic Boron Nitride) or diamond) It is known to use. The resin bond core wire tool in which the ultra-lip is fixed by a synthetic resin to the core wire has a problem that wear is more severe than the electrodeposited core wire tool, and the ultra-lip is easy to peel off. On the other hand, although the electrodeposition core wire tool which fixed ultra-rip in the core wire by electrodeposition is more difficult to wear than the resin bond core wire tool, there exists a problem that the plating process which electrodeposits ultra-rip is time-consuming. Therefore, in the electrodeposition core wire tool, in order to improve the electrodeposition speed at the time of manufacture of a core wire tool, it is proposed to use the coating ultra-slip which the surface was coat | covered by the coating layer which consists of metals, such as Ni, Ti, Cu, etc. (See patent document 1).

In patent document 1, the thickness of the coating layer of coating ultra-low grain | grains is thickness in the range of 0.1-10 micrometers, For example, it becomes thick at 1 micrometer. In addition, the mass percentage of the coating layer in the conventional coating ultra-slip is enlarged, for example to 30 to 55%, and the thick coating layer is provided. This is because it was considered important to increase the thickness of the coating layer to increase the conductivity in order to increase the electrodeposition efficiency (see Patent Document 2).

[Patent Document 1] Japanese Patent Laid-Open No. 2003-340729

[Patent Document 2] Republic of Korea Patent Publication No. 2007-0090074

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the state in which super granulation is electrodeposited in the plating bath to the core wire of the tool of patent document 2. However, as in Patent Document 2, even if the thickness of the coating layer 20 is 0.1 μm or less, since the coating layer 20 is formed on the entirety of the ultrafine grains 16, the superfine grains 16 do not prevent aggregation.

Because, when the ultra-rip granules 16 are electrodeposited to the core wire 12, the ultra-rip granules 16 are electrically energized by the core wire 12 having the negative electrode, and thus, the adjacent ultra-lip granules 16 which are not electrodeposited are attracted. The pulling force will act. For this reason, even if it is patent document 2, there exists a problem that the super granulation 16 cannot be aggregated.

For this reason, the excessive ultra-rip granules 16 are electrodeposited on the core wire. In addition, the excessively electrodeposited super-lip 16 is easily separated, there is a problem that the ultra-lip 16 is not useful, or the life of the wire tool is shortened.

In addition, it takes time and cost to perform the process of removing the extra-electrodeposited electrode core from extra electrode, and it reduces the manufacturing efficiency of a wire tool.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problem, and an object thereof is to provide a wire saw capable of preventing overdeposition of ultra-adsorption on a core wire and at the same time easily forming a partial coating layer.

The wire saw of the present invention for achieving the above object includes a core wire, an ultra lip, a partial coating layer formed only on a part of the surface of the ultra lip, and a plating layer for attaching the ultra lip to the core.

In the above-described configuration, the partial coating layer may be coated in a point or line shape, the partial coating layer may be less than 10% of the ultra-low grain mass.

According to the wire saw of the present invention as described above, there are the following effects.

Including a partial coating layer formed only on a part of the surface of the ultra-lip, it is possible to prevent excessive electrodeposition on the super-grains on the core wire and at the same time the amount of the partial coating layer is easily controlled even if the thickness of the partial coating layer is not formed thinly, so that the partial coating layer on the ultra-lip Can be easily formed. As such, the ultra-rip is electrodeposited to the core wire in an appropriate amount so that the ultra-rip is not separated from the core wire and the life of the wire saw is also long. In addition, since after the electrodeposition is carried out, there is no need to perform the process of removing the extra ultralips, so that the labor and cost in manufacturing can be reduced. In addition, the portion where the partial coating layer is not formed has the advantage that the surface of the ultra-slip is exposed to the outside to improve the performance of the wire saw.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a state where ultra-lip grains are electrodeposited in a plating bath to a core wire of a conventional core wire tool.

2 is a cross-sectional view of the wire saw according to a preferred embodiment of the present invention.

3 is a front view of the ultra-separated wire saw in accordance with a preferred embodiment of the present invention.

Figure 4 is an ultra-static front view of a wire saw according to another embodiment of the present invention.

** Description of symbols for the main parts of the drawing **

120: core wire

160: Super Low

180: plating layer

200, 200 ': partial coating layer

Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

For reference, among the configurations of the present invention to be described below, the same configuration as the prior art will be referred to the above-described prior art, and a detailed description thereof will be omitted.

2 is a cross-sectional view of a wire saw according to a preferred embodiment of the present invention, Figure 3 is an ultra-separated front view of a wire saw according to a preferred embodiment of the present invention, Figure 4 is a candle of a wire saw according to another embodiment of the present invention An erect front view.

As shown in Figure 2 to 4, the wire saw of the present embodiment, the core wire 120, the ultra-lip 160, the partial coating layer (200, 200 ') formed only on a part of the surface of the ultra-lip 160, It includes a plating layer 180 for attaching the ultra-lip 160 to the core wire 120.

The core wire 120 is a linear body made of a piano wire, a stranded wire, or the like.

The ultra-fine granules 160 are particles made of diamond, CNB, or the like.

The average particle diameter of the ultra-fine granules 160 may be 1-60 micrometers.

The plating layer 180 is formed of a material such as Ni, and attaches the ultra-lip 200 to the outer circumferential surface of the core wire 120.

The plating layer 180 is plated on the core wire 120 through electroplating.

For this reason, the ultra-low grain 160 is buried in the plating layer 180 and electrodeposited on the outer circumferential surface of the core wire 120.

The

partial coating layers

200 and 200 ′ are formed of any one of Ti, Ni, Cu, TiC, and SiC, and are formed only on a part of the surface of the ultra-lip granules 160. In other words, a portion of the ultra-lip granules 160 may not include the

partial coating layers

200 and 200 ′.

In addition, the mass of the partial coating layer (200, 200 ') is to be less than 10%, preferably less than 5% of the mass of the ultra-fine (160).

Further, as shown in FIGS. 3 and 4, the

partial coating layers

200 and 200 ′ are coated in dot form (200 ′: shape like a dot) or line shape (200: shape like a line).

As such, including the

partial coating layers

200 and 200 ′ formed only on a part of the surface of the ultra-lip granules 160, even if the thickness of the coating layer coated on the ultra-lip granules 160 is not formed to be thin, the amount of the coating layer is controlled. The coating may be performed on the 160, so that the

partial coating layers

200 and 200 ′ may be easily formed on the ultra-lip granules 160.

As a result, since excessive current does not flow in the ultrafine grain 160 at the time of electrodeposition of the ultrafine grain 160, the ultrafine grain 160 may be prevented from being excessively electrodeposited on the core wire 120.

In addition, since the ultra-lip granules 160 are not formed as a whole, but only partially, the conduction is not conducted to regions other than the partial coating layers 200 and 200 'even after the ultra-lip granules 160 are electrodeposited to the core wire 120. Do not. As a result, in the region in which the

partial coatings

200 and 200 ′ are not formed, the force of pulling the adjacent super lip 160 which has not been electrodeposited is not applied, thereby preventing the super lip 160 from agglomerating.

As such, the ultra-slip 160 is electrodeposited in an appropriate amount (adequate density) on the core wire 120 so that the ultra-slip 160 does not escape from the core wire 120, so that the life of the wire saw is long. In addition, since there is no need to perform the process of removing the extra ultra-fine granules 160 after electrodepositing the ultra-lip granules 160, manufacturing labor and cost can be reduced.

As described above, although described with reference to a preferred embodiment of the present invention, those skilled in the art various modifications or variations of the present invention without departing from the spirit and scope of the invention described in the claims below Can be carried out.

As described above, the wire saw according to the present invention is particularly suitable for the wire saw used when cutting silicon or the like.

Claims

Core wire;

Ultra granulation;

A partial coating layer formed only on a part of the ultra-slip surface;

Wire saw comprising a plating layer for attaching the ultra-lip to the core wire.
The method of claim 1,

The partial coating layer is a wire saw coated in a dot.
The method of claim 1,

The partial coating layer is a wire saw coated in a line.
The method according to any one of claims 1 to 3,

The partial coating layer is less than 10% of the ultra-low mass of wire saw.